JP2017195135A - Organic electroluminescent element - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an organic EL element having a heat dissipation function while suppressing a configuration from being complex.SOLUTION: An organic EL element includes: a transparent base material 1; a transparent first electrode layer 2 on one surface of the transparent base material; an organic EL layer 3 which includes a luminous layer and is on a surface of the first electrode layer, the surface being on an opposite side to the transparent base material; a second electrode layer 4 on a surface of the organic EL layer, the surface being on an opposite side to the first electrode layer; an insulating member 5 on a laminate that comprises the first electrode layer, the organic EL layer, and the second electrode layer; and a heat dissipation member 6 which is on a surface of the insulating member, the surface being on an opposite side to the laminate, faces the second electrode layer, and contains a metal material.SELECTED DRAWING: Figure 1

Description

  An embodiment of the present disclosure relates to an organic electroluminescence element having a heat dissipation function.

  The organic electroluminescence element has high visibility due to self-coloring, is an all-solid-state display unlike a liquid crystal display device, has excellent impact resistance, has a fast response speed, is less affected by temperature changes, and Advantages such as a wide viewing angle are attracting attention. Hereinafter, organic electroluminescence may be abbreviated as organic EL.

  On the other hand, the organic EL element has a problem that heat is retained inside the organic EL element due to heat generation during driving. The heat accumulated inside the organic EL element deteriorates each layer constituting the organic EL element, and as a result, the light emission efficiency is lowered. For such a problem, for example, as disclosed in Patent Document 1, a technique is provided in which a heat dissipation member is provided in an organic EL element, and heat accumulated in the organic EL element is dissipated outside the organic EL element. Proposed.

JP 2010-080307 A

  By the way, when a heat radiating member is provided in an organic EL element, there exists an effect that the deterioration of each functional layer which comprises an organic EL element, and the fall of the luminous efficiency by it can be suppressed. On the other hand, when the heat dissipation member is provided in the organic EL element, there is a problem that the configuration of the organic EL element becomes complicated and the process of manufacturing the organic EL element becomes complicated. Further, since the configuration of the organic EL element is complicated, there is a problem that the reliability of the organic EL element is lowered.

  The present disclosure has been made in view of the above problems, and a main object of the present disclosure is to provide an organic EL device having a heat dissipation function while suppressing the organic EL device from having a complicated configuration.

  One embodiment of the present disclosure includes a transparent substrate, a transparent first electrode layer on one surface of the transparent substrate, and a light emitting layer, and the first electrode layer is opposite to the transparent substrate. An organic EL layer on the surface, a second electrode layer on the surface of the organic EL layer opposite to the first electrode layer, the first electrode layer, the organic EL layer, and the second electrode layer. An organic EL device comprising: an insulating member on the laminate including the insulating member; and a heat dissipating member including a metal material on the surface of the insulating member opposite to the laminated body and facing the second electrode layer. An element is provided.

  In one embodiment of the present disclosure, the heat dissipation member provides an organic EL element having a concavo-convex shape on a surface opposite to the laminate.

  In one embodiment of the present disclosure, the heat dissipating member includes a counter substrate on a surface opposite to the insulating member, and a sealing member on the insulating member. An organic EL element in which the laminate is sealed by a stop member and the heat dissipation member is provided.

  In one embodiment of the present disclosure, the counter substrate provides an organic EL element having a through hole.

  In one embodiment of the present disclosure, an organic EL display device including the above-described organic EL element and a color filter having a plurality of colored portions and a light shielding portion between the plurality of colored portions is provided.

  In one embodiment of the present disclosure, there is an effect that an organic EL element having a heat dissipation function can be obtained while suppressing a complicated configuration of the organic EL element.

It is a schematic sectional drawing which shows an example of the organic EL element of a 1st embodiment. It is a schematic sectional drawing which shows the other example of the organic EL element of a 1st embodiment. It is explanatory drawing for demonstrating the heat radiating member in a 1st embodiment. It is explanatory drawing for demonstrating the heat radiating member in a 1st embodiment. It is a schematic sectional drawing which shows an example of the organic EL element of a 2nd embodiment. It is a schematic sectional drawing which shows the other example of the organic EL element of a 2nd embodiment. It is a schematic plan view which shows the other example of the organic EL element of a 2nd embodiment. It is a schematic process drawing which shows an example of the manufacturing method of the heat radiating member in a 2nd embodiment. FIG. 3 is a schematic process diagram illustrating a method for producing an organic EL element in Example 1. It is a schematic sectional drawing which shows an example of the conventional organic EL element.

  In this specification, when a certain configuration such as a certain member or a certain region is “above (or below)” another configuration such as another member or another region, unless otherwise limited, This includes not only when directly above (or directly below) another configuration, but also when above (or below) another configuration, i.e., another configuration above (or below) another configuration. This includes cases where elements are included.

  Hereinafter, embodiments of the present disclosure will be described with reference to the drawings. However, the present disclosure can be implemented in many different modes, and should not be construed as being limited to the description of the embodiments described below. Further, in order to clarify the description, the drawings may be schematically represented with respect to the width, thickness, shape, etc. of each part as compared with the embodiment, but are merely examples, and the interpretation of the present disclosure may be interpreted. It is not limited. In addition, in the present specification and each drawing, elements similar to those described above with reference to the previous drawings are denoted by the same reference numerals, and detailed description may be omitted as appropriate. Further, for convenience of explanation, the description may be made using the terms “upper” or “lower”, but the vertical direction may be reversed.

I. Organic EL Device Hereinafter, the organic EL device according to one embodiment of the present disclosure will be described by being divided into a first embodiment and a second embodiment.

A. 1st embodiment The organic EL element of 1st embodiment contains a transparent base material, the transparent 1st electrode layer on one side of the said transparent base material, and a light emitting layer, The said transparent of the said 1st electrode layer An organic EL layer on a surface opposite to the substrate; a second electrode layer on the surface of the organic EL layer opposite to the first electrode layer; the first electrode layer; the organic EL layer; An insulating member on the laminate having the second electrode layer, and a heat dissipating member including a metal material on the surface of the insulating member opposite to the laminate and facing the second electrode layer And having.

The organic EL element of the first embodiment will be described with reference to the drawings.
FIG. 1 is a schematic cross-sectional view showing an example of the organic EL element of the first embodiment. As illustrated in FIG. 1, the organic EL element 10 of the first embodiment includes a transparent substrate 1, a transparent first electrode layer 2 on one surface of the transparent substrate 1, and a light emitting layer. It has the organic EL layer 3 on the surface on the opposite side to the transparent base material 1 of the 1 electrode layer 2, and the 2nd electrode layer 4 on the surface on the opposite side to the 1st electrode layer 2 of the organic EL layer 3. Moreover, the organic EL element 10 of the first embodiment includes the insulating member 5 on the stacked body 11 having the first electrode layer 2, the organic EL layer 3, and the second electrode layer 4, and the stacked body 11 of the insulating member 5. It has the heat radiating member 6 which is on the opposite surface and faces the second electrode layer 4.

According to the organic EL element 10 of the first embodiment shown in FIG. 1, the laminate 11 having the first electrode layer 2, the organic EL layer 3, and the second electrode layer 4 is disposed on the transparent base material 1. Since the insulating member 5 is disposed so as to cover the body 11 and the heat radiating member 6 is disposed on the insulating member 5, the configuration of the organic EL element is complicated compared to the conventional organic EL element having the heat radiating member. Thus, an organic EL element having an excellent heat dissipation function can be obtained.
The specific reason why such an effect can be obtained is presumed as follows.

