TWI758044B - Coating device and operation control method thereof - Google Patents

Abstract

The present invention can optimize the arrangement and operation control of the constituent elements of the plating package for suppressing particle contamination. The plating apparatus 1000 for plating a substrate includes a first robot chamber 115 for accommodating a first conveying robot 110 for conveying the substrates carried into the plating apparatus 1000 and from the first conveying robot 110 The substrate carried out by the coating device 1000; the coating chamber 405 houses the coating film group 400, and the coating film group 400 is used for plating the substrate; the first processing chamber 125 houses the pre-processing module and the pre-processing module The pretreatment used for plating the substrate; the second automatic machine room 705 accommodates the second transfer robot 700 , and the second transfer robot 700 is used to transfer the substrate between the pretreatment module and the plating module 400 The first door 117 is arranged between the first automatic machine room 115 and the first processing room 125; the second door 127 is arranged between the first processing room 125 and the second automatic machine room 705; and the control module 800 , and is configured to control the opening and closing of the first door 117 and the second door 127 so that the first door 117 and the second door 127 are not opened at the same time.

Description

Coating device and operation control method thereof

The present application relates to a coating device and an operation control method of the coating device.

As an example of a plating apparatus, a cup-type electrolytic plating apparatus is known. The cup-type electrolytic plating apparatus includes a plating module for plating a substrate. In the plating film group, a substrate (eg, a semiconductor substrate) is held with the surface to be plated downward, the substrate is immersed in a plating solution, and a voltage is applied between the substrate and the anode to deposit a conductive film on the surface of the substrate.

The cup-type electrolytic plating apparatus includes various components in addition to the plating film group. For example, a plating apparatus is provided with the 1st conveyance robot which conveys the board|substrate carried in to the plating apparatus and the board|substrate carried out from the plating apparatus, and an aligner for adjusting the notch direction of a board|substrate. Furthermore, the plating apparatus includes: a pre-treatment module for performing pre-treatment of the plating treatment; a post-treatment module for performing post-treatment after the plating treatment; Transfer substrates between groups.

The 1st conveyance robot conveys the board|substrate carried into the plating apparatus to the aligner, and the board|substrate whose notch direction is adjusted by the aligner is conveyed to the 2nd conveyance robot. The second conveyance robot conveys the substrate received from the first conveyance robot to the pretreatment module, and conveys the substrate after the pretreatment to the coating film group. The second transfer robot transfers the substrate after the plating process to the post-processing module, and transfers the substrate after the post-treatment to the first transfer robot. The first transfer robot unloads the substrate received from the second transfer robot from the plating device.

[Prior Art Literature] [Patent Literature] [Patent Document 1] Japanese Patent Laid-Open No. 2018-9215

[Problems to be Solved by Invention] In the conventional plating apparatus, there is still room for improvement in the arrangement and operation control of the constituent elements for suppressing particle contamination caused by the plating process.

That is, in the plating apparatus, particles resulting from the plating process are generated in the plating film group, and the particles may be mixed into the space in which other constituent elements are housed from the space in which the plating film group is housed. For example, in the prior art, by transferring the substrate between the first transfer robot and the second transfer robot, the room in which the first transfer robot is accommodated and the room in which the second transfer robot is accommodated are communicated. Thereby, particles are mixed from the room containing the second transfer robot into the room containing the first transfer robot, and the particles may adhere to the substrate carried out from the coating apparatus. Particle contamination like this leads to deterioration of the quality of the plated substrate, and as a result, may deteriorate the production yield.

Therefore, an object of this application is to optimize the arrangement and operation control of the constituent elements of the coating apparatus for suppressing particle contamination.

