CN107966472B - Nondestructive rapid measurement method for high-temperature contact thermal resistance - Google Patents
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Abstract
The invention discloses a nondestructive rapid measurement method of high-temperature contact thermal resistance, which adopts an ultrasonic echo method to obtain ultrasonic propagation time under a transient heat transfer condition according to medium temperature-ultrasonic propagation characteristics, optimizes and solves the inverse problem of heat conduction, and can rapidly, nondestructively and contactlessly measure interface contact thermal resistance parameters changing along with temperature. The method of the invention needs simple measuring device and short measuring period, and does not need the contact of the sensor and the tested piece, thereby avoiding the interference of the contact of the sensor and the tested piece and the limitation of the high temperature resistance of the sensor on the measuring range.
Description
Technical Field
The invention relates to the field of ultrasonic detection, in particular to a nondestructive rapid measurement method of high-temperature contact thermal resistance.
Background
In structural heat transfer characteristic analysis and heat protection design, thermal contact resistance is one of important parameters, and whether the value is accurate or not is directly related to the quality of thermal control design. The thermal resistance between contact interfaces is excessively high or excessively low, which affects the heat transfer of the structure, and in severe cases, the use efficiency of the structure is low or potential safety hazards are caused. Therefore, the measurement of the contact thermal resistance at the interface has important application value in the fields of aerospace, mechanical manufacturing, microelectronics, biomedicine, instruments and meters and the like. Thermal contact resistance is a nonlinear problem influenced by the coupling of a plurality of factors such as temperature, load, medium, material thermophysical property, surface roughness, material mechanical characteristics, material surface property, environment and the like. The existing theoretical model is difficult to be used in practice, and experimental research on contact thermal resistance has become a main method for engineering application.
Generally, a contact thermal resistance measurement method is divided into a steady-state measurement method and a transient measurement method according to whether experimental heat flow is stable or not. The steady state method has simple device and mature method, but has long measuring time. The transient method comprises a laser photothermal measurement method, a thermal imaging method, a flash method and the like, and has the advantages of quick response, non-contact, capability of reducing the size of a measurement sample to nanometer order of magnitude, easiness in influence of various factors on the measurement process, relatively complex formula derivation and difficulty in ensuring the measurement precision. The invention carries out the optimization solution of the heat conduction equation through the sound time characteristic of the ultrasonic echo to obtain the contact thermal resistance at the interface of two tested pieces, and essentially combines a steady state method and a transient state method, namely, the transient state heating is adopted on the heating mode, and the measurement principle of the steady state method is adopted on the calculation of the contact thermal resistance, so the invention has the advantages of the two methods and avoids the defects thereof.
Disclosure of Invention
The invention aims to provide a nondestructive rapid measurement method of high-temperature thermal contact resistance, which adopts an ultrasonic echo method to obtain ultrasonic propagation time under a transient heat transfer condition and rapidly measures the thermal contact resistance of an interface along with temperature change in a nondestructive and non-contact manner.
In order to achieve the purpose, the invention adopts the following technical scheme:
the method comprises the following steps: two tested pieces are taken and named as a first tested piece and a second tested piece respectively, and the two tested pieces are contacted with each other.
Step two: and obtaining the corresponding relation between the ultrasonic propagation speed V and the temperature T in the second tested piece through a calibration experiment.
Step three: heating the first tested piece, and obtaining a second tested piece t by a common ultrasonic pulse echo methodiTime of ultrasonic wave propagation time ti,exp。
Step four: and establishing an optimization model for measuring the high-temperature contact thermal resistance. The optimized objective function is:
wherein: r is the contact thermal resistance to be measured at the interface of the two tested pieces; t is ti,calT calculated for a valueiThe ultrasonic wave propagation time of the moment, the measurement time sequence represented by subscript i, and n represent the total measurement time point number; l is2Is the length of the second tested piece in the tested direction.
The constraint conditions are as follows:
wherein: t is1(x,t),T2(x, t) is the temperature field in the two tested pieces, and k, C and rho are respectively the heat conductivity coefficient, specific heat capacity and density of the material of the tested pieces; t (t)x＝0Heating the boundary by a heater;
as a contact interface boundary, T2Is the temperature at the contact interface of the second test piece.
Step five: obtained by means of infrared or contact thermocouples or the like
The temperature of the surface changes.
Step six: and solving the inverse heat conduction problem by adopting a common sequential quadratic programming method or a descending simplex method to obtain the contact thermal resistance R of the contact surface of the first tested piece and the second tested piece.
