CN114025592A - Etched microchannel heat exchanger - Google Patents
Etched microchannel heat exchanger Download PDFInfo
- Publication number
- CN114025592A CN114025592A CN202111471531.5A CN202111471531A CN114025592A CN 114025592 A CN114025592 A CN 114025592A CN 202111471531 A CN202111471531 A CN 202111471531A CN 114025592 A CN114025592 A CN 114025592A
- Authority
- CN
- China
- Prior art keywords
- heat exchanger
- frame
- etched
- microchannel heat
- radiating fins
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005530 etching Methods 0.000 claims abstract description 14
- 239000000110 cooling liquid Substances 0.000 claims abstract description 13
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 18
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 9
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 9
- 229910052782 aluminium Inorganic materials 0.000 claims description 9
- 229910052802 copper Inorganic materials 0.000 claims description 9
- 239000010949 copper Substances 0.000 claims description 9
- 229910052759 nickel Inorganic materials 0.000 claims description 9
- 238000007747 plating Methods 0.000 claims description 9
- 238000000034 method Methods 0.000 claims description 7
- 239000000463 material Substances 0.000 claims description 6
- 238000003466 welding Methods 0.000 claims description 4
- 238000005476 soldering Methods 0.000 claims description 3
- 238000003672 processing method Methods 0.000 claims description 2
- 230000000694 effects Effects 0.000 abstract description 5
- 238000011031 large-scale manufacturing process Methods 0.000 abstract description 2
- 238000003754 machining Methods 0.000 abstract description 2
- 230000017525 heat dissipation Effects 0.000 description 10
- 238000001816 cooling Methods 0.000 description 7
- 239000007788 liquid Substances 0.000 description 7
- 239000012530 fluid Substances 0.000 description 6
- 239000002826 coolant Substances 0.000 description 3
- 239000012809 cooling fluid Substances 0.000 description 2
- 230000002708 enhancing effect Effects 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 238000007493 shaping process Methods 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000011664 nicotinic acid Substances 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
- H05K7/20136—Forced ventilation, e.g. by fans
- H05K7/20172—Fan mounting or fan specifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
Abstract
The invention discloses an etched microchannel heat exchanger, which comprises a frame, wherein a cooling liquid microchannel flow channel is etched in the frame, and a radiating fin is welded on the frame. The invention has the advantages that: but it heat exchange effect is better and through the etching mode of processing, applicable in large-scale production and can improve machining efficiency and yields.
Description
Technical Field
The invention relates to the technical field of heat dissipation of electronic components, in particular to an etching micro-channel type heat exchanger.
Background
The size and volume of electronic components and electronic equipment assembled by the electronic components are smaller and smaller, the corresponding integration density is greatly increased, and high-heat-flow-density electronic equipment is formed and can reach a very high degree by a faster development trend. Along with the sharp increase of the heat flow density of the electronic equipment, the conventional air cooling heat dissipation mode is difficult to meet the heat dissipation requirement of the electronic equipment, and the liquid cooling has wider application in the field of heat dissipation of the electronic equipment due to higher heat exchange efficiency of the liquid cooling.
The liquid cooling heat dissipation is divided into two modes, one mode is liquid cooling plate heat dissipation, and the principle is that liquid and heating components are utilized to carry out direct contact heat transfer or indirect heat exchange, so that heat is taken away in the flowing or evaporating process, and then the temperature of the heating components is reduced.
The liquid cooling system mainly comprises a cold plate, a circulating pipeline, a pump and an air-liquid heat exchanger.
The other mode is heat dissipation and cooling of a heat exchanger, and the heat exchange principle of the heat exchanger is as follows: the cold fluid is introduced into the internal flow pipeline of the heat exchanger, the hot air is introduced into the external part of the heat exchanger, heat exchange is carried out between the hot air and the internal cold fluid through the heat convection effect of the radiating fins, the hot air is cooled and heated by the cold fluid, and the cooled hot air is conveyed to the equipment or the electronic component needing heat radiation, so that heat transfer and dissipation are realized. In the heat dissipation of the electronic equipment, after the air is cooled by the micro heat exchanger, the air is blown into the electronic equipment or the surface of the electronic component, so that the temperature of the air entering the electronic equipment or the temperature of the electronic component is reduced.