[Problem-solving technical arm section] According to an embodiment, a plating apparatus is disclosed, which is used for plating a substrate, comprising: a first automatic machine room for accommodating a first conveying robot, and the first conveying robot is used for conveying into the plating apparatus The substrate and the substrate carried out from the above-mentioned coating device; the coating chamber houses the coating film group, and the above-mentioned coating film group is used to perform the coating process on the substrate; the first processing chamber houses the pre-processing module, the above-mentioned pre-processing The module is used for the pretreatment of the plating process on the substrate; the second automatic machine room accommodates the second conveying robot, and the second conveying robot is used for conveying between the pre-processing module and the plating module a substrate; a first door disposed between the first robot chamber and the first processing chamber; a second door disposed between the first processing chamber and the second robot chamber; and a control device configured as The opening and closing of the first door and the second door are controlled so that the first door and the second door are not opened at the same time.

Hereinafter, embodiments of the present invention will be described with reference to the drawings. In the drawings to be described below, the same or corresponding constituent elements are assigned the same reference numerals, and repeated explanations are omitted.

<Overall structure of coating apparatus> FIG. 1 is a perspective view showing the overall structure of the coating apparatus according to the present embodiment. Fig. 2 is a plan view showing the overall configuration of the coating apparatus of the present embodiment. As shown in the first and second figures, the coating apparatus 1000 includes a loading port 100, a first transfer robot 110, an aligner 120, a coating film group 400, a cleaning module 500, a spin dryer 600, and a second transfer The automaton 700 and the control module 800 .

The loading port 100 is a module for carrying substrates accommodated in cassettes such as FOUPs (not shown) into the plating apparatus 1000 , and for carrying out substrates from the plating apparatus 1000 to the cassettes. The loading port 100 is arranged adjacent to the first robot chamber 115 in which the first transfer robot 110 is accommodated. In the present embodiment, the three load ports 100 are arranged in parallel in the horizontal direction, but the number and arrangement of the load ports 100 are arbitrary.

The first transfer robot 110 is a robot for transferring substrates, and is configured to transfer substrates among the load port 100 , the aligner 120 , and the spin dryer 600 . The first transfer robot 110 is accommodated in the first robot room 115 .

The aligner 120 is a module used to align the orientation plane or the notch of the substrate in a specific direction. The aligner 120 is a kind of pre-processing module, and is used for pre-processing the substrate for plating processing. The aligner 120 is accommodated in the first processing chamber 125 adjacent to the first robot chamber 115 . In the present embodiment, the two aligners 120 are arranged side by side in the vertical direction, but the number and arrangement of the aligners 120 are arbitrary. In this embodiment, the aligner 120 is described as an example of the preprocessing module, but it is not limited to this. The pretreatment module may also include a pre-wet module for supplying pure water or degassed water to the substrate. The pre-wetting module replaces the air inside the pattern formed on the substrate surface with the treatment liquid by wetting the plated surface of the substrate before the plating treatment with the treatment liquid such as pure water or degassed water. In addition, the pretreatment module may include a prepreg module for supplying the etching treatment liquid to the substrate. The prepreg module is configured to apply a prepreg treatment, and the prepreg treatment is to remove the large resistance oxide film such as the surface of the seed layer formed on the plated surface of the substrate before the plating treatment by etching with a treatment solution such as sulfuric acid or hydrochloric acid. to clean or activate plated base surfaces.

The coating film group 400 is a module for applying a coating process to a substrate. In the present embodiment, there are two plating film groups 400 arranged in parallel in the vertical direction and six in the horizontal direction, for a total of 24 plating film groups 400 , but the number of plating film groups 400 is limited by the Configured to be arbitrary. The plating film group 400 is accommodated in the plating chamber 405 .

The cleaning module 500 is configured to perform cleaning treatment on the substrate in order to remove the plating solution and the like remaining on the substrate after the plating treatment. In the present embodiment, although one cleaning module 500 is arranged in the first processing chamber 125, the number and arrangement of the cleaning modules 500 are arbitrary. The cleaning module 500 is one of the first post-processing modules, and is used to perform post-processing of the plating process on the substrate.

