CN113994713B - Microphone array device and sound analysis system - Google Patents
Microphone array device and sound analysis system Download PDFInfo
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- CN113994713B CN113994713B CN202080044382.1A CN202080044382A CN113994713B CN 113994713 B CN113994713 B CN 113994713B CN 202080044382 A CN202080044382 A CN 202080044382A CN 113994713 B CN113994713 B CN 113994713B
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- 238000004458 analytical method Methods 0.000 title claims description 39
- 239000000758 substrate Substances 0.000 claims abstract description 302
- 238000005259 measurement Methods 0.000 claims description 32
- 238000003780 insertion Methods 0.000 claims description 14
- 230000037431 insertion Effects 0.000 claims description 14
- 238000010586 diagram Methods 0.000 description 11
- 238000012545 processing Methods 0.000 description 10
- 238000000034 method Methods 0.000 description 7
- 230000005236 sound signal Effects 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 230000002411 adverse Effects 0.000 description 2
- 238000003491 array Methods 0.000 description 2
- 238000001093 holography Methods 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000002452 interceptive effect Effects 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
Classifications
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R1/00—Details of transducers, loudspeakers or microphones
- H04R1/20—Arrangements for obtaining desired frequency or directional characteristics
- H04R1/32—Arrangements for obtaining desired frequency or directional characteristics for obtaining desired directional characteristic only
- H04R1/40—Arrangements for obtaining desired frequency or directional characteristics for obtaining desired directional characteristic only by combining a number of identical transducers
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R2201/00—Details of transducers, loudspeakers or microphones covered by H04R1/00 but not provided for in any of its subgroups
- H04R2201/40—Details of arrangements for obtaining desired directional characteristic by combining a number of identical transducers covered by H04R1/40 but not provided for in any of its subgroups
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- Health & Medical Sciences (AREA)
- Otolaryngology (AREA)
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Acoustics & Sound (AREA)
- Signal Processing (AREA)
- Obtaining Desirable Characteristics In Audible-Bandwidth Transducers (AREA)
- Circuit For Audible Band Transducer (AREA)
Abstract
The microphone array device (50) comprises: a plurality of microphones; at least one first substrate, at least one of the first substrates mounting at least one microphone of a plurality of microphones; and a second substrate electrically connected to the first substrate and outputting sound information acquired by the microphone to a control substrate that controls the first substrate. The first substrate comprises a first connecting part and a second connecting part which are different in connection mode. The second substrate includes: a third connection portion electrically connectable with the first connection portion; and a fourth connection portion electrically connectable with the second connection portion.
Description
Technical Field
The present invention relates to a microphone array device and a sound analysis system.
Background
In recent years, as the demand for reduction of noise in products increases, it is demanded to measure and analyze the spatial distribution of a sound field.
Patent document 1 discloses a sound pressure distribution analysis system using a microphone array in which a plurality of microphones are arranged in a lattice shape and sounds are detected at a plurality of positions. The sound pressure distribution analysis system has an amplifier capable of amplifying a multichannel signal, and the amplifier amplifies the sound signals of the microphones and outputs the amplified sound signals to an analysis terminal. The analysis terminal performs a/D conversion on the audio signal inputted from the amplifier, and records the audio signal as a time waveform.
However, in the conventional microphone array described above, when the condenser microphone or the dynamic microphone is used, and the microphones are arranged at intervals of, for example, 10mm or less, the measurement surface of the microphone array has a compact structure, and it is difficult to perform acoustic hologram analysis due to the influence of reflected sound from the microphone array.
Thus, a microphone array using a Micro-MEMS (Micro-Electrical-MCHANICAL SYSTEMS: micro-electro-mechanical system) microphone capable of mounting a surface on a substrate is known. As such a MEMS microphone array, a method of forming a microphone array device by mounting a plurality of MEMS microphones on a lattice-shaped substrate and forming the microphone array device by the substrate itself is known.
Prior art literature
Patent literature
Patent document 1: japanese patent laid-open publication No. 2005-91272
Disclosure of Invention
Technical problem to be solved by the invention
In the case where the microphone array is formed by the substrate itself, the array-like interval cannot be changed according to the size of the object to be measured. Therefore, it is necessary to manufacture a microphone array for each object to be measured, and the cost increases.
Accordingly, an object of the present invention is to provide a microphone array device and a sound analysis system capable of changing arrangement intervals of a plurality of microphones.
Technical proposal adopted for solving the technical problems
In order to solve the above-described problems, a microphone array device according to an embodiment of the present invention includes: a plurality of microphones; at least one first substrate on which at least one microphone of a plurality of microphones is mounted; and a second substrate electrically connected to the first substrate and outputting sound information obtained by the microphone to a control substrate that controls the first substrate, the first substrate including a first connection portion and a second connection portion having different connection modes, the second substrate including: a third connection portion electrically connectable with the first connection portion; and a fourth connection portion electrically connectable with the second connection portion.
Further, an acoustic analysis system according to an embodiment of the present invention includes: the microphone array means; and an acoustic analysis device having the control board, the acoustic analysis device inputting the acoustic information outputted from the second board, and analyzing the acoustic information to detect a physical quantity representing a characteristic of the sound.
Effects of the invention
According to one aspect of the present invention, the first substrate and the second substrate each include two types of connection portions, and the first substrate and the second substrate can be connected in different manners, so that the arrangement interval of the plurality of microphones can be greatly changed.
Drawings
Fig. 1 is an overall view of a first embodiment of a microphone array according to the present embodiment.
Fig. 2 is a diagram showing a structural example of the first substrate.
Fig. 3 is a diagram showing a structural example of the second substrate.
Fig. 4 is a connection example of the first substrate and the second substrate.
Fig. 5 is a view showing a structural example of the first support member.