The heat exchange of the micro heat exchange comprises three parts which are respectively: the cooling liquid exchanges heat with the circulation pipeline in a convection mode, the circulation pipeline conducts heat with the external radiating fins, and the radiating fins exchange heat with air in a convection mode. The heat conduction between the circulation pipeline and the external fins is mainly influenced by material characteristics, and the convective heat transfer between the radiating fins and the air is mainly influenced by air flow rate and fin structures. The convective heat transfer between the cooling fluid and the flow-through pipeline is mainly influenced by the pipeline structure and the material properties of the cooling fluid. To enhance the heat convection between the coolant and the flow-through channel, the flow-through channel is generally designed as a microchannel (channel cross-section equivalent diameter is less than 1 mm). In the process of convective heat transfer, a thin layer with violent change of speed and temperature appears near a solid wall surface due to the viscous action of fluid, namely a boundary layer, a laminar bottom layer exists at the bottom of the boundary layer, and heat is conducted in a heat transfer mode of the laminar bottom layer. The structure of the micro-channel can effectively reduce the speed boundary layer, thereby enhancing the convection heat transfer.
At present, the traditional cooling liquid circulation pipelines of the micro heat exchanger are all machined, namely, wire cutting, relieving or CNC, the machining efficiency and yield are low, and the micro heat exchanger is not suitable for large-scale production.
Disclosure of Invention
In order to solve the above problems, the present invention provides an etching microchannel heat exchanger, which has a good heat exchange effect, and is applicable to mass production and capable of improving the processing efficiency and yield by an etching processing method.
In order to solve the technical problems, the technical scheme provided by the invention is as follows: the etched microchannel heat exchanger comprises a frame, wherein a cooling liquid microchannel flow channel is etched in the frame, and a radiating fin is welded on the frame.
Preferably, the material of the cooling liquid microchannel flow channel is aluminum or copper.
Preferably, the radiating fins are made of aluminum.
Preferably, the shape of the heat dissipation fin is zigzag or corrugated.
The invention also comprises a processing mode for etching the microchannel heat exchanger, which comprises the following specific steps:
the method comprises the following steps: firstly, a cooling liquid circulation pipeline is processed in an etching mode;
step two: if the frame is made of aluminum, firstly carrying out nickel plating treatment on the frame; if the copper material is copper, nickel plating is not needed;
step three: carrying out nickel plating treatment on the radiating fins;
step four: welding the radiating fins on the surface of the hollowed-out part of the frame by adopting reflow soldering;
step five: and an axial flow or turbine fan is arranged above or below the radiating fins.
Compared with the prior art, the invention has the advantages that: when the micro heat exchanger is used, the cooling liquid circulation pipeline of the micro heat exchanger is processed in an etching mode, and the pipeline can be etched into a bionic structure pipeline or other pipelines (such as a corrugated pipeline, a sawtooth pipeline and the like) capable of enhancing the heat convection effect according to the theory of hydrodynamics or heat transfer.
The etched micro-channel has smaller cross section size, and the thickness of a fluid boundary layer in the process of convection heat exchange is smaller, so that the convection heat exchange effect of a cooling liquid side can be improved, and the heat exchange performance of a heat exchanger is further improved. On the other hand, the etching mode makes the structure type of microchannel pipeline shaping abundanter, shaping efficiency and yield are higher.
Drawings
Fig. 1 is a front view of the present patent.
Fig. 2 is a right side view of the present patent.
FIG. 3 is a partial view of a microchannel of the present invention.
Fig. 4 is a three-dimensional structural view of the present invention patent.
As shown in the figure: 1. a coolant microchannel flow channel; 2. and (4) radiating fins.
Detailed Description
The present invention will be described in further detail with reference to the accompanying drawings.
With reference to fig. 1 to 4, the etched microchannel heat exchanger includes a frame, a coolant microchannel flow channel 1 is etched in the frame, and a heat dissipation fin 2 is welded on the frame.
The cooling liquid micro-channel flow channel 1 is made of aluminum or copper.
The radiating fins 2 are made of aluminum.
The radiating fins 2 are zigzag or corrugated.
The invention also comprises a processing mode of etching the micro-channel heat exchanger, which comprises the following specific steps:
the method comprises the following steps: firstly, a cooling liquid circulation pipeline is processed in an etching mode;
step two: if the frame is made of aluminum, firstly carrying out nickel plating treatment on the frame; if the copper material is copper, nickel plating is not needed;
step three: carrying out nickel plating treatment on the radiating fins;
step four: welding the radiating fins on the surface of the hollowed-out part of the frame by adopting reflow soldering;
step five: and an axial flow or turbine fan is arranged above or below the radiating fins.
The specific implementation mode of the invention is as follows: when the etching microchannel heat exchanger is used, namely, the fluid channels adopt the etching technology to process the microchannel structure, the microchannels are welded in a diffusion welding mode, and the radiating fins 2 are welded among the microchannels to form the etching microchannel heat exchanger.
