CN113936863B - Wire harness manufacturing device and wire harness manufacturing method - Google Patents
Wire harness manufacturing device and wire harness manufacturing method Download PDFInfo
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- CN113936863B CN113936863B CN202110785261.9A CN202110785261A CN113936863B CN 113936863 B CN113936863 B CN 113936863B CN 202110785261 A CN202110785261 A CN 202110785261A CN 113936863 B CN113936863 B CN 113936863B
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- wiring
- wiring substrate
- wire harness
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- substrate
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 197
- 239000000758 substrate Substances 0.000 claims abstract description 295
- 238000000926 separation method Methods 0.000 claims description 29
- 239000002184 metal Substances 0.000 claims description 20
- 229910052751 metal Inorganic materials 0.000 claims description 20
- 238000005096 rolling process Methods 0.000 claims description 2
- 230000002093 peripheral effect Effects 0.000 description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 238000000034 method Methods 0.000 description 2
- 230000037237 body shape Effects 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 230000013011 mating Effects 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
- H01B13/012—Apparatus or processes specially adapted for manufacturing conductors or cables for manufacturing wire harnesses
- H01B13/01209—Details
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
- H01B13/012—Apparatus or processes specially adapted for manufacturing conductors or cables for manufacturing wire harnesses
- H01B13/01236—Apparatus or processes specially adapted for manufacturing conductors or cables for manufacturing wire harnesses the wires being disposed by machine
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B60—VEHICLES IN GENERAL
- B60R—VEHICLES, VEHICLE FITTINGS, OR VEHICLE PARTS, NOT OTHERWISE PROVIDED FOR
- B60R16/00—Electric or fluid circuits specially adapted for vehicles and not otherwise provided for; Arrangement of elements of electric or fluid circuits specially adapted for vehicles and not otherwise provided for
- B60R16/02—Electric or fluid circuits specially adapted for vehicles and not otherwise provided for; Arrangement of elements of electric or fluid circuits specially adapted for vehicles and not otherwise provided for electric constitutive elements
- B60R16/0207—Wire harnesses
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Insulated Conductors (AREA)
- Supply And Installment Of Electrical Components (AREA)
Abstract
In order to manufacture a wire harness on a general-purpose production line regardless of a difference in vehicle type, there is provided a wire harness manufacturing apparatus (1) including: a first wiring board (11) on which a first part of a wire harness having a first part and a second part is routed; a second wiring substrate (12) formed to have a shape that can be detachably combined with the first wiring substrate (11) to which the first portion (W11) has been wired, and after the combination, the second portion is wired to complete a wire harness; and a guide support (13) that supports the second wiring board (12) at a combination position (P13) of the second wiring board (12) and the first wiring board (11), and guides and supports the first wiring board (11) to the combination position (P13).
Description
Technical Field
The present invention relates to a wire harness manufacturing apparatus and a wire harness manufacturing method for manufacturing a wire harness.
Background
Conventionally, there is known a technique using a wiring substrate on which a wire harness is wired to manufacture the wire harness by wiring the wire harness on the wiring substrate (see, for example, patent document 1). In such a technique using a wiring substrate, an operator appropriately arranged around the wiring substrate performs a wiring operation on the wiring substrate to manufacture a wire harness.
List of references
Patent literature
Patent document 1: japanese patent application laid-open No.2012-119110
Disclosure of Invention
Note that, at a place where a wire harness mounted on a vehicle is manufactured, it is desirable to manufacture the wire harness using the same wiring substrate and production line as possible.
However, even for the wire harness related to the same type of component, if the vehicle type is different, the vehicle body shape will be different due to the design of the vehicle, and the wiring shape of the wire harness will be different. It may be difficult to perform production with the same wiring substrate and production line.
Accordingly, an object of the present invention is to address the above-described problems and to provide a wire harness manufacturing apparatus and a wire harness manufacturing method that are capable of manufacturing wire harnesses on a general-purpose production line regardless of vehicle types.
In order to solve the above-described problem, a wire harness manufacturing apparatus is characterized by comprising: a first wiring substrate on which at least a part of a first portion of a wire harness having the first portion and a second portion is wired; a second wiring substrate formed in a shape that can be detachably combined with the first wiring substrate to which the first portion has been wired, and at least a part of the second portion is wired after combination to complete a wire harness; and a guide support portion that supports the second wiring substrate at a combined position where the second wiring substrate is combined with the first wiring substrate, and guides and supports the first wiring substrate to the combined position.
Further, in order to solve the above-described problems, the wire harness manufacturing method is characterized by comprising the steps of: a first wiring step of wiring at least a part of a first portion of a wire harness having the first portion and a second portion on a first wiring substrate; a combining step of combining the first wiring substrate on which the first portion has been wired with a second wiring substrate having a shape that can be detachably combined with the first wiring substrate; and wiring at least a part of the second portion on the second wiring substrate that has been combined with the first wiring substrate to complete the wire harness.
According to the wire harness manufacturing apparatus and the wire harness manufacturing method described above, the respective wiring substrates for the first portion and the second portion of the wire harness are prepared. Therefore, by changing the combination of the first wiring substrate corresponding to the first portion and the second wiring substrate corresponding to the second portion according to the vehicle type, it is possible to absorb the difference in the wiring shape depending on the vehicle type so as to manufacture the wiring harness universally on the same production line as a whole. That is, according to the wire harness manufacturing apparatus and the wire harness manufacturing method described above, the wire harness can be manufactured on a common production line regardless of the difference in vehicle types.
