CN114038884A - Pre-injection molding type MINI LED packaging substrate - Google Patents
Pre-injection molding type MINI LED packaging substrate Download PDFInfo
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- CN114038884A CN114038884A CN202111441688.3A CN202111441688A CN114038884A CN 114038884 A CN114038884 A CN 114038884A CN 202111441688 A CN202111441688 A CN 202111441688A CN 114038884 A CN114038884 A CN 114038884A
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- packaging
- mini led
- etching
- circuit
- bonding pad
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- 238000004806 packaging method and process Methods 0.000 title claims abstract description 62
- 239000000758 substrate Substances 0.000 title claims abstract description 22
- 238000001746 injection moulding Methods 0.000 title claims abstract description 21
- 238000005530 etching Methods 0.000 claims abstract description 27
- 238000000034 method Methods 0.000 claims abstract description 14
- 229920000642 polymer Polymers 0.000 claims abstract description 11
- 239000000463 material Substances 0.000 claims description 33
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 21
- 229910052802 copper Inorganic materials 0.000 claims description 21
- 239000010949 copper Substances 0.000 claims description 21
- 239000004033 plastic Substances 0.000 claims description 14
- 229920003023 plastic Polymers 0.000 claims description 14
- 239000000956 alloy Substances 0.000 claims description 12
- 229910045601 alloy Inorganic materials 0.000 claims description 12
- 239000003822 epoxy resin Substances 0.000 claims description 11
- 229920000647 polyepoxide Polymers 0.000 claims description 11
- 238000002347 injection Methods 0.000 claims description 9
- 239000007924 injection Substances 0.000 claims description 9
- 229920002521 macromolecule Polymers 0.000 claims description 9
- 238000010586 diagram Methods 0.000 claims description 6
- 238000009713 electroplating Methods 0.000 claims description 6
- 238000000227 grinding Methods 0.000 claims description 6
- 238000005498 polishing Methods 0.000 claims description 6
- 230000009286 beneficial effect Effects 0.000 claims description 3
- 230000005540 biological transmission Effects 0.000 claims description 3
- 150000001875 compounds Chemical class 0.000 claims description 3
- 238000005520 cutting process Methods 0.000 claims description 3
- 238000004519 manufacturing process Methods 0.000 claims description 3
- 230000000873 masking effect Effects 0.000 claims description 3
- 238000001721 transfer moulding Methods 0.000 claims description 3
- 238000003466 welding Methods 0.000 claims description 3
- 238000005538 encapsulation Methods 0.000 claims description 2
- 239000004593 Epoxy Substances 0.000 claims 2
- 238000007788 roughening Methods 0.000 abstract description 7
- 230000017525 heat dissipation Effects 0.000 abstract description 4
- 239000002184 metal Substances 0.000 abstract description 4
- 229910052751 metal Inorganic materials 0.000 abstract description 4
- 230000000007 visual effect Effects 0.000 abstract description 4
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 abstract description 3
- 238000005516 engineering process Methods 0.000 abstract description 2
- 239000000243 solution Substances 0.000 description 11
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000002861 polymer material Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/15—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission
- H01L27/153—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars
- H01L27/156—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars two-dimensional arrays
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/54—Encapsulations having a particular shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/56—Materials, e.g. epoxy or silicone resin
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Abstract
The invention discloses a pre-injection molding type MINI LED packaging substrate, which belongs to the field of packaging substrates and is technically characterized by comprising a bonding pad and a packaging circuit structure, wherein the packaging circuit structure is formed on the bonding pad through etching, a polymer layer is filled in a gap of the packaging circuit structure through injection molding, a plurality of pins are integrally formed on the packaging circuit structure, heat-conducting columns are arranged on the bonding pad, and the distance between every two adjacent pins is smaller than 0.3 mm. According to the invention, a multilayer etching technology is adopted, the lead wire spacing and the wire width can be reduced to 0.07-0.1 mm, so that the distance of pixel points can be reduced, the resolution is improved, a flat plate type packaging scheme is adopted, the traditional groove type packaging design is eliminated, the visual angle range is greatly widened, a surface roughening treatment process is adopted, the bonding force between structures is enhanced, the reliability of the packaging structure is also improved, and the heat dissipation capability of the packaging structure can be improved by adding the heat conduction columns formed by metal.
Description
Technical Field
The invention relates to the field of package substrates, in particular to a pre-injection molding type MINI LED package substrate.
