CN114038772A - Feeding method of semiconductor machine - Google Patents
Feeding method of semiconductor machine Download PDFInfo
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- CN114038772A CN114038772A CN202210012716.8A CN202210012716A CN114038772A CN 114038772 A CN114038772 A CN 114038772A CN 202210012716 A CN202210012716 A CN 202210012716A CN 114038772 A CN114038772 A CN 114038772A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67772—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving removal of lid, door, cover
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
- H01L21/67781—Batch transfer of wafers
Abstract
The invention provides a feeding method of a semiconductor machine, which comprises the following steps: providing M wafer transfer boxes, wherein the door of the Kth wafer transfer box is in an open state and is used for goods running, and the doors of the other wafer transfer boxes are in a closed state; detecting the goods running information of the semiconductor machine, and if the number of the remaining wafers in the Kth wafer transfer box is less than or equal to the preset number, opening a door of the Kth +1 th wafer transfer box for preparing goods running; and detecting the goods running information of the semiconductor machine, and controlling the K +1 wafer transfer box to start the goods running if the K wafer transfer box runs the goods. The door of the Kth wafer transmission box which is only provided with running and has the residual wafer quantity larger than the preset quantity is in an opening state, so that the exposure chance of the wafer is reduced, the oxidation problem of the wafer in a microenvironment is solved, the door of the Kth wafer transmission box can be opened in advance to prepare for running, and the feeding rate is ensured.
Description
Technical Field
The invention relates to the technical field of semiconductors, in particular to a feeding method of a semiconductor machine.
Background
In a semiconductor machine, a Mini Environment (Mini Environment) is a closed space region that needs to be isolated from an external atmospheric Environment except a process chamber, and is one of core structures of the semiconductor machine, and its main function is to provide a stable region for transferring, loading, unloading, and transferring a wafer inside the semiconductor machine, and the transferring, loading, unloading, and processing of the wafer can be performed inside the Mini Environment before the processing and after the processing.
Be provided with the fan at the top of microenvironment and let in clean air in to microenvironment to form the malleation atmosphere with outside atmospheric environment, thereby reduce the influence of granule in the external environment to the wafer, and in time discharge the granule in the microenvironment.
Taking the feeding of the existing semiconductor machine as an example, a plurality of wafer conveying boxes are placed in a plurality of feeding ports of the semiconductor machine, the plurality of feeding ports are arranged in a microenvironment, and all doors of the wafer conveying boxes positioned at the feeding ports are opened so as to improve the goods running speed of the machine. However, the clean air additionally introduced into the microenvironment increases the contact between the surface of the wafer in the wafer transfer box and the clean air, so that a thicker oxide layer is easily formed on the surface of the wafer, especially when an easily oxidized film layer is formed on the surface of the wafer. The thicker oxide layer formed is not only unfavorable for the process yield of the semiconductor machine, but also can consume more time and steps to remove the oxide layer, thereby affecting the production efficiency.
Disclosure of Invention
The invention aims to provide a loading method of a semiconductor machine table, which aims to solve the problem of oxidation of a microenvironment on the surface of a wafer in a wafer transfer box.
In order to solve the above technical problem, the present invention provides a method for loading a semiconductor machine, wherein the semiconductor machine has at least two loading ports, and a microenvironment is configured on at least two of the loading ports, and the method for loading the semiconductor machine comprises: providing M wafer transmission boxes, wherein the Kth wafer transmission box and the Kth +1 wafer transmission box are placed on different feeding ports, the door of the Kth wafer transmission box is in an open state and used for goods running, and the doors of the other wafer transmission boxes are in a closed state; detecting the goods running information of the semiconductor machine, and if the number of the remaining wafers in the K wafer transfer box is less than or equal to a preset number, opening a door of the K +1 wafer transfer box to prepare for goods running, wherein the size of the preset number depends on the time for preparing for goods running; detecting the goods running information of the semiconductor machine, and controlling the K +1 wafer transfer box to start goods running if the K wafer transfer box runs the goods; wherein M is 2 or more, K =1, 2.
Optionally, after the door of the K +1 th wafer transfer box is opened, the wafer information in the K +1 th wafer transfer box is detected.
Optionally, the wafer information in the K +1 th wafer transfer box includes batch information, state information, and position information of the wafer.
Optionally, the time for preparing for running includes a time for opening a door of the foup and a time for detecting wafer information in the foup.
