CN114023782A - Display panel, manufacturing method of display panel and mobile terminal - Google Patents
Display panel, manufacturing method of display panel and mobile terminal Download PDFInfo
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- CN114023782A CN114023782A CN202111213188.4A CN202111213188A CN114023782A CN 114023782 A CN114023782 A CN 114023782A CN 202111213188 A CN202111213188 A CN 202111213188A CN 114023782 A CN114023782 A CN 114023782A
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- PQQKPALAQIIWST-UHFFFAOYSA-N oxomolybdenum Chemical compound [Mo]=O PQQKPALAQIIWST-UHFFFAOYSA-N 0.000 claims abstract description 11
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/005—Processes
- H01L33/0093—Wafer bonding; Removal of the growth substrate
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/15—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission
- H01L27/153—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars
- H01L27/156—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars two-dimensional arrays
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/54—Encapsulations having a particular shape
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
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- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
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Abstract
The invention relates to a display panel, a manufacturing method of the display panel and a mobile terminal, wherein the display panel forms a first light shielding layer on the surface of a metal cushion layer, the first light shielding layer is formed by adopting black molybdenum oxide with low reflectivity, a first through hole exposing the metal cushion layer is formed on the first light shielding layer, an LED chip is transferred to the metal cushion layer exposed to the first through hole, and the light leakage problem caused by the light reflection of the metal cushion layer can be effectively improved by combining the design of a second light shielding layer and a packaging layer.
Description
Technical Field
The invention relates to the technical field of display, in particular to a display panel, a manufacturing method of the display panel and a mobile terminal.
Background
One of the hot spots of MLED (Micro-LED and Mini-LED) developing into future display technology has the advantages of fast response, high color gamut, high PPI (pixel density), low energy consumption, etc. compared with the current LCD display and OLED display devices; however, the technical difficulties are many and the technology is complex, especially the key technology of the technology is huge transfer technology and the miniaturization of LED particles is a technical bottleneck, the Mini-LED as a product of the combination of the Micro-LED and the backboard has the characteristics of high contrast, high color rendering performance and the like which are comparable to that of an OLED, the manufacturing cost of the Mini-LED display is slightly higher than that of an LCD display and is only about six of the manufacturing cost of the OLED display, and the manufacturing method is easier to implement compared with the Micro-LED and the OLED, so the Mini-LED becomes a hotspot layout of manufacturers of various large panels.
For the Mini-LED direct display, the requirement on contrast is high because the Mini-LED direct display is a direct light-emitting product, in order to improve the contrast, a black oil layer formed by manufacturing black oil is generally adopted to match with a packaging transparent adhesive to reduce light leakage so as to improve the contrast, but because the process precision and a gap exist between an LED chip and the black oil, a part of metal cushion layer can be exposed in the gap, and the metal cushion layer emits light to the LED chip to form light reflection so as to cause the gap light leakage and influence the contrast.
Disclosure of Invention
The invention aims to provide a display panel, a manufacturing method of the display panel and a mobile terminal, so as to solve the problem of contrast reduction caused by light leakage of the conventional display.
Specifically, the technical scheme adopted by the invention is as follows:
a display panel, comprising: a substrate; at least one metal pad layer disposed on the substrate; the first light shielding layer is arranged on the metal cushion layer, at least one first through hole is formed in the first light shielding layer, at least part of the surface of the metal cushion layer is exposed through the first through hole, and the first through holes are arranged in an array; the protective layer covers the first shading layer, a second through hole corresponding to the first through hole is formed in the protective layer, and at least the first through hole is exposed by the second through hole; the second light shielding layer covers the protective layer, and a third through hole exposing the second through hole is formed in the second light shielding layer; at least one LED chip disposed on the metal pad layer exposed to the first via hole; and the packaging layer covers the second shading layer and the LED chip.
Optionally, a third light shielding layer is disposed on a surface of the substrate away from the metal pad layer, and the third light shielding layer covers the first via hole, the second via hole, and the third via hole.
Optionally, the third light shielding layer is a heat conducting graphite sheet.
Optionally, the second via hole exposes the first via hole and at least a part of the first light shielding layer located outside the first via hole.
