CN113934108B - Composite PET soft film and preparation method thereof - Google Patents

Composite PET soft film and preparation method thereof Download PDF

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Publication number
CN113934108B
CN113934108B CN202111037116.9A CN202111037116A CN113934108B CN 113934108 B CN113934108 B CN 113934108B CN 202111037116 A CN202111037116 A CN 202111037116A CN 113934108 B CN113934108 B CN 113934108B
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pattern
film
pet
area
soft film
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CN113934108A (en
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宋崇顺
史晓华
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Nanchang Guanglan Semiconductor Co ltd
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Nanchang Guanglan Semiconductor Co ltd
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    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0002Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/68Preparation processes not covered by groups G03F1/20 - G03F1/50
    • G03F1/76Patterning of masks by imaging

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)

Abstract

The invention relates to a composite PET soft film and a preparation method thereof, wherein the preparation method of the composite PET soft film comprises the following steps: coating a photoresist mold on the motherboard to cover and be higher than the pattern structure to form a photoresist layer, wherein the pattern structure area is smaller than three fifths of the motherboard area; dividing more than two pattern transfer areas on the PET soft film; the ultraviolet-proof film is provided with a light-transmitting area; sequentially aligning the pattern transfer area, the light transmission area and the pattern structure in the vertical direction, and mutually attaching the PET soft film and the photoresist layer; exposing the PET soft film vertically to solidify the photoresist layer in the light transmission area to form a transfer pattern structure; demolding the PET soft film and the ultraviolet-proof film; and aligning the next pattern transfer area of the PET soft film with the pattern structure, and repeating the steps in sequence until all pattern transfer areas finish pattern transfer. Through the arrangement, the problem that the final yield is affected due to low pattern structure transfer efficiency when the composite soft mold is prepared through the mother board at present can be solved.