Background
The LED display screen has wide application indoors and outdoors. All basic packages used conventional DIP or SMD package configurations. The RGB light source chips are packaged together to form a pixel point.
In the display screen field of DIP or SMD, the resolution is reduced due to a large pixel point, the view angle (view angle) caused by a packaging structure is reduced, and the reliability is reduced due to the interface combination of different materials.
The adopted traditional support forming process has the advantages that the space between the packaging leads is large (0.3 mm), the line width is also wide (0.3 mm), the space between pixel points is large, the resolution is reduced, and the packaging in the form of a cup with a bowl limits the width of a visual angle (less than 120 degrees).
Disclosure of Invention
Aiming at the problems in the prior art, the invention aims to provide a pre-injection molding type MINI LED packaging substrate to solve the problems of large pixel pitch, low resolution and low use reliability of the conventional packaging substrate.
In order to solve the above problems, the present invention adopts the following technical solutions.
The pre-injection molding type MINI LED packaging substrate comprises a bonding pad and a packaging circuit structure, wherein the packaging circuit structure is formed on the bonding pad through etching, a macromolecule layer is filled in a gap of the packaging circuit structure through injection molding, a plurality of pins are integrally formed on the packaging circuit structure, heat-conducting columns are arranged on the bonding pad, the distance between every two adjacent pins is smaller than 0.3mm, and the joint surface between the packaging circuit structure and the macromolecule layer is subjected to roughening treatment.
As a further description of the above technical solution:
the interval of two adjacent pins is between 0.07 ~ 0.1mm, the thickness of pad is one of 6mil and 8 mli's alloy copper board.
As a further description of the above technical solution:
the macromolecular layer is composed of epoxy resin, and the macromolecular layer is formed by injection molding of epoxy resin with the thickness of less than 50 um.
As a further description of the above technical solution:
the manufacturing process of the pre-injection molding type MINI LED packaging substrate comprises the following steps:
etching a circuit diagram of a chip by using an alloy copper material, wherein only partial materials are etched, a pin gap is between 0.07 and 0.1mm, and the specific pin number depends on the design of an ASIC (application specific integrated circuit) or the chip to form a bonding pad;
step two, using a transfer molding method to inject an epoxy resin material with excellent characteristics onto the circuit surface of the etched part of the copper material to obtain a part of a macromolecule layer;
grinding out the lines covered by the plastic packaging rubber material through grinding;
etching the circuit which does not have the over-etching process and takes the alloy copper material as the bonding pad to form a pin;
fifthly, injecting an epoxy resin material with excellent characteristics to the surface of the packaging circuit structure with the residual copper material etched by using a traditional plastic packaging mold method to form a complete macromolecule layer;
step six, electroplating a copper material on the surface of the whole welding line to metalize the whole surface;
seventhly, etching the MINI LED packaging circuit on the metalized surface;
eighthly, packaging and plastic packaging protection of the MINI LED are carried out;
and step nine, single forming and cutting.
As a further description of the above technical solution:
in the first step, the whole alloy copper plate is completely covered by the design of a masking die, and the circuit covering film is activated by UV or laser to form a circuit structure.
As a further description of the above technical solution:
and in the second step, a compound material with filling thickness lower than 50um is selected in the plastic transmission process so as to be beneficial to filling sufficient structures among superfine pins in the complex ASIC design.
As a further description of the above technical solution:
and after the etching in the fourth step is finished, the surface of the bonding pad circuit and the surface of the pin are selected to be roughened.
As a further description of the above technical solution:
and polishing the injection molding surface after the injection molding in the step five, and polishing the surface of the electroplated layer after the electroplating in the step six.
As a further description of the above technical solution:
and etching part in the first step, and simultaneously etching to form the heat conduction column.
Compared with the prior art, the invention has the advantages that:
(1) according to the scheme, a flat plate type packaging scheme is adopted, the traditional groove type packaging design is removed, the visual angle range is greatly widened, the surface roughening treatment process is adopted, the interface bonding force of different materials is increased due to the increase of the specific surface area caused by roughening, the bonding force is enhanced, the reliability of the packaging structure is also improved, the heat dissipation capacity of the packaging structure can be improved by increasing the heat conduction columns formed by metal, and the reliability of a product is greatly improved.
(2) This scheme has adopted the technique of multilayer etching, can reduce lead wire interval and linewidth to between 0.07 ~ 0.1mm, is less than traditional encapsulation circuit 0.3 mm's interval far away, just so can reduce the distance of pixel, and resolution ratio improves.