Optionally, the first light shielding layer is a molybdenum oxide layer.
Optionally, the color of the first light shielding layer is black.
Optionally, the metal pad layer is formed with at least one through hole exposing at least a portion of the substrate, and the protective layer is deposited to the substrate through the through hole.
Optionally, an insulating layer is disposed between the substrate and the metal pad layer, the through hole exposes at least a portion of the insulating layer, and the protective layer is deposited on the insulating layer through the through hole.
In order to achieve the above object, the present invention also provides a mobile terminal including a terminal body and the display panel as described above.
In order to achieve the above object, the present invention further provides a method for manufacturing a display panel, including:
providing a substrate;
forming an insulating layer on a substrate;
forming a metal pad layer on the insulating layer;
forming a first light-shielding layer on the metal pad layer;
forming a through hole penetrating through the first light-shielding layer and the metal pad layer and exposing at least part of the insulating layer on the first light-shielding layer;
forming a first via hole exposing at least a part of the metal pad layer on the first light-shielding layer;
forming a protective layer on the first shading layer, wherein the protective layer is deposited on the surface of the insulating layer through the through hole;
forming a second via hole on the protective layer, wherein the second via hole exposes the first via hole and at least part of the first shading layer positioned outside the first via hole;
forming a second light shielding layer on the protective layer;
forming a third via hole exposing the second via hole on the second light shielding layer;
transferring the LED chip to the metal cushion layer exposed to the first via hole;
forming a packaging layer on the second shading layer, wherein the packaging layer covers the second shading layer and the LED chip;
and forming a third light shielding layer on one surface of the substrate far away from the metal cushion layer, wherein the third light shielding layer covers the first via hole, the second via hole and the third via hole.
The display panel, the manufacturing method of the display panel and the mobile terminal have the advantages that the display panel, the manufacturing method of the display panel and the mobile terminal are provided, the first light shielding layer is formed on the surface of the metal cushion layer and is made of black molybdenum oxide with low reflectivity, the first through hole exposing the metal cushion layer is formed in the first light shielding layer, the LED chip is transferred to the metal cushion layer exposed to the first through hole, the light leakage problem caused by light reflection of the metal cushion layer can be effectively solved by combining the design of the second light shielding layer and the packaging layer, in addition, the third light shielding layer is arranged on the surface, far away from the metal cushion layer, of the substrate, the light leakage phenomenon caused by poor process precision around the LED chip is conveniently provided, and therefore the contrast of the display panel is improved.
Drawings
The technical solution and other advantages of the present invention will become apparent from the following detailed description of specific embodiments of the present invention, which is to be read in connection with the accompanying drawings.
Fig. 1 is a schematic structural diagram of a display panel according to an exemplary embodiment of the present invention;
fig. 2 is a schematic diagram of a matching structure of an LED chip, a first light-shielding layer and a metal pad layer in a display panel according to an exemplary embodiment of the invention;
FIG. 3 is a flowchart illustrating a method for fabricating a display panel according to an exemplary embodiment of the present invention;
fig. 4 is a schematic structural diagram of an insulating layer, a metal pad layer and a first light-shielding layer formed on a substrate in a method for manufacturing a display panel according to an exemplary embodiment of the present invention;
fig. 5 is a schematic structural diagram illustrating a method for manufacturing a display panel according to an exemplary embodiment of the present invention, in which a through hole is formed in a metal pad layer and a first via hole is formed in a first light-shielding layer;
fig. 6 is a schematic structural diagram illustrating formation of a protective layer and a second light-shielding layer and formation of a second via hole and a third via hole in a method for manufacturing a display panel according to an exemplary embodiment of the present invention;
fig. 7 is a schematic structural diagram illustrating transferring of an LED chip and forming of an encapsulation layer in a method for manufacturing a display panel according to an exemplary embodiment of the invention;
fig. 8 is a schematic structural diagram illustrating a third light-shielding layer formed in a method for manufacturing a display panel according to an exemplary embodiment of the invention;
FIG. 9 is a schematic structural diagram of a display panel without a first light-shielding layer and a second light-shielding layer;
FIG. 9a is a top view of FIG. 9;
FIG. 10 is a schematic structural diagram of a display panel with a second light-shielding layer but without a first light-shielding layer;
FIG. 10a is a top view of FIG. 10;
FIG. 11 is a schematic structural diagram of a display panel with a first light-shielding layer formed thereon;
FIG. 11a is a top view of FIG. 11;
FIG. 12 is a schematic structural diagram of a display panel with a third light-shielding layer;
fig. 12a is a top view of fig. 12.