The present invention and its embodiments have been described above, and the description is not intended to be limiting, and the drawings are only one embodiment of the present invention, and the actual structure is not limited thereto. In summary, those skilled in the art should appreciate that they can readily use the disclosed conception and specific embodiments as a basis for designing or modifying other structures for carrying out the same purposes of the present invention without departing from the spirit and scope of the invention as defined by the appended claims.
Claims (5)
1. The etched microchannel heat exchanger is characterized by comprising a frame, wherein a cooling liquid microchannel flow channel (1) is etched in the frame, and a radiating fin (2) is welded on the frame.
2. The etched microchannel heat exchanger of claim 1, wherein: the cooling liquid micro-channel flow channel (1) is made of aluminum or copper.
3. The etched microchannel heat exchanger of claim 1, wherein: the radiating fins (2) are made of aluminum.
4. The etched microchannel heat exchanger of claim 1, wherein: the shape of the radiating fin (2) is zigzag or corrugated.
5. The etched microchannel heat exchanger of claim 1, wherein: the processing method comprises the following steps:
the method comprises the following steps: firstly, a cooling liquid circulation pipeline is processed in an etching mode;
step two: if the frame is made of aluminum, firstly carrying out nickel plating treatment on the frame; if the copper material is copper, nickel plating is not needed;
step three: carrying out nickel plating treatment on the radiating fins;
step four: welding the radiating fins on the surface of the hollowed-out part of the frame by adopting reflow soldering;
step five: and an axial flow or turbine fan is arranged above or below the radiating fins.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111471531.5A CN114025592A (en) | 2021-12-06 | 2021-12-06 | Etched microchannel heat exchanger |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111471531.5A CN114025592A (en) | 2021-12-06 | 2021-12-06 | Etched microchannel heat exchanger |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN114025592A true CN114025592A (en) | 2022-02-08 |
Family
ID=80067758
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202111471531.5A Pending CN114025592A (en) | 2021-12-06 | 2021-12-06 | Etched microchannel heat exchanger |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN114025592A (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2009109112A1 (en) * | 2008-03-03 | 2009-09-11 | Sun Haichao | A parallel-flow heat exchanger for an air-conditioner |
| CN103997880A (en) * | 2014-05-26 | 2014-08-20 | 江苏大学 | Micro-channel heat sink and micro-electromechanical product cooling system device composed of same |
| CN104006698A (en) * | 2014-05-06 | 2014-08-27 | 北京理工大学 | Heat transfer element with double-arc inclined broken fins and tube free of thermal contact resistance |
| CN113606967A (en) * | 2021-06-27 | 2021-11-05 | 江阴市富仁高科股份有限公司 | High-pressure micro-channel heat exchanger and manufacturing method thereof |
| CN214666272U (en) * | 2020-08-26 | 2021-11-09 | 广东美的暖通设备有限公司 | Heat exchanger, electric control box and air conditioning system |
-
2021
- 2021-12-06 CN CN202111471531.5A patent/CN114025592A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2009109112A1 (en) * | 2008-03-03 | 2009-09-11 | Sun Haichao | A parallel-flow heat exchanger for an air-conditioner |
| CN104006698A (en) * | 2014-05-06 | 2014-08-27 | 北京理工大学 | Heat transfer element with double-arc inclined broken fins and tube free of thermal contact resistance |
| CN103997880A (en) * | 2014-05-26 | 2014-08-20 | 江苏大学 | Micro-channel heat sink and micro-electromechanical product cooling system device composed of same |
| CN214666272U (en) * | 2020-08-26 | 2021-11-09 | 广东美的暖通设备有限公司 | Heat exchanger, electric control box and air conditioning system |
| CN113606967A (en) * | 2021-06-27 | 2021-11-05 | 江阴市富仁高科股份有限公司 | High-pressure micro-channel heat exchanger and manufacturing method thereof |
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| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| TA01 | Transfer of patent application right |
Effective date of registration: 20240308 Address after: No. 258, Dongping Road, Bacheng Town, Kunshan City, Suzhou City, Jiangsu Province, 215311 Applicant after: KUNSHAN PING TAI ELECTRONIC CO.,LTD. Country or region after: China Address before: No.399, Minghu Road, Jintan District, Changzhou City, Jiangsu Province 213000 Applicant before: Changzhou pinrui Electronic Technology Co.,Ltd. Country or region before: China |
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| TA01 | Transfer of patent application right |