CN114013059A - 一种注塑高频覆铜板的制造方法 - Google Patents
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Abstract
本发明涉及一种注塑高频覆铜板的制造方法。重新配置了注塑基材的材料,添加了环糊精、二氧化硅、氢氧化镁、纳米氧化铝和聚乙烯;其中环糊精和聚乙烯的加入有利于降低覆铜板的介电损耗;氢氧化镁、纳米氧化铝和二氧化硅的加入能够提高激光加工时的表面吸光和处理效果;使用双激光进行贴敷铜膜前的表面处理,有利于提高铜膜和基板的结合效果,同时提高后续辊压的稳定性;在进行注塑前使用离心机进行离心,去除气泡的同时能够充分去除底部的杂质。
Description
技术领域
本发明涉及覆铜板制备技术领域,尤其涉及一种注塑高频覆铜板的制造方法。
背景技术
覆铜板是电子工业的基础材料,是绝大多数电子产品达到电路互连不可缺少的主要组成部件,可分为纸基板、复合基板、FR-4覆铜板、无卤板、高频覆铜板、封装基板等。覆铜板技术演进经历了“普通板→无铅无卤板→高频高速/车用/IC封装/高导热板”的逐步升级过程,随着通信技术的发展,高频覆铜板的使用越来越多。
申请号CN201710485086.5提供了一种高频高速覆铜板制作方法,将低分子量聚苯醚与双酚A型氰酸酯树脂进行共混性改,制备得到改良后的PPO/CE树脂;将改良后的PPO/CE树脂与填料、阻燃剂等按照一定比例加工混合而成,配制成生产频率高频高速覆铜板专用的胶水;再对增强材料进行预处理;然后将预处理后的NE玻璃纤维布与PPO/CE树脂在含浸机中经过预浸、含浸、排气、烘干等单元操作后制备成半固化片;制备好的半固化片交错堆叠,将叠制好的半固化片与一种高频超低轮廓度电解铜箔(VLP)组装成本后,在热机中经过高温、高压压制成型。
申请号CN201811355446.0公开了一种高频高速覆铜板用腈基树脂,通过后续温度处理可得到用于覆铜板制造的树脂胶液,程序升温固化成型后可得到性能优异的聚合物。
但是上述的方案都不能不是注塑高频覆铜板,还存在材料混合不均匀,介电损耗不够低,铜膜结合效果不好,容易脱落的问题。
发明内容
针对上述内容,为解决上述问题,提供一种注塑高频覆铜板的制造方法,步骤包括:基材制备、低压注塑、表面处理、铜膜贴敷、真空冷却、二次辊压和二次真空冷却。
步骤1、基材制备
将按照质量准备基材料:200-300份酚醛树脂、100-200份环氧树脂、100-200份聚乙烯、1-5份氢氧化镁、100-200份环糊精、100-150份纳米氧化铝粉和100-150份二氧化硅;
将准备的基材料混合,混合后放入球磨机进行球磨,球磨过程中保证球磨温度不超过50℃;
球磨至基材料的粒径小于0.05mm,将基材料加入加热容器中进行加热,加热至300℃使得基材料整体上呈流动态,然后降温挤出,制作成基材颗粒;
步骤2、低压注塑
将步骤1中得到的基材颗粒中加入环氧树脂固化剂并混合后进行加热,加热至250℃注入低压注塑模具,待注满后200℃保持30秒;然后脱模分离,得到基材板;
步骤3、表面处理:
将步骤2脱模后的基材板放置在准分子激光下进行离焦辐照,离焦光斑直径30-50mm,波长248nm,单脉冲能量300-400mJ,单个位置辐照次数20-30次,辐照时基材板底部进行加热,加热温度50摄氏度;辐照同时另一束连续红外激光对辐照位置进行加热照射,照射光斑与准分子激光相同,照射波长1024nm,红外激光功率600-1000W;
辐照范围覆盖整个基材板,使得基材板表面形成微小凹凸;
步骤4、铜膜贴敷
将成卷的铜膜展开,并在一侧涂覆环氧树脂胶结剂,铜膜厚度为150-300μm,将具有胶结剂的一侧贴敷在步骤3得到的基材板上,并将整体放置到辊压机上进行辊压;辊压时进行加热,加热辊的温度为50-80℃,得到覆铜板;
步骤5、真空冷却
将辊压后的覆铜板放置到真空中干燥机中进行真空干燥,真空的压强为0.1个大气压;
真空干燥的参数为:
0.1个大气压下,80℃,持续15min;
0.1个大气压下,100℃,持续25min;
0.5个大气压下,50℃,持续15min;
1个大气压下,室温,持续30min;
步骤6、二次辊压
将步骤5中得到的覆铜板进行二次辊压,二次辊压与第一次辊压的参数相同;
步骤7、二次真空冷却
将辊压后的覆铜板放置到真空中干燥机中进行真空干燥,真空的压强为0.1个大气压;
真空干燥的参数为:
0.1个大气压下,80℃,持续15min;
0.1个大气压下,100℃,持续25min;
0.1个大气压下,50℃,持续15min;
1个大气压下,室温,持续30min。
步骤1中还包括超声振荡混匀步骤,具体为:
