CN113936863A - Wire harness manufacturing device and wire harness manufacturing method - Google Patents
Wire harness manufacturing device and wire harness manufacturing method Download PDFInfo
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- CN113936863A CN113936863A CN202110785261.9A CN202110785261A CN113936863A CN 113936863 A CN113936863 A CN 113936863A CN 202110785261 A CN202110785261 A CN 202110785261A CN 113936863 A CN113936863 A CN 113936863A
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- wiring substrate
- wiring
- wire harness
- combined
- harness manufacturing
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 180
- 239000000758 substrate Substances 0.000 claims abstract description 301
- 238000000926 separation method Methods 0.000 claims description 32
- 239000002184 metal Substances 0.000 claims description 20
- 229910052751 metal Inorganic materials 0.000 claims description 20
- 230000002093 peripheral effect Effects 0.000 description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 230000033001 locomotion Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000037237 body shape Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
- H01B13/012—Apparatus or processes specially adapted for manufacturing conductors or cables for manufacturing wire harnesses
- H01B13/01209—Details
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
- H01B13/012—Apparatus or processes specially adapted for manufacturing conductors or cables for manufacturing wire harnesses
- H01B13/01236—Apparatus or processes specially adapted for manufacturing conductors or cables for manufacturing wire harnesses the wires being disposed by machine
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B60—VEHICLES IN GENERAL
- B60R—VEHICLES, VEHICLE FITTINGS, OR VEHICLE PARTS, NOT OTHERWISE PROVIDED FOR
- B60R16/00—Electric or fluid circuits specially adapted for vehicles and not otherwise provided for; Arrangement of elements of electric or fluid circuits specially adapted for vehicles and not otherwise provided for
- B60R16/02—Electric or fluid circuits specially adapted for vehicles and not otherwise provided for; Arrangement of elements of electric or fluid circuits specially adapted for vehicles and not otherwise provided for electric constitutive elements
- B60R16/0207—Wire harnesses
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Insulated Conductors (AREA)
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Abstract
In order to manufacture a wire harness on a general production line regardless of vehicle type differences, there is provided a wire harness manufacturing apparatus (1) including: a first wiring substrate (11) on which a first portion of a wire harness having a first portion and a second portion is wired; a second wiring substrate (12) formed to have a shape capable of being detachably combined with the first wiring substrate (11) on which the first portion (W11) has been wired, and after the combination, the second portion is wired to complete the wire harness; and a guide support portion (13) that supports the second wiring substrate (12) at a combination position (P13) of the second wiring substrate (12) and the first wiring substrate (11), and guides and supports the first wiring substrate (11) to the combination position (P13).
Description
Technical Field
The present invention relates to a wire harness manufacturing apparatus and a wire harness manufacturing method for manufacturing a wire harness.
Background
Conventionally, there is known a technique using a wiring substrate on which a wire harness is wired to manufacture the wire harness by wiring the wire harness on the wiring substrate (see, for example, patent document 1). In such a technique using a wiring board, it is appropriately arranged that a worker around the wiring board performs a wiring operation on the wiring board to manufacture a wire harness.
Reference list
Patent document
Patent document 1: japanese patent application laid-open No.2012-119110
Disclosure of Invention
Note that, at a manufacturing site of a wire harness mounted on a vehicle, it is desirable to manufacture the wire harness using the same wiring substrate and production line as much as possible.
However, even for the wire harnesses related to the same type of component, if the vehicle models are different, the vehicle body shape will be different due to the design of the vehicle, and the wiring shape of the wire harness will be different. It may be difficult to perform production with the same wiring substrate and production line.
Accordingly, an object of the present invention is to focus on the above-described problems, and to provide a wire harness manufacturing apparatus and a wire harness manufacturing method that can manufacture a wire harness on a general production line regardless of a vehicle type.
In order to solve the above problem, a wire harness manufacturing apparatus is characterized by comprising: a first wiring substrate on which at least a part of the first portion in a wire harness having the first portion and the second portion is wired; a second wiring substrate formed in a shape capable of being detachably combined with the first wiring substrate on which the first portion has been wired, and at least a part of the second portion is wired after the combination to complete a wire harness; and a guide support portion that supports the second wiring substrate at a combination position where the second wiring substrate is combined with the first wiring substrate, and guides and supports the first wiring substrate to the combination position.
Further, in order to solve the above-mentioned problems, the wire harness manufacturing method is characterized by comprising the steps of: a first wiring step of wiring at least a part of a first portion in a wire harness having the first portion and a second portion on a first wiring substrate; a combining step of combining the first wiring substrate on which the first portion has been wired with a second wiring substrate having a shape that can be detachably combined with the first wiring substrate; and routing at least a part of the second portion on the second wiring substrate that has been combined with the first wiring substrate to complete the wire harness.
According to the above-described wire harness manufacturing apparatus and wire harness manufacturing method, the respective wiring substrates for the first portion and the second portion of the wire harness are prepared. Therefore, by changing the combination of the first wiring substrate corresponding to the first portion and the second wiring substrate corresponding to the second portion according to the vehicle type, it is possible to absorb the difference in wiring shape depending on the vehicle type to universally manufacture the wire harness on the same production line as a whole. That is, according to the wire harness manufacturing apparatus and the wire harness manufacturing method, the wire harness can be manufactured on a general production line regardless of differences in vehicle types.