In summary, due to the adoption of the technical scheme, the invention has the beneficial effects that:
the invention is based on the ultrasonic method, needs simple measuring device and short measuring period, does not need the contact of the sensor and the tested piece, and avoids the interference of the contact of the sensor and the tested piece and the limitation of the high temperature resistance of the sensor on the measuring range.
1. The method only measures once, the heating surface of the tested piece is heated to a preset temperature value such as 500 ℃, so that interface contact thermal resistance parameters at different temperatures from room temperature to 500 ℃ can be obtained, and the method has the advantages of high measuring speed, low cost and the like;
2. when non-contact measurement is carried out based on electromagnetic or laser ultrasonic, the measurement of the high-temperature thermophysical property of the material is hardly influenced by the temperature resistance of the sensor, and the method has the advantage of wide measurement range.
Drawings
The invention will now be described, by way of example, with reference to the accompanying drawings, in which:
FIG. 1 is a flow chart of a method of measuring interfacial contact thermal resistance;
FIG. 2 results of interfacial contact thermal resistance measurements as a function of temperature.
Detailed Description
All of the features disclosed in this specification, or all of the steps in any method or process so disclosed, may be combined in any combination, except combinations of features and/or steps that are mutually exclusive.
The specific case implementation is carried out according to the technical scheme and the steps of the invention, and the specific case implementation is as follows:
M1one end of the tested piece is heated by a flat heater T-550 ℃, the other surfaces are all heat insulation surfaces, and the ultrasonic probe is arranged in the M2The upper end surface of the tested piece adopts a vertical incidence mode to excite pulse ultrasonic waves and is based on measurement M2The variation of the echo propagation time in the test piece is inverted by solving the inverse problem of heat/sound coupling1Test piece and M2Contact resistance at the specimen interface.
Case1M1Test piece and M2The contact thermal resistance R of the test piece interface does not change along with the temperature, and the true value is 5.952e-5m2℃W-1. Parameter identification result 5.952e-5m2℃W-1The error is 0.006%.
Case1M1Test piece and M2The contact thermal resistance R of the test piece interface changes with the temperature, and the true value is
R＝1.47e-15×T4-2.01e-12×T3+9.65e-10×T2-2.12e-07×T+3.88e-05(m2℃W-1) Wherein T is temperature. The material parameters are obtained by pre-fitting experimental data, and generally no prior knowledge is given to the contact resistance in advance in engineering practice, so that the contact resistance is expressed as a piecewise function varying with position and time in a heat transfer model, the function is given through parameter identification, and a specific calculation flow is shown in fig. 1.
Figure 2 gives the contact resistance measurements as a function of temperature. Characterized by 6 piecewise function, the average error is less than 0.146%.
The invention is not limited to the foregoing embodiments. The invention extends to any novel feature or any novel combination of features disclosed in this specification and any novel method or process steps or any novel combination of features disclosed.
Claims (1)
1. A nondestructive rapid measurement method of high-temperature contact thermal resistance is characterized by comprising the following steps:
the method comprises the following steps: taking two tested pieces, namely a first tested piece and a second tested piece respectively, wherein the two tested pieces are in mutual contact;
step two: obtaining the corresponding relation between the ultrasonic propagation speed V and the temperature T in the second tested piece through a calibration experiment;
step three: heating the first tested piece, and obtaining a second tested piece t by a common ultrasonic pulse echo methodiTime of ultrasonic wave propagation time ti,exp；
Step four: establishing an optimization model for measuring the high-temperature contact thermal resistance, wherein the optimization objective function is as follows:
wherein: r is the contact thermal resistance to be measured at the interface of the two tested pieces; t is ti,calT calculated for a valueiThe ultrasonic wave propagation time of the moment, the measurement time sequence represented by subscript i, and n represent the total measurement time point number; l is2The length of the second tested piece in the tested direction;
the constraint conditions are as follows:
wherein: t is1(x,t),T2(x, t) is the temperature field in the two tested pieces, and k, C and rho are respectively the heat conductivity coefficient, specific heat capacity and density of the material of the tested pieces; t (t) leucorrheax＝0Heating the boundary by a heater;
as a contact interface boundary, T2Is the temperature at the contact interface of the second piece under test;
step five: obtained by means of infrared or contact thermocouples or the like
A change in temperature of the surface;
step six: and solving the inverse heat conduction problem by adopting a common sequential quadratic programming method or a descending simplex method to obtain the contact thermal resistance R of the contact surface of the first tested piece and the second tested piece.
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| CN115356372B (en) * | 2022-10-24 | 2023-03-10 | 中国空气动力研究与发展中心计算空气动力研究所 | Time-varying thermal response testing method and system for novel material in flight test |
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