CN114011947B - LED support cutting method based on cutting die - Google Patents
LED support cutting method based on cutting die Download PDFInfo
- Publication number
- CN114011947B CN114011947B CN202111247845.7A CN202111247845A CN114011947B CN 114011947 B CN114011947 B CN 114011947B CN 202111247845 A CN202111247845 A CN 202111247845A CN 114011947 B CN114011947 B CN 114011947B
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- cutting
- die
- base frame
- support
- cut
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- 238000005520 cutting process Methods 0.000 title claims abstract description 174
- 238000000034 method Methods 0.000 title claims abstract description 37
- 230000002950 deficient Effects 0.000 claims abstract description 44
- 239000000463 material Substances 0.000 claims abstract description 26
- 239000002699 waste material Substances 0.000 claims abstract description 9
- 238000007664 blowing Methods 0.000 claims abstract description 4
- 238000007599 discharging Methods 0.000 claims description 3
- 238000010586 diagram Methods 0.000 description 4
- 239000000758 substrate Substances 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 230000001360 synchronised effect Effects 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21D—WORKING OR PROCESSING OF SHEET METAL OR METAL TUBES, RODS OR PROFILES WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21D28/00—Shaping by press-cutting; Perforating
- B21D28/02—Punching blanks or articles with or without obtaining scrap; Notching
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21D—WORKING OR PROCESSING OF SHEET METAL OR METAL TUBES, RODS OR PROFILES WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21D28/00—Shaping by press-cutting; Perforating
- B21D28/02—Punching blanks or articles with or without obtaining scrap; Notching
- B21D28/14—Dies
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Led Device Packages (AREA)
Abstract
The invention discloses a cutting method of an LED bracket based on a cutting die, wherein the LED bracket comprises a base frame and a plurality of single brackets connected to the base frame, the left side and the right side of the single brackets are connected with the base frame before cutting, and the cutting method comprises the following steps: s1: the defective products are pre-cut, the defective single support is cut off the base frame, and the cutting length in the left-right direction is smaller than the length in the left-right direction of the single support during cutting; s2: separating the residual materials, and further cutting the defective single support pre-cut in the step S1 to separate the residual materials of the defective single support from the base frame; s3: and removing the residual materials, and blowing the residual materials away from the cutting die. The cutting size in the left-right direction is smaller than that of the single LED bracket when the defective product is pre-cut, so that when the pre-cut defective single bracket is further cut, the base frame connected with the residual material of the defective single bracket is clamped with the cavity, and the phenomenon that the waste is separated from the cavity due to the fact that the waste is not clamped with the cavity and moves along with the LED bracket, and the defective product is crushed and damaged by the die is avoided.
Description
[ field of technology ]
The application relates to the field of LED processing, in particular to an LED bracket cutting method based on a cutting die.
[ background Art ]
In the LED processing process, a single LED support needs to be cut off the substrate, and before cutting, defective products need to be cut off the substrate, and then the defective products are cut off the substrate through a cutting die. When the defective products are cut, the transverse size of the cutting is larger than that of the single LED support, so that the waste materials at the position of the defective products cannot be clamped in the cutting cavity 3 when the defective products are cut, the waste materials are separated from the cutting cavity 3 along with the movement of the substrate, and the defective products are crushed and damaged by the die.
[ invention ]
The utility model aims at providing a LED support cuts method based on cut mould, it is through when the defective products is cut in advance, makes the size of cutting in the left and right directions be less than the size in the left and right directions of single LED support to when making further cut the defective single support of cutting in advance, the bed frame card that links to each other with defective single support clout is full die cavity, avoids the waste material to deviate from the die cavity and remove along with the LED support because of not full die cavity, causes the crushing of good products and the damage of mould.