Drawings
Fig. 1 shows a schematic view of a wire harness manufacturing site in which a wire harness manufacturing apparatus of one embodiment is installed;
fig. 2 is a schematic view showing an example of a wire harness manufactured by the wire harness manufacturing apparatus of the manufacturing site shown in fig. 1;
fig. 3 is a detailed external perspective view of the wire harness manufacturing apparatus schematically shown in fig. 1;
fig. 4 is an enlarged perspective view showing a peripheral portion of a starting point position and a position below the starting point of wiring of the wire harness manufacturing device shown in fig. 3 and the first wiring substrate;
fig. 5 is a side view of an enlarged portion of the wire harness manufacturing device shown in fig. 4 as viewed from the direction of an arrow V11 in fig. 4;
fig. 6 is an enlarged perspective view showing a part of a first production line of the wire harness manufacturing apparatus shown in fig. 3 and a first wiring substrate which moves on the first production line while being subjected to a wiring operation of a first part of the wire harness;
fig. 7 is an enlarged perspective view showing a peripheral portion of a combination position and a separation position of the first wiring substrate and the second wiring substrate in the wire harness manufacturing apparatus shown in fig. 3 and the combined first wiring substrate and second wiring substrate;
fig. 8 is a side view of an enlarged portion of the wire harness manufacturing device shown in fig. 7 as viewed from the direction of an arrow V12 in fig. 7;
fig. 9 is an enlarged perspective view enlarged and showing a part of a second production line of the wire harness manufacturing apparatus shown in fig. 3 and a combined wiring substrate which moves on the second production line while being subjected to a wiring operation of a second part of the wire harness on the second wiring substrate;
fig. 10 is an enlarged perspective view showing peripheral portions of end positions and positions below the end positions of the wiring of the wire harness manufacturing apparatus shown in fig. 3 and one assembled wiring substrate; and
fig. 11 is a side view of an enlarged portion of the wire harness manufacturing device shown in fig. 10 when viewed from the direction of an arrow V13 in fig. 10.
List of reference marks
1 wire harness manufacturing device
11 first wiring board
12 second wiring board
13 guide support part
13a structural frame
14 combination wiring substrate
21 off-line work area
131 first production line
131a power relay mechanism
131a-1 power relay board
131a-2 metal wheel
132 second production line
133 first return line
133a first line part
133a-1, 134b-1 line end-point
133b Pre-origin lifting mechanism
134 second return line
134a terminal point descending mechanism
134b second thread portion
134c combined front lifting mechanism
P11 starting position
P12 end position
P13 combination position
P14 separation position
Position below the starting point of P15
Position below P16 end point
R11 first travel path
R12 second travel path
R13 first return path
R14 second return path
CN1 first joint part
CN2 second joint part
W1 wire harness
W11 first part
W12 second part
EG1 engine
BD1 vehicle body
BD11 Power supply
BD12 engine control device
Direction of circulation of D11
D12 and D13 lifting directions
D14 combination direction
D15 descending direction
Detailed Description
Hereinafter, embodiments of a wire harness manufacturing apparatus and a wire harness manufacturing method will be described.
Fig. 1 shows a schematic view of a wire harness manufacturing site in which a wire harness manufacturing device of one embodiment is installed, and fig. 2 is a schematic view showing an example of a wire harness manufactured using the wire harness manufacturing device of the manufacturing site shown in fig. 1.
The wire harness W1 shown as an example in fig. 2 is a wire harness routed in an engine compartment. The harness W1 includes: a first section W11 wired to the power supply BD11 and the engine control device BD12 on the vehicle body BD1 side; and a second portion W12 routed to various accessories on the engine EG 1. Here, the second portion W12 on the engine EG1 and the first portion W11 on the vehicle body BD1 side may have a part of the wiring shape according to the shape of the vehicle body panel specified by the design of each vehicle type. Therefore, the wiring shape of the wire harness W1 is determined by the combination of the first portion W11 and the second portion W12 that are appropriately set according to the vehicle type.
The wire harness manufacturing apparatus 1 at the manufacturing site shown in fig. 1 includes: a first wiring substrate 11 in which a first portion W11 of the wire harness W1 is routed; and a second wiring substrate 12 in which the second portion W12 is wired to complete the wire harness W1. The first wiring substrate 11 is formed in a rectangular plate shape, and includes a first bonding portion CN1 for bonding with the second wiring substrate 12. Further, the second wiring substrate 12 is formed in the shape of an L-shaped plate provided with a recess to which the first wiring substrate 11 can be fitted so that the first wiring substrate 11 on which the wired first portion W11 is mounted can be detachably combined therewith; in addition, the second engagement portion CN2 engaged with the first engagement portion CN1 is attached to the inner edge of the recess. In the present embodiment, as shown in fig. 2, the first portion W11 and the second portion W12 are not physically separated but conceptually divided into portions in the middle of the electric wire routed across the boundary between the first wiring board 11 and the second wiring board 12. When manufacturing the wire harness W1, first, the first portion W11 is wired on the first wiring board 11. At this stage, a part of the electric wires constituting the second portion W12 are put together in a wound state before wiring, and wired on the first wiring substrate 11 or in the vicinity of the first wiring substrate 11. Thereafter, when the first wiring substrate 11 is combined with the second wiring substrate 12, the electric wires gathered as described above extend onto the second wiring substrate 12, and the second portion W12 is wired. In the present embodiment, a plurality of the first wiring boards 11 and a plurality of the second wiring boards 12 are provided, respectively.
The wire harness manufacturing apparatus 1 shown in fig. 1 is a line configuration in which: the plurality of first wiring substrates 11 and the plurality of second wiring substrates 12 are sequentially laid while circulating in the circulation direction D11 in the drawing between the starting position P11 and the ending position P12 of the wiring. Further, in the vicinity of the harness manufacturing apparatus 1, a lower wire work area 21 is provided, and in this lower work area 21, additional wiring operations are appropriately performed as necessary.
Fig. 3 is a detailed external perspective view of the wire harness manufacturing apparatus schematically shown in fig. 1. Although the number of the first wiring substrate 11 and the second wiring substrate 12 shown is significantly different between fig. 3 and fig. 1 described above, these drawings essentially show the same wire harness manufacturing apparatus 1.
In addition to the first wiring board 11 and the second wiring board 12 described above, the wire harness manufacturing device 1 of the present embodiment further includes the guide support 13, and the guide support 13 guides and supports the respective wiring boards in the circulation direction D11 of fig. 1. First, the guide support portion 13 supports the second wiring substrate 12 at the combination position P13 with the first wiring substrate 11, and guides and supports the first wiring substrate 11 to the combination position P13. Further, while the first portion W11 is wired on each of the plurality of first wiring boards 11, the guide support 13 sequentially moves the first wiring board 11 to the combining position P13. Then, the guide support 13 is configured to sequentially combine the first wiring substrate 11 and the second wiring substrate 12 at the combination position P13, and to cause the second portion W12 of the combined second wiring substrate 12 to be wired.
More specifically, the guide support 13 includes a first production line 131, a second production line 132, a first return line 133, and a second return line 134.