将球磨后的基材料进行加热前先进行超声混匀,即将球磨后的基材料放置于超声振荡器上进行超声混匀,振荡时间为10-15min,振荡频率150kHz-300kHz。
步骤1中还包括离心去除杂质和气泡的步骤,具体为:
将基材加热至流动态之后将其加入至离心管中,并将加热离心管放置于加热离心机中,保证加热温度300℃的条件下进行离心;离心机转速3000-5000转/分钟,离心时间15-20min;
离心后去除离心管最底端5%的材料,将融化的材料降温挤出成颗粒状得到基材颗粒。
本发明的有益效果为:本发明重新配置了注塑基材的材料,添加了环糊精、二氧化硅、氢氧化镁、纳米氧化铝和聚乙烯;其中环糊精和聚乙烯的加入有利于降低覆铜板的介电损耗;氢氧化镁、纳米氧化铝和二氧化硅的加入能够提高激光加工时的表面吸光和处理效果;
使用双激光进行贴敷铜膜前的表面处理,有利于提高铜膜和基板的结合效果,同时提高后续辊压的稳定性;在进行注塑前使用离心机进行离心,去除气泡的同时能够充分去除底部的杂质。
附图说明
图1为本发明的制作流程图。
具体实施方式
本发明的优点、特征以及达成所述目的的方法通过附图及后续的详细说明将会明确。
实施例1:
注塑高频覆铜板的制造方法包括:
步骤1、基材制备
将按照质量准备基材料:300份酚醛树脂、200份环氧树脂、200份聚乙烯、5份氢氧化镁、200份环糊精、150份纳米氧化铝粉和150份二氧化硅;
将准备的基材料混合,混合后放入球磨机进行球磨,球磨过程中保证球磨温度不超过50℃;
球磨至基材料的粒径小于0.05mm,将基材料加入加热容器中进行加热,加热至300℃使得基材料整体上呈流动态,然后降温挤出,制作成基材颗粒;
步骤2、低压注塑
将步骤1中得到的基材颗粒中加入环氧树脂固化剂并混合后进行加热,加热至250℃注入低压注塑模具,待注满后200℃保持30秒;然后脱模分离,得到基材板;
步骤3、表面处理:
将步骤2脱模后的基材板放置在准分子激光下进行离焦辐照,离焦光斑直径50mm,波长248nm,单脉冲能量400mJ,单个位置辐照次数30次,辐照时基材板底部进行加热,加热温度50摄氏度;辐照同时另一束连续红外激光对辐照位置进行加热照射,照射光斑与准分子激光相同,照射波长1024nm,红外激光功率1000W;
辐照范围覆盖整个基材板,使得基材板表面形成微小凹凸;
步骤4、铜膜贴敷
将成卷的铜膜展开,并在一侧涂覆环氧树脂胶结剂,铜膜厚度为300μm,将具有胶结剂的一侧贴敷在步骤3得到的基材板上,并将整体放置到辊压机上进行辊压;辊压时进行加热,加热辊的温度为80℃,得到覆铜板;
步骤5、真空冷却
将辊压后的覆铜板放置到真空中干燥机中进行真空干燥,真空的压强为0.1个大气压;
真空干燥的参数为:
0.1个大气压下,80℃,持续15min;
0.1个大气压下,100℃,持续25min;
0.5个大气压下,50℃,持续15min;
1个大气压下,室温,持续30min;
步骤6、二次辊压
将步骤5中得到的覆铜板进行二次辊压,二次辊压与第一次辊压的参数相同;
步骤7、二次真空冷却
将辊压后的覆铜板放置到真空中干燥机中进行真空干燥,真空的压强为0.1个大气压;
真空干燥的参数为:
0.1个大气压下,80℃,持续15min;
0.1个大气压下,100℃,持续25min;
0.1个大气压下,50℃,持续15min;
1个大气压下,室温,持续30min。
实施例2:
步骤1、基材制备
将按照质量准备基材料:200份酚醛树脂、100份环氧树脂、100份聚乙烯、1份氢氧化镁、100份环糊精、100份纳米氧化铝粉和100份二氧化硅;
将准备的基材料混合,混合后放入球磨机进行球磨,球磨过程中保证球磨温度不超过50℃;
球磨至基材料的粒径小于0.05mm,将基材料加入加热容器中进行加热,加热至300℃使得基材料整体上呈流动态,然后降温挤出,制作成基材颗粒;
步骤2、低压注塑
将步骤1中得到的基材颗粒中加入环氧树脂固化剂并混合后进行加热,加热至250℃注入低压注塑模具,待注满后200℃保持30秒;然后脱模分离,得到基材板;
步骤3、表面处理:
将步骤2脱模后的基材板放置在准分子激光下进行离焦辐照,离焦光斑直径30mm,波长248nm,单脉冲能量300mJ,单个位置辐照次数20次,辐照时基材板底部进行加热,加热温度50摄氏度;辐照同时另一束连续红外激光对辐照位置进行加热照射,照射光斑与准分子激光相同,照射波长1024nm,红外激光功率600W;
辐照范围覆盖整个基材板,使得基材板表面形成微小凹凸;
步骤4、铜膜贴敷
将成卷的铜膜展开,并在一侧涂覆环氧树脂胶结剂,铜膜厚度为150μm,将具有胶结剂的一侧贴敷在步骤3得到的基材板上,并将整体放置到辊压机上进行辊压;辊压时进行加热,加热辊的温度为50℃,得到覆铜板;