The application is realized by the following technical scheme:
an LED support cutting method based on a cutting die, wherein the LED support comprises a base frame and a plurality of single supports connected to the base frame, the left side and the right side of each single support are connected with the base frame before cutting, and the cutting method comprises the following steps:
s1: cutting off the defective single support from the base frame, wherein the cutting length in the left-right direction is smaller than that of the single support during cutting;
s2: separating the residual materials, and further cutting the single support which is pre-cut in the step S1 to separate the residual materials of the single support from the base frame;
s3: and removing the residual materials, and blowing the residual materials away from the cutting die.
In the cutting method of the LED support based on the cutting die, in the step S1, the cutting length in the left-right direction is X when the defective products are pre-cut, the required length in the left-right direction of a single support is Y, Y is greater than X, and the difference is: 0.01mm-1.0mm.
The cutting die comprises a pre-cutting die for cutting the single support which is bad from the base frame, and the step S1 comprises the following steps:
s11: acquiring the position of the single bracket which is bad;
s12: and controlling the pre-cutting die to move to one side of the single support, which is poor, and cutting the single support away from the base frame.
The cutting die based on the cutting die comprises an upper die set and a lower die set, the upper die set comprises a cutting punch, a guide part and a fixing part, the lower die set comprises a female die with a cutting edge, the lengths of the cutting punch and the cutting edge in the left-right direction are smaller than those of the single bracket in the left-right direction, the LED bracket is positioned between the upper die set and the lower die set, and the step S12 comprises the following steps:
s121: controlling the upper module and the lower module to synchronously move, so that the cutting punch and the cutting knife opening respectively move to the upper side and the lower side of the single support;
s122: controlling the cutting punch to move downwards to cut the single support away from the base frame;
s123: discharging the single support which is cut off the base frame from the cutting die
In the method for cutting the LED support based on the cutting die, the pre-cutting die can move in the front-back direction and also can move in the up-down direction.
According to the LED bracket cutting method based on the cutting die, the single brackets are subjected to one-by-one precutting by the precutting die.
In the cutting method of the LED support based on the cutting die, in step S2, the single support is further cut while the defective single support pre-cut in step S1 is cut, so that the left and right sides of the single support are separated from the base frame.
In the cutting method of the LED support based on the cutting die, a plurality of horizontal rows and a plurality of vertical rows are formed on the base frame 1 at intervals by the single support 2, and in step S2, the single support 2 and/or the excess material 21 of the single support 2, which is pre-cut in step S1, are cut in synchronization with good products located in the same vertical row.
The LED bracket cutting method based on the cutting die comprises the cutting die for cutting the base frame to separate the left side and the right side of the single bracket from the base frame.
According to the LED support cutting method based on the cutting die, two cavities which are oppositely arranged in the left-right direction are formed on the cutting die, the distance between the two cavities in the left-right direction is equal to the length of the single support in the left-right direction, and the cavities are used for clamping waste materials generated when the cutting die cuts the base frame.
Compared with the prior art, the invention has the following advantages:
according to the invention, when the defective product is pre-cut, the cutting size in the left-right direction is smaller than the size of the single LED bracket in the left-right direction, so that when the pre-cut defective single bracket is further cut, the base frame connected with the residual material of the defective single bracket is clamped with the cavity, and the phenomenon that the waste is separated from the cavity due to the fact that the cavity is not clamped with the base frame and moves along with the LED bracket, and the defective product is crushed and the die is damaged is avoided.
[ description of the drawings ]
In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings that are required to be used in the description of the embodiments will be briefly described below.
Fig. 1 is a flowchart of a cutting method of an LED support based on a cutting die according to an embodiment of the present application;
FIGS. 2-5 are schematic flow diagrams of a process for cutting an LED support using a cutting die-based cutting method;
FIG. 6 is an enlarged view of a portion of FIG. 4 at A;
fig. 7-9 are schematic production flow diagrams of cutting out a defective single support from a base frame by using a pre-cutting die.
[ detailed description ] of the invention
In order to make the technical problems, technical schemes and beneficial effects solved by the application more clear, the application is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the present application.
