JP7452592B1 - display device - Google Patents

Abstract

The present invention provides a display device with excellent heat dissipation. A black matrix substrate 3 includes a transparent substrate 31 having a first main surface and a second main surface, and a black matrix substrate 31 provided on the first main surface and having a plurality of first through holes. A matrix 32, a resin layer 34 provided on the black matrix 32 and having second through holes at the positions of the first through holes, and a side wall of each of the second through holes and an upper surface of the resin layer 34. The portion of the reflective layer 35 that covers the upper surface of the resin layer 34 has an arithmetic mean height Sa within a range of 40 to 650 nm, and a kurtosis Sku of 3 or more. be. [Selection diagram] Figure 3

Description

The present invention relates to a display device.

In display devices, partition walls are sometimes provided to separate pixels or sub-pixels from each other (see Patent Documents 1 and 2). The partition wall makes it possible, for example, to utilize light efficiently or to prevent color mixing.

JP2018-189920A Japanese Patent Application Publication No. 2015-064391

An object of the present invention is to provide a display device with excellent heat dissipation.

According to one aspect of the present invention, a transparent substrate having a first main surface and a second main surface; a black matrix provided on the first main surface and having a plurality of first through holes; , a resin layer provided on the black matrix and having a plurality of second through holes at the positions of the plurality of first through holes, and a side wall of each of the plurality of second through holes and the resin layer. a reflective layer that at least partially covers an upper surface, and the portion of the reflective layer that covers the upper surface has an arithmetic average height S _a in a range of 40 to 650 nm, and a kurtosis S _ku of 3. The above black matrix substrate is provided.

Here, the "arithmetic mean height S _a " is a surface texture parameter defined in JIS B0681-2:2018. Further, "Kurtosis S _ku " is a surface texture parameter defined in JIS B0681-2:2018. Note that JIS B0681-2:2018 corresponds to ISO25178-2.

According to another aspect of the present invention, the portion of the reflective layer that covers the side wall has an arithmetic mean height S _a in a range of 40 to 650 nm, and a kurtosis S _ku of 3 or more. A black matrix substrate is provided.

According to still another aspect of the present invention, there is provided a black matrix substrate according to any of the above aspects, in which the reflective layer further partially covers the black matrix.

According to still another aspect of the present invention, there is provided a black matrix substrate according to any one of the above aspects, further including a plurality of wavelength conversion layers respectively provided in at least some of the plurality of second through holes. Ru.

According to still another aspect of the present invention, the black matrix according to any one of the above aspects further includes a color filter including a plurality of colored layers, each of which is disposed at a position of at least a part of the plurality of first through holes. A substrate is provided.

According to still another aspect of the present invention, there is provided a black matrix substrate according to any of the above aspects, in which the reflective layer includes a layer made of metal or an alloy.

According to still another aspect of the present invention, a black matrix substrate according to any of the above aspects, a light control device installed to face the first main surface, and a combination of the black matrix substrate and the light control device. A display device is provided that includes an adhesive layer interposed therebetween and bonded together.

According to yet another aspect of the invention,
The display according to the above-mentioned side surface further comprising a heat radiator located outside the laminate of the black matrix substrate, the light control device, and the adhesive layer, and a heat conductor that guides heat from the reflective layer to the heat radiator. Equipment is provided.

According to still another aspect of the present invention, the display according to the above-mentioned side surface includes a back heat radiator provided to face the black matrix substrate with the light control device and the adhesive layer interposed therebetween. Equipment is provided.

According to still another aspect of the present invention, there is provided a display device according to the above aspect, in which the back heat radiator is a back heat radiator layer provided on the light control device.

According to yet another aspect of the invention, the light control device is provided with one or more through holes, and the heat transfer body is located at least partially within the one or more through holes. A display device according to the present invention is provided.

According to still another aspect of the present invention, there is provided a display device according to any of the above aspects, in which the light control device includes a plurality of light emitting elements.

According to still another aspect of the present invention, there is provided a display device according to any of the above aspects, wherein the light control device includes a plurality of light emitting diodes.

According to the present invention, a display device with excellent heat dissipation properties is provided.

FIG. 1 is a plan view showing a part of a display device according to a first embodiment of the present invention. FIG. 2 is an equivalent circuit diagram of the display device shown in FIG. 1. FIG. 3 is a cross-sectional view of the display device shown in FIG. 1 taken along line III-III. FIG. 4 is a cross-sectional view of the display device shown in FIG. 1 taken along line IV-IV. FIG. 5 is a sectional view showing a part of a display device according to a second embodiment of the present invention.

Embodiments of the present invention will be described below with reference to the drawings. The embodiments described below are more specific implementations of any of the above aspects. The matters described below can be incorporated into each of the above aspects alone or in combination.

In addition, the embodiments shown below illustrate configurations for embodying the technical idea of the present invention, and the technical idea of the present invention includes the materials, shapes, structures, etc. of the following constituent members. It is not limited by. Various changes can be made to the technical idea of the present invention within the technical scope defined by the claims.

Note that elements having the same or similar functions will be designated by the same reference numerals in the drawings referred to below, and overlapping explanations will be omitted. In addition, the drawings are schematic, and the relationship between dimensions in one direction and dimensions in another direction, and the relationship between the dimensions of a certain member and the dimensions of other members, etc. may differ from the actual one. It can be different.

<1> First Embodiment FIG. 1 is a plan view showing a part of a display device according to a first embodiment of the present invention. FIG. 2 is an equivalent circuit diagram of the display device shown in FIG. 1. FIG. 3 is a cross-sectional view of the display device shown in FIG. 1 taken along line III-III. FIG. 4 is a cross-sectional view of the display device shown in FIG. 1 taken along line IV-IV. In addition, in FIG. 1, the area surrounded by the broken line represents the opening on the transparent substrate 31 side of the first through hole that the black matrix 32 has, as will be described later.

The display device 1A shown in FIGS. 1 to 4 is a micro LED display capable of color display using an active matrix driving method, and each sub-pixel includes a light emitting diode (LED).

Note that in each figure, the X direction and the Y direction are directions that are parallel to the display surface of the display device 1A and intersect with each other. According to one example, the X direction and the Y direction are perpendicular to each other. Further, the Z direction is a direction perpendicular to the X direction and the Y direction. That is, the Z direction is the thickness direction of the display device 1A.

As shown in FIG. 2, the display device 1A includes a video signal line VSL, a power supply line PSL, a scanning signal line SSL, a pixel PX, a video signal line driver VDR, and a scanning signal line driver SDR. .

The video signal line VSL and the power supply line PSL each extend in the Y direction and are arranged alternately in the X direction. The scanning signal lines SSL each extend in the X direction and are arranged in the Y direction.

Pixels PX are arranged in the X direction and the Y direction. Each pixel PX includes a first sub-pixel PXR, a second sub-pixel PXG, and a third sub-pixel PXB. The first sub-pixel PXR, the second sub-pixel PXG, and the third sub-pixel PXB are arranged corresponding to the intersection of the video signal line VSL and the scanning signal line SSL.

The first sub-pixel PXR, the second sub-pixel PXG, and the third sub-pixel PXB emit light of different colors. Here, as an example, it is assumed that the first sub-pixel PXR, the second sub-pixel PXG, and the third sub-pixel PXB emit red light, green light, and blue light, respectively.

In each pixel PX, a first sub-pixel PXR, a second sub-pixel PXG, and a third sub-pixel PXB are arranged in this order in the X direction. The arrangement order of the first sub-pixel PXR, second sub-pixel PXG, and third sub-pixel PXB in each pixel PX can be changed.

Further, here, the first sub-pixel PXR, the second sub-pixel PXG, and the third sub-pixel PXB form a stripe arrangement. The first sub-pixel PXR, the second sub-pixel PXG, and the third sub-pixel PXB may form other arrangements such as a delta arrangement and a mosaic arrangement.

Each of the first sub-pixel PXR, the second sub-pixel PXG, and the third sub-pixel PXB includes a light emitting element D, a drive control element DR, a switch SW, and a capacitor C.

Light emitting element D is a light emitting diode. The light emitting diode is, for example, a light emitting diode made of an inorganic material. A light emitting diode made of an inorganic substance can be obtained, for example, by dividing a laminate having a layer structure similar to these into a plurality of parts. The light emitting element D may be an electroluminescent element which is a light emitting diode made of an organic material. The cathode of the light emitting element D is connected to a ground electrode. Here, as an example, it is assumed that the light emitting element D is a blue light emitting diode that is made of an inorganic substance and emits blue light.

The drive control element DR and switch SW are field effect transistors. Here, the drive control element DR is a p-channel thin film transistor, and the switch SW is an n-channel thin film transistor. The drive control element DR has a gate connected to the drain of the switch SW, a source connected to the power supply line PSL, and a drain connected to the anode of the light emitting element D. The switch SW has a gate connected to the scanning signal line SSL, and a source connected to the video signal line VSL.

Capacitor C is, for example, a thin film capacitor. The capacitor C has one electrode connected to the gate of the drive control element DR, and the other electrode connected to the power supply line PSL.

The first sub-pixel PXR further includes a first wavelength conversion layer 36R and a first colored layer 33R shown in FIGS. 3 and 4.

The first wavelength conversion layer 36R is installed to face the light emitting element D of the first sub-pixel PXR. The first wavelength conversion layer 36R converts the light emitted by the light emitting element D of the first sub-pixel PXR into first light of a specific color. The first wavelength conversion layer 36R converts, for example, blue light emitted by the light emitting element D of the first sub-pixel PXR into red light.

The first colored layer 33R is installed to face the light emitting element D of the first sub-pixel PXR with the first wavelength conversion layer 36R interposed therebetween. The first colored layer 33R transmits the light whose wavelength has been converted by the first wavelength conversion layer 36R, and absorbs the light whose wavelength has not been converted by the first wavelength conversion layer 36R. The first colored layer 33R is, for example, a red colored layer that transmits red light after wavelength conversion by the first wavelength conversion layer 36R and absorbs blue light etc. whose wavelength has not been converted by the first wavelength conversion layer 36R. .

The second sub-pixel PXG further includes a second wavelength conversion layer 36G and a second colored layer 33G shown in FIG.

The second wavelength conversion layer 36G is installed to face the light emitting element D of the second sub-pixel PXG. The second wavelength conversion layer 36G converts the light emitted by the light emitting element D of the second sub-pixel PXG into second light having a different color from the first light. The second wavelength conversion layer 36G converts, for example, blue light emitted by the light emitting element D of the second sub-pixel PXG into green light.

The second colored layer 33G is placed so as to face the light emitting element D of the second sub-pixel PXG with the second wavelength conversion layer 36G interposed therebetween. The second colored layer 33G transmits the light whose wavelength has been converted by the second wavelength conversion layer 36G, and absorbs the light whose wavelength has not been converted by the second wavelength conversion layer 36G. The second colored layer 33G is, for example, a green colored layer that transmits green light after wavelength conversion by the second wavelength conversion layer 36G and absorbs blue light, etc. whose wavelength has not been converted by the second wavelength conversion layer 36G. .

The third sub-pixel PXB further includes a base layer 33B and a filling layer 36B shown in FIG.

The filling layer 36B is installed to face the light emitting element D of the third sub-pixel PXB. The filling layer 36B is, for example, a colorless and transparent layer. The filling layer 36B can be omitted.

The base layer 33B is placed so as to face the light emitting element D of the third sub-pixel PXB with the filling layer 36B in between. The base layer 33B transmits the light emitted by the light emitting element D of the third sub-pixel PXB as third light. The base layer 33B is, for example, a colorless light transmitting layer or a blue colored layer that transmits blue light emitted from the light emitting element D of the third subpixel PXB.

The video signal line driver VDR and the scanning signal line driver SDR are mounted on a display panel as COG (chip on glass), as shown in FIG. The video signal line driver VDR and the scanning signal line driver SDR may be implemented using TCP (tape carrier package) instead of COG implementation.

A video signal line VSL and a power supply line PSL are connected to the video signal line driver VDR. The video signal line driver VDR outputs a voltage signal as a video signal to the video signal line VSL.

A scanning signal line SSL is connected to the scanning signal line driver SDR. The scanning signal line driver SDR outputs a voltage signal as a scanning signal to the scanning signal line SSL. The power supply line PSL may be connected to the scanning signal line driver SDR instead of being connected to the video signal line driver VDR.

The display device 1A will be explained in more detail.
The display device 1A includes a light control device 2A, a black matrix substrate 3, and an adhesive layer 4, as shown in FIGS. 3 and 4.

The light control device is a device that emits light toward a black matrix substrate and is capable of adjusting at least one of the intensity of the light and the time for emitting the light for each pixel or each subpixel. The light control device 2A shown in FIG. 3 and FIG. , a filling layer 27 , and a conductor layer 28 .

The substrate 21 includes, for example, an insulating substrate such as a glass substrate. The substrate 21 may further include an undercoat layer provided on the main surface of the insulating substrate facing the black matrix substrate 3. The undercoat layer is, for example, a laminate of a silicon nitride layer and a silicon oxide layer that are sequentially stacked on an insulating substrate. The substrate 21 may be a semiconductor substrate such as a silicon substrate. The substrate 21 may be rigid or flexible.

The semiconductor layers 22 are arranged on the main surface of the substrate 21 facing the black matrix substrate 3 . The semiconductor layer 22 is, for example, a polysilicon layer. The semiconductor layer 22 is a semiconductor layer of a thin film transistor that constitutes the drive control element DR or the switch SW. Each semiconductor layer 22 includes a source and a drain, and a channel region interposed therebetween.

The conductor layer 23A is a conductor pattern provided on the main surface of the substrate 21. The conductor layer 23A constitutes the video signal line VSL, the power supply line PSL, the source electrode SE, the drain electrode DE, and the lower electrode (not shown) of the capacitor C. The source electrode SE and the drain electrode DE are connected to the source and drain of the semiconductor layer 22, respectively. The conductor layer 23A is made of metal or an alloy. The conductor layer 23A may have a single layer structure or a multilayer structure.

The insulating layer 24A covers the conductor layer 23A and the main surface of the substrate 21. The insulating layer 24A can be formed using, for example, TEOS (tetraethyl orthosilicate). The gate insulating film of each thin film transistor constituting the drive control element DR or switch SW is a part of the insulating layer 24A. Further, the dielectric layer of each capacitor C is another part of the insulating layer 24A.

The conductor layer 23B is a conductor pattern provided on the insulating layer 24A. The gate electrode GE of each thin film transistor constituting the drive control element DR or switch SW is a part of the conductor layer 23B. Each gate electrode GE faces the channel region of the semiconductor layer 22 with the insulating layer 24A in between. Further, the upper electrode (not shown) of each capacitor C is another part of the conductor layer 23B. Each upper electrode faces the lower electrode of the capacitor C including the upper electrode, with the insulating layer 24A interposed therebetween. The conductor layer 23B is made of metal or an alloy. The conductor layer 23B may have a single layer structure or a multilayer structure.

The insulating layer 24B covers the conductor layer 23B and the insulating layer 24A. The insulating layer 24B is an interlayer insulating film. The insulating layer 24B is made of, for example, an inorganic insulator such as silicon oxide. The insulating layer made of an inorganic insulator can be formed by, for example, a plasma CVD (chemical vapor deposition) method.

The conductor layer 23C is a conductor pattern provided on the insulating layer 24B, as shown in FIG. The conductor layer 23C constitutes a scanning signal line SSL. The source electrode SE and the drain electrode DE may be provided on the insulating layer 24B instead of being provided on the insulating layer 24A. That is, the conductor layer 23C may constitute the scanning signal line SSL, the source electrode SE, and the drain electrode DE.

The insulating layer 24C covers the conductor layer 23C and the insulating layer 24B. The insulating layer 24C is a passivation film. The insulating layer 24C is made of an inorganic insulator such as silicon nitride, for example.

The conductor layer 23D is a conductor pattern provided on the insulating layer 24C. The conductor layer 23D constitutes electrode pads arranged in the X direction and the Y direction corresponding to the first sub-pixel PXR, the second sub-pixel PXG, and the third sub-pixel PXB. A through hole is provided in the stacked body consisting of the insulating layers 24A, 24B, and 24C at the position of the drain electrode DE connected to the drain of the drive control element DR. Each electrode pad is connected to the drain electrode DE through this through hole. The conductor layer 23D is made of metal or an alloy, for example. The conductor layer 23D may have a single layer structure or a multilayer structure.

The contour of the orthogonal projection of each electrode pad onto a plane perpendicular to the Z direction is spaced apart from the orthogonal projection of the light emitting element 25 installed on this electrode pad onto the plane above, and surrounds this orthogonal projection. There is. That is, the electrode pad has a larger dimension in the direction perpendicular to the Z direction than the light emitting element 25. Therefore, the electrode pad also serves as a reflective layer that reflects light traveling toward the substrate 21. The electrode pad does not have to play the role of this reflective layer. In this case, the reflective layer that plays this role may be provided separately from the electrode pad, or may not be provided.

The light emitting element 25 shown in FIGS. 3 and 4 is the light emitting element D shown in FIG. 2. The light emitting element 25 is placed on the electrode pad.

The light emitting element 25 here is a light emitting diode made of an inorganic material. Note that a substrate including a light emitting diode as the light emitting element 25 is sometimes referred to as an "LED substrate."

The light emitting element 25 has a multilayer structure including a plurality of layers, for example, a first layer 251, a second layer 252, and a third layer 253. Here, the stacking direction of the layers included in the light emitting element 25 is the Z direction. This stacking direction may be perpendicular to the Z direction.

Each light emitting element 25 includes an anode and a cathode. The light emitting element 25 has an anode and a cathode on one surface. The anode of the light emitting element 25 is connected to an electrode pad via a bonding wire (not shown). When the light emitting element 25 has an anode on one surface and a cathode on the other surface, the bonding of the light emitting element 25 to the electrode pad and the connection of the anode to the electrode pad are performed using a conductive paste such as a conductive paste. The bonding may also be performed by die bonding using the material as a bonding material. When the light emitting element 25 has an anode and a cathode on one surface, the conductor layer 28 is omitted, and an electrode pad for connecting to the cathode of the light emitting element 25 is further provided on the insulating layer 24C, and these electrodes are Wiring connected to the pads may be further provided between the insulating layers, and the connection of the light emitting element 25 to the electrode pad and the conductor layer 28 and the connection of the anode and cathode to the electrode pads may be performed by flip chip bonding.

The dimensions of the light emitting element 25 in the X and Y directions are preferably in the range of 1 to 100 μm, more preferably in the range of 5 to 80 μm, and still more preferably in the range of 10 to 60 μm. The dimension of the light emitting element 25 in the Z direction is preferably in the range of 1 to 20 μm, more preferably in the range of 1 to 15 μm, and still more preferably in the range of 1 to 10 μm.

The partition layer 26 is provided on the insulating layer 24C. The partition layer 26 has through holes at the positions of the electrode pads. The light emitting elements 25 are located within these through holes, respectively. The partition layer 26 is made of resin, for example. Such a partition layer 26 can be formed by photolithography using a photosensitive resin. The partition layer 26 may include a resin layer having through holes, and a reflective layer covering the side walls of the through holes and optionally the upper surface of the resin layer. The reflective layer may have a single layer structure or a multilayer structure. The reflective layer includes, for example, a metal, an alloy, or a transparent dielectric. The partition layer 26 can be omitted.

The filling layer 27 fills the gap between the light emitting element 25 and the partition layer 26. The filling layer 27 is a light transmitting layer that transmits the light emitted from the light emitting element 25. Furthermore, the filling layer 27 also serves as a protective layer that protects the light emitting element 25 and the joints between it and the electrodes. The filling layer 27 is made of resin, for example. The refractive index of the filling layer 27 is preferably different from the refractive index of the material forming the surface of the partition layer 26.

The conductor layer 28 is provided on the partition layer 26 and the filling layer 27. The cathode of the light emitting element 25 is connected to the conductor layer 28. When the conductor layer 28 is made of a conductive transparent oxide, it can be provided so as to cover the entire cathode of the light emitting element 25 . When the conductor layer 28 is made of metal or an alloy, it is preferable to provide the conductor layer 28 so as to partially cover the cathode of the light emitting element 25 .

The black matrix substrate 3 faces the light control device 2A. Specifically, the black matrix substrate 3 faces the substrate 21 with the light emitting elements 25 and the like interposed therebetween.

The black matrix substrate 3 includes a transparent substrate 31, a black matrix 32, a resin layer 34, a reflective layer 35, a color filter including a first colored layer 33R and a second colored layer 33G, a base layer 33B, and a color filter including a first colored layer 33R and a second colored layer 33G. It includes a first wavelength conversion layer 36R, a second wavelength conversion layer 36G, and a filling layer 36B.

The transparent substrate 31 has visible light transmittance. The transparent substrate 31 is, for example, a colorless substrate. The transparent substrate 31 may have a single layer structure or a multilayer structure. The transparent substrate 31 is made of, for example, glass, transparent resin, or a combination thereof. The transparent substrate 31 may be hard or flexible. The transparent substrate 31 has a first main surface facing the light control device 2A and a second main surface that is the back surface thereof.

The black matrix 32 is provided on the first main surface of the transparent substrate 31. The black matrix 32 is a black layer that blocks visible light. The black matrix 32 is made of, for example, a mixture containing a binder resin and a colorant. The coloring agent is, for example, a black pigment or a mixture of pigments that produces a black color by subtractive color mixing, for example a mixture containing a blue pigment, a green pigment and a red pigment. According to one example, the black matrix 32 is a layer containing carbon materials such as graphite, graphene, and carbon nanotubes. According to another example, the black matrix 32 is a laminate of a chromium layer and a chromium oxide layer.

The black matrix 32 has a first through hole at the position of the light emitting element 25. The opening of each first through hole on the transparent substrate 31 side has a larger dimension in the direction perpendicular to the Z direction than the light emitting element 25 .

Here, the opening of the first through hole on the transparent substrate 31 side has a shape extending in the Y direction, as shown by the broken line in FIG. Each portion of the black matrix 32 corresponding to the pixel PX includes a first through hole provided at the position of the first sub pixel PXR, a first through hole provided at the position of the second sub pixel PXG, and a third through hole provided at the position of the second sub pixel PXG. and a first through hole provided at the position of the sub-pixel PXB, and these three first through holes are arranged in the X direction. A plurality of first through-hole groups each consisting of these three first through-holes are arranged in the X direction and the Y direction. The distance between adjacent first through-hole groups in the X direction is larger than the distance between first through-holes included in the same through-hole group. The distance between adjacent first through-hole groups in the Y direction is also larger than the distance between first through-holes included in the same through-hole group.

The aperture ratio of the black matrix 32 is preferably in the range of 5 to 66%, more preferably in the range of 5 to 40%, and still more preferably in the range of 5 to 20%. A light emitting diode made of an inorganic material can emit bright light even if the light exit surface is small, and has a long life. Therefore, when the light emitting element 25 is a light emitting diode made of an inorganic material, bright display is possible even if the aperture ratio of the black matrix 32 is made small. When the aperture ratio of the black matrix 32 is reduced, reflection of external light can be suppressed, black color with greater depth can be displayed, and a higher contrast ratio can therefore be achieved.

The thickness of the black matrix 32 is preferably in the range of 0.1 to 30 μm, more preferably in the range of 1 to 15 μm, and still more preferably in the range of 1 to 5 μm. A thick black matrix 32 is advantageous in achieving high light-shielding properties. However, if the black matrix 32 is made thicker, during pattern exposure of a coating film made of a photosensitive black composition, light may not be able to reach deep parts of the coating film with sufficient intensity, and high shape accuracy may not be achieved. .

The resin layer 34 is provided on the black matrix 32, as shown in FIGS. 3 and 4. According to one example, resin layer 34 is transparent. In this case, the resin layer 34 may be colored or colorless. The resin layer 34 may have light scattering properties. For example, assuming that the film thickness is 5 μm, the transparent resin layer 34 has a maximum transmittance of 20% or more for light in the wavelength range of 350 to 480 nm that is incident in the thickness direction. It is desirable that

The resin layer 34 has second through holes at the positions of the first through holes. These second through holes constitute a second through hole group corresponding to the above first through hole group. Each of the second through-hole groups here includes three second through-holes arranged in the X direction. The second through-hole group is arranged in a first direction and a second direction that intersect with each other, here, in the X direction and the Y direction.

The distance W _x 1 between the second through-hole groups adjacent to each other in the X direction is larger than the distance W1 between the second through-holes included in the same through-hole group. The distance W _y 1 between the second through-hole groups adjacent to each other in the Y direction is also larger than the distance W 1 between the second through-holes included in the same through-hole group.

The distance W1 is preferably in the range of 5 to 80 μm, more preferably in the range of 5 to 40 μm, and still more preferably in the range of 5 to 20 μm.

The distance W _x 1 is preferably in the range of 5 to 250 μm, more preferably in the range of 50 to 250 m, even more preferably in the range of 100 to 250 μm.

The distance W _y 1 is preferably in the range of 5 to 250 μm, more preferably in the range of 5 to 100 μm, and still more preferably in the range of 5 to 50 μm.

The ratio W _x 1/W1 between the distance W _x 1 and the distance W1 is preferably in the range of 0.1 to 50, more preferably in the range of 2 to 20, and still more preferably in the range of 5 to 15. It's within. The distance W _x 1 may be equal to the distance W1 or may be smaller than the distance W1.

The ratio W _y 1/W1 between the distance W _y 1 and the distance W1 is preferably in the range of 0.1 to 50, more preferably in the range of 0.1 to 10, and even more preferably 0.1. It is within the range of 5 to 5. The distance W _y 1 may be equal to the distance W1 or may be smaller than the distance W1.

Here, the contour of the orthogonal projection of the opening on the transparent substrate 31 side onto the first principal surface of the second through hole (hereinafter referred to as the second contour) is the contour of the orthogonal projection of the opening on the transparent substrate 31 side onto the first principal surface. It is provided so as to surround the projection contour (hereinafter referred to as the first contour). The second contour does not have to surround the first contour. In a structure in which the second contour surrounds the first contour, stray light has less influence on the display than in a structure in which the second contour does not surround the first contour.

A portion of the resin layer 34 sandwiched between adjacent second through holes has a forward tapered cross-sectional shape. This portion may have a rectangular cross-sectional shape, a reverse tapered cross-sectional shape, or another cross-sectional shape.

The thickness of the resin layer 34 is preferably in the range of 5 to 50 μm, more preferably in the range of 5 to 40 μm, and still more preferably in the range of 10 to 25 μm. When the thickness of the resin layer 34 is small, it is difficult to increase the total thickness of the layers formed in the second through hole. When the resin layer 34 is made thicker, the shape accuracy of the partition wall portion sandwiched between adjacent second through holes is reduced.

The reflective layer 35 at least partially covers the side walls of each of the second through holes and the upper surface of the resin layer 34 . Here, as shown in FIGS. 3 and 4, the reflective layer 35 covers the entire side wall of each second through hole, the entire upper surface of the resin layer 34, and the part of the black matrix 32 that is not covered with the resin layer 34. It covers the parts. The reflective layer 35 does not need to cover a part of the side wall of the second through hole. For example, the reflective layer 35 covers at least one of a portion of at least one side wall of the second through hole near the black matrix 32 and a portion of at least one side wall of the second through hole near the top surface of the resin layer 34. It does not need to be covered. Furthermore, the reflective layer 35 does not need to cover the portions of the black matrix 32 that are not covered with the resin layer 34 .

The portion of the reflective layer 35 located within the second through hole is open at the position of the first colored layer 33R, the second colored layer 33G, or the base layer 33B. The area S2 of each of these openings is preferably larger compared to the area S1 of the opening of the first through hole. The ratio S2/S1 between area S2 and area S1 is preferably in the range of 1 to 100, more preferably in the range of 1 to 30, and still more preferably in the range of 1 to 2.

The reflective layer 35 may have a single layer structure or a multilayer structure. The layer included in the reflective layer 35 is, for example, a metal, an alloy, or a transparent dielectric. From the viewpoint of thermal conductivity, the reflective layer 35 preferably includes a layer made of metal or an alloy. According to one example, the reflective layer 35 consists of aluminum, an aluminum alloy or a neodymium alloy.

The thickness of the reflective layer 35 covering the upper surface of the resin layer 34 is preferably in the range of 100 to 500 nm, more preferably in the range of 100 to 250 nm. Increasing the thickness of the reflective layer 35 improves the thermal conductivity in the in-plane direction. However, increasing the thickness of the reflective layer 35 increases manufacturing costs.

The reflective layer 35 can be formed by, for example, forming a film using a vapor deposition method such as a sputtering method or a vacuum evaporation method, forming an etching mask, and etching such as wet etching in this order. The etching mask can be formed by photolithography using a photosensitive resin. The transparent resin layer used as this etching mask may or may not be removed after the above etching.

The first colored layer 33R fills a first through hole at the position of the first sub-pixel PXR, as shown in FIGS. 3 and 4. As mentioned above, the first colored layer 33R is a red colored layer here.

As shown in FIG. 3, the second colored layer 33G fills the first through hole at the position of the second sub-pixel PXG. As mentioned above, the second colored layer 33G is a green colored layer here.

As shown in FIG. 3, the base layer 33B embeds the first through hole at the position of the third sub-pixel PXB. As mentioned above, here it is a colorless light-transmitting layer or a blue-colored layer.

The first wavelength conversion layer 36R is provided on the first colored layer 33R, and buries at least the bottom of the second recess. The first wavelength conversion layer 36R is a layer containing a phosphor such as a quantum dot phosphor and a transparent resin. As described above, here, the first wavelength conversion layer 36R converts the blue light emitted by the light emitting element D of the first sub-pixel PXR into red light.

The second wavelength conversion layer 36G is provided on the second colored layer 33G and buries at least the bottom of the second recess. The second wavelength conversion layer 36G is a layer containing a phosphor such as a quantum dot phosphor and a transparent resin. As described above, here, the second wavelength conversion layer 36G converts the blue light emitted by the light emitting element D of the second sub-pixel PXG into red light.

The filling layer 36B is provided on the base layer 33B and fills at least the bottom of the second recess. As mentioned above, the filling layer 36B is a colorless and transparent layer here. In this case, the filling layer 36B is made of transparent resin, for example.

The adhesive layer 4 is interposed between the light control device 2A and the black matrix substrate 3, and adheres them to each other. The adhesive layer 4 transmits the light emitted by the light emitting element 25. The adhesive layer 4 is, for example, a colorless and transparent layer. The adhesive layer 4 is made of adhesive or adhesive.

In this display device 1A, the portion of the reflective layer 35 that covers the upper surface of the resin layer 34 has an arithmetic mean height S _a in the range of 40 to 650 nm, and a kurtosis S _ku of 3 or more. Preferably, the portion of the reflective layer 35 that covers the side wall of the second through hole provided in the resin layer 34 also has an arithmetic average height S _a within the range of 40 to 650 nm, and a kurtosis S _ku of 3 or more. be. It is preferable that these arithmetic mean heights S _a are 100 nm or more, and it is also preferable that it is 400 nm or less. Further, these kurtosis S _ku are, for example, 6 or less. Note that the kurtosis S _ku represents the sharpness of the height distribution.

In this display device 1A, the light emitting element 25 is the main heat source. A portion of the heat generated in the light emitting element 25 is transmitted to the reflective layer 35 via the adhesive layer 4. When the part of the reflective layer 35 that covers the upper surface of the resin layer 34 has the above-mentioned surface texture, the difference between the adhesive layer 4 and the reflective layer 35 is greater than when this part is smoother. heat exchange can occur more efficiently.

Further, the reflective layer 35 has particularly excellent thermal conductivity among the elements located between the adhesive layer 4 and the transparent substrate 31. In this display device 1A, the reflective layer 35 covers not only the upper surface of the resin layer 34 but also the side walls of the through holes provided in the resin layer 34, and also partially covers the black matrix 32. There is. That is, the reflective layer 35 includes a portion adjacent to the adhesive layer 4 as well as a portion located near the transparent substrate 31. The black matrix 32 interposed between the reflective layer 35 and the transparent substrate 31 is made of a black material such as carbon-containing resin or chromium oxide. These black materials have high thermal conductivity. Therefore, the heat transmitted from the adhesive layer 4 to the reflective layer 35 is quickly transmitted to the transparent substrate 31.

Therefore, the display device 1A can quickly radiate part of the heat generated in the light emitting elements 25 to the outside air via the black matrix substrate 3. Therefore, this display device 1A is difficult to accumulate heat inside and has excellent heat dissipation.

Since the display device 1A has excellent heat dissipation properties as described above, it is difficult to cause deterioration, decrease in brightness, and color shift, as described below.

In recent years, with the aim of expanding the use of display devices, there has been a need for display devices with increased output and high brightness in order to improve outdoor visibility. However, when the output of a display device using a light emitting diode is increased, the heat generated by the light emitting diode may cause problems such as thermal deterioration of members such as wiring and sealing resin located near the light emitting diode. In addition, phosphors such as quantum dots undergo thermal deterioration, as well as a decrease in brightness and color shift when emitting light at high temperatures (shift in wavelength showing maximum intensity in the visible range; hereinafter referred to as wavelength shift). In particular, in a display device that includes a light emitting diode and has a structure in which a pair of substrates are bonded together via an adhesive layer, the light emitting diode, which is the heat source, is isolated from the atmosphere, so heat is stored inside. easy. Therefore, high-brightness display uses phosphors such as quantum dots to convert the short wavelength light (blue light or ultraviolet light) emitted by light-emitting diodes into blue, green, and red light for full-color display. Equipment requires excellent heat dissipation.

As described above, the display device 1A described above quickly radiates part of the heat generated in the light emitting elements 25 to the outside of the display device 1A via the black matrix substrate 3. Therefore, in this display device 1A, heat does not easily accumulate inside the display device 1A, and the inside temperature does not easily reach an excessively high temperature. Therefore, the display device 1A is unlikely to cause deterioration of quantum dots, etc., decrease in brightness, and color shift (wavelength shift).

Further, if the portion of the reflective layer 35 that covers the side wall of the second through hole provided in the resin layer 34 has the above-mentioned surface texture, this portion will moderately scatter the light from the light emitting element 25. can be done. As a result, the wavelength conversion efficiency in the first wavelength conversion layer 36R and the second wavelength conversion layer 36G increases, making it possible to increase brightness or reduce power consumption.

The reflective layer 35 having the above-mentioned surface properties can be obtained, for example, by subjecting the resin layer 34 to surface roughening treatment such as O ₂ plasma treatment, and then forming the reflective layer 35 into a film. That is, by performing the surface roughening treatment, the arithmetic mean height S _a and the kurtosis S _ku of the resin layer 34 can be increased, and therefore the arithmetic mean height S _a and the kurtosis S _ku of the reflective layer 35 can also be increased. It can be made larger. For example, by subjecting a resin layer having an arithmetic mean height S _a of 30 nm to O ₂ plasma treatment, the reflective layer 35 having an arithmetic mean height S _a of 40 nm or more can be obtained.

The reflective layer 35 having the above-mentioned surface properties can also be obtained by incorporating particles into the material of the resin layer 34. By appropriately setting the particle size and content of the particles, it is possible to obtain the resin layer 34 having the desired surface texture, and therefore to obtain the reflective layer 35 having the above-mentioned surface texture. is also possible.

When the material of the resin layer 34 contains particles, these particles are preferably made of a highly thermally conductive material such as a metal oxide. In this case, the thermal conductivity of the resin layer 34 is increased, and the heat dissipation performance is improved.

When the material of the resin layer 34 contains particles, the proportion of the particles in the material is preferably 50% by volume or less, more preferably 20% by volume or less. If this ratio is increased, the shape accuracy of the resin layer 34 will decrease.

In order to obtain the above-mentioned light scattering effect, the portion of the reflective layer 35 that covers the side wall of the second through hole provided in the resin layer 34 has an arithmetic mean height S _a that is the same as the wavelength in the visible range. It is preferable that the degree of

The arithmetic mean height S a of the portion of the reflective layer 35 that covers the upper surface of the resin layer 34 and the portion that covers the side wall of the second through hole provided in the resin layer 34 _is not excessively large. is desirable. In order to form the reflective layer 35 with a large arithmetic mean height S _a of these portions, it is necessary to form a resin layer 34 with a large arithmetic mean height S _a . In such a resin layer 34, when a portion of the reflective material layer is removed by etching in order to form the reflective layer 35 thereon, etching residue is likely to be generated. Furthermore, if the arithmetic mean height S _a of the resin layer 34 is excessively increased, the removability of the protective resist used as a mask during this etching will be reduced.

Further, in the display device 1A, the black matrix substrate 3 includes a partition layer consisting of a resin layer 34 provided with a second through hole and a reflective layer 35 covering the resin layer 34. The structure in which a black matrix substrate is provided with a partition layer including a resin layer having through holes and a metal layer covering the resin layer is advantageous for repairing the LED substrate before bonding the LED substrate and the black matrix substrate. It is. This will be explained below.

In order to improve the brightness of a micro LED display, it is effective to increase the reflectance of the partition walls that separate the light emitting diodes. Furthermore, in order to prevent color mixing between adjacent pixels, it is necessary to increase the light-shielding properties of the partition walls. For these reasons, there is a need for partition walls that have both high reflectance and light-blocking properties.

When a structure in which a reflective layer is formed on a resin layer having through-holes is adopted as a partition layer including partition walls, ease of manufacture, high reflectance, and high light-shielding properties can be achieved.

In order to form a resin layer having through-holes, it is desirable to use well-known photolithography including exposure and development steps. However, it is difficult to uniformly form a photoresist on an LED substrate whose surface has irregularities with large height differences. Furthermore, when forming the resin layer, there is a risk that defects may occur in the LED substrate during steps such as photoresist coating and development that come into contact with a solution.

In order to solve the above problems, a protective film can also be formed on the light emitting diode. However, if a defect is found in the light emitting diode after the protective film is formed, the LED substrate cannot be repaired, resulting in a reduction in yield.

When a partition layer including a resin layer having through holes and a metal layer covering the resin layer is provided on a black matrix substrate, there is no need to form large partition walls on the LED substrate, and in some cases, The partition wall can be omitted from the LED board. Therefore, ease of manufacture, high reflectance, and high light shielding properties can be achieved without reducing yield.

<2> Second Embodiment FIG. 5 is a sectional view showing a part of a display device according to a second embodiment of the present invention.
The display device 1B shown in FIG. 5 is the same as the display device 1A described above except that the following configuration is adopted. That is, the display device 1B includes a light control device 2B that is similar to the light control device 2A except that one or more through holes each extending in the Z direction are provided instead of the light control device 2A. . In addition, the display device 1B further includes a heat radiator 5 and a heat conductor.

The heat sink 5 is located outside the laminate of the light control device 2A, the black matrix substrate 3, and the adhesive layer 4. Here, the heat radiator 5 is a back heat radiator provided so as to face the black matrix substrate 3 with the light control device 2B and the adhesive layer 4 interposed therebetween. More specifically, the heat dissipation body 5 is a back heat dissipation layer provided on the light control device 2B here.

The heat sink 5 is made of a highly thermally conductive material. Highly thermally conductive materials include, for example, metals such as copper, aluminum, iron, silver, titanium, molybdenum, tantalum, tungsten, and niobium; alloys containing one or more of these metals; carbides such as tungsten carbide; graphite, graphene, Carbon materials such as carbon nanotubes and diamonds; other insulating ceramics; or composite materials containing one or more of them. The heat sink 5 may have a single layer structure or a multilayer structure.

The heat sink 5 has a flat surface. The heat sink 5 having a flat surface can be formed by, for example, forming a film on the light control device 2A. Alternatively, the heat sink 5 having a flat surface can be provided on the light control device B by pasting it on the light control device 2B. The heat radiator 5 having a flat surface is easy to form or install on the light control device 2B.

The heat sink 5 may have an uneven surface. For example, the heat sink 5 may have a plurality of fins or pins on its surface. Such a heat sink 5 has a large surface area and is excellent in heat dissipation.

The ratio S RB /S _B of the apparent area S _RB of the heat sink 5 (area not taking into account irregularities) and the area S _B of the back surface of the light control device _2A is preferably 0.05 or more, and 0.05 or more. More preferably, it is 5 or more. The larger the ratio S _RB /S _B is, the higher the heat dissipation is. Note that the upper limit value of the ratio S _RB /S _B is, for example, 1. The ratio S _RB /S _B may be greater than 1.

The minimum thickness of the heat sink 5 is preferably 50 μm or more, more preferably 500 μm or more. When the minimum thickness of the heat sink 5 is increased, the heat capacity of the heat sink 5 increases, and the thermal resistance of the heat sink 5 decreases. Although there is no upper limit to the minimum thickness of the heat sink 5, if the minimum thickness of the heat sink 5 is increased, the display device 1B becomes thicker. From this point of view, it is preferable that the minimum thickness of the heat sink 5 is 5 mm or less.

The heat transfer body is provided inside the laminate. The heat transfer body guides heat from the reflective layer 35 to the heat dissipation body 5.

The heat transfer body here consists of a main heat transfer body 29 and an auxiliary heat transfer body 6. Moreover, here, the heat transfer body is located at least partially within the through hole of the light control device 2B.

Specifically, the main heat transfer body 29 is made of a highly thermally conductive material that fills a through hole provided in the light control device 2B. The main heat transfer body 29 may be one in which the side wall of a through hole provided in the light control device 2B is coated with a highly thermally conductive material. The main heat transfer body 29 promotes heat transfer from the reflective layer 35 to the heat dissipation body 5 .

The auxiliary heat transfer body 6 is installed between the main heat transfer body 29 and the reflective layer 35. The auxiliary heat transfer body 6 is made of a highly thermally conductive material. The auxiliary heat transfer body 6 promotes heat transfer from the reflective layer 35 to the main heat transfer body 29. The auxiliary heat transfer body 6 can be omitted.

The main heat transfer body 29 and the auxiliary heat transfer body 6 are made of a highly thermally conductive material as described above. As the highly thermally conductive material, for example, those exemplified for the heat sink 5 can be used. Each of the main heat transfer body 29 and the auxiliary heat transfer body 6 may have a single layer structure or a multilayer structure.

In this display device 1B, the light emitting element 25 is the main heat source. The other part of the heat generated in the light emitting element 25 is radiated to the outside air via the black matrix substrate 3, similarly to the display device 1A. Another part of the heat generated in the light emitting element 25 is guided to the heat sink 5 installed outside the laminate via the reflective layer 35 and the heat transfer body. Therefore, this display device 1B is less likely to accumulate heat inside the laminate, and is particularly excellent in heat dissipation.

Furthermore, in the display device 1B, since the heat sink 5 is provided on the back surface, the heat sink 5 does not interfere with display. Therefore, various structures can be adopted for the heat sink 5.

Furthermore, in the display device 1B, a partition layer including a resin layer having through holes and a metal layer covering the resin layer is provided on the black matrix substrate, so a large partition wall can be formed on the LED substrate. In some cases, the partition wall can be omitted from the LED board. Therefore, ease of manufacture, high reflectance, and high light shielding properties can be achieved without reducing yield.

<3> Modifications Various modifications can be made to the display device and black matrix substrate described above, as exemplified below.

For example, in the display device 1B, the heat transfer body that thermally connects the reflective layer 35 and the heat dissipation body 5 is at least partially located outside the laminate of the light control device 2B, the black matrix substrate 3, and the adhesive layer 4. You may provide it so that it may be located. For example, the heat transfer body may be provided on the end face of the laminate.

Alternatively, the display device 1A further includes a front heat dissipation layer as a heat dissipation body, which is provided on the second main surface of the transparent substrate 31 and is open at the position of the first through hole provided in the black matrix 32. Good too. In this case, the display device 1A may further include a heat conductor that thermally connects the reflective layer 35 and the front heat dissipation layer. The heat transfer body may be provided inside the laminate of the light control device 2A, the black matrix substrate 3, and the adhesive layer 4, or may be provided at least partially outside the laminate.

In an electronic device including a display device, the display device is usually installed in a casing so that the front surface of the display device is exposed to the outside of the electronic device and the back surface is adjacent to the internal space of the casing. Therefore, when the display device 1A provided with a front heat dissipation layer as a heat dissipation body is mounted on an electronic device, heat exchange is likely to occur between the heat dissipation body and the outside air.

The display device 1B may also further include the above-described front heat dissipation layer. In this case, the display device 1B may further include a heat conductor that thermally connects the reflective layer 35 and the front heat dissipation layer.

A configuration different from that shown in FIG. 2 can be adopted for the circuit provided in the light control devices 2A, 2B, etc.
For example, the video signal line driver VDR may supply a current signal as a video signal to the video signal line VSL. In this case, in each of the first sub-pixel PXR, the second sub-pixel PXG, and the third sub-pixel PXB, during the write period in which the video signal is written, the gate-source voltage of the drive control element DR is equal to this current signal. It may be set to a corresponding value, and a drive current having a magnitude corresponding to the gate-source voltage may be caused to flow through the light emitting element D during the light emitting period. Furthermore, instead of employing a circuit for displaying an image using an active matrix drive method, a circuit for displaying an image using a passive matrix drive method may be employed in the light control devices 2A and 2B.

Instead of using a blue light emitting diode as the light emitting element 25, an ultraviolet light emitting diode may be used. In this case, the filling layer 36B is a wavelength conversion layer that converts the light emitted by the light emitting element 25 of the third sub-pixel PXB into third light having a different color from the first light and the second light. For example, the first wavelength conversion layer 36R, the second wavelength conversion layer 36G, and the filling layer 36B convert the ultraviolet light emitted by the light emitting element 25 into red light, green light, and blue light, respectively.

Instead of using a single type of light emitting diode as the light emitting element 25, multiple types of light emitting diodes may be used, for example, in the first subpixel PXR, the second subpixel PXG, and the third subpixel PXB. , a red light emitting diode, a green light emitting diode and a blue light emitting diode, respectively. In this case, a layer similar to that described above for the base layer 33B is provided instead of the first colored layer 33R and the second colored layer 33G, and a filling layer is provided instead of the first wavelength conversion layer 36R and the second wavelength conversion layer 36G. Layers similar to those described above for layer 36B may be provided.

Although the display device described above is capable of displaying a color image, the display device may also display a monochrome image. For example, in the display device 1A, the first sub-pixel PXR and the second sub-pixel PXG are omitted, a blue light emitting diode is used as the light emitting element 25, and the filling layer 36B is a wavelength conversion layer that converts blue light into yellow light. do. When the filling layer 36B converts a portion of the blue light incident thereon into yellow light and transmits the rest, it is possible to display white by additive color mixing of blue and yellow.

The black matrix substrate may further include an overcoat layer interposed between the black matrix 32 and the resin layer 34. The overcoat layer can include a transparent resin and one or more of a UV absorber, a yellow pigment, and transparent particles. The overcoat layer containing an ultraviolet absorber can absorb ultraviolet light when the stray light incident on the resin layer 34 is ultraviolet light.

Display devices other than micro LED displays may also be used, such as organic electroluminescent displays. However, it is preferable that the display device includes a light emitting element.

1A...Display device, 1B...Display device, 2A...Dimmer, 2B...Dimmer, 3...Black matrix substrate, 4...Adhesive layer, 5...Heat radiator, 6...Auxiliary heat transfer body, 21...Substrate, 22 ... Semiconductor layer, 23A... Conductor layer, 23B... Conductor layer, 23C... Conductor layer, 23D... Conductor layer, 24A... Insulating layer, 24B... Insulating layer, 24C... Insulating layer, 25... Light emitting element, 26... Partition layer, 27 ...Filled layer, 28...Conductor layer, 29...Main heat transfer body, 31...Transparent substrate, 32...Black matrix, 33B...Underlayer, 33G...Second colored layer, 33R...First colored layer, 34...Resin layer, 35... Reflection layer, 36B... Filling layer, 36G... Second wavelength conversion layer, 36R... First wavelength conversion layer, 251... First layer, 252... Second layer, 253... Third layer, C... Capacitor, D... Light emitting element, DR...drive control element, PSL...power supply line, PX...pixel, PXB...third sub-pixel, PXG...second sub-pixel, PXR...first sub-pixel, SDR...scanning signal line driver, SSL...scanning signal line, SW...switch, VDR...video signal line driver, VSL...video signal line.

Claims (13)

a transparent substrate having a first main surface and a second main surface;
a black matrix provided on the first main surface and having a plurality of first through holes;
a resin layer provided on the black matrix and having a plurality of second through holes at the positions of the plurality of first through holes, respectively;
a reflective layer that at least partially covers the side walls of each of the plurality of second through holes and the upper surface of the resin layer;
A black matrix substrate in which a portion of the reflective layer that covers the upper surface has an arithmetic mean height S _a in a range of 40 to 650 nm and a kurtosis S _ku of 3 or more. The black matrix substrate according to claim 1, wherein the portion of the reflective layer that covers the side wall has an arithmetic mean height S _a in a range of 40 to 650 nm and a kurtosis S _ku of 3 or more. The black matrix substrate according to claim 1, wherein the reflective layer further partially covers the black matrix. The black matrix substrate according to claim 1, further comprising a plurality of wavelength conversion layers each provided in at least a portion of the plurality of second through holes. 2. The black matrix substrate according to claim 1, further comprising a color filter including a plurality of colored layers disposed at at least some positions of the plurality of first through holes. The black matrix substrate according to claim 1, wherein the reflective layer includes a layer made of metal or an alloy. A black matrix substrate according to any one of claims 1 to 6,
a light control device installed to face the first main surface;
A display device comprising: an adhesive layer interposed between the black matrix substrate and the light control device to bond them together. a heat sink located outside the laminate of the black matrix substrate, the light control device, and the adhesive layer;
The display device according to claim 7, further comprising a heat transfer body that guides heat from the reflective layer to the heat radiator. 9. The display device according to claim 8, wherein the heat radiator includes a back heat radiator provided to face the black matrix substrate with the light control device and the adhesive layer interposed therebetween. The display device according to claim 9, wherein the back heat radiator is a back heat radiator layer provided on the light control device. The display device according to claim 9, wherein the light control device is provided with one or more through holes, and the heat transfer body is located at least partially within the one or more through holes. The display device according to claim 7, wherein the light control device includes a plurality of light emitting elements. The display device according to claim 7, wherein the light control device includes a plurality of light emitting diodes.