Drawings
FIG. 1 is a front cross-sectional structural schematic view of the present invention;
FIG. 2 is a schematic structural diagram of a circuit packaging structure according to the present invention;
FIG. 3 is a schematic view of the plastic package structure of the polymer layer and the bonding pad according to the present invention;
FIG. 4 is a schematic diagram of a bonding pad structure according to the present invention;
FIG. 5 is a schematic diagram of the circuit structure of the present invention;
FIG. 6 is a schematic view of the preparation process of the present invention.
The reference numbers in the figures illustrate:
1. a pad; 2. packaging the circuit structure; 3. a polymer layer; 4. a pin; 5. a heat-conducting column.
Detailed Description
The technical solution in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention;
referring to fig. 1 to 5, in the present invention, the pre-injection molded MINI LED package substrate includes a pad 1 and a package circuit structure 2, the pad 1 is etched to form the package circuit structure 2, a gap of the package circuit structure 2 is filled with a polymer layer 3 by injection molding, the package circuit structure 2 is integrally formed with a plurality of pins 4, the pad 1 is provided with a heat conduction column 5, a distance between adjacent pins 4 is smaller than 0.3mm, and a bonding surface between the package circuit structure 2 and the polymer layer 3 is roughened.
The flat plate type packaging scheme is adopted, the traditional groove type packaging design is removed, the visual angle range is greatly widened, the surface roughening treatment process is adopted, the interface bonding force of different materials is increased due to the increase of the specific surface area caused by roughening, the bonding force is enhanced, the reliability of the packaging structure is also improved, the heat dissipation capacity of the packaging structure can be improved by adding the heat conduction columns 5 formed by metal, and the reliability of the product is greatly improved.
Please refer to fig. 1-5, wherein: the distance between two adjacent pins 4 is 0.07-0.1 mm, and the thickness of the bonding pad 1 is 6mil or 8mli of alloy copper plate.
Please refer to fig. 1-5, wherein: the polymer layer 3 is made of epoxy resin, and the polymer layer 3 is made of epoxy resin with the thickness of less than 50um through injection molding.
The polymer layer 3 may be epoxy resin or other polymer material with similar function.
Please refer to fig. 1 to 6, wherein: the manufacturing process of the pre-injection molding type MINI LED packaging substrate comprises the following steps:
etching a circuit diagram of a chip by using an alloy copper material, wherein only partial materials are etched, the gap between pins 4 is 0.07-0.1 mm, the specific number of the pins 4 depends on the design of an ASIC (application specific integrated circuit) or the chip, and a bonding pad 1 is formed;
step two, using a transfer molding method to inject an epoxy resin material with excellent characteristics onto the circuit surface of the etched part of the copper material to obtain a part of the macromolecule layer 3;
grinding out the lines covered by the plastic packaging rubber material through grinding;
etching out a circuit which is not subjected to an over-etching process and is made of an alloy copper material serving as a bonding pad 1 to form a pin 4;
fifthly, injecting an epoxy resin material with excellent characteristics to the surface of the packaging circuit structure 2 with the residual copper material etched by using a traditional plastic packaging mold method to form a complete macromolecule layer 3;
step six, electroplating a copper material on the surface of the whole welding line to metalize the whole surface;
seventhly, etching the MINI LED packaging circuit on the metalized surface;
eighthly, packaging and plastic packaging protection of the MINI LED are carried out;
and step nine, single forming and cutting.
Please refer to fig. 1 to 6, wherein: in the first step, the whole alloy copper plate is completely covered by the design of a masking die, and a circuit covering film is activated by UV or laser to form a circuit structure.
Please refer to fig. 1 to 6, wherein: in the second step, a compound material with filling thickness lower than 50um is selected in the plastic transmission process so as to be beneficial to filling sufficient structures among the superfine pins 4 in the complex ASIC design.
Please refer to fig. 1 to 6, wherein: and step four, after etching is completed, surface roughening treatment is selected for the bonding pad circuit and the pin 4.
Please refer to fig. 1 to 6, wherein: and polishing the injection molding surface after the injection molding is finished in the step five, and polishing the surface of the electroplated layer after the electroplating is finished in the step six.
Please refer to fig. 1 to 6, wherein: and etching parts in the first step, and simultaneously etching to form the heat conduction columns 5.