The parts in the figure are numbered as follows:
100. display panel, 110, base plate, 120, insulating layer, 130, metal cushion layer, 140, first shading layer, 141, first via hole, 142, through-hole, 150, protective layer, 151, second via hole, 160, second shading layer, 161, third via hole, 170, LED chip, 171, first electrode, 172, second electrode, 180, packaging layer, 190, third shading layer.
Detailed Description
The technical solution in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. It is to be understood that the described embodiments are merely exemplary of the invention, and not restrictive of the full scope of the invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
According to the display panel, the manufacturing method of the display panel and the mobile terminal, the first light shielding layer is formed on the surface of the metal cushion layer, the first light shielding layer is formed by adopting black molybdenum oxide with low reflectivity, the first through hole exposing the metal cushion layer is formed on the first light shielding layer, the LED chip is transferred to the metal cushion layer exposed to the first through hole, and the light leakage problem caused by light reflection of the metal cushion layer can be effectively improved by combining the design of the second light shielding layer and the packaging layer. As a typical application, the display panel may be applied to a mobile terminal including a terminal body and the display panel, for example, a Mini-LED direct display.
In an embodiment of the present invention, referring to fig. 1 and 2, the display panel 100 includes a substrate 110, an insulating layer 120, a metal pad layer 130, a first light shielding layer 140, a protective layer 150, a second light shielding layer 160, an LED chip 170, and an encapsulation layer 180. The insulating layer 120 is disposed on the upper surface of the substrate 110, the metal pad layer 130 is disposed on the upper surface of the insulating layer 120, a through hole 142 penetrating through the first light shielding layer 140 and the metal pad layer 130 and exposing at least a part of the surface of the insulating layer 120 is formed on the surface of the first light shielding layer 140, the first light shielding layer 140 is disposed on the upper surface of the metal pad layer 130, a first via hole 141 exposing at least a part of the surface of the metal pad layer 130 is formed on the first light shielding layer 140, the protective layer 150 covers the first light shielding layer 140 and is deposited on the surface of the insulating layer 120 through the through hole 142, a second via hole 151 exposing the first via hole 141 is formed on the protective layer 150, the second light shielding layer 160 covers the protective layer 150, a third via hole 161 exposing the second via hole 151 is formed on the second light shielding layer 160, the LED chip 170 is connected to the metal pad layer 130 exposed to the first via hole 141, and the encapsulation layer 180 covers the second light shielding layer 160 and the LED chip 170.
In this embodiment, the substrate 110 is a glass substrate, the metal pad layers 130 are copper pad layers (Cu pads), the number of the metal pad layers 130 is plural, a through hole 142 is formed between two adjacent metal pad layers 130, the second light-shielding layer 160 is a black ink layer or a black matrix layer, and the encapsulation layer 180 is a transparent adhesive layer. The first light-shielding layer 140 is a molybdenum oxide (MoOx) layer with a black color, wherein the molybdenum oxide is a compound of molybdenum and oxygen and is MoO3Or MoO2MoO is preferred in this embodiment3The molybdenum oxide is used as the first light-shielding layer 140, so that the first light-shielding layer 140 has a conductive effect, i.e., the first light-shielding layer 140 can be used as a conductive layer.