Optionally, the time for preparing for running is less than or equal to the running time of the preset number of wafers.
Optionally, the value of the preset number is greater than or equal to 2 and less than or equal to 4.
Optionally, the time when the kth foup arrives at the semiconductor machine is earlier than the time when the K +1 th foup arrives at the semiconductor machine.
Optionally, the value of the preset number is greater than or equal to 2 and less than or equal to 4.
Optionally, a silicon layer or a metal layer is formed on the surface of the wafer.
Optionally, the semiconductor machine is a nickel deposition device or a copper electroplating device.
In summary, the method for loading semiconductor machine provided by the invention has the following advantages: the door of the Kth wafer transmission box which runs goods and has the residual wafer number larger than the preset number is only arranged to be in an opening state, the doors of the other wafer transmission boxes are closed, so that the chance that wafers in the wafer transmission box are exposed to air is reduced, the problem of oxidation of the wafers in a microenvironment is solved, and when the residual wafer number in the Kth wafer transmission box is smaller than or equal to the preset number, the door of the Kth +1 wafer transmission box is opened in advance to prepare for running goods, the Kth wafer transmission box is connected better, and the feeding rate is guaranteed.
Drawings
It will be appreciated by those skilled in the art that the drawings are provided for a better understanding of the invention and do not constitute any limitation to the scope of the invention.
Fig. 1 is a flowchart of a loading method of a semiconductor machine according to an embodiment of the present disclosure.
Detailed Description
To further clarify the objects, advantages and features of the present invention, a more particular description of the invention will be rendered by reference to specific embodiments thereof which are illustrated in the appended drawings. It is to be noted that the drawings are in greatly simplified form and are not to scale, but are merely intended to facilitate and clarify the explanation of the embodiments of the present invention. Further, the structures illustrated in the drawings are often part of actual structures. In particular, the drawings may have different emphasis points and may sometimes be scaled differently.
As used in this application, the singular forms "a", "an" and "the" include plural referents, the term "or" is generally employed in a sense including "and/or," the terms "a" and "an" are generally employed in a sense including "at least one," the terms "at least two" are generally employed in a sense including "two or more," and the terms "first", "second" and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicit to the number of technical features indicated. Thus, features defined as "first," "second," and "third" may explicitly or implicitly include one or at least two of the features unless the content clearly dictates otherwise.
The invention provides a feeding method of a semiconductor machine table, which aims to solve the problem of oxidation of a microenvironment on the surface of a wafer in a wafer transfer box.
Fig. 1 is a flowchart of a loading method of a semiconductor machine according to an embodiment of the present disclosure.
As shown in fig. 1, the method for loading a semiconductor machine provided in this embodiment includes at least two loading ports, and a microenvironment is configured on at least two of the loading ports, and includes:
s01: providing M wafer transmission boxes, wherein the Kth wafer transmission box and the Kth +1 wafer transmission box are placed on different feeding ports, the door of the Kth wafer transmission box is in an open state and used for goods running, and the doors of the other wafer transmission boxes are in a closed state;
s02: detecting the goods running information of the semiconductor machine, and if the number of the remaining wafers in the K wafer transfer box is less than or equal to a preset number, opening a door of the K +1 wafer transfer box to prepare for goods running, wherein the size of the preset number depends on the time for preparing for goods running;
s03: detecting the goods running information of the semiconductor machine, and if the K-th wafer transfer box finishes goods running, controlling the K + 1-th wafer transfer box to start goods running, wherein M is more than or equal to 2, and K =1 and 2.
The semiconductor machine in this embodiment may be any suitable machine in a semiconductor process, and the semiconductor machine has a plurality of Load ports (Load ports) for providing a better and uniform loading time interval to ensure the process execution of the semiconductor machine. All material loading mouths of semiconductor board all set up in a microenvironment, and this microenvironment utilization is used for providing a malleation atmosphere from the clean air that the top let in, and then improves this regional cleanliness factor.
The following describes the loading method of the semiconductor machine in detail with reference to the flowchart.
First, step S01 is executed to provide M pod, wherein the kth pod and the K +1 th pod are placed on different loading ports, the door of the kth pod is opened for loading, and the doors of the other pods are closed.
The Foup in this embodiment may be a front opening Foup (Foup), the number M of foups may be equal to or less than the number of loading ports, the number of loading ports or the number of foups may be, for example, equal to or greater than 2 and equal to or less than 5, and M foups are sequentially placed on the corresponding loading ports.
