CN113950187A - Plane heat conduction copper-clad plate and packaging substrate for packaging multiple plane heat conduction copper-clad plates - Google Patents
Plane heat conduction copper-clad plate and packaging substrate for packaging multiple plane heat conduction copper-clad plates Download PDFInfo
- Publication number
- CN113950187A CN113950187A CN202111258081.1A CN202111258081A CN113950187A CN 113950187 A CN113950187 A CN 113950187A CN 202111258081 A CN202111258081 A CN 202111258081A CN 113950187 A CN113950187 A CN 113950187A
- Authority
- CN
- China
- Prior art keywords
- copper
- clad
- layer
- heat
- insulating layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 title claims abstract description 28
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 26
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 49
- 239000011889 copper foil Substances 0.000 claims abstract description 20
- 230000017525 heat dissipation Effects 0.000 claims description 9
- 239000003292 glue Substances 0.000 claims description 8
- 238000009413 insulation Methods 0.000 claims description 7
- 239000000919 ceramic Substances 0.000 claims description 5
- 239000003822 epoxy resin Substances 0.000 claims description 3
- 239000004744 fabric Substances 0.000 claims description 3
- 229920000647 polyepoxide Polymers 0.000 claims description 3
- 239000011152 fibreglass Substances 0.000 claims 1
- 238000002791 soaking Methods 0.000 abstract description 9
- 230000000694 effects Effects 0.000 abstract description 6
- 230000008646 thermal stress Effects 0.000 abstract description 5
- 229910052802 copper Inorganic materials 0.000 description 29
- 239000010949 copper Substances 0.000 description 29
- 238000010438 heat treatment Methods 0.000 description 7
- 238000000034 method Methods 0.000 description 6
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 6
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 6
- 229910010271 silicon carbide Inorganic materials 0.000 description 6
- 244000137852 Petrea volubilis Species 0.000 description 3
- 229910052581 Si3N4 Inorganic materials 0.000 description 3
- UNRNJMFGIMDYKL-UHFFFAOYSA-N aluminum copper oxygen(2-) Chemical compound [O-2].[Al+3].[Cu+2] UNRNJMFGIMDYKL-UHFFFAOYSA-N 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 239000000843 powder Substances 0.000 description 3
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 3
- 238000012360 testing method Methods 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- 238000004891 communication Methods 0.000 description 2
- 238000005336 cracking Methods 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 238000013021 overheating Methods 0.000 description 2
- 238000007650 screen-printing Methods 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000005219 brazing Methods 0.000 description 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0207—Cooling of mounted components using internal conductor planes parallel to the surface for thermal conduction, e.g. power planes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
Abstract
The invention discloses a plane heat-conducting and soaking copper-clad plate and a packaging substrate for packaging a plurality of heat-conducting copper-clad plates, wherein the plane heat-conducting copper-clad plate comprises an insulating layer (b 1) and a copper-clad layer (t 1), the copper-clad layer (t 1) is staggered along the plane to cover the insulating layer (b 1), the exposed width (D1) of the insulating layer (b 1) is greater than the protruding width (D2) of the copper-clad layer (t 1), the exposed position of the insulating layer (b 1) thermally connected with the plane heat-conducting copper-clad plate is partially covered by the protruding position of the copper-clad layer (t 1) of the plane heat-conducting copper-clad plate, and the whole packaging substrate is quickly soaked in heat by the quick plane heat soaking effect of the copper foil with the heat conductivity greater than 300 w/m.k, so that the risk of thermal stress failure is reduced. In addition, the width (D1) of the exposed position of the insulating layer (b 1) is larger than the width (D2) of the protruding position of the copper-clad layer (t 1), so that the two copper-clad layers are directly electrically connected, and the risk of electrical conduction failure is avoided.
Description
Technical Field
The invention relates to the technical field of copper-clad plates, in particular to a planar heat-conducting and soaking copper-clad plate and a packaging substrate for packaging a plurality of heat-conducting copper-clad plates.
Background
The printed circuit board is also called copper clad laminate, and is a carrier for electrically connecting and physically fixing electronic components. The development of the printed circuit board has already been over 100 years, and the adoption of the printed circuit board has the main advantages of greatly reducing errors of wiring and assembly, improving the automation level and labor efficiency and making contribution to the improvement of science and technology and the popularization of electronic products.