Referring to fig. 2, in the LED chip 170 of the present embodiment, the first electrode 171 and the second electrode 172 are respectively inserted into the first via hole 141 and connected to the metal pad 130, the outer sidewall of the first electrode 171 and the outer sidewall of the second electrode 172 are respectively connected to the adjacent first light shielding layer 140 to form an electrical connection, so that the first light shielding layer 140 covers and shields the surface of the metal pad 130 exposed to the gap between the outer sidewall of the first electrode 171 and the inner wall of the second via hole 151 of the protection layer 150, and the first light shielding layer 140 covers and shields the surface of the metal pad 130 exposed to the gap between the outer sidewall of the second electrode 172 and the inner wall of the second via hole 151 of the protection layer 150, usually due to the existence of poor process precision, a gap is left between the outer sidewall of the first electrode 171 and/or the second electrode 172 of the LED chip 170 and the inner wall of the second via hole 151 of the protection layer 150, the existence of this clearance can expose partial metal bed course 130, and then leads to when LED chip 170 is luminous, the metal bed course 130 that exposes in the clearance can form the reflection to the light that the LED chip sent and lead to the light leak, influences display panel 100's contrast, and in this embodiment, because first light shield layer 140 covers, shields the metal bed course 130 that exposes in clearance department for metal bed course 130 can't reflect the light that LED chip 170 sent, avoids the light leak, promotes display panel 100's contrast.
Meanwhile, molybdenum oxide is selected as the first light shielding layer 140, and the reflectivity of the molybdenum oxide to light is only about 2% and is far less than about 40% of that of metal molybdenum, so that the contrast of the display panel 100 can be effectively improved.
In this embodiment, referring to fig. 1, the cross-sectional shape of the second via 151 is an inverted trapezoid shape, that is, the cross-sectional area of the end of the second via 151 close to the first light shielding layer 140 is smaller than the cross-sectional area of the end of the second via 151 far from the first light shielding layer 140, and the cross-sectional area of the end of the second via 151 close to the first light shielding layer 140 is larger than the cross-sectional area of the first via 141, that is, the second via 151 exposes at least a part of the surface of the first light shielding layer 140 outside the first via 141 in addition to the first via 141, so that the design leaves enough space and room for the subsequent transfer of the LED chip 170. Accordingly, the shape of the third via 161 formed on the second light shielding layer 160 corresponds to the shape of the second via 151, and the third via 161 forms an extension of the second via 151.
As an improvement, referring to fig. 1, a third light shielding layer 190 is disposed on a surface of the substrate 110 away from the metal pad layer 130, the third light shielding layer 190 corresponds to the first via hole 141, and the third light shielding layer 190 covers the first via hole 141, the second via hole 151, and the third via hole 161, that is, a cross-sectional area of the third light shielding layer 190 > a cross-sectional area of the third via hole 161 > a cross-sectional area of the second via hole 151 > a cross-sectional area of the first via hole 141. In this embodiment, the third light-shielding layer 190 is a heat-conducting graphite sheet, which is a novel heat-dissipating black material, having unique crystal grain orientation, and diffusing heat dissipation along the horizontal direction, the lamellar structure can adapt to any surface well, and quickly dissipate heat to achieve the purpose of uniform heat dissipation, shielding the electrical conductivity between the heat source and the substrate 110, and improving the performance of the display panel 100, and the plane of the heat-conducting graphite sheet has ultrahigh heat-conducting performance within the range of 1700W/m-k, and the heat-conducting coefficient of the heat-conducting graphite sheet is 3-5 times that of copper (380W/m-k) and 9-11 times that of aluminum (160W/m-k). In this embodiment, the heat conductive graphite sheet is adopted as the third light shielding layer 190, and the third light shielding layer 190 covers and shields the first via hole 141, the second via hole 151, and the third via hole 161, so as to further prevent the light leakage phenomenon caused by the poor process precision, for example, the light leakage caused by the gap between the first electrode 171 and/or the second electrode 172 of the LED chip 170 and the first light shielding layer 140 caused by the poor process precision is avoided by the design of the third light shielding layer 190, and the contrast of the display panel 100 is improved.
