CN113994713A - Microphone array device and sound analysis system - Google Patents
Microphone array device and sound analysis system Download PDFInfo
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- CN113994713A CN113994713A CN202080044382.1A CN202080044382A CN113994713A CN 113994713 A CN113994713 A CN 113994713A CN 202080044382 A CN202080044382 A CN 202080044382A CN 113994713 A CN113994713 A CN 113994713A
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- 238000004458 analytical method Methods 0.000 title claims description 37
- 239000000758 substrate Substances 0.000 claims abstract description 285
- 238000005259 measurement Methods 0.000 claims description 39
- 238000003780 insertion Methods 0.000 claims description 14
- 230000037431 insertion Effects 0.000 claims description 14
- 238000010586 diagram Methods 0.000 description 12
- 238000000034 method Methods 0.000 description 9
- 238000012545 processing Methods 0.000 description 9
- 238000001093 holography Methods 0.000 description 4
- 230000008859 change Effects 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 230000005236 sound signal Effects 0.000 description 3
- 230000002411 adverse Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000003491 array Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000002452 interceptive effect Effects 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R1/00—Details of transducers, loudspeakers or microphones
- H04R1/20—Arrangements for obtaining desired frequency or directional characteristics
- H04R1/32—Arrangements for obtaining desired frequency or directional characteristics for obtaining desired directional characteristic only
- H04R1/40—Arrangements for obtaining desired frequency or directional characteristics for obtaining desired directional characteristic only by combining a number of identical transducers
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R2201/00—Details of transducers, loudspeakers or microphones covered by H04R1/00 but not provided for in any of its subgroups
- H04R2201/40—Details of arrangements for obtaining desired directional characteristic by combining a number of identical transducers covered by H04R1/40 but not provided for in any of its subgroups
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- Otolaryngology (AREA)
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Acoustics & Sound (AREA)
- Signal Processing (AREA)
- Obtaining Desirable Characteristics In Audible-Bandwidth Transducers (AREA)
- Circuit For Audible Band Transducer (AREA)
Abstract
The microphone array apparatus (50) includes: a plurality of microphones; at least one first substrate mounted with at least one of a plurality of microphones; and a second substrate electrically connected to the first substrate and outputting the sound information acquired by the microphone to a control substrate that controls the first substrate. The first substrate includes a first connection portion and a second connection portion that are connected in different ways. The second substrate includes: a third connection portion electrically connectable with the first connection portion; and a fourth connection portion electrically connectable with the second connection portion.
Description
Technical Field
The invention relates to a microphone array device and a sound analysis system.
Background
In recent years, due to the increasing demand for noise reduction of products, measurement and analysis of the spatial distribution of a sound field have been required.
However, in the conventional microphone array described above, a condenser microphone or a dynamic microphone is used, and if the microphones are arranged at an interval of, for example, 10mm or less, the measurement surface of the microphone array has a compact structure, and it is difficult to perform acoustic holography analysis due to the influence of reflected sound from the microphone array.
Therefore, a microphone array using a small MEMS (Micro-Electrical-mechanical Systems) microphone capable of surface mounting on a substrate is known. As such a MEMS microphone array, a method is known in which a plurality of MEMS microphones are surface-mounted on a lattice-shaped substrate, and a microphone array device is configured by the substrate itself.
Documents of the prior art
Patent document
Patent document 1: japanese patent laid-open No. 2005-91272
Disclosure of Invention
Technical problem to be solved by the invention
When the microphone array is formed by the substrate itself, the array-like intervals cannot be changed according to the size of the object to be measured. Therefore, a microphone array needs to be prepared for each object to be measured, which increases the cost.
Accordingly, an object of the present invention is to provide a microphone array device and a sound analysis system capable of changing the arrangement interval of a plurality of microphones.
Technical scheme for solving technical problem
In order to solve the above-described problems, a microphone array device according to an aspect of the present invention includes: a plurality of microphones; at least one first substrate mounted with at least one of the plurality of microphones; and a second substrate electrically connected to the first substrate and outputting sound information acquired by the microphone to a control substrate that controls the first substrate, the first substrate including a first connection portion and a second connection portion that are different in connection manner, the second substrate including: a third connection portion electrically connectable with the first connection portion; and a fourth connection portion electrically connectable with the second connection portion.
Further, an acoustic analysis system according to an aspect of the present invention includes: the microphone array means; and an acoustic analysis device having the control board, the acoustic analysis device receiving the sound information output from the second board, and analyzing the sound information to detect a physical quantity indicating a feature of sound.
Effects of the invention
According to one aspect of the present invention, since the first substrate and the second substrate include two types of connection portions, respectively, and the first substrate and the second substrate can be connected in different manners, the arrangement interval of the plurality of microphones can be changed greatly.
Drawings
Fig. 1 is an overall view of a first embodiment of a microphone array of the present embodiment.
Fig. 2 is a diagram showing a configuration example of the first substrate.
Fig. 3 is a diagram showing a configuration example of the second substrate.
Fig. 4 shows an example of connection between the first substrate and the second substrate.
Fig. 5 is a diagram showing a configuration example of the first support member.
Fig. 6 is a diagram illustrating another example of the first support member.
Fig. 7 shows a configuration example of the first embodiment of the microphone array device.
Fig. 8 shows a configuration example of a second embodiment of the microphone array device.
Fig. 9 is an overall view of a second embodiment of the microphone array of the present embodiment.
