CN114843302A - Display panel, preparation method thereof and display device - Google Patents

Abstract

The application discloses a display panel, a preparation method thereof and a display device, wherein the display panel comprises a display area and a non-display area arranged around the display area, wherein the display area is provided with an insulating heat conduction layer, and the surface and the side surface of the non-display area are provided with metal heat dissipation layers; the insulating heat conduction layer is in contact with the metal heat dissipation layer. The insulating heat conduction layer is arranged around the LEDs in the display area and is in contact with the peripheral metal heat dissipation layer, so that heat generated by the LEDs is conducted to the peripheral metal heat dissipation layer, the whole surface of the display panel is uniformly dissipated, and hot spots are avoided; the metal radiating layer covers around the side face of the display panel, so that the radiating area of the device is increased, and the radiating effect is improved by utilizing the large metal area of the side face and simultaneously performing quick heat exchange with air; the problems of reduced lighting effect, color cast and the like of the LED are avoided.

Description

Display panel, preparation method thereof and display device

Technical Field

The application relates to the technical field of display, in particular to a display panel, a preparation method thereof and a display device.

Background

In recent years, the micro led display technology has been gradually developed, and compared with the OLED and LCD technologies, the micro led display technology has significantly improved performance, has a series of advantages of high contrast, high brightness, high color gamut, fast response speed, thinness, long service life, low power consumption, and the like, and is a new generation of display technology equipment.

However, the external quantum efficiency of the current Micro LED is generally 20% -30%, the luminous efficiency is not high, and the rest 70% -80% is converted into heat. Due to the fact that the size of the Micro LED device is very small, generated heat is difficult to dissipate, and junction temperature of the Micro LED is increased. The Micro LED light efficiency is reduced as a result of the increase of the junction temperature, color cast is generated, more energy is converted into heat, and the degradation of the Micro LED is aggravated.

Disclosure of Invention

In view of the foregoing defects or shortcomings in the prior art, it is desirable to provide a display panel, a manufacturing method thereof, and a display device, which can improve the heat dissipation capability of the display panel and improve the display effect.

In a first aspect, the present application provides a display panel, including a display area and a non-display area surrounding the display area, wherein the display area is provided with an insulating and heat conducting layer, and the surface and the side surfaces of the non-display area are provided with metal heat dissipation layers; the insulating heat conduction layer is in contact with the metal heat dissipation layer.

Optionally, the heat sink comprises a substrate and a base plate which are stacked, the insulating and heat conducting layer is arranged on the upper surface of the base plate, and the metal heat dissipation layer extends from the upper surface of the base plate to the lower surface of the substrate through the side surface.

Optionally, the metal heat dissipation layer is integrally formed on one side of the display panel.

Optionally, the material of the insulating and heat conducting layer comprises one or more of aluminum nitride, silicon carbide, beryllium oxide and boron nitride.

Optionally, the substrate comprises a first edge proximate to the upper surface, the first edge being provided with a chamfer.

Optionally, the substrate includes a second edge proximate to the lower surface, the second edge processed using an edging process.

In a second aspect, the present application provides a method for manufacturing a display panel, which is used for manufacturing the display panel as described in any one of the above, including:

forming a substrate on a substrate;

forming a heat conduction insulating film layer on the display area of the substrate, and patterning to form an insulating heat conduction layer;

and forming a metal heat dissipation layer on the substrate and the non-display area of the substrate.

Optionally, forming an insulating and heat conducting layer on the substrate and patterning to form a pixel region includes:

forming a first protective layer on the substrate, wherein the first protective layer corresponds to the pixel area and the non-display area;

and forming a heat conduction insulating film layer on the substrate, and removing the first protective layer to form the insulating heat conduction layer.