When the semiconductor tool is connected to a Manufacturing Execution System (MES) task (Lot), a pod is placed on the load port of the semiconductor tool. If the parameter set (Recipe) and other status information of the semiconductor machine are confirmed to be correct, the door of a pod (e.g., the first pod) is opened to start running.
It should be noted that, at this time, only the door of the first foup for running is opened, and the doors of the other foups are not opened but are in a closed state, so as to prevent the clean air in the microenvironment from contacting the wafers in the foups that are not running (or are not ready to run) to oxidize the wafer surfaces. It should be understood that the microenvironment is a positive pressure atmosphere during the run, and if the door of the wafer transfer box without the run is opened all the time, the wafer therein is in contact with the excessive introduced clean air in the positive pressure atmosphere, so that the probability that the surface of the wafer is in contact with the oxygen in the air is greatly increased, thereby significantly increasing the oxidation rate of the wafer in the wafer transfer box in the microenvironment (relative to the oxidation rate of the wafer in the closed space of the wafer transfer box). In addition, if the door of the wafer in the wafer transfer box which does not run or is not ready to run is in a closed state, the chance that the wafer is contacted with particles in a microenvironment can be correspondingly reduced, and the cleanliness of the wafer is favorably maintained.
After opening the door of the first FOUP, corresponding run preparation can be performed, for example, whether the actual information of the wafer in the FOUP is consistent with the task information sent by the MES is detected (Mapping). The actual information of the wafer may include, for example, Lot (Lot) information of the wafer, status information of the wafer, and position information of the wafer in the foup, etc. If all the actual information is detected to be qualified, the first wafer transmission box can execute formal goods running, namely, a transmission hand is used for sending the wafers in the first wafer transmission box into a semiconductor machine to execute corresponding process; if the actual information is different from the task information, the first wafer transfer box is marked as abnormal and is suspended for running, and a wafer transfer box of another material loading port is selected for running preparation.
Then, step S02 is executed to detect the run information of the semiconductor machine, and if the number of remaining wafers in the kth foup is less than or equal to a preset number, the door of the K +1 th foup is opened to prepare for the run, wherein the preset number depends on the time for preparing for the run.
Specifically, the number of wafers accommodated in the foup is, for example, 25, and the wafers in the first foup run at a constant speed (loading time interval), and during this process, the run information of the semiconductor machine can be continuously monitored, and if the number of wafers in the first foup is less than or equal to the preset number, the door of another foup (for example, the second foup) is opened for run preparation, so as to implement run connection between different foups, so as to reduce the chance of exposing the wafers in the foup to the microenvironment and simultaneously ensure the loading speed.
The size of the preset quantity depends on the time of the goods running preparation, and the time of the goods running preparation comprises the time of opening a door of the wafer transfer box and the time of detecting wafer information in the wafer transfer box. Specifically, the time for run preparation is less than or equal to the run time for a predetermined number of wafers, so as to achieve better connection between different wafer transfer boxes. In practice, the loading time intervals (average running time of a single wafer) of the semiconductor machines of different processes may be different greatly, and the size of the preset number needs to be specifically set according to the actual situation, and may be, for example, greater than or equal to 2 and less than or equal to 4, which is not limited in this embodiment.
In the process, only the doors of the first wafer transmission box and the second wafer transmission box are in an opening state, and when the wafers in the first wafer transmission box are run completely, the wafers in the second wafer transmission box which are ready for running start to run. Similarly, when the quantity of the remaining wafers in the second wafer transfer box is less than the preset quantity by detecting the running information of the semiconductor machine, the door of another wafer transfer box (for example, the third wafer transfer box) is opened for preparing the running. The first through K + 1-th foups in this embodiment are used to refer to foups located at different loading ports. Preferably, the time of the kth foup reaching the corresponding loading port is earlier than the time of the kth +1 foup reaching the corresponding loading port, and the first-in first-out principle is followed to reduce the residence time of the whole wafer. And closing the door of the run-out wafer transfer box, and withdrawing the wafer transfer box from the feeding port.