The first production line 131 movably supports the first wiring substrate 11 from the starting point position P11 of the wiring to the combination position P13 with the second wiring substrate 12 along the first travel path R11. Then, the first wiring board 11 is moved by the first line 131 along the first travel path R11 to the combining position P13 while the first portion W11 is wired on the first wiring board 11.
The second production line 132 movably supports the assembled wiring substrate 14 in which the first wiring substrate 11 and the second wiring substrate 12 have been assembled with each other, from the assembling position P13 to the terminal position P12 where the completed wire harness W1 is moved out, along the second traveling path R12. Then, the second line 132 moves the combined wiring substrate 14 to the end position P12 while the second portion W12 is wired on the second wiring substrate 12 of the combined wiring substrate 14.
The first return line 133 moves the first wiring substrate 11 separated from the second wiring substrate 12 at a separation position P14 described later along a first return path R13 different from the first travel path R11 and returns it to a starting point position P11 of the wiring.
The first return line 133 includes a first line part 133a and a front start point lifting mechanism 133 b. The first wire portion 133a extends below the first line 131 from the separation position P14 to the below-start-point position P15 below the start point position P11 in parallel with the first line 131, and moves the first wiring substrate 11 to the below-start-point position P15. The front-start lifting mechanism 133b is a mechanism for lifting the first wiring board 11 from the lower-start-point position P15 to the start-point position P11.
After removing the wire harness W1, the second return wire 134 moves the assembled wiring substrate 14 from the end position P12 to the separation position P14 near the assembly position P13 along the second return path R14 different from the second travel path R12. Then, the second return line 134 separates the first wiring substrate 11 at the separation position P14 and returns only the second wiring substrate 12 to the combination position P13. The first wiring substrate 11 separated at the second return line 134 is returned to the starting point position P11 by the first return line 133 as described above.
The second return wire 134 includes a final lowering mechanism 134a, a second wire portion 134b, and a combined front raising mechanism 134 c. The end-point lowering mechanism 134a is a mechanism for lowering the assembled wiring board 14 from the end point position P12 to the end point lower position P16 located below the end point position P12. The second wire portion 134b extends below the second line 132 from the end point lower position P16 to the separation position P14 in parallel with the second line 132, and moves the assembled wiring substrate 14 to the separation position P14. The combined front lifting mechanism 134c is the following mechanism: which separates the first wiring substrate 11 from the second wiring substrate 12 at the separation position P14 and raises the separated second wiring substrate 12 from the separation position P14 to the combination position P13.
The wire harness manufacturing device 1 of the present embodiment is configured substantially as described above. Hereinafter, details of respective parts of the wire harness manufacturing device 1 will be described.
Fig. 4 is an enlarged perspective view showing the peripheral portions of the starting point position and the position below the starting point of the wire harness manufacturing device shown in fig. 3 and one first wiring substrate. Further, fig. 5 is a side view of an enlarged portion of the wire harness manufacturing device shown in fig. 4 when viewed from the direction of arrow V11 in fig. 4.
Fig. 4 and 5 illustrate the pre-starting-point lifting mechanism 133b, which the pre-starting-point lifting mechanism 133b lifts the first wiring substrate 11, which has been returned to below the first production line 131 by the first wire part 133a of the first return wire 133, from the under-starting-point position P15 to the starting point position P11. The first line portion 133a is constituted by a plurality of rails attached along the first return path R13 inside the structural frame 13a guiding the supporting portion 13. When the first wiring substrate 11 reaches the lower-than-start-point position P15, the pre-start-point lifting mechanism 133b is lifted in the lifting direction D12 to the start-point position P11 together with the line end 133a-1 that supports the first line portion 133a of the first wiring substrate 11 at that point. In the wire harness manufacturing device 1 of the present embodiment, a hydraulic lifter is employed as the starting point front lifting mechanism 133 b. The line end 133a-1 lifted together with the first wiring board 11 is connected to the end of the first line 131 on the side of the starting point position P11. By the connecting line, the first wiring substrate 11 which has been lifted up to the starting position P11 is smoothly transferred to the first production line 131. When the first wiring substrate 11 is transferred to the first line 131, the pre-starting-point lifting mechanism 133b is reset, and the line end 133a-1 that has been lifted together with the first wiring substrate 11 also returns to the first line end 133a, and will wait for the arrival of the next first wiring substrate 11.
Fig. 6 is an enlarged perspective view of a portion of the first production line of the wire harness manufacturing apparatus shown in fig. 3 and showing the first wiring substrate moving on the first production line while the first portion of the wire harness is routed.
In the wire harness manufacturing apparatus 1 of the present embodiment, the first production line 131 is constituted by a plurality of rails attached along the first traveling path R11 above the structural frame 13a of the guide support portion 13. The first portion W11 of the wire harness W1 is wired while the first wiring substrate 11 slides and moves along the first travel path R11 on the first production line 131. Note that fig. 6 shows the first wire portion 133a of the first return wire 133 and the empty first wiring substrate 11 that slides along this first wire portion 133 a.
As shown in fig. 3, in the first production line 131, the plurality of first wiring boards 11 automatically slide along the first travel path R11 while being aligned in a row by a moving device (not shown) provided on the guide support 13. Then, the worker performs the wiring operation of the first portion W11 for each of the moved first wiring boards 11. The plurality of first wiring substrates 11 sequentially advance toward the combining position P13 while being subjected to the wiring operation in this manner. By the time the wiring operation of the first portion W11 on the first wiring substrate 11 reaches the combining position P13, the portion of the electric wire forming the second portion W12 is completed in a state of being wired on the first wiring substrate 11 or in the vicinity of the first wiring substrate 11.
Here, in the present embodiment, with respect to the wiring operation of the first portion W11, the first wiring substrate 11 is provided with a navigation function for guiding the wiring flow and the like on the first wiring substrate 11. The navigation function operates by being supplied with electric power from the outside. Then, the first production line 131 in the guide support portion 13 is provided with a guide path to the combination position P13, that is, a power relay mechanism 131a that relays electric power while movably supporting the first wiring board 11 along the first travel path R11. The power relay mechanism 131a includes a power relay plate 131a-1 and a metal wheel 131 a-2.