Fig. 10 is a diagram showing a structural example of the mounting member.
Fig. 11 is a diagram showing a configuration example of the second support member.
Fig. 12 is a diagram showing an example of the sound analysis system.
Detailed Description
Hereinafter, embodiments of the present invention will be described with reference to the drawings.
The scope of the present invention is not limited to the following embodiments, but can be arbitrarily changed within the scope of the technical idea of the present invention.
Fig. 1 is an overall view of a first embodiment of a microphone array 1 included in a microphone array device according to the present embodiment.
The microphone array 1 in the present embodiment can be used in an acoustic analysis system for analyzing a measurement target sound from a measurement target (sound source) by using a near-field acoustic holography method, for example. In the near-field acoustic holography, it is necessary to measure the sound pressure distribution on a measurement plane close to and parallel to the sound source plane, and a microphone array in which a plurality of microphones are arranged in a lattice shape is used.
As shown in fig. 1, the microphone array 1 includes a plurality of microphones mc, a plurality of first substrates 31, and a plurality of second substrates 10 a.
The first substrate 31 is a microphone substrate on which at least one microphone mc of the plurality of microphones mc included in the microphone array 1 is mounted. In the present embodiment, a case where one microphone mc is mounted on one first substrate 31 will be described, but a plurality of microphones mc may be mounted on one first substrate 31.
The second board 10a is a connection board electrically connected to the first board 31 and configured to output the audio information acquired by the microphone mc to the control board 40 (see fig. 7) that controls the first board 31. In the present embodiment, a case where a plurality of first substrates 31 are connected to one second substrate 31 will be described, but one first substrate 31 on which a plurality of microphones mc are mounted may be connected to one second substrate 31.
The microphone array 1 further includes a first support member 20 a. The first support members 20a are arranged side by side at an arbitrary interval and support the plurality of second substrates 10a to which the first substrates 31 are respectively connected.
The second base plate 10a detachably supports the first base plate 31. The first support member 20a detachably supports the second base plate 10a, thereby detachably supporting the first base plate 31.
Each of the plurality of microphones mc may be, for example, a MEMS (Micro-Electrical-mechanical Systems) microphone. In the present embodiment, a case where the microphone mc is an MEMS microphone is described, but the microphone mc is not limited to the MEMS microphone.
The second substrates 10a are arranged with the first direction (x direction) being the longitudinal direction. In the present embodiment, the microphone array 1 includes N (eight in fig. 1) second substrates 10 a.
The first support member 20a is a member having a second direction (z direction) orthogonal to the first direction (x direction) as a longitudinal direction. In the present embodiment, the microphone array 1 includes two first support members 20 a. The two first supporting members 20a detachably support both ends of the N second base plates 10a, respectively.
M (eight in fig. 1) first substrates 31 are connected to the second substrate 10a, respectively. Here, the first substrates 31 are arranged at a constant interval d in the x direction, respectively. The first board 31 and the second board 10a are directly connected by a board-to-board connector described later, and the first board 31 is attachable to and detachable from the second board 10a via the board-to-board connector. In addition, when the second substrate 10a is detachable with respect to the first support member 20a, the first substrate 31 may be fixed to the second substrate 10 a.
In addition, the second substrates 10a are arranged side by side at a constant interval d in the z direction, respectively. Here, the positions of the first substrates 31 in the x direction are the same in the respective second substrates 10 a. That is, the M × N microphones mc are arranged in a lattice shape in the xz direction by the N second substrates 10 a.
In fig. 1, the xz plane is a plane parallel to the measurement plane of the microphones mc of the microphone array 1 arranged in a lattice shape, and is a plane parallel to the sound source plane of the measurement target. The microphone array 1 is arranged with a measurement surface spaced a predetermined distance in the y direction from the sound source surface of the object to be measured. For example, the microphone array 1 configures the distance in the y direction between the measurement plane and the sound source plane to be within 10 mm.
The microphone mc can be, for example, a nondirectional MEMS microphone capable of receiving sound from all directions. In the present embodiment, a case where the microphone mc is an omnidirectional MEMS microphone is described, but the microphone mc may be a directional microphone.
The microphone mc incorporates an acoustic transducer (MEMS chip) using MEMS technology and an amplifier, and is mounted on the surface of the first substrate 31. The microphone mc converts sound (sound pressure) into an electric signal by an acoustic transducer, amplifies the electric signal by an amplifier, and outputs the converted electric signal. In the case where the microphone mc is a digital microphone, the microphone mc further includes an a/D converter, and can convert an analog signal amplified by an amplifier into a digital signal and output the digital signal.
Fig. 2 is a diagram showing a configuration example of the first substrate 31. As shown in fig. 2, a microphone mc is mounted on the first substrate 31. The first substrate 31 has one first connection portion 32a and one second connection portion 32b, which are connected in different manners. The first substrate 31 may include an LED33 for confirming energization. By confirming that the LED33 is on, it can be easily confirmed that there is no electrical failure in the first substrate 31 due to disconnection of the connector or the like.
Fig. 3 is a diagram showing a configuration example of the second substrate 10 a. As shown in fig. 3, the second substrate 10a includes a plurality of third connection portions 12a and a plurality of fourth connection portions 12b having different connection methods. The third connection portion 12a and the fourth connection portion 12b are installed at a constant interval in the x direction, for example. The third connection portion 12a can be electrically connected to the first connection portion 32a of the first substrate 31, and the fourth connection portion 12b can be electrically connected to the second connection portion 32b of the first substrate 31.
In addition, the second substrate 10a includes one fifth connection portion 13. The fifth connection portion 13 can be a connector portion to which a cable 41 (see fig. 7) for connecting the second substrate 10a to a control substrate 40 (see fig. 7) that controls the first substrate 31 is connected. The fifth connection portion 13 can be attached to, for example, one end portion of the second substrate 10 a.
The first connection portion 32a of the first substrate 31 and the third connection portion 12a of the second substrate 10a may be substrate-to-substrate connectors that directly connect the first substrate 31 and the second substrate 10 a. The first connection portion 32a and the third connection portion 12a can be directly connected, and in a state where the first connection portion 32a and the third connection portion 12a are connected, as shown in fig. 4, the first substrate 31 and the second substrate 10a are parallel to each other. Here, the first connection portion 32a and the third connection portion 12a are small-sized connectors in which the distance between the first substrate 31 and the substrate of the second substrate 10a is, for example, within 1 mm. The first substrate 31 is detachable with respect to the second substrate 10a via the first connection portion 32a and the third connection portion 12 a.
In the microphone array 1 shown in fig. 1, M first substrates 31 are connected to the second substrate 10a via the first connection portions 32a and the third connection portions 12a so as to be arranged at constant intervals d in the x direction.
The first substrate 31 and the second substrate 10a are connected in parallel as described above, and are arranged in a state of extending perpendicularly to the measurement surface in the microphone array 1. That is, the mounting surface of the microphone mc in the first substrate 31 is perpendicular with respect to the measurement surface.
In a state where the first substrate 31 is attached to the second substrate 10a, as shown in fig. 3, the microphone mc is attached to the first substrate 31 at a position close to the measurement target, that is, at a position close to the sound source surface 2 a. More specifically, the microphone mc is disposed so as to protrude from an end surface of the second substrate 10a on the object side to be measured (sound source surface 2a side) toward the object side to be measured (sound source surface 2a side) in the y direction. That is, the second substrate 10a is disposed on the opposite side of the sound source surface 2a with respect to the measurement surface so as to prevent the measurement sound from the sound source from being blocked.
Fig. 5 is a diagram showing a configuration example of the first support member 20a in the present embodiment.
As shown in fig. 5, the first support member 20a includes a plurality of substrate insertion portions 21a, and a plurality of second substrates 10a can be inserted into the plurality of substrate insertion portions 21a at arbitrary intervals in the z direction. The plurality of substrate insertion portions 21a are grooves (concave portions) having a shape into which the second substrate 10a can be inserted, and are formed at equal intervals in the z direction, for example. The end portions of the N second substrates 10a are inserted into the substrate insertion portions 21a of the first support member 20a to be arranged at a constant interval d in the z direction. The second substrate 10a is detachable from the first support member 20a, and the interval d in the z direction of the second substrate 10a can be arbitrarily changed. Here, the substrate insertion portions 21a are formed at intervals of, for example, about 3mm in the z direction, and the interval d in the z direction can be changed, for example, between about 3mm and about 20 mm.
In the present embodiment, a case where both ends of the second substrate 10a are supported by two first support members 20a is described, but the first support members 20a may support only one end of the second substrate 10a, or may support positions other than the end of the second substrate 10 a. The first support member 20a is not limited to the configuration shown in fig. 5. The first support member 20a may be configured to support the plurality of second substrates 10a to which the first substrates 31 are respectively connected, while being arranged side by side at an arbitrary interval. For example, a bolt-like fixing member inserted into a hole formed in the second substrate 10a as in the first support member 20 a' shown in fig. 6 may be used instead of the first support member 20 a. The plurality of second substrates 10a may be supported by a frame-shaped frame member.
The first substrate 31 and the second substrate 10a may be electrically connected to each other through the second connection portion 32b and the fourth connection portion 12 b. Here, the second connection portion 32b and the fourth connection portion 12b are electrically connected via a connection member. The connecting member may be a cable having a connector detachable from at least one of the second connecting portion 32b and the fourth connecting portion 12 b.
That is, the microphone array 1 in the present embodiment has a first mode in which the first substrate 31 and the second substrate 10a are directly connected via the first connection portion 32a and the third connection portion 12a as shown in fig. 1, and a second mode in which the first substrate 31 and the second substrate 10a are indirectly connected via the second connection portion 32b, the fourth connection portion 12b, and the connection member.
First, fig. 7, which explains the configuration of the first embodiment of the microphone array device 50, is a configuration example of the first embodiment of the microphone array device 50 in the present embodiment.
The microphone array device 50 of the first embodiment includes the microphone array 1 shown in fig. 1 described above. In fig. 7, the number of the first substrate 31 and the second substrate 10a included in the microphone array 1 is reduced for simplification of illustration. Further, illustration of the first support member 20a included in the microphone array 1 is omitted.
The first substrate 31 includes a microphone mc, and the first substrate 31 is directly connected to the second substrate 10a through the first connection portion 32a and the third connection portion 12a as shown in fig. 4. The plurality of second substrates 10a to which the plurality of first substrates 31 are directly connected are electrically connected to the control substrate 40 via cables 41. The second substrate 10a acquires sound information acquired by the microphone mc from the first substrate 31 in a state of being connected to the plurality of first substrates 31 and the control substrate 40, respectively, and outputs the acquired sound information to the control substrate 40.
One end of the cable 41 is connected to the control board 40, and the other end of the cable 41 is connected to the fifth connection portion (connector portion) 13 of the second board 10 a. The cable 41 may be detachable from at least one of the control board 40 and the second board 10 a.
The control board 40 can control the M × N first boards 31 and perform control related to recording of the M × N microphones mc. Specifically, the control board 40 outputs a recording instruction to the first board 31, and in response to the recording instruction, the recording data (sound information acquired by the microphone mc) output from the first board 31 via the second board 10a and the cable 41 is input.
In the present embodiment, a case where M × N microphones mc included in the microphone array 1 are connected to one control board 40 will be described. However, the number of microphones mc connected to one control board 40 is not limited to the above. For example, one second substrate 10a may be connected to one control substrate 40. That is, the control board 40 may be connected to different M microphones mc. In this case, there are N control boards 40, and each control board 40 performs control related to recording of M microphones mc. In this case, a control unit for controlling the N control boards 40 may be further provided.
In this way, in the microphone array 1 of the first embodiment, the first substrate 31 and the second substrate 10a are directly connected via the first connection portion 32a included in the first substrate 31 and the third connection portion 12a included in the second substrate 10 a. That is, the first substrate 31 and the second substrate 10a can be connected without a cable. Therefore, for example, even when the object to be measured is small and the arrangement interval of the first substrate 31 is narrowed in order to form a microphone array in which the arrangement interval of the microphones mc is narrow, it is possible to avoid that the cables extending from the first substrate 31 become walls and adversely affect the sound measurement. In addition, the interference between the tight cable and the measured object can be avoided.
In this way, even when the arrangement interval of the microphones mc is narrow, the measurement surface of the microphone array 1 can be suppressed from becoming tight, and the influence of reflected sound or the like can be appropriately reduced. The microphone array 1 of the first embodiment is preferably configured such that microphones mc are arranged at narrow intervals of about 10 mm.
The first substrate 31 is detachable from the second substrate 10a via the first connection portion 32a and the third connection portion 12 a. Therefore, the first substrate 31 can be easily replaced. For example, when any trouble occurs in one of the plurality of microphones mc, only the first substrate 31 on which the microphone mc having the trouble occurred can be repaired or replaced. Further, if the first substrate 31 on which one microphone mc is mounted is replaced with the first substrate 31 on which a plurality of microphones mc are mounted, the number of microphones mc included in the microphone array 1 can be easily increased, and the arrangement interval of the microphones mc can be easily changed.
In addition, as shown in fig. 3, the second substrate 10a may include a plurality of third connection parts 12 a. This allows the plurality of first boards 31 and the second board 10a to be detachably connected. Therefore, by changing the connection position of the first substrate 31 with respect to the second substrate 10a, the arrangement interval of the first substrates 31 can be easily changed. For example, the arrangement interval of the microphones mc can be easily changed by connecting every other or every two of the first substrates 31 to the plurality of third connecting portions 12a included in the second substrate 10 a.
The microphone array device 50 according to the present embodiment further includes the first support member 20a, and the first support member 20a is arranged in parallel at an arbitrary interval and supports the plurality of second substrates 10a to which the first substrates 31 are respectively connected. Therefore, the plurality of microphones mc can be easily and appropriately arranged in an array. Further, since the first support member 20a can include the plurality of substrate insertion portions 21a into which the plurality of second substrates 10a can be inserted at arbitrary intervals, the arrangement interval of the second substrates 10a in the z direction can be easily set to a desired interval.
As described above, by preparing a plurality of types of first substrates 31 having different mounting intervals of the microphones mc and changing the type of the first substrate 31 connected to the second substrate 10a, the arrangement interval of the microphones mc in the x direction can be easily changed. Further, by changing the connection position of the first substrate 31 with respect to the second substrate 10a, the arrangement interval of the microphones mc in the x direction can also be easily changed.
Further, by changing the mounting position of the second substrate 10a with respect to the first support member 20a, the arrangement interval of the microphones mc in the z direction can be easily changed.
Therefore, the microphone array 1 can be provided with the microphones mc arranged in an array at desired intervals in the x direction and the z direction.
Next, the configuration of the second embodiment of the microphone array device 50 will be described.
Fig. 8 shows an example of the configuration of the second embodiment of the microphone array device 50 according to the present embodiment.
The microphone array device 50 of the second mode includes the microphone array 1 and the connection member 14.
In fig. 8, for simplification of illustration, the number of the first substrate 31, the second substrate 10a, and the mounting member 10b included in the microphone array 1 is reduced. Moreover, illustration of the second support member 20b included in the microphone array 1 is omitted.
The first substrates 31 have one microphone mc, respectively, and the plurality of first substrates 31 are indirectly connected to one second substrate 10a via the connecting members 14, respectively. The plurality of second substrates 10a to which the plurality of first substrates 31 are indirectly connected are electrically connected to the control substrate 40 via cables 41. The second substrate 10a acquires sound information acquired by the microphone mc from the first substrate 31 in a state of being connected to the plurality of first substrates 31 and the control substrate 40, respectively, and outputs the acquired sound information to the control substrate 40.
The method of connecting the second substrate 10a to the control substrate 40 is the same as that of the microphone array 1 of the first embodiment.
The connection member 14 is a cable that connects the second connection portion 32b mounted on the first substrate 31 and the fourth connection portion 12b mounted on the second substrate 10 a. Specifically, the connecting member 14 includes a first connector 14a detachably connected to the second connecting portion 32b at one end thereof, and includes a second connector 14b detachably connected to the fourth connecting portion 12b at the other end thereof. That is, the first substrate 31 is detachable from the second substrate 10 a. The connecting member 14 may be a cable having a connector detachable from at least one of the second connecting portion 32b and the fourth connecting portion 12 b.
Fig. 9 is an overall view of a second mode of the microphone array 1.
In the second embodiment, the microphone array 1 includes a plurality of microphones mc, a plurality of first substrates 31, and a plurality of mounting members 10 b. The mounting member 10b detachably mounts the first substrate 31 connected to the second substrate 10a via the connecting member 14. Further, the microphone array 1 further includes a second support member 20 b. The second support members 20b are arranged side by side at an arbitrary interval and support the plurality of mounting members 10b on which the first substrates 31 are mounted, respectively.
The mounting members 10b are members each having a first direction (x direction) as a longitudinal direction. In the present embodiment, the microphone array 1 includes N (eight in fig. 9) mounting members 10 b.
The second support member 20b is a member having a second direction (z direction) orthogonal to the first direction (x direction) as a longitudinal direction. In the present embodiment, the microphone array 1 includes two second support members 20 b. The two second support members 20b detachably support both ends of the N mounting members 10b, respectively.
M (eight in fig. 9) first substrates 31 are detachably mounted on the mounting members 10b, respectively. Here, the first substrates 31 are arranged at a constant interval d in the x direction, respectively. Further, the mounting members 10b are arranged side by side at a constant interval d in the z direction. Here, in each mounting member 10b, the position of the first substrate 31 in the x direction is the same. That is, the M × N microphones mc are arranged in a lattice shape in the xz direction by the N mounting members 10 b.
Fig. 10 is a diagram showing a configuration example of the mounting member 10 b.
As shown in fig. 10, the mounting member 10b includes a plurality of board mounting portions 11, and a plurality of first boards 31 can be mounted on the board mounting portions 11 at arbitrary intervals in the x direction. The plurality of board mounting portions 11 are mounting holes to which the first board 31 can be mounted, and have a shape in which the first board 31 can be screwed through a plurality of mounting holes 31a formed in the first board 31 shown in fig. 2.
Here, the mounting holes formed in the mounting member 10b may be formed at a constant interval (for example, an interval of about 3 mm) in the x direction. In this case, the mounting position of the first substrate 31 in the x direction can be finely adjusted.
The mounting member 10b has a plate-like shape whose length in the z direction is shorter than the length in the y direction perpendicular to the measurement surface. That is, the mounting member 10b extends perpendicularly with respect to the measurement plane. Further, the first substrate 31 is mounted in parallel with a plane perpendicular to the measurement plane in the mounting member 10 b. Thus, the mounting surface of the microphone mc is perpendicular to the measurement surface.
In a state where the first substrate 31 is attached to the attachment member 10b, the microphone mc is attached to a position of the first substrate 31 close to the measurement target, that is, close to the sound source surface 2 a. More specifically, the microphone mc is disposed so as to protrude from an end surface of the mounting member 10b on the object side to be measured (sound source surface 2a side) toward the object side to be measured (sound source surface 2a side) in the y direction. That is, the mounting member 10b is disposed on the opposite side of the sound source surface 2a with respect to the measurement surface so as to prevent the sound to be measured from the sound source from being blocked.
In a state where the connector portion 14a of the connecting member 14 is connected to the second connecting portion 32b of the first substrate 31, the connecting member 14 extends from a side away from the object to be measured (sound source surface 2a) in the first substrate 31 to the second substrate 10a in the y direction.
Fig. 11 is a diagram showing a configuration example of the second support member 20 b.
As shown in fig. 11, the second support member 20b includes a plurality of member insertion portions 21b, and the plurality of mounting members 10b can be inserted into the plurality of member insertion portions 21b at arbitrary intervals in the z direction. The plurality of member insertion portions 21b are grooves (recesses) having a shape into which the mounting member 10b can be inserted, and are formed at equal intervals in the z direction, for example. The end portions of the N mounting members 10b are inserted into the member insertion portions 21b of the second support member 20b to be arranged at constant intervals d in the z direction. The mounting member 10b is detachable from the second support member 20b, and the interval d of the mounting member 10b in the z direction can be arbitrarily changed. Here, the member insertion portions 21b are formed at intervals of, for example, about 3mm in the z direction, and the interval d in the z direction can be changed, for example, between about 30mm and about 50 mm.
In the present embodiment, the case where both ends of the mounting member 10b are supported by the two second support members 20b is described, but the second support members 20b may support only one end of the mounting member 10b, or may support positions other than the end of the mounting member 10 b. The second support member 20b is not limited to the structure shown in fig. 11. The second support member 20b may be configured to support the plurality of mounting members 10b on which the first substrates 31 are mounted, in a row at an arbitrary interval.
As described above, the microphone array apparatus 50 of the second mode includes: a connecting member 14 connecting the second connecting portion 32b included in the first substrate 31 and the fourth connecting portion 12b included in the second substrate 10 a; and a mounting member 10b detachably mounting the first substrate 31 connected to the second substrate 10a via the connecting member 14.
In this way, since the first substrate 31 and the second substrate 10a can be connected via the connecting member 14, the arrangement interval of the first substrate 31 can be widened, and the microphone array 1 having a wide arrangement interval corresponding to a large-sized object to be measured can be configured. Further, since the first substrate 31 is detachable from the mounting member 10b, the arrangement interval of the microphones mc can be easily changed.
The microphone array 1 of the second embodiment is preferably configured such that microphones mc are arranged at intervals of more than 10 mm. For example, the length of the connection member 14 is set to a length that allows the microphone mc to be disposed at about 30mm to 50 mm.
The connecting member 14 may be a cable having a connector detachable from at least one of the second connecting portion 32b and the fourth connecting portion 12 b. This allows the first substrate 31 to be detachably attached to the second substrate 10 a. Therefore, the first substrate 31 can be easily replaced. For example, when any trouble occurs in one of the plurality of microphones mc, only the first substrate 31 on which the microphone mc having the trouble occurred can be repaired or replaced. Further, if the first substrate 31 on which one microphone mc is mounted is replaced with the first substrate 31 on which a plurality of microphones mc are mounted, the number of microphones mc included in the microphone array 1 can be easily increased, and the arrangement interval of the microphones mc can be easily changed.
Further, the mounting member 10b can include a plurality of substrate mounting portions 11 to which the first substrate 31 can be mounted at arbitrary intervals. This allows the first substrate 31 to be attached to an arbitrary position of the mounting member 10b, and allows the arrangement interval of the microphones mc to be easily changed.
The microphone array device 50 according to the present embodiment further includes second support members 20b, and the second support members 20b are arranged in parallel at arbitrary intervals and support the plurality of mounting members 10b to which the first substrates 31 are respectively connected. Therefore, the plurality of microphones mc can be easily and appropriately arranged in an array. Further, since the second support member 20b can include the plurality of member insertion portions 21b into which the plurality of mounting members 10b can be inserted at arbitrary intervals, the arrangement interval of the mounting members 10b in the z direction can be easily set to a desired interval.
As described above, by preparing a plurality of types of first substrates 31 having different mounting intervals of the microphones mc and changing the type of the first substrate 31 mounted on the mounting member 10b, the arrangement interval of the microphones mc in the x direction can be easily changed. Further, by changing the mounting position of the first substrate 31 with respect to the mounting member 10b, the arrangement interval of the microphones mc in the x direction can also be easily changed.
Further, by changing the mounting position of the mounting member 10b with respect to the second supporting member 20b, the arrangement interval of the microphones mc in the z direction can be easily changed.
Therefore, the microphone array 1 can be provided with the microphones mc arranged in an array at desired intervals in the x direction and the z direction.
As described above, the microphone array device 50 according to the present embodiment can easily change the array-like intervals (intervals in the x-direction and the z-direction) of the microphones mc.
When a plurality of microphones are mounted on a lattice-shaped substrate and a microphone array is formed by the substrate itself, the substrate forming the microphone array is fixed to a housing of a microphone array device, and when it is desired to change the lattice-shaped intervals (intervals of microphones) in accordance with the size of an object to be measured, it is necessary to replace each microphone array device. That is, a microphone array device needs to be prepared for each object to be measured, which leads to high cost.
In contrast, in the present embodiment, the microphone mc is attached to the first substrate 31, and the first substrate 31 can be replaced or the arrangement position can be changed. Therefore, the arrangement interval of the microphones mc can be easily changed, and the microphone array device 50 corresponding to the objects to be measured of various sizes can be provided. Therefore, it is not necessary to prepare a microphone array device for each object to be measured as in the conventional technique described above, and the cost can be reduced.
When the object to be measured is small, the lattice spacing of the microphones may be set to, for example, 10mm or less. In the case of configuring such a small microphone array, if the measuring surface of the microphone array is configured to be compact, the microphone array is regarded as a wall and reflects sound, so that the sound is reverberated between the measured object and the microphone array. In the case where the sound in the steady state is to be measured, since the reverberant sound overlaps with the sound to be measured, accurate measurement is hindered. As a result, it is difficult to analyze the sound using the microphone array.
In contrast, in the present embodiment, the microphone array 1 can be configured by a first method in which the first substrate 31 on which the microphones mc are mounted and the second substrate 10a are directly connected to each other. In this case, the first substrate 31 and the second substrate 10a can be connected in parallel, and the first substrate 31 and the second substrate 10a can be arranged perpendicular to the measurement plane. Therefore, even if the lattice interval of the microphone mc is narrow, the measurement surface of the microphone array can be suppressed from being compact. As a result, it is possible to suppress the reflected sound from the microphone array from adversely affecting the acoustic analysis result.
Note that, if the microphone mc is a non-directional microphone, the sound reception by the microphone mc can be performed appropriately regardless of the posture of the first substrate 31. Further, if the microphone mc is an MEMS microphone, a microphone array capable of realizing near-field acoustic holography for a small object to be analyzed can be provided.
As described above, the microphone mc may be a directional microphone. In this case, the first substrate 31 is preferably disposed so that the sensor surface having the highest sensitivity among the directional microphones faces the sound source surface 2a, i.e., is parallel or substantially parallel to the sound source surface 2 a.
According to the acoustic analysis system of the present embodiment, the microphone array 1 is disposed close to the object to be measured so that the measurement plane is parallel to the sound source plane 2a of the object to be measured. That is, the measurement plane of the microphone array 1 is parallel to the sound source plane 2 a. Therefore, when the microphone mc is a directional microphone, the microphone mc is preferably mounted on the first substrate 31 such that the sensor surface of the microphone mc is parallel or substantially parallel to the measurement surface and the sound source surface 2a, respectively. This makes it possible to appropriately perform sound reception by the directional microphone.
Even when the microphone array 1 of the second embodiment is configured such that the first substrate 31 on which the microphone mc is mounted and the second substrate 10a are connected to each other via the connecting member 14, the first substrate 31 can be disposed in a posture extending perpendicularly to the measurement plane by mounting the first substrate 31 on the surface perpendicular to the measurement plane of the mounting member 10b by forming the mounting member 10b in a shape extending perpendicularly to the measurement plane. Therefore, the first substrate 31 and the mounting member 10b can be prevented from becoming walls, and the generation of the above-described reflected sound can be suppressed.
The microphone mc can be attached to the first substrate 31 at a position close to the object to be measured. This enables appropriate reception of sound by the microphone mc. In addition, at this time, by disposing the microphone mc so as to protrude from the end surface of the second substrate 10a or the mounting member 10b on the object side toward the object side, it is possible to more appropriately receive sound.
In the microphone array device 50 of the second embodiment, the connection member 14 can extend from the side of the first substrate 31 away from the object to be measured toward the second substrate 10 a. In this case, the connection member 14 can be suppressed from interfering with sound reception.
As described above, the microphone array device 50 according to the present embodiment includes: a plurality of microphones mc; at least one first substrate 31, at least one of the first substrate 31 having at least one microphone mc among a plurality of microphones mc mounted thereon; and a second substrate 10a, the second substrate 10a being electrically connected to the first substrate 31, and outputting the sound information acquired by the microphone mc to the control substrate 40 that controls the first substrate 31. Further, the first substrate 31 includes a first connection portion 32a and a second connection portion 32b having different connection methods, and the second substrate 10a includes: a third connection portion 12a electrically connectable with the first connection portion 32 a; and a fourth connection portion 12b electrically connectable with the second connection portion 32 b.
Thus, the first substrate 31 and the second substrate 10a include two kinds of connection portions, respectively, and the first substrate 31 and the second substrate 10a can be connected in different forms. Specifically, the microphone array device 50 in the present embodiment can be modified to: a first mode in which the first substrate 31 and the second substrate 10a are directly connected; and a second mode in which the first substrate 31 and the second substrate 10a are indirectly connected. Therefore, the arrangement interval of the microphones mc can be greatly changed.
Therefore, the interval between the microphones mc can be easily changed according to the size of the object to be measured, and the sound to be measured from the object to be measured can be appropriately measured. Even when the object to be measured is small and the lattice interval of the microphone mc is narrow, the structure can be made so as not to block the sound to be measured from the object to be measured. Therefore, the measurement sound from various small-sized objects to be measured can be accurately measured.
Fig. 12 shows an example of the configuration of an acoustic analysis system 1000 including the microphone array device 50 according to the present embodiment. In addition, in fig. 12, the microphone array apparatus 50 simply shows the microphone array 1.
The acoustic analysis system 1000 includes the microphone array device 50, the acoustic analysis device 100, and the display device 200. The sound analysis device 100 receives the sound information output from the second substrate 10a, and analyzes the received sound information to detect a physical quantity indicating a feature of the sound. In the acoustic analysis system 1000, the microphone array 1 is disposed close to the object 2 so that the measurement plane is parallel to the sound source plane 2a of the object 2.
The sound analysis device 100 includes a signal processing unit 101, an analysis processing unit 102, and a storage unit 103. The signal processing unit 101 performs predetermined signal processing on the signal from each microphone mc of the microphone array 1 to obtain a signal for acoustic analysis. The signal processing may include a process of synchronizing signals of M × N microphones mc included in the microphone array 1, and the like.
The analysis processing unit 102 analyzes the signal processed by the signal processing unit 101 and detects a physical quantity representing the feature of the sound. Here, the physical quantity representing the characteristics of sound includes a sound pressure distribution, a particle velocity distribution, and the like. Then, the analysis processing unit 102 generates an image corresponding to the physical quantity indicating the sound feature, and performs display control for displaying the image on the display device 200.
The storage unit 103 stores analysis results and the like of the analysis processing unit 102.
The display device 200 includes a monitor such as a liquid crystal display, and displays the image as a result of analysis by the sound analyzer 100.
As described above, the acoustic analysis system 1000 according to the present embodiment includes the microphone array device 50 that can easily change the lattice intervals of the microphones mc, and thus can perform accurate measurement and acoustic analysis of objects to be measured that have different sizes.
The acoustic analysis system 1000 including the mxn microphone array may include, for example: n microphone array modules that perform control related to the recording of the M microphones mc; and a control unit for controlling the N microphone array modules. In this case, the microphone array module includes: m microphones mc; at least one first substrate 31 on which M microphones mc are mounted; and a control board 40 for controlling the first board 31, wherein the microphone array module transmits the sound information acquired by the M microphones mc to the control unit. Then, the control unit receives the signals of the microphones mc from the N microphone array modules, respectively, and processes the signals as signals for acoustic analysis.
At this time, the control unit may perform a process of aligning the phases of the signals of the microphones mc received from the respective microphone array modules. In addition, synchronization of the M microphones mc included in one microphone array module is electrically achieved. Here, a microphone array module can use, for example, smart speakers (AI speakers).