By adopting the multilayer etching technology, the lead wire distance and the line width can be reduced to 0.07-0.1 mm, and the distance is far smaller than the distance of 0.3mm of the traditional packaging circuit. Therefore, the distance between the pixel points can be reduced, the resolution is improved, the heat conducting columns 5 formed by adding metal are added, the heat dissipation capacity of the packaging structure can be improved, and the reliability of the product is greatly improved.
The foregoing is only a preferred embodiment of the present invention; the scope of the invention is not limited thereto. Any person skilled in the art should be able to cover the technical scope of the present invention by equivalent or modified solutions and modifications within the technical scope of the present invention.
Claims (9)
1. Formula MINI LED packaging substrate of annotating in advance, including pad (1) and encapsulation circuit structure (2), its characterized in that: the packaging structure is characterized in that a packaging line structure (2) is formed on the bonding pad (1) through etching, a high polymer layer (3) is filled in a gap of the packaging line structure (2) through injection molding, a plurality of pins (4) are integrally formed on the packaging line structure (2), heat-conducting columns (5) are arranged on the bonding pad (1), the distance between every two adjacent pins (4) is smaller than 0.3mm, and the bonding surface between the packaging line structure (2) and the high polymer layer (3) is roughened.
2. The pre-injection molded MINI LED package substrate of claim 1, wherein: the interval of two adjacent pins (4) is between 0.07-0.1 mm, and the thickness of the bonding pad (1) is one of 6mil and 8mli alloy copper plates.
3. The pre-injection molded MINI LED package substrate of claim 1, wherein: macromolecule layer (3) constitute for epoxy, macromolecule layer (3) select for use to be less than 50um epoxy and mould plastics and constitute.
4. The pre-injection molded MINI LED package substrate of claim 1, wherein: the manufacturing process of the pre-injection molding type MINI LED packaging substrate comprises the following steps:
etching a circuit diagram of a chip by using an alloy copper material, wherein only partial materials are etched, the gap between pins (4) is 0.07-0.1 mm, the number of the specific pins (4) depends on the design of an ASIC (application specific integrated circuit) or the chip, and a bonding pad (1) is formed;
step two, injecting an epoxy resin material with excellent characteristics to the circuit surface of the etched part of the copper material by using a transfer molding method to obtain a part of a high polymer layer (3);
grinding out the lines covered by the plastic packaging rubber material through grinding;
etching out the circuit which is not subjected to the over-etching process and is made of the alloy copper material serving as the bonding pad (1) to form a pin (4);
fifthly, injecting an epoxy resin material with excellent characteristics to the surface of the packaging circuit structure (2) with the residual copper material etched by using a traditional plastic packaging mold method to form a complete macromolecule layer (3);
step six, electroplating a copper material on the surface of the whole welding line to metalize the whole surface;
seventhly, etching the MINI LED packaging circuit on the metalized surface;
eighthly, packaging and plastic packaging protection of the MINI LED are carried out;
and step nine, single forming and cutting.
5. The pre-injection molded MINI LED package substrate of claim 4, wherein: in the first step, the whole alloy copper plate is completely covered by the design of a masking die, and the circuit covering film is activated by UV or laser to form a circuit structure.
6. The pre-injection molded MINI LED package substrate of claim 4, wherein: and in the second step, a compound material with filling thickness lower than 50um is selected in the plastic transmission process so as to be beneficial to filling sufficient structures among the superfine pins (4) in the complex ASIC design.
7. The pre-injection molded MINI LED package substrate of claim 4, wherein: and after the etching in the fourth step is finished, the surface of the bonding pad circuit and the surface of the pin (4) are selected to be roughened.
8. The pre-injection molded MINI LED package substrate of claim 4, wherein: and polishing the injection molding surface after the injection molding in the step five, and polishing the surface of the electroplated layer after the electroplating in the step six.
9. The pre-injection molded MINI LED package substrate of claim 4, wherein: and etching part in the first step, and simultaneously etching to form the heat conduction column (5).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111441688.3A CN114038884A (en) | 2021-11-30 | 2021-11-30 | Pre-injection molding type MINI LED packaging substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111441688.3A CN114038884A (en) | 2021-11-30 | 2021-11-30 | Pre-injection molding type MINI LED packaging substrate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN114038884A true CN114038884A (en) | 2022-02-11 |
Family
ID=80139301
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202111441688.3A Pending CN114038884A (en) | 2021-11-30 | 2021-11-30 | Pre-injection molding type MINI LED packaging substrate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN114038884A (en) |
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2021
- 2021-11-30 CN CN202111441688.3A patent/CN114038884A/en active Pending
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