The power relay board 131a-1 is formed of a conductive metal plate, and extends at least along the first travel path R11 to relay power to the first wiring substrate 11. In the present embodiment, the power relay board 131a-1 is a copper plate formed in a strip shape, and is mounted on the upper surface of the rail constituting the first production line 131. The power relay board 131a-1 receives power from a power supply device (not shown).
The metal wheel 131a-2 is a conductive metal wheel, which is disposed on the lower surface of the first wiring substrate 11 facing the power relay board 131a-1 to make contact with the power relay board 131a-1 and roll. In the present embodiment, a copper wheel is used as the metal wheel 131 a-2. A plurality of metal wheels 131a-2 are provided to make contact with the power relay board 131 a-1. Then, the plurality of metal wheels 131a-2 support the first wiring substrate 11 to move on the power relay plate 131a-1, and the electric power relayed by the power relay plate 131a-1 is transferred to the first wiring substrate 11. In the first wiring board 11, the worker performs the wiring operation of the first portion W11 while referring to the navigation function operated by the electric power transmitted in this manner.
Fig. 7 is an enlarged perspective view showing, in an enlarged manner, the peripheral portions of the combination position and the separation position of the first wiring substrate and the second wiring substrate in the wire harness manufacturing apparatus shown in fig. 3 and the first wiring substrate and the second wiring substrate after combination. Further, fig. 8 is a side view of an enlarged portion of the wire harness manufacturing device shown in fig. 7 when viewed from the direction of arrow V12.
In fig. 7 and 8, the second wiring substrate 12 returned to the empty combined wiring substrate 14 under the second production line 132 is lifted to the combining position P13, and the first portion W11 is shown combined with the already wired first wiring substrate 11 to form a new combined wiring substrate 14. In the second return line 134, the second line portion 134b for returning the empty combined wiring board 14 to the separation position P14 below the combining position P13 is configured by a plurality of rails attached to the inside of the structural frame 13a of the guide support portion 13 along the second return path R14.
When the empty combined wiring board 14 reaches the separation position P14, the pre-combination lifting mechanism 134c first separates the first wiring board 11 from the second wiring board 12 in the combined wiring board 14. The separated first wiring substrate 11 is transferred to the first wire part 133a of the first return wire 133 and is moved to the starting point lower position P15. Then, only the remaining second wiring substrate 12 is lifted up to the combining position P13 by the pre-combination lifting mechanism 134 c. At this time, the pre-assembly lifting mechanism 134c lifts the second wiring substrate 12 to the assembly position P13 in the lifting direction D13 together with the production-line end 134b-1 supporting the second wire section 134b of the second wiring substrate 12. In the wire harness manufacturing device 1 of the present embodiment, in the pre-combination lifting mechanism 134c, a hydraulic lifter is employed as a mechanism portion for lifting the second wiring substrate 12 and the line end 134 b-1.
When the second wiring substrate 12 is lifted to the combining position P13 in this manner, the first wiring substrate 11 on which the first part W11 of the wire harness W1 has been routed in the first production line 131 is sequentially slid in the combining direction D14 and combined with the second wiring substrate 12. In this combination, the first wiring substrate 11 in a rectangular plate shape is fitted into the recess of the second wiring substrate 12 in an L-shaped plate shape, and the first joint CN1 is joined to the second joint CN 2. Then, the combined wiring board 14 formed by the combination of the two wiring boards is transferred to the second production line 132 along the second travel path R12. At this time, the line end 134b-1 lifted by the pre-assembly lifting mechanism 134c together with the second wiring substrate 12 is connected to the end of the second line 132 on the assembly position P13 side. By the connecting line, the assembled wiring substrate 14 is smoothly transferred to the second production line 132. When the combined wiring substrate 14 is transferred to the second line 132, the pre-combination lifting mechanism 134c is reset, and the line end 134b-1 that has been lifted together with the second wiring substrate 12 is also returned to the second line portion 134b, and will wait for the arrival of the next empty combined wiring substrate 14. On the other hand, the assembled wiring substrate 14 having been transferred to the second production line 132 is then subjected to the wiring operation of the second portion W12 of the wiring harness W1 on the second wiring substrate 12.
In the present embodiment, the plurality of empty combined wiring substrates 14 are sequentially returned to the separation position P14 along the second return path R14, the first wiring substrate 11 is separated, and the second wiring substrate 12 is lifted to the combination position P13. Further, the plurality of wired first wiring boards 11 are sequentially sent out from the first production line 131. Then, at the combining position P13, the first wiring substrate 11 sent out from the first production line 131 is combined with one second wiring substrate 12 which has been lifted from the separation position P14, and the combined wiring substrate 14 is constituted. When one combined wiring substrate 14 is transferred to the second production line 132 and the space at the combining position P13 becomes empty, the next second wiring substrate 12 is lifted up to the combining position P13, and the next first wiring substrate 11 is combined to form the combined wiring substrate 14. At the combination position P13, such a series of operations is repeated.
Fig. 9 is an enlarged perspective view of a part of the second production line of the wire harness manufacturing apparatus shown in fig. 3 and a combined wiring substrate moving on the second production line while a second part of the wire harness is routed on the second wiring substrate.
In the wire harness manufacturing device 1 of the present embodiment, the second production line 132 is constituted by a plurality of rails mounted along the second traveling path R12 above the structural frame 13a guiding the supporting portion 13. The assembled wiring substrate 14 is automatically moved on the second production line 132 along the second travel path R12 by a moving device (not shown) provided on the guide support 13. Then, the worker performs the wiring operation of the second portion W12 of the wire harness W1 with respect to the second wiring substrate 12 among the combined wiring substrates 14 in motion. In the wiring operation at this time, as described above, the electric wires wired together on the first wiring substrate 11 or in the vicinity of the first wiring substrate 11 extend to the second wiring substrate 12 across the boundary of the wiring substrate, so that the second portion W12 is wired. In fig. 9, the portion of the second portion W12 that has been wired is shown by a solid line, and the portion that has not been wired is shown by a broken line. In fig. 9, the second wire portion 134b of the second return wire 134 is shown together with the empty combined wiring board 14 that moves along the second wire portion 134 b.