Fig. 6 is a view illustrating another example of the first support member.
Fig. 7 is a structural example of a first embodiment of a microphone array device.
Fig. 8 is a structural example of a second embodiment of the microphone array device.
Fig. 9 is an overall view of a second embodiment of the microphone array of the present embodiment.
Fig. 10 is a diagram showing a structural example of the attachment member.
Fig. 11 is a diagram showing a structural example of the second support member.
Fig. 12 is a diagram showing an example of the sound analysis system.
Detailed Description
Hereinafter, embodiments of the present invention will be described with reference to the drawings.
The scope of the present invention is not limited to the following embodiments, but can be arbitrarily changed within the scope of the technical idea of the present invention.
Fig. 1 is an overall view of a first embodiment of a microphone array 1 included in a microphone array device according to the present embodiment.
The microphone array 1 in the present embodiment can be used for an acoustic analysis system for analyzing a sound to be measured from an object to be measured (sound source) by using near-field acoustic holography, for example. In the near-field acoustic hologram method, it is necessary to measure the sound pressure distribution of a measurement surface that is close to and parallel to the sound source surface, and a microphone array in which a plurality of microphones are arranged in a lattice shape is used.
As shown in fig. 1, the microphone array 1 includes a plurality of microphones mc, a plurality of first substrates 31, and a plurality of second substrates 10a.
The first substrate 31 is a microphone substrate on which at least one microphone mc among a plurality of microphones mc included in the microphone array 1 is mounted. In the present embodiment, the case where one microphone mc is mounted on one first substrate 31 is described, but a plurality of microphones mc may be mounted on one first substrate 31.
The second substrate 10a is a connection substrate electrically connected to the first substrate 31, and outputs the sound information acquired by the microphone mc to the control substrate 40 (see fig. 7) that controls the first substrate 31. In the present embodiment, the case where a plurality of first substrates 31 are connected to one second substrate 31 is described, but one first substrate 31 having a plurality of microphones mc mounted thereon may be connected to one second substrate 31.
The microphone array 1 further comprises a first support member 20a. The first support members 20a are arranged side by side at an arbitrary interval and support a plurality of second substrates 10a to which the first substrates 31 are respectively connected.
The second substrate 10a can detachably support the first substrate 31. Further, the first support member 20a can detachably support the first substrate 31 by detachably supporting the second substrate 10 a.
The plurality of microphones mc can be respectively set as, for example, MEMS (Micro-Electrical-MCHANICAL SYSTEMS: microelectromechanical system) microphones. In the present embodiment, the case where the microphone mc is a MEMS microphone is described, but the microphone mc is not limited to the MEMS microphone.
The second substrates 10a are arranged in the longitudinal direction in the first direction (x direction). In the present embodiment, the microphone array 1 includes N (eight in fig. 1) second substrates 10a.
The first support members 20a are members each having a long side direction of a second direction (z direction) orthogonal to the first direction (x direction). In the present embodiment, the microphone array 1 includes two first support members 20a. The two first support members 20a detachably support both ends of the N second substrates 10a, respectively.
M (eight in fig. 1) first substrates 31 are connected to the second substrate 10a, respectively. Here, the first substrates 31 are arranged at a constant interval d in the x direction, respectively. The first substrate 31 and the second substrate 10a are directly connected by a substrate-to-substrate connector described later, and the first substrate 31 is detachable from the second substrate 10a via the substrate-to-substrate connector. In addition, when the second substrate 10a is detachable from the first support member 20a, the first substrate 31 may be fixed to the second substrate 10 a.
Further, the second substrates 10a are arranged side by side at constant intervals d in the z direction, respectively. Here, the positions of the first substrates 31 in the x direction are the same in each of the second substrates 10 a. That is, the m×n microphones mc are arranged in a lattice shape in the xz direction by the N second substrates 10 a.
In fig. 1, the xz plane is a plane parallel to the measurement plane of the microphones mc of the microphone array 1 arranged in a lattice shape, and is a plane parallel to the sound source plane of the object to be measured. The microphone array 1 is configured to have a measurement surface spaced apart from the sound source surface of the object to be measured by a predetermined distance in the y-direction. For example, the microphone array 1 configures the distance between the measurement surface and the sound source surface in the y direction to be 10mm or less.
The microphone mc can be, for example, an nondirectional MEMS microphone capable of receiving sound from all directions. In the present embodiment, the case where the microphone mc is an nondirectional MEMS microphone is described, but the microphone mc may be a directional microphone.
The microphone mc has built-in acoustic transducers (MEMS chips) and amplifiers using MEMS technology, and is mounted on the surface of the first substrate 31. The microphone mc converts sound (sound pressure) into an electrical signal by an acoustic transducer, amplifies the electrical signal by an amplifier, and outputs the converted electrical signal. In addition, when the microphone mc is a digital microphone, an a/D converter is incorporated in the microphone mc, and the analog signal amplified by the amplifier can be converted into a digital signal and output.
Fig. 2 is a diagram showing a structural example of the first substrate 31. As shown in fig. 2, a microphone mc is mounted on the first substrate 31. The first substrate 31 has one first connection portion 32a and one second connection portion 32b, respectively, which are connected in different manners. The first substrate 31 may include an LED33 for confirming energization. By confirming that the LED33 is lit, it can be easily confirmed that there is no failure in conduction to the first substrate 31 due to disconnection of the connector or the like.
Fig. 3 is a diagram showing a structural example of the second substrate 10 a. As shown in fig. 3, the second substrate 10a has a plurality of third connecting portions 12a and fourth connecting portions 12b, respectively, which are different in connection manner. The third connecting portion 12a and the fourth connecting portion 12b are installed at a constant interval in the x direction, for example. The third connection portion 12a can be electrically connected to the first connection portion 32a of the first substrate 31, and the fourth connection portion 12b can be electrically connected to the second connection portion 32b of the first substrate 31.