Along with the rise of packaging of power electronic devices such as IGBT (insulated gate bipolar transistor), the packaging of the power electronic devices is realized by packaging a plurality of copper-clad plates on one heat dissipation substrate, so that the packaging integration level is improved. Because the chip of different copper-clad plates is different at the load of same time in the in-service use process, and the heat that leads to the chip to produce is different, and the copper-clad plate is limited along the heat conductivity of vertical direction, thereby cause the local chip of whole heat dissipation base plate and copper-clad plate overheat temperature to rise, make local overheat region and other regions be in the thermal stress fatigue, in addition because the chip, copper-clad plate and heat dissipation base plate are mostly inorganic looks's brittle material, this kind of thermal stress fatigue cycle is many easily makes between chip and the copper-clad plate many times, fracture between local copper-clad plate and the heat dissipation base plate, make whole electron device inefficacy.
Therefore, there is a need for a heat-soaking technique that can soak the entire heat-dissipating substrate even when the chips are actually under different loads during operation.
Disclosure of Invention
In view of the above, the present invention provides a planar thermal copper-clad plate, which includes an insulating layer (b 1) and a copper-clad layer (t 1), wherein the copper-clad layer (t 1) is dislocated along a plane to cover the insulating layer (b 1), and a width (D1) of an exposed position of the insulating layer (b 1) is greater than a width (D2) of a protruding position of the copper-clad layer (t 1).
Preferably, 1mm < the width (D2) of the projected position of the copper-clad layer (t 1) < the width (D1) of the exposed position of the insulating layer (b 1) <35 mm.
Preferably, 3mm < the width (D2) of the projected position of the copper-clad layer (t 1) < the width (D1) of the exposed position of the insulating layer (b 1) <20 mm.
Preferably, the copper-clad layer (t 1) is composed of a circuit layer (t 01) and a ring-shaped copper foil layer (t 02) surrounding the circuit layer (t 01), and an insulating gap (G2) is formed between the circuit layer (t 01) and the ring-shaped copper foil layer (t 02).
Preferably, the insulating gap (G2) is filled with insulating heat conducting glue (j 1) so that the annular copper foil layer (t 02) is in thermal communication with the surrounding circuit layer (t 01).
Preferably, the width of the insulation gap (G2) is 0.5mm to 25 mm.
Preferably, the width of the insulation gap (G2) is 0.5mm to 15 mm.
Preferably, the other side of the insulating layer (b 1) further comprises a copper-clad layer (t 2), wherein the center point of the insulating layer (b 1) is coincident with the center point of the copper-clad layer (t 2).
Preferably, the intermediate insulating layer (b 1) is a glass cloth epoxy resin insulating layer or a ceramic substrate insulating layer.
Preferably, the insulating heat-conducting glue (j 1) is beta silicon nitride powder filled heat-conducting glue or spherical aluminum oxide filled heat-conducting glue.
The invention provides a packaging substrate for packaging a plurality of heat-conducting copper-clad plates, which comprises a heat dissipation substrate (c 1) and at least 2 planar heat-conducting copper-clad plates connected to the heat dissipation substrate (c 1), wherein the protruding position of a copper-clad layer (t 1) of one planar heat-conducting copper-clad plate partially covers the exposed position of an insulating layer (b 1') of one planar heat-conducting copper-clad plate.
The invention has the beneficial effects that: the invention discloses a plane heat-conducting and uniform-heating copper-clad plate and a packaging substrate for packaging a plurality of heat-conducting copper-clad plates, wherein the plane heat-conducting copper-clad plate comprises an insulating layer (b 1) and a copper-clad layer (t 1), the copper-clad layer (t 1) covers the insulating layer (b 1) along the plane in a staggered manner, the exposed width (D1) of the insulating layer (b 1) is greater than the protruding width (D2) of the copper-clad layer (t 1), the exposed position of an insulating layer (b 1) thermally connected with a plane heat conduction copper clad laminate is partially covered by the protruding position of a copper clad laminate (t 1) of the plane heat conduction copper clad laminate, the copper foil with the thermal conductivity more than 300 w/m.k is used for rapidly conducting the heat of the overheated copper clad laminate to another copper clad laminate, through plane propagation between the copper-clad plate and the copper-clad plate, the effect of soaking the whole packaging substrate, the copper-clad plate and the chip is quickly achieved, and therefore cracking failure caused by local overheating thermal stress is avoided. In addition, because the width (D1) of the exposed position of the insulating layer (b 1) is greater than the width (D2) of the protruding position of the copper-clad layer (t 1), the two copper-clad layers are directly electrically connected, and the failure caused by electrical conduction is avoided.