The spin dryer 600 is a module for rotating and drying the cleaned substrate at high speed. In this embodiment, although two spin dryers are arranged in parallel in the vertical direction, the number and arrangement of spin dryers are arbitrary. The spin dryer 600 is one of the second post-processing modules, and is used for post-processing of the plating process on the substrate. The spin dryer 600 is accommodated in the second processing chamber 605 . In the present embodiment, an example in which the cleaning module 500 is used as the first post-processing module and the spin dryer 600 is used as the second post-processing module is shown, but the present invention is not limited to this. Not limited to the above example, an edge post-rinsing module for supplying the processing liquid to the outer peripheral portion of the substrate may be used as the first post-processing module or the second post-processing module.

The second transfer robot 700 is a device for transferring the substrate between the plurality of modules in the coating apparatus 1000 . Specifically, the second transfer robot 700 has a pre-processing module including the aligner 120 , a first post-processing module including the coating film group 400 and the cleaning module 500 , and a second processing module including the spin dryer 600 . Transfer substrates between post-processing modules. The second transfer robot 700 is accommodated in a second robot chamber 705 adjacent to the first processing chamber 125 , the coating chamber 405 , and the second processing chamber 605 .

FIG. 3 schematically shows a configuration diagram of the arm of the second transfer robot. As shown in FIG. 3 , the second transfer robot 700 includes a first arm 720 , a second arm 730 , and an arm 710 for holding the first arm 720 and the second arm 730 . The first arm 720 is a dry-only arm for conveying the substrate Wf before the plating process. The second arm 730 is a wet-only arm for conveying the substrate Wf subjected to the plating process, and is disposed below the first arm 720 . Thereby, liquid such as a plating solution can be prevented from dripping from the substrate Wf held by the second arm 730 to the first arm 720 .

The first robot room 115 is the area that must be kept in the cleanest state. Therefore, the inside of the first robot chamber 115 is always maintained at a higher pressure than the outside of the coating film group 400 , the first processing chamber 125 , the second processing chamber 605 , the second robot chamber 705 , and the coating chamber 405 . On the other hand, the plating chamber 405 is the dirtiest area because particles at the molecular level are generated due to the evaporation of the chemical solution in the wet process such as the plating process. Therefore, a negative pressure is formed inside the coating chamber 405 . The inside of the coating film group 400 is adjusted to reduce the pressure in the order of the first robot chamber 115 , the first processing chamber 125 , the second processing chamber 605 , the second robot chamber 705 , and the coating chamber 405 .

The control module 800 is configured as a plurality of modules for controlling the coating apparatus 1000 , and may be composed of, for example, a general electronic computer or a dedicated electronic computer having an input/output interface with an operator. The control module 800 is accommodated in the control room.

In the coating apparatus 1000 of the present embodiment, the first robot chamber 115, the first processing chamber 125, the second processing chamber 605, the second robot chamber 705, and the coating chamber 405 are isolated from each other. In this way, the coating apparatus 1000 realizes a miniature device in which the first transfer robot 110 , the aligner 120 , the cleaning module 500 , the spin dryer 600 , the second transfer robot 700 and the coating film group 400 are respectively arranged in the isolated room. environment. The plating apparatus 1000 is configured to restrict the opening of the isolation between the rooms only when the substrate is transferred. The following description is about this point.

The control module 800 is configured to control the closing of a door that partitions a plurality of rooms in which each component of the plating apparatus 1000 is accommodated. Specifically, as shown in FIG. 2 , the coating apparatus 1000 includes the first door 117 arranged between the first robot chamber 115 and the first processing chamber 125 . The control module 800 is configured to control the opening and closing of the first door 117 . The control module 800 opens the first door 117 when, for example, the substrate is transferred from the first transfer robot 110 to the aligner 120 .

The coating apparatus 1000 includes the second door 127 arranged between the first processing chamber 125 and the second automatic machine chamber 705 . The control module 800 is configured to control the opening and closing of the second door 127 . For example, the control module 800 opens the second door 127 when the second transfer robot 700 receives the substrate whose notch direction is adjusted by the aligner 120 .

The coating apparatus 1000 includes the third door 707 arranged in the second robot chamber 705 and the second processing chamber 605 . The control module 800 is configured to control the opening and closing of the third door 707 . The control module 800 opens the third door 707 when, for example, the plated substrate is transferred from the second transfer robot 700 to the spin dryer 600 .