For example, as shown in FIG. 10, a conventional organic EL element having a heat radiating member has a first electrode layer 2, an organic EL layer 3, and a second electrode layer 4 disposed on a transparent substrate 1, with these interposed therebetween. The opposing base material 8 is arranged by the sealing member 7 so as to face the transparent base material 1, and the heat dissipation member 6 is arranged on the opposing base material 8. As described above, the conventional organic EL element 10 ′ shown in FIG. 10 requires two substrates, the transparent substrate 1 and the counter substrate 8, and sealing for sealing these two substrates. Since the member 7 is required, there is a problem that the configuration of the organic EL element becomes complicated. Moreover, when two base materials are required, there is a problem that the thickness as the organic EL element becomes relatively thick, and it is difficult to impart desired flexibility to the organic EL element.
On the other hand, as shown in FIG. 1, the organic EL element of the first embodiment is sufficient if it has only the transparent substrate 1, and does not require a counter substrate or a sealing member as in the prior art. Therefore, it is considered that the configuration of the organic EL element can be simplified as compared with the conventional one. Moreover, the organic EL element of 1st embodiment can make thickness as an organic EL element thin compared with the past by having the structure mentioned above, and gives desired flexibility to an organic EL element. It is thought that you can.

Moreover, the conventional organic EL element which has a heat radiating member has the area | region S where the transparent base material 1 and the opposing base material 8 were sealed with the sealing member 7, as shown in FIG. Such a region S is usually a void or filled with a heat-dissipating liquid or a heat-dissipating gel. When the region S is a void, there is a problem that heat generated during driving of the organic EL element stays in the region S, that is, the void. Even if such a conventional organic EL element has a heat radiating member, the heat accumulated in the gap of the organic EL element cannot be released sufficiently to the outside of the organic EL element. There exists a problem that the 1st electrode layer, organic EL layer, 2nd electrode layer, etc. which comprise are deteriorated. In addition, since the heat staying in the voids tends to stay upward, the functional layer disposed above the organic EL element tends to be particularly deteriorated.
Furthermore, when the region S is filled with a heat-dissipating liquid, a heat-dissipating gel, or the like, the heat-dissipating liquid or the heat-dissipating gel deteriorates when the heat generated in the driving of the organic EL element becomes high. There is a problem of end. Therefore, even in the case where the region S is filled with a heat-dissipating liquid or a heat-dissipating gel, it is difficult to maintain excellent heat dissipation in an organic EL element that continues to emit light with high brightness for a long time. In addition, when the area | region S is filled with the thermal radiation liquid or the thermal radiation gel, there also exists a problem that the structure of an organic EL element will become still more complicated. Furthermore, when the region S is filled with a heat-dissipating liquid, a heat-dissipating gel, or the like, even if the organic EL element has flexibility, when the organic EL element is bent, the heat-dissipating liquid, the heat-dissipating gel, etc. May leak out.
On the other hand, as shown in FIG. 1, the organic EL element of the first embodiment has the insulating member 5 formed so as to cover the first electrode layer 2, the organic EL layer 3, and the second electrode layer 4. Compared with the conventional organic EL element, the region S can be reduced. Therefore, heat generated during driving of the organic EL element can be suppressed from staying in the organic EL element, and sufficient heat dissipation can be performed by the heat dissipation member. Therefore, an organic EL element having an excellent heat dissipation function can be obtained without complicating the configuration of the organic EL element.

  In the organic EL element of the first embodiment, the heat dissipation member may have an uneven shape on the surface opposite to the laminate.

  FIG. 2 is a schematic cross-sectional view showing another example of the organic EL element of the first embodiment. In the organic EL element 10 of the first embodiment illustrated in FIG. 2, the heat dissipating member 6 has a concavo-convex shape on the surface opposite to the laminated body 11. In addition, since the other structure of an organic EL element can be made the same as that of the organic EL element illustrated in FIG. 1 mentioned above, description here is abbreviate | omitted.

According to the organic EL element 10 shown in FIG. 2, the organic EL element having a more excellent heat dissipation function can be obtained by having a concavo-convex shape on the surface opposite to the laminate 11 of the heat dissipation member 6. Can do.
The specific reason why such an effect can be obtained is presumed as follows.

In the conventional organic EL element, for example, as shown in FIG. 10, the surface of the heat dissipation member 6 has flatness.
On the other hand, the organic EL element of the first embodiment has an uneven shape on the surface opposite to the laminated body 11 of the heat radiating member 6 as shown in FIG. Therefore, the organic EL element of the first embodiment can increase the contact area between the heat radiating member and the air as compared to the conventional organic EL element having a heat radiating member having a flat surface. It is considered that heat can be diffused into the air and excellent heat dissipation can be exhibited.

  Hereinafter, each structure in the organic EL element of the first embodiment will be described.

1. Heat Dissipation Member The heat dissipation member in the first embodiment is a member including a metal material on the surface opposite to the laminated body of insulating members and facing the second electrode layer.

  The heat radiating member in the first embodiment may be a member containing a metal material, and among them, a member having a desired heat radiating property is preferable. Examples of the metal material included in the heat dissipation member include aluminum, copper, copper alloy, phosphor bronze, stainless steel (SUS), gold, gold alloy, nickel, nickel alloy, silver, silver alloy, tin, tin alloy, titanium, Iron, iron alloy, zinc, molybdenum, etc. are mentioned. Especially, it is preferable to use aluminum and copper for the heat dissipation member in the first embodiment, and it is particularly preferable to use aluminum. This is because the metal material described above has excellent heat dissipation and is relatively inexpensive. Moreover, you may use a metal paste as a metal material mentioned above.

  The heat dissipation member in the first embodiment is not particularly limited as long as it is a member containing a metal material, but for example, a metal base material is preferably used. This is because the metal base material has high thermal conductivity, so that the heat accumulated inside the organic EL element can be effectively dissipated outside the organic EL element. When the heat radiating member is a metal substrate, the heat radiating member may be composed of a single layer of the metal substrate or may be composed of two or more layers including the metal substrate.

  The heat radiating member in the first embodiment preferably has a concavo-convex shape on the surface opposite to the laminate. A heat radiating member having a concavo-convex shape on the surface has a larger surface area than a heat radiating member having a flat surface. Therefore, in the case of a heat radiating member having an uneven shape on the surface, the contact area between the heat radiating member surface and air is increased, and more heat can be diffused to exhibit excellent heat dissipation.

  The uneven shape formed on the heat radiating member is preferably a shape that can increase the surface area of the heat radiating member and increase the contact area with air. Examples of the shape of the convex portion in the concavo-convex shape include a cone shape and a cone shape. Further, the upper and bottom surfaces of the convex portion when the heat radiating member is cut in the thickness direction may be flat as indicated by reference numeral 61 in FIG. 3B, or as indicated by reference numeral 61 in FIG. It may be a curved surface. Furthermore, the cross-sectional shape of the convex portion when the heat radiating member is cut in the thickness direction may be a triangular shape as shown in FIG. 3A, or a rectangular shape such as a trapezoid as shown in FIG. There may be, and a semicircle may be sufficient as shown in FIG.3 (c).