Drawings
Other features, objects and advantages of the present application will become more apparent upon reading of the following detailed description of non-limiting embodiments thereof, made with reference to the accompanying drawings in which:
fig. 1 is a schematic top view of a planar heat-conducting copper-clad plate according to an embodiment.
Fig. 2 is a schematic diagram of a packaging substrate for packaging a plurality of planar thermal-conductive copper-clad plates according to an embodiment.
Detailed Description
The present application will be described in further detail with reference to the following drawings and detailed description. It is to be understood that the specific embodiments described herein are merely illustrative of the invention and are not limiting of the invention. It should be noted that, for convenience of description, only the portions related to the present invention are shown in the drawings.
Referring to fig. 1 and fig. 2, fig. 1 is a schematic top view of a planar thermal copper clad laminate according to an embodiment, and fig. 2 is a schematic view of a package substrate for packaging a plurality of planar thermal copper clad laminates according to an embodiment.
Fig. 1 is a schematic top view of a planar heat-conducting copper-clad plate according to an embodiment, and as shown in the figure, the heat-conducting copper-clad plate includes an insulating layer (b 1), an upper copper-clad layer (t 1), and a lower copper-clad layer (t 2), wherein the copper-clad layer (t 1) is staggered along a plane to cover the insulating layer (b 1), and an exposed width (D1) of the insulating layer (b 1) is greater than a protruding width (D2) of the copper-clad layer (t 1). In the present embodiment, 1mm < the width (D2) of the protruding position of the copper-clad layer (t 1) < the exposed width (D1) <35mm of the insulating layer (b 1), and particularly preferably 3mm < the protruding width (D2) of the copper-clad layer (t 1) < the exposed width (D1) <20mm of the insulating layer (b 1). The width (D2) of the protruding position of the copper-clad layer (t 1) and the width (D1) of the exposed position of the insulating layer (b 1) are limited in size, the requirement that two copper-clad plates cannot be electrically connected can be met, and the D1 and D2 value range are researched and determined, so that the phenomenon that the gap between the two copper-clad layers (t 1) is too large is avoided, the thermal resistance is increased, the plane soaking effect is poor, the gap between the two preferable copper-clad layers (t 1) can also be reduced by filling insulating heat-conducting glue, and the heat conduction performance is improved.
In this embodiment, the copper-clad layer (t 1) on the upper layer of the insulating layer (b 1) is configured to be composed of the circuit layer (t 01) and the annular copper foil layer (t 02) surrounding the circuit layer (t 01), and an insulating gap (G2) is formed between the circuit layer (t 01) and the annular copper foil layer (t 02), so that the circuit layer (t 01) is focused on the circuit design and packaging of the chip, and the annular copper foil layer (t 02) is focused on the transmission of the heat generated by the chip to another copper-clad plate, thereby achieving the purpose of soaking. In addition, the insulating gap (G2) is filled with insulating heat-conducting glue (j 1), so that the annular copper foil layer (t 02) is in thermal communication with the surrounding circuit layer (t 01), the thermal resistance is reduced, and the heat-conducting performance is improved, and preferably, the width of the insulating gap (G2) is 0.5 mm-25 mm; more preferably, the width of the insulation gap (G2) is 0.5mm to 15 mm. Therefore, the matching of the insulating heat-conducting glue (j 1) and the gap G2 can meet the requirements of electrical insulation and more effective heat conduction.
In this embodiment, the other side of the insulating layer (b 1) further includes a copper-clad layer (t 2), wherein the center point of the insulating layer (b 1) coincides with the center point of the copper-clad layer (t 2), and the insulating layer is thermally connected to the heat dissipating substrate through the copper-clad layer (t 2), wherein the conventional thermal connection method is screen-printing solder paste or the like. The other copper-clad layer (t 2) can also be not overlapped with the center point of the insulating layer (b 1), the copper-clad layer (t 2) can be larger or smaller than the insulating layer (b 1), the design is carried out according to the actual circuit requirement, in the above embodiment, the preferable copper-clad layer (t 2) is also staggered along the plane to cover the insulating layer (b 1), and is the same with the direction and the staggered position of the copper-clad layer (t 1), so that the copper-clad layer (t 2) is also in thermal connection with the lower surface of the insulating layer of the other copper-clad plate, the plane thermal conduction of the upper surface and the lower surface is realized, and the plane heat soaking effect is further improved.