In the second manufacturing line 132, in a state where the plurality of combined wiring substrates 14 in which the second portions W12 are wired on the respective second wiring substrates 12 are arranged in line, the plurality of combined wiring substrates 14 sequentially travel toward the end position P14 while being slidingly moved along the second travel path R12.
Here, in the present embodiment, unlike the wiring operation of the first section W11 described above, the wiring operation of the second section W12 does not navigate the wiring flow. This is because, in the present embodiment, an operation requiring navigation such as an operation of inserting a terminal into a connector is completed by the wiring operation of the first portion W11. In the wiring operation of the second portion W12, an operation requiring no navigation, such as an external operation like bonding of a wire harness and attachment of a bellows, is performed. Therefore, unlike the first wiring board 11, the second wiring board 12 does not provide the navigation function to the second wiring board 12. That is, the second wiring board 12 does not require the power required for the first wiring board 11, and the second line 132 side is not provided with a mechanism corresponding to the power relay mechanism 131a provided on the first line 131 side of the guide support portion 13.
Fig. 10 is an enlarged perspective view showing peripheral portions of the terminal position and the position below the terminal position of the wire harness manufacturing apparatus shown in fig. 3 and one assembled wiring substrate. Further, fig. 11 is a side view of an enlarged portion of the wire harness manufacturing device shown in fig. 10 when viewed from the direction of arrow V13 in fig. 10.
In fig. 10 and 11, when the assembled wiring substrate 14 in which the wire harness W1 is completed on the board corresponding to the wiring operation of the second portion W12 is moved to the end position P12, a state in which the wire harness W1 is removed is shown at the end position P12. In the wire harness manufacturing apparatus 1, the assembled wiring substrate 14 that has been emptied by removing the wire harness W1 is lowered from the end position P12 to the end lower position P16 by the end lowering mechanism 134a in the second return wire 134. When the assembled wiring substrate 14 reaches the end-point-below position P16, the end-point lowering mechanism 134a is lowered in the lowering direction D15 to the end-point-below position P16 together with the line end 132a of the second line 132 supporting the assembled wiring substrate 14 at that point. In the present embodiment, a hydraulic lifter is employed as the end-point lowering mechanism 134 a. The production line end portion 132a that descends together with the assembled wiring substrate 14 is connected to an end portion on the side of the terminal point lower position P16 of the second line portion 134b of the second return line 134. By the connecting line, the empty assembled wiring substrate 14 that has been lowered to the end point below position P16 is smoothly transferred to the second wire portion 134 b. When the assembled wiring substrate 14 is transferred to the second line portion 134b, the end-point lowering mechanism 134a is reset, and the line end portion 132a that has been lowered together with the assembled wiring substrate 14 also returns to the second line 132, waiting for the arrival of the next assembled wiring substrate 14. On the other hand, the empty combined wiring substrate 14 that has moved to the second wire portion 134b proceeds to the separation position P14 along the second return path R14.
In the present embodiment, the plurality of assembled wiring substrates 14 sequentially reach the terminal position P12 along the second travel path R12, the wire harness W1 is moved out, and is lowered to the terminal lower position P16. Then, when the assembled wiring substrate 14 is transferred to the second wire part 134b and the space of the terminal position P12 and the terminal below position P16 becomes empty, the next assembled wiring substrate 14 is transferred to the terminal position P12, and the wire harness W1 is moved out and lowered to the terminal below position P16. At the end position P12, such a series of operations is repeated.
Next, although the description so far may be repeated, a wire harness manufacturing method performed using the wire harness manufacturing device 1 shown in fig. 1 to 11 will be described below.
The wire harness manufacturing method in the present embodiment includes a first wiring step, a combining step, a second wiring step, a second returning step, and a first returning step.
As shown in fig. 6, the first wiring step is a step of wiring the first portion W11 of the wire harness W1 on the first wiring board 11 while moving the first wiring board 11 on the first production line 131. By the time the first wiring substrate 11 reaches the combining position P13, the wiring operation of the first section W11 is completed. At this time, a part of the electric wires constituting the second portion W12 is to be placed on the first wiring substrate 11.
As shown in fig. 7 and 8, the combining step is a step of combining the first wiring board 11 on which the wired first portion W11 is placed with the second wiring board 12 having a shape capable of being attachably combined with the first wiring board 11. In this combining step, separation of the first wiring board 11 from the second wiring board 12 in the empty combined wiring board 14, lifting of the second wiring board 12 to the combining position P13 after the separation, and the next combination of the first wiring board 11 and the second wiring board 12 are performed.
In the second wiring step, as shown in fig. 9, the second portion W12 is wired with respect to the second wiring substrate 12 while the combined wiring substrate 14 is moved on the second production line 132. In the wiring operation here, the electric wires wired together on the first wiring substrate 11 or in the vicinity of the first wiring substrate 11 extend to the second wiring substrate 12 across the boundary of the wiring substrate, and the wiring of the second portion W12 is performed. By the time the assembled wiring substrate 14 reaches the end position P12, the wiring operation of the second portion W12 is completed, and the wire harness W1 is completed in this second wiring step.
The second returning step is a step of returning the second wiring substrate 12 of the empty buildup wiring substrate 14, which is obtained by removing the completed wire harness W1 from the buildup wiring substrate 14, to the buildup position P13. In this second return step, first, the empty assembled wiring substrate 14 is lowered to the below-end position P16 and conveyed to the separation position P14 along the second return path R14. Then, the first wiring substrate 11 is separated at the separation position P14, and the remaining second wiring substrate 12 is lifted from the separation position P14 to the combination position P13. The second wiring substrate 12 lifted in this manner is used for the next assembly step.
The first returning step is a step of returning the empty first wiring substrate 11 separated at the separation position P14 to the starting position P11 of the wiring. In the first return step, the empty first wiring board 11 is conveyed to the lower-start-point position P15 along the first return path R13. Then, as shown in fig. 4 and 5, the empty first wiring substrate 11 is lifted up to the starting position P11 at the starting below position P15. The first wiring substrate 11 lifted in this manner is used for the next first wiring step.
In the wire harness manufacturing method of the present embodiment, the first wiring step, the combining step, the second wiring step, the second returning step, and the first returning step are repeatedly performed using the plurality of first wiring substrates 11 and second wiring substrates 12 as targets of wiring.