其余步骤与实施例1相同。
实施例3:
步骤1中还包括超声振荡混匀步骤,具体为:
将球磨后的基材料进行加热前先进行超声混匀,即将球磨后的基材料放置于超声振荡器上进行超声混匀,振荡时间为10-15min,振荡频率150kHz-300kHz。
实施例4:
步骤1中还包括离心去除杂质和气泡的步骤,具体为:
将基材加热至流动态之后将其加入至离心管中,并将加热离心管放置于加热离心机中,保证加热温度300℃的条件下进行离心;离心机转速3000-5000转/分钟,离心时间15-20min;
以上所述,仅为本发明的优选实施方式,但本发明的保护范围并不局限于此,任何熟悉本技术领域的技术人员在本发明揭露的技术范围内,可轻易想到变化或替换,都应涵盖在本发明的保护范围之内。因此,本发明的保护范围应以所述权利要求的保护范围为准。
Claims (4)
1.一种注塑高频覆铜板的制造方法,其特征在于:
步骤包括:基材制备、低压注塑、表面处理、铜膜贴敷、真空冷却、二次辊压和二次真空冷却。
2.根据权利要求1所述的注塑高频覆铜板的制造方法,其特征在于具体步骤为:
步骤1、基材制备
将按照质量准备基材料:200-300份酚醛树脂、100-200份环氧树脂、100-200份聚乙烯、1-5份氢氧化镁、100-200份环糊精、100-150份纳米氧化铝粉和100-150份二氧化硅;
将准备的基材料混合,混合后放入球磨机进行球磨,球磨过程中保证球磨温度不超过50℃;球磨至基材料的粒径小于0.05mm,将基材料加入加热容器中进行加热,加热至300℃使得基材料整体上呈流动态,然后降温挤出,制作成基材颗粒;
步骤2、低压注塑
将步骤1中得到的基材颗粒中加入环氧树脂固化剂并混合后进行加热,加热至250℃注入低压注塑模具,待注满后200℃保持30秒;然后脱模分离,得到基材板;
步骤3、表面处理:
将步骤2脱模后的基材板放置在准分子激光下进行离焦辐照,离焦光斑直径30-50mm,波长248nm,单脉冲能量300-400mJ,单个位置辐照次数20-30次,辐照时基材板底部进行加热,加热温度50摄氏度;辐照同时另一束连续红外激光对辐照位置进行加热照射,照射光斑与准分子激光相同,照射波长1024nm,红外激光功率600-1000W;
辐照范围覆盖整个基材板,使得基材板表面形成微小凹凸;
步骤4、铜膜贴敷
将成卷的铜膜展开,并在一侧涂覆环氧树脂胶结剂,铜膜厚度为150-300μm,将具有胶结剂的一侧贴敷在步骤3得到的基材板上,并将整体放置到辊压机上进行辊压;辊压时进行加热,加热辊的温度为50-80℃,得到覆铜板;
步骤5、真空冷却
将辊压后的覆铜板放置到真空中干燥机中进行真空干燥,真空的压强为0.1个大气压;
真空干燥的参数为:
0.1个大气压下,80℃,持续15min;
0.1个大气压下,100℃,持续25min;
0.5个大气压下,50℃,持续15min;
1个大气压下,室温,持续30min;
步骤6、二次辊压
将步骤5中得到的覆铜板进行二次辊压,二次辊压与第一次辊压的参数相同;
步骤7、二次真空冷却
将辊压后的覆铜板放置到真空中干燥机中进行真空干燥,真空的压强为0.1个大气压;
真空干燥的参数为:
0.1个大气压下,80℃,持续15min;
0.1个大气压下,100℃,持续25min;
0.1个大气压下,50℃,持续15min;
1个大气压下,室温,持续30min。
3.根据权利要求2所述的注塑高频覆铜板的制造方法,其特征在于:
步骤1中还包括超声振荡混匀步骤,具体为:
将球磨后的基材料进行加热前先进行超声混匀,即将球磨后的基材料放置于超声振荡器上进行超声混匀,振荡时间为10-15min,振荡频率150kHz-300kHz。
4.根据权利要求3所述的注塑高频覆铜板的制造方法,其特征在于:
步骤1中还包括离心去除杂质和气泡的步骤,具体为:
将基材加热至流动态之后将其加入至离心管中,并将加热离心管放置于加热离心机中,保证加热温度300℃的条件下进行离心;离心机转速3000-5000转/分钟,离心时间15-20min;
离心后去除离心管最底端5%的材料,将融化的材料降温挤出成颗粒状得到基材颗粒。
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US20200040191A1 (en) * | 2011-09-23 | 2020-02-06 | Dystar Hilton Davis Corp. | Self-assembled nano-structured particle and methods for preparing |
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