The method for cutting the LED bracket based on the cutting die shown in fig. 1, wherein the LED bracket comprises a base frame 1 and a plurality of single brackets 2 connected to the base frame 1, and before cutting, the left side and the right side of the single brackets 2 are connected with the base frame 1, and the cutting method comprises the following steps:
s1: cutting off defective products in advance, namely cutting off defective single supports 2 from the base frame 1, wherein the cutting length in the left-right direction is smaller than that of the single supports 2 during cutting;
s2: separating the residual materials, and further cutting the single support 2 which is pre-cut in the step S1, so that the residual materials 21 of the single support 2 which are defective are separated from the base frame 1;
s3: and removing the residual materials, and blowing the residual materials 21 out of the cutting die.
In combination with the production schematic diagrams shown in fig. 2-5, in the method, when the defective product is pre-cut (as shown in fig. 3), the cutting size (X in fig. 3 or fig. 6) in the left-right direction is smaller than the required size (Y in fig. 3 or fig. 6) of the single LED support, so that when the pre-cut defective product is further cut (as shown in fig. 4), the base frame connected with the residual material 21 of the defective product single support 2 is clamped with the cavity 3, and the waste is prevented from falling out of the cavity 3 due to the fact that the residual material is not clamped with the cavity 3 and moves along with the LED support, thereby causing crushing of the defective product and damage to the die.
Further, as a preferred embodiment of the present invention, but not limited to, in step S1, the cutting length in the left-right direction of the pre-cutting of the defective product is X, the required length in the left-right direction of the single support 2 is Y, and Y is greater than X, and the difference is: 0.01mm-1.0mm. If the difference between Y and X is too large, the excess material 21 will be too large and too heavy, and will not easily blow off the cutting die. If the difference between Y and X is too small, the requirement for cutting accuracy will be too high. The value is reasonable, and the excessive cutting precision is avoided while the excess material 21 is ensured to be blown away from the cutting die.
Further, as a preferred embodiment of the present invention, but not limited thereto, the cutting die includes a cutting die for cutting the base frame 1 so that the left and right sides of the single frame 2 are separated from the base frame 1, two cavities 3 are formed on the cutting die, which are oppositely disposed in the left and right direction, the space between the two cavities 3 in the left and right direction is equal to the dimension of the single frame 2 in the left and right direction, and the cavities 3 are used to catch the scrap 100 generated when the cutting die cuts the base frame 1. This arrangement enables the cutting of the LED support.
Further, as a preferred embodiment of the present invention, not limited thereto, the cutting die further includes a pre-cutting die for cutting the defective individual carriers 2 from the base frame 1, and the step S1 includes the steps of:
s11: acquiring the position of the single bracket 2 which is bad;
s12: and controlling the pre-cutting die to move to the side of the single support 2 which is poor, and cutting the single support 2 which is poor away from the base frame 1.
Specifically, the pre-cutting die comprises an upper die set and a lower die set, the upper die set comprises a cutting punch 4, a guide part 200 and a fixing part 300, the lower die set comprises a die 5 formed with a cutting edge 6, the sizes of the cutting punch 4 and the cutting edge 6 in the left-right direction are smaller than those of the single bracket 2 in the left-right direction, the LED bracket is positioned between the upper die set and the lower die set, and the step S12 comprises the following steps:
s121: controlling the upper die set and the lower die set to synchronously move so that the cutting punch 4 and the cutting edge 6 respectively move to the upper side and the lower side of the single support 2;
s122: controlling the cutting punch 4 to move downwards to cut the single support 2 which is bad away from the base frame 1;
s123: and discharging the single support 2 which is cut off the base frame 1 out of the cutting die.
With reference to the production schematic diagrams shown in fig. 7-9, the method can synchronously move to the cutting punch 4 and the cutting knife opening 6 on the upper side and the lower side of the single support 2, and control the cutting punch 4 to move downwards to cut the single support 2 away from the base frame 1 after moving in place, so as to realize automatic pre-cutting of defective products and improve cutting precision and cutting efficiency.