According to the wire harness manufacturing apparatus 1 and the wire harness manufacturing method of the above embodiment, the following effects can be obtained. That is, in the present embodiment, the wiring substrate for the first portion W11 and the second portion W12 of the wire harness W1 is manufactured. Therefore, by changing the combination of the first wiring substrate 11 corresponding to the first portion W11 and the second wiring substrate 12 corresponding to the second portion W12 according to the vehicle type, it is possible to absorb the difference in wiring shape depending on the vehicle type, and it is possible to universally manufacture the wire harness W1 on the same production line as a whole. That is, according to the wire harness manufacturing apparatus 1 and the wire harness manufacturing method of the present embodiment described above, the wire harness can be manufactured on a general production line regardless of the vehicle type.
Here, in the present embodiment, a plurality of first wiring boards 11 and a plurality of second wiring boards 12 are provided, respectively, and the wiring operation of the first section W11, the combination of the wiring boards, and the wiring operation of the second section W12 are sequentially performed for the plurality of first wiring boards 11 and the plurality of second wiring boards 12. According to this configuration, the wiring operation of the first portion W11 in one wire harness W1 and the wiring operation of the second portion W12 in the other wire harness W can be simultaneously performed, so that the plurality of wire harnesses W1 can be efficiently manufactured.
Further, in the present embodiment, the guide support 13 includes a first line 131 for assembling the first wiring substrate 11 in the wiring substrate 14 and a second line 132 for assembling the second wiring substrate 12 in the wiring substrate 14. According to this configuration, the first production line 131 in which the wiring operation of the first section W11 is performed and the second production line 132 in which the wiring operation of the second section W12 is performed are combined at the combining position P13 to form one production line. By connecting the production lines in this manner, a series of operations relating to the manufacture of the wire harness W1 can be smoothly performed by the assembly line along one production line, which is preferable.
Further, in the present embodiment, the guide support portion 13 includes the second return line 134 for returning the second wiring substrate 12 of the assembled wiring substrate 14 to the assembling position P13 and the first return line 133 for returning the first wiring substrate 11 to the starting position P11 of the wiring. According to this configuration, the first wiring substrate 11 is circulated between the start position P11 and the end position P12, and the second wiring substrate 12 is circulated between the combination position P13 and the end position P12. Through such circulation of the wire harness, the respective wiring substrates for the wiring operations of the first and second portions W11 and W12 are repeatedly provided, so that the wire harness W1 can be efficiently manufactured.
In addition, in the present embodiment, the first return line 133 includes a first line part 133a and a front-of-origin lifting mechanism 133b, and the first line part 133a extends below the first production line 131. Further, the second return line 134 includes an end descent mechanism 134a, a second line portion 134b, and a combined front elevation mechanism 134c, the second line portion 134b extending below the second production line 132. According to this configuration, the first wire parts 133a of the first production line 131 and the first return line 133 are arranged in upper and lower two stages, and are connected via the starting point front lifting mechanism 133 b. Further, the second wire portions 134b of the second production line 132 and the second return line 134 are arranged in two stages, upper and lower, and are connected via an end lowering mechanism 134a and a combined front raising mechanism 134 c. By arranging the respective production lines in two stages up and down in this way, the wire harness manufacturing device 1 can be more compactly installed while reducing the installation space.
Further, in the present embodiment, the guide support portion 13 includes a power relay mechanism 131a that relays electric power. According to this configuration, the navigation function for guiding the wiring flow on the first wiring substrate 11 can be operated by the power supplied from the power relay mechanism 131 a.
Further, in the present embodiment, the power relay mechanism 131a includes the power relay plate 131a-1 and the metal wheel 131a-2, the power relay plate 131a-1 is formed of a conductive metal plate, and the metal wheel 131a-2 supports the first wiring substrate 11 and transmits the electric power relayed by the power relay plate 131a-1 to the first wiring substrate 11. According to this configuration, it is possible to achieve a good balance between smooth motions of the first wiring substrate 11 by rolling the metal wheel 131a-2 on the power relay board 131a-1, and relay electric power to the first wiring substrate 11 via the metal wheel 131a-2 and the power relay board 131 a-1.
It should be noted that the above-described embodiments show only typical embodiments of the wire harness manufacturing device and the wire harness manufacturing method, and the wire harness manufacturing device and the wire harness manufacturing method are not limited thereto, and can be modified and implemented via various modifications.
For example, in the above-described embodiment, as an example of the wire harness manufacturing device, the wire harness manufacturing device 1 in which the first wiring substrate 11 and the combined wiring substrate 14 are automatically slide-moved by the moving device that guides the supporting portion 13 is exemplified. However, the wire harness manufacturing device is not limited thereto, and the wire harness manufacturing device may be as follows: wherein the wiring substrate is slid manually by an operator without providing a means for automatically moving the wiring substrate. Further, a production line in which the wiring substrate is moved by manually sliding and a production line in which the wiring substrate automatically slides may be used in combination. For example, in the first production line, the worker may slide the first wiring substrate manually, and in the second production line, the combined wiring substrate may slide automatically.
Further, in the above-described embodiment, as an example of the wire harness manufacturing device, the wire harness manufacturing device 1 is exemplified in which the wiring of the first portion W11 on the first wiring substrate 11 is completed in a state where the parts of the electric wires of the second portion W12 are arranged together at or near the first wiring substrate. The wiring of the second portion W12 is performed by combining the first wiring board 11 and the second wiring board 12 and then extending the bundled electric wires to the second wiring board 12. However, the wire harness manufacturing apparatus is not limited thereto, and for example, a part of the wiring operation of the first portion is performed on the first wiring substrate, and the remaining part of the first portion and the second portion may be wired on the second wiring substrate after the wiring substrates are combined. Alternatively, in the wire harness manufacturing apparatus, the wiring operation of all of the first portion and a part of the second portion is performed on the first wiring substrate, and after the combination, the wiring operation of the remaining part of the second portion is performed on the second wiring substrate. Thus, in these wire harness manufacturing apparatuses, at least a part of the electric wires to be wired on the second wiring substrate after the wiring on the first wiring substrate is finished may be wired on or near the first wiring substrate.
Further, in the above-described embodiment, as an example of the wire harness manufactured by the wire harness manufacturing device, the wire harness W1 conceptually divided into two parts is exemplified. However, the wire harness manufactured by the wire harness manufacturing device is not limited thereto. For example, the wire harness may be physically divided into a first part and a second part, and combined by fitting connectors provided at ends of the respective parts. In this case, in the first wiring substrate, a wiring operation of the first portion provided with a connector for connecting to the second portion is performed. After the wiring substrates are assembled, the connector of the second portion is fitted to the connector of the first portion, and the second portion is wired on the second wiring substrate to reach the connector. When manufacturing a wire harness divided via a connector, a position to which the connector is connected may be on a boundary between the first wiring substrate and the second wiring substrate, or on one of the first wiring substrate and the second wiring substrate.
Further, in the above-described embodiment, as an example of the wire harness manufacturing apparatus, the wire harness manufacturing apparatus 1 in which only the first wiring substrate 11 and the second wiring substrate 12 are combined is exemplified. However, the wire harness manufacturing apparatus is not limited thereto. In the case of combining the first wiring substrate and the second wiring substrate, the wire harness manufacturing apparatus may combine three or more wiring substrates in total after adding other wiring substrates. In this case, the additional wiring substrates may be combined together at the combined position of the first wiring substrate and the second wiring substrate or at a combined position different from the combined position of the first wiring substrate and the second wiring substrate. Further, when a plurality of wiring substrates including the first wiring substrate and the second wiring substrate are combined at a plurality of combination positions, it is also possible to increase the number of wiring substrates in the shape of a billiard ball and combine them in order, such as combining one wiring substrate with another wiring substrate when the wiring operation thereof is completed.
Further, in the above-described embodiment, as examples of the first wiring board and the second wiring board, the first wiring board 11 having a rectangular plate shape and the second wiring board 12 having an L shape are illustrated, and the second wiring board 12 having an L shape is provided with a concave portion into which the first wiring board 11 can be fitted and is larger than the first wiring board 11. However, the first wiring substrate and the second wiring substrate are not limited thereto. For example, the first wiring substrate may be formed into an L-shaped plate larger than the second wiring substrate, or the first wiring substrate and the second wiring substrate may have the same shape and the same size as each other, as long as they are detachable from each other. As described above, the shape and size of the first wiring board and the second wiring board can be arbitrarily set.
Further, in the above-described embodiment, as an example of the guide support portion, the guide support portion 13 formed by combining a plurality of the structural frames 13a is exemplified. However, the guide support portion is not limited thereto, and a specific structure is not required as long as the second wiring substrate is supported at the combination position of the second wiring substrate and the first wiring substrate is guided and supported to the combination position.
Further, in the above-described embodiment, as an example of the wire harness manufacturing apparatus, the wire harness manufacturing apparatus 1 in which the plurality of first wiring substrates 11 and the plurality of second wiring substrates 12 are provided is exemplified. However, the wire harness manufacturing device is not limited thereto, and may be a wire harness manufacturing device in which one first wiring substrate and one second wiring substrate are provided.
Further, in the above-described embodiment, as an example of the guide support portion, the guide support portion 13 provided with the second return line 134 and the first return line 133 is exemplified. However, the guide support portion is not limited thereto, and may be configured such that the worker conveys the wiring substrate after the operation to the operation starting point position without providing the return line as described above.
Further, in the above-described embodiment, as an example of the guide support, the guide support 13 in which the production line and the return line are arranged in two stages up and down is exemplified. However, the arrangement of the production line and the return line in the guide support portion is not limited to this, and for example, the production line and the return line may be arranged side by side, or the production line and the return line may be arranged in a loop or the like. That is, the production line and the return line in the guide support portion can be arranged via an arbitrary path.
Further, in the above-described embodiment, the guide support portion 13 provided with the power relay mechanism 131a is exemplified as an example of the guide support portion. However, the guide support portion is not limited thereto, and the power relay mechanism may not be provided.
Here, in the above-described embodiment, as an example of the wire harness manufacturing device, the following wire harness manufacturing device 1 is exemplified: among them, only the first wiring board 11 has a navigation function, and the power relay mechanism 131a relays power only to the first wiring board 11 as a target. However, the wire harness manufacturing apparatus is not limited thereto, and a navigation function is also provided for a wiring operation on the combined second wiring substrate, and the power relay mechanism may be provided in the second production line on the second wiring substrate and the guide support portion. That is, only one of the first wiring board and the second wiring board, or both of the first wiring board and the second wiring board may be used as a relay destination of electric power. Further, when both the first wiring substrate and the second wiring substrate serve as relay destinations, it may be an indirect relay destination via one wiring substrate. Further, the operation function provided in the first wiring board or the second wiring board is not limited to the navigation function and may be a function arbitrarily set as long as it operates by receiving electric power.
Further, in the above-described embodiment, as an example of the power relay mechanism, the power relay mechanism 131a provided with the conductive power relay plate 131a-1 and the metal wheel 131a-2, respectively, is exemplified. However, the power relay mechanism is not limited thereto, and a specific mechanism mode thereof is not required. For example, the power relay mechanism is a mechanism provided with: a conductive metal track provided on the guide support portion side and having a groove formed along a traveling path of the wiring substrate; and a conductive metal rib that is provided on the wiring substrate side and slides and moves while rubbing on an inner surface of the groove. Further, the power relay mechanism may be a mechanism in which power is supplied in a non-contact manner. Even when the power relay plate and the metal wheel are provided, the metal material is not limited to copper in the above-described embodiments, and any metal having conductivity can be employed.
Claims (8)
1. A wire harness manufacturing apparatus comprising:
a first wiring substrate on which at least a part of the first portion in a wire harness having a first portion and a second portion is wired;
a second wiring substrate formed in a shape that can be detachably combined with the first wiring substrate on which the first portion has been wired, wherein, after the combination, at least a part of the second portion is wired on the second wiring substrate to complete the wire harness; and
a guide support portion that supports the second wiring substrate at a combination position where the second wiring substrate is combined with the first wiring substrate, and guides and supports the first wiring substrate to the combination position.
2. The wire harness manufacturing device according to claim 1,
a plurality of the first wiring boards and a plurality of the second wiring boards are provided,
the guide support portion sequentially guides the plurality of first wiring boards to the combining position while the wiring of the first portion is performed on each of the plurality of first wiring boards, and at the combining position, the guide support portion combines the plurality of first wiring boards with the plurality of second wiring boards to wire the second portion in the combined second wiring board.
3. The wire harness manufacturing device according to claim 1 or 2,
the guide support portion includes:
a first production line that movably supports the first wiring substrate from a predetermined starting point position to the combining position along a first travel path, and moves the first wiring substrate while performing wiring of the first portion on the first wiring substrate; and
a second production line that movably supports the combined wiring substrate, in which the first wiring substrate and the second wiring substrate have been combined with each other, from the combining position to an end position, at which the completed wire harness is removed, along a second travel path, and that moves the combined wiring substrate to the end position while performing routing of the second portion on the second wiring substrate of the combined wiring substrate.
4. The wire harness manufacturing device according to claim 3,
the guide support portion includes:
a second return line that moves the combined wiring substrate after the wire harness is moved out, along a second return path different from the second travel path, from the end position to a separation position near the combining position, and separates the first wiring substrate at the separation position and returns only the second wiring substrate to the combining position; and
a first return line that moves the first wiring substrate separated from the second wiring substrate at the separation position along a first return path different from the first travel path and returns the first wiring substrate to the starting point position.
5. The wire harness manufacturing device according to claim 4,
the separation position is located below the combination position, and,
the first return line includes: a first wire portion that extends below and parallel to the first production line from the separation position to a position below the starting point that is below the starting point position, and that moves the first wiring substrate to the position below the starting point; and a pre-starting-point lifting mechanism that lifts the first wiring substrate from the below-starting-point position to the starting-point position, and wherein,
the second return line includes: a terminal lowering mechanism that lowers the assembled wiring board from the terminal position to a position below the terminal position; a second wire portion that extends below and parallel to the second production line from the position below the end point to the separation position, and that moves the assembled wiring substrate to the separation position; and a pre-combination lifting mechanism that separates the first wiring substrate from the second wiring substrate at the separation position and lifts the second wiring substrate from the separation position to the combination position after separation.
6. The wire harness manufacturing device according to any one of claims 1 to 5,
at least one of the first wiring substrate and the second wiring substrate includes an operation function operated by supplying electric power, and the guide support portion includes a power relay mechanism for relaying the electric power.
7. The wire harness manufacturing device according to claim 6,
the power relay mechanism includes: a power relay board formed of a conductive metal plate and extending at least along a guide path to relay the electric power to at least one of the first wiring substrate and the second wiring substrate; and a conductive metal wheel that is provided in contact with and rolls on the power relay board, and that supports one of the first wiring board and the second wiring board so that the one of the first wiring board and the second wiring board moves on the power relay board, and that transmits the electric power relayed by the power relay board to the first wiring board.
8. A wire harness manufacturing method comprising:
a first wiring step: routing at least a portion of a first portion of a wire harness having the first portion and a second portion on a first wiring substrate;
the combination step is as follows: combining the first wiring substrate on which the first portion has been wired with a second wiring substrate having a shape that can be detachably combined with the first wiring substrate; and
a second wiring step: routing at least a part of the second portion on the second wiring substrate that has been combined with the first wiring substrate to complete the wire harness.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2020-120109 | 2020-07-13 | ||
| JP2020120109A JP7187506B2 (en) | 2020-07-13 | 2020-07-13 | Wire harness manufacturing device and wire harness manufacturing method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN113936863A true CN113936863A (en) | 2022-01-14 |
| CN113936863B CN113936863B (en) | 2024-06-07 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110785261.9A Active CN113936863B (en) | 2020-07-13 | 2021-07-12 | Wire harness manufacturing device and wire harness manufacturing method |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP7187506B2 (en) |
| CN (1) | CN113936863B (en) |
| PH (1) | PH12021050266A1 (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20020053468A1 (en) * | 1998-04-30 | 2002-05-09 | Hideo Yumi | Grounding terminal and mounting structure of the same on a printed circuit board |
| CN106024208A (en) * | 2016-06-20 | 2016-10-12 | 南京航空航天大学 | Three-dimensional modular wiring and detection integrating device for manufacturing wiring harness |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0754652B2 (en) * | 1990-01-08 | 1995-06-07 | 住友電装株式会社 | Wiring harness assembly drawing board shaping method and wiring jig used for the assembly drawing board |
| JPH0588103U (en) * | 1992-04-23 | 1993-11-26 | 株式会社東芝 | Work transfer device |
| JPH0765652A (en) * | 1993-08-27 | 1995-03-10 | Sumitomo Wiring Syst Ltd | Method for wire harness manufacture and wire harness manufacturing apparatus to realize such method |
| JP3613075B2 (en) * | 1999-06-16 | 2005-01-26 | 住友電装株式会社 | Wire harness manufacturing apparatus and manufacturing method |
| JP2004186083A (en) * | 2002-12-05 | 2004-07-02 | Yazaki Corp | Manufacturing device and manufacturing method of wire harness |
| JP5523289B2 (en) * | 2010-11-30 | 2014-06-18 | 矢崎総業株式会社 | Wire harness manufacturing apparatus and method |
-
2020
- 2020-07-13 JP JP2020120109A patent/JP7187506B2/en active Active
-
2021
- 2021-06-14 PH PH12021050266A patent/PH12021050266A1/en unknown
- 2021-07-12 CN CN202110785261.9A patent/CN113936863B/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20020053468A1 (en) * | 1998-04-30 | 2002-05-09 | Hideo Yumi | Grounding terminal and mounting structure of the same on a printed circuit board |
| CN106024208A (en) * | 2016-06-20 | 2016-10-12 | 南京航空航天大学 | Three-dimensional modular wiring and detection integrating device for manufacturing wiring harness |
Also Published As
| Publication number | Publication date |
|---|---|
| PH12021050266A1 (en) | 2022-01-24 |
| JP7187506B2 (en) | 2022-12-12 |
| JP2022017049A (en) | 2022-01-25 |
| CN113936863B (en) | 2024-06-07 |
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