In this embodiment, the intermediate insulating layer (b 1) is a ceramic substrate insulating layer, preferably a ceramic substrate such as alumina, aluminum nitride, silicon nitride, etc., and preferably has a thickness of 0.3 to 2.5mm, and the intermediate insulating layer (b 1) may be a glass cloth epoxy resin insulating layer or other insulating circuit layer, as required.
In this embodiment, the insulating thermal conductive paste (j 1) is beta silicon nitride powder filled thermal conductive paste or spherical alumina filled thermal conductive paste. The preferable heat-conducting insulating adhesive has the filling rate of heat-conducting powder more than 50 percent and good heat-conducting property.
In this example, the insulating layer (b 1), the copper clad layer (t 1), and the copper clad layer (t 2) are thermally connected by a DBC or AMB process in the prior art, and preferably by an AMB process.
FIG. 2 is a schematic diagram of a package substrate for packaging a plurality of thermally conductive copper clad laminates, wherein the package substrate is a bulk substrate (c 1), an insulation layer (b 1) of a first copper clad laminate, an upper copper clad laminate (t 1) and a lower copper clad laminate (t 2) of the first copper clad laminate; a second copper-clad plate insulation layer (b 1 '), an upper copper-clad layer (t 1 ') and a lower copper-clad layer (t 2 ') of the second copper-clad plate. As shown in fig. 2, in this embodiment, there are at least two planar thermal copper clad laminates, and the protruding position of the copper clad laminate (t 1) of one planar thermal copper clad laminate partially covers the exposed position of the insulating layer (b 1') thermally connected to one planar thermal copper clad laminate. The copper foil with the thermal conductivity larger than 300 w/m.k quickly conducts heat of the overheated copper clad laminate to another copper clad laminate, and the effect of soaking the whole packaging substrate, the copper clad laminate and the chip is quickly achieved through plane heat transmission between the copper clad laminate and the copper clad laminate, so that cracking failure caused by local overheating thermal stress is avoided. In this example, the width (D1) of the exposed position of the insulating layer (b 1) is greater than the width (D2) of the protruding position of the copper-clad layer (t 1), so that the two copper-clad layers are directly electrically connected, thereby avoiding the failure caused by electrical conduction. In the present embodiment, the heat dissipating substrate (c 1) is an insulating ceramic plate, an aluminum plate, a copper plate, or a aluminized silicon carbide plate, and particularly preferably, the aluminized silicon carbide plate is used, the thickness is selected according to the requirement, preferably, the thickness is 5 to 10mm, and the back of the aluminized silicon carbide plate may be provided with heat dissipating fins. In the embodiment, the heat dissipation substrate (c 1) and the copper-clad plate are thermally connected and fixed in a screen printing soldering paste or active metal mode and the like, so that the requirements of thermal property and mechanical property are met.
In order to verify the technical effect of the invention, the following embodiments are implemented, wherein the copper-clad plate preparation process is a titanium metal active brazing technology commonly used in the field, and the etching uses a commonly used mask etching process without special requirements.
Example 1: the surfaces of two 50 multiplied by 50mm aluminum oxide copper clad plates with copper coated on both sides (the center positions of the front copper foil and the back copper foil of the copper clad plate are superposed with the center position of aluminum oxide) are polished by 1000-mesh sand paper, washed by clean water and dried in vacuum, and then one side is printed with 20um lead-free soldering paste and packaged in an aluminized silicon carbide plate of 0.635cm at the interval of 10 mm. Heating one copper-clad plate at room temperature of 25 ℃ by using a small flame gun to 105 ℃, stopping heating, and testing the central position of another copper-clad plate at an interval of 15s, wherein the temperature is 37.5 ℃.
Example 2: two 50mm aluminum oxide copper clad plates (the copper foils are the same as the aluminum oxide, but the upper copper foils are connected with the aluminum oxide in a staggered mode, D1 is 18mm, and D2 is 15 mm) with two sides coated with copper are polished by 1000-mesh sand paper, washed by clean water, dried in vacuum, printed with 20um lead-free solder paste on one side at an interval of 10mm, and encapsulated in a 0.635cm aluminized silicon carbide plate. Heating one copper-clad plate at room temperature of 25 ℃ by using a small flame gun to 105 ℃, stopping heating, and testing the central position of another copper-clad plate at an interval of 15s, wherein the temperature is 72.1 ℃.