Moreover, the coating apparatus 1000 is provided with the 4th door 607 arrange|positioned between the 2nd process chamber 605 and the 1st robot chamber 115. The control module 800 is configured to control the opening and closing of the fourth door 607 . The control module 800 opens the fourth door 607 when, for example, the first transfer robot 110 receives the substrate subjected to the drying treatment by the spin dryer 600 .

Moreover, the coating apparatus 1000 is provided with the 5th door 407 arrange|positioned between the 2nd robot chamber 705 and the coating chamber 405. The control module 800 is configured to control the opening and closing of the fifth door 407 . The control module 800 opens the fifth door 407 when, for example, the second transfer robot 700 transfers the substrate to the coating film group 400 .

The control module 800 is configured to control the opening and closing of the first door 117 and the second door 127 so that the first door 117 and the second door 127 are not opened at the same time. Furthermore, the control module 800 is configured to control the opening and closing of the third door 707 and the fourth door 607 so that the third door 707 and the fourth door 607 are not opened at the same time.

That is, the coating apparatus 1000 of the present embodiment is configured to suppress particle contamination of the first robot chamber 115 that needs to be kept in the cleanest state. Specifically, the plating apparatus 1000 is configured so as not to transfer the substrate between the first transfer robot 110 and the second transfer robot 700 , but to transfer the substrate through the aligner 120 or the spin dryer 600 . Here, when the substrate is transferred from the first transfer robot 110 to the aligner 120, the first door 117 is opened, but the second door 127 is closed at this time. In addition, when the second transfer robot 700 receives the substrate whose notch direction has been adjusted by the aligner 120, the second door 127 is opened, but the first door 117 is closed at this time. Furthermore, when the substrate subjected to the plating treatment is transferred from the second transfer robot 700 to the spin dryer 600, the third door 707 is opened, but the fourth door 607 is closed at this time. Furthermore, when the first transfer robot 110 receives the substrate subjected to the overdrying process by the spin dryer 600, the fourth door 607 is opened, but the third door 707 is closed at this time.

Thereby, since the first robot chamber 115 and the second robot chamber 705 are not in a communication state, the particles adhering to the second transfer robot 700 can be suppressed from being mixed into the first robot chamber 115 . In this way, since the arrangement and operation control of the constituent elements are optimized in the coating film group 400 of the present embodiment, it is possible to suppress the mixing of particles into the first robot chamber 115 , and as a result, it is possible to suppress the adhesion of particles to the particles carried out from the coating film group 400 . substrate.

In addition, the control module 800, like the second door 127 and the fifth door 407, is configured to control the opening and closing of the second door 127 and the fifth door 407 so that both are not opened at the same time. Furthermore, the control module 800 is also configured to control the opening and closing of the third door 707 and the fifth door 407 so as not to open at the same time as the third door 707 and the fifth door 407 .

Next, an example of a series of operation control of the coating apparatus 1000 will be described. FIG. 4 is a flowchart of the operation control of the coating apparatus 1000 of the present embodiment. First, the plating apparatus 1000 receives the substrates accommodated in the cassettes at the loading port 100 (step 102 ). Next, the coating apparatus 1000 takes out the substrate from the cassette of the loading port 100 by the first transfer robot 110 (step 104 ). Next, the control module 800 opens the first door 117 (step 106 ). Next, the coating apparatus 1000 transfers the substrate to the aligner 120 by the first transfer robot 110 (first transfer step 108 ). Next, the control module 800 closes the first door 117 (step 110 ).

Next, the plating apparatus 1000 uses the aligner 120 to align the orientation plane or the notch of the substrate in a specific direction (step 112 ). Next, the control module 800 opens the second door 127 (step 114). Next, the coating apparatus 1000 receives the aligned substrates from the aligner 120 by the first arm 720 of the second transfer robot 700 (first receiving step 116). Next, the control module 800 closes the second door 127 (step 118 ).