Referring to fig. 3 to 8, the present embodiment further provides a manufacturing method of the display panel 100, including:
s1, providing a substrate;
s2, forming an insulating layer on the substrate;
s3, forming a metal pad layer on the insulating layer;
s4, forming a first light-shielding layer on the metal pad layer;
s5, forming a through hole which penetrates through the first light-shielding layer and the metal pad layer and exposes at least part of the insulating layer on the first light-shielding layer;
s6, forming a first via hole exposing at least part of the metal pad layer on the first light shielding layer;
s7, forming a protection layer 150 on the first light-shielding layer 140, and depositing the protection layer 150 on the surface of the insulation layer 120 through the via 142;
s8, forming a second via hole 151 on the protection layer 150, wherein the second via hole 151 exposes the first via hole 141 and at least a portion of the first light shielding layer 140 located outside the first via hole 141;
s9, forming a second light-shielding layer 160 on the protective layer 150;
s10, forming a third via 161 on the second light shielding layer 160 to expose the second via 151;
s11, transferring the LED chip 170 onto the metal pad layer 130 exposed to the first via 141;
s12, forming an encapsulation layer 180 on the second light-shielding layer 160, the encapsulation layer 180 covering the second light-shielding layer 160 and the LED chip 170;
s13, forming a third light-shielding layer 190 on a surface of the substrate 110 away from the metal pad layer 130, where the third light-shielding layer covers the first via 141, the second via 151, and the third via 161.
Referring to fig. 4, the substrate 110, the insulating layer 120, and the metal pad layer 130 are formed by a cyclic process of cleaning, film forming, coating, exposing, developing, etching, and stripping through a TFT panel manufacturing process. The forming process of the first light shielding layer 140 is as follows: a metal molybdenum layer is formed on the surface of the metal pad layer 130 (in this embodiment, a copper pad layer, Cu pad), and then oxygen plasma (O) is used2Plasma) bombards the metal molybdenum layer to form a molybdenum oxide (MoOx) layer, and the thickness of the first light-shielding layer 140 is 50-500 angstroms. Referring to fig. 5, a first via hole 141 is formed on the first light shielding layer 140 by dry etching to expose at least a portion of the metal pad layer 130, and a via hole 142 penetrating the first light shielding layer 140 and the metal pad layer 130 and exposing at least a portion of the insulating layer 120 is formed by etching using a half-tone mask (Halftone) process. In the Halftone process, a photomask (Mask) with 30-60% of Tr (light transmittance) is adopted, a through hole 142 is formed by wet etching, and then a first via hole 141 is formed by dry etching. The second light shielding layer 160 is formed by exposure and development process or screen printing process, and has a thickness of 0.5-50 μm and an OD greater than 1. The optical density represents the transmittance of light passing through the second light-shielding layer 160 (black ink or black matrix). The third light shielding layer 190 is made of black heat conducting graphite flakes, an evaporation process is adopted to form a film, the thickness of the film is 0.1-10 microns, and after the third light shielding layer 190 is formed, a graphite flake pattern can be manufactured in a dry etching or wet etching mode.
Referring to fig. 9 to 12, the light shielding structure of the display panel 100 according to the present embodiment is designed according to the following principle:
referring to fig. 9 and 9a, which are schematic structural diagrams of the display panel 100 without forming a first light shielding layer and a second light shielding layer, three LED chips in a group of LED chips are arranged in a delta shape, colors of the three LED chips 170 in the group are different, for example, a color of one LED chip 170 is blue (B), a color of one LED chip 170 is blue (G), and a color of the LED chip 170 is blue (R), the metal pad layer 130 is exposed to the second via hole 151 of the protection layer 150, and the exposed metal pad layer 130 reflects light emitted by the LED chip 170 to cause light mixing and light leakage, which affects contrast of the display panel 100.
Referring to fig. 10 and 10a, which are schematic structural diagrams of a display panel in which a second light shielding layer is formed but a first light shielding layer is not formed, a metal pad layer 130 is exposed to a second via 151 of a protective layer 150 and a third via 161 of the second light shielding layer 160, although the second light shielding layer 160 is covered on the protective layer 150, the exposed metal pad layer 130 still reflects light emitted by an LED chip 170 to cause light mixing and light leakage, and even if an encapsulation layer 180 is used to encapsulate the second via 151 and the third via 161, in order to ensure that the LED chip 170 emits light, grinding is required to expose the LED chip 170, but the grinding may damage the LED chip 170, thereby reducing the reliability of the LED chip.
Referring to fig. 11 and 11a, which are schematic structural diagrams of the display panel 100 forming the first light shielding layer, the first light shielding layer 140 is formed on the metal pad layer 130 to cover and shield the metal pad layer 130 exposed to the second via 151 and the third via 161, so as to eliminate reflection of the exposed metal pad layer 130 on light emitted from the LED chip 170 as much as possible, but due to poor process accuracy, there may be a gap between the LED chip 170 and the first light shielding layer 140 and thus there is a risk of exposing the metal pad layer 130.