Example 3: two 50mm aluminum oxide copper clad laminates (the copper foils are the same as the aluminum oxide, but the upper copper foils are connected with the aluminum oxide in a staggered mode, wherein D1 is 18mm, D2 is 15mm, and a gap of 5mm is formed between an etched circuit layer (t 01) and an annular copper foil layer (t 02)) with two sides coated with copper are polished by 1000-mesh sand paper, washed by clear water, dried in vacuum, printed with 20-micron lead-free solder paste at intervals of 10mm, and packaged in an aluminized silicon carbide board of 0.635 cm. Heating one copper-clad plate at room temperature of 25 ℃ by using a small flame gun to 105 ℃, stopping heating, and testing the central position of another copper-clad plate at an interval of 15s, wherein the temperature is 53.9 ℃.
The above description is only a preferred implementation of the present application and is illustrative of the principles of the technology employed. It will be appreciated by a person skilled in the art that the scope of the invention as referred to in the present application is not limited to the embodiments with a specific combination of the above-mentioned features, but also covers other embodiments with any combination of the above-mentioned features or their equivalents without departing from the inventive concept. For example, the above features may be replaced with (but not limited to) features having similar functions disclosed in the present application.
Claims (10)
1. Plane heat conduction copper-clad plate, its characterized in that: the copper-clad laminate comprises an insulating layer (b 1) and a copper-clad layer (t 1), wherein the copper-clad layer (t 1) is staggered along the plane to cover the insulating layer (b 1), and the width (D1) of the exposed position of the insulating layer (b 1) is larger than the width (D2) of the protruding position of the copper-clad layer (t 1).
2. The planar heat-conducting copper-clad plate according to claim 1, characterized in that: 1mm < width (D2) of the projected position of the copper-clad layer (t 1) < width (D1) of the exposed position of the insulating layer (b 1) <35 mm.
3. The planar heat-conducting copper-clad plate according to claim 2, wherein: 3mm < width (D2) of the projected position of the copper-clad layer (t 1) < width (D1) of the exposed position of the insulating layer (b 1) <20 mm.
4. The planar heat-conducting copper-clad plate according to claim 1, characterized in that: the copper-clad layer (t 1) is composed of a circuit layer (t 01) and a ring-shaped copper foil layer (t 02) surrounding the circuit layer (t 01), and an insulating gap (G2) is formed between the circuit layer (t 01) and the ring-shaped copper foil layer (t 02).
5. The planar heat-conducting copper-clad plate according to claim 4, wherein: the insulating gap (G2) is filled with insulating heat-conducting glue (j 1) so that the annular copper foil layer (t 02) is in thermal conduction with the circuit layer (t 01).
6. The planar heat-conducting copper-clad plate according to claim 5, wherein: the width of the insulation gap (G2) is 0.5 mm-25 mm.
7. The planar heat-conducting copper-clad plate according to claim 6, wherein: the width of the insulation gap (G2) is 0.5 mm-15 mm.
8. The planar heat-conducting copper-clad plate according to claim 1, characterized in that: the other side of the insulating layer (b 1) further comprises a copper-clad layer (t 2), wherein the center point of the insulating layer (b 1) is coincident with the center point of the copper-clad layer (t 2).
9. The planar heat-conducting copper-clad plate according to claim 1, characterized in that: the intermediate insulating layer (b 1) is a fiberglass cloth epoxy resin insulating layer or a ceramic substrate insulating layer.