Next, the control module 800 opens the fifth door 407 (step 120). Next, the coating apparatus 1000 transfers the substrate to the coating film group 400 by the first arm 720 of the second conveying robot 700 (step 122 ). Next, the control module 800 closes the fifth door 407 (step 124 ). Next, the plating apparatus 1000 applies a plating process to the substrate by means of the plating film group 400 (step 126 ). Next, the control module 800 opens the fifth door 407 (step 128). Next, the coating apparatus 1000 receives the substrate from the coating film group 400 by the second arm 730 of the second transfer robot 700 (step 130). Next, the control module 800 closes the fifth door 407 (step 132 ).

Next, the control module 800 opens the second door 127 (step 134). Next, the coating apparatus 1000 transfers the substrate to the cleaning module 500 by the second arm 730 of the second transfer robot 700 (step 136 ). Next, the control module 800 closes the second door 127 (step 138 ). Next, the plating apparatus 1000 applies a cleaning process to the substrate through the cleaning module 500 (step 140 ).

Next, the control module 800 opens the second door 127 (step 142). Next, the coating apparatus 1000 receives the substrate from the cleaning module 500 via the second arm 730 of the second transfer robot 700 (step 144). Next, the control module 800 closes the second door 127 (step 146 ).

Next, the control module 800 opens the third door 707 (step 148). Next, the coating apparatus 1000 transfers the substrate to the spin dryer 600 by the second arm 730 of the second transfer robot 700 (second transfer step 150 ). Next, the control module 800 closes the third door 707 (step 152).

Next, the coating apparatus 1000 applies a drying process to the substrate by the spin dryer 600 (step 154 ). Next, the control module 800 opens the fourth door 607 (step 156). Next, the plating apparatus 1000 receives the over-dried substrate by the first transfer robot 110 (second receiving step 158 ). Next, the control module 800 closes the fourth door 607 (step 160 ). Next, the plating apparatus 1000 transports the substrate to the cassette of the loading port 100 by the first transport robot 110 (step 162 ). Finally, the plating apparatus 1000 unloads the cassette containing the substrate from the loading port 100 (step 164 ).

As described above, according to the present embodiment, in a coating apparatus in which a plurality of constituent elements are individually arranged in a microenvironment in an isolated room, in order to prevent the first robot chamber 115 and the second robot chamber 705 from being in a communication state, the control Opening and closing of doors between isolated rooms. Thereby, it can suppress that the particle|grains adhering to the 2nd conveyance robot 700 are mixed into the 1st robot chamber 115.

Although some embodiments of the present invention have been described above, the above-described embodiments of the present invention are intended to facilitate understanding of the present invention and are not intended to limit the present invention. The present invention can be changed and improved without departing from the gist, and it is needless to say that the present invention also includes the equivalents thereof. Further, within the range that at least a part of the above-mentioned problems can be solved, or the range that at least a part of the effects can be achieved, the respective constituent elements described in the claims and the specification can be arbitrarily combined or omitted.

The present application, as an embodiment, discloses a plating apparatus for plating a substrate, comprising: a first automatic machine room, accommodating a first conveying robot, and the first conveying robot is used for conveying into a The substrate of the coating device and the substrate carried out from the coating device; the coating chamber, which houses a coating film group, and the coating film group is used for plating the substrate; the first processing chamber houses a pre-processing module , the aforementioned pre-processing module is used for pre-processing the substrate for plating; the second automatic machine room accommodates the second conveying robot, and the aforementioned second conveying robot is used for the aforementioned pre-processing module and the aforementioned plating mold substrates are transferred between groups; a first door is arranged between the first robot chamber and the first processing chamber; a second door is arranged between the first processing chamber and the second robot chamber; and a control The device is configured to control the opening and closing of the first door and the second door so that the first door and the second door are not opened at the same time.