  Moreover, although the shape of the recessed part in uneven | corrugated shape can be suitably selected according to the shape of the convex part mentioned above, a cone shape and a cone shape are mentioned, for example. Furthermore, the lower bottom surface of the recess when the heat radiating member is cut in the thickness direction may be flat, for example, as indicated by reference numeral 62 in FIG. 4A, or as indicated by reference numeral 62 in FIG. It may be curved. Furthermore, the cross-sectional shape of the recess when the heat radiating member is cut in the thickness direction may be a trapezoidal rectangle as shown in FIG. 4 (a) or a semicircular shape as shown in FIG. 4 (b). There may be.

  The formation method of the uneven | corrugated shape in a heat radiating member will not be specifically limited if it is a method which can form desired uneven | corrugated shape on the surface of a heat radiating member. For example, a method of directly embossing, etching, sandblasting, frosting, stamping, etc. on the surface of a metal substrate, a method of forming a concavo-convex pattern using a photoresist, a plating method, etc. It is done. In the case of embossing, for example, an uneven shape can be formed by pressing a rolling roll having unevenness on the surface of a metal substrate. Moreover, in the case of an etching process, an etching agent can be selected according to the kind of metal base material. In a 1st embodiment, it is preferable to form an uneven | corrugated shape in the surface of a heat radiating member using embossing.

  The heat dissipation member in the first embodiment preferably has a predetermined thickness. The thickness of the heat radiating member is, for example, preferably 1 μm or more, more preferably 5 μm or more, and particularly preferably 10 μm or more. Moreover, as thickness of a heat radiating member, it is preferable that it is 3000 micrometers or less, for example, it is preferable that it is 2000 micrometers or less especially, and it is especially preferable that it is 1000 micrometers or less. When the thickness of the heat radiating member is within the above range, for example, even when the organic EL element has flexibility, the heat radiating member can sufficiently follow. Therefore, when the organic EL element is bent, it is possible to suppress a problem that the heat radiating member does not follow and is peeled off or damaged. Moreover, the function as a heat radiating member can fully be exhibited because the thickness of a heat radiating member is in the said range. In addition, the thickness of the heat radiating member here points out the distance shown with the code | symbol T of FIG. 1, FIG. 2, for example.

  As a method for forming the heat radiating member in the first embodiment, for example, a method of forming a metal vapor deposition film on the insulating member using a general vapor deposition method, or a metal plating film using a general plating method on the insulating member And a method of bonding a metal foil on an insulating member via an adhesive such as an epoxy resin. In addition, since the adhesive agent used here can be made to be the same as what is generally used for an organic EL element, description here is abbreviate | omitted.

2. 1st electrode layer The 1st electrode layer in a 1st embodiment is a transparent member arranged on one side of the transparent substrate mentioned below. In the organic EL element of the first embodiment, light is extracted from the first electrode layer side.

  The first electrode layer in the first embodiment has predetermined transparency. The transparency of the first electrode layer is preferably such that the light emitted from the organic EL layer can be transmitted and display can be performed. For example, the transmittance in the visible light region is 80% or more. Is preferable, and 90% or more is more preferable.

  The first electrode layer may be an anode or a cathode. As a material of the first electrode layer, a material used for a general organic EL element can be used. For example, indium tin oxide called ITO, indium zinc oxide called IZO, indium oxide, tin oxide Etc. In addition, a material in which metal particles such as silver nanowires and metal nanowires such as copper nanowires are dispersed in a binder resin may be used as the first electrode layer.

  The thickness of the first electrode layer can be adjusted as appropriate according to the application of the organic EL element and the like, and is not particularly limited.

  The formation method of a 1st electrode layer can be suitably selected according to the structure of an organic EL element, and a 1st electrode layer may be formed in the whole surface of a transparent base material, and a 1st electrode layer is formed in pattern shape You may do it. Since the specific formation method of the first electrode layer can be the same as the general electrode formation method, description thereof is omitted here.

3. Organic EL Layer The organic EL layer in the first embodiment is a member that includes a light emitting layer and is disposed on the surface of the first electrode layer opposite to the transparent substrate.

  The organic EL layer in the first embodiment is a member having one or more organic layers including a light emitting layer. That is, the organic EL layer is a member including at least a light emitting layer, and is a member having a layer configuration of one or more organic layers. Usually, when forming an organic EL layer by a wet process, it is often composed of one or two organic layers because it is difficult to stack a large number of layers in relation to the solvent, It is possible to further increase the number of layers by devising organic materials or combining vacuum deposition methods.

  Examples of the layer constituting the organic EL layer other than the light emitting layer include a hole injection layer, an electron injection layer, a hole transport layer, and an electron transport layer. The hole transport layer may be integrated with the hole injection layer by imparting a hole transport function to the hole injection layer. In addition, the electron transport layer may be integrated with the electron injection layer by adding an electron transport function to the electron injection layer. Furthermore, as a layer which comprises an organic electroluminescent layer, the layer for preventing the penetration of a hole or an electron like a carrier block layer, and improving a recombination efficiency is mentioned.

  Hereinafter, each structure of the organic EL layer in the first embodiment will be described.

(A) Light-emitting layer Examples of the material used for the light-emitting layer in the first embodiment include light-emitting materials such as dye-based materials, metal complex-based materials, and polymer-based materials.

  Examples of dye-based materials include cyclopentadiene derivatives, tetraphenylbutadiene derivatives, triphenylamine derivatives, oxadiazole derivatives, pyrazoloquinoline derivatives, distyrylbenzene derivatives, distyrylarylene derivatives, silole derivatives, thiophene ring compounds, pyridine Examples thereof include ring compounds, perinone derivatives, perylene derivatives, oligothiophene derivatives, trifumanylamine derivatives, oxadiazole dimers, and pyrazoline dimers.

  Examples of the metal complex-based material include aluminum quinolinol complex, benzoquinolinol beryllium complex, benzoxazole zinc complex, benzothiazole zinc complex, azomethyl zinc complex, porphyrin zinc complex, and eurobium complex. Or a metal complex having a rare earth metal such as Tb, Eu, or Dy and having a oxadiazole, thiadiazole, phenylpyridine, phenylbenzimidazole, quinoline structure, or the like as a ligand.

  Furthermore, examples of the polymer material include polyparaphenylene vinylene derivatives, polythiophene derivatives, polyparaphenylene derivatives, polysilane derivatives, polyacetylene derivatives, polyvinylcarbazole, polyfluorene derivatives, polyquinoxaline derivatives, and copolymers thereof. Is mentioned.

  The light emitting layer in the first embodiment may contain a doping agent for the purpose of improving the light emission efficiency and changing the light emission wavelength. Examples of the doping agent include perylene derivatives, coumarin derivatives, rubrene derivatives, quinacridone derivatives, squalium derivatives, porphyrin derivatives, styryl dyes, tetracene derivatives, pyrazoline derivatives, decacyclene, phenoxazone, quinoxaline derivatives, carbazole derivatives, fluorene derivatives, and the like. It is done.

  The thickness of the light emitting layer in the first embodiment is not particularly limited as long as it can provide a function of emitting light by providing a recombination field between electrons and holes. Moreover, it can be 500 nm or less.

