WO2008059684A1

WO2008059684A1 - Substrate carrying equipment

Info

Publication number: WO2008059684A1
Application number: PCT/JP2007/070119
Authority: WO
Inventors: Yuuichi Yamamoto
Original assignee: Tokyo Electron Limited
Priority date: 2006-11-17
Filing date: 2007-10-16
Publication date: 2008-05-22
Also published as: JP5025231B2; JP2008130634A; KR101355693B1; KR20090092799A; TWI358103B; TW200824029A

Abstract

Substrate carrying equipment comprises a carrier station for carrying in or carrying out a carrier containing a wafer, a processing station, and a carrying means of wafer. The carrier station comprises a carrier mounting section having shelves at a plurality of levels for mounting the carriers, a carrier stock section, a carrier lifter for delivering the carrier between the carrier mounting section and the carrier stock section, and a transfer arm which carries in or carries out a wafer for the carrier at the carrier mounting section. The lower mounting shelf at the carrier mounting section is moved by a moving mechanism to a position below the upper mounting shelf or to an outer position not interfering in the vertical direction for the upper mounting shelf. The lower mounting shelf delivers the carrier to the lower mounting shelf at the outer position by means of the carrier lifter.

Description

Specification

Substrate transfer processing equipment

Technical field

[0001] The present invention relates to a substrate transfer processing apparatus.

Background art

In general, in the manufacture of semiconductor devices, a photolithography technique is used to form an ITO (Indium Tin Oxide) thin film or an electrode pattern on a substrate such as a semiconductor wafer or an LCD glass substrate. In this photolithography technique, a photoresist is applied to a substrate, a resist film formed thereby is exposed in accordance with a predetermined circuit pattern, and this exposure pattern is developed to form a desired circuit pattern on the resist film. It is performed by a series of steps to form.

[0003] In general, such processing is performed by transporting a substrate unloaded from a carrier (FOUP) containing a substrate to a processing unit, and performing resist coating processing, heat processing after resist coating processing, exposure processing, and heating after exposure. 2. Description of the Related Art A substrate transfer processing apparatus that stores a processed substrate in a carrier and finishes processing after performing processing, development processing, and the like is known (for example, see Patent Document 1).

Yes

[0004] In the above processing apparatus, in order to increase processing efficiency, a plurality of, for example, four or five carriers are placed in parallel on a carrier station, a substrate is unloaded from a predetermined carrier, and accommodated in an empty carrier. Thus, continuous processing is performed.

[0005] In addition, there is a known structure in which a carrier stock part is provided above the carrier station so that the carrier can be quickly replaced with the carrier station! Reference 2).

Patent Document 1: Japanese Patent Laid-Open No. 2003-218018

Patent Document 2: Japanese Patent Laid-Open No. 2002-134588

Disclosure of the invention

Problems to be solved by the invention

[0006] By the way, with the recent finer integration of semiconductor devices, the substrate diameter has increased. In addition, high-speed processing of substrates and multiplexing of processing (for example, lithographic process is used twice)

V, an increase in the number of carriers is required due to the small lot processing associated with the inline inspection machine module required for multi-patterning technology.

However, in the current processing apparatus, since the number of carriers that can be placed on the carrier station is limited, it is particularly difficult to increase the number of carriers significantly, and high-speed processing of the substrate can be achieved. There is a problem!

[0008] As a means to solve the above problem, it is possible to increase the number of carriers by placing carriers in multiple stages. In this structure, it takes a lot of time to replace the carrier with the carrier station, and the high speed of the substrate There is a concern that it cannot be processed!

[0009] The present invention has been made in view of the above-mentioned problems, and can increase the number of carriers without increasing the size of the apparatus more than necessary, enabling a high-speed substrate processing and a small lot processing. It is an object to provide a transfer processing device.

Means for solving the problem

[0010] In order to solve the above-described problems, a substrate transfer processing apparatus of the present invention includes a carrier station that loads and unloads a carrier that accommodates a substrate to be processed, and a processing unit that performs various types of processing on the substrate to be processed. A substrate transfer processing apparatus comprising: a processing station; and a transfer means for transferring a substrate to be processed between the carrier station and the processing station, wherein the carrier station has a plurality of stages on which a plurality of carriers can be placed. A carrier mounting section having a mounting shelf; a carrier stock section positioned above the carrier mounting section; and carrier delivery means for delivering a carrier between the carrier mounting section and the carrier stock section; Substrate carrier loading / unloading means for loading / unloading a substrate to be processed with respect to the carrier loaded into the carrier loading portion. The lower mounting shelf is formed so as to be movable with respect to the upper mounting shelf by the moving mechanism to a position below the upper mounting shelf and an outer position that does not interfere in the vertical direction. The carrier delivery means is formed so as to be able to deliver a carrier to a mounting shelf in an outward position.