Furthermore, the present application, as an embodiment, discloses a coating device, further comprising: a second processing chamber, which accommodates a post-processing module, and the post-processing module is used to perform post-processing on the substrate; Three doors are arranged between the second automatic machine room and the second processing room; and a fourth door is arranged between the second processing room and the first automatic machine room, wherein the control device is configured to control the When the third door and the fourth door are opened and closed, the third door and the fourth door are not opened at the same time.

Furthermore, the present application, as an embodiment, discloses a plating apparatus, wherein the second conveying robot includes: a first arm for conveying the substrate before the plating process; and a second arm, It is arranged at the lower part of the first arm, and is used to transport the substrate after the plating process.

Furthermore, the present application, as an embodiment, discloses a coating device, wherein the pre-processing module includes at least one of the following: an aligner, used for adjusting the position of the rotation direction of the substrate; a pre-wetting module, used for supplying pure water or degassed water to the substrate; and a prepreg module for supplying etching treatment liquid to the substrate.

Furthermore, the present application, as an embodiment, discloses a coating apparatus, wherein the post-processing module includes at least one of the following: a cleaning module for supplying cleaning solution to a substrate; a spin dryer for rotating the substrate and drying; and a post-edge rinse module for supplying the processing liquid to the outer periphery of the substrate.

Furthermore, the present application, as an embodiment, discloses an operation control method of a coating device, comprising: a step of opening a first door disposed between a first automatic machine chamber and a first processing chamber, wherein the first automatic The machine room accommodates a first transfer robot, and the first transfer robot is used to transfer the substrates carried into the plating apparatus and the substrates unloaded from the plating apparatus, and the first processing chamber houses a pre-processing module, the pre-processing The module is used for the pretreatment of the plating process on the substrate; in the first transfer step, after the step of opening the first door, the substrate is transferred to the pretreatment module by the first transfer robot; in the first transfer After the transfer step, the step of closing the first door; after the step of closing the first door, the step of opening the second door disposed between the first processing chamber and the second automatic machine room, the second automatic machine room accommodating a second conveying robot, the second conveying robot is used for conveying the substrate between the plating module and the pre-processing module, and the plating module is used for plating the substrate; and a first receiving step and after the step of opening the second door, the substrate is received from the pre-processing module by the second conveying robot.

Furthermore, the present application, as an embodiment, discloses an operation control method of a coating device, further comprising: a step of opening a third door disposed between the second automatic machine chamber and the second processing chamber, wherein the aforementioned The second processing chamber accommodates a post-processing module, and the post-processing module is used for the post-processing of the plating process on the substrate; in the second transfer step, after the step of opening the third door, the second transfer automatic machine is used Transfer the substrate to the post-processing module; after the second transfer step, the step of closing the third door; after the step of closing the third door, opening the second processing chamber and the first automatic machine chamber The step between the fourth door and the second receiving step, after the step of opening the fourth door, the step of receiving the substrate from the post-processing module by the first transfer robot.

Furthermore, the present application, as an embodiment, discloses an operation control method of a coating device, wherein the first receiving step is performed using a first arm, and the first arm is used for conveying the second conveying robot. The substrate before the plating process; the second receiving step is performed using the second arm, and the second arm is used to transport the substrate after the plating process of the second conveying robot.

100: Load port 110: The first conveying automaton 115: The first automatic machine room 117: The first door 120: Aligner 125: The first processing chamber 127: Second Door 400: Coating group 405: Plating Room 407: Fifth Door 500: Cleaning Module 600: Spin dryer 605: Second processing chamber 607: Fourth Door 700: Second transfer automaton 705: Second Automata Room 707: The third door 710: Arm 720: First Arm 730: Second Arm 800: Control Module 1000: Coating device Wf: substrate

[Fig. 1] A perspective view showing the overall structure of the coating apparatus according to the present embodiment. [Fig. 2] A plan view showing the overall configuration of the coating apparatus according to the present embodiment. [Figure 3] A schematic diagram showing the configuration of the arm of the second transfer robot. [FIG. 4] A flowchart of the operation control of the coating apparatus of the present embodiment.