Drawings
Fig. 1 shows a schematic view of a harness manufacturing site in which a harness manufacturing device of one embodiment is installed;
Fig. 2 is a schematic diagram showing an example of a wire harness manufactured by the wire harness manufacturing device of the manufacturing site shown in fig. 1;
fig. 3 is a detailed external perspective view of the wire harness manufacturing device schematically shown in fig. 1;
fig. 4 is an enlarged perspective view showing a peripheral portion of a starting point position and a position below the starting point of wiring of the wire harness manufacturing apparatus shown in fig. 3 and a first wiring substrate;
Fig. 5 is a side view of an enlarged portion of the wire harness manufacturing device shown in fig. 4 as seen from the direction of arrow V11 in fig. 4;
Fig. 6 is an enlarged perspective view of a portion of a first production line of the wire harness manufacturing apparatus shown in fig. 3 and a first wiring substrate that moves on the first production line while undergoing a wiring operation of the first portion of the wire harness;
Fig. 7 is an enlarged perspective view showing a peripheral portion of a combination position and a separation position of the first wiring substrate and the second wiring substrate and the first wiring substrate and the second wiring substrate after combination in the wire harness manufacturing apparatus shown in fig. 3;
fig. 8 is a side view of an enlarged portion of the wire harness manufacturing device shown in fig. 7 as viewed from the direction of arrow V12 in fig. 7;
Fig. 9 is an enlarged perspective view of a portion of a second production line of the wire harness manufacturing apparatus shown in fig. 3 and a combined wiring substrate that moves on the second production line while undergoing a wiring operation of the second portion of the wire harness on the second wiring substrate;
Fig. 10 is an enlarged perspective view showing peripheral portions of the end position and the position below the end of the wiring of the wire harness manufacturing apparatus shown in fig. 3 and one combined wiring substrate; and
Fig. 11 is a side view of an enlarged portion of the wire harness manufacturing device shown in fig. 10 as seen from the direction of arrow V13 in fig. 10.
List of reference marks
1. Wire harness manufacturing device
11. First wiring board
12. Second wiring board
13. Guide support
13A structural frame
14. Combined wiring substrate
21. Offline working area
131. First production line
131A power relay mechanism
131A-1 power relay board
131A-2 metal wheel
132. Second production line
133. First return line
133A first line portion
133A-1, 134b-1 end of line
133B starting point front lifting mechanism
134. Second return line
134A end point lowering mechanism
134B second line portion
134C combined front lifting mechanism
P11 origin position
P12 end position
P13 combination position
P14 separation position
P15 lower position from the start point
P16 endpoint lower position
R11 first travel path
R12 second travel path
R13 first return path
R14 second return path
CN1 first joint
CN2 second joint
W1 wire harness
W11 first part
W12 second part
EG1 engine
BD1 vehicle body
BD11 power supply
BD12 engine control device
D11 Direction of circulation
D12, D13 lifting direction
D14 Combination direction
D15 Direction of descent
Detailed Description
Hereinafter, embodiments of a wire harness manufacturing apparatus and a wire harness manufacturing method will be described.
Fig. 1 is a schematic view showing a wire harness manufacturing site in which the wire harness manufacturing device of one embodiment is installed, and fig. 2 is a schematic view showing an example of a wire harness manufactured by the wire harness manufacturing device of the manufacturing site shown in fig. 1.
The wire harness W1 shown as an example in fig. 2 is a wire harness routed in the engine compartment. The wire harness W1 has: a first portion W11 wired to a power source BD11 and an engine control device BD12 on the vehicle body BD1 side; and a second portion W12 wired to various auxiliary devices on the engine EG 1. Here, the second portion W12 on the engine EG1 and the first portion W11 on the vehicle body BD1 side may have a part of the wiring shape according to the shape of the vehicle body panel specified by the design of each vehicle model. Accordingly, the wiring shape of the wire harness W1 is determined by a combination of the first portion W11 and the second portion W12, which are appropriately set according to the vehicle type.
The wire harness manufacturing apparatus 1 of the manufacturing site shown in fig. 1 includes: a first wiring board 11, a first portion W11 of the wire harness W1 being routed in the first wiring board 11; and a second wiring substrate 12, the second portion W12 being wired in the second wiring substrate 12 to complete the wiring harness W1. The first wiring substrate 11 is formed in a rectangular plate shape, and includes a first bonding portion CN1 for bonding with the second wiring substrate 12. Further, the second wiring substrate 12 is formed in the shape of an L-shaped plate provided with a recess to which the first wiring substrate 11 can be fitted, so that the first wiring substrate 11 with the wired first portion W11 mounted thereto can be detachably combined therewith; in addition, a second engagement portion CN2 engaged with the first engagement portion CN1 is attached to the inner edge of the recess. In the present embodiment, as shown in fig. 2, the first portion W11 and the second portion W12 are not physically divided portions, but are conceptually divided portions in the middle of electric wires routed across the boundary between the first wiring board 11 and the second wiring board 12. In manufacturing the wire harness W1, first, the first portion W11 is wired to the first wiring board 11. At this stage, a part of the electric wires constituting the second portion W12 are put together in a wound state before wiring, and are wired on the first wiring substrate 11 or in the vicinity of the first wiring substrate 11. Thereafter, when the first wiring substrate 11 is combined with the second wiring substrate 12, the electric wires gathered as described above extend onto the second wiring substrate 12, and the second portion W12 is routed. In the present embodiment, a plurality of the first wiring boards 11 and a plurality of the second wiring boards 12 are provided, respectively.
The wire harness manufacturing apparatus 1 shown in fig. 1 is of a production line configuration in which: the plurality of first wiring boards 11 and the plurality of second wiring boards 12 are sequentially laid out while being circulated in a circulation direction D11 in the drawing between a start position P11 and an end position P12 of the wiring. Further, in the vicinity of the wire harness manufacturing apparatus 1, an off-wire work area 21 is provided, and in this off-wire work area 21, additional wiring operations are appropriately performed as needed.
Fig. 3 is a detailed external perspective view of the wire harness manufacturing device schematically shown in fig. 1. Although the number of first wiring boards 11 and second wiring boards 12 shown is significantly different between fig. 3 and fig. 1 described above, these figures show substantially the same wire harness manufacturing apparatus 1.
In addition to the first wiring substrate 11 and the second wiring substrate 12 described above, the wire harness manufacturing apparatus 1 of the present embodiment further includes a guide support portion 13, the guide support portion 13 guiding and supporting the respective wiring substrates in the circulation direction D11 of fig. 1. First, the guide support portion 13 supports the second wiring substrate 12 at the combination position P13 with the first wiring substrate 11, and guides and supports the first wiring substrate 11 to the combination position P13. Further, while the first portion W11 is wired on each of the plurality of first wiring boards 11, the guide support portion 13 sequentially moves the first wiring boards 11 to the combining position P13. Then, the guide support portion 13 is configured to sequentially combine the first wiring substrate 11 and the second wiring substrate 12 at the combining position P13, and cause the second portion W12 of the combined second wiring substrate 12 to be wired.