In this case, the number of microphones mc constituting the microphone array 1 can be easily increased by adding the microphone array module. Therefore, it is easy to increase the size of the microphone array 1 or improve the spatial resolution in accordance with the size of the object to be measured.
(modification) in the above-described embodiment, the case where the first substrate 31 is disposed so as to be perpendicular to the measurement plane on which the plurality of microphones mc are disposed has been described, but the first substrate 31 may be disposed so as to be perpendicular or substantially perpendicular to the measurement plane. That is, the first substrate 31 may be disposed obliquely to the measurement plane. In this case, too, an effect of suppressing the influence of the reflected sound of the microphone array 1 can be obtained.
Further, a plurality of M × N microphone arrays 1 in the above embodiment may be connected to form a larger microphone array.
(symbol description)
1 … microphone array;
2 … measured object (sound source);
2a … sound source plane;
10a … second substrate;
10b … mounting member;
11 … a substrate mounting part;
12a … third connection;
12b … fourth connection;
13 … fifth connecting part;
14 … a connecting member;
14a … first connector portion;
14b … second connector portion;
20a … first support member;
20b … second support member;
31 … a first substrate;
32a … first connection;
32b … second connection;
33…LED；
40 … control substrate;
41 … cables;
50 … microphone array arrangement;
100 … acoustic analysis device;
200 … display device;
1000 … sound analytic system;
mc … microphone.
Claims (14)
1. A microphone array apparatus, comprising:
a plurality of microphones;
at least one first substrate mounted with at least one of the plurality of microphones; and
a second substrate electrically connected to the first substrate and outputting sound information acquired by the microphone to a control substrate that controls the first substrate,
the first substrate comprises a first connecting part and a second connecting part which are connected in different ways,
the second substrate includes:
a third connection portion electrically connectable with the first connection portion; and
a fourth connection portion electrically connectable with the second connection portion.
2. Microphone array arrangement according to claim 1,
the first connection portion and the third connection portion may be directly connected,
the first substrate is detachable with respect to the second substrate via the first connection portion and the third connection portion.
3. Microphone array arrangement according to claim 2,
the first connection portion and the third connection portion are substrate-to-substrate connectors that connect the first substrate and the second substrate.
4. Microphone array arrangement according to claim 2 or 3,
the second substrate includes a plurality of the third connection portions.
5. Microphone array arrangement according to one of claims 2 to 4,
the microphone array apparatus includes a plurality of the second substrates,
the microphone array device further includes a first support member that is arranged side by side at an arbitrary interval and supports the plurality of second substrates to which the first substrates are respectively connected.
6. Microphone array arrangement according to claim 5,
the first support member includes a plurality of substrate insertion portions into which the plurality of second substrates can be inserted at arbitrary intervals.
7. Microphone array arrangement according to one of claims 1 to 6,
the microphone array apparatus further includes:
a connection member connecting the second connection portion with the fourth connection portion; and
a mounting member that detachably mounts the first substrate connected to the second substrate via the connecting member.
8. Microphone array arrangement according to claim 7,
the connecting member is a cable having a connector detachable with respect to at least one of the second connecting portion and the fourth connecting portion.
9. Microphone array arrangement according to claim 7 or 8,
the mounting member includes a plurality of substrate mounting portions, and the substrate mounting portions enable the first substrate to be mounted at arbitrary intervals.
10. Microphone array arrangement according to one of claims 7 to 9,
the microphone array apparatus includes a plurality of the mounting members,
the microphone array device further includes a second support member that is arranged side by side at an arbitrary interval and supports the mounting members on which the first substrates are mounted, respectively.
11. Microphone array arrangement according to claim 10,
the second support member includes a plurality of member insertion portions into which the plurality of mounting members can be inserted at arbitrary intervals.
12. Microphone array arrangement according to one of claims 1 to 11,
the first substrate is arranged perpendicular or substantially perpendicular to a measurement plane, and the plurality of microphones are arranged in an array on the measurement plane.
13. Microphone array arrangement according to one of claims 1 to 12,
a plurality of the microphones are each non-directional microphones.
14. A sound analysis system, comprising:
the microphone array arrangement of any one of claims 1 to 13; and
an acoustic analyzer having the control board,
the sound analysis device receives the sound information output from the second board, and analyzes the sound information to detect a physical quantity indicating a feature of sound.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2019112898 | 2019-06-18 | ||
| JP2019-112898 | 2019-06-18 | ||
| PCT/JP2020/022429 WO2020255762A1 (en) | 2019-06-18 | 2020-06-05 | Microphone array device and sound analysis system |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN113994713A true CN113994713A (en) | 2022-01-28 |
| CN113994713B CN113994713B (en) | 2024-04-26 |
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| CN202080044382.1A Active CN113994713B (en) | 2019-06-18 | 2020-06-05 | Microphone array device and sound analysis system |
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| Country | Link |
|---|---|
| JP (1) | JPWO2020255762A1 (en) |
| CN (1) | CN113994713B (en) |
| WO (1) | WO2020255762A1 (en) |
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- 2020-06-05 JP JP2020571889A patent/JPWO2020255762A1/ja active Pending
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Also Published As
| Publication number | Publication date |
|---|---|
| WO2020255762A1 (en) | 2020-12-24 |
| JPWO2020255762A1 (en) | 2020-12-24 |
| CN113994713B (en) | 2024-04-26 |
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