CN113948972B - Optical device, semiconductor optical amplification module and use method thereof - Google Patents
Optical device, semiconductor optical amplification module and use method thereof Download PDFInfo
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- CN113948972B CN113948972B CN202111130851.4A CN202111130851A CN113948972B CN 113948972 B CN113948972 B CN 113948972B CN 202111130851 A CN202111130851 A CN 202111130851A CN 113948972 B CN113948972 B CN 113948972B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/50—Amplifier structures not provided for in groups H01S5/02 - H01S5/30
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/0225—Out-coupling of light
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04J—MULTIPLEX COMMUNICATION
- H04J14/00—Optical multiplex systems
- H04J14/02—Wavelength-division multiplex systems
- H04J14/0201—Add-and-drop multiplexing
- H04J14/0202—Arrangements therefor
Abstract
The invention relates to a semiconductor optical amplifying module, which comprises a tube shell and an SOA (service oriented architecture) encapsulated in the tube shell, wherein a first optical interface, a second optical interface and a third optical interface are arranged on the tube shell, a plurality of optical elements are arranged in the tube shell, each optical element is matched with the SOA to form an amplifying optical path, the amplifying optical path is used for amplifying the wavelength of first signal light input by the first optical interface and then guiding the first signal light to the second optical interface or the third optical interface for output, and the amplifying optical path is used for guiding the second signal light input by the third optical interface to the second optical interface for output after amplifying the wavelength. The application method of the semiconductor optical amplifying module and an optical device adopting the semiconductor optical amplifying module are also related. The invention can realize the longer-distance transmission of two paths of signal light and is beneficial to the optical path design of communication systems such as WDM and the like; the SOA and other optical elements are integrated and packaged in the same tube shell, and the miniaturization and integration design of the semiconductor optical amplifying module can be realized while the optical wavelength amplification of two paths of signals is efficiently and reliably completed.
Description
Technical Field
The invention belongs to the technical field of optical communication, and particularly relates to a semiconductor optical amplification module, a use method thereof and an optical device adopting the semiconductor optical amplification module.
Background
With the continuous progress of the optical communication industry, the development speed of optical communication is severely restricted by the speed and cost of an optical device, and how to effectively increase the transmission rate and the transmission capacity of an optical fiber transmission network becomes an important subject of optical fiber communication. Limited to the development of optical chips, the development of optical communication is mainly realized by increasing the system capacity, and wavelength division multiplexing (Wavelength Division Multiplex, abbreviated as WDM) technology is the best choice for expanding the communication capacity.
A semiconductor optical amplifier (Semiconductor Optical Amp lifier, SOA) is an optoelectronic device that uses semiconductor material as a gain medium to amplify or provide gain to external photons. The semiconductor optical amplifier is a mode for realizing long-distance optical signal transmission, has the advantages of large working wavelength range, small volume, low power consumption, high reaction speed, large nonlinearity, mature manufacturing process and the like, plays an increasingly important role in WDM system networks, and is an important device for realizing all-optical signal processing and compensating optical loss in future all-optical networks. The existing semiconductor optical amplifier is mainly used for amplifying single-wavelength light or single-group-wavelength light, and is difficult to match with the technical development requirements of the optical communication industry.
Disclosure of Invention
The invention relates to a semiconductor optical amplifying module, a use method thereof and an optical device adopting the semiconductor optical amplifying module, which at least can solve part of defects in the prior art.
The invention relates to a semiconductor optical amplifying module, which comprises a tube shell and an SOA (service oriented architecture) packaged in the tube shell, wherein a first optical interface, a second optical interface and a third optical interface are arranged on the tube shell, a plurality of optical elements are arranged in the tube shell, each optical element is matched with the SOA to form an amplifying optical path, and the amplifying optical path is used for amplifying the wavelength of first signal light input by the first optical interface and then guiding the first signal light to the second optical interface or the third optical interface for output, and is used for amplifying the wavelength of second signal light input by the third optical interface and then guiding the second signal light to the second optical interface for output.
As one of the embodiments, each of the optical elements includes a first dichroic mirror disposed on an SOA light-entering side, a second dichroic mirror disposed on an SOA light-exiting side, and a bypass mirror group for guiding reflected light of the first dichroic mirror to the second dichroic mirror, both of the first and second dichroic mirrors allowing the first signal light to pass therethrough and totally reflecting the second signal light;
the first signal light sequentially passes through the first dichroic mirror, the SOA and the second dichroic mirror and then is output through the third optical interface;
the second signal light is output via the second optical interface after sequentially passing through the second dichroic mirror, the bypass mirror group, the first dichroic mirror, the SOA, and the second dichroic mirror.
As one embodiment, the bypass mirror group includes a first mirror and a second mirror, the first dichroic mirror, and the second dichroic mirror are parallel, and the second mirror is perpendicular to the first mirror.
As one embodiment, a first isolator is provided between the second dichroic mirror and the bypass mirror group.
As one embodiment, a second isolator is disposed between the first optical interface and the first dichroic mirror.
As one embodiment, a shaping lens is provided between the first dichroic mirror and the SOA and between the SOA and the second dichroic mirror, respectively.
As one of the implementation modes, a ceramic substrate is arranged in the tube shell, and the SOA and the optical elements are uniformly distributed on the ceramic substrate.
As one embodiment, an electrical connection pin is provided on the envelope, and the SOA is electrically connected to the electrical connection pin.
The invention also relates to a use method of the semiconductor optical amplifying module, which comprises the following steps:
the first signal light is input by the first optical interface, amplified by wavelength in the amplifying light path and then output by the second optical interface or the third optical interface; the second signal light is input by the third optical interface, amplified by wavelength in the amplifying light path and then output by the second optical interface;
the first signal light is single-wavelength light or multi-wavelength light, and the second signal light is single-wavelength light or multi-wavelength light.
The present invention also relates to an optical device including a light emitting component for emitting first signal light and a light receiving component for receiving second signal light incident thereon, further comprising:
the semiconductor optical amplification module as described above;
a first transmission optical fiber adapted for transmission of a first signal light prior to wavelength amplification, the first transmission optical fiber being connected to the first optical interface;
a second transmission optical fiber adapted to transmit the first signal light after wavelength amplification together with the second signal light before wavelength amplification;
a third transmission optical fiber adapted for wavelength-amplified second signal light transmission;
the second transmission optical fiber is connected with the second optical interface, and the third transmission optical fiber is connected with the third optical interface; or the second transmission optical fiber is connected with the third optical interface, and the third transmission optical fiber is connected with the second optical interface.
The invention has at least the following beneficial effects:
according to the semiconductor optical amplification module provided by the invention, the three optical interfaces are arranged on the tube shell, and the amplifying optical paths containing the SOA are packaged in the tube shell, so that the first signal light input by the first optical interface and the second signal light input by the third optical interface are amplified by the same SOA and then are respectively output, the transmission of two paths of signal light in a longer distance can be realized, and the optical path design of communication systems such as WDM and the like is facilitated. Based on the characteristics of small volume and the like of the SOA, the SOA and other optical elements are integrated and packaged in the same tube shell, and the miniaturization and integration design of the semiconductor optical amplification module can be realized while the optical wavelength amplification of two paths of signals is efficiently and reliably completed, so that the application range and the use convenience of the semiconductor optical amplification module can be remarkably improved.
Drawings
In order to more clearly illustrate the embodiments of the invention or the technical solutions in the prior art, the drawings that are required in the embodiments or the description of the prior art will be briefly described, it being obvious that the drawings in the following description are only some embodiments of the invention, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
Fig. 1 is a schematic structural diagram of a semiconductor optical amplifying module according to an embodiment of the present invention;
fig. 2 is a schematic diagram of an optical path of a semiconductor optical amplifying module according to an embodiment of the present invention.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and completely, and it is apparent that the described embodiments are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
Example 1
Referring to fig. 1, an embodiment of the present invention provides a semiconductor optical amplifying module, including a package 100 and an SOA400 encapsulated in the package 100, where a first optical interface 901, a second optical interface 902 and a third optical interface 903 are disposed on the package 100, a plurality of optical elements are disposed in the package 100, and each optical element is configured to cooperate with the SOA400 to form an amplifying optical path, where the amplifying optical path is used for amplifying a wavelength of a first signal light input by the first optical interface 901, and then guiding the amplified first signal light to the second optical interface 902 or the third optical interface 903 for outputting, and for amplifying a wavelength of a second signal light input by the third optical interface 903 and then guiding the amplified second signal light to the second optical interface 902 for outputting.
The envelope 100 is preferably an airtight envelope 100, ensuring the operational stability and reliability of the semiconductor optical amplification module. Correspondingly, the first optical port 121, the second optical port 122 and the third optical port 123 are formed on the package 100, and the three optical ports are sealed by the first optical window 131, the second optical window 132 and the third optical window 133, respectively, and the first optical port 901, the second optical port 902 and the third optical port 903 are disposed at the first optical port 121, the second optical port 122 and the third optical port 123, respectively. In one embodiment, the first optical interface 901, the second optical interface 902, and the third optical interface 903 are in the form of adapters, which may be conventional adapter structures, including, for example, the collection lens 910, the adjustment sleeve 920, and the adapter 930, and the specific structures are not described herein.
In one embodiment, as shown in fig. 1, a ceramic substrate 300 is disposed in the package 100, and the SOA400 and each optical element are uniformly disposed on the ceramic substrate 300, so as to facilitate the arrangement and packaging of each component; the ceramic substrate 300 is preferably an optical ceramic. Preferably, the SOA400 includes a semiconductor optical amplifier chip 410 and an amplifier substrate 420, the amplifier substrate 420 being fixed on the ceramic substrate 300, the semiconductor optical amplifier chip 410 being disposed on the amplifier substrate 420.
Further, as shown in fig. 1, the package 100 is provided with an electrical connection pin 110, and the SOA400 is electrically connected to the electrical connection pin 110, and an external power source can be connected through the electrical connection pin 110. In a preferred embodiment, as shown in fig. 1, a bonding area 310 is disposed on the ceramic substrate 300, and the electrical connection pins 110 may be electrically connected to the bonding area 310 by means of gold wire bonding.
Optionally, a refrigerator 200 and a thermistor 500 are further disposed in the tube 100, where the refrigerator 200 may employ a conventional refrigerator 200 such as a TEC, and the environmental temperature in the tube 100 is detected by the thermistor 500 and interlocked with the refrigerator 200 to control the temperature in the tube 100, so as to ensure the normal and stable operation of the SOA400. The refrigerator 200 and the thermistor 500 are also preferably electrically connected to the bonding pad 310 by wire bonding.
Preferably, as in fig. 1, the axis of the first optical interface 901 is parallel to the axis of the third optical interface 903, and the axis of the second optical interface 902 is perpendicular to the axis of the first optical interface 901; for example, for a square cartridge 100, a first optical interface 901 and a third optical interface 903 are disposed on opposite sidewalls of the cartridge 100, and a second optical interface 902 and the first optical interface 901 are respectively located on adjacent sidewalls of the cartridge 100. Further, as shown in fig. 1, the electrical connection pins 110 are disposed adjacent to the second optical interface 902, for example, on the same side wall of the package 100, so as to effectively reduce the space occupied by the semiconductor optical amplifying module, which is beneficial to the miniaturization design and application of the semiconductor optical amplifying module.
In the semiconductor optical amplification module provided in this embodiment, three optical interfaces are disposed on the package 100, and an amplification optical path including the SOA400 is encapsulated in the package 100, so that the first signal light input by the first optical interface 901 and the second signal light input by the third optical interface 903 are amplified by the same SOA400 and then output respectively, which can realize longer-distance transmission of the two signal lights, and is beneficial to optical path design of communication systems such as WDM. Based on the characteristics of small volume and the like of the SOA400, the SOA400 and other optical elements are integrated and packaged in the same tube shell 100, and the miniaturization and integration design of the semiconductor optical amplification module can be realized while the optical wavelength amplification of two paths of signals is efficiently and reliably completed, so that the application range and the use convenience of the semiconductor optical amplification module can be remarkably improved.
For the design of the optical path in the package 100, the optical path along which the first signal light passes and the optical path along which the second signal light passes share the same SOA400, that is, the first signal light and the second signal light are amplified by the SOA400, the optical element needs to guide the first signal light and the second signal light to the optical input port of the SOA400, and then output the two paths of amplified signal light output by the optical output port of the SOA400 from the corresponding optical interfaces, so that the optical element combination capable of realizing the function by matching with the SOA400 is suitable for the embodiment.
In one embodiment, as shown in fig. 1 and 2, each of the optical elements includes a first dichroic mirror 704 disposed on the light-in side of the SOA, a second dichroic mirror 701 disposed on the light-out side of the SOA, and a bypass mirror group for guiding the reflected light of the first dichroic mirror 704 to the second dichroic mirror 701, both the first dichroic mirror 704 and the second dichroic mirror 701 allowing the first signal light to pass therethrough and totally reflecting the second signal light; the first signal light sequentially passes through the first dichroic mirror 704, the SOA400, and the second dichroic mirror 701 and is then output through the third optical interface 903; the second signal light is output via the second optical interface 902 after passing through the second dichroic mirror 701, the bypass mirror group, the first dichroic mirror 704, the SOA400, and the second dichroic mirror 701 in this order. It will be appreciated that the first mirror of the first dichroic mirror 704 is oriented towards the SOA400, the second signal light is incident on the first mirror, and the reflected light beam is incident on the SOA400; the second mirror surface of the first dichroic mirror 704 faces the first optical interface 901, and the first signal light incident on the first optical interface 901 is incident on the second mirror surface, passes through the first dichroic mirror 704, and then is incident on the SOA400. It can be understood that the third mirror surface of the second dichroic mirror 701 faces the third optical interface 903, the fourth mirror surface of the second dichroic mirror 701 faces the SOA400 and the second optical interface 902, the second signal light incident on the third optical interface 903 is incident on the third mirror surface, the reflected light beam is guided by the bypass mirror group to be incident on the first mirror surface of the first dichroic mirror 704, the light beam output by the SOA400 is incident on the fourth mirror surface, wherein the first signal light amplified light beam is incident on the third optical interface 903 after passing through the second dichroic mirror 701, and the second signal light amplified light beam is reflected by the fourth mirror surface to be incident on the second optical interface 902. The mirror surface of the first dichroic mirror 704 is then angled with respect to the axis of the first optical interface 901, and the mirror surface of the second dichroic mirror 701 is angled with respect to the axes of the second optical interface 902 and the third optical interface 903, which is typically 45 °.
Further preferably, as shown in fig. 1 and 2, the bypass mirror group includes a first mirror 702 and a second mirror 703, the first mirror 702, the first dichroic mirror 704 and the second dichroic mirror 701 are parallel, and the second mirror 703 is perpendicular to the mirror surface of the first mirror 702. It is understood that the reflecting mirror surface of the first reflecting mirror 702 intersects the reflecting light optical axis of the second dichroic mirror 701, the reflecting mirror surface of the second reflecting mirror 703 intersects the reflecting light optical axis of the first reflecting mirror 702, and the reflecting light optical axis of the second reflecting mirror 703 intersects the first reflecting mirror surface of the first dichroic mirror 704. Obviously, the present embodiment is not limited to the above-mentioned lens group, but the beam guiding of the second signal light is realized by using only two mirrors, so that the number of optical elements is small, the optical transmission distance is short, and the volume of the semiconductor optical amplifying module can be further reduced, and the optical loss can be reduced. The wavelength amplification of two paths of signal light can be completed through the cooperation of the two-sided dichroic mirror, the two-sided reflecting mirror and the SOA400, the number of components is small, the miniaturization design of the semiconductor optical amplification module is facilitated, and the optical path is simple and the working reliability is high.
Further optimizing the above semiconductor optical amplifying module, as shown in fig. 1, the first isolator 801 is disposed between the second dichroic mirror 701 and the bypass mirror set, so as to improve the optical transmission efficiency and ensure the working reliability of the semiconductor optical amplifying module. Likewise, a second isolator 802 is provided between the first optical interface 901 and the first dichroic mirror 704.
Further optimizing the above semiconductor optical amplifying module, as shown in fig. 1, a first shaping lens 601 is disposed between the first dichroic mirror 704 and the SOA400, and a second shaping lens 602 is disposed between the SOA400 and the second dichroic mirror 701, so as to facilitate wavelength amplification of the SOA400 and transmission of the optical beam after optical amplification.