100: Load port

110: The first conveying automaton

115: The first automatic machine room

117: The first door

125: The first processing chamber

127: Second Door

400: Coating group

405: Plating Room

407: Fifth Door

500: Cleaning Module

600: Spin dryer

605: Second processing chamber

607: Fourth Door

700: Second transfer automaton

705: Second Automata Room

707: The third door

800: Control Module

1000: Coating device

Claims (8)

A plating apparatus for plating a substrate, comprising: a first robot chamber for accommodating a first conveying robot, the first conveying robot for conveying the substrate carried in the plating apparatus and transferring the substrate from the plating apparatus The substrate unloaded by the coating device; the coating chamber houses the coating film group, which is used for plating the substrate; the first processing chamber houses the pre-processing module, which is used for the substrate The pre-processing of the plating process is carried out; the second automatic machine room accommodates the second conveying robot, and the second conveying robot is used for conveying the substrate between the pre-processing module and the plating module; the first door, a second door is arranged between the first processing chamber and the second automatic chamber; and a control device is configured to control the first door and the The opening and closing of the second door prevents the first door and the second door from being opened at the same time. The coating apparatus according to claim 1, further comprising: a second processing chamber, accommodating a post-processing module, and the post-processing module is used to perform post-processing on the substrate; Between two automatic machine rooms and the second processing room; and a fourth door, arranged between the second processing room and the first automatic machine room, wherein the control device is configured to control the third door and the fourth door The opening and closing of the door prevents the third door and the fourth door from being opened at the same time. The plating apparatus according to claim 1 or 2, wherein the second conveying robot includes: a first arm for conveying the substrate before the plating process; and The second arm is arranged at the lower part of the first arm, and is used for conveying the substrate after the plating process. The coating device according to claim 1 or 2, wherein the pretreatment module comprises at least one of the following: an aligner for adjusting the position of the rotation direction of the substrate; a pre-wetting module for supplying pure water or Degassed water to the substrate; or a prepreg module for supplying the etching solution to the substrate. The coating apparatus of claim 2, wherein the post-processing module includes at least one of the following: a cleaning module for supplying cleaning solution to the substrate; a spin dryer for rotating and drying the substrate; The rinse module is used to supply the processing liquid to the outer periphery of the substrate. An operation control method of a coating apparatus, comprising: the step of opening a first door disposed between a first automatic machine room and a first processing room, wherein the first automatic machine room accommodates a first conveying robot, and the first conveying machine The automatic machine is used for conveying the substrates carried into the plating apparatus and the substrates carried out from the plating apparatus, the first processing chamber accommodates a pre-processing module, and the pre-processing module is used for pre-processing the substrate for the plating processing ; the first transfer step, after the step of opening the first door, the substrate is transferred to the pre-processing module by the first transfer robot; after the first transfer step, the step of closing the first door; in After the step of closing the first door, the step of opening the second door arranged between the first processing chamber and the second robot chamber, the second robot chamber accommodates the second transfer robot, and the second transfer robot is used for transferring the substrate between the plating module and the pre-processing module, and the plating module is used for plating the substrate; and In the first receiving step, after the step of opening the second door, the substrate is received from the pre-processing module by the second transfer robot. The operation control method of the coating apparatus according to claim 6, further comprising: the step of opening a third door disposed between the second automatic machine chamber and the second processing chamber, wherein the second processing chamber accommodates post-processing a module, the post-processing module is used for post-processing of the plating process on the substrate; the second transfer step, after the step of opening the third door, the second transfer robot transfers the substrate to the post-processing mold group; after the second transfer step, the step of closing the third door; after the step of closing the third door, the fourth door disposed between the second processing chamber and the first automatic machine chamber is opened. step; the second receiving step, after the step of opening the fourth door, the step of receiving the substrate from the post-processing module by the first conveying robot. The operation control method of a coating apparatus according to claim 7, wherein the first receiving step is performed using a first arm, and the first arm is used to transport the substrate before the coating process of the second transport robot; The second receiving step is performed using a second arm for conveying the substrate subjected to the plating process by the second conveying robot.

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