More specifically, the guide support 13 includes a first production line 131, a second production line 132, a first return line 133, and a second return line 134.
The first production line 131 movably supports the first wiring substrate 11 along the first travel path R11 from a start position P11 of wiring to a combination position P13 with the second wiring substrate 12. Then, the first production line 131 moves the first wiring board 11 to the combining position P13 along the first travel path R11 while the first portion W11 is wired on the first wiring board 11.
The second production line 132 movably supports the combined wiring substrate 14 in which the first wiring substrate 11 and the second wiring substrate 12 have been combined with each other from the combining position P13 to the end position P12 where the completed wire harness W1 is moved out along the second travel path R12. Then, the second production line 132 moves the combined wiring substrate 14 to the end position P12 while the second portion W12 is wired on the second wiring substrate 12 of the combined wiring substrate 14.
The first return line 133 moves the first wiring substrate 11 separated from the second wiring substrate 12 at a separation position P14 described later along a first return path R13 different from the first travel path R11, and returns it to the start position P11 of the wiring.
The first return line 133 includes a first line portion 133a and a pre-start lifting mechanism 133b. The first line portion 133a extends from the separation position P14 to the start point lower position P15 located below the start point position P11 below the first production line 131 in parallel with the first production line 131, and moves the first wiring substrate 11 to the start point lower position P15. The pre-start-point lifting mechanism 133b is a mechanism that lifts the first wiring substrate 11 from the start-point lower position P15 to the start-point position P11.
After the wire harness W1 is removed, the second return line 134 moves the combination wiring substrate 14 from the end position P12 to the separation position P14 near the combination position P13 along a second return path R14 different from the second travel path R12. Then, the second return line 134 separates the first wiring substrate 11 at the separation position P14 and returns only the second wiring substrate 12 to the combining position P13. The first wiring substrate 11 separated at the second return line 134 returns to the start position P11 through the first return line 133 as described above.
The second return line 134 includes a final descent mechanism 134a, a second line portion 134b, and a pre-combination lift mechanism 134c. The destination lowering mechanism 134a is a mechanism for lowering the built-up wiring board 14 from the destination position P12 to a destination lower position P16 located below the destination position P12. The second line portion 134b extends from the end point lower position P16 to the separation position P14 below the second line 132 in parallel with the second line 132, and moves the built-up wiring substrate 14 to the separation position P14. The pre-combination lifting mechanism 134c is the following mechanism: which separates the first wiring substrate 11 from the second wiring substrate 12 at the separation position P14, and lifts the separated second wiring substrate 12 from the separation position P14 to the combining position P13.
The wire harness manufacturing apparatus 1 of the present embodiment is constructed substantially as described above. Hereinafter, details of respective portions of the wire harness manufacturing device 1 will be described.
Fig. 4 is an enlarged perspective view showing a peripheral portion of the starting point position and the position below the starting point of the wire harness manufacturing apparatus shown in fig. 3 and one first wiring substrate. Further, fig. 5 is a side view of an enlarged portion of the wire harness manufacturing device shown in fig. 4 as seen from the direction of arrow V11 in fig. 4.
Fig. 4 and 5 show a pre-start lifting mechanism 133b, which pre-start lifting mechanism 133b lifts the first wiring substrate 11 that has been returned to the lower side of the first production line 131 through the first line portion 133a of the first return line 133 from the start-point lower position P15 to the start-point position P11. The first wire portion 133a is constituted by a plurality of rails mounted along the first return path R13 inside the structural frame 13a of the guide support portion 13. When the first wiring substrate 11 reaches the start-point lower position P15, the start-point front lifting mechanism 133b is lifted to the start point position P11 in the lifting direction D12 together with the line end 133a-1 supporting the first line portion 133a of the first wiring substrate 11 at this point. In the wire harness manufacturing apparatus 1 of the present embodiment, the hydraulic lifter is employed as the front lifting mechanism 133b. The end 133a-1 of the line raised together with the first wiring substrate 11 is connected to the end of the first line 131 on the side of the start position P11. By the connection line, the first wiring substrate 11 that has been lifted up to the start position P11 is smoothly transferred to the first line 131. When the first wiring substrate 11 is transferred to the first production line 131, the pre-start lifting mechanism 133b is reset, and the production line end 133a-1 that has been lifted together with the first wiring substrate 11 also returns to the first line portion 133a, and will wait for the next first wiring substrate 11 to arrive.
Fig. 6 is an enlarged perspective view showing a portion of a first production line of the wire harness manufacturing apparatus shown in fig. 3 and a first wiring substrate moving on the first production line while the first portion of the wire harness is routed.
In the wire harness manufacturing apparatus 1 of the present embodiment, the first production line 131 is constituted by a plurality of rails mounted along the first travel path R11 above the structural frame 13a of the guide support portion 13. The first portion W11 of the wire harness W1 is routed while the first wiring substrate 11 slides and moves along the first travel path R11 on the first production line 131. Note that fig. 6 shows the first wire portion 133a of the first return wire 133 and the empty first wiring substrate 11 sliding along the first wire portion 133 a.
As shown in fig. 3, in the first production line 131, the plurality of first wiring boards 11 automatically slide along the first travel path R11 while being aligned by a moving device (not shown) provided on the guide support 13. Then, the operator performs the wiring operation of the first portion W11 on each of the moving first wiring boards 11. The plurality of first wiring substrates 11 sequentially advance toward the combining position P13 while being subjected to the wiring operation in this way. When the wiring operation of the first portion W11 on the first wiring board 11 reaches the combination position P13, the portion of the electric wire forming the second portion W12 is completed in a state of being wired on the first wiring board 11 or in the vicinity of the first wiring board 11.
Here, in the present embodiment, regarding the wiring operation of the first portion W11, the first wiring substrate 11 is provided with a navigation function for guiding the wiring flow and the like on the first wiring substrate 11. The navigation function operates by being supplied with electric power from the outside. Then, the first production line 131 in the guide support portion 13 is provided with a guide path to the combining position P13, that is, a power relay mechanism 131a that relays power while movably supporting the first wiring substrate 11 along the first travel path R11. The power relay mechanism 131a includes a power relay board 131a-1 and a metal wheel 131a-2.