Referring to fig. 12 and 12a, the structural schematic diagram of the display panel 100 is that the third light shielding layer 190 is formed on the surface of the substrate 110 away from the metal pad layer 130, by forming the third light shielding layer 190, complete blackening around the LED chip 170 is achieved, a gap that may exist between the LED chip 170 and the first light shielding layer 140 is made up, and the third light shielding layer 190 adopts a heat conductive graphite sheet to have a heat dissipation function, so that the problem that the gap between the LED chip 170 and the first light shielding layer 140 affects the optical effect due to the process precision tolerance is avoided, the problem that the reliability of the LED chip 170 is affected due to the damage of the LED chip 170 caused by the grinding process is avoided, and the display contrast of the display panel 100 and the mobile terminal including the display panel 100 is effectively improved.
The foregoing is only a preferred embodiment of the present invention, and it should be noted that, for those skilled in the art, various modifications and decorations can be made without departing from the principle of the present invention, and these modifications and decorations should also be regarded as the protection scope of the present invention.
Claims (10)
1. A display panel, comprising:
a substrate;
at least one metal pad layer disposed on the substrate;
the first light shielding layer is arranged on the metal cushion layer, at least one first through hole is formed in the first light shielding layer, at least part of the surface of the metal cushion layer is exposed through the first through hole, and the first through holes are arranged in an array;
the protective layer covers the first shading layer, a second through hole corresponding to the first through hole is formed in the protective layer, and at least the first through hole is exposed by the second through hole;
the second light shielding layer covers the protective layer, and a third through hole exposing the second through hole is formed in the second light shielding layer;
at least one LED chip disposed on the metal pad layer exposed to the first via hole; and
and the packaging layer covers the second shading layer and the LED chip.
2. The display panel according to claim 1, wherein a third light-shielding layer is disposed on a surface of the substrate away from the metal pad layer, and the third light-shielding layer covers the first via hole, the second via hole, and the third via hole.
3. The display panel of claim 2, wherein the third light shielding layer is a thermally conductive graphite sheet.
4. The display panel of claim 2, wherein the second via exposes the first via and at least a portion of the first light shielding layer outside the first via.
5. The display panel according to claim 4, wherein the first light-shielding layer is a molybdenum oxide layer.
6. The display panel according to claim 5, wherein the color of the first light-shielding layer is black.
7. The display panel of claim 1, wherein the metal pad layer is formed with at least one via exposing at least a portion of the substrate, the protective layer being deposited to the substrate through the via.
8. The display panel of claim 7, wherein an insulating layer is disposed between the substrate and the metal pad layer, wherein the via exposes at least a portion of the insulating layer, and wherein the protective layer is deposited to the insulating layer through the via.
9. A mobile terminal characterized in that it comprises a terminal body and a display panel according to any one of claims 1 to 8.
10. A method for manufacturing a display panel is characterized by comprising the following steps:
providing a substrate;
forming an insulating layer on a substrate;
forming a metal pad layer on the insulating layer;
forming a first light-shielding layer on the metal pad layer;
forming a through hole penetrating through the first light-shielding layer and the metal pad layer and exposing at least part of the insulating layer on the first light-shielding layer;
forming a first via hole exposing at least a part of the metal pad layer on the first light-shielding layer;
forming a protective layer on the first shading layer, wherein the protective layer is deposited on the surface of the insulating layer through the through hole;
forming a second via hole on the protective layer, wherein the second via hole exposes the first via hole and at least part of the first shading layer positioned outside the first via hole;
forming a second light shielding layer on the protective layer;
forming a third via hole exposing the second via hole on the second light shielding layer;
transferring the LED chip to the metal cushion layer exposed to the first via hole;
forming a packaging layer on the second shading layer, wherein the packaging layer covers the second shading layer and the LED chip;
and forming a third light shielding layer on one surface of the substrate far away from the metal cushion layer, wherein the third light shielding layer covers the first via hole, the second via hole and the third via hole.
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