In addition, the second substrate 10a includes a fifth connection portion 13. The fifth connection portion 13 can be a connector portion for connecting a cable 41 (see fig. 7) for connecting the second board 10a to a control board 40 (see fig. 7) for controlling the first board 31. The fifth connection portion 13 can be attached to one end portion of the second substrate 10a, for example.
The first connection portion 32a of the first substrate 31 and the third connection portion 12a of the second substrate 10a can be configured as a substrate-to-substrate connector that directly connects the first substrate 31 and the second substrate 10 a. The first connection portion 32a and the third connection portion 12a can be directly connected, and in a state where the first connection portion 32a and the third connection portion 12a are connected, as shown in fig. 4, the first substrate 31 and the second substrate 10a are parallel to each other. Here, the first connection portion 32a and the third connection portion 12a are small connectors having a distance between the first substrate 31 and the second substrate 10a of, for example, 1mm or less. The first substrate 31 is detachable from the second substrate 10a via the first connection portion 32a and the third connection portion 12 a.
In the microphone array 1 shown in fig. 1, M first substrates 31 are connected to the second substrate 10a via the first connection portions 32a and the third connection portions 12a so as to be arranged at a constant interval d in the x direction.
The first substrate 31 and the second substrate 10a are connected in parallel as described above, and are arranged in a state extending perpendicularly to the measurement plane in the microphone array 1. That is, the mounting surface of the microphone mc in the first substrate 31 is perpendicular to the measurement surface.
In a state where the first substrate 31 is mounted on the second substrate 10a, as shown in fig. 3, the microphone mc is mounted on the first substrate 31 at a position close to the object to be measured, that is, at a position close to the sound source surface 2 a. More specifically, the microphone mc is disposed so as to protrude from the end surface of the second substrate 10a on the object side (sound source surface 2a side) toward the object side (sound source surface 2a side) in the y direction. That is, the second substrate 10a is disposed on the opposite side of the sound source surface 2a to the measurement surface so as not to block the measured sound from the sound source.
Fig. 5 is a diagram showing a structural example of the first support member 20a in the present embodiment.
As shown in fig. 5, the first support member 20a includes a plurality of substrate insertion portions 21a, and the plurality of substrate insertion portions 21a are capable of inserting the plurality of second substrates 10a at arbitrary intervals in the z direction. The plurality of substrate insertion portions 21a are grooves (recesses) having a shape into which the second substrate 10a can be inserted, and are formed at equal intervals in the z direction, for example. The end portions of the N second substrates 10a are inserted into the substrate insertion portions 21a of the first support member 20a to be arranged at a constant interval d in the z direction. The second substrate 10a is detachable with respect to the first support member 20a, and the interval d of the second substrate 10a in the z direction can be arbitrarily changed. The substrate insertion portions 21a are formed at intervals of, for example, about 3mm in the z direction, and the intervals d in the z direction can be changed between about 3mm to about 20mm, for example.
In the present embodiment, the case where both end portions of the second substrate 10a are supported by the two first support members 20a is described, but the first support members 20a may support only one end of the second substrate 10a or may support positions other than the end portions of the second substrate 10 a. The first support member 20a is not limited to the structure shown in fig. 5. The first support member 20a may be any structure capable of supporting a plurality of second substrates 10a to which the first substrate 31 is connected, while being arranged side by side at an arbitrary interval. For example, instead of the first support member 20a, a bolt-like fixing member inserted into a hole formed in the second substrate 10a as in the first support member 20a' shown in fig. 6 may be used. The plurality of second substrates 10a may be supported by a frame member.
The first substrate 31 and the second substrate 10a can also be electrically connected via the second connection portion 32b and the fourth connection portion 12 b. Here, the second connection portion 32b and the fourth connection portion 12b are electrically connected via a connection member. The connection member can be provided as a cable having a connector that is detachable with respect to at least one of the second connection portion 32b and the fourth connection portion 12 b.
That is, the microphone array 1 according to the present embodiment has a first aspect in which the first substrate 31 and the second substrate 10a are directly connected via the first connection portion 32a and the third connection portion 12a, as shown in fig. 1, and a second aspect in which the first substrate 31 and the second substrate 10a are indirectly connected via the second connection portion 32b, the fourth connection portion 12b, and the connection member.
First, fig. 7, which is a diagram for explaining the structure of the first embodiment of the microphone array device 50, shows an example of the structure of the first embodiment of the microphone array device 50 in the present embodiment.
The microphone array device 50 of the first embodiment includes the microphone array 1 shown in fig. 1 described above. In fig. 7, the number of the first substrate 31 and the second substrate 10a included in the microphone array 1 is reduced for simplicity of illustration. In addition, illustration of the first support member 20a included in the microphone array 1 is omitted.
The first substrate 31 includes one microphone mc, and the first substrate 31 is directly connected to the second substrate 10a via the first connection portion 32a and the third connection portion 12a as shown in fig. 4. Further, the plurality of second substrates 10a directly connected to the plurality of first substrates 31 are electrically connected to the control substrate 40 via the cable 41. The second substrate 10a acquires sound information acquired by the microphone mc from the first substrate 31 in a state of being connected to the plurality of first substrates 31 and the control substrate 40, respectively, and outputs the acquired sound information to the control substrate 40.
One end of the cable 41 is connected to the control board 40, and the other end of the cable 41 is connected to the fifth connection portion (connector portion) 13 of the second board 10 a. The cable 41 may be detachable from at least one of the control board 40 and the second board 10 a.
The control board 40 can control the m×n first boards 31 and control the recording of the m×n microphones mc. Specifically, the control board 40 outputs a recording instruction to the first board 31, and in response to the recording instruction, inputs recording data (sound information acquired by the microphone mc) output from the first board 31 via the second board 10a and the cable 41.