[0011] According to this configuration, a plurality of carriers can be placed on a plurality of placement shelves provided in the carrier station, and the placement shelf located in the lower stage does not interfere with the upper placement shelf. This is the force to deliver the carrier to and from the carrier stock section with respect to the shelf described above while moving to the outward position.

[0012] Further, the substrate transfer processing apparatus receives a detection signal detected by the substrate detection means and a substrate detection means for detecting a storage state of the substrate to be processed accommodated in the carrier, When the substrate to be processed accommodated in the carrier is in a predetermined number of states, it is configured to further comprise a carrier delivery means and a control means for transmitting an operation signal to the moving mechanism of the mounting shelf. it can.

[0013] According to this configuration, when the processed substrate is accommodated in the carrier placed on the lower placement shelf, the substrate detection means detects the accommodated state, and the detection signal Can be transmitted to the control means to recognize the accommodation state (number of substrates) of the substrate to be processed in the carrier. When the accommodation state (number) of the substrates to be processed in the carrier reaches a predetermined state (number) set in advance, the lower placement shelf is placed on the upper placement based on the control signal from the control means. Move to the outside position where it does not interfere with the shelf, transport it to the carrier stock section by the carrier delivery means, transfer another carrier from the carrier stock section to the empty placement shelf, and then move the placement shelf to the original position Then, the force S is used to make the subsequent processed substrate ready for storage.

[0014] In addition, in the above-described substrate transfer processing apparatus, the placement shelf located in the lower stage places one carrier independently, and is independent of the lower position and the outward position of the upper placement shelf. Thus, it can be configured to have a plurality of movable shelves.

[0015] According to this configuration, the force S is used to deliver each carrier between the mounting shelf and the carrier stock unit.

[0016] Further, in the substrate transfer processing apparatus, the carrier includes a storage container that stores a plurality of substrates to be processed, and a lid that opens and closes an opening of the storage container. The station includes a lid opening / closing device that opens and closes the lid, and the lid opening / closing device is formed so as to be movable up and down with respect to the carrier placed on each stage mounting shelf. When the lid is opened, the force S can be configured so that the lid is opened at a position that does not interfere with the upper and lower placement shelves.

[0017] According to this configuration, the lid provided on the carrier placed on the placement shelf of each stage is opened and closed. Thus, the substrate to be processed can be carried in and out of the carrier. At this time, there is no hindrance to loading / unloading of the substrate to be processed with respect to the carrier mounted on the mounting shelf at the adjacent stage.

The invention's effect

[0018] According to the substrate transfer processing apparatus of the present invention, the force S for placing a plurality of carriers on a plurality of stages of mounting shelves can be achieved, and the mounting shelves positioned at the lower stage do not interfere with the upper stage mounting shelves. Since the carrier can be transferred to and from the carrier stock section with respect to the mounting shelf while moving to the outward position, the number of carriers can be increased without increasing the size of the device more than necessary. In addition to high-speed processing of substrates and multiplexing of processing (for example, in-line inspection machine modules required for multi-patterning technology that uses lithographic processes twice) it can.

Brief Description of Drawings

FIG. 1 is a schematic perspective view showing an example of a resist coating / developing apparatus provided with a substrate transfer processing apparatus according to the present invention.

FIG. 2 is a schematic plan view of the resist coating / developing apparatus.

FIG. 3 is a schematic side view showing a carrier station in the present invention.

FIG. 4A is a perspective view showing a configuration of a carrier in the present invention.

FIG. 4B is a transverse sectional view showing the structure of the carrier in the present invention.

FIG. 5A is a side view showing different open states of the carrier lid by the lid opening / closing device according to the present invention.

FIG. 5B is a side view showing different open states of the carrier lid by the lid opening / closing device according to the present invention.

FIG. 6 is a schematic side view showing a processing station in the present invention.

FIG. 7 is a schematic side view showing a measuring apparatus according to the present invention.

FIG. 8A is a schematic side view showing an example of carrier loading / unloading operations and wafer loading / unloading operations at a carrier station.

FIG. 8B is a schematic side view showing an example of carrier loading / unloading operations and wafer loading / unloading operations at the carrier station. FIG. 8C is a schematic side view showing an example of carrier loading / unloading operations and wafer loading / unloading operations at the carrier station.

FIG. 8D is a schematic side view showing an example of carrier loading / unloading operations and wafer loading / unloading operations at the carrier station.

FIG. 8E is a schematic side view showing an example of carrier loading / unloading operations and wafer loading / unloading operations at the carrier station.

BEST MODE FOR CARRYING OUT THE INVENTION

Hereinafter, a substrate transfer processing apparatus according to an embodiment of the present invention will be described with reference to the drawings. Here, a case where the substrate transfer processing apparatus according to the present invention is applied to a semiconductor wafer resist coating and developing apparatus will be described.