This exampleThe material loading method in (1) is particularly suitable for a wafer with a surface exposed with a relatively easily oxidized film layer or structure, such as a silicon layer (polysilicon or monocrystalline silicon) or a metal layer. The corresponding semiconductor machine can be, for example, a nickel deposition apparatus or a copper electroplating apparatus. It is understood that nickel (Ni) is deposited on the silicon surface in a nickel deposition apparatus for forming a contact layer (NiSi) with silicon (Si) subsequentlyx) If the surface of the silicon is oxidized (silicon oxide is formed), the formation of a subsequent contact layer is seriously influenced; a thin seed copper layer is formed on the surface of the wafer before the copper electroplating to be used as a cathode in the copper electroplating, and if the seed copper layer is oxidized, the quality of the copper electroplating is seriously influenced.
In summary, the method for loading semiconductor machine provided by the invention has the following advantages: the door of the Kth wafer transmission box which runs goods and has the residual wafer number larger than the preset number is only arranged to be in an opening state, the doors of the other wafer transmission boxes are closed, so that the chance that wafers in the wafer transmission box are exposed to air is reduced, the problem of oxidation of the wafers in a microenvironment is solved, and when the residual wafer number in the Kth wafer transmission box is smaller than or equal to the preset number, the door of the Kth +1 wafer transmission box is opened in advance to prepare for running goods, the Kth wafer transmission box is connected better, and the feeding rate is guaranteed.
The above description is only for the purpose of describing the preferred embodiments of the present invention, and is not intended to limit the scope of the present invention, and any variations and modifications made by those skilled in the art based on the above disclosure are within the scope of the appended claims.
Claims (10)
1. The utility model provides a method of feeding of semiconductor board, the semiconductor board has two at least material loading mouths, and at least two dispose a microenvironment on the material loading mouth, its characterized in that, method of feeding of semiconductor board includes:
providing M wafer transmission boxes, wherein the Kth wafer transmission box and the Kth +1 wafer transmission box are placed on different feeding ports, the door of the Kth wafer transmission box is in an open state and used for goods running, and the doors of the other wafer transmission boxes are in a closed state;
detecting the goods running information of the semiconductor machine, and if the number of the remaining wafers in the K wafer transfer box is less than or equal to a preset number, opening a door of the K +1 wafer transfer box to prepare for goods running, wherein the size of the preset number depends on the time for preparing for goods running; and the number of the first and second groups,
detecting the goods running information of the semiconductor machine, and controlling the K +1 wafer transfer box to start goods running if the K wafer transfer box finishes goods running;
wherein M is 2 or more, K =1, 2.
2. The method as claimed in claim 1, wherein after the door of the K +1 th FOUP is opened, wafer information in the K +1 th FOUP is detected.
3. The method of claim 2, wherein the wafer information in the K +1 th FOUP box comprises lot information, status information and location information of the wafer.
4. The method of claim 3, wherein the run preparation time comprises a time to open a door of the FOUP and a time to detect wafer information in the FOUP.
5. The method of claim 1, wherein the run preparation time is less than or equal to the run time of the predetermined number of wafers.
6. The method of claim 5, wherein the predetermined number is greater than or equal to 2 and less than or equal to 4.
7. The method as claimed in claim 1, wherein the K-th FOUP arrives at the semiconductor tool earlier than the K + 1-th FOUP arrives at the semiconductor tool.
8. The method of claim 7, wherein M is greater than or equal to 2 and less than or equal to 5.
9. The method as claimed in claim 1, wherein a silicon layer or a metal layer is formed on the surface of the wafer.
10. The method as claimed in claim 9, wherein the semiconductor machine is a nickel deposition apparatus or a copper electroplating apparatus.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210012716.8A CN114038772A (en) | 2022-01-07 | 2022-01-07 | Feeding method of semiconductor machine |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202210012716.8A CN114038772A (en) | 2022-01-07 | 2022-01-07 | Feeding method of semiconductor machine |
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| CN114038772A true CN114038772A (en) | 2022-02-11 |
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| CN202210012716.8A Pending CN114038772A (en) | 2022-01-07 | 2022-01-07 | Feeding method of semiconductor machine |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114373693A (en) * | 2022-03-22 | 2022-04-19 | 广州粤芯半导体技术有限公司 | Method for improving scanning success rate of Taiko wafer at position of loading table of machine table |
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|---|---|---|---|---|
| CN114373693A (en) * | 2022-03-22 | 2022-04-19 | 广州粤芯半导体技术有限公司 | Method for improving scanning success rate of Taiko wafer at position of loading table of machine table |
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