In the present embodiment, a case will be described in which m×n microphones mc included in the microphone array 1 are connected to one control board 40. However, the number of microphones mc connected to one control substrate 40 is not limited to the above. For example, one second substrate 10a may be connected to one control substrate 40. That is, the control board 40 may be connected to different ones of the M microphones mc. In this case, there are N control boards 40, and each control board 40 performs control related to recording of M microphones mc. In this case, a control unit for controlling the N control boards 40 may be further included.
In this way, in the microphone array 1 according to the first aspect, the first substrate 31 and the second substrate 10a are directly connected via the first connection portion 32a included in the first substrate 31 and the third connection portion 12a included in the second substrate 10 a. That is, the first substrate 31 and the second substrate 10a can be connected without a cable. Therefore, for example, even when the object to be measured is small and the arrangement interval of the first substrate 31 is narrowed in order to construct a microphone array in which the arrangement interval of the microphones mc is narrow, it is possible to avoid adverse effects on the sound measurement due to the cables extending from the first substrate 31 being walls, respectively. In addition, the interference between the tight cable and the measured object can be avoided.
In this way, even when the arrangement interval of the microphones mc is narrow, the measurement surface of the microphone array 1 can be suppressed from becoming compact, and the influence of reflected sound or the like can be appropriately reduced. The microphone array 1 of the first embodiment is preferably arranged with the microphones mc at narrow intervals of about 10 mm.
Further, the first substrate 31 is detachable with respect to the second substrate 10a via the first connection portion 32a and the third connection portion 12 a. Therefore, the first substrate 31 can be easily replaced. For example, when any trouble occurs in one of the plurality of microphones mc, only the first substrate 31 on which the microphone mc having the trouble has been mounted can be repaired or replaced. Further, if the first substrate 31 on which one microphone mc is mounted is replaced with the first substrate 31 on which a plurality of microphones mc are mounted, the number of microphones mc included in the microphone array 1 can be easily increased, and the arrangement interval of the microphones mc can also be easily changed.
In addition, as shown in fig. 3, the second substrate 10a can include a plurality of third connection parts 12a. Thereby, the plurality of first substrates 31 and the second substrate 10a can be detachably connected. Therefore, by changing the connection position of the first substrate 31 with respect to the second substrate 10a, the arrangement interval of the first substrate 31 can be easily changed. For example, by connecting every other or every second first substrate 31 to the plurality of third connection portions 12a included in the second substrate 10a, the arrangement interval of the microphones mc can be easily changed.
The microphone array device 50 according to the present embodiment further includes a first support member 20a, and the first support member 20a is arranged side by side at an arbitrary interval and supports a plurality of second substrates 10a to which the first substrates 31 are connected, respectively. Therefore, the plurality of microphones mc can be easily and appropriately arranged in an array. Further, the first support member 20a can include a plurality of substrate insertion portions 21a into which a plurality of second substrates 10a can be inserted at arbitrary intervals, and therefore, the arrangement interval of the second substrates 10a in the z direction can be easily set to a desired interval.
As described above, by preparing a plurality of types of first substrates 31 having different mounting intervals of the microphones mc and changing the types of the first substrates 31 connected to the second substrate 10a, the arrangement interval of the microphones mc in the x direction can be easily changed. Further, by changing the connection position of the first substrate 31 with respect to the second substrate 10a, the arrangement interval of the microphones mc in the x direction can also be easily changed.
Further, by changing the mounting position of the second substrate 10a with respect to the first support member 20a, the arrangement interval of the microphones mc in the z direction can be easily changed.
Therefore, the microphone array 1 having the microphones mc arranged in an array at desired intervals in the x-direction and the z-direction can be provided.
Next, a structure of a second embodiment of the microphone array device 50 will be described.
Fig. 8 shows a configuration example of a second embodiment of the microphone array device 50 according to the present embodiment.
The microphone array device 50 of the second embodiment includes the microphone array 1 and the connecting member 14.
In fig. 8, the number of the first substrate 31, the second substrate 10a, and the mounting member 10b included in the microphone array 1 is reduced for simplicity of illustration. In addition, illustration of the second support member 20b included in the microphone array 1 is omitted.
The first substrates 31 each have one microphone mc, and the plurality of first substrates 31 are each indirectly connected to one second substrate 10a via the connection member 14. The plurality of second substrates 10a to which the plurality of first substrates 31 are indirectly connected are electrically connected to the control substrate 40 via the cable 41. The second substrate 10a acquires sound information acquired by the microphone mc from the first substrate 31 in a state of being connected to the plurality of first substrates 31 and the control substrate 40, respectively, and outputs the acquired sound information to the control substrate 40.
The connection method of the second substrate 10a and the control substrate 40 is the same as that of the microphone array 1 of the first embodiment.
The connection member 14 is a cable that connects the second connection portion 32b attached to the first substrate 31 and the fourth connection portion 12b attached to the second substrate 10 a. Specifically, the connection member 14 includes a first connector 14a detachably connected to the second connection portion 32b at one end thereof, and a second connector 14b detachably connected to the fourth connection portion 12b at the other end thereof. That is, the first substrate 31 is detachable with respect to the second substrate 10 a. The connection member 14 may be a cable having a connector that is detachable from at least one of the second connection portion 32b and the fourth connection portion 12 b.
Fig. 9 is an overall view of a second embodiment of the microphone array 1.
In the second embodiment, the microphone array 1 includes a plurality of microphones mc, a plurality of first substrates 31, and a plurality of mounting members 10b. The mounting member 10b detachably mounts the first substrate 31 connected to the second substrate 10a via the connection member 14. Furthermore, the microphone array 1 comprises a second support member 20b. The second support members 20b are arranged side by side at an arbitrary interval and support the plurality of mounting members 10b to which the first substrates 31 are respectively mounted.
The mounting members 10b are members each having a first direction (x direction) in the longitudinal direction. In the present embodiment, the microphone array 1 includes N (eight in fig. 9) mounting members 10b.
The second support members 20b are members each having a second direction (z direction) orthogonal to the first direction (x direction) as a longitudinal direction. In the present embodiment, the microphone array 1 includes two second support members 20b. The two second support members 20b detachably support both ends of the N mounting members 10b, respectively.
M (eight in fig. 9) first substrates 31 are detachably mounted at the mounting members 10b, respectively. Here, the first substrates 31 are arranged at a constant interval d in the x direction, respectively. Further, the mounting members 10b are arranged side by side at a constant interval d in the z direction. Here, in each of the mounting members 10b, the position of the first substrate 31 in the x direction is the same. That is, the m×n microphones mc are arranged in a lattice shape in the xz direction by the N mounting members 10 b.
Fig. 10 is a diagram showing a structural example of the attachment member 10 b.
As shown in fig. 10, the mounting member 10b includes a plurality of substrate mounting portions 11, and the plurality of substrate mounting portions 11 are capable of mounting a plurality of first substrates 31 at arbitrary intervals in the x direction. The plurality of substrate mounting portions 11 are mounting holes to which the first substrate 31 can be mounted, and have a shape to which the first substrate 31 can be screwed via a plurality of mounting holes 31a formed in the first substrate 31 shown in fig. 2.
Here, the mounting holes formed in the mounting member 10b may be formed at a constant interval (for example, an interval of about 3 mm) in the x-direction. In this case, fine adjustment can be made to the mounting position of the first substrate 31 in the x direction.
The mounting member 10b has a plate-like shape having a length in the z direction shorter than a length in the y direction orthogonal to the measurement surface. That is, the mounting member 10b extends perpendicularly with respect to the measurement face. Further, the first substrate 31 is mounted in parallel with a plane perpendicular to the measurement plane in the mounting member 10 b. Thus, the mounting surface of the microphone mc is perpendicular to the measurement surface.
In a state where the first substrate 31 is mounted on the mounting member 10b, the microphone mc is mounted on the first substrate 31 at a position close to the object to be measured, that is, at a position close to the sound source surface 2 a. More specifically, the microphone mc is disposed so as to protrude from the end surface of the mounting member 10b on the object side (sound source surface 2a side) toward the object side (sound source surface 2a side) in the y direction. That is, the mounting member 10b is disposed on the opposite side of the sound source surface 2a from the measurement surface so as to prevent the measured sound from the sound source from being blocked.
In a state where the connector portion 14a of the connecting member 14 is connected to the second connecting portion 32b of the first substrate 31, the connecting member 14 extends in the y direction from a side away from the object to be measured (the sound source surface 2 a) in the first substrate 31 toward the second substrate 10 a.
Fig. 11 is a diagram showing a structural example of the second support member 20 b.
As shown in fig. 11, the second support member 20b includes a plurality of member insertion portions 21b, and the plurality of member insertion portions 21b are capable of inserting the plurality of mounting members 10b at arbitrary intervals in the z-direction. The plurality of member insertion portions 21b are grooves (recesses) having a shape into which the mounting member 10b can be inserted, and are formed at equal intervals in the z direction, for example. The ends of the N mounting members 10b are inserted into the member insertion portions 21b of the second support member 20b so as to be arranged at a constant interval d in the z direction. The mounting member 10b is detachable with respect to the second support member 20b, and the interval d of the mounting member 10b in the z-direction can be arbitrarily changed. Here, the member insertion portions 21b are formed at intervals of, for example, about 3mm in the z direction, and the intervals d in the z direction can be changed between about 30mm to about 50mm, for example.
In the present embodiment, the case where both end portions of the mounting member 10b are supported by the two second support members 20b is described, but the second support members 20b may support only one end of the mounting member 10b or may support positions other than the end portions of the mounting member 10 b. The second support member 20b is not limited to the structure shown in fig. 11. The second support member 20b may be any structure capable of supporting a plurality of mounting members 10b each having the first substrate 31 mounted thereon, and arranged side by side at an arbitrary interval.
As described above, the microphone array device 50 of the second embodiment includes: a connection member 14 that connects the second connection portion 32b included in the first substrate 31 and the fourth connection portion 12b included in the second substrate 10 a; and a mounting member 10b detachably mounting the first substrate 31 connected to the second substrate 10a via the connecting member 14.
In this way, since the first substrate 31 and the second substrate 10a can be connected via the connecting member 14, the arrangement interval of the first substrate 31 can be widened, and the microphone array 1 having a wide arrangement interval corresponding to a large-sized measurement object can be configured. Further, since the first substrate 31 is detachable from the mounting member 10b, the arrangement interval of the microphones mc can be easily changed.
The microphone array 1 of the second embodiment is preferably used when the microphones mc are arranged at intervals of more than 10 mm. For example, the length of the connection member 14 is set to a length at which the microphone mc can be arranged at about 30mm to 50 mm.
In addition, the connection member 14 can be provided as a cable having a connector that is detachable with respect to at least one of the second connection portion 32b and the fourth connection portion 12 b. Thus, the first substrate 31 can be detachably attached to the second substrate 10 a. Therefore, the first substrate 31 can be easily replaced. For example, when any trouble occurs in one of the plurality of microphones mc, only the first substrate 31 on which the microphone mc having the trouble has been mounted can be repaired or replaced. Further, if the first substrate 31 on which one microphone mc is mounted is replaced with the first substrate 31 on which a plurality of microphones mc are mounted, the number of microphones mc included in the microphone array 1 can be easily increased, and the arrangement interval of the microphones mc can also be easily changed.
Further, the mounting member 10b can include a plurality of substrate mounting portions 11 to which the first substrate 31 can be mounted at arbitrary intervals. Thus, the first substrate 31 can be mounted at an arbitrary position of the mounting member 10b, and the arrangement interval of the microphones mc can be easily changed.
The microphone array device 50 according to the present embodiment further includes a second support member 20b, and the second support member 20b is arranged side by side at an arbitrary interval and supports a plurality of mounting members 10b to which the first substrate 31 is connected, respectively. Therefore, the plurality of microphones mc can be easily and appropriately arranged in an array. Further, the second support member 20b can include a plurality of member insertion portions 21b into which a plurality of mounting members 10b can be inserted at arbitrary intervals, and therefore, the arrangement interval of the mounting members 10b in the z direction can be easily set to a desired interval.
As described above, by preparing plural kinds of first substrates 31 having different mounting intervals of the microphones mc and changing the kind of the first substrate 31 mounted on the mounting member 10b, the arrangement interval of the microphones mc in the x direction can be easily changed. Further, by changing the mounting position of the first substrate 31 with respect to the mounting member 10b, the arrangement interval of the microphones mc in the x direction can also be easily changed.
Further, by changing the mounting position of the mounting member 10b with respect to the second support member 20b, the arrangement interval of the microphones mc in the z-direction can be easily changed.
Therefore, the microphone array 1 having the microphones mc arranged in an array at desired intervals in the x-direction and the z-direction can be provided.
As described above, the microphone array device 50 in the present embodiment can easily change the array-like intervals (intervals in the x-direction and the z-direction) of the microphones mc.
When a plurality of microphones are mounted on a lattice-shaped substrate and a microphone array is formed by the substrate itself, the substrate constituting the microphone array is fixed to a case of the microphone array device, and when the lattice-shaped interval (interval between microphones) is to be changed according to the size of an object to be measured, it is necessary to replace each microphone array device. That is, it is necessary to prepare a microphone array device for each object to be measured, and the cost increases.
In contrast, in the present embodiment, the microphone mc is mounted on the first substrate 31, and the replacement of the first substrate 31 and the change of the arrangement position can be performed. Therefore, the arrangement interval of the microphones mc can be easily changed, and the microphone array device 50 corresponding to various sizes of objects to be measured can be provided. Therefore, it is not necessary to prepare a microphone array device for each object to be measured as in the conventional technique described above, and the cost can be reduced.
In addition, when the object to be measured is small, the lattice spacing of the microphones may be set to, for example, 10mm or less. In the case of constructing such a small microphone array, if the measurement surface of the microphone array is of a compact structure, the microphone array is regarded as a wall and sound is reflected, so that sound is reverberated between the object to be measured and the microphone array. In the case where the sound in the steady state is to be measured, since the reverberated sound overlaps with the sound to be measured, accurate measurement is hindered. As a result, it is difficult to analyze sounds using the microphone array.
In contrast, in the present embodiment, the microphone array 1 can be configured by a first method in which the first substrate 31 on which the microphone mc is mounted and the second substrate 10a are directly connected to each other. In this case, the first substrate 31 and the second substrate 10a may be connected in parallel, and the first substrate 31 and the second substrate 10a may be arranged perpendicular to the measurement plane. Therefore, even if the lattice spacing of the microphone mc is narrow, the measurement surface of the microphone array can be suppressed from being compact. As a result, the reflected sound from the microphone array can be suppressed from adversely affecting the sound analysis result.
In addition, if the microphone mc is a non-directional microphone, the sound reception by the microphone mc can be performed appropriately regardless of the posture of the first substrate 31. Further, if the microphone mc is a MEMS microphone, a microphone array capable of realizing near-field acoustic holography for a small-sized object to be analyzed can be provided.
As described above, the microphone mc may be a directional microphone. In this case, the first substrate 31 is preferably arranged such that the sensor surface having the highest sensitivity among the directional microphones faces the sound source surface 2a, that is, is parallel or substantially parallel to the sound source surface 2 a.
According to the acoustic analysis system of the present embodiment, the microphone array 1 is disposed close to the object to be measured so that the measurement surface is parallel to the sound source surface 2a of the object to be measured. That is, the measurement plane of the microphone array 1 is parallel to the sound source plane 2a. Therefore, in the case where the microphone mc is a directional microphone, the microphone mc is preferably mounted on the first substrate 31 such that the sensor surfaces of the microphone mc are parallel or substantially parallel to the measurement surface and the sound source surface 2a, respectively. Thus, sound reception by the directional microphone can be performed appropriately.
In addition, even in the case of the microphone array 1 of the second embodiment in which the first substrate 31 on which the microphone mc is mounted is connected to the second substrate 10a via the connection member 14, by providing the mounting member 10b in a shape extending perpendicularly to the measurement surface, the first substrate 31 can be arranged in a posture extending perpendicularly to the measurement surface by mounting the first substrate 31 on the surface of the mounting member 10b perpendicular to the measurement surface. Therefore, the first substrate 31 and the mounting member 10b can be suppressed from becoming walls, and the occurrence of the reflected sound can be suppressed.
Further, the microphone mc can be mounted in the first substrate 31 at a position close to the object to be measured. Thus, sound can be appropriately received by the microphone mc. In this case, the microphone mc is arranged so as to protrude from the end surfaces of the second substrate 10a and the mounting member 10b on the object side toward the object side, whereby the sound can be received more appropriately.
In the microphone array device 50 according to the second embodiment, the connection member 14 can extend from the side of the first substrate 31 away from the object to be measured toward the second substrate 10 a. In this case, the connection member 14 can be suppressed from interfering with sound reception.