Optionally, forming a metal heat dissipation layer on the substrate and the non-display area of the substrate includes:

forming a second protective layer on the substrate and the substrate, wherein the second protective layer corresponds to the display area;

and forming metal heat dissipation film layers on the surfaces and the side surfaces of the substrate and the substrate in a three-dimensional sputtering mode, and removing the second protection layer to form the metal heat dissipation layer.

In a third aspect, the present application provides a display device comprising a display panel as described in any of the above.

The technical scheme provided by the embodiment of the application can have the following beneficial effects:

according to the display panel provided by the embodiment of the application, the insulating heat conduction layer is arranged around the LEDs in the display area and is in contact with the peripheral metal heat dissipation layer, so that heat generated by the LEDs is conducted to the peripheral metal heat dissipation layer, the whole surface of the display panel is uniformly dissipated, and hot spots are avoided; the metal radiating layer covers around the side face of the display panel, so that the radiating area of the device is increased, and the radiating effect is improved by utilizing the large metal area of the side face and simultaneously performing quick heat exchange with air; the problems of reduced lighting effect, color cast and the like of the LED are avoided.

Drawings

Other features, objects and advantages of the present application will become more apparent upon reading of the following detailed description of non-limiting embodiments thereof, made with reference to the accompanying drawings in which:

fig. 1 is a schematic structural diagram of a display panel according to an embodiment of the present disclosure;

FIG. 2 is a schematic cross-sectional view taken at A-A of FIG. 1;

fig. 3 is a flowchart of a method for manufacturing a display panel according to an embodiment of the present disclosure;

fig. 4 is a schematic structural diagram of a first protection layer according to an embodiment of the present disclosure;

fig. 5 is a schematic structural diagram of a second passivation layer according to an embodiment of the present disclosure.

Detailed Description

The present application will be described in further detail with reference to the following drawings and examples. It is to be understood that the specific embodiments described herein are merely illustrative of the relevant invention and not restrictive of the invention. It should be noted that, for convenience of description, only the portions related to the present invention are shown in the drawings.

It should be noted that the embodiments and features of the embodiments in the present application may be combined with each other without conflict. The present application will be described in detail below with reference to the embodiments with reference to the attached drawings.

Referring to fig. 1-2 in detail, the present application provides a display panel, including a display area 1 and a non-display area 2 disposed around the display area 1, wherein an insulating and heat conducting layer 5 is disposed on the display area 1, and a metal heat dissipation layer 6 is disposed on a surface and a side surface of the non-display area 2; the insulating heat conduction layer 5 is in contact with the metal heat dissipation layer 6.

The display panel comprises a substrate 3 and a base plate 4 which are arranged in a stacked mode, the insulating heat conduction layer 5 is arranged on the upper surface 7 of the base plate 4, the metal heat dissipation layer 6 extends from the upper surface 7 of the base plate 4 to the lower surface 9 of the substrate 3 through the side face, and the metal heat dissipation layer 6 is approximately in a shape like a letter J and covers the edge of the display panel. In the embodiment of the present application, the metal heat dissipation layer 6 is integrally formed on one side of the display panel.

Optionally, the material of the insulating and heat conducting layer 5 comprises one or more of aluminum nitride, silicon carbide, beryllium oxide and boron nitride, and other suitable insulating and heat conducting materials can be selected for the insulating and heat conducting layer 5, and the thermal conductivity is preferably greater than 50W/m-K. The metal heat dissipation layer 6 may be a metal such as silver, copper, nickel, or carbon, but the present application is not limited thereto, and other metal materials with good heat conductivity may be selected for the metal heat dissipation layer 6.

In the present embodiment, the substrate 4 comprises a first edge 8 adjacent to the upper surface 7, the first edge 8 being provided with a chamfer. The size and the shape of the chamfer are not limited in the embodiment of the application, in different embodiments, the covering area of the metal heat dissipation layer 6 on the side face can be prolonged in a mode of increasing the size of the chamfer so as to improve the heat dissipation effect, and in different embodiments, the adjustment is carried out according to the heat dissipation requirement or the application scene and the like.