Description

Composite PET soft film and preparation method thereof
Technical Field
The invention relates to the technical field of nanoimprint, in particular to a composite PET soft film and a preparation method thereof.
Background
In nanoimprint technology, nanoimprint process flows applied to the field of display technology generally include: firstly, preparing a working template, then preparing an imprinting template used by a large-size imprinting machine according to the working template, and patterning a film on a display substrate by using the imprinting template.
At present, a master plate usually only replicates a composite soft mold, and then the composite soft mold is used for imprinting a sample, so that the sample has only one pattern structure; it can be seen that such pattern replication or transfer is inefficient, which can severely impact product yield efficiency.
Disclosure of Invention
In order to solve the technical problems, the invention aims to provide a composite PET soft film and a preparation method thereof, and the preparation method of the composite PET soft film is used for solving the problem that the final yield is affected due to low pattern structure transfer efficiency when a mother board is used for preparing a composite soft film at present.
In order to achieve one of the above objects, an embodiment of the present invention provides a method for preparing a composite PET soft film, including:
Step A: coating a photoresist mold on a motherboard to cover a pattern structure on the motherboard and form a photoresist layer; wherein the photoresist layer is higher than the pattern structure, and the pattern structure has an area smaller than three fifths of the motherboard area;
and (B) step (B): dividing more than two pattern transfer areas on the PET soft film, so that the plane size and shape of the pattern transfer areas and the plane size and shape of the pattern structures are matched;
step C: a transparent light-transmitting area is formed on the ultraviolet-proof film; the plane sizes and shapes of the pattern structure and the light-transmitting area are matched;
Step D: the ultraviolet-proof film and the PET soft film are sequentially stacked and covered on the photoresist layer, so that the pattern transfer area, the light transmission area and the pattern structure are sequentially aligned in the vertical direction; meanwhile, at the position of the light transmission area, the PET soft film and the photoresist layer are mutually attached;
Step E: exposing the PET soft film in the vertical direction, so that the photoresist layer positioned in the plane range of the light transmission area is solidified, and a transfer pattern structure is formed on the lower surface of the PET soft film;
step F: sequentially separating the PET soft film and the ultraviolet-proof film attached with the transfer pattern structure from the mother board to finish demolding;
Step G: shifting the PET soft film to enable the next pattern transfer area to be aligned with the pattern structure, and sequentially repeating the step A, the step C, the step D, the step E and the step F; and finishing pattern transfer until all pattern transfer areas on the PET soft film are completed.
As a further improvement of an embodiment of the present invention, the number of the ultraviolet-proof film and the number of the pattern transfer areas are matched; the light-transmitting areas on each ultraviolet-proof film are in one-to-one correspondence with each pattern transfer area.
As a further improvement of an embodiment of the present invention, the planar size relationship of the pattern transfer area, the light transmission area, and the pattern structure is: the pattern transfer area is larger than the light transmission area and larger than the pattern structure.
As a further improvement of an embodiment of the present invention, the planar size and shape of the light-transmitting area and the graphic structure are the same;
In the step D, the edge of the ultraviolet-proof film presses the photoresist layer and is in contact with the pattern structure.
As a further improvement of an embodiment of the present invention, in the step D, "the ultraviolet-proof film and the PET soft film are sequentially stacked and covered on the photoresist layer" specifically includes:
attaching and covering the ultraviolet-proof film on the photoresist layer, so that the light-transmitting area and the pattern structure are aligned in the middle in the vertical direction;
And attaching and covering the PET soft film on the ultraviolet-proof film, so that the pattern transfer area and the light transmission area are aligned in the middle in the vertical direction.
As a further improvement of one embodiment of the present invention, in step E, the PET soft film is exposed to UV light by an ultraviolet lamp.
As a further improvement of an embodiment of the present invention, the mother board is a circular silicon wafer, and the planar shape of the pattern structure is rectangular.
As a further improvement of an embodiment of the present invention, the planar size and shape of the ultraviolet-proof film and the mother board are matched.
An embodiment of the present invention also provides a composite PET soft film produced by the method for producing a composite PET soft film according to any one of the above, the composite PET soft film comprising:
a PET soft film comprising more than two pattern transfer areas;
And the transfer pattern structures are matched with the number of the transfer pattern structures, and the transfer pattern structures are respectively attached to the pattern transfer areas.
As a further improvement of one embodiment of the present invention, all pattern transfer areas are arranged on the PET soft film in a 4*4 array structure.
Compared with the prior art, the invention has the beneficial effects that:
When the pattern structure area on the motherboard is less than three fifths of the motherboard area, the preparation method of the composite PET soft film is as follows:
Coating a photoresist layer on the mother board, and covering the pattern structure to form a photoresist layer;
Providing a PET soft film, wherein the PET soft film comprises more than two pattern transfer areas, and the pattern transfer areas and the pattern structures are matched in plane size and shape;
Providing an ultraviolet-proof film, wherein a transparent light-transmitting area is formed, and the size and shape of the plane of the light-transmitting area and the shape of the plane of the pattern structure are matched;
sequentially stacking an ultraviolet-proof film and a PET soft film on the photoresist layer, so that the pattern structure, the light transmission area and the pattern transfer area are sequentially aligned from bottom to top, and the PET soft film is tightly attached to the photoresist layer;
exposing vertically downwards, and forming a transfer pattern structure after the photoresist layer is solidified in the transparent light transmission area;
Sequentially demolding the PET soft film and the ultraviolet-proof film, and attaching a transfer pattern structure to the lower surface of the PET soft film;
And aligning the next pattern transfer area of the PET soft film with the pattern structure, repeating the steps of gluing, arranging a light transmission area on the ultraviolet-proof film, stacking, exposing, sequentially demolding and the like until all pattern transfer areas on the PET soft film are processed and are attached with the transfer pattern structure.
When the pattern structure on the motherboard is of a small-size structure, the pattern transfer areas on the PET soft film are sequentially subjected to mass replication or pattern transfer through one PET soft film and a plurality of ultraviolet-proof films, so that a plurality of transfer pattern structures are formed on the PET soft film, and finally, a composite PET soft film is formed; therefore, when the sample is stamped through the composite PET soft film, a plurality of pattern structures can be stamped simultaneously, so that the transfer efficiency of the pattern structures can be greatly improved, and the product yield can be improved.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings used in the description of the embodiments or the prior art will be briefly described below. It is evident that the drawings in the following description are only some embodiments of the present invention and that other drawings may be obtained from these drawings without inventive effort for a person of ordinary skill in the art.