As described above, the microphone array device 50 in the present embodiment includes: a plurality of microphones mc; at least one first substrate 31, at least one of the first substrates 31 being mounted with at least one microphone mc of a plurality of microphones mc; the second board 10a is electrically connected to the first board 31, and outputs the sound information acquired by the microphone mc to the control board 40 that controls the first board 31. The first substrate 31 includes a first connection portion 32a and a second connection portion 32b having different connection methods, and the second substrate 10a includes: a third connection portion 12a electrically connectable to the first connection portion 32 a; and a fourth connection portion 12b electrically connectable to the second connection portion 32 b.
Thus, the first substrate 31 and the second substrate 10a include two kinds of connection portions, respectively, and the first substrate 31 and the second substrate 10a can be connected in different forms. Specifically, the microphone array device 50 in the present embodiment can be modified to: a first mode of directly connecting the first substrate 31 and the second substrate 10 a; and a second mode of indirectly connecting the first substrate 31 and the second substrate 10 a. Therefore, the arrangement interval of the microphones mc can be greatly changed.
Therefore, the interval between the microphones mc can be easily changed according to the size of the object to be measured, and the sound to be measured from the object to be measured can be appropriately measured. Even when the object to be measured is small and the lattice interval of the microphone mc is narrow, the object to be measured can be configured so as not to block the sound to be measured from the object to be measured. Therefore, the measured sounds from various small-sized objects to be measured can be accurately measured.
Fig. 12 shows an example of the configuration of an acoustic analysis system 1000 including the microphone array device 50 according to the present embodiment. In fig. 12, the microphone array device 50 simply shows the microphone array 1.
The sound analysis system 1000 includes the microphone array device 50, the sound analysis device 100, and the display device 200. The sound analysis device 100 receives the sound information output from the second board 10a, and analyzes the received sound information to detect a physical quantity representing the characteristics of the sound. In the acoustic analysis system 1000, the microphone array 1 is disposed close to the object 2 so that the measurement surface is parallel to the sound source surface 2a of the object 2.
The acoustic analysis device 100 includes a signal processing unit 101, an analysis processing unit 102, and a memory unit 103. The signal processing unit 101 performs predetermined signal processing on the signals from the microphones mc of the microphone array 1 to obtain signals for acoustic analysis. The signal processing may include processing for synchronizing signals of m×n microphones mc included in the microphone array 1.
The analysis processing unit 102 analyzes the signal processed by the signal processing unit 101, and detects a physical quantity representing a characteristic of the sound. Here, the physical quantity representing the characteristics of sound includes sound pressure distribution, particle velocity distribution, and the like. Then, the analysis processing unit 102 generates an image corresponding to the physical quantity representing the sound feature, and performs display control for causing the display device 200 to display the image.
The memory unit 103 stores the analysis result of the analysis processing unit 102.
The display device 200 includes a monitor such as a liquid crystal display, and displays the image as the analysis result of the acoustic analysis device 100.
As described above, since the acoustic analysis system 1000 according to the present embodiment includes the microphone array device 50 capable of easily changing the lattice spacing of the microphones mc, accurate measurement and acoustic analysis can be performed on objects to be measured having different sizes.
The sound analysis system 1000 including the mxn microphone array may be configured to include: n microphone array modules that perform control related to sound recording of the M microphones mc; and a control unit for controlling the N microphone array modules. In this case, the microphone array module includes: m microphones mc; at least one first substrate 31 on which M microphones mc are mounted; and a control board 40 for controlling the first board 31, wherein the microphone array module transmits the sound information acquired by the M microphones mc to the control unit. Then, the control unit receives signals of the microphones mc from the N microphone array modules, respectively, and processes the signals as signals for sound analysis.
In this case, the control unit may perform a process of matching the phases of the signals of the microphones mc received from the microphone array modules. In addition, synchronization of M microphones mc included in one microphone array module is electrically achieved. Here, for example, a smart speaker (AI speaker) can be used for one microphone array module.
In this case, by adding the microphone array module, the number of microphones mc constituting the microphone array 1 can be easily increased. Therefore, the size of the microphone array 1 is easily increased or the spatial resolution is improved in accordance with the size of the object to be measured.
In the above embodiment, the case where the first substrate 31 is arranged perpendicular to the measurement plane on which the plurality of microphones mc are arranged has been described, but the first substrate 31 may be arranged perpendicular or substantially perpendicular to the measurement plane. That is, the first substrate 31 may be disposed obliquely to the measurement surface. In this case, too, the effect of suppressing the influence of the reflected sound of the microphone array 1 can be obtained.
In addition, a plurality of m×n microphone arrays 1 in the above-described embodiments may be connected to each other to form a larger microphone array.
(Symbol description)
1 … Microphone arrays;
2 … objects to be measured (sound sources);
2a … sound source face;
10a … second substrate;
10b … mounting member;
11 … substrate mounting portions;
12a … third connection portion;
12b … fourth connection;
13 … fifth connection portion;
14 … connecting members;
14a … first connector portion;
14b … second connector portion;
20a … first support member;
20b … second support member;
31 … a first substrate;
32a … first connection portion;
32b … second connection;
33…LED；
40 … control substrates;
41 … cables;
A 50 … microphone array arrangement;
100 … sound analysis device;
200 … display devices;
1000 … sound analysis system;
mc … microphone.
Claims (10)
1. A microphone array apparatus, comprising:
a plurality of MEMS microphones;
at least one first substrate on which at least one MEMS microphone of a plurality of the MEMS microphones is mounted; and
A second substrate electrically connected to the first substrate and outputting sound information acquired by the MEMS microphone to a control substrate that controls the first substrate,
The first substrate comprises a first connecting part and a second connecting part which are connected in different modes,
The second substrate includes:
A third connection portion electrically connectable with the first connection portion; and
A fourth connection portion electrically connectable to the second connection portion,
The first connecting part and the third connecting part can be directly connected,
The first substrate is detachable relative to the second substrate via the first connecting portion and the third connecting portion,
The first connection portion and the third connection portion are substrate-to-substrate connectors that connect the first substrate with the second substrate,
The microphone array device further includes:
A connecting member connecting the second connecting portion with the fourth connecting portion; and
A mounting member detachably mounting the first substrate connected to the second substrate via the connection member,
The connection member is a cable having a connector that is detachable with respect to at least one of the second connection portion and the fourth connection portion.
2. The microphone array apparatus of claim 1 wherein,
The second substrate comprises a plurality of third connecting parts.
3. The microphone array apparatus of claim 1 wherein,
The microphone array arrangement comprises a plurality of the second substrates,
The microphone array device further includes a first support member that is arranged side by side at an arbitrary interval and supports the plurality of second substrates to which the first substrates are respectively connected.
4. The microphone array apparatus of claim 3 wherein,
The first support member includes a plurality of substrate insertion portions into which a plurality of the second substrates can be inserted at arbitrary intervals.
5. The microphone array apparatus of claim 1 wherein,
The mounting member includes a plurality of substrate mounting portions, and the plurality of substrate mounting portions are configured to mount the first substrate at arbitrary intervals.
6. The microphone array apparatus of claim 1 wherein,
The microphone array arrangement comprises a plurality of the mounting members,
The microphone array device further includes a second support member that is arranged side by side at an arbitrary interval and supports the plurality of mounting members to which the first substrate is mounted, respectively.
7. The microphone array apparatus of claim 6 wherein,
The second support member includes a plurality of member insertion portions into which a plurality of the mounting members can be inserted at arbitrary intervals.
8. The microphone array apparatus of any of claims 1 to 7,
The first substrate is disposed perpendicularly or substantially perpendicularly to a measurement surface on which a plurality of the MEMS microphones are disposed in an array.
9. The microphone array apparatus of any of claims 1 to 7,
The MEMS microphones are respectively nondirectional MEMS microphones.
10. An acoustic analysis system, comprising:
The microphone array arrangement of any of claims 1 to 9; and
An acoustic analysis device having the control board,
The sound analysis device receives the sound information output from the second board, and analyzes the sound information to detect a physical quantity representing a characteristic of sound.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2019112898 | 2019-06-18 | ||
| JP2019-112898 | 2019-06-18 | ||
| PCT/JP2020/022429 WO2020255762A1 (en) | 2019-06-18 | 2020-06-05 | Microphone array device and sound analysis system |
Publications (2)
| Publication Number | Publication Date |
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| CN113994713A CN113994713A (en) | 2022-01-28 |
| CN113994713B true CN113994713B (en) | 2024-04-26 |
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| CN202080044382.1A Active CN113994713B (en) | 2019-06-18 | 2020-06-05 | Microphone array device and sound analysis system |
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| JP (1) | JPWO2020255762A1 (en) |
| CN (1) | CN113994713B (en) |
| WO (1) | WO2020255762A1 (en) |
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|---|---|---|---|---|
| TW528259U (en) * | 2002-02-08 | 2003-04-11 | Sheng-Chieh Wang | Composite extended means and wide-angle transmission unit for a wireless infrared microphone transmitter |
| JP2004032314A (en) * | 2002-06-25 | 2004-01-29 | Fuji Xerox Co Ltd | Microphone array |
| CN102544950A (en) * | 2010-12-17 | 2012-07-04 | 无锡爱睿芯电子有限公司 | Serial-in parallel-out port extension module |
| JP2014238369A (en) * | 2013-06-10 | 2014-12-18 | 日本電信電話株式会社 | Multi-sensor and sensing system |
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|---|---|---|---|---|
| US7365476B2 (en) * | 2004-02-27 | 2008-04-29 | The Boeing Company | Methods and systems for supporting acoustical transducers |
| US9084045B2 (en) * | 2009-12-11 | 2015-07-14 | Sorama Holding B.V. | Acoustic transducer assembly |
| US9086430B2 (en) * | 2010-05-24 | 2015-07-21 | The Board Of Trustees Of The University Of Illinois | High sensitivity environmental sensor board and methods for structural health monitoring |
| CN102735872A (en) * | 2011-04-02 | 2012-10-17 | 无锡爱睿芯电子有限公司 | Acceleration sensor module |
| JP7051876B6 (en) * | 2017-01-27 | 2023-08-18 | シュアー アクイジッション ホールディングス インコーポレイテッド | Array microphone module and system |
| US20190097362A1 (en) * | 2017-09-26 | 2019-03-28 | Xcelsis Corporation | Configurable smart object system with standard connectors for adding artificial intelligence to appliances, vehicles, and devices |
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2020
- 2020-06-05 JP JP2020571889A patent/JPWO2020255762A1/ja active Pending
- 2020-06-05 CN CN202080044382.1A patent/CN113994713B/en active Active
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Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW528259U (en) * | 2002-02-08 | 2003-04-11 | Sheng-Chieh Wang | Composite extended means and wide-angle transmission unit for a wireless infrared microphone transmitter |
| JP2004032314A (en) * | 2002-06-25 | 2004-01-29 | Fuji Xerox Co Ltd | Microphone array |
| CN102544950A (en) * | 2010-12-17 | 2012-07-04 | 无锡爱睿芯电子有限公司 | Serial-in parallel-out port extension module |
| JP2014238369A (en) * | 2013-06-10 | 2014-12-18 | 日本電信電話株式会社 | Multi-sensor and sensing system |
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| JPWO2020255762A1 (en) | 2020-12-24 |
| CN113994713A (en) | 2022-01-28 |
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