10. The packaging substrate for packaging the plurality of plane heat-conducting copper-clad plates is characterized in that: the planar heat-conducting copper-clad plate comprises a heat dissipation substrate (c 1) and at least 2 planar heat-conducting copper-clad plates which are connected to the heat dissipation substrate (c 1) and belong to any claim 1-9, wherein the protruding position of a copper-clad layer (t 1) of one planar heat-conducting copper-clad plate partially covers the exposed position of an insulating layer (b 1') of one planar heat-conducting copper-clad plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111258081.1A CN113950187A (en) | 2021-10-27 | 2021-10-27 | Plane heat conduction copper-clad plate and packaging substrate for packaging multiple plane heat conduction copper-clad plates |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111258081.1A CN113950187A (en) | 2021-10-27 | 2021-10-27 | Plane heat conduction copper-clad plate and packaging substrate for packaging multiple plane heat conduction copper-clad plates |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN113950187A true CN113950187A (en) | 2022-01-18 |
Family
ID=79332802
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202111258081.1A Pending CN113950187A (en) | 2021-10-27 | 2021-10-27 | Plane heat conduction copper-clad plate and packaging substrate for packaging multiple plane heat conduction copper-clad plates |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN113950187A (en) |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0964108A (en) * | 1995-08-29 | 1997-03-07 | Hitachi Cable Ltd | Tape carrier for tab |
| JP2005183452A (en) * | 2003-12-16 | 2005-07-07 | Fujikura Ltd | Bonding structure and bonding method of terminals |
| CN1697592A (en) * | 2004-05-10 | 2005-11-16 | 三井金属矿业株式会社 | Printed wiring board, production process thereof and semiconductor device |
| CN102403464A (en) * | 2010-09-14 | 2012-04-04 | 三星移动显示器株式会社 | Encapsulation substrate for organic light emitting diode display and method of manufaturing the excapsulation substrate |
| KR20120084527A (en) * | 2011-01-20 | 2012-07-30 | 삼성엘이디 주식회사 | Mccl and method manufacturing the same |
| CN103129049A (en) * | 2011-11-24 | 2013-06-05 | 三星电子株式会社 | CCL and method of manufacturing the same |
| CN206727225U (en) * | 2014-11-04 | 2017-12-08 | 株式会社村田制作所 | Transmission line cable |
| CN210042392U (en) * | 2016-12-01 | 2020-02-07 | 株式会社村田制作所 | Multilayer substrate connector and transmission line device |
-
2021
- 2021-10-27 CN CN202111258081.1A patent/CN113950187A/en active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0964108A (en) * | 1995-08-29 | 1997-03-07 | Hitachi Cable Ltd | Tape carrier for tab |
| JP2005183452A (en) * | 2003-12-16 | 2005-07-07 | Fujikura Ltd | Bonding structure and bonding method of terminals |
| CN1697592A (en) * | 2004-05-10 | 2005-11-16 | 三井金属矿业株式会社 | Printed wiring board, production process thereof and semiconductor device |
| CN102403464A (en) * | 2010-09-14 | 2012-04-04 | 三星移动显示器株式会社 | Encapsulation substrate for organic light emitting diode display and method of manufaturing the excapsulation substrate |
| KR20120084527A (en) * | 2011-01-20 | 2012-07-30 | 삼성엘이디 주식회사 | Mccl and method manufacturing the same |
| CN103129049A (en) * | 2011-11-24 | 2013-06-05 | 三星电子株式会社 | CCL and method of manufacturing the same |
| CN206727225U (en) * | 2014-11-04 | 2017-12-08 | 株式会社村田制作所 | Transmission line cable |
| CN210042392U (en) * | 2016-12-01 | 2020-02-07 | 株式会社村田制作所 | Multilayer substrate connector and transmission line device |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP4159861B2 (en) | Method for manufacturing heat dissipation structure of printed circuit board | |
| US7872869B2 (en) | Electronic chip module | |
| WO2016174899A1 (en) | Semiconductor device | |
| JP6755386B2 (en) | Manufacturing method of power semiconductor module and power semiconductor module | |
| JPH09275170A (en) | Semiconductor device | |
| JPH04162756A (en) | Semiconductor module | |
| JP2003124400A (en) | Semiconductor power module and manufacturing method therefor | |
| JP2012009828A (en) | Multilayer circuit board | |
| KR20160108307A (en) | Electronic circuit device | |
| JP3164067U (en) | Circuit board | |
| US20210020557A1 (en) | Insulating circuit substrate and method for producing insulating circuit substrate | |
| CN113950187A (en) | Plane heat conduction copper-clad plate and packaging substrate for packaging multiple plane heat conduction copper-clad plates | |
| JP3972519B2 (en) | Power semiconductor module | |
| CN108650778B (en) | PCB heat dissipation method and device | |
| JP3588315B2 (en) | Semiconductor element module | |
| JP4876612B2 (en) | Insulated heat transfer structure and power module substrate | |
| JP6967063B2 (en) | Power device package structure | |
| JP2009032959A (en) | Circuit substrate, and package and electronic apparatus using the same | |
| JP4459031B2 (en) | Electronic component storage package and electronic device | |
| WO2013021983A1 (en) | Semiconductor device and method for manufacturing same | |
| CN220692000U (en) | Power chip packaging loading board | |
| CN209947825U (en) | Power device | |
| JP7087446B2 (en) | A method for manufacturing an insulated circuit board with a heat radiating plate and an insulated circuit board with a heat radiating plate. | |
| JP2003068954A (en) | Package for housing semiconductor element | |
| JP2004072003A (en) | Multilayer circuit board having metal base, and hybrid integrated circuit using the same |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |