CN113939554A - 高弹性聚酰亚胺薄膜及包含其的柔性金属箔层压板 - Google Patents

高弹性聚酰亚胺薄膜及包含其的柔性金属箔层压板 Download PDF

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Publication number
CN113939554A
CN113939554A CN201980096777.3A CN201980096777A CN113939554A CN 113939554 A CN113939554 A CN 113939554A CN 201980096777 A CN201980096777 A CN 201980096777A CN 113939554 A CN113939554 A CN 113939554A
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CN
China
Prior art keywords
polyimide film
polyimide
diamine
formula
monomer
Prior art date
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Pending
Application number
CN201980096777.3A
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English (en)
Chinese (zh)
Inventor
白承烈
李吉男
崔祯烈
金纪勋
赵珉相
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Polyimide Advanced Materials Co Ltd
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Polyimide Advanced Materials Co Ltd
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Filing date
Publication date
Application filed by Polyimide Advanced Materials Co Ltd filed Critical Polyimide Advanced Materials Co Ltd
Publication of CN113939554A publication Critical patent/CN113939554A/zh
Pending legal-status Critical Current

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1067—Wholly aromatic polyimides, i.e. having both tetracarboxylic and diamino moieties aromatically bound
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0346—Organic insulating material consisting of one material containing N
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2379/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen, or carbon only, not provided for in groups C08J2361/00 - C08J2377/00
    • C08J2379/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08J2379/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
CN201980096777.3A 2019-05-24 2019-10-29 高弹性聚酰亚胺薄膜及包含其的柔性金属箔层压板 Pending CN113939554A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
KR1020190061396A KR20200135028A (ko) 2019-05-24 2019-05-24 고탄성 폴리이미드 필름 및 이를 포함하는 연성금속박적층판
KR10-2019-0061396 2019-05-24
PCT/KR2019/014337 WO2020241983A1 (ko) 2019-05-24 2019-10-29 고탄성 폴리이미드 필름 및 이를 포함하는 연성금속박적층판

Publications (1)

Publication Number Publication Date
CN113939554A true CN113939554A (zh) 2022-01-14

Family

ID=73554074

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201980096777.3A Pending CN113939554A (zh) 2019-05-24 2019-10-29 高弹性聚酰亚胺薄膜及包含其的柔性金属箔层压板

Country Status (3)

Country Link
KR (1) KR20200135028A (ko)
CN (1) CN113939554A (ko)
WO (1) WO2020241983A1 (ko)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115926159A (zh) * 2022-06-09 2023-04-07 常州工学院 一种电机用低介电损耗聚酰亚胺及其制备方法和应用

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20110010009A (ko) * 2009-07-23 2011-01-31 코오롱인더스트리 주식회사 폴리이미드 제조 방법, 이에 의해 제조된 폴리이미드 및 상기 폴리이미드로 제조된 필름
KR20150080221A (ko) * 2013-12-31 2015-07-09 에스케이이노베이션 주식회사 폴리아믹산 수지 조성물, 이로부터 제조된 폴리이미드 수지 및 폴리이미드 기판
JP2016188298A (ja) * 2015-03-30 2016-11-04 新日鉄住金化学株式会社 ポリイミド、樹脂フィルム、金属張積層体及び回路基板
CN106336511A (zh) * 2015-07-07 2017-01-18 律胜科技股份有限公司 聚酰亚胺树脂及其制造方法与薄膜
CN109789689A (zh) * 2016-09-29 2019-05-21 日铁化学材料株式会社 聚酰亚胺膜、铜张层叠板及电路基板

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101838333B1 (ko) * 2014-02-13 2018-03-13 주식회사 엘지화학 폴리이미드계 필름 및 이의 제조방법

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20110010009A (ko) * 2009-07-23 2011-01-31 코오롱인더스트리 주식회사 폴리이미드 제조 방법, 이에 의해 제조된 폴리이미드 및 상기 폴리이미드로 제조된 필름
KR20150080221A (ko) * 2013-12-31 2015-07-09 에스케이이노베이션 주식회사 폴리아믹산 수지 조성물, 이로부터 제조된 폴리이미드 수지 및 폴리이미드 기판
JP2016188298A (ja) * 2015-03-30 2016-11-04 新日鉄住金化学株式会社 ポリイミド、樹脂フィルム、金属張積層体及び回路基板
CN106336511A (zh) * 2015-07-07 2017-01-18 律胜科技股份有限公司 聚酰亚胺树脂及其制造方法与薄膜
CN109789689A (zh) * 2016-09-29 2019-05-21 日铁化学材料株式会社 聚酰亚胺膜、铜张层叠板及电路基板

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115926159A (zh) * 2022-06-09 2023-04-07 常州工学院 一种电机用低介电损耗聚酰亚胺及其制备方法和应用
CN115926159B (zh) * 2022-06-09 2024-01-23 常州工学院 一种电机用低介电损耗聚酰亚胺及其制备方法和应用

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Publication number Publication date
KR20200135028A (ko) 2020-12-02
WO2020241983A1 (ko) 2020-12-03

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