FIG. 1 is a schematic perspective view showing the configuration of a resist coating / developing apparatus as an embodiment of a substrate transfer processing apparatus of the present invention. FIG. 2 is a plan view showing the configuration of the resist coating and developing apparatus shown in FIG.

[0022] This resist coating / development processing apparatus is a carrier station for carrying in / out a carrier 20 (FOUP) in which, for example, 25 semiconductor wafers W (hereinafter referred to as wafers W) are hermetically contained. Interface unit S3 that transfers wafer W between exposure station S4 and processing station S2 configured by vertically arranging S1 and a plurality of unit blocks B1 to B4, for example, four unit blocks B1 to B4, and processing with carrier station S1 And a measuring station S 5 interposed between the stations S 2.

[0023] Each of the carrier stations S1 includes a carrier mounting unit 10 having a plurality of, for example, two mounting shelves 11, 12 on which a plurality of, for example, eight carriers 20 can be mounted, and the carrier mounting unit. The carrier stock unit 13 located above 10, the carrier lifter 14 that is a carrier delivery means for delivering the carrier 20 between the carrier mounting unit 10 and the carrier stock unit 13, and the carrier mounting unit 10 (loading) And a transfer arm C as a substrate loading / unloading means for loading / unloading the wafer W to / from the carrier 20 placed on the carrier 20.

In this case, as shown in FIGS. 4A and 4B, the carrier 20 has an opening 21 on one side and a plurality of (for example, 25) wafers W on the inner wall with an appropriate interval! / The storage container 22 having a holding groove (not shown) that is held in a horizontal state, and the opening 21 of the storage container 22 is opened and closed. And the lid 23 is opened and closed by operating the engagement / disengagement mechanism 24 incorporated in the lid 23 with the lid opening / closing device 25.

In addition, the state of the wafer W accommodated in the carrier 20, for example, the number of wafers and the posture of the wafer W are detected by the mapping sensor 26 which is a substrate detection unit, and the detection signal is a control unit which is a control unit. In response to a control signal from the control unit 60, the wafer lifter 14, the carrier transfer robot 15 disposed in the carrier stock unit 13, the lid opening / closing device 25, the transfer arm C, the moving mechanism 16 described later, etc. It is configured to work.

[0026] The lower mounting shelf 12 located in the lower stage of the carrier mounting portion 10 is formed of a plurality of, for example, four shelf bodies 12a on which one carrier 20 can be mounted independently. . Each shelf 12a has a lower position of the upper mounting shelf 11 with respect to the upper mounting shelf 11 by a moving mechanism 16 formed by, for example, an air cylinder, a ball screw mechanism, a timing belt, etc. It does not interfere with the direction! /, It is configured to be movable to the outside position.

It should be noted that a carrier mounting table 27 on which each carrier 20 is mounted is provided on the upper mounting shelf 11 and the lower mounting shelf 12. The carrier mounting table 27 is formed to be movable toward and away from a wafer carry-out port 19a and a wafer carry-in port 19b, which will be described later.

The carrier stock unit 13 is provided with a carrier transport robot 15 that can move in the horizontal XY direction and the vertical Z direction. By this carrier transport robot 15, a plurality of carriers 20 are transferred to the carrier stock unit 13. It is arranged in the inside. The carrier stock unit 13 is provided with a carrier 20 containing the wafer W, an empty carrier 20 and the like.

The carrier lifter 14 is formed to be movable in the horizontal XY direction and the vertical Z direction, and is configured to be able to transfer the carrier 20 to and from the carrier transport robot 15. With the carrier lifter 14 configured in this way, the carrier 20 in the carrier stock unit 13 is transported to the carrier mounting unit 10 or placed on the upper mounting shelf 11 of the carrier mounting unit 10. The carrier 20 can be transported by the carrier stock section 13. [0030] When the carrier 20 is delivered to the lower mounting shelf 12, the outer side which does not interfere with the upper mounting shelf 11 in the vertical direction with the shelf 12a of the lower mounting shelf 12 by the moving mechanism 16. The carrier 20 can be delivered by the carrier lifter 14 while moving to the position.

[0031] By configuring as described above, the carrier 20 can be smoothly delivered to the upper mounting shelf 11 and the lower mounting shelf 12, and a large number of devices without increasing the size more than necessary ( For example, eight carriers 20 can be mounted on the carrier mounting portion 10.

As shown in FIG. 5A or 5B, the lid opening / closing device 25 includes an engagement pin 25a that engages with an engagement / disengagement mechanism 24 of the lid body 23 of the carrier 20, a lid body holding plate 25b, and a lid body. And an elevating mechanism 25c for moving the holding plate 25b in the vertical direction. The elevating mechanism 25c is formed to be movable up and down with respect to the carrier 20 mounted on the upper mounting shelf 11 or the lower mounting shelf 12, and the lid body. When opening 23, the lid 23 is opened to a position that does not interfere with the loading / unloading port 19a and loading / unloading port 19b for loading / unloading the wafer W to / from the carriers 20 mounted on the upper and lower loading shelves 11 and 12. Is formed.

For example, as shown in FIG. 5A, the lower mounting shelf 12 opens the lid 23 on the lower side that does not interfere with the loading / unloading of the wafer W with respect to the carrier 20 on the upper mounting shelf 11. Is configured. Further, as shown in FIG. 5B, the upper mounting shelf 11 is configured to open the lid 23 on the upper side that does not hinder the loading / unloading of the wafer W with respect to the carrier 20 on the lower mounting shelf 12. ing. Accordingly, it is possible to smoothly carry in and out the wafer W with respect to each carrier 20, and the throughput can be improved.

[0034] It should be noted that the wall W 18 that divides the carrier mounting section 10 and the chamber 17 including the mapping sensor 26, the lid opening / closing device 25, and the transfer arm C has a wafer W carry-out port 19a and a carry-in port 19b. Is provided. For example, a wafer exit 18a for wafer W is provided in the wall 18 where the upper mounting shelf 11 is close, and a wafer entrance 19b for wafer W is provided in a position where the lower mounting shelf 12 is close. ! /, Ru (see Figure 1).

[0035] A processing station S2, which is connected to the back side of the carrier station S1 via a measurement station S5 and is surrounded by a casing 70, is connected. In this example, the processing station S2 includes, from the lower side, a first unit block (CHM) B1 for storing chemical liquid containers such as a resist solution and a developing solution, and a second unit block (DEV layer for performing a developing process). ) B2, 2-stage The coating film forming unit block for performing the resist solution coating process and the third and fourth unit blocks (COT layers) B3 and B4 which are the cleaning unit blocks for performing the cleaning process are hit ij. In this case, one of the unit blocks for forming the coating film, for example, the third unit block (COT layer) B3 is a unit block for performing an antireflection film forming process formed on the lower layer side of the resist film. (BCT layer) may be used. Further, a unit block for forming an antireflection film for performing an antireflection film forming process formed on the upper layer side of the resist film may be provided on the upper stage of the fourth unit block (COT layer) B4. Good.

[0036] The second to fourth unit blocks B2 to B4 are disposed on the front surface side, and are disposed on the rear surface side with a liquid processing unit for applying a chemical solution to the wafer W, and the liquid processing unit. Processing units such as various heating units for pre-processing and post-processing of the processing performed in the above, the liquid processing unit disposed on the front side, the heating unit disposed on the back side, etc. In order to transfer wafer W between the processing unit, specifically the development processing unit at the lower level and the processing unit such as the heating unit and the processing unit with the resist processing unit at the upper level Main arms A1 and A2 which are dedicated substrate transfer means.

[0037] In this example, the unit blocks B2 to B4 have the same layout layout of the liquid processing unit, the processing unit such as the heating unit, and the conveying means between the unit blocks B2 to B4. Has been. Here, the same arrangement layout means that the center of the wafer W in each processing unit, that is, the center of the spin chuck that is the means for holding the wafer W in the liquid processing unit, the heating plate or cooling in the heating unit, and so on. It means that the center of the plate is the same.

[0038] As shown in FIG. 2, the above DEV layer B2 has a measuring station S5 on the carrier station S1 side in the length direction of the DEV layer B2 (Y direction in the figure) at the center of the DEV layer B2. A transfer area R1 of the wafer W for connecting the interface portion S3 (horizontal movement area of the main arm A1) is formed. COT layers B3 and B4 are not shown, but like DEV layer B2, COT layers B3 and B4 are almost centered in the length direction of COT layers B3 and B4 (in the Y direction in the figure). A transfer area R2 (horizontal movement area of the main arm A2) for the wafer W for connecting the carrier station S1 side and the interface section S3 is formed! /.

[0039] On both sides of the transfer area Rl (R2) viewed from the carrier station S1 side, the front side ( One-stage development unit 3 1 having a plurality of, for example, three development processing units for performing development processing on the right side as the liquid processing unit on the right side from the carrier station SI side), 2 A step coating unit 32 and a cleaning unit (not shown) are provided. Each unit block is provided with, for example, four shelf units Ul, U2, U3, and U4 in order from the front side to the left side. Various units for pre-processing and post-processing of the processing performed in the unit 31 are stacked in a plurality of stages, for example, three stages. In this way, the developing unit 31 and the shelf units U1 to U4 are partitioned by the transport region R1, and by ejecting the cleaning air to the transport region R1 and exhausting it, the floating of particles in the region is suppressed. It ’s going to be.

[0040] Among the various units for performing the above pre-processing and post-processing, as shown in FIG. 6, for example, a post-exposure baking unit that heat-processes the wafer W after exposure is called. It is called a heating unit (PEB) or a post-baking unit that heats the wafer W after development to remove moisture! /, A heating unit (POST), etc. It is. Each processing unit such as the heating unit (PEB, POST) is accommodated in the processing container 40, and the shelf units U1 to U4 are configured by stacking the processing containers 40 in three stages. A wafer loading / unloading port 41 is formed on the surface of the processing container facing the transfer region R1. The heating unit (PEB, POST) is formed so that the heating temperature and heating time can be adjusted.

[0041] The transfer arm R1 is provided with the main arm A1. The main arm A 1 transfers wafers to and from all modules in the DEV layer B2 (where the wafer W is placed), for example, each processing unit of the shelf units U1 to U4 and each part of the developing unit 31. For this purpose, it can move in the horizontal X and Y directions and the vertical Z direction, and can rotate around the vertical axis.

Note that the main arm Al (A2) is configured in the same manner, and the main arm A1 will be described as a representative example. For example, as shown in FIG. An arm main body 50 having two curved arm pieces 51 is provided, and these curved arm pieces 51 are configured to be movable forward and backward independently of each other along a base (not shown). This base The stand is configured to be rotatable about the vertical axis, and is configured to be movable in the Y direction and movable up and down. In this way, the curved arm piece 51 is configured to be movable back and forth in the X direction, movable in the Y direction, freely movable up and down, and rotatable about the vertical axis, and is arranged on each unit of the shelf units U1 to U4 and on the carrier station S1 side. The wafer W can be transferred between the delivery unit TRS1 of the shelf unit U5 and the liquid processing unit. The driving of the main arm A1 is controlled by a controller (not shown) based on a command from the control unit 60. In addition, in order to prevent heat storage in the heating unit of the main arm Al (A2), the receiving order of the wafers W can be arbitrarily controlled by a program.

[0043] The unit blocks B3 and B4 for coating film formation are both configured in the same manner, and are configured in the same manner as the unit block B2 for development processing described above. Specifically, a coating unit 32 for performing a resist solution coating process on the wafer W is provided as a liquid processing unit, and the shelf units U1 to U4 of the COT layers B3 and B4 are provided with a resist solution coating unit. Equipped with a heating unit (CLHP) that heats the wafer W and a hydrophobic treatment unit (ADH) that improves the adhesion between the resist solution and the wafer W, and is configured in the same way as the DEV layer B2. Yes. That is, the coating unit, the heating unit (CLHP), and the hydrophobizing unit (ADH) are configured to be divided by the transfer area R2 of the main arm A2 (horizontal movement area of the main arm A2). In the COT layers B3 and B4, the main arm A2 delivers the wafer W to the delivery unit TRS1 of the shelf unit U5, the coating unit 32, and the processing units of the shelf units U;! To U4. Is done. The hydrophobic treatment unit (ADH) described above may be provided in any one of the unit blocks B3 and B4 for forming a force coating film that performs gas treatment in an HMDS atmosphere.

[0044] The measurement station S5 arranged adjacent to the processing station S2 includes a carrier station S1 and a casing 80 connected to the casing 70 of the processing station S2. A line width measuring device 90 that is an apparatus, a transfer arm D that is a transfer means for transferring the wafer W to and from the line width measuring device 90, and a delivery stage TRS2 are provided. In this case, the transfer arm D is connected to the delivery stage TRS2 in the measurement station S5, to the delivery stage TRS1 in the processing station S2, and to the line width measuring device 90. The wafer W is transferred between and in the horizontal X and Y directions and in the vertical Z direction.

As shown in FIG. 7, the line width measuring apparatus 90 includes a mounting table on which the wafer W is mounted horizontally.

91. The mounting table 91 forms, for example, an XY stage, and is formed to be movable in the horizontal X direction and the Y direction. Above the mounting table 91, a light irradiation unit 92 that irradiates light on the wafer W mounted on the mounting table 91 from an oblique direction, and a light irradiation unit 92 that is also irradiated with the force and detects light reflected by the wafer W is detected. A light receiving unit 93 is disposed! Information on the light detected by the light receiving unit 93 can be output to the detection unit 94, and the detection unit 94 is formed on the wafer W based on the acquired light information! The light intensity distribution of the reflected light reflected from the pattern can be measured. Note that the line width measuring apparatus 90 can detect impurities and particles adhering to the wafer W in addition to measuring the line width of the pattern.

[0046] Information from the detection unit 94 is transmitted to the control unit 60, and information processing for measuring the line width, for example, is performed. The control unit 60 includes, for example, a calculation unit 61, a storage unit 62, and an analysis unit 63. The calculation unit 61 calculates each light intensity in calculating reflected light reflected from a plurality of virtual patterns having different line widths based on, for example, known information such as the optical constant of the resist film, the pattern shape, and the structure of the resist film. Distribution can be calculated. The storage unit 62 can store each calculated light intensity distribution for the virtual pattern calculated by the calculation unit 61 and create a library thereof.

The light intensity distribution for the actual pattern on the wafer W measured by the detection unit 94 can be output to the analysis unit 63. The analysis unit 63 collates the light intensity distribution of the actual pattern output from the detection unit 94 with the light intensity distribution of the virtual pattern stored in the library of the storage unit 62, and the virtual pattern with which the light intensity distribution matches. , And the line width of the virtual pattern can be estimated as the line width of the actual pattern to measure the line width.

[0048] The line width information measured as described above is transmitted to the exposure apparatus S4 and the heating unit (PEB). In this case, the exposure apparatus S4 has an exposure control unit (not shown), and exposure is performed according to exposure conditions such as the exposure position, exposure amount, and exposure focus on the optical system wafer W preset by the exposure control unit. The process is configured to be controllable. [0049] Therefore, by transmitting a control signal from the control unit 60 to the exposure apparatus S4 and the heating unit (PEB), based on the measurement information of the line width of the pattern, in the exposure process of the second and subsequent lithography steps The force S is used to correct the exposure position, exposure amount, exposure focus, etc., and to correct the heating temperature, heating time, etc. in the heating process of the heating unit (PEB) after exposure.

[0050] Further, as shown in FIG. 2, a shelf unit U6 is provided at a position where the main arm A1 can access the adjacent area of the processing station S2 and the interface unit S3. The shelf unit U6 includes a delivery stage TRS3 and a delivery stage (not shown) having a cooling function for delivering the wafer W so as to deliver the wafer W to and from the main arm A1 of the DEV layer B2. ing. Further, in a region adjacent to the processing station S2 and the interface unit S3, as shown in FIG. 2 and FIG. 6, a peripheral edge exposure device (WEE) power stage is arranged.

On the other hand, an exposure apparatus S4 is connected to the back side of the shelf unit U6 in the processing station S2 via an interface unit S3. The interface unit S3 includes an interface arm E for delivering the wafer W to each part of the shelf unit U6 of the DEV layer B2 of the processing station S2 and the exposure apparatus S4. This interface arm E forms a means for transporting the wafer W interposed between the processing station S2 and the exposure apparatus S4. In this example, the interface arm E is used for the transfer stage TRS3 etc. of the DEV layer B2. C It is configured to move in the horizontal X, Y and vertical Z directions and to rotate around the lead straight axis so as to deliver W!

Next, an example of a procedure for processing the wafer W in the resist coating / development processing apparatus configured as described above will be described with reference to FIGS. 8A to 8E.

First, the carrier 20 in the carrier stock unit 13 is loaded, that is, placed on the carrier placement unit 10 by the carrier lifter 14. In this case, 25 wafers W are accommodated in one of the carriers 20 placed on the upper placement shelf 11. Also, an empty carrier 20 is placed on one of the lower placement shelves 12! /, (See FIG. 8A).

Next, the lid 23 of the carrier 20 that accommodates the 25 wafers W placed on the upper placement shelf 11 is opened by the lid opening / closing device 25. With the lid 23 open, The sensor 26 detects the accommodation state of the wafer W in the carrier 20, for example, the number of sheets, the horizontal posture, and the like, and transmits the detection signal to the control unit 60. Then, the transfer arm C is operated by the control signal from the control unit 60, the wafer W is unloaded from the carrier 20, and is transferred to the transfer stage TRS 2 of the measurement station S5 adjacent to the carrier station S1. The wafer W transferred to the transfer stage TRS2 is transferred by the transfer arm D to the transfer stage TRS1 of the processing station S2, and then transferred to the hydrophobization unit ADH by the main arm A2 and subjected to a hydrophobic treatment.

[0055] The wafer W is hydrophobized and then temporarily stored in the shelf unit U5, taken out of the shelf unit U5 by the main arm A2, and transferred to the coating unit 32 to form a resist film in the coating unit 32. . The wafer W on which the resist film is formed is transferred to the heating unit (CLHP) by the main arm A2, and subjected to a pre-beta (PAB) for evaporating the solvent from the resist film. Thereafter, the wafer W is transferred to a peripheral edge exposure apparatus (WEE), subjected to a peripheral exposure process, and then subjected to a heating process. Next, the wafer W is transferred to the exposure apparatus S4 by the interface arm E, where a predetermined exposure process is performed.

[0056] The wafer W after the exposure processing is transferred by the interface arm E to the delivery stage TRS3 of the shelf unit U6 in order to deliver the wafer W to the DEV layer B2, and the wafer W on the stage TRS3 is transferred to the DEV layer. After being received by the main arm A1 of B2 and first subjected to post-exposure beta processing by the heating unit (PEB) in the DEV layer B2, the main arm A1 applies a cooling plate (not shown) to the shelf unit U6. It is transported and adjusted to a predetermined temperature. Next, the wafer W is taken out from the shelf unit U6 by the main arm A1 and transferred to the developing unit 31, where a developing solution is applied. Thereafter, the main arm A1 transports it to the heating unit (POST), where a predetermined development process is performed.

[0057] The developed wafer W is transferred to the delivery stage TRS 1 of the shelf unit U5, and the wafer W on the stage TRS1 is received by the transfer arm D of the measurement station S5 to measure the line width of the measurement station S5. The line width of the pattern formed on the wafer W after being transferred to the apparatus 90 is measured. The measurement information of the line width is transmitted to the control unit 60 and stored in the control unit 60. The wafer W on which the line width has been measured is taken out from the line width measuring device 90 by the transfer arm D, and then transferred to the delivery stage TRS1 of the processing station S2, and the wafer W of the stage TR S 1 Is received by the main arm A2 of the processing station S2, transferred to the cleaning unit (SCR), and subjected to the cleaning process. This completes a series of lithographic processes.

The wafer W that has undergone a series of lithographic processes as described above is transferred to the empty carrier 20 placed on the lower placement shelf 12 of the carrier station S 1 by the transfer farm C. (See Figure 8B). At this time, for example, when 12 wafers W are accommodated in the carrier 20, the mapping sensor 26 detects the accommodation state of the wafer W, and the detection signal is transmitted to the control unit 60, and the control from the control unit 60 is performed. Based on the signal, the lid opening / closing device 25 operates to close the lid 23 of the carrier 20.

[0060] After the lid 23 of the carrier 20 is closed, the moving mechanism 16 operates and the lower mounting shelf 12 on which the carrier 20 containing 12 wafers W is placed is connected to the upper mounting shelf 11 and It is moved to an outside position where it does not interfere (see Figure 8C). The carrier 20 placed on the lower placement shelf 12 moved to the outer position is transported to the carrier stock unit 13 by the carrier lifter 14.

[0061] On the lower mounting shelf 12 from which the carrier 20 has been carried out (conveyed), a new empty carrier 20 disposed in the carrier stock section 13 is transported and placed by the carrier lifter 14 (see FIG. See 8D). Thereafter, the lower mounting shelf 12 on which the moving mechanism 16 is activated to place the carrier 20 is moved to a position close to the carry-in port 19b of the carrier station S1 (see FIG. 8E). After the remaining 13 processed wafers W are accommodated in the empty carrier 20, the mapping sensor 26 detects the accommodated state of the wafers W in the carrier 20, for example, 13 and the lid opening / closing device 25 The lid 23 is closed. Thereafter, similarly to the above, the moving mechanism 16 is operated, and the lower mounting shelf 12 on which the carrier 20 containing 13 wafers W is placed is moved to an outer position where it does not interfere with the upper mounting shelf 11. In this state, the carrier lifter 14 transports the carrier stock 13 to the carrier stock unit 13.

In the above description, the force described for the case where the first lithographic process is performed is the carrier 20 that accommodates the wafer W that has been subjected to the first lithographic process. Place it on the shelf 11 and repeat the same lithographic process as above. As a result, the pattern formed on the wafer w can be miniaturized. That is, the wafer W that has been subjected to the first lithographic process and the etching process is subjected to the resist coating process (COT) → the pre-beta (PAB) → the peripheral exposure process (WEE) → the heating process (BAK E) as described above. → By performing exposure processing (EXP) → post-exposure beta (PEB) → development processing (DEV), a pattern is additionally formed between the pitches of the pattern formed by one lithography process. The pattern can be formed.

[0063] In the second lithographic process, measurement information measured by the line width measuring device 90 after the first etching process is transmitted from the control unit 60 to the exposure device S4 and the heating unit (PEB). Based on the measurement information of the line width of the pattern, exposure correction such as exposure position, exposure amount and exposure focus in the second and subsequent exposure processes, heating in the heating process of the heating unit (PEB) after exposure Temperature correction such as temperature and heating time can be performed. As a result, the pattern formed on the wafer W can be miniaturized.

[0064] Further, the wafer W that has been subjected to the second lithographic process is transferred to the line width measuring device 90 of the measurement station S5, where the line width of the pattern is measured and impurities adhering to the surface of the wafer W are measured. Particles are measured (CDM / MCRO). This measurement information is also transmitted to the control unit 60, and the shape and pitch of the line width formed on the wafer W and the state of impurities and particles adhering to the wafer W can be confirmed.