In another embodiment, the second dichroic mirror 701 is replaced by a third reflecting mirror that totally reflects the first signal light, and the other components are arranged identically, so that the first signal light and the second signal light are output by the second optical interface 902 after being amplified by the SOA400 in wavelength, and the transmission directions of the first signal light and the second signal light are identical. Therefore, when the semiconductor optical amplification module is configured with the second dichroic mirror 701 and the third mirror at the same time, the application range of the optical amplification module can be correspondingly expanded when the second dichroic mirror 701 is provided at the corresponding position or replaced with the third mirror as needed.
As shown in fig. 1 and fig. 2, the embodiment of the present invention correspondingly further provides a method for using the semiconductor optical amplifying module, including:
the first signal light is input by the first optical interface 901, amplified by wavelength in the amplifying optical path, and then output by the second optical interface 902 or the third optical interface 903; the second signal light is input by the third optical interface 903, and is output by the second optical interface 902 after being amplified by the wavelength in the amplifying optical path;
the first signal light is single-wavelength light or multi-wavelength light, and the second signal light is single-wavelength light or multi-wavelength light.
Therefore, the semiconductor optical amplification module is suitable for the following working conditions:
(1) The first signal light and the second signal light are both single-wavelength light;
(2) The first signal light is multi-wavelength light (for example, signal light including 4 wavelengths having wavelengths λ1 to λ4), and the second signal light is single-wavelength light;
(3) The first signal light is single-wavelength light, and the second signal light is multi-wavelength light;
(4) The first signal light and the second signal light are both multi-wavelength light.
Therefore, the semiconductor optical amplifying module has multifunction and wide application range.
Example two
An embodiment of the present invention provides an optical device including a light emitting element for emitting first signal light and a light receiving element for receiving second signal light incident thereon, further including:
the semiconductor optical amplifying module provided in the first embodiment;
a first transmission optical fiber adapted for transmission of a first signal light before wavelength amplification, said first transmission optical fiber being connected to said first optical interface 901;
a second transmission optical fiber adapted to transmit the first signal light after wavelength amplification together with the second signal light before wavelength amplification;
a third transmission optical fiber adapted for wavelength-amplified second signal light transmission;
the second transmission optical fiber is connected to the second optical interface 902, and the third transmission optical fiber is connected to the third optical interface 903; alternatively, the second transmission fiber is connected to the third optical interface 903, and the third transmission fiber is connected to the second optical interface 902.
In this embodiment, the semiconductor optical amplification module is integrated on an optical device, and can be applied to a WDM ultra-long distance transmission system, so that bidirectional gain of incoming light and outgoing light can be realized, i.e., double gain can be realized, and in ultra-long distance single-fiber bidirectional transmission, under the same cost, 1.5-2 times of transmission distance increase can be realized.
The foregoing description of the preferred embodiments of the invention is not intended to be limiting, but rather is intended to cover all modifications, equivalents, alternatives, and improvements that fall within the spirit and scope of the invention.
Claims (8)
1. The utility model provides a semiconductor light amplification module, includes the tube shell and encapsulates in the SOA of tube shell, its characterized in that: the optical fiber coupler comprises a shell, wherein a first optical interface, a second optical interface and a third optical interface are arranged on the shell, a plurality of optical elements are arranged in the shell, each optical element is matched with the SOA to form an amplifying optical path, and the amplifying optical path is used for amplifying the wavelength of first signal light input by the first optical interface and then guiding the first signal light to the second optical interface or the third optical interface for output, and is used for amplifying the wavelength of second signal light input by the third optical interface and then guiding the second signal light to the second optical interface for output;
each of the optical elements includes a first dichroic mirror disposed on an SOA light-entering side, a second dichroic mirror disposed on an SOA light-exiting side, and a bypass mirror group for guiding reflected light of the first dichroic mirror to the second dichroic mirror, both of the first and second dichroic mirrors allowing the first signal light to pass therethrough and totally reflecting the second signal light; the first signal light sequentially passes through the first dichroic mirror, the SOA and the second dichroic mirror and then is output through the third optical interface; the second signal light sequentially passes through the second dichroic mirror, the bypass mirror group, the first dichroic mirror, the SOA and the second dichroic mirror and then is output through the second optical interface;
the semiconductor optical amplification module is further provided with a third reflecting mirror which totally reflects the first signal light and the second signal light, and the second dichroic mirror is arranged at a corresponding position or replaced by the third reflecting mirror according to the requirement, so that the first signal light with amplified wavelength is selectively output from the third optical interface or the second optical interface.