The substrate 3 comprises a second edge 10 close to the lower surface 9, said second edge 10 being treated with an edging process. By chamfering the base plate 4 and edging the substrate 3, stress concentration of the metal heat dissipation layer 6 at the position can be reduced, metal fracture is avoided, the adhesive force of the metal heat dissipation layer 6 can be improved, the metal heat dissipation layer 6 is prevented from being separated from the adhesive surface, and the heat dissipation capacity of the metal heat dissipation layer 6 can be improved.

A plurality of pixels arranged in an array are disposed in the display region 1, and each pixel includes a plurality of light emitting elements 11 of different colors. In the present embodiment, the light emitting element 11 may be a light emitting diode, for example, the light emitting element 11 may be a small light emitting diode or a Micro light emitting diode (Micro LED). The light emitting element 11 is exemplified as a Micro LED, but the present application is not limited thereto, and different light emitting elements 11 may be adopted in the present application depending on the device and the application scenario.

In the embodiment of the present application, each pixel includes red RLED, green GLED, and blue BLED, but the present invention is not limited thereto. The colors of the LEDs may also be described as a first color, a second color, and a third color, which may also be cyan, magenta, and yellow. In addition, the pixel may include a white LED.

In the embodiment of the present application, the arrangement of the LEDs in each pixel unit is not limited, and the arrangement of the LEDs may be a stripe arrangement, an island arrangement, a mosaic arrangement, or a delta arrangement.

In the embodiment of the present application, the insulating and heat conducting layer 5 is in contact with the LED, and the insulating and heat conducting layer 5 is used for uniformly conducting heat generated by the LED, which is not limited in the present application. In different embodiments, different settings may be performed according to different devices or application scenarios. In addition, in the embodiment of the present application, the insulating and heat conducting layer 5 and the metal heat dissipation layer 6 may be in contact with each other at a side surface perpendicular to the substrate 3, and may also be connected in a partially covering manner to improve the contact effect.

It should be noted that in the embodiment of the present application, the insulating heat conducting layer 5 may extend from the display area 1 to the non-display area 2 to achieve contact or connection between the insulating heat conducting layer 5 and the metal heat dissipation layer 6, and certainly, when the display effect is not affected, the insulating heat conducting layer 5 may also extend from the non-display area 2 to the display area 1 through the metal heat dissipation layer 6 to achieve contact or connection between the insulating heat conducting layer 5 and the metal heat dissipation layer 6. In the connection position, the insulating and heat conducting layer 5 can be positioned on the upper layer or the lower layer of the metal heat dissipation layer 6.

In this embodiment, the substrate 4 is a TFT array substrate 4, and the TFT substrate 4 may specifically include: an active layer 41, a gate insulating layer 42, a gate layer 43, an interlayer dielectric layer 44, a source/drain electrode layer 45, a first planarization layer 46, a passivation layer 47, and a second planarization layer 48 are sequentially formed on the substrate 3. As described above, the TFT substrate 4 is of a top gate type, but the TFT substrate 4 in this embodiment may also be of a bottom gate type, and the present embodiment is not limited thereto.

In the embodiment of the present application, the light emitting element 11Micro LED includes an LED chip and two pins (a positive electrode 21 and a negative electrode 31), wherein the positive electrode 21 of the Micro LED is connected to the second electrode of the transistor, and the negative electrode 31 of the Micro LED is connected to the power line VSS 61.

In this embodiment, the display panel further includes a connection electrode layer disposed on the upper surface 7 of the substrate 4, wherein, for example, the connection electrode layer is used to form the first connection electrode 71 and the second connection electrode 81. The first connection electrode 71 transmits a first signal from the drain 51 of the thin film transistor to the positive electrode 21 of the light emitting element 11, the second connection electrode 81 transmits a second signal from the power supply line VSS61 to the negative electrode 31 of the light emitting element 11, the light emitting element 11 operates by the first signal and the second signal, and the operation of the light emitting element 11, such as whether or not light is emitted and the intensity of the emitted light, is controlled by the first signal and the second signal. For example, the first signal is a high voltage signal and the second signal is a low voltage signal.

It will be appreciated that the metal heat sink layer 6 is arranged around the sides of the display panel without the fan-out area 91. In this embodiment, the display panel is quadrilateral, wherein one side edge of the fan-out region 91 is provided with no fan-out region 91, and the metal heat dissipation layer 6 is disposed around the other three side edges of the display panel.

Of course, in the display panel wrapped by the wrapping material provided in the present application, the side of the display panel for the fan-out region 91 is not limited to one, and correspondingly, the metal heat dissipation layer 6 is not limited to be disposed around the other three sides of the display panel. It suffices that the metal heat dissipation layer 6 is provided around at least one side.

In another embodiment of the present application, the side of the display panel covered by the metal heat dissipation layer 6 may be provided with a plurality of protruding structures, and the area of the metal heat dissipation layer 6 on the side is increased by the protruding structures. For example, with a plurality of layers in the array substrate 4, it is possible to extend outward in the non-display region 2, form a step shape on the side, and increase the area of the metal heat dissipation layer 6 on the side. Of course, in other embodiments, the upper surface 7 of the substrate 4 may also be formed with a convex structure, and in different embodiments, the convex structure may be adjusted according to the heat dissipation requirement and the application scenario.

It can be understood that in the embodiment of the present application, the protruding structure has three exposed outer surfaces, and the metal heat dissipation layer 6 completely covers the three outer surfaces of the protruding structure, so as to form a continuous and integrated structure on the side surface, thereby increasing the heat dissipation area.

According to the display panel provided by the embodiment of the application, the insulation heat conduction layer 5 is arranged around the LEDs in the display area 1, and the insulation heat conduction layer 5 is in contact with the peripheral metal heat dissipation layer 6, so that heat generated by the LEDs is conducted to the peripheral metal heat dissipation layer 6, the whole surface of the display panel is uniformly dissipated, and hot spots are avoided; the metal heat dissipation layer 6 covers around the side face of the display panel, so that the heat dissipation area of the device is increased, and the heat dissipation effect is improved by utilizing the large metal area of the side face and simultaneously performing quick heat exchange with air; the problems of reduced lighting effect, color cast and the like of the LED are avoided.

As shown in fig. 3, the present application provides a method for manufacturing a display panel, which is used for manufacturing the display panel described in any one of the above, and includes:

s01, forming a base plate 4 on the substrate 3;

s02, forming a heat conduction insulating film layer on the display area 1 of the substrate 4, and patterning to form an insulating heat conduction layer 5;

and S03, forming a metal heat dissipation layer 6 on the base plate 4 and the non-display area 2 of the substrate 3.

In the embodiment of the present application, the forming of the base plate 4 on the substrate 3 in step S01 specifically includes:

providing a substrate 3;

an active layer 41, a gate insulating layer 42, a gate layer 43 and an interlayer dielectric layer 44 are sequentially formed on the substrate 3;

forming a first via hole penetrating through the interlayer dielectric layer 44 and the gate insulating layer 42 in the interlayer dielectric layer 44 and the gate insulating layer 42 by an etching process;

forming a source and drain electrode layer 45 on the interlayer dielectric layer 44, and patterning to form a source and drain electrode and a power line VSS 61; the source and drain electrodes are electrically connected to the active layer 41 through the first via hole;

sequentially forming a first flat layer 46 and a passivation layer 47 on the source-drain electrode layer 45;

forming a second via hole penetrating the first planarization layer 46 and the passivation layer 47 in the first planarization layer 46 and the passivation layer 47 through an etching process;

forming a connection electrode layer on the passivation layer 47, patterning the first connection electrode 71 and the second connection electrode 81, wherein the first connection electrode 71 is electrically connected to the drain electrode 51 through a second via hole, and the second connection electrode 81 is electrically connected to a power line through a second via hole;

a second planarization layer 48 is then formed on the passivation layer 47.

It should be noted that "disposed in the same layer" in the present embodiment means that two layers, components, members, elements or portions are located on the same horizontal plane, and the lower surfaces 9 (i.e., the surfaces on the sides close to the substrate 3) of the two layers in the present embodiment are on the same horizontal plane. Unless otherwise specified, the "patterning" process in the embodiments of the present application generally includes the steps of coating, exposing, developing, etching, stripping of the photoresist, and the like.

The insulating and heat conducting layer 5 and the metal heat dissipation layer 6 are exemplarily described in the present application in terms of a sputtering implementation, but the present application is not limited thereto, and the forming process further includes processes of depositing a film layer, coating a photoresist, masking and exposing, developing, etching, and stripping the photoresist. The deposition may employ any one or more selected from evaporation and chemical vapor deposition, the coating may employ any one or more selected from spray coating and spin coating, and the etching may employ any one or more selected from dry etching and wet etching.

Alternatively, as shown in fig. 4, in step S02, forming the insulating and heat conducting layer 5 on the substrate 4, and patterning to form the pixel region includes:

s21, forming a first protection layer 31 on the substrate 4, wherein the first protection layer 31 corresponds to the pixel region and the non-display region 2;

s22, forming a heat conducting insulating film layer on the substrate 4, removing the first protective layer 31, and forming the insulating and heat conducting layer 5.

Alternatively, as shown in fig. 5, forming a metal heat dissipation layer 6 on the base board 4 and the non-display area 2 of the substrate 3 in step S03 includes:

s31, forming a second protection layer 32 on the substrate 4 and the substrate 3, where the second protection layer 32 corresponds to the display area 1;

and S32, forming a metal heat dissipation film layer on the surfaces and the side surfaces of the base plate 4 and the substrate 3 in a three-dimensional sputtering mode, and removing the second protection layer 32 to form the metal heat dissipation layer 6.

In the embodiment of the application, the three-dimensional sputtering method includes a sputtering process and a planetary revolution/rotation method for coating, and the relative position of the substrate layer and the sputtering chamber is changed in the interval of multiple times of sputtering coating. The sputtering source and the substrate 4 are rotated relative to each other by means of a rotating shaft, and a sputtering step is performed to sputter and deposit the material of the sputtering target through the central opening onto the substrate 4.

It should be noted that, in an embodiment of the present application, the substrate 4 is stationary, and the sputtering source rotates relative to the substrate 4 with the rotation axis as the rotation axis. In another embodiment of the present application, the sputtering source is stationary, and the substrate 4 rotates about the rotation axis relative to the sputtering source. In another embodiment of the present application, the substrate 4 and the sputtering source both rotate relative to each other with the rotation axis as the rotation axis.

In the present application, the first protective layer 31 and the second protective layer 32 are used as masks, the protective layers are attached to regions where sputtering is not needed, then a sputtering process is performed, and after sputtering is completed, the protective layers are removed to form a patterning process. In the embodiment of the application, the protective layer is a PI film.

The PI film layer is Polyimide (PI) film, which is a film type insulating material prepared by polycondensation and film-casting of pyromellitic dianhydride and diaminodiphenyl ether in a strong polar solvent and imidization. The Polyimide (PI) film has excellent high and low temperature resistance, electric insulation, adhesion, radiation resistance, medium resistance and the like, and can be used for a long time in a temperature range of-269-280 ℃.

Of course, other materials, such as an ink protective layer, may be used for the protective layer. When the ink protective layer is applied, the photo-curing ink or the thermal-curing ink in the prior art can be selected as the material of the ink protective layer, and the application does not limit the material of the ink and the ink removing mode and does not damage the substrate 3 and the substrate 4.

In an embodiment of the present application, the method further includes:

s04, after the insulating and heat conducting layer 5 and the metal heat dissipation layer 6 are formed, the Micro LED chip is finally transferred to the substrate 4 by a stamp method or other transfer method, so as to form the display panel.

The application provides a display device comprising a display panel as described in any of the above.

The embodiment of the application is not specifically limited to the application of the display device, and the display device can be any product or part with a display function, such as a television, a notebook computer, a tablet computer, wearable display equipment (such as an intelligent bracelet, an intelligent watch and the like), a mobile phone, virtual reality equipment, augmented reality equipment, vehicle-mounted display, an advertising lamp box and the like.

It will be understood that the terms "length," "width," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like, as used herein, refer to an orientation or positional relationship indicated in the drawings that is solely for the purpose of facilitating the description and simplifying the description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and is therefore not to be construed as limiting the invention.

Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or to implicitly indicate the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless specifically defined otherwise.

Unless defined otherwise, technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. Terms such as "disposed" and the like, as used herein, may refer to one element being directly attached to another element or one element being attached to another element through intervening elements. Features described herein in one embodiment may be applied to another embodiment, either alone or in combination with other features, unless the feature is otherwise inapplicable or otherwise stated in the other embodiment.

The present invention has been described in terms of the above embodiments, but it should be understood that the above embodiments are for purposes of illustration and description only and are not intended to limit the invention to the scope of the described embodiments. It will be appreciated by those skilled in the art that many variations and modifications may be made to the teachings of the invention, which fall within the scope of the invention as claimed.

Claims (10)

1. A display panel is characterized by comprising a display area and a non-display area arranged around the display area, wherein the display area is provided with an insulating heat conduction layer, and the surface and the side surface of the non-display area are provided with metal heat dissipation layers; the insulating heat conduction layer is in contact with the metal heat dissipation layer.

2. The display panel according to claim 1, comprising a substrate and a base plate which are stacked, wherein the insulating and heat conducting layer is disposed on an upper surface of the base plate, and the metal heat dissipation layer extends from the upper surface of the base plate to a lower surface of the substrate through the side surface.

3. The display panel of claim 1, wherein the metal heat sink layer is integrally formed on one side of the display panel.

4. The display panel of claim 1, wherein the material of the insulating and thermally conductive layer comprises one or more of aluminum nitride, silicon carbide, beryllium oxide, and boron nitride.

5. The display panel of claim 2, wherein the substrate comprises a first edge proximate the upper surface, the first edge being provided with a chamfer.

6. The display panel of claim 2, wherein the substrate comprises a second edge proximate the lower surface, the second edge treated with an edging process.

7. A method for manufacturing a display panel, for manufacturing the display panel according to any one of claims 1 to 6, comprising:

forming a substrate on a substrate;

forming a heat conduction insulating film layer on the display area of the substrate, and patterning to form an insulating heat conduction layer;

and forming a metal heat dissipation layer on the substrate and the non-display area of the substrate.

8. The method for manufacturing a display panel according to claim 7, wherein forming an insulating and heat conducting layer on the substrate and patterning a pixel region comprises:

forming a first protective layer on the substrate, wherein the first protective layer corresponds to the pixel area and the non-display area;

and forming a heat conduction insulating film layer on the substrate, and removing the first protective layer to form the insulating heat conduction layer.

9. The method for manufacturing a display panel according to claim 7, wherein forming a metal heat dissipation layer on the substrate and the non-display region of the substrate comprises:

forming a second protective layer on the substrate and the substrate, wherein the second protective layer corresponds to the display area;

and forming metal heat dissipation film layers on the surfaces and the side surfaces of the substrate and the substrate in a three-dimensional sputtering mode, and removing the second protection layer to form the metal heat dissipation layer.

10. A display device comprising the display panel according to any one of claims 1 to 6.

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