  The light emitting layer in the first embodiment may be formed in a pattern so as to have light emitting portions of a plurality of colors such as red, green, and blue. Thereby, an organic EL element capable of color display can be obtained.

  As a method for forming a light emitting layer in the first embodiment, a general method for forming a light emitting layer can be adopted, and either a wet process or a dry process can be used. For example, vacuum deposition, printing, inkjet, die coating, spin coating, casting, dipping, bar coating, slit coating, blade coating, roll coating, gravure coating, gravure offset printing, Examples include a flexographic printing method, a spray coating method, and a self-organizing method.

(B) Hole injection layer and hole transport layer In the first embodiment, the hole transport layer is integrated with the hole injection layer by adding a hole transport function to the hole injection layer. There is. That is, the hole injection layer may have only a hole injection function, or may have both a hole injection function and a hole transport function.

  The material used for the hole injection layer is not particularly limited as long as the material can stabilize the injection of holes into the light emitting layer. In addition, phenylamine, starburst amine, phthalocyanine, vanadium oxide, molybdenum oxide, ruthenium oxide, aluminum oxide, titanium oxide and other oxides, amorphous carbon, polyaniline, polythiophene, polyphenylene vinylene derivatives, etc. can be used. . Specifically, bis (N-((1-naphthyl) -N-phenyl) benzidine (α-NPD), 4,4 ′, 4 ″ -tris (3-methylphenylphenylamino) triphenylamine (m- MTDATA), poly (3,4-ethylenedioxythiophene) -polystyrene sulfonic acid (PEDOT-PSS), polyvinylcarbazole (PVCz) and the like.

  Further, the thickness of the hole injection layer is not particularly limited as long as the hole injection function and the hole transport function are sufficiently exhibited, but specifically, it is preferably 0.5 nm or more, It is preferable that it is 10 nm or more. In addition, the thickness of the hole injection layer is preferably 500 nm or less, and more preferably 200 nm or less.

  Since the method for forming the hole injection layer can be the same as the method for forming the light emitting layer described above, description thereof is omitted here.

(C) Electron injection layer and electron transport layer In the first embodiment, the electron transport layer may be integrated with the electron injection layer by imparting an electron transport function to the electron injection layer. That is, the electron injection layer may have only an electron injection function, or may have both an electron injection function and an electron transport function.

  The material used for the electron injection layer is not particularly limited as long as the material can stabilize the injection of electrons into the light emitting layer. In addition to the compounds exemplified as the light emitting material of the light emitting layer, Aluminum lithium alloy, lithium fluoride, sodium fluoride, strontium, magnesium oxide, magnesium fluoride, strontium fluoride, calcium fluoride, barium fluoride, aluminum oxide, strontium oxide, calcium, polymethyl methacrylate, sodium polystyrene sulfonate, Examples include lithium, cesium, cesium fluoride, alkali metals, alkali metal halides, alkali metal organic complexes, and the like.

  Alternatively, a metal doped layer in which an alkali metal or alkaline earth metal is doped on an electron transporting organic material may be formed and used as an electron injection layer. Examples of the electron-transporting organic material include bathocuproin, bathophenanthroline, and phenanthroline derivatives. Examples of the metal to be doped include Li, Cs, Ba, and Sr. In addition, other examples include 8-hydroxyquinolinolato-lithium called Liq.

  The thickness of the electron transport layer is not particularly limited as long as the electron transport function is sufficiently exerted.

  Since the formation method of an electron carrying layer can be made the same as the formation method of the light emitting layer mentioned above, description here is abbreviate | omitted.

4). Second electrode layer The second electrode layer in the first embodiment is a member disposed on the surface of the organic EL layer opposite to the first electrode layer.

  The second electrode layer in the first embodiment may be an anode or a cathode. Examples of the material of the second electrode layer include metals such as Li, Na, Mg, Al, Ca, Ag, and In, or alloys containing one or more of these metals, such as MgAg, AlLi, AlCa, and AlMg. An alloy is mentioned. Among them, Al, Ag metal, or alloys containing Al and Ag such as MgAg, AlLi, AlCa, and AlMg are preferably used.

  The thickness of the second electrode layer is not particularly limited as long as it can function as the second electrode layer. For example, the thickness is preferably 10 nm or more, and more preferably 50 nm or more. . In addition, the thickness of the second electrode layer is preferably 1 μm or less, and more preferably in the range of 500 nm or less.

  The formation method of a 2nd electrode layer can be suitably selected according to the structure of an organic EL element. Since a specific method for forming the second electrode layer can be the same as a general electrode forming method, description thereof is omitted here.

5. Insulating Member The insulating member in the first embodiment is a member disposed on the laminate having the first electrode layer, the organic EL layer, and the second electrode layer described above.

  In the first embodiment, the insulating member may be disposed on the entire surface of the multilayer body including the first electrode layer, the organic EL layer, and the second electrode layer, or may not be disposed on the entire surface of the multilayer body. . When the insulating member is disposed on the entire surface of the laminate, the insulating member preferably has a sealing property. On the other hand, when the insulating member is not disposed on the entire surface of the laminate, the insulating member is partially disposed and usually does not have a sealing property. Therefore, for example, when the insulating member is not disposed on the entire surface of the multilayer body, the insulating member is disposed so that at least the second electrode layer in the multilayer body and the heat dissipation member disposed on the second electrode layer do not contact each other. It is arrange | positioned and it is preferable to have the sealing member etc. which have sealing performance as other members.

  The material of the insulating member in the first embodiment is not particularly limited as long as it is a material that can be used for a general organic EL element, and either an organic material or an inorganic material can be used. Examples of the organic material include polyimide resin, fluorine resin, silicone resin, urethane resin, nylon resin, epoxy resin, PEEK resin, acrylic resin, polyvinyl butyral resin, polyvinyl acetal resin, or the like, or parylene, Examples include parylene derivatives. Examples of the inorganic material include silicon oxide, silicon oxynitride, zinc oxide, titanium oxide, and aluminum oxide.

  The thickness of the insulating member is preferably a thickness that can sufficiently cover the first electrode layer, the organic EL layer, and the second electrode layer described above and can exhibit the function as the insulating member. For example, the thickness of the insulating member is preferably 0.005 μm or more, more preferably 0.01 μm or more, and particularly preferably 0.03 μm or more. Further, the thickness of the insulating member is preferably 500 μm or less, for example, preferably 100 μm or less, and particularly preferably 50 μm or less.

  The formation method of an insulating member will not be specifically limited if it can be formed so that the 1st electrode layer, organic electroluminescent layer, and 2nd electrode layer which were mentioned above may be covered. For example, it can be the same as a general method for forming an insulating member, and specifically includes a vapor deposition method, a coating method, and the like. Examples of the vapor deposition method include a resistance heating method, a sputtering method, a CVD method, and an ion plating method. Examples of the coating method include spin coating, die coating, dip coating, bar coating, gravure printing, and screen printing. Moreover, you may affix the insulating member formed previously so that the 1st electrode layer, organic electroluminescent layer, and 2nd electrode layer which were mentioned above may be covered.

6). Transparent substrate The transparent substrate in the first embodiment is a member that supports the heat dissipation member, the first electrode layer, the organic EL layer, the second electrode layer, and the insulating member described above.

  The transparent substrate in the first embodiment preferably has a predetermined transparency. The transparency of the transparent substrate is preferably such that the light emitted from the organic EL layer can be transmitted and displayed, and for example, the transmittance in the visible light region is 80% or more. Preferably, it is 90% or more. Here, the transmittance of the transparent substrate can be measured by a test method for the total light transmittance of a plastic-transparent material according to JIS K7361-1.

  The transparent substrate in the first embodiment may or may not have flexibility, and can be appropriately selected according to the use of the organic EL element. It is preferable. This is because flexibility can be imparted to the organic EL element of the first embodiment.

  Examples of the transparent base material include inflexible rigid materials such as quartz glass, Pyrex (registered trademark) glass, and synthetic quartz plates, or flexible materials such as resin films, optical resin plates, and thin glass. A flexible material having Note that the transparent substrate in the first embodiment may be a laminate in which a barrier layer is formed on a resin film.

  The thickness of the transparent base material can be appropriately selected according to the type of material used for the transparent base material, the use of the organic EL element, and the like, for example, 0.005 mm or more, and 5 mm It can be as follows.

7). Other Members The organic EL element of the first embodiment only needs to have the above-described members, and may have other members as necessary. About other members, since the member used for a general organic EL element can be employ | adopted, description here is abbreviate | omitted.

  The organic EL element of the first embodiment may have one light emitting unit between the first electrode layer and the second electrode layer, or has two or more light emitting units, for example, multiphoton light emission. It may have a structure. Specifically, an organic EL element having excellent luminance even at a low current density can be obtained by forming a light-emitting unit in which an electron transport layer and a light-emitting layer are stacked into a stack structure of two or three stages.

B. Second Embodiment The organic EL device of the second embodiment includes a transparent base material, a transparent first electrode layer on one surface of the transparent base material, and a light emitting layer, and the transparent electrode of the first electrode layer. An organic EL layer on a surface opposite to the substrate; a second electrode layer on the surface of the organic EL layer opposite to the first electrode layer; the first electrode layer; the organic EL layer; An insulating member on the laminate having the second electrode layer, and a heat dissipating member including a metal material on the surface of the insulating member opposite to the transparent base and facing the second electrode layer And have. Moreover, it has the opposing base material on the surface on the opposite side to the said insulating member of the said heat radiating member, and the sealing member on the said insulating member, The said transparent base material, the said sealing member, and the said heat radiating member The laminate is sealed.

The organic EL element of the second embodiment will be described with reference to the drawings.
FIG. 5 is a schematic cross-sectional view showing an example of the organic EL element of the second embodiment. As illustrated in FIG. 5, the organic EL element 10 according to the second embodiment includes a counter substrate 8 on the surface of the heat radiating member 6 opposite to the insulating member 5, and a sealing member 7 on the insulating member 5. The laminate 11 is sealed by the transparent base material 1, the sealing member 7 and the heat dissipation member 6. In addition, about the structure of the transparent base material 1, the 1st electrode layer 2, the organic EL layer 3, the 2nd electrode layer 4, the insulating member 5, and the heat radiating member 6, since it can be made the same as that of FIG. 1 mentioned above, here The description in is omitted.

According to the organic EL element 10 of the second embodiment shown in FIG. 5, the conventional organic EL element having a heat dissipating member is, for example, as shown in FIG. 7 has a region S sealed by 7. Such a region S is usually a void or filled with a heat-dissipating liquid or a heat-dissipating gel.
On the other hand, in the organic EL element of the second embodiment, as shown in FIG. 5, the insulating member 5 is provided so as to cover the laminate 11 having the first electrode layer 2, the organic EL layer 3, and the second electrode layer 4. It is formed and the laminated body 11 has the structure sealed with the transparent base material 1, the sealing member 7, and the heat radiating member 6. FIG. That is, the organic EL element of the second embodiment does not have the region S unlike the conventional organic EL element. Therefore, in the second embodiment, an organic EL element having an excellent heat dissipation function can be obtained without complicating the configuration of the organic EL element. The specific reason can be the same as the content described in the section “A. First Embodiment” described above, and therefore the description is omitted here.

  Moreover, as for the organic EL element of a 2nd embodiment, the said opposing base material may have a through-hole.

  FIGS. 6A and 6B are schematic cross-sectional views showing other examples of the organic EL element of the second embodiment. As illustrated in FIG. 6A, in the organic EL element 10 of the second embodiment, the opposing base material 8 may have a through hole. Further, in this case, as illustrated in FIG. 6B, the heat dissipation member 6 may have an external contact portion that is continuously arranged up to a position in contact with the outside through the through hole. In addition, since the other structure of an organic EL element can be made the same as that of the organic EL element illustrated in FIG. 5 mentioned above, description here is abbreviate | omitted.

  According to the organic EL element 10 shown in FIGS. 6A and 6B, since the heat radiating member 6 is in contact with the outside through the through hole of the counter substrate 8, the surface of the heat radiating member 6 is in contact with, for example, air. Compared with the case where the heat dissipation member is not in contact with air, the heat dissipation can be improved, and an organic EL element having a more excellent heat dissipation function can be obtained. Further, according to the organic EL element 10 shown in FIG. 6B, when the heat dissipation member 6 has an external contact portion that is continuously arranged to a position in contact with the outside through the through hole of the counter substrate 8. The above effect becomes remarkable.

  Here, “the heat dissipating member has an external contact portion continuously arranged to a position in contact with the outside through the through hole” means that, for example, the external contact portion in the heat dissipating member is shown in FIG. As described above, the surface 6 ′ of the region opposite to the laminated body 11 of the heat radiating member 6 and overlapping the through hole of the counter base material 8 in plan view is opposite to the heat radiating member 6 of the counter base material 8. Although it may be formed so that it may become the same plane as the surface of the side, although not illustrated, it may be formed so that it may protrude from the surface on the opposite side to the heat radiating member of an opposing base material. Furthermore, although not illustrated, it may be formed in a layer on the surface opposite to the laminate of the opposing base material. Further, the above-mentioned “outside” means a region outside the organic EL element, and usually means outside air such as air. Furthermore, the above-mentioned “external contact portion” is opposite to the laminated body of the heat radiating member from the boundary surface between the heat radiating member and the opposing base material when the cross section in the thickness direction of the organic EL element is observed in the heat radiating member. It is a surface on the side, and refers to a portion up to the surface of a region overlapping with the through hole of the opposing base material in plan view.

  Hereinafter, each structure in the organic EL element of the second embodiment will be described.

1. Heat Dissipation Member The heat dissipation member in the second embodiment is a member that includes a metal material and is disposed on a surface opposite to the laminated body and facing the second electrode layer.

  The heat radiating member in the second embodiment has an external contact portion that is continuously arranged to a position in contact with the outside through a through-hole formed in a counter substrate described later, whereby the heat radiating member comes into contact with air. Thus, it becomes possible to exhibit better heat dissipation.

  FIG. 7 is a schematic plan view showing an example in which the external contact portion of the heat dissipation member is exposed from a through hole formed in the counter substrate. As shown in FIG. 7, when the external contact portion in the heat radiating member 6 is exposed from the through hole formed in the counter substrate 8, the external contact portion exposed from the through hole formed in the counter substrate 8 The shape is not particularly limited. In FIG. 7, the shape of the external contact portion exposed from the counter substrate 8 in a plan view is a quadrangle, but may be a rectangle such as a trapezoid or a rectangle, for example, a triangle, a pentagon, or a circle although not shown. There is no particular limitation.

  When the external contact part in the heat radiating member is exposed from the through hole formed in the counter substrate, the number of pattern-shaped heat radiating members exposed from the through hole formed in the counter substrate is the size of the organic EL element. It adjusts suitably according to sheath and a use etc., and is not specifically limited. Especially, it is preferable that it is a grade from which desired heat dissipation is obtained, and it is preferable that the some external contact part is exposed from the through-hole formed in the opposing base material.

  When the external contact portions in the heat dissipation member are exposed from the through holes formed in the counter substrate, the plurality of external contact portions observed in a plan view of the counter substrate are in the X direction as shown in FIG. And may be regularly arranged in the Y direction, and although not shown, they may be arranged irregularly.

When the external contact portion in the heat radiating member is exposed from the through hole formed in the counter substrate, the area per one plan view of the external contact portion exposed from the through hole formed in the counter substrate is The organic EL element can be appropriately adjusted according to the size and use of the organic EL element, and is not particularly limited. For example, when the organic EL element has flexibility, the area per one plan view of the external contact portion exposed from the through hole of the counter substrate does not affect the flexibility of the organic EL element Is preferably small. Since the heat dissipating base material is a member containing a metal material, if the area per one of the external contact portions in the surface area of the organic EL element on the side where the opposing base material is disposed is too large, the organic EL element has a desired flexibility. May be difficult to provide. Specifically, the area per one plan view of the external contact portion exposed from the through hole of the counter substrate is preferably 5 μm ² or more, and more preferably 10 μm ² or more. Moreover, it is preferable that the area per plane of the external contact part exposed from the through-hole of the opposing base material is 1 million μm ² or less, and more preferably 100000 μm ² or less.

  When the external contact portion in the heat radiating member is exposed from the through hole formed in the counter substrate, the total area in plan view of the external contact portion exposed from the through hole formed in the counter substrate is organic EL. It can adjust suitably according to the magnitude | size, use, etc. of an element, and is not specifically limited. For example, the total area in plan view of the external contact portion exposed from the through hole of the counter substrate is preferably 10% or more, more preferably 20% or more, with respect to the surface area in plan view of the heat dissipation member. It is preferable that it is 30% or more especially. Further, the total area of the external contact portion exposed from the through hole of the opposing base material in plan view is preferably 95% or less, more preferably 90% or less, with respect to the surface area of the heat radiating member in plan view. In particular, it is preferably 85% or less. The total area in plan view of the external contact portion exposed from the through hole of the opposing substrate is within the above range, so that a sufficient contact area between the heat radiating member and air can be secured. It is possible to sufficiently exhibit the heat dissipation. Further, since the heat dissipation base is a member containing a metal material, if the total area of the external contact portion in plan view in the surface area of the heat dissipation member in plan view is too large, desired flexibility is imparted to the organic EL element. May be difficult. Therefore, when the total area in a plan view of the external contact portion exposed from the through hole of the opposing base material is within the above range, desired flexibility can be imparted to the organic EL element.

  The heat dissipation member in the second embodiment may have an external contact portion that is continuously arranged up to a position in contact with the outside through a through-hole of an opposing base material to be described later. In this case, examples of a method for forming the heat radiating member include the following methods. For example, as shown in FIG. 8A, after disposing the heat dissipating member 6 at a predetermined position, as shown in FIG. 8B, the opposing base material 8 having a through hole is disposed on the heat dissipating member 6. Then, by evaporating the heat radiating member forming material constituting the heat radiating member 6 in the through hole of the counter substrate 8 through a mask having an opening at a position overlapping the through hole of the counter substrate 8 in plan view, The method of forming the heat radiating member 6 which has an external contact part as shown in FIG.8 (c) is mentioned.

  About description of the material of a heat radiating member in 2nd embodiment, thickness, etc., since it can be made to be the same as that of the content described in the term of "A. 1st embodiment 1. Heat radiating member" mentioned above, description here Is omitted.

2. 1st electrode layer The 1st electrode layer in a 2nd embodiment is a member arrange | positioned on the transparent base material mentioned later. In addition, about the 1st electrode layer in 2nd embodiment, since it can be the same as that of the content described in the term of "A. 1st embodiment 2. 1st electrode layer" mentioned above, description here Omitted.

3. Organic EL Layer The organic EL layer in the second embodiment is a member that is disposed on the surface of the first electrode layer opposite to the transparent substrate and includes a light emitting layer. Note that the organic EL layer in the second embodiment can be the same as the contents described in the section “A. First embodiment 3. Organic EL layer” described above, so description thereof is omitted here. .

4). Second Electrode Layer The second electrode layer in the second embodiment is a member disposed on the surface of the organic EL layer opposite to the first electrode layer. In addition, about the 2nd electrode layer in 2nd embodiment, since it can be made to be the same as that of the content described in the term of "A. 1st embodiment 4. 2nd electrode layer" mentioned above, description here Omitted.

5. Insulating Member The insulating member in the second embodiment is a member arranged so as to cover the laminate having the first electrode layer, the organic EL layer, and the second electrode layer described above. In addition, about the insulating member in 2nd embodiment, since it can be made to be the same as that of the content described in the term of the "A. 1st embodiment 5. Insulating member" mentioned above, description here is abbreviate | omitted.

6). Transparent base material The transparent base material in the second embodiment is a member that supports the heat dissipation member, the first electrode layer, the organic EL layer, the second electrode layer, the insulating member, the sealing member described later, and the opposing base material. . In addition, about the transparent base material in 2nd embodiment, since it can be made to be the same as that of the content described in the term of "A. 1st embodiment 6. Transparent base material" mentioned above, description here is abbreviate | omitted. .

7). Sealing member The sealing member in the second embodiment is a member disposed so as to cover the opposing base material disposed on the surface of the heat dissipation member opposite to the insulating member and the insulating member.

  The sealing member in a 2nd embodiment will not be specifically limited if it can arrange | position so that the opposing base material arrange | positioned on the surface on the opposite side to the insulating member of a thermal radiation member, and an insulating member may be covered. Specifically, as shown in FIG. 5, the entire surface of the insulating member 5 is preferably covered with the sealing member 7 and the counter base material 8. As shown in FIG. 6, it is preferable that the insulating member 5 is covered with the sealing member 7 and the heat radiating member 6.

  As a material of the sealing member in the second embodiment, for example, a radical seal material using various acrylates such as ester acrylate, urethane acrylate, epoxy acrylate, melamine acrylate, acrylic resin acrylate, and resins such as urethane polyester, epoxy, etc. And a photo-curing resin such as a cationic sealant using a resin such as vinyl ether, a thiol-ene addition resin-based sealant, or a thermosetting resin.

  About the thickness of a sealing member, it can adjust suitably according to the use etc. of the organic EL element of a 2nd embodiment, Although it does not specifically limit, It is the thickness of the grade which can fully cover an insulating member. preferable.

  As a method for forming the sealing member, a conventional method can be used. For example, inkjet method, dispenser method, spin coating method, die coating method, micro gravure coating method, gravure coating method, bar coating method, roll coating method, wire bar coating method, dip coating method, flexographic printing method, offset printing method, and Screen printing method etc. are mentioned.

8). Opposing base material The opposing base material in the second embodiment is a member disposed on the surface of the heat dissipation member opposite to the insulating member.

  Since the opposing base material in a 2nd embodiment is a member arrange | positioned on the surface on the opposite side to the light emission surface of an organic EL element, it may have transparency and does not need to have transparency. .

  Examples of the material for the counter substrate in the second embodiment include inflexible rigid materials such as quartz glass, Pyrex (registered trademark) glass, and synthetic quartz plate, or resin films, optical resin plates, and thin glass. Examples thereof include a flexible material having flexibility. In addition, the opposing base material in a 2nd embodiment may be the laminated body in which the barrier layer was formed in the resin film.

  The opposing base material in the second embodiment may have a through hole as necessary. In that case, it is preferable that a heat radiating member has an external contact part arrange | positioned continuously to the position which contacts the exterior via a through-hole.

  When the opposing base material has a through hole, the number and shape of the through holes formed in the opposing base material are appropriately determined according to the number and shape of the external contact portions in the heat dissipation member described above. Therefore, the description of the number and shape of the through holes formed in the opposing base material can be the same as the description described in the above-mentioned section “B. Second embodiment 1. Heat radiation member”. Is omitted.

  Examples of the method for forming the through hole in the counter substrate include a punching process, a burning process using a laser beam, and an etching process. Examples of the punching process include a method using a punching machine. Examples of the tempering process using a laser beam include a method using a laser beam punch. As the etching process, a general method using an etching solution can be used. In addition, you may use a commercial item as an opposing base material in which the through-hole was formed.

II. Organic EL Display Device The organic EL display device of the present invention is a device having the above-described organic EL element, and a color filter having a plurality of colored portions and a light shielding portion between the plurality of colored portions.
Hereinafter, the organic EL display device according to one embodiment of the present disclosure will be described separately for each configuration.

A. Organic EL Element The organic EL element in one embodiment of the present disclosure can be the same as the contents described in the above-mentioned section of “I. Organic EL element”, and thus description thereof is omitted here.

B. Color filter The color filter in one embodiment of this indication is a member which has a colored part of a plurality of colors, and a shade part between colored parts of a plurality of colors.
Hereinafter, the coloring portion and the light shielding portion constituting the color filter will be described.

1. Colored portion The colored portion used in one embodiment of the present disclosure has a plurality of colors. For example, it has three colored layers of red, green, and blue. The color of the colored portion usually includes at least three colors of red, green, and blue. For example, four colors of red, green, blue, yellow and red, green, blue, and white, or red, green, blue, It is also possible to use five colors such as yellow and cyan. In the case of four colors of red, green, blue and white, a colored layer portion of three colors of red, green and blue and a white layer which will be described later are used.

The colored portion can be obtained, for example, by dispersing a color material in a binder resin. Examples of the color material include pigments and dyes of each color. Examples of the color material used for the red colored layer include perylene pigments, lake pigments, azo pigments, quinacridone pigments, anthraquinone pigments, anthracene pigments, and isoindoline pigments. Examples of the color material used in the green coloring layer include phthalocyanine pigments such as halogen polysubstituted phthalocyanine pigments or halogen polysubstituted copper phthalocyanine pigments, triphenylmethane basic dyes, isoindoline pigments, and isoindolinone pigments. And pigments. Examples of the color material used in the blue colored layer include copper phthalocyanine pigments, anthraquinone pigments, indanthrene pigments, indophenol pigments, cyanine pigments, dioxazine pigments, and the like. These pigments and dyes may be used alone or in combination of two or more.
As the binder resin, for example, a photosensitive resin having a reactive vinyl group such as acrylate, methacrylate, polyvinyl cinnamate, or cyclized rubber is used.
If necessary, the colored portion may contain a photopolymerization initiator, a sensitizer, a coating improver, a development improver, a crosslinking agent, a polymerization inhibitor, a plasticizer, a flame retardant, and the like.

  The arrangement of the colored portions can be appropriately selected as necessary, and examples thereof include known arrangements such as a stripe type, a mosaic type, a triangle type, and a four-pixel arrangement type.

  The thickness of the colored portion can be the same as the thickness of the colored portion used in a general color filter. For example, the thickness of the colored portion can be 1 μm or more, and can be 5 μm or less.

  The coloring part may be formed by any method as long as a plurality of colored parts can be arranged on the same plane, and examples thereof include a photolithography method, an ink jet method, and a printing method.

2. Light Shielding Part The light shielding part used in one embodiment of the present disclosure is disposed between the colored parts of a plurality of colors. That is, the color filter used in one embodiment of the present disclosure has a configuration in which the light-shielding portion has a plurality of openings, and the colored portions are arranged in the openings.

The light shielding part is obtained, for example, by dispersing a black color material in a binder resin. For the black color material, for example, any of a pigment and a dye can be used. Specific examples include carbon black and titanium black.
For example, when the binder resin is formed using a photolithography method, a photosensitive resin having a reactive vinyl group such as an acrylate-based, methacrylate-based, polyvinyl cinnamate-based, or cyclized rubber-based resin can be used. In addition, when the binder resin is formed using, for example, an inkjet method or a printing method, a polymethyl methacrylate resin, a polyacrylate resin, a polycarbonate resin, a polyvinyl alcohol resin, a polyvinyl pyrrolidone resin, a hydroxyethyl cellulose resin, a carboxymethyl cellulose resin, a polychlorinated resin. Vinyl resin, melamine resin, phenol resin, alkyd resin, epoxy resin, polyurethane resin, polyester resin, maleic acid resin, polyamide resin, and the like can be used.
The light-shielding portion may contain a photopolymerization initiator, a sensitizer, a coating property improver, a development improver, a crosslinking agent, a polymerization inhibitor, a plasticizer, a flame retardant, and the like as necessary.

  Although the shape of the opening part of a light-shielding part is not specifically limited, For example, a stripe shape, a dogleg shape, etc. are mentioned.

  The thickness of the light shielding part can be the same as the thickness of the light shielding part used in a general color filter. For example, the thickness of the light-shielding part can be 0.5 μm or more, and can be 2 μm or less.

  The light shielding part may be formed by any method as long as a light shielding part having a plurality of openings can be obtained. Examples thereof include a photolithography method, an ink jet method, and a printing method.

3. Others The color filter according to an embodiment of the present disclosure may include other members as necessary in addition to the above-described colored portions and light-shielding portions. Since other members can be the same as those used in general color filters, description thereof is omitted here.

  Unless otherwise specified, the following operations were performed in a glove box (oxygen concentration 1 ppm or less, moisture concentration 1 ppm or less) under a nitrogen atmosphere.

[Example 1]
9A to 9E are schematic process diagrams illustrating a method for manufacturing an organic EL element in Example 1. FIG.

(Formation of first electrode layer)
As shown in FIG. 9A, a transparent first electrode layer 2 (material: indium tin oxide, thickness: 300 nm) was formed on the transparent substrate 1 in a pattern. Thereafter, the transparent substrate on which the patterned first electrode layer was formed was ultrasonically cleaned in the order of neutral detergent and ultrapure water, and then subjected to UV ozone treatment.