2. The semiconductor optical amplification module of claim 1, wherein: the bypass mirror group comprises a first reflecting mirror and a second reflecting mirror, the first dichroic mirror and the second dichroic mirror are parallel, and the second reflecting mirror is perpendicular to the first reflecting mirror.
3. The semiconductor optical amplification module of claim 1, wherein: a first isolator is arranged between the second dichroic mirror and the bypass mirror group.
4. The semiconductor optical amplification module of claim 1, wherein: a second isolator is arranged between the first optical interface and the first bicolor mirror.
5. The semiconductor optical amplification module of claim 1, wherein: and a shaping lens is respectively arranged between the first dichroic mirror and the SOA and between the SOA and the second dichroic mirror.
6. The semiconductor optical amplification module of claim 1, wherein: and a ceramic substrate is arranged in the tube shell, and the SOA and the optical elements are uniformly distributed on the ceramic substrate.
7. The semiconductor optical amplification module of claim 1, wherein: and the shell is provided with an electric connection pin, and the SOA is electrically connected with the electric connection pin.
8. A method of using a semiconductor optical amplification module as claimed in any one of claims 1 to 7, comprising:
the first signal light is input by the first optical interface, and the first signal light is output by the third optical interface after sequentially passing through the first dichroic mirror, the SOA and the second dichroic mirror; the second signal light is input by the third optical interface, and the second signal light is output by the second optical interface after passing through the second dichroic mirror, the bypass mirror group, the first dichroic mirror, the SOA and the second dichroic mirror in sequence;
the second dichroic mirror is replaced by a third reflecting mirror according to the requirement, first signal light is input by the first optical interface, and the first signal light is output by the second optical interface after passing through the first dichroic mirror, the SOA and the third reflecting mirror in sequence; the second signal light is input by the third optical interface, and the second signal light is output by the second optical interface after passing through the third reflector, the bypass mirror group, the first dichroic mirror, the SOA and the third reflector in sequence;
the first signal light is single-wavelength light or multi-wavelength light, and the second signal light is single-wavelength light or multi-wavelength light.
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| JPH08248275A (en) * | 1995-03-08 | 1996-09-27 | Oki Electric Ind Co Ltd | Optical circuit module for optical amplifier |
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| JP2829569B2 (en) * | 1994-12-27 | 1998-11-25 | 日本電気エンジニアリング株式会社 | Optical amplifier |
| EP0723170A3 (en) * | 1995-01-19 | 1997-04-23 | Sumitomo Electric Industries | Optical composite module and method of assembling the same |
| IT1273465B (en) * | 1995-01-27 | 1997-07-08 | Pirelli Cavi Spa | BIDIRECTIONAL OPTICAL TELECOMMUNICATION SYSTEM INCLUDING A BIDIRECTIONAL OPTICAL AMPLIFIER |
| CN1271465C (en) * | 2001-08-15 | 2006-08-23 | 陈惠龙 | Single optical-fiber bidirectional photo amplifier |
| US7346280B1 (en) * | 2002-03-15 | 2008-03-18 | Cisco Technology, Inc. | Bi-directional long haul/ultra long haul optical communication link |
| JP2004015073A (en) * | 2002-06-03 | 2004-01-15 | Mitsubishi Electric Corp | Optical transmission system |
| JP4310971B2 (en) * | 2002-06-18 | 2009-08-12 | 日本電気株式会社 | Optical fiber amplifier |
| CN101145854B (en) * | 2007-03-15 | 2012-03-07 | 中兴通讯股份有限公司 | A device for optical amplification for single fiber bidirectional WDM system |
| EP3148018A1 (en) * | 2015-09-25 | 2017-03-29 | Alcatel Lucent | Amplification device with polarized soas, for amplifying optical signals in a wdm transmission system |
| CN109378688A (en) * | 2018-11-02 | 2019-02-22 | 中国科学院上海光学精密机械研究所 | Bidirectional optical amplifier for single fiber bi-directional transmitting |
| CN111628828A (en) * | 2020-05-25 | 2020-09-04 | 湖北协长通讯科技有限公司 | High-sensitivity light receiving device |
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Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08248275A (en) * | 1995-03-08 | 1996-09-27 | Oki Electric Ind Co Ltd | Optical circuit module for optical amplifier |
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