JP2015220215A - Organic electroluminescence display device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an organic EL display device which can efficiently discharge heat generated in an organic EL layer of an organic EL element or heat generated by driving of a TFT circuit or by wiring resistance, to the outside.SOLUTION: An organic EL display device 100 comprises: an organic EL element substrate 10 which has organic EL elements 40 formed on one surface 11a side of a substrate 11 and a plurality of first banks 16 for partitioning the organic EL elements 40; and an encapsulation substrate 20 which has a color conversion layer 23 formed on one surface 21a side of a transparent substrate 21 and a plurality of second banks 25 for partitioning the transparent substrate 21 into a plurality of regions. The organic EL element substrate 10 and the encapsulation substrate 20 are arranged opposite each other such that each first bank 16 and each second bank 25 are connected to each other in at least one part, and auxiliary electrodes 26 are provided between the transparent substrate 21 and the second banks 25, each auxiliary electrode 26 being provided with a feeding point 27.

Description

  The present invention relates to an organic electroluminescence display device.

  As an organic electroluminescence (hereinafter, also referred to as “organic EL”) display device, a wavelength conversion type organic EL in which an organic EL element is combined with at least one of a wavelength conversion layer containing a phosphor and a color filter. A display device is known (for example, see Patent Document 1).

JP 2005-268062 A

  When the organic EL display device is enlarged, the length of the wiring for supplying the drive current to each pixel is extremely different between the outer peripheral portion and the central portion of the display screen. For this reason, when a wiring made of a material having high resistance is used, a voltage drop partially occurs, the luminance uniformity of the organic EL layer is lowered, and luminance unevenness occurs. In particular, in many top emission type organic EL display devices, since the resistance value of the transparent cathode is higher than that of the metal film, the influence of the voltage drop becomes large.

Further, in the organic EL display device, heat generated in the organic EL layer and heat due to TFT driving and wiring resistance stay in the device, and the heat cannot be efficiently released to the outside of the device. Organic EL elements are vulnerable to heat, and if they are operated at high temperatures, their lifetime may be reduced, light emission unevenness, and destruction of the elements themselves may occur. Therefore, it is necessary to remove the heat generated from the organic EL element and the heat generated when driving the TFT.
In addition, in the wavelength conversion type organic EL display device, light emitted from the organic EL layer or the wavelength conversion layer is guided in a direction perpendicular to the thickness direction in each layer, so that light loss occurs. The light extraction efficiency is low and the power consumption is high.

  The present invention has been made in view of the above circumstances, and can efficiently release the heat generated in the organic electroluminescent layer of the organic electroluminescent element and the heat generated by driving the TFT circuit and wiring resistance to the outside. An object of the present invention is to provide an organic electroluminescence display device.

  An organic electroluminescence display device according to one aspect of the present invention includes a substrate, an organic electroluminescence element formed on one surface of the substrate, and the organic electroluminescence element formed on one surface side of the substrate. A plurality of first banks, an organic electroluminescence element substrate having a transparent substrate, a color conversion layer formed on one surface of the transparent substrate, formed on one surface side of the transparent substrate, A sealing substrate having a plurality of second banks partitioning the transparent substrate into a plurality of regions, and the organic electroluminescence so that the first bank and the second bank are connected at least one place An element substrate and the sealing substrate are arranged to face each other, and an auxiliary electrode made of metal is provided between the transparent substrate and the second bank. Wherein the auxiliary electrode, characterized in that the feed point for connecting to an external power source is provided.

  In the organic electroluminescence display device according to one aspect of the present invention, the first bank and the second bank may be made of a heat conductive material or a heat radiation material.

  In the organic electroluminescence display device according to one aspect of the present invention, a reflective film may be provided on a side surface of the first bank.

  In the organic electroluminescence display device according to one aspect of the present invention, a reflective film may be provided on a side surface of the second bank.

  In the organic electroluminescence display device according to one aspect of the present invention, the second bank includes a first end surface facing one surface of the transparent substrate, a first end surface, and an area of the first end surface. Alternatively, the second end surface having a small area and a side surface may be included.

  In the organic electroluminescence display device according to one aspect of the present invention, the second bank includes a first end surface facing one surface of the transparent substrate, a first end surface, and an area of the first end surface. May be configured by a second end surface having a large area and a side surface.

  In the organic electroluminescence display device according to one aspect of the present invention, a columnar or spherical conductive spacer may be disposed between the first bank and the second bank.

  In the organic electroluminescence display device according to one aspect of the present invention, a thin metal wire may be disposed between the first bank and the second bank.

  In the organic electroluminescence display device according to one aspect of the present invention, a mesh-shaped fine metal wire may be disposed between the transparent substrate and the second bank.

  In the organic electroluminescence display device according to one aspect of the present invention, a filler layer filled with a conductive filler may be provided between the organic electroluminescence element substrate and the sealing substrate.

  An organic electroluminescence display device according to one aspect of the present invention includes a substrate, an organic electroluminescence element formed on one surface of the substrate, and the organic electroluminescence element formed on one surface side of the substrate. A plurality of first banks, an organic electroluminescence element substrate having a transparent substrate, a color conversion layer formed on one surface of the transparent substrate, formed on one surface side of the transparent substrate, A sealing substrate having a plurality of second banks partitioning the transparent substrate into a plurality of regions, and the organic electroluminescence so that the first bank and the second bank are connected at least one place The element substrate and the sealing substrate are arranged to face each other, and a feeding point for connecting to an external power source is provided in the first bank. To.

  An organic electroluminescence display device according to one aspect of the present invention includes a substrate, an organic electroluminescence element formed on one surface of the substrate, and the organic electroluminescence element formed on one surface side of the substrate. A plurality of first banks, an organic electroluminescence element substrate having a transparent substrate, a color conversion layer formed on one surface of the transparent substrate, formed on one surface side of the transparent substrate, A sealing substrate having a plurality of second banks partitioning the transparent substrate into a plurality of regions, and the organic electroluminescence so that the first bank and the second bank are connected at least one place The element substrate and the sealing substrate are arranged to face each other, and a feeding point for connecting to an external power source is provided in the second bank. To.

  According to the present invention, it is possible to provide an organic electroluminescence display device capable of efficiently releasing heat generated in an organic electroluminescence layer of an organic electroluminescence element or heat generated by driving a TFT circuit or wiring resistance to the outside. it can.

(A) is sectional drawing which shows schematic structure of the organic electroluminescent display apparatus which is 1st Embodiment of this invention, (B) is a figure which shows schematic structure of an organic EL element. 1 is a top view showing an organic EL display device according to a first embodiment of the present invention. Sectional drawing which shows schematic structure of the organic electroluminescence display which is 2nd Embodiment of this invention. Sectional drawing which shows schematic structure of the organic electroluminescence display which is 3rd Embodiment of this invention. Sectional drawing which shows schematic structure of the organic electroluminescence display which is 4th Embodiment of this invention. Sectional drawing which shows schematic structure of the organic electroluminescence display which is 5th Embodiment of this invention. Sectional drawing which shows schematic structure of the organic electroluminescence display which is 6th Embodiment of this invention. Sectional drawing which shows schematic structure of the organic electroluminescence display which is 7th Embodiment of this invention. Sectional drawing which shows schematic structure of the organic electroluminescence display which is 8th Embodiment of this invention. Sectional drawing which shows schematic structure of the organic electroluminescence display which is 9th Embodiment of this invention. Sectional drawing which shows schematic structure of the organic electroluminescence display which is 10th Embodiment of this invention.

An embodiment of the organic electroluminescence display device of the present invention will be described.
Note that this embodiment is specifically described in order to better understand the gist of the invention, and does not limit the present invention unless otherwise specified.

[First Embodiment]
FIG. 1A is a cross-sectional view showing a schematic configuration of an organic EL display device according to the first embodiment of the present invention. FIG. 1B is a diagram illustrating a schematic configuration of an organic EL element.
As shown in FIG. 1A, an organic EL display device 100 according to this embodiment includes an organic EL element substrate 10, a sealing substrate (wavelength conversion substrate) 20, an organic EL element substrate 10, and a sealing substrate 20. A top emission type organic EL display device that is driven by an active driving method.

  The organic EL element substrate 10 mainly includes a substrate 11, a TFT (thin film transistor) circuit 12, and an organic EL element (organic light emitting element) 40. A plurality of organic EL elements 40 are provided on the substrate 11 including the TFT circuit 12. Is provided.

  The sealing substrate (wavelength conversion substrate) 20 mainly includes a transparent substrate 21, a color filter layer (color adjustment layer) 22, and a color conversion layer (wavelength conversion layer) 23. On the one surface 21a side of the transparent substrate 21, A color filter layer (color adjustment layer) 22 and a color conversion layer 23 corresponding to each of the R, G, and B sub-pixels S are provided.