(Formation of organic EL layer)
Next, a PEDOT / PSS aqueous dispersion (CLEVIUS P AI4083 manufactured by Heraeus Co., Ltd.) is used as the first hole injection / transport layer forming composition constituting the first hole injection / transport layer on the obtained first electrode layer. The coating was applied in the air using a spin coating method. Then, it heated at 200 degreeC and the conditions for 30 minutes in air | atmosphere using the hotplate, and obtained the 1st positive hole injection transport layer. The thickness of the first hole injection transport layer after heating was 20 nm.
Next, as a composition for forming a second hole injecting and transporting layer constituting the second hole injecting and transporting layer, poly [(9,9-dioctylfluorenyl-2,7-diyl) which is a conjugated polymer material is used. ) -Co- (4,4 ′-(N- (4-sec-butylphenyl)) diphenylamine)] (TFB) was dissolved in xylene at a concentration of 0.4 wt%. The obtained composition for forming a second hole injecting and transporting layer was applied onto the obtained first hole injecting and transporting layer by a spin coating method. Then, it heated on 200 degreeC and the conditions for 30 minutes using the hotplate, the solvent was removed, and the 2nd positive hole injection transport layer was obtained. The thickness of the second hole injecting and transporting layer after heating was 20 nm.
Next, on the obtained second hole injecting and transporting layer, tris (2-phenylpyridine) iridium (III) (Ir (ppy) 3) is contained as a luminescent dopant as a luminescent layer, and 4,4′- A mixed thin film containing bis (2,2-carbazol-9-yl) biphenyl (CBP) as a host was formed by vapor deposition. The mixed thin film was formed by co-evaporation in a vacuum of 1 × 10 ⁻⁴ Pa by a resistance heating method so that the volume ratio of host to dopant was 20: 1 and the total film thickness was 30 nm.
Subsequently, a bis (2-methyl-8-quinolinato) (p-phenylphenolate) aluminum complex (BAlq) thin film was formed as a hole blocking layer on the obtained light emitting layer by vapor deposition. The BAlq thin film was formed in a vacuum of 1 × 10 ⁻⁴ Pa so as to have a film thickness of 10 nm by a resistance heating method.
Next, a tris (8-quinolinolato) aluminum complex (Alq3) thin film was formed as an electron transport layer on the obtained hole blocking layer by vapor deposition. The Alq3 thin film was formed by resistance heating vapor deposition in a vacuum at a pressure of 1 × 10 ⁻⁴ Pa.
Finally, on the obtained electron transport layer, as an electron injection layer, 0.5 nm-thick lithium fluoride (LiF) was formed by resistance heating vapor deposition in a vacuum with a pressure of 1 × 10 ⁻⁴ Pa. .
In this way, as shown in FIG. 9B, the organic EL layer 3 was formed on the first electrode layer 2 formed in a pattern on the transparent substrate 1.

(Formation of second electrode layer)
Next, Al was used as a material constituting the second electrode layer on the obtained organic EL layer, and a film was formed by resistance heating vapor deposition in a vacuum of 1 × 10 ⁻⁴ Pa. Thereby, as shown in FIG. 9C, the second electrode layer 4 having a thickness of 100 nm was formed on the organic EL layer 3.

(Formation of insulation members)
Next, a film was formed on the obtained second electrode layer by resistance heating vapor deposition in a vacuum of 1 × 10 ⁻⁴ Pa using parylene as a material constituting the insulating member. Thereby, as shown in FIG. 9D, the insulating member 5 having a thickness of 500 nm was formed so as to cover the second electrode layer 4.

(Heat dissipation member)
Finally, on the obtained insulating member, Al was used as a material constituting the heat radiating member, and a film was formed by resistance heating vapor deposition in a vacuum with a pressure of 1 × 10 ⁻⁴ Pa. Thereby, as shown in FIG.9 (e), the thermal radiation member 6 with a thickness of 3 micrometers was formed on the insulating member 5. FIG.

(Organic EL device)
By having the above-mentioned process, in Example 1, the organic EL element 10 as shown in FIG.9 (e) was able to be obtained. In addition, the structure of the vertical cross section with respect to the surface of the organic EL element of the organic EL element 10 shown in FIG.9 (e) was the same as that of FIG. 1, for example.

[Example 2]
An organic EL layer was formed in the same manner as in Example 1 except that a counter substrate was disposed on the surface of the heat radiating member opposite to the second electrode layer using an ultraviolet curable adhesive. In addition, 25 through-holes of 2 mm □ were formed in the opposing base material, and the thickness was 0.2 mm. The configuration of the vertical cross section of the organic EL element formed in Example 2 was the same as that shown in FIG.

[Example 3]
By disposing a mask so that the through-holes formed in the opposing base material are exposed and applying Al paste using the screen printing method, the heat dissipating member is continuously arranged until it contacts the outside through the through-holes An organic EL element was formed in the same manner as in Example 2 except that the formed external contact portion was formed. The configuration of the longitudinal section of the organic EL element formed in Example 3 was the same as that shown in FIG. 6B, for example.

[Comparative Example 1]
An organic EL element was formed in the same manner as in Example 1 except that the heat radiating member was not formed.

[Comparative Example 2]
An organic EL element was formed in the same manner as in Example 2 except that the heat radiating member was not formed.

[Evaluation]
Heat dissipation was evaluated using the organic EL elements obtained in Examples 1 to 3 and Comparative Examples 1 and 2. Specifically, Example 1 and Comparative Example 1 were compared and evaluated by measuring the temperature at an emission luminance of 2,000 cd / m ² using infrared thermography (G-120 NEC Avio). Examples 2 and 3 and Comparative Example 2 were comparatively evaluated. The results are shown in Table 1.

  From the evaluation results shown in Table 1, it was found that an excellent heat dissipation effect was obtained in the case of the organic EL element of the present disclosure having a heat dissipation member as compared to a conventional organic EL element having no heat dissipation member. In addition, the excellent heat dissipation effect in Examples 2 and 3 is obtained by having the external contact portion in which the heat dissipation member is continuously arranged to the position in contact with the outside through the through hole of the opposing base material. This is probably because the heat dissipation effect is promoted.

DESCRIPTION OF SYMBOLS 1 ... Transparent base material 2 ... 1st electrode layer 3 ... Organic EL layer 4 ... 2nd electrode layer 5 ... Insulating member 6 ... Heat radiation member 7 ... Sealing member 8 ... Opposite base material 10 ... Organic EL element

Claims (5)

A transparent substrate;
A transparent first electrode layer on one side of the transparent substrate;
An organic electroluminescence layer on the surface of the first electrode layer opposite to the transparent substrate, comprising a light emitting layer;
A second electrode layer on a surface opposite to the first electrode layer of the organic electroluminescence layer;
An insulating member on the laminate having the first electrode layer, the organic electroluminescence layer, and the second electrode layer;
A heat dissipating member including a metal material on the surface of the insulating member opposite to the laminated body and facing the second electrode layer;
An organic electroluminescence device having:   The organic electroluminescence element according to claim 1, wherein the heat radiating member has a concavo-convex shape on a surface opposite to the laminated body. A counter substrate on a surface opposite to the insulating member of the heat dissipation member;
A sealing member on the insulating member,
The organic electroluminescence element according to claim 1, wherein the laminate is sealed by the transparent substrate, the sealing member, and the heat dissipation member.   The organic electroluminescence device according to claim 3, wherein the counter substrate has a through hole. An organic electroluminescence device according to any one of claims 1 to 4, and
A color filter having a plurality of colored portions, and a light shielding portion between the colored portions of a plurality of colors;
An organic electroluminescence display device.