The wafer W that has been subjected to the second lithographic process as described above is transferred to the carrier 20 mounted on, for example, the lower mounting shelf 12 of the carrier station S 1 by the transfer farm C. Returned and the process ends.

In the above embodiment, the case where the antireflection film is not formed has been described, but the resist coating-developing apparatus is also used when the antireflection film is formed below or above the resist film. The same can be applied.

In the above-described embodiment, the case where the carrier mounting unit 10 includes the two mounting shelves 11 and 12 has been described. However, the carrier mounting unit 10 may include three or more mounting shelves. Also in this case, the mounting shelf located in the lower stage is formed so as to be movable to an outer position that does not interfere with the mounting shelf located in the upper stage, and the carrier 20 is delivered as described above. Industrial applicability

[0068] According to the present invention, the number of carriers can be increased without unnecessarily increasing the size of an apparatus used for manufacturing a semiconductor device, and the substrate can be processed at high speed and in a small lot. A conveyance processing apparatus can be provided.

[0069] The power described above for the preferred embodiments of the present invention The present invention is not limited to such specific embodiments, and various modifications and changes can be made within the scope described in the claims. .

[0070] This application is the basis for priority claim. Patent application No. 2006 filed on Nov. 17, 2006.

— Based on issue 311031, the entire contents of which are incorporated herein.

Claims

The scope of the claims

[1] A carrier station that carries in and out a carrier that accommodates a substrate to be processed, a processing station that includes a processing unit that performs various types of processing on the substrate to be processed, and a substrate to be processed between the carrier station and the processing station. A substrate transfer processing apparatus comprising transfer means for delivering,

The carrier station includes a carrier mounting unit having a plurality of mounting shelves on which a plurality of carriers can be mounted, a carrier stock unit positioned above the carrier mounting unit, and the carrier mounting unit. A carrier delivery means for delivering the carrier to and from the carrier stock unit, and a substrate carrying-in / out means for carrying in / out the substrate to be processed with respect to the carrier carried into the carrier mounting unit,

The placement shelf located in the lower stage of the carrier placement section can be moved to the lower position of the upper placement shelf and the outer orientation that does not interfere in the vertical direction with respect to the upper placement shelf by the moving mechanism. A substrate transfer processing apparatus, wherein the carrier transfer means is formed so as to be able to transfer a carrier to a mounting shelf which is formed and located at an outer position.

[2] Substrate detection means for detecting the accommodation state of the substrate to be processed accommodated in the carrier, and the substrate to be processed accommodated in the carrier in response to the detection signal detected by the substrate detection means. 2. The substrate transfer processing apparatus according to claim 1, further comprising a control means for transmitting an operation signal to the carrier delivery means and the placement shelf moving mechanism when the number of states is reached.

[3] The placement shelf located in the lower stage is provided with a plurality of shelves that can be independently moved to the lower position and the outer position of the upper placement shelf while placing one carrier independently. The substrate transfer processing apparatus according to claim 1, wherein the substrate transfer processing apparatus is provided.

[4] The placement shelf located in the lower stage is provided with a plurality of shelves that can be independently moved to a lower position and an outer position of the upper placement shelf while placing one carrier independently. The substrate transfer processing apparatus according to claim 2, wherein the substrate transfer processing apparatus is provided.

[5] The carrier includes a storage container that stores a plurality of substrates to be processed, and a lid that opens and closes an opening of the storage container.

The carrier station includes a lid opening / closing device that opens and closes the lid, The lid opening / closing device is formed so as to be able to move up and down with respect to the carrier placed on each stage mounting shelf, and when the lid is opened, the lid opens to a position where it does not interfere with the upper and lower stage mounting shelves. The substrate transfer processing apparatus according to claim 1, wherein the substrate transfer processing apparatus is formed.

[6] The carrier includes a storage container that stores a plurality of substrates to be processed, and a lid that opens and closes an opening of the storage container.

The carrier station includes a lid opening / closing device that opens and closes the lid, and the lid opening / closing device is formed to be movable up and down with respect to a carrier placed on a mounting shelf at each stage. 3. The substrate transfer processing apparatus according to claim 2, wherein when the cover is opened, the lid is opened at a position that does not interfere with the upper and lower mounting shelves.

[7] The carrier includes a storage container that stores a plurality of substrates to be processed, and a lid that opens and closes the opening of the storage container.

The carrier station includes a lid opening / closing device that opens and closes the lid, and the lid opening / closing device is formed to be movable up and down with respect to a carrier placed on a mounting shelf at each stage. 4. The substrate transfer processing apparatus according to claim 3, wherein when the cover is opened, the lid is opened at a position where the lid does not interfere with the upper and lower mounting shelves.