  In the organic EL display device 100 of the present embodiment, light emitted from the organic EL element 40 that is a light source is incident on the color conversion layer 23 and the color filter layer 22, so that three colors of red, green, and blue are obtained. Light is emitted to the outside (observer side) of the wavelength conversion substrate 20.

  As shown in FIG. 1B, the organic EL element 40 is configured by an organic EL layer 41 sandwiched between a first electrode 42 and a second electrode 43. As shown in FIG. 1A, the first electrode 42 is connected to one of the TFT circuits 12 by a contact hole 12b provided through the interlayer insulating film 13 and the planarizing film 14. The second electrode 43 is connected to one of the TFT circuits 12 by a wiring (not shown) provided through the interlayer insulating film 13 and the planarizing film 14.

FIG. 2 is a top view showing the organic EL display device 100.
As shown in FIG. 2, the organic EL display device 100 according to the present embodiment has a plurality of pixels 24. Each pixel 24 includes three sub-pixels S (red pixel portion S (R), green pixel portion S (G), blue color corresponding to red light (R), green light (G), and blue light (B), respectively. Pixel portion S (B)).

  The red pixel portion S (R), the green pixel portion S (G), and the blue pixel portion S (B) extend in a stripe shape along the y axis, and the red pixel portion S (R), green color along the x axis. The pixel portion S (G) and the blue pixel portion S (B) are arranged in this order to form a two-dimensional stripe arrangement.

  The example shown in FIG. 2 shows an example in which the RGB sub-pixels (red pixel portion S (R), green pixel portion S (G), and blue pixel portion S (B)) are arranged in stripes. The present embodiment is not limited to this, and the arrangement of the RGB sub-pixels (red pixel portion S (R), green pixel portion S (G), blue pixel portion S (B)) is a mosaic arrangement, a delta arrangement, or the like. Alternatively, a conventionally known RGB pixel array may be used.

"Organic EL device substrate"
As shown in FIG. 1A, the organic EL element substrate 10 includes an active matrix substrate 15, a plurality of organic EL elements 40 provided on the active matrix substrate 15, a first bank 16, and a sealing layer 17. And is configured. The active matrix substrate 15 includes a substrate 11, a TFT circuit 12 formed on the substrate 11, an interlayer insulating film 13, and a planarizing film 14.

  A TFT circuit 12 and various wirings (not shown) are formed on the substrate 11, and an interlayer insulating film 13 and a planarizing film 14 are sequentially stacked so as to cover the upper surface of the substrate 11 and the TFT circuit 12. .

As the substrate 11, for example, an inorganic material substrate made of glass, quartz or the like, a plastic substrate made of polyethylene terephthalate, polycarbazole, polyimide or the like, an insulating substrate such as a ceramic substrate made of alumina, etc., aluminum (Al), iron (Fe ), Etc., a substrate in which an insulator made of an organic insulating material such as silicon oxide (SiO ₂ ) is coated on the surface thereof, or a surface of a metal substrate made of aluminum or the like is anodized. Although the board | substrate etc. which performed the insulation process by the method are mentioned, this embodiment is not limited to these.

  The TFT circuit 12 is formed on the substrate 11 in advance before the organic EL element 40 is formed, and functions as a switching device and a driving device. As the TFT circuit 12, a conventionally known TFT circuit can be used. In this embodiment, a metal-insulator-metal (MIM) diode can be used instead of the TFT as a switching and driving element.

  The TFT circuit 12 can be formed using a known material, structure, and formation method. As the material of the active layer of the TFT circuit 12, for example, amorphous silicon (amorphous silicon), polycrystalline silicon (polysilicon), microcrystalline silicon, inorganic semiconductor materials such as cadmium selenide, zinc oxide, indium oxide-oxide Examples thereof include oxide semiconductor materials such as gallium-zinc oxide, and organic semiconductor materials such as polythiophene derivatives, thiophene oligomers, poly (p-ferylene vinylene) derivatives, naphthacene, and pentacene. Examples of the structure of the TFT circuit 12 include a staggered type, an inverted staggered type, a top gate type, and a coplanar type.

The gate insulating film of the TFT circuit 12 used in this embodiment can be formed using a known material. Examples thereof include SiO ₂ formed by plasma oxidation chemical vapor deposition (PECVD), low pressure chemical vapor deposition (LPCVD), or the like, or SiO ₂ obtained by thermally oxidizing a polysilicon film. Further, the signal electrode line, the scanning electrode line, the common electrode line, the first drive electrode, and the second drive electrode of the TFT circuit 12 used in this embodiment can be formed using a known material, for example, tantalum. (Ta), aluminum (Al), copper (Cu), and the like.

The interlayer insulating film 13 can be formed using a known material. Examples of the material include silicon oxide (SiO ₂ ), silicon nitride (SiN or Si ₂ N ₄ ), tantalum oxide (TaO, Alternatively, an inorganic material such as Ta ₂ O ₅ ), an organic material such as an acrylic resin or a resist material, or the like can be given.

  Examples of the method for forming the interlayer insulating film 13 include a dry process such as a chemical vapor deposition (CVD) method and a vacuum deposition method, and a wet process such as a spin coating method. Moreover, it can also pattern by the photolithographic method etc. as needed.

  The planarization film 14 has a defect in the organic EL element 40 (for example, a defect in the pixel electrode, a defect in the organic EL layer, a disconnection in the counter electrode, a short circuit between the pixel electrode and the counter electrode, a decrease in breakdown voltage due to unevenness on the surface of the TFT circuit 12 Etc.) and the like are provided. The planarizing film 14 can be omitted.

  The planarization film 14 can be formed using a known material, and examples thereof include inorganic materials such as silicon oxide, silicon nitride, and tantalum oxide, and organic materials such as polyimide resin, acrylic resin, and resist material. Examples of the method for forming the planarizing film 14 include a dry process such as a CVD method and a vacuum deposition method, and a wet process such as a spin coat method, but the present embodiment is not limited to these materials and the formation method. The planarizing film 14 may have a single layer structure or a multilayer structure.

  The first bank 16 surrounds the organic EL element 40 and is formed so as to partition each sub-pixel S. The first bank 16 is formed between at least the sub-pixels S on the one surface 11 a of the substrate 11, and prevents leakage between the first electrode 42 and the second electrode 43.

  Specifically, the first bank 16 includes a first end surface 16a facing the substrate 11, a second end surface 16b facing the first end surface 16a and having an area smaller than the area of the first end surface 16a, and a side surface 16c. , Has a forward taper shape. Here, the “forward taper shape” refers to a taper shape whose cross-sectional shape becomes narrower in a direction away from the substrate 11.

The first bank 16 is a white bank that takes into account the light extraction efficiency from the organic EL element 40. Thereby, the luminance is improved.
The first bank 16 can be formed using an insulating material by a known method such as an electron beam (EB) vapor deposition method, a sputtering method, an ion plating method, or a resistance heating vapor deposition method. The first bank 16 can be patterned by a known dry method or wet photolithography method. Note that the formation method of the first bank 16 is not limited to these formation methods. Further, the material constituting the first bank 16 is not particularly limited, but a known material is used. For example, the same material as that of the planarizing film 14 can be used.

  The first bank 16 has a film thickness that can sufficiently secure the insulation between the first electrode 42 and the second electrode 43. The film thickness of the first bank 16 is preferably 100 nm to 2000 nm, for example. If the film thickness of the first bank 16 is less than 100 nm, the insulation is not sufficient, and leakage occurs between the first electrode 42 and the second electrode 43, resulting in an increase in power consumption and non-light emission. On the other hand, when the film thickness of the first bank 16 exceeds 2000 nm, it takes time for the film forming process, and there is a concern that the productivity deteriorates.

  The first bank 16 is preferably made of a heat conductive material or a heat radiating material in its entirety or on the surface (first end surface 16a, second end surface 16b, side surface 16c).

Examples of the heat conductive material or the heat radiation material include aluminum (Al, 235 W / m · K), copper (Cu, 401 W / m · K), silver (Ag, 428 W / m · K), gold (Au, Au, 318W / m · K), tin (Sn), titanium (Ti), iron (Fe), zinc (Zn), molybdenum (Mo), nickel (Ni) and other metals, copper alloys, phosphor bronze, stainless steel, gold alloys , Alloys such as nickel alloys and iron alloys, aluminum oxide (Al ₂ O ₃ , 46 W / m · K), silicon dioxide (SiO ₂ , 8.38 W / m · K), titanium oxide (TiO ₂ , 8.38 W / m · K), magnesium oxide (MgO, 60 W / m · K), metal oxides such as silicon carbide (SiC, 8. W / m · K), and the like.
In addition, said numerical value has shown the thermal conductivity (W / m * K) of each material. Moreover, the thermal conductivity of the acrylic resin, which is an insulating material used for the first bank 16, is 0.2 W / m · K, and the thermal conductivity of the polyimide resin is 0.3 W / m · K.

When the surface of the first bank 16 is made of a heat conductive material or a heat radiating material, a thin film made of a heat conductive material or a heat radiating material is provided on the surface of the first bank 16.
As a method of forming a thin film made of a thermally conductive material or a thermally radiative material on the surface of the first bank 16, the above-described thermally conductive material or a thermally radiative material is used, for example, chemical vapor deposition (CVD). ) Method, dry process such as vacuum deposition, and wet process such as spin coating.

  The first bank 16 has a film thickness that can sufficiently secure the insulation between the first electrode 42 and the second electrode 43. The film thickness of the first bank 16 is preferably 100 nm to 2000 nm, for example. If the film thickness of the first bank 16 is less than 100 nm, the insulation is not sufficient, and leakage occurs between the first electrode 42 and the second electrode 43, resulting in an increase in power consumption and non-light emission. On the other hand, when the film thickness of the first bank 16 exceeds 2000 nm, it takes time for the film forming process, and there is a concern that the productivity deteriorates.

The organic EL element 40 includes a first electrode 42, an organic EL layer 41, and a second electrode 43.
The first electrode 42 and the second electrode 43 function as a pair as an anode or a cathode of the organic EL element 40.
1A and 1B and the following description, the case where the first electrode 42 is an anode and the second electrode 43 is a cathode will be described as an example.

The first electrode 42 and the second electrode 43 can be formed using a conventional electrode material.
For example, in order to efficiently inject electrons into the organic EL layer 41, the first electrode 42 includes a low work function metal such as Ca / Al, Ce / Al, Cs / Al, Ba / Al, and a stable metal. It is preferable to form by laminating. The first electrode 11 may be formed of an alloy containing a metal having a low work function, such as a Ca: Al alloy, Mg: Ag alloy, or Li: Al alloy, or LiF / Al or LiF / Ca / Al. , BaF2 / Ba / Al, LiF / Al / Ag, or other thin film insulating layers and metal electrodes may be combined.

As the second electrode 43, a transparent electrode can be formed using ITO, IDIXO, IZO, GZO, SnO ₂ or the like. When the microresonator structure is constituted by the first electrode 42 and the second electrode 43, it is preferable to use a translucent electrode as the second electrode 43.

  The second electrode 43 may be a combination of a metal translucent electrode and a transparent electrode material. In particular, as a material for the semitransparent electrode, silver is preferable from the viewpoint of reflectance and transmittance. The film thickness of the translucent electrode is preferably 5 nm to 30 nm. When the film thickness of the translucent electrode is less than 5 nm, the light cannot be sufficiently reflected, and the interference effect cannot be obtained sufficiently. Further, when the film thickness of the semi-transparent electrode exceeds 30 nm, the light transmittance is drastically lowered, so that the luminance and light emission efficiency of the organic EL element 40 may be lowered.

  The organic EL layer 41 is disposed between the first electrode 42 and the second electrode 43 and emits light when a voltage is applied. For example, as illustrated in FIG. 1B, the organic EL layer 41 includes, in order from the first electrode 42 side, a hole injection layer 44, a hole transport layer 45, an electron blocking layer 46, a light emitting layer 47, and an electron transport layer. 48 and an electron injection layer 49 are provided (hole injection layer / hole transport layer / electron blocking layer / light emitting layer / electron transport layer / electron injection layer). The light emitting layer 47 of the present embodiment has a single layer structure that emits blue to blue-green light.

  When the microresonator structure is configured by the first electrode 42 and the second electrode 43, the light emission of the organic EL layer 41 is directed in the front direction (light extraction direction) due to the interference effect between the first electrode 42 and the second electrode 43. It can be condensed. In that case, since the directivity can be given to the light emission of the organic EL layer 41, the light emission loss escaping to the surroundings can be reduced, and the light emission efficiency can be increased. Thereby, the luminescence energy generated in the organic EL layer 41 can be emitted more efficiently to the color conversion layer 23 side, and the front luminance of the organic EL element 40 can be increased.

  In addition, according to the microresonator structure constituted by the first electrode 42 and the second electrode 43, it is possible to adjust the emission spectrum of the organic EL layer 41, and to adjust to the desired emission peak wavelength and half width. Can do. Thereby, the emission spectrum of the organic EL layer 41 can be controlled to a spectrum that can effectively excite the organic fluorescent dye in the color conversion layer 23.

  The first electrode 42 and the second electrode 43 can be formed by using a dry process such as an evaporation method, an EB method, an MBE method, or a sputtering method, or a wet method such as a spin coating method, a printing method, or an inkjet method. A process can also be used.

  The hole injection layer 44 is provided in order to efficiently receive holes from the first electrode 42 and efficiently transfer them to the hole transport layer 45. The HOMO level of the material used for the hole injection layer 44 is preferably lower than the HOMO level used for the hole transport layer 45 and higher than the work function of the first electrode 42. The hole injection layer 44 may be a single layer or a multilayer.

  For example, polycarbonate or polyester can be used as the adhesive resin. The solvent is only required to dissolve or disperse the material. For example, pure water, methanol, ethanol, THF, chloroform, xylene, trimethylbenzene and the like can be used as the solvent.

  As a material of the hole injection layer 44, a material generally used for an organic EL element or an organic photoconductor can be used. For example, inorganic p-type semiconductor materials, porphyrin compounds, N, N′-bis- (3-methylphenyl) -N, N′-bis- (phenyl) -benzidine (TPD), N, N′-di (naphthalene) -1-yl) -N, N′-diphenyl-benzidine (NPD) and other aromatic tertiary amine compounds, hydrazone compounds, quinacridone compounds, styrylamine compounds and other low molecular materials, polyaniline (PANI), 3, 4 -Polymer materials such as polyethylene dioxythiophene / polystyrene sulfonate (PEDT / PSS), poly [triphenylamine derivative] (Poly-TPD), polyvinyl carbazole (PVCz), poly (p-phenylene vinylene) precursor ( Prepolymer materials such as Pre-PPV) and poly (p-naphthalene vinylene) precursor (Pre-PNV) A body or the like can be used.

  The hole transport layer 45 is provided in order to efficiently receive holes from the hole injection layer 44 and transfer them to the light emitting layer 47 efficiently. The HOMO level of the material used for the hole transport layer 45 is preferably higher than the HOMO level of the hole injection layer 44 and lower than the HOMO level of the light emitting layer 47. This is because holes can be injected and transported to the light emitting layer 47 more efficiently, and the effect of reducing the voltage required for light emission and the effect of improving the light emission efficiency can be obtained.

  Further, the LUMO level of the hole transport layer 45 is preferably lower than the LUMO level of the light emitting layer 47 so that leakage of electrons from the light emitting layer 47 can be suppressed. If it does so, the luminous efficiency in the light emitting layer 47 can be improved. The band gap of the hole transport layer 45 is preferably larger than the band gap of the light emitting layer 47. Then, excitons can be effectively confined in the light emitting layer 47.

  The hole transport layer 45 may be a single layer or a multilayer, and can be formed in the same manner as the hole injection layer 44 using a dry process or a wet process.

The electron blocking layer 46 can be formed using the same material as the hole injection layer 44. However, the absolute value of the LUMO level of the material is preferably smaller than the absolute value of the LUMO level of the material of the hole injection layer 44 included in the light emitting layer 47 in contact with the electron blocking layer 46. This is because electrons can be more effectively confined in the light emitting layer 47.
The electron blocking layer 46 may be a single layer or a multilayer, and can be formed in the same manner as the hole injection layer 44 using a dry process or a wet process.

  The light emitting layer 47 may be composed only of the organic light emitting material exemplified below, or may be composed of a combination of a light emitting dopant and a host material, and optionally includes a hole transport material, an electron transport material, and an additive. An agent (donor, acceptor, etc.) may be included. Moreover, the structure by which these each material was disperse | distributed in the polymer material (adhesive resin) or the inorganic material may be sufficient. From the viewpoint of light emission efficiency and durability, the material of the light emitting layer 47 is preferably a material in which a light emitting dopant is dispersed in a host material.

As the organic light emitting material, a known light emitting material for an organic EL element can be used.
Such light-emitting materials are classified into low-molecular light-emitting materials, polymer light-emitting materials, and the like. Specific examples of these compounds are given below, but the present embodiment is not limited to these materials.
The organic light emitting material may be classified into a fluorescent material, a phosphorescent material, and the like. From the viewpoint of reducing power consumption, it is preferable to use a phosphorescent material with high emission efficiency.

  As the low molecular weight light emitting material (including host material) used for the light emitting layer 47, aromatic dimethylidene compounds such as 4,4′-bis (2,2′-diphenylvinyl) -biphenyl (DPVBi); 5-methyl- Oxadiazole compounds such as 2- [2- [4- (5-methyl-2-benzoxazolyl) phenyl] vinyl] benzoxazole; 3- (4-biphenyl) -4-phenyl-5-t-butyl Triazole derivatives such as phenyl-1,2,4-triazole (TAZ); styrylbenzene compounds such as 1,4-bis (2-methylstyryl) benzene; thiopyrazine dioxide derivatives, benzoquinone derivatives, naphthoquinone derivatives, anthraquinone derivatives, Fluorescent organic materials such as diphenoquinone derivatives and fluorenone derivatives; azomethine zinc complexes, (8- Fluoroluminescent organometallic complexes such as (roxyquinolinato) aluminum complex (Alq3); BeBq (bis (benzoquinolinolato) beryllium complex); 4,4′-bis- (2,2-di-p-tolyl-vinyl) -biphenyl (DTVBi); Tris (1,3-diphenyl-1,3-propanediono) (monophenanthroline) Eu (III) (Eu (DBM) 3 (Phen)); Diphenylethylene derivative; Tris [4- (9-phenyl) Triphenylamine derivatives such as fluoren-9-yl) phenyl] amine (TTPPA); diaminocarbazole derivatives; bisstyryl derivatives; aromatic diamine derivatives; quinacridone compounds; perylene compounds; coumarin compounds; distyrylarylene derivatives (DPVBi) An oligothiophene derivative (BMA- T); 4,4′-di (triphenylsilyl) -biphenyl (BSB), diphenyl-di (o-tolyl) silane (UGH1), 1,4-bistriphenylsilylbenzene (UGH2), 1,3-bis Silane derivatives such as (triphenylsilyl) benzene (UGH3), triphenyl- (4- (9-phenyl-9H-fluoren-9-yl) phenyl) silane (TPSi-F); 9,9-di (4- Dicarbazole-benzyl) fluorene (CPF), 3,6-bis (triphenylsilyl) carbazole (mCP), 4,4′-bis (carbazol-9-yl) biphenyl (CBP), 4,4′-bis ( Carbazol-9-yl) -2,2′-dimethylbiphenyl (CDBP), N, N-dicarbazolyl-3,5-benzene (m-CP), 3- (diphenyl) Enylphosphoryl) -9-phenyl-9H-carbazole (PPO1), 3,6-di (9-carbazolyl) -9- (2-ethylhexyl) carbazole (TCz1), 9,9 ′-(5- (triphenylsilyl) ) -1,3-phenylene) bis (9H-carbazole) (SimCP), bis (3,5-di (9H-carbazol-9-yl) phenyl) diphenylsilane (SimCP2), 3- (diphenylphosphoryl) -9 -(4-Diphenylphosphoryl) phenyl) -9H-carbazole (PPO21), 2,2-bis (4-carbazolylphenyl) -1,1-biphenyl (4CzPBP), 3,6-bis (diphenylphosphoryl)- 9-phenyl-9H-carbazole (PPO2), 9- (4-tert-butylphenyl) -3,6-bis ( Riphenylsilyl) -9H-carbazole (CzSi), 3,6-bis [(3,5-diphenyl) phenyl] -9-phenyl-carbazole (CzTP), 9- (4-tert-butylphenyl) -3, 6-ditrityl-9H-carbazole (CzC), 9- (4-tert-butylphenyl) -3,6-bis (9- (4-methoxyphenyl) -9H-fluoren-9-yl) -9H-carbazole ( DFC), 2,2′-bis (4-carbazol-9-yl) phenyl) -biphenyl (BCBP), 9,9 ′-((2,6-diphenylbenzo [1,2-b: 4,5- b ′] carbazole derivatives such as difuran-3,7-diyl) bis (4,1-phenylene)) bis (9H-carbazole) (CZBDF); 4- (diphenylphosphoyl) Aniline derivatives such as -N, N-diphenylaniline (HM-A1); 1,3-bis (9-phenyl-9H-fluoren-9-yl) benzene (mDPFB), 1,4-bis (9-phenyl- 9H-fluoren-9-yl) benzene (pDPFB), 2,7-bis (carbazol-9-yl) -9,9-dimethylfluorene (DMFL-CBP), 2- [9,9-di (4-methyl) Phenyl) -fluoren-2-yl] -9,9-di (4-methylphenyl) fluorene (BDAF), 2- (9,9-spirobifluoren-2-yl) -9,9-spirobifluorene ( BSBF), 9,9-bis [4- (pyrenyl) phenyl] -9H-fluorene (BPPF), 2,2′-dipyrenyl-9,9-spirobifluorene (Spiro-Pye), 2,7 -Dipyrenyl-9,9-spirobifluorene (2,2'-Spiro-Pye), 2,7-bis [9,9-di (4-methylphenyl) -fluoren-2-yl] -9,9- Di (4-methylphenyl) fluorene (TDAF), 2,7-bis (9,9-spirobifluoren-2-yl) -9,9-spirobifluorene (TSBF), 9,9-spirobifluorene- Fluorene derivatives such as 2-yl-diphenyl-phosphine oxide (SPPO1); pyrene derivatives such as 1,3-di (pyren-1-yl) benzene (m-Bpye); propane-2,2′-diylbis (4 , 1-phenylene) dibenzoate (MMA1) and the like; 4,4′-bis (diphenylphosphine oxide) biphenyl (PO1), 2,8-bis (di) Phosphine oxide derivatives such as phenylphosphoryl) dibenzo [b, d] thiophene (PPT); terphenyl derivatives such as 4,4 ″ -di (triphenylsilyl) -p-terphenyl (BST); 2,4 Examples include triazine derivatives such as -bis (phenoxy) -6- (3-methyldiphenylamino) -1,3,5-triazine (BPMT).

  Polymer light emitting materials used for the light emitting layer 47 include poly (2-decyloxy-1,4-phenylene) (DO-PPP), poly [2,5-bis- [2- (N, N, N-triethyl). Ammonium) ethoxy] -1,4-phenyl-alt-1,4-phenyllene] dibromide (PPP-NEt3 +), poly [2- (2′-ethylhexyloxy) -5-methoxy-1,4-phenylenevinylene ] (MEH-PPV), poly [5-methoxy- (2-propanoxysulfonide) -1,4-phenylenevinylene] (MPS-PPV), poly [2,5-bis- (hexyloxy) -1 , 4-phenylene- (1-cyanovinylene)] (CN-PPV), etc .; poly (9,9-dioctylfluorene) (PDAF), etc. B derivatives; poly (N- vinylcarbazole) (PVK) carbazole derivatives such like.

  The organic light emitting material is preferably a low molecular light emitting material, and a phosphorescent material having high light emission efficiency is preferably used from the viewpoint of reducing power consumption.

As a luminescent dopant used for the light emitting layer 47, a well-known dopant for organic EL elements can be used. Examples of such a dopant include p-quaterphenyl, 3,5,3,5-tetra-tert-butylsecphenyl, 3,5,3,5-tetra-tert-butyl-p in the case of an ultraviolet light emitting material. -Fluorescent materials such as quinckphenyl. Further, in the case of a blue light emitting material, a fluorescent light emitting material such as a styryl derivative; bis [(4,6-difluorophenyl) -pyridinato-N, C2 ′] picolinate iridium (III) (FIrpic), bis (4 ′, 6 Examples include phosphorescent organic metal complexes such as' -difluorophenylpolydinato) tetrakis (1-pyrazoyl) borate iridium (III) (FIr ₆ ). In addition, a phosphorescent organic metal complex such as tris (2-phenylpyridinate) iridium (Ir (ppy) ₃ ) may be used as a green light emitting material.
The thickness of the light emitting layer 47 is preferably 5 nm to 500 nm.

  Examples of the material of the electron transport layer 48 include n-type semiconductor inorganic materials, oxadiazole derivatives, triazole derivatives, thiopyrazine dioxide derivatives, benzoquinone derivatives, naphthoquinone derivatives, anthraquinone derivatives, diphenoquinone derivatives, fluorenone derivatives, and the like. Molecular materials; polymer materials such as poly (oxadiazole) (Poly-OXZ) and polystyrene derivatives (PSS) can be used.

The electron injection layer 49 is provided in order to efficiently receive electrons from the second electrode 43 and transfer them efficiently to the electron transport layer 48. Examples of the material of the electron injection layer 49 include fluorides such as lithium fluoride (LiF) and barium fluoride (BaF ₂ ), and oxides such as lithium oxide (Li ₂ O).

  In order to perform electron injection and transport more efficiently, the material used for the electron injection layer 49 preferably has a higher LUMO level than the material used for the electron transport layer 48. The material used for the electron transport layer 48 is preferably a material having a higher electron mobility than the material used for the electron injection layer 49.

  Note that the configuration of the organic EL layer 41 is not limited to this, and can be appropriately set as necessary. For example, hole transport layer / light emitting layer / electron transport layer configuration, hole injection layer / hole transport layer / light emitting layer / electron transport layer / electron injection layer configuration, hole injection layer / hole transport layer / An electron blocking layer / light emitting layer / hole blocking layer / electron injection layer can also be used.

  The formation method of each layer constituting the organic EL layer 41 includes a dry process such as a vacuum evaporation method, and a wet process such as a doctor blade method, a dip coating method, a micro gravure method, a spray method, an ink jet method, and a printing method. Can be used. In the wet process, in consideration of the influence of oxygen and moisture on the organic EL layer 41 and the like, the treatment is preferably performed in an inert gas atmosphere or in a vacuum condition. Moreover, after forming each layer, it is preferable to perform a drying process by heating or the like in order to remove the solvent. In that case, it is preferable to perform a drying process in inert gas atmosphere, and it is more preferable to carry out under reduced pressure.

  The sealing layer 17 seals the plurality of organic EL elements 40 provided on the one surface 11 a of the substrate 11. The sealing layer 17 is formed so as to cover the surfaces of the first bank 16 and the organic EL element 40 partitioned by the first bank 16. By the sealing layer 17, it is possible to prevent oxygen, moisture, and mixing into the organic EL element 40 from the outside. As a result, the life of the organic EL element 40 can be improved.

  Examples of the method for forming the sealing layer 17 include EB vapor deposition, sputtering, ion plating, and resistance heating vapor deposition. Moreover, as a material of the sealing layer 17, if it is an organic substance, a phthalocyanine etc. will be mentioned, and if it is an inorganic substance, SiON, SiO, SiN etc. will be mentioned.

"Encapsulation substrate (wavelength conversion substrate)"
The sealing substrate (wavelength conversion substrate) 20 includes a transparent substrate 21, a color filter layer (color adjustment layer) 22 formed on the transparent substrate 21, a color conversion layer (wavelength conversion layer) 23, and a second bank 25. And is configured.

  Although it does not specifically limit as the transparent substrate 21, The board | substrate which has the light transmittance used with the conventional organic EL display apparatus is used. Examples of the material of the transparent substrate 21 include a transparent inorganic glass substrate, various transparent plastic substrates, and various transparent films.

The second bank 25 is formed between the sub-pixels S, and the red pixel portion S (R) and the green pixel portion S (G) of the color filter layer 22 on one surface 21a of the transparent substrate 21. Are formed between the blue pixel portions S (B).
Specifically, the second bank 25 includes a first end face 25a facing the transparent substrate 21, a second end face 25b facing the first end face 25a and having an area smaller than the area of the first end face 25a, and a side face 25c. And a forward tapered shape. Here, the “forward taper shape” refers to a taper shape whose cross-sectional shape becomes narrower in a direction away from the transparent substrate 21.

  An organic resin can be used as the material of the second bank 25. As a method of forming the second bank 25, a coating method can be used, and it is particularly preferable to use a photo process. The film thickness of the second bank 25 is preferably a layer thickness that can prevent the color conversion layer material from overflowing outside a predetermined sub-pixel region when the color conversion layer 23 is formed by the ink jet coating method.

The color filter layer 22 obtains light having a specific wavelength and has a function of reducing light having other wavelengths.
The color filter layer 22 includes a red color filter 22R, a green color filter 22G, and a blue color filter 22B formed on one surface 21a of the transparent substrate 21. The red color filter 22R sets the red pixel portion S (R), the green color filter 22G sets the green pixel portion S (G), and the blue color filter 22B sets the blue pixel portion S (B). Become.
The color filter layer 22 in this embodiment has a lower refractive index than the color conversion layer 23.

  The second bank 25 is preferably made of a heat conductive material or a heat radiating material in its entirety or on the surface (first end surface 25a, second end surface 25b, side surface 25c).

  As the heat conductive material or the heat radiation material, the same material as that of the first bank 16 is used.

When the surface of the second bank 25 is made of a heat conductive material or a heat radiating material, a thin film made of a heat conductive material or a heat radiating material is provided on the surface of the second bank 25.
As a method of forming a thin film made of a heat conductive material or a heat radiative material on the surface of the second bank 25, the above-described heat conductive material or heat radiative material is used, for example, chemical vapor deposition (CVD). ) Method, dry process such as vacuum deposition, and wet process such as spin coating.

The color filter layer 22 obtains light having a specific wavelength and has a function of reducing light having other wavelengths.
The color filter layer 22 includes a red color filter 22R, a green color filter 22G, and a blue color filter 22B formed on one surface 21a of the transparent substrate 21. The red color filter 22R sets the red pixel portion S (R), the green color filter 22G sets the green pixel portion S (G), and the blue color filter 22B sets the blue pixel portion S (B). Become.
The color filter layer 22 in this embodiment has a lower refractive index than the color conversion layer 23.

  The color conversion layer 23 has a function of absorbing incident light and emitting light in different wavelength ranges. Specifically, the color conversion layer 23 absorbs a part of incident light (light emitted from the plurality of organic EL elements 40 mounted on the substrate 11), performs wavelength distribution conversion, and does not absorb incident light. This is a layer for emitting light including minute and converted light (light having a wavelength distribution different from that of incident light).

  The color conversion layer 23 is a layer composed of a plurality of types of color conversion dyes, and in the present embodiment, includes a red phosphor layer 23R and a green phosphor layer 23G. The red phosphor layer 23R and the green phosphor layer 23G are selected at positions corresponding to the sub pixel S (R) and the sub pixel S (G) among the sub pixels partitioned by the second bank 25 on the transparent substrate 21. Provided. The red phosphor layer 23R is laminated on the surface of the red color filter 22R at a position corresponding to the red pixel portion S (R). The green phosphor layer 23G is a position corresponding to the green pixel portion S (G) and is laminated on the surface of the green color filter 22G.

  As the color conversion dye, at least one fluorescent dye that emits fluorescence in the red region may be used, and may be combined with one or more fluorescent dyes that emit fluorescence in the green region. That is, when the organic EL element 40 that emits light from the blue region to the blue-green region is used as the light source, if the light from the organic EL device 40 is passed through a simple red filter to obtain light in the red region, The output light becomes extremely dark because there is little light of the wavelength of. Therefore, by converting the light from the blue region to the blue-green region from the organic EL element 40 into the red region light by the fluorescent dye of the color conversion layer 23, it is possible to output the red region light having sufficient intensity. Become.

  On the other hand, the light in the green region may be output by converting the light from the organic EL element 40 into the light in the green region by another organic fluorescent dye, similarly to the light in the red region. Alternatively, if the light emission of the organic EL element 40 sufficiently includes light in the green region, the light from the organic EL element 40 may be simply output through the green filter.

  Among the light emitted from the organic EL element 40, the fluorescent dyes that absorb light from the blue region to the blue-green region and emit fluorescence in the red region include, for example, rhodamine B, rhodamine 6G, rhodamine 3B, rhodamine 101, Rhodamine 110, sulforhodamine, basic violet 11, basic red 2 and other rhodamine dyes, cyanine dyes, 1-ethyl-2- [4- (p-dimethylaminophenyl) -1,3-butadienyl] -pyridinium perchlorate Examples thereof include pyridine dyes such as (pyridine 1) or oxazine dyes. Furthermore, various dyes (direct dyes, acid dyes, basic dyes, disperse dyes, etc.) can be used if they are fluorescent.

  Among the light emitted from the organic EL element 40, as a fluorescent dye that absorbs light in the blue region to blue-green region and emits fluorescence in the green region, for example, 3- (2′-benzothiazolyl) -7-diethylamino Coumarin (coumarin 6), 3- (2′-benzimidazolyl) -7-N, N-diethylaminocoumarin (coumarin 7), 3- (2′-N-methylbenzimidazolyl) -7-N, N-diethylaminocoumarin (coumarin) 30), coumarin dyes such as 2,3,5,6-1H, 4H-tetrahydro-8-trifluoromethylquinolidine (9,9a, 1-gh) coumarin (coumarin 153), or coumarin dyes Some basic yellow 51, and naphthalimide dyes such as Solvent Yellow 11 and Solvent Yellow 116 are listed. It is. Furthermore, various dyes (direct dyes, acid dyes, basic dyes, disperse dyes, etc.) can be used if they are fluorescent.

  The organic fluorescent dyes used in the present embodiment are polymethacrylic acid ester, polyvinyl chloride, vinyl chloride-vinyl acetate copolymer resin, alkyd resin, aromatic sulfonamide resin, urea resin, melamine resin, benzoguanamine resin and these. An organic fluorescent pigment may be obtained by kneading into a resin mixture or the like in advance to obtain a pigment. In addition, these organic fluorescent dyes and organic fluorescent pigments (hereinafter, organic fluorescent dyes and organic fluorescent pigments are collectively referred to as organic fluorescent dyes) may be used alone or in order to adjust the hue of fluorescence. You may use combining more than a seed.

  The organic fluorescent dye used in the present embodiment contains 0.01% by mass to 5% by mass, more preferably 0.1% by mass to 2% by mass, based on the mass of the color conversion layer 23 with respect to the color conversion layer 23. Is done. If the content of the organic fluorescent dye is less than 0.01% by mass with respect to the mass of the color conversion layer 23, sufficient wavelength conversion cannot be performed. Further, if the content of the organic fluorescent dye exceeds 5% by mass with respect to the mass of the color conversion layer 23, the color conversion efficiency is lowered due to the effect of concentration quenching or the like.

  The matrix resin used in the color conversion layer 23 of the present embodiment is polymerized or crosslinked by photocuring or photothermal combination curable resin (resist) by light and / or heat treatment to generate radical species or ion species. And insoluble and infusible.

  Moreover, as a material of the color conversion layer 23 required for patterning, it is desirable to have a photocurable or photothermal combination type curable resin and to be soluble in an organic solvent or an alkaline solution in an unexposed state.

  Specifically, the photocurable or photothermal combination type curable resin comprises (1) a composition comprising an acrylic polyfunctional monomer and oligomer having a plurality of acryloyl groups and methacryloyl groups, and photo or thermal polymerization initiator, (2 ) A composition comprising a polyvinylcinnamic acid ester and a sensitizer, (3) a composition comprising a chain or cyclic olefin and bisazide, and (4) a composition comprising an epoxy group-containing monomer and an acid generator, etc. including. In particular, the composition comprising the acrylic polyfunctional monomer and oligomer (1) and photo or thermal polymerization initiator is capable of high-definition patterning and has high reliability such as solvent resistance and heat resistance. To preferred. As described above, the matrix resin is formed by applying light and / or heat to the photocurable or photothermal combination type curable resin.

The photopolymerization initiator, sensitizer, and acid generator that can be used in the present embodiment are preferably those that initiate polymerization by light having a wavelength that is not absorbed by the fluorescent conversion dye contained therein.
In the color conversion layer 23, when the photocurable resin or the resin in the photothermal combination curable resin can be polymerized by light or heat, a photopolymerization initiator and a thermal polymerization initiator are added. It is also possible not to.

  In addition, an auxiliary electrode (auxiliary wiring) 26 made of metal is provided between the transparent substrate 21 and the second bank 25. Further, a feeding point 27 for connecting to the auxiliary electrode 26 with an external power source (not shown) is provided on the first end face 25 a of the second bank 25.

The auxiliary electrode 26 can be formed using a known material, and examples thereof include Cu, Ag, Au, Pt, Al, Cr, Co, and Mo.
The feeding point 27 can be formed using a known material, and examples of the material include silver paste and carbon paste.

In the organic EL display device 100 of the present embodiment, the organic EL element substrate 10 and the sealing are provided so that the first bank 16 of the organic EL element substrate 10 and the second bank 25 of the sealing substrate 20 are connected (contacted). The stop substrate 20 is disposed to face the stop substrate 20.
That is, as shown in FIG. 1, the first end face 16 a of the first bank 16 and the first end face 25 a of the second bank 25 are in contact with each other, and the first bank 16 and the second bank 25 are connected. .

  The organic EL element substrate 10 and the sealing substrate 20 are bonded together via a seal member 31 disposed along the peripheral edge of either the organic EL element substrate 10 or the sealing substrate 20.

The filling layer 30 is provided between the organic EL element substrate 10 and the sealing substrate 20 and in a space surrounded by the sealing member 31.
The filling layer 30 is made of a transparent medium. As the transparent medium, air, an inert gas such as nitrogen gas or argon gas, or a resin material having a low refractive index is used.

Moreover, as a transparent medium, electroconductive fillers, such as an ionic liquid, are preferable. Examples of the cation constituting the ionic liquid include a tetraalkylammonium ion, a tetraalkylphosphonium ion, a dialkylpiperidinium ion, a dialkylimidazolium ion, a trialkylimidazolium ion, a trialkylsulfonium ion, and an alkylpyridinium ion.
By using a conductive filler as a transparent medium constituting the filling layer 30, heat generated in the organic EL layer 41 of the organic EL element 40, heat due to driving of the TFT circuit 12 and wiring resistance, Thus, it can be efficiently discharged to the outside of the device (on the transparent substrate 21 side of the sealing substrate 20).

  Examples of the anion constituting the ionic liquid include hexafluorophosphate ion, tetrafluoroborate ion, methanesulfonate ion, chloride ion, bromide ion, acetate ion, trifluoroacid ion, thiocyanate ion, dicyanamide. Ion, bis (trifluoromethanesulfonyl) imide ion, dibutyl phosphate ion and the like.

  When an ionic liquid is used as the transparent conductive filler, it is preferable that the ionic liquid has a melting point of room temperature or lower, a liquid having a low viscosity near room temperature, and a liquid having absorption in the ultraviolet region.

  In the organic EL display device 100 of the present embodiment, light emission (excitation light) from the organic EL element 40 is light from the blue region to the blue-green region. In the blue pixel portion S (B), light emitted from the organic EL element 40 passes through the blue color filter 22B, thereby reducing green light emission and obtaining blue light emission with high color purity. In the green pixel portion S (G), the light from the organic EL element 40 is first converted to substantially green by transmitting through the green phosphor layer 23G, and further converted to approximately green by transmitting through the green color filter 22G. Of the emitted light, light having a wavelength close to blue is reduced to obtain green light emission. In the red pixel portion S (R), the light from the organic EL element 40 is first converted to substantially red by transmitting through the red phosphor layer 23R, and further converted to substantially red by transmitting through the red color filter 22R. Of the converted light, light having a wavelength close to green is reduced to obtain red light emission.

  According to the organic EL display device 100 of the present embodiment, since the first bank 16 and the second bank 25 are connected, the heat generated in the organic EL layer 41 of the organic EL element 40, the driving of the TFT circuit 12, and so on. In addition, heat due to wiring resistance can be efficiently released to the outside of the device (on the transparent substrate 21 side of the sealing substrate 20). That is, the heat generated in the organic EL layer 41 and the TFT circuit 12 is transferred to the outside of the device (on the transparent substrate 21 side of the sealing substrate 20) via the first bank 16, the second bank 25, the auxiliary electrode 26 and the feeding point 27. ) Can be released. Therefore, the heat generated in the organic EL layer 41 and the TFT circuit 12 is retained in the device, and the organic EL element 40 can be prevented from being destroyed by the heat.

  Further, the whole or surface of the first bank 16 is made of a heat conductive material or a heat radiating material, and the whole or surface of the second bank 25 is made of a heat conductive material or a heat radiating material. Then, the first bank 16 and the second bank 25 can be electrically connected, so that the heat generated in the organic EL layer 41 and the TFT circuit 12 can be more efficiently transferred outside the device (sealing substrate). 20 transparent substrate 21 side).

  In the present embodiment, the case where all the first banks 16 and the second banks 25 are electrically connected is illustrated, but the present embodiment is not limited to this. In the present embodiment, it is only necessary that the first bank 16 and the second bank 25 are electrically connected at least at one location. The number of locations where the first bank 16 and the second bank 25 are electrically connected is appropriately adjusted according to the size of the organic EL display device 100 and the like. That is, the number of locations where the first bank 16 and the second bank 25 are electrically connected is appropriately adjusted according to the amount of heat generated in the organic EL layer 41 and the TFT circuit 12.

[Second Embodiment]
FIG. 3 is a cross-sectional view showing a schematic configuration of an organic EL display device according to the second embodiment of the present invention. In FIG. 3, the same components as those of the organic EL display device 100 shown in FIG.
The organic EL display device 110 of the present embodiment is different from the organic EL display device 100 of the first embodiment described above in that a reflective film 111 is provided on the side surface 16c of the first bank 16.

  By providing the reflective film 111 on the side surface 16 c of the first bank 16, among the isotropic light emission from the organic EL element 40, light is emitted in the side surface direction (waveguide component through the organic EL element 40), and the sealing substrate 20. The loss component of light emission that cannot be extracted to the side is reflected and scattered in the desired pixel by the reflection film 111, so that the light emission can be used effectively, and the light emission leaks to other than the desired pixel. It is possible to prevent a decrease in color purity due to.

The material for forming the reflective film 111 is not particularly limited, and examples thereof include a reflective film such as a metal such as gold, silver, and aluminum, and a scattering film such as titanium oxide.
Examples of the method for forming the reflective film 111 on the side surface 16c of the first bank 16 include a dry process such as a chemical vapor deposition (CVD) method and a vacuum deposition method, and a wet process such as a spin coating method.

  In the present embodiment, the case where the reflective film 111 is provided on the side surface 16c of the first bank 16 is illustrated, but the present embodiment is not limited to this. In the present embodiment, a reflective film made of the same material as that of the reflective film 111 may also be provided on the side surface 25 c of the second bank 25.

[Third Embodiment]
FIG. 4 is a cross-sectional view showing a schematic configuration of an organic EL display device according to the third embodiment of the present invention. In FIG. 4, the same components as those of the organic EL display device 100 shown in FIG.
The organic EL display device 120 of the present embodiment is different from the organic EL display device 100 of the first embodiment described above in that the second bank 25 of the sealing substrate 20 is different from the first end surface 25a facing the transparent substrate 21. Is that the area of the second end face 25 b on the opposite side is larger than the area of the first end face 25 a facing the transparent substrate 21, and has an inversely tapered shape. Here, the “reverse taper shape” refers to a taper shape whose cross-sectional shape becomes thicker in a direction away from the transparent substrate 21.

  By making the shape of the second bank 25 of the sealing substrate 20 into an inversely tapered shape, light emitted from the organic EL element 40 enters the color conversion layer 23 of the sealing substrate 20 and is converted in wavelength by the color conversion layer 23. The emitted light can be effectively emitted (propagated) to the transparent substrate 21 side.

[Fourth Embodiment]
FIG. 5 is a cross-sectional view showing a schematic configuration of an organic EL display device according to the fourth embodiment of the present invention. In FIG. 5, the same components as those of the organic EL display device 100 shown in FIG.
The organic EL display device 130 according to the present embodiment is different from the organic EL display device 100 according to the first embodiment described above in that the second bank 25 of the sealing substrate 20 has a reverse taper shape and is sealed. The reflection film 131 is provided on the side surface 25c of the second bank 25 of the stop substrate 20.

  By providing the reflective film 131 on the side surface 25c of the second bank 25, light emission in the side surface direction (color conversion layer 23) isotropic light emission from the color conversion layer 23 (red phosphor layer 23R, green phosphor layer 23G). The loss component of light emission that cannot be extracted to the transparent substrate 21 side is reflected and scattered in a desired pixel by the reflective film 131 so that the light emission can be used effectively. Thus, it is possible to prevent a decrease in color purity due to leakage of light emission to other than the desired pixel. In addition, the light emitted from the color conversion layer 23 can be reflected in each pixel, and the light emission from the color conversion layer 23 can be used effectively, so that the light emission efficiency can be improved and the power consumption can be reduced. Can be reduced.

A material for forming the reflective film 131 is not particularly limited, and examples thereof include a reflective film made of metal such as gold, silver, and aluminum, and a scattering film made of titanium oxide.
Examples of the method for forming the reflective film 131 on the side surface 25c of the second bank 25 include a dry process such as a chemical vapor deposition (CVD) method and a vacuum deposition method, and a wet process such as a spin coating method.

[Fifth Embodiment]
FIG. 6 is a cross-sectional view showing a schematic configuration of an organic EL display device according to the fifth embodiment of the present invention. In FIG. 6, the same components as those of the organic EL display device 100 shown in FIG. 1, the organic EL display device 110 shown in FIG. 3, and the organic EL display device 130 shown in FIG. The description is omitted.
The organic EL display device 140 of the present embodiment is different from the organic EL display device 100 of the first embodiment described above in that the second bank 25 of the sealing substrate 20 has an inversely tapered shape, the first bank The reflective film 111 is provided on the side surface 16c of the 16th and the reflective film 131 is provided on the side surface 25c of the second bank 25 of the sealing substrate 20.

[Sixth Embodiment]
FIG. 7 is a cross-sectional view showing a schematic configuration of an organic EL display device according to the sixth embodiment of the present invention. In FIG. 7, the same components as those of the organic EL display device 100 shown in FIG. 1, the organic EL display device 110 shown in FIG. 3, and the organic EL display device 130 shown in FIG. The description is omitted.
The organic EL display device 150 of the present embodiment is different from the organic EL display device 100 of the first embodiment described above in that the second bank 25 of the sealing substrate 20 has an inversely tapered shape, the first bank 16 is provided with the reflective film 111 on the side surface 16c, the reflective film 131 is provided on the side surface 25c of the second bank 25 of the sealing substrate 20, and the first bank 16 and the second bank. 25 is a columnar or spherical conductive spacer 151.

  As the conductive spacer 151, gold-plated silica beads or spherical or columnar metal particles are used. Anything may be used as long as safety and conductivity are high.

  The conductive spacer 151 is disposed between the first bank 16 and the second bank 25, that is, between the second end face 16b of the first bank 16 and the second end face 25b of the second bank 25. The first bank 16 and the second bank 25 can be reliably connected. For example, when the organic EL element substrate 10 and the sealing substrate 20 are disposed to face each other, the conductive spacer 151 is disposed even if there is a gap between the first bank 16 and the second bank 25. Thus, the first bank 16 and the second bank 25 can be reliably connected. In particular, when the first bank 16 and the second bank 25 are made of a heat conductive material or a heat radiation material, a conductive spacer 151 is disposed between the first bank 16 and the second bank 25. As a result, the first bank 16 and the second bank 25 can be reliably electrically connected. Thereby, the heat generated in the organic EL layer 41 and the TFT circuit 12 can be more efficiently released to the outside of the device (on the transparent substrate 21 side of the sealing substrate 20).

[Seventh Embodiment]
FIG. 8 is a cross-sectional view showing a schematic configuration of an organic EL display device according to the seventh embodiment of the present invention. 8, the same components as those of the organic EL display device 100 shown in FIG. 1, the organic EL display device 110 shown in FIG. 3, and the organic EL display device 130 shown in FIG. The description is omitted.
The organic EL display device 160 of the present embodiment is different from the organic EL display device 100 of the first embodiment described above in that the second bank 25 of the sealing substrate 20 has an inversely tapered shape, the first bank 16 is provided with the reflective film 111 on the side surface 16c, the reflective film 131 is provided on the side surface 25c of the second bank 25 of the sealing substrate 20, and the first bank 16 and the second bank. 25, a metal fine wire 161 is disposed.

  As the metal thin wire 161, Au, Pt, Cu, Ni, Cr, Al, or the like is used.

  By arranging the fine metal wire 161 between the first bank 16 and the second bank 25, that is, between the second end face 16b of the first bank 16 and the second end face 25b of the second bank 25, The first bank 16 and the second bank 25 can be reliably connected. For example, when the organic EL element substrate 10 and the sealing substrate 20 are disposed to face each other, even if there is a gap between the first bank 16 and the second bank 25, by arranging the metal thin wire 161, The first bank 16 and the second bank 25 can be reliably connected. In particular, when the first bank 16 and the second bank 25 are made of a heat conductive material or a heat radiation material, the fine metal wires 161 are disposed between the first bank 16 and the second bank 25. Thus, the first bank 16 and the second bank 25 can be reliably electrically connected. Thereby, the heat generated in the organic EL layer 41 and the TFT circuit 12 can be more efficiently released to the outside of the device (on the transparent substrate 21 side of the sealing substrate 20).

[Eighth Embodiment]
FIG. 9 is a cross-sectional view showing a schematic configuration of an organic EL display device according to the eighth embodiment of the present invention. 9, the same components as those of the organic EL display device 100 shown in FIG. 1, the organic EL display device 110 shown in FIG. 3, and the organic EL display device 130 shown in FIG. The description is omitted.
The organic EL display device 170 of the present embodiment is different from the organic EL display device 100 of the first embodiment described above in that the second bank 25 of the sealing substrate 20 has an inversely tapered shape, the first bank The reflective film 111 is provided on the side surface 16c of the 16th side, the reflective film 131 is provided on the side surface 25c of the second bank 25 of the sealing substrate 20, and the first bank 16 includes the first side thereof. A feeding point 171 is provided with the two end face 16b as a base end and extending toward the first end face 16a. The feeding point 171 and the TFT circuit 12 are connected to an external power source 180 via conductors 172 and 173. It is a point.

[Ninth Embodiment]
FIG. 10 is a cross-sectional view showing a schematic configuration of an organic EL display device according to the ninth embodiment of the present invention. 10, the organic EL display device 100 shown in FIG. 1, the organic EL display device 110 shown in FIG. 3, the organic EL display device 130 shown in FIG. 5, and the organic EL display device 170 shown in FIG. The same components are denoted by the same reference numerals, and the description thereof is omitted.
The organic EL display device 190 of the present embodiment is different from the organic EL display device 100 of the first embodiment described above in that the second bank 25 of the sealing substrate 20 has an inversely tapered shape, the first bank 16 is provided with a reflective film 111 on the side surface 16c, is provided with a reflective film 131 on the side surface 25c of the second bank 25 of the sealing substrate 20, and has a second end face on the first bank 16. A feeding point 171 is provided with 16b as a base end and extending toward the first end face 16a. The feeding point 171 and the TFT circuit 12 are connected to an external power source 180 via conductors 172 and 173. The thin metal wire 191 extending from the first end surface 25 a side to the second end surface 25 b side is provided on the point and the second bank 25, and the thin metal wire 191 is provided between the transparent substrate 21 and the second bank 25. Installed in In that Interview shaped metal thin wire 192 is connected.
The second bank 25 is preferably an insulator in order to prevent current from leaking to the thin metal wires 191 and 192 from the feeding point of the first bank 16 through the second bank 25.

  Since the mesh-shaped fine metal wire 192 is disposed between the transparent substrate 21 and the second bank 25, heat generated in the organic EL layer 41 of the organic EL element 40, driving of the TFT circuit 12, and wiring Heat generated by the resistance is transmitted to the fine metal wire 192 through the first bank 16, the second bank 25, the filling layer 30, and the fine metal wire 191, and the metal fine wire 192 is connected to the outside of the device (the transparent substrate 21 of the sealing substrate 20). Side).

[Tenth embodiment]
FIG. 11 is a cross-sectional view showing a schematic configuration of an organic EL display device according to the tenth embodiment of the present invention. 11, the organic EL display device 100 shown in FIG. 1, the organic EL display device 110 shown in FIG. 3, the organic EL display device 130 shown in FIG. 5, and the organic EL display device 170 shown in FIG. The same components are denoted by the same reference numerals, and the description thereof is omitted.
The organic EL display device 200 of the present embodiment is different from the organic EL display device 100 of the first embodiment described above in that the second bank 25 of the sealing substrate 20 has an inversely tapered shape, the first bank The reflective film 111 is provided on the side surface 16c of the sixteenth surface, the reflective film 131 is provided on the side surface 25c of the second bank 25 of the sealing substrate 20, and the second bank 25 is provided with the first film. A feeding point 201 is provided with the second end face 25b as a base end and extending toward the first end face 25a. The feeding point 201 and the TFT circuit 12 are connected to an external power source 180 via conductors 172 and 173. It is a point.

  In the first to tenth embodiments, the case where all the second banks 25 of the sealing substrate 20 are equal in height is illustrated, but the first to tenth embodiments are not limited to this. In the first to tenth embodiments, the height of the second bank 25 may be partially different. In this way, a gap can be partially formed between the first bank 16 and the second bank 25, so that the organic EL element substrate 10 and the wavelength conversion substrate 20 are pasted via the filler. When combining, the filler can be sufficiently expanded over the entire surface of the organic EL element substrate 10 and the entire surface of the wavelength conversion substrate 20, so that the distance (interval) between the organic EL element substrate 10 and the wavelength conversion substrate 20 is increased. Can be small. Thereby, it becomes easy to connect the first bank 16 and the second bank 25.

  The present invention is applicable to an organic electroluminescence display device.

DESCRIPTION OF SYMBOLS 10 ... Organic EL element substrate, 11 ... Substrate, 12 ... TFT circuit, 13 ... Interlayer insulating film, 14 ... Planarization film, 15 ... Active matrix substrate, 16 ... 1st bank, 17 ... sealing layer, 20 ... sealing substrate (wavelength conversion substrate), 21 ... transparent substrate, 22 ... color filter layer, 23 ... color conversion layer (wavelength conversion) Layer), 24 ... pixel, 25 ... second bank, 26 ... auxiliary electrode, 27, 171, 201 ... feeding point, 30 ... filling layer, 31 ... sealing member, 40 ... Organic EL element, 41 ... Organic EL layer, 42 ... First electrode, 43 ... Second electrode, 44 ... Hole injection layer, 45 ... Hole transport layer, 46 ... Electron blocking layer, 47 ... Light emitting layer, 48 ... Electron transport layer, 49 ... Electron injection layer, 100, 10, 120, 130, 140, 150, 160, 170, 190, 200 ... organic electroluminescence display device (organic EL display device), 111, 131 ... reflective film, 151 ... conductive spacer, 161 , 191, 192 ... fine metal wires, 172, 173 ... conductors, 180 ... external power source.

Claims (12)

An organic electroluminescence device comprising a substrate, an organic electroluminescence device formed on one surface of the substrate, and a plurality of first banks formed on one surface of the substrate and partitioning the organic electroluminescence device A substrate,
A transparent substrate, a color conversion layer formed on one surface of the transparent substrate, and a plurality of second banks formed on one surface side of the transparent substrate and partitioning the transparent substrate into a plurality of regions. A sealing substrate having,
The organic electroluminescence element substrate and the sealing substrate are disposed to face each other so that the first bank and the second bank are connected to at least one place.
An organic electroluminescence display device, wherein an auxiliary electrode made of metal is provided between the transparent substrate and the second bank, and a feeding point for connecting to an external power source is provided on the auxiliary electrode. .   2. The organic electroluminescence display device according to claim 1, wherein the first bank and the second bank are made of a heat conductive material or a heat radiation material.   The organic electroluminescence display device according to claim 1, wherein a reflective film is provided on a side surface of the first bank.   The organic electroluminescence display device according to claim 1, wherein a reflective film is provided on a side surface of the second bank.   The second bank includes a first end surface facing one surface of the transparent substrate, a second end surface facing the first end surface and having an area smaller than the area of the first end surface, and a side surface. It is comprised, The organic electroluminescent display apparatus of any one of Claims 1-4 characterized by the above-mentioned.   The second bank includes a first end surface facing one surface of the transparent substrate, a second end surface facing the first end surface and having an area larger than the area of the first end surface, and a side surface. It is comprised, The organic electroluminescent display apparatus of any one of Claims 1-4 characterized by the above-mentioned.   The organic electroluminescence display device according to claim 1, wherein a columnar or spherical conductive spacer is disposed between the first bank and the second bank. .   The organic electroluminescence display device according to claim 1, wherein a thin metal wire is disposed between the first bank and the second bank.   The organic electroluminescence display device according to any one of claims 1 to 8, wherein a fine metal wire in a mesh shape is disposed between the transparent substrate and the second bank.   The organic material according to claim 1, wherein a filler layer filled with a conductive filler is provided between the organic electroluminescence element substrate and the sealing substrate. Electroluminescence display device. An organic electroluminescence device comprising a substrate, an organic electroluminescence device formed on one surface of the substrate, and a plurality of first banks formed on one surface of the substrate and partitioning the organic electroluminescence device A substrate,
A transparent substrate, a color conversion layer formed on one surface of the transparent substrate, and a plurality of second banks formed on one surface side of the transparent substrate and partitioning the transparent substrate into a plurality of regions. A sealing substrate having,
The organic electroluminescence element substrate and the sealing substrate are disposed to face each other so that the first bank and the second bank are connected to at least one place.
An organic electroluminescence display device, wherein a feeding point for connecting to an external power source is provided in the first bank. An organic electroluminescence device comprising a substrate, an organic electroluminescence device formed on one surface of the substrate, and a plurality of first banks formed on one surface of the substrate and partitioning the organic electroluminescence device A substrate,
A transparent substrate, a color conversion layer formed on one surface of the transparent substrate, and a plurality of second banks formed on one surface side of the transparent substrate and partitioning the transparent substrate into a plurality of regions. A sealing substrate having,
The organic electroluminescence element substrate and the sealing substrate are disposed to face each other so that the first bank and the second bank are connected to at least one place.
An organic electroluminescence display device, wherein a feeding point for connecting to an external power source is provided in the second bank.

Images