The power relay board 131a-1 is formed of a conductive metal plate, and extends at least along the first travel path R11 to relay power to the first wiring substrate 11. In the present embodiment, the power relay board 131a-1 is a copper plate formed in a bar shape, and is mounted on the upper surface of a rail constituting the first production line 131. The power relay board 131a-1 receives power from a power supply device (not shown).
The metal wheel 131a-2 is a conductive metal wheel provided on a lower surface of the first wiring substrate 11 facing the power relay board 131a-1 to make contact with the power relay board 131a-1 and roll. In the present embodiment, copper wheels are used as the metal wheels 131a-2. A plurality of metal wheels 131a-2 are provided to make contact with the power relay board 131 a-1. Then, the plurality of metal wheels 131a-2 support the first wiring substrate 11 to move on the power relay board 131a-1, and the power relayed through the power relay board 131a-1 is transferred to the first wiring substrate 11. In the first wiring board 11, the worker performs the wiring operation of the first portion W11 while referring to the navigation function that is operated by the electric power transmitted in this way.
Fig. 7 is an enlarged perspective view showing a peripheral portion of a combining position and a separating position of the first wiring substrate and the second wiring substrate and the first wiring substrate and the second wiring substrate after combination in the wire harness manufacturing apparatus shown in fig. 3. Further, fig. 8 is a side view of an enlarged portion of the wire harness manufacturing device shown in fig. 7 as viewed from the direction of arrow V12.
In fig. 7 and 8, the second wiring substrate 12 returned to the empty combined wiring substrate 14 below the second production line 132 is lifted to the combining position P13, and the first portion W11 is shown combined with the first wiring substrate 11 that has been wired to form a new combined wiring substrate 14. In the second return line 134, a second line portion 134b that returns the empty built-up wiring board 14 to the separation position P14 below the built-up position P13 is constituted by a plurality of rails mounted inside the structural frame 13a of the guide support portion 13 along the second return path R14.
When the empty combined wiring substrate 14 reaches the separation position P14, the pre-combination lift mechanism 134c first separates the first wiring substrate 11 from the second wiring substrate 12 in the combined wiring substrate 14. The separated first wiring substrate 11 is transferred to the first wire portion 133a of the first return wire 133 and moved to the start point lower position P15. Then, only the remaining second wiring substrate 12 is lifted to the combining position P13 by the pre-combining lifting mechanism 134 c. At this time, the pre-combination lifting mechanism 134c lifts the second wiring substrate 12 to the combination position P13 in the lifting direction D13 together with the line end 134b-1 supporting the second line portion 134b of the second wiring substrate 12. In the wire harness manufacturing apparatus 1 of the present embodiment, in the pre-combination lifting mechanism 134c, a hydraulic lifter is employed as a mechanism portion for lifting the second wiring substrate 12 and the production line end 134 b-1.
When the second wiring substrate 12 is lifted to the combining position P13 in this way, the first wiring substrates 11, on which the first portion W11 of the wire harness W1 has been routed in the first production line 131, are sequentially slid in the combining direction D14 and combined with the second wiring substrate 12. In this combination, the rectangular plate-like first wiring substrate 11 is fitted into the recess of the L-shaped plate-like second wiring substrate 12, and the first bonding portion CN1 is bonded with the second bonding portion CN 2. Then, the combined wiring board 14 formed by the combination of the two wiring boards is transferred to the second production line 132 along the second travel path R12. At this time, the end 134b-1 of the production line lifted by the pre-combination lifting mechanism 134c together with the second wiring substrate 12 is connected to the end on the combining position P13 side of the second production line 132. By the connection line, the composite wiring substrate 14 is smoothly transferred to the second line 132. When the combined wiring substrate 14 is transferred to the second production line 132, the pre-combination lifting mechanism 134c is reset, and the production line end 134b-1 that has been lifted together with the second wiring substrate 12 is also returned to the second line portion 134b, and will wait for the next empty combined wiring substrate 14 to arrive. On the other hand, the combined wiring substrate 14 that has been transferred to the second production line 132 then undergoes a wiring operation of the second portion W12 of the wire harness W1 on the second wiring substrate 12.
In the present embodiment, the plurality of empty combined wiring substrates 14 are sequentially returned to the separation position P14 along the second return path R14, the first wiring substrate 11 is separated, and the second wiring substrate 12 is lifted to the combining position P13. Further, the plurality of wired first wiring substrates 11 are sequentially sent out from the first production line 131. Then, at the combining position P13, the first wiring substrate 11 sent out from the first production line 131 is combined with one second wiring substrate 12 that has been lifted from the separating position P14, and the combined wiring substrate 14 is constituted. When one combined wiring substrate 14 is transferred to the second production line 132 and the space at the combining position P13 becomes empty, the next second wiring substrate 12 is lifted up to the combining position P13, and the next first wiring substrate 11 is combined to form the combined wiring substrate 14. At the combining position P13, such a series of operations is repeated.
Fig. 9 is an enlarged perspective view showing a portion of the second production line of the wire harness manufacturing apparatus shown in fig. 3 and a combined wiring board that moves on the second production line while a second portion of the wire harness is routed on the second wiring board.
In the wire harness manufacturing apparatus 1 of the present embodiment, the second production line 132 is constituted by a plurality of rails mounted along the second travel path R12 above the structural frame 13a of the guide support portion 13. The built-up wiring substrate 14 is automatically moved on the second production line 132 along the second travel path R12 by a moving device (not shown) provided on the guide support 13. Then, the worker performs a wiring operation of the second portion W12 of the wire harness W1 with respect to the second wiring board 12 in the moving combined wiring board 14. In the wiring operation at this time, as described above, the electric wires wired together on the first wiring substrate 11 or in the vicinity of the first wiring substrate 11 extend to the second wiring substrate 12 across the boundary of the wiring substrates, so that the second portion W12 is wired. In fig. 9, the portion of the second portion W12 that has been wired is shown by a solid line, and the portion that has not been wired is shown by a broken line. In fig. 9, the second wire portion 134b of the second return wire 134 is shown together with the empty built-up wiring board 14 moving along the second wire portion 134 b.
In the second production line 132, in a state in which a plurality of the built-up wiring boards 14 in which the second portions W12 are wired on the respective second wiring boards 12 are arranged in a row, the plurality of built-up wiring boards 14 sequentially travel toward the end position P14 while sliding along the second travel path R12.
Here, in the present embodiment, unlike the wiring operation of the first portion W11 described above, the wiring operation of the second portion W12 does not navigate the wiring flow. This is because, in the present embodiment, an operation requiring navigation such as an operation of inserting a terminal into a connector is completed by a wiring operation of the first portion W11. In the wiring operation of the second portion W12, an operation requiring no navigation, such as an external operation like the joining of the wire harness and the attachment of the bellows, is performed. Therefore, unlike the first wiring board 11, the second wiring board 12 is not provided with a navigation function in the second wiring board 12. That is, the second wiring board 12 does not require the power required for the first wiring board 11, and a mechanism corresponding to the power relay mechanism 131a provided on the first production line 131 side of the guide support portion 13 is not provided on the second production line 132 side.
Fig. 10 is an enlarged perspective view showing peripheral portions of the end position and the position below the end point of the wire harness manufacturing apparatus shown in fig. 3, and one combined wiring substrate. Further, fig. 11 is a side view of an enlarged portion of the wire harness manufacturing device shown in fig. 10 as seen from the direction of arrow V13 in fig. 10.
In fig. 10 and 11, when the combined wiring substrate 14 in which the wiring harness W1 is completed on the board corresponding to the wiring operation of the second portion W12 is moved to the end position P12, a state in which the wiring harness W1 is moved out is shown at the end position P12. In the harness manufacturing device 1, the combined wiring substrate 14 that has been emptied by removing the harness W1 is lowered from the end position P12 to the end position P16 by the end point lowering mechanism 134a in the second return line 134. When the built-up wiring substrate 14 reaches the below-endpoint position P16, the endpoint descent mechanism 134a descends in the descent direction D15 to the below-endpoint position P16 together with the production line end 132a of the second production line 132 supporting the built-up wiring substrate 14 at this point. In the present embodiment, a hydraulic lifter is employed as the end point lowering mechanism 134a. The production line end 132a which descends together with the combined wiring substrate 14 is connected to an end of the second return line 134 on the side of the position P16 below the end point of the second line portion 134b. By the connection line, the empty built-up wiring substrate 14 that has been lowered to the below-end position P16 is smoothly transferred to the second line portion 134b. When the combined wiring substrate 14 is transferred to the second line portion 134b, the end-point lowering mechanism 134a is reset, and the production line end 132a that has been lowered together with the combined wiring substrate 14 is also returned to the second production line 132, waiting for the next combined wiring substrate 14 to arrive. On the other hand, the empty built-up wiring substrate 14 that has moved to the second wire portion 134b advances toward the separation position P14 along the second return path R14.
In the present embodiment, the plurality of combined wiring boards 14 sequentially reach the end position P12 along the second travel path R12, the wire harness W1 is removed, and descends to the end position P16. Then, when the combined wiring substrate 14 is transferred to the second wire portion 134b and the space of the end point position P12 and the under-end point position P16 becomes empty, the next combined wiring substrate 14 is transferred to the end point position P12, and the wire harness W1 is moved out and lowered to the under-end point position P16. At the end position P12, such a series of operations is repeated.
Next, although the description so far may be repeated, a wire harness manufacturing method performed with the wire harness manufacturing apparatus 1 shown in fig. 1 to 11 will be described below.
The wire harness manufacturing method in the present embodiment includes a first wiring step, a combining step, a second wiring step, a second returning step, and a first returning step.
As shown in fig. 6, the first wiring step is a step of wiring a first portion W11 of the wire harness W1 on the first wiring substrate 11 while moving the first wiring substrate 11 on the first production line 131. When the first wiring board 11 reaches the combination position P13, the wiring operation of the first portion W11 is completed. At this time, a part of the electric wire constituting the second portion W12 will be placed on the first wiring substrate 11.
As shown in fig. 7 and 8, the combining step is a step of combining a first wiring substrate 11 on which a first portion W11 that has been wired is placed with a second wiring substrate 12 having a shape that can be combined with the first wiring substrate 11 in an attachable and grounding manner. In this combining step, the first wiring board 11 is separated from the second wiring board 12 in the empty combined wiring board 14, and after the separation, the second wiring board 12 is lifted up to the combining position P13, and the next combination of the first wiring board 11 and the second wiring board 12 is performed.
In the second wiring step, as shown in fig. 9, the second portion W12 is wired with respect to the second wiring substrate 12 while the combined wiring substrate 14 is moved on the second production line 132. In the wiring operation here, the wires wired together on the first wiring board 11 or in the vicinity of the first wiring board 11 extend across the boundary of the wiring boards to the second wiring board 12, and the second portion W12 is wired. When the combined wiring substrate 14 reaches the end position P12, the wiring operation of the second portion W12 is completed, and the wire harness W1 is completed in this second wiring step.
The second returning step is a step of returning the second wiring substrate 12 of the empty built-up wiring substrate 14, which is obtained by removing the completed wire harness W1 from the built-up wiring substrate 14, to the built-up position P13. In this second return step, first, the empty built-up wiring substrate 14 is lowered to the lower-endpoint position P16 and conveyed to the separation position P14 along the second return path R14. Then, the first wiring substrate 11 is separated at the separation position P14, and the remaining second wiring substrate 12 is lifted from the separation position P14 to the combining position P13. The second wiring substrate 12 lifted in this way is used for the next combining step.
The first returning step is a step of returning the empty first wiring substrate 11 separated at the separation position P14 to the start position P11 of the wiring. In this first return step, the empty first wiring board 11 is conveyed to the start point lower position P15 along the first return path R13. Then, as shown in fig. 4 and 5, the empty first wiring substrate 11 is lifted up to the start position P11 at the start-down position P15. The first wiring substrate 11 lifted in this way is used for the next first wiring step.
In the wire harness manufacturing method of the present embodiment, the first wiring step, the combining step, the second wiring step, the second returning step, and the first returning step are repeatedly performed using the plurality of first wiring substrates 11 and second wiring substrates 12 as targets of wiring.
According to the wire harness manufacturing apparatus 1 and the wire harness manufacturing method of the above-described embodiments, the following effects can be obtained. That is, in the present embodiment, wiring boards for the first portion W11 and the second portion W12 of the wire harness W1 are manufactured. Therefore, by changing the combination of the first wiring substrate 11 corresponding to the first portion W11 and the second wiring substrate 12 corresponding to the second portion W12 according to the vehicle type, it is possible to absorb the difference in the wiring shape depending on the vehicle type, and it is possible to manufacture the wire harness W1 in common on the same production line as a whole. That is, according to the wire harness manufacturing apparatus 1 and the wire harness manufacturing method of the present embodiment described above, the wire harness can be manufactured on a common production line regardless of the vehicle type.
Here, in the present embodiment, the plurality of first wiring substrates 11 and the plurality of second wiring substrates 12 are provided, respectively, and the wiring operation of the first portion W11, the combination of the wiring substrates, and the wiring operation of the second portion W12 are sequentially performed on the plurality of first wiring substrates 11 and the plurality of second wiring substrates 12. According to this configuration, the wiring operation of the first portion W11 in one wire harness W1 and the wiring operation of the second portion W12 in the other wire harness W can be performed simultaneously, so that a plurality of wire harnesses W1 can be efficiently manufactured.
Further, in the present embodiment, the guide support portion 13 includes a first production line 131 for combining the first wiring boards 11 in the wiring boards 14 and a second production line 132 for combining the second wiring boards 12 in the wiring boards 14. According to this configuration, the first production line 131 in which the wiring operation of the first portion W11 is performed and the second production line 132 in which the wiring operation of the second portion W12 is performed are combined at the combining position P13 to form one production line. By connecting the production lines in this way, it is possible to smoothly perform a series of operations related to the manufacture of the wire harness W1 by an assembly line along one production line, which is preferable.
Further, in the present embodiment, the guide support portion 13 includes a second return line 134 for returning the second wiring substrate 12 of the combined wiring substrate 14 to the combining position P13 and a first return line 133 for returning the first wiring substrate 11 to the start position P11 of the wiring. According to this configuration, the first wiring substrate 11 circulates between the start position P11 and the end position P12, and the second wiring substrate 12 circulates between the combination position P13 and the end position P12. By such circulation of the wire harness, the respective wiring substrates for the wiring operation of the first portion W11 and the second portion W12 are repeatedly provided, so that the wire harness W1 can be efficiently manufactured.
Further, in the present embodiment, the first return line 133 includes a first line portion 133a and a start point front lifting mechanism 133b, and the first line portion 133a extends below the first production line 131. Further, the second return line 134 includes a final descent mechanism 134a, a second line portion 134b, and a pre-combination lift mechanism 134c, the second line portion 134b extending below the second production line 132. According to this configuration, the first production line 131 and the first line portion 133a of the first return line 133 are arranged in the upper and lower two steps, and are connected via the start-point front lifting mechanism 133 b. Further, the second line portion 134b of the second production line 132 and the second return line 134 are arranged in the upper and lower two stages, and are connected via the end point lowering mechanism 134a and the pre-combination lifting mechanism 134 c. By arranging the respective production lines in two stages up and down in this way, the harness manufacturing device 1 can be mounted more compactly while reducing the mounting space.
Further, in the present embodiment, the guide support portion 13 includes a power relay mechanism 131a that relays power. According to this configuration, the navigation function for guiding the wiring flow on the first wiring substrate 11 can be operated by the electric power supplied from the electric power relay mechanism 131a.
Further, in the present embodiment, the power relay mechanism 131a includes the power relay board 131a-1 and the metal wheel 131a-2, the power relay board 131a-1 is formed of a conductive metal plate, the metal wheel 131a-2 supports the first wiring substrate 11 and transmits the power relayed through the power relay board 131a-1 to the first wiring substrate 11. According to this configuration, it is possible to achieve a good balance between smooth actions of the first wiring substrate 11 by rolling the metal wheel 131a-2 on the power relay board 131a-1, and relay power to the first wiring substrate 11 via the metal wheel 131a-2 and the power relay board 131 a-1.
It should be noted that the above-described embodiments show only typical embodiments of the wire harness manufacturing apparatus and the wire harness manufacturing method, and the wire harness manufacturing apparatus and the wire harness manufacturing method are not limited thereto, and can be modified and implemented via various modifications.
For example, in the above-described embodiment, as an example of the wire harness manufacturing apparatus, the wire harness manufacturing apparatus 1 in which the first wiring substrate 11 and the combined wiring substrate 14 are automatically slidingly moved by the moving means of the guide support portion 13 is exemplified. However, the wire harness manufacturing apparatus is not limited thereto, and the wire harness manufacturing apparatus may be as follows: wherein the wiring board is manually slid by an operator without providing a means for automatically moving the wiring board. Further, a production line in which the wiring board is moved by manually sliding and a production line in which the wiring board is automatically slid may be used in combination. For example, in the first production line, an operator may manually slide the first wiring substrate, and in the second production line, the combined wiring substrate may automatically slide.
Further, in the above-described embodiment, as an example of the wire harness manufacturing apparatus, the wire harness manufacturing apparatus 1 is exemplified in which the wiring of the first portion W11 on the first wiring substrate 11 is completed in a state in which a part of the electric wires of the second portion W12 are arranged together on or near the first wiring substrate. The wiring of the second portion W12 is performed by combining the first wiring substrate 11 and the second wiring substrate 12 and then extending the bundled electric wires to the second wiring substrate 12. However, the wire harness manufacturing apparatus is not limited thereto, for example, a part of the wiring operation of the first portion is performed on the first wiring substrate, and the remaining portion of the first portion and the second portion may be wired on the second wiring substrate after the wiring substrates are combined. Alternatively, in the wire harness manufacturing apparatus, the wiring operation of all of the first portion and a part of the second portion is performed on the first wiring substrate, and after the combination, the wiring operation of the remaining part of the second portion is performed on the second wiring substrate. Then, in these harness manufacturing apparatuses, at least a part of the electric wires to be wired on the second wiring substrate after the wiring on the first wiring substrate is completed may be wired on or near the first wiring substrate.
Further, in the above-described embodiment, as an example of the wire harness manufactured by the wire harness manufacturing apparatus, the wire harness W1 conceptually divided into two parts is exemplified. However, the wire harness manufactured by the wire harness manufacturing device is not limited thereto. For example, the wire harness may be physically divided into a first portion and a second portion, and combined by mating connectors provided at the ends of the respective portions. In this case, in the first wiring substrate, a wiring operation of the first portion provided with the connector for connection to the second portion is performed. After the wiring substrate combination, the connector of the second portion is fitted to the connector of the first portion, and the second portion is wired on the second wiring substrate to reach the connector. When manufacturing the wire harness divided via the connector, the position where the connector is connected may be on the boundary between the first wiring substrate and the second wiring substrate, or on one of the first wiring substrate and the second wiring substrate.
Further, in the above-described embodiment, as an example of the wire harness manufacturing apparatus, the wire harness manufacturing apparatus 1 in which only the first wiring substrate 11 and the second wiring substrate 12 are combined is exemplified. However, the wire harness manufacturing apparatus is not limited thereto. In the case of combining the first wiring substrate and the second wiring substrate, the harness manufacturing apparatus may combine three or more wiring substrates in total after adding other wiring substrates. In this case, the additional wiring substrates may be combined together at a combination position of the first wiring substrate and the second wiring substrate or at a combination position different from the combination position of the first wiring substrate and the second wiring substrate. Further, when a plurality of wiring boards including the first wiring board and the second wiring board are combined at a plurality of combining positions, it is also possible to increase the number of wiring boards in the shape of a billiard ball and combine them in order, such as combining one wiring board with another wiring board when the wiring operation of the other wiring board is completed.
In the above-described embodiment, as an example of the first wiring board and the second wiring board, the rectangular plate-shaped first wiring board 11 and the L-shaped second wiring board 12 are illustrated, and the L-shaped second wiring board 12 is provided with a recess into which the first wiring board 11 can be fitted and is larger than the first wiring board 11. However, the first wiring substrate and the second wiring substrate are not limited thereto. For example, the first wiring substrate may be formed as an L-shaped plate larger than the second wiring substrate, or the first wiring substrate and the second wiring substrate may have the same shape and the same size as each other as long as they can be detached from each other. As described above, the shape and size of the first wiring board and the second wiring board can be arbitrarily set.
Further, in the above-described embodiment, as an example of the guide support portion, the guide support portion 13 formed by combining a plurality of structural frames 13a is exemplified. However, the guide support portion is not limited thereto, and a specific structure is not required as long as the second wiring substrate is supported at the combined position of the second wiring substrate and the first wiring substrate is guided and supported to the combined position.
Further, in the above-described embodiment, as an example of the wire harness manufacturing apparatus, the wire harness manufacturing apparatus 1 in which the plurality of first wiring substrates 11 and the plurality of second wiring substrates 12 are provided is exemplified. However, the wire harness manufacturing apparatus is not limited thereto, and may be one in which one first wiring substrate and one second wiring substrate are provided.
Further, in the above-described embodiment, as an example of the guide support portion, the guide support portion 13 provided with the second return line 134 and the first return line 133 is exemplified. However, the guide support portion is not limited thereto, and may be configured such that the operator conveys the operated wiring substrate to the operation start position without providing the return line as described above.
Further, in the above-described embodiment, as an example of the guide support portion, the guide support portion 13 in which the production line and the return line are arranged in two stages up and down is exemplified. However, the arrangement of the production line and the return line in the guide support portion is not limited thereto, and for example, the production line and the return line may be arranged side by side, or the production line and the return line may be arranged in a loop shape or the like. That is, the production line and the return line in the guide support can be arranged via arbitrary paths.
Further, in the above-described embodiment, the guide support portion 13 provided with the power relay mechanism 131a is exemplified as an example of the guide support portion. However, the guide support is not limited thereto, and a power relay mechanism may not be provided.
Here, in the above-described embodiment, as an example of the wire harness manufacturing apparatus, the following wire harness manufacturing apparatus 1 is exemplified: of these, only the first wiring board 11 has a navigation function, and the power relay mechanism 131a relays power only to the first wiring board 11 as a target. However, the wire harness manufacturing apparatus is not limited thereto, and a navigation function is also provided for the wiring operation on the combined second wiring substrate, and the power relay mechanism may be provided in the second production line on the second wiring substrate and the guide support portion. That is, only one of the first wiring substrate and the second wiring substrate, or both of the first wiring substrate and the second wiring substrate may serve as a relay destination of electric power. Further, when both the first wiring substrate and the second wiring substrate are used as relay destinations, they may be indirect relay destinations via one wiring substrate. Further, the operation function provided in the first wiring board or the second wiring board is not limited to the navigation function, and may be an arbitrarily set function as long as it operates by receiving electric power.
Further, in the above-described embodiment, as an example of the power relay mechanism, the power relay mechanism 131a provided with the conductive power relay plate 131a-1 and the metal wheel 131a-2, respectively, is exemplified. However, the power relay mechanism is not limited thereto, and a specific mechanism mode thereof is not required. For example, the power relay mechanism is a mechanism provided with: a conductive metal rail provided on the guide support portion side and having a groove formed along a traveling path of the wiring substrate; and a conductive metal rib provided on the wiring substrate side and sliding and moving while rubbing on the inner surface of the groove. Further, the power relay mechanism may be a mechanism in which power is supplied in a noncontact manner. Even when the power relay board and the metal wheel are provided, the metal material is not limited to copper in the above-described embodiment, and any metal having conductivity can be employed.
Claims (7)
1. A wire harness manufacturing apparatus comprising:
a first wiring substrate on which at least a part of the first portion of a wire harness having a first portion and a second portion is routed;
a second wiring substrate formed in a shape capable of being detachably combined with the first wiring substrate on which the first portion has been wired, wherein at least a part of the second portion is wired on the second wiring substrate after combination to complete the wire harness; and
A guide support portion that supports the second wiring substrate at a combined position where the second wiring substrate is combined with the first wiring substrate, and guides and supports the first wiring substrate to the combined position,
Wherein,
Providing a plurality of the first wiring substrates and a plurality of the second wiring substrates,
The guide support portion sequentially guides the plurality of first wiring boards to the combining position while wiring of the first portion is performed on each of the plurality of first wiring boards, and at the combining position, the guide support portion combines the plurality of first wiring boards with the plurality of second wiring boards to wire the second portion in the combined second wiring boards.
2. The wire harness manufacturing device according to claim 1, wherein,
The guide support portion includes:
A first production line that movably supports the first wiring substrate from a predetermined start position to the combination position along a first travel path, and moves the first wiring substrate while performing wiring of the first portion on the first wiring substrate; and
And a second production line that movably supports the combined wiring board in which the first wiring board and the second wiring board have been combined with each other along a second traveling path from the combining position to an end position at which the completed wire harness is removed, and moves the combined wiring board to the end position while performing wiring of the second portion on the second wiring board of the combined wiring board.
3. The wire harness manufacturing device according to claim 2, wherein,
The guide support portion includes:
A second return line that moves the combined wiring substrate after the harness is removed from the end position to a separation position near the combination position along a second return path different from the second travel path, and separates the first wiring substrate at the separation position and returns only the second wiring substrate to the combination position; and
A first return line that moves the first wiring substrate separated from the second wiring substrate at the separation position along a first return path different from the first travel path, and returns the first wiring substrate to the start position.
4. The wire harness manufacturing device according to claim 3, wherein,
The separation position is located below the combination position, and
The first return line includes: a first wire portion extending from the separation position to a position below a start point located below the start point position below the first production line and parallel to the first production line, and moving the first wiring substrate to the position below the start point; and a pre-start-point lifting mechanism that lifts the first wiring substrate from a position below the start point to the start point position, and wherein,
The second return line includes: an end point lowering mechanism that lowers the build-up wiring board from the end point position to an end point lower position located below the end point position; a second line portion that extends below the second production line and parallel to the second production line from the position below the end point to the separation position, and that moves the combined wiring substrate to the separation position; and a pre-combination lifting mechanism that separates the first wiring substrate from the second wiring substrate at the separation position, and lifts the second wiring substrate from the separation position to the combination position after separation.
5. The wire harness manufacturing device according to any one of claims 1 to 4, wherein,
At least one of the first wiring substrate and the second wiring substrate includes an operation function that operates by supplying electric power, and the guide support portion includes an electric power relay mechanism for relaying the electric power.
6. The wire harness manufacturing device according to claim 5, wherein,
The power relay mechanism includes: a power relay board formed of a conductive metal plate and extending at least along a guide path to relay the power to at least one of the first wiring substrate and the second wiring substrate; and a conductive metal wheel provided in contact with and rolling on the power relay board, and supporting one of the first wiring substrate and the second wiring substrate so that the one of the first wiring substrate and the second wiring substrate moves on the power relay board, and transmitting the power relayed through the power relay board to the first wiring substrate.
7. A wire harness manufacturing method, comprising:
a first wiring step: routing at least a portion of a first portion of a wire harness having the first portion and a second portion on a first wiring substrate;
The combination step: combining the first wiring substrate on which the first portion has been wired with a second wiring substrate having a shape that can be detachably combined with the first wiring substrate; and
A second wiring step of: routing at least a portion of the second portion on the second wiring substrate that has been combined with the first wiring substrate to complete the wire harness,
Wherein,
Providing a plurality of the first wiring substrates and a plurality of the second wiring substrates,
The guide support portion sequentially guides the plurality of first wiring boards to a combining position while wiring of the first portion is performed on each of the plurality of first wiring boards, and at the combining position, the guide support portion combines the plurality of first wiring boards with the plurality of second wiring boards to wire the second portion in the combined second wiring boards.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2020-120109 | 2020-07-13 | ||
| JP2020120109A JP7187506B2 (en) | 2020-07-13 | 2020-07-13 | Wire harness manufacturing device and wire harness manufacturing method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN113936863A CN113936863A (en) | 2022-01-14 |
| CN113936863B true CN113936863B (en) | 2024-06-07 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110785261.9A Active CN113936863B (en) | 2020-07-13 | 2021-07-12 | Wire harness manufacturing device and wire harness manufacturing method |
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| Country | Link |
|---|---|
| JP (1) | JP7187506B2 (en) |
| CN (1) | CN113936863B (en) |
| PH (1) | PH12021050266A1 (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106024208A (en) * | 2016-06-20 | 2016-10-12 | 南京航空航天大学 | Three-dimensional modular wiring and detection integrating device for manufacturing wiring harness |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0754652B2 (en) * | 1990-01-08 | 1995-06-07 | 住友電装株式会社 | Wiring harness assembly drawing board shaping method and wiring jig used for the assembly drawing board |
| JPH0588103U (en) * | 1992-04-23 | 1993-11-26 | 株式会社東芝 | Work transfer device |
| JPH0765652A (en) * | 1993-08-27 | 1995-03-10 | Sumitomo Wiring Syst Ltd | Method for wire harness manufacture and wire harness manufacturing apparatus to realize such method |
| JP3068557B2 (en) * | 1998-04-30 | 2000-07-24 | 北川工業株式会社 | Grounding structure of printed wiring board and conductive member used for the grounding structure |
| JP3613075B2 (en) * | 1999-06-16 | 2005-01-26 | 住友電装株式会社 | Wire harness manufacturing apparatus and manufacturing method |
| JP2004186083A (en) * | 2002-12-05 | 2004-07-02 | Yazaki Corp | Manufacturing device and manufacturing method of wire harness |
| JP5523289B2 (en) * | 2010-11-30 | 2014-06-18 | 矢崎総業株式会社 | Wire harness manufacturing apparatus and method |
-
2020
- 2020-07-13 JP JP2020120109A patent/JP7187506B2/en active Active
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- 2021-06-14 PH PH12021050266A patent/PH12021050266A1/en unknown
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106024208A (en) * | 2016-06-20 | 2016-10-12 | 南京航空航天大学 | Three-dimensional modular wiring and detection integrating device for manufacturing wiring harness |
Also Published As
| Publication number | Publication date |
|---|---|
| PH12021050266A1 (en) | 2022-01-24 |
| JP7187506B2 (en) | 2022-12-12 |
| JP2022017049A (en) | 2022-01-25 |
| CN113936863A (en) | 2022-01-14 |
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