Further, as a preferred embodiment of the present invention, not limited thereto, the pre-cutting die may be movable in the front-rear direction, and may also be movable in the up-down direction. This arrangement can improve the flexibility of the movement of the precut die, so that the precut die can be flexibly moved to the side of the defective single support 2, and precut the defective single support 2.
Further, as a preferred embodiment of the present invention, not limited thereto, the precutting die precuts the plurality of defective individual stents 2 one by one. Due to the fact that the distribution of the single supports 2 is irregular, the single supports are precut one by one, and cutting accuracy is improved.
Further, as a preferred embodiment of the present invention, but not limited to, in step S2, the single support 2 having the defect pre-cut in step S1 is further cut, and the single support 2 having the good product is cut, so that the left and right sides of the single support 2 having the good product are separated from the base frame 1. This step realizes synchronous cutting of the good product and the defective product surplus material 21, and improves the cutting speed.
Further, as a preferred embodiment of the present invention, but not limited to, a plurality of the single frames 2 are arranged on the base frame 1 at intervals to form a plurality of horizontal rows and a plurality of vertical rows, and in step S2, the single frames 2 and/or the excess materials 21 on the single frames 2 which are defective and are pre-cut in step S1 are cut synchronously. This step can further increase the cutting speed.
Before cutting, the front, back, left and right sides of the single bracket 2 are connected with the base frame 1. After the pre-cutting in the step S1 and the further cutting in the step S2, the single support 2 is separated from the base frame 1 completely; after further cutting in the step S2, the left and right sides of the single support 2 are separated from the base frame 1, and the front and rear sides are still connected with the base frame 1. After all the single supports 2 on the LED support are cut, cutting the LED support is completed, and then the LED support enters a packaging procedure.
It should be understood that the terms "first," "second," and the like are used in this application to describe various information, but the information should not be limited to these terms, which are used only to distinguish one type of information from another. For example, a "first" message may also be referred to as a "second" message, and similarly, a "second" message may also be referred to as a "first" message, without departing from the scope of the present application. Furthermore, references to orientations or positional relationships by the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., are based on the orientations or positional relationships shown in the drawings, are merely for purposes of describing the present application and simplifying the description, and do not indicate or imply that the referenced devices or elements must have a particular orientation, be configured and operated in a particular orientation, and therefore are not to be construed as limiting the present application.
The foregoing description of one or more embodiments provided in connection with the specific disclosure is not intended to limit the practice of this application to such description. Any approximation, or substitution of techniques for the methods, structures, etc. of the present application or for the purposes of making a number of technological deductions based on the concepts of the present application should be considered as the scope of protection of the present application.
Claims (10)
1. The utility model provides a LED support cuts method based on cutting mould which characterized in that, LED support includes bed frame and a plurality of single supports of connecting on the bed frame, before cutting, the left and right sides of single support all with the bed frame links to each other, the method of cutting includes:
s1: cutting off the defective single support from the base frame, wherein the cutting length in the left-right direction is smaller than that of the single support during cutting;
s2: separating the residual materials, and further cutting the single support which is pre-cut in the step S1 to separate the residual materials of the single support from the base frame;
s3: and removing the residual materials, and blowing the residual materials away from the cutting die.
2. The cutting die-based method for cutting an LED support according to claim 1, wherein in step S1, a cutting length in a left-right direction of the defective product is X, a required length in a left-right direction of a single support is Y, and Y is greater than X, and a difference is: 0.01mm-1.0mm.
3. The cutting die-based LED support cutting method according to claim 1, wherein the cutting die includes a pre-cutting die that cuts the single support from the base frame, the step S1 including the steps of:
s11: acquiring the position of the single bracket which is bad;
s12: and controlling the pre-cutting die to move to one side of the single support, which is poor, and cutting the single support away from the base frame.
4. The cutting die-based LED fixture cutting method according to claim 3, wherein the pre-cutting die comprises an upper die set and a lower die set, the upper die set comprises a cutting punch, a guide and a fixing part, the lower die set comprises a die formed with a cutting edge, the lengths of the cutting punch and the cutting edge in the left-right direction are smaller than those of the single fixture in the left-right direction, the LED fixture is located between the upper die set and the lower die set, and step S12 comprises the steps of:
s121: controlling the upper module and the lower module to synchronously move, so that the cutting punch and the cutting knife opening respectively move to the upper side and the lower side of the single support;
s122: controlling the cutting punch to move downwards to cut the single support away from the base frame;
s123: and discharging the single support which is cut off the base frame from the cutting die.
5. The method of cutting a LED support based on a cutting die according to claim 3 or 4, wherein the pre-cutting die is movable in a front-rear direction as well as in an up-down direction.
6. The cutting die-based LED support cutting method according to claim 3 or 4, wherein the pre-cutting die pre-cuts a plurality of defective individual supports one by one.
7. The cutting die-based LED support cutting method according to claim 1, wherein in step S2, the single support is cut to be good while the single support pre-cut in step S1 is further cut, so that the left and right sides of the single support are separated from the base frame.
8. The cutting die-based method for cutting the LED support according to claim 1, wherein a plurality of the single supports (2) are arranged on the base frame (1) at intervals to form a plurality of horizontal rows and a plurality of vertical rows, and in step S2, the single supports (2) and/or the excess materials (21) of the single supports (2) which are pre-cut in step S1 and are defective in the same vertical row are cut synchronously.
9. The cutting die-based LED fixture cutting method of claim 1, wherein the cutting die comprises a cutting die for cutting the base frame such that the left and right sides of the single fixture are separated from the base frame.
10. The cutting die-based LED support cutting method according to claim 9, wherein two cavities are formed on the cutting die, the two cavities are oppositely arranged in the left-right direction, the distance between the two cavities in the left-right direction is equal to the length of the single support in the left-right direction, and the cavities are used for clamping waste materials generated when the cutting die cuts the base frame.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111247845.7A CN114011947B (en) | 2021-10-26 | 2021-10-26 | LED support cutting method based on cutting die |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111247845.7A CN114011947B (en) | 2021-10-26 | 2021-10-26 | LED support cutting method based on cutting die |
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| Publication Number | Publication Date |
|---|---|
| CN114011947A CN114011947A (en) | 2022-02-08 |
| CN114011947B true CN114011947B (en) | 2024-02-27 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202111247845.7A Active CN114011947B (en) | 2021-10-26 | 2021-10-26 | LED support cutting method based on cutting die |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN114011947B (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01104426A (en) * | 1987-10-17 | 1989-04-21 | Akebono Brake Ind Co Ltd | Method and device for taking out product in blanking press by progressive compound die |
| KR20160037448A (en) * | 2014-09-29 | 2016-04-06 | 주식회사 엘지화학 | Method and system for producing cutting product |
| CN208162398U (en) * | 2018-04-28 | 2018-11-30 | 天津诺鼎电子科技有限公司 | A kind of punching particle separation shrapnel device |
-
2021
- 2021-10-26 CN CN202111247845.7A patent/CN114011947B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01104426A (en) * | 1987-10-17 | 1989-04-21 | Akebono Brake Ind Co Ltd | Method and device for taking out product in blanking press by progressive compound die |
| KR20160037448A (en) * | 2014-09-29 | 2016-04-06 | 주식회사 엘지화학 | Method and system for producing cutting product |
| CN208162398U (en) * | 2018-04-28 | 2018-11-30 | 天津诺鼎电子科技有限公司 | A kind of punching particle separation shrapnel device |
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| Publication number | Publication date |
|---|---|
| CN114011947A (en) | 2022-02-08 |
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