FIG. 1 is a schematic diagram of a motherboard according to an embodiment of the present invention;
FIG. 2 is a schematic diagram of a structure of a motherboard and a photoresist layer according to an embodiment of the present invention;
FIG. 3 is a schematic view of a PET soft film and an ultraviolet-proof film according to an embodiment of the invention;
FIG. 4 is a schematic diagram of a process for exposing a composite PET soft film according to an embodiment of the present invention;
FIG. 5 is a schematic diagram of a demolding process of a composite PET soft film according to an embodiment of the invention;
FIG. 6 is a schematic diagram showing the actual structure of a motherboard according to an embodiment of the present invention;
fig. 7 is a schematic view showing the actual structure of a composite PET film according to an embodiment of the present invention.
Wherein reference numerals are as follows:
The ultraviolet-proof film comprises a mother board 1, a pattern structure 11, a photoresist layer 2, an ultraviolet-proof film 3, a light-transmitting area 31 and a PET soft film 4.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the technical solutions of the present invention will be clearly and completely described below in conjunction with the detailed description of the present invention and the corresponding drawings. It will be apparent that the described embodiments are only some, but not all, of the embodiments of the invention. All other embodiments, which can be made by those skilled in the art based on the embodiments of the present invention without making any inventive effort, are intended to fall within the scope of the present invention.
The embodiments described below by referring to the drawings are exemplary only for explaining the present invention and are not to be construed as limiting the present invention.
As shown in fig. 1 to 5, an embodiment of the present invention provides a method for preparing a composite PET soft film, including:
Step A: coating a photoresist mold on the motherboard 1 to cover the pattern structure 11 on the motherboard 1 and form a photoresist layer 2; wherein the photoresist layer 2 is higher than the pattern structure 11, and the pattern structure 11 has an area smaller than three fifths of the area of the motherboard 1;
and (B) step (B): dividing more than two pattern transfer areas on the PET soft film 4 so that the plane sizes and shapes of the pattern transfer areas and the pattern structures 11 are matched;
Step C: a transparent light-transmitting area 31 is arranged on the ultraviolet-proof film 3; wherein, the plane size and shape of the pattern structure 11 and the light-transmitting area 31 are matched;
Step D: the ultraviolet-proof film 3 and the PET soft film 4 are sequentially stacked and covered on the photoresist layer 2, so that the pattern transfer area, the light transmission area 31 and the pattern structure 11 are sequentially aligned in the vertical direction; meanwhile, at the position of the light transmission area 31, the PET soft film 4 and the photoresist layer 2 are mutually attached;
step E: exposing the PET soft film 4 in the vertical direction to solidify the photoresist layer 2 positioned in the plane range of the light transmission area 31 and form a transfer pattern structure on the lower surface of the PET soft film 4;
Step F: sequentially separating the PET soft film 4 and the ultraviolet-proof film 3 attached with the transfer pattern structure from the mother board 1 to finish demolding;
step G: displacing the PET soft film 4 to enable the next pattern transfer area to be aligned with the pattern structure 11, and sequentially repeating the steps A, C, D, E and F; until all pattern transfer areas on the PET soft film 4 are completed with pattern transfer.
Specifically, when the pattern structure area on the motherboard is less than three fifths of the motherboard area, the preparation method of the composite PET soft film is as follows:
The mother board 1 is coated with photoresist and covered with a pattern structure 11 to form a photoresist layer 2;
Providing a PET soft film 4, wherein the PET soft film comprises more than two pattern transfer areas, and the pattern transfer areas and the pattern structures 11 are matched in plane size and shape;
Providing an ultraviolet-proof film 3, and arranging a transparent light-transmitting area 31, wherein the plane size and shape of the light-transmitting area 31 and the plane size and shape of the graph structure 11 are matched;
Sequentially stacking an ultraviolet-proof film 3 and a PET soft film 4 on the photoresist layer 2, ensuring that the pattern structure 11, the light-transmitting area 31 and the pattern transfer area are sequentially aligned from bottom to top, and the PET soft film 4 is tightly attached to the photoresist layer 2;
Exposing vertically downwards, and forming a transfer pattern structure after the photoresist layer 2 is solidified in the transparent region 31;
sequentially demolding the PET soft film 4 and the ultraviolet-proof film 3, and attaching a transfer pattern structure to the lower surface of the PET soft film 4;
the next pattern transfer area of the PET soft film 4 is aligned to the pattern structure 11, and the steps of gluing, forming a light transmission area 31 on the ultraviolet-proof film 3, stacking, exposing, sequentially demolding and the like are repeated until all pattern transfer areas on the PET soft film 4 are processed and the transfer pattern structure is attached.
Therefore, when the pattern structure 11 on the motherboard is a small-size structure, the pattern transfer areas on the PET soft film 4 are sequentially subjected to mass replication or pattern transfer through one PET soft film 4 and a plurality of ultraviolet-proof films 3, so that a plurality of transfer pattern structures are formed on the PET soft film 4, and finally, a composite PET soft film is formed; therefore, when the sample is stamped through the composite PET soft film, a plurality of pattern structures can be stamped simultaneously, so that the transfer efficiency of the pattern structures can be greatly improved, and the product yield can be improved.
In practical use, a plurality of identical patterns are copied on the soft mold through a motherboard, then the soft mold is used for printing the sample, and then the printed sample has a plurality of identical patterns, thereby greatly improving the output efficiency. Therefore, the completed graph structure 11 can be prevented from being polluted by the current graph transferring process, the utilization rate of the PET soft film is improved, and the overall output efficiency of the graph structure is improved.
In addition, on the final composite PET soft film, the period of transferring the pattern structure can be designed by itself, so long as the shape of the pattern structure is not smaller than the plane size of the pattern structure. When the soft mold is copied at the back, the ultraviolet-proof film can protect the patterns which are finished at the front, and the spacing between a plurality of patterns on the finally finished composite soft mold can be automatically adjusted.
Furthermore, the number of the ultraviolet-proof film 3 and the number of the pattern transfer areas are matched; the light-transmitting areas 31 on each ultraviolet-proof film 3 are in one-to-one correspondence with each pattern transfer area.
In actual operation, a plurality of ultraviolet-proof films are used, and a plurality of patterns are copied through a plurality of times of transfer, so that all pattern transfer areas on the PET soft film are subjected to pattern transfer.
Further, the plane size relationship among the pattern transfer area, the light transmission area 31 and the pattern structure 11 is: the pattern transfer area is larger than the light transmission area and larger than the pattern structure.
Thereby, sufficient exposure can be ensured so that the photoresist layer 2 is cured, forming a transfer pattern structure on the lower surface of the PET soft film 4.
Further, the planar sizes and shapes of the light-transmitting area 31 and the graphic structure 11 are the same;
In step D, the edge of the uv-blocking film 3 presses the photoresist layer 2 and contacts the pattern structure 11.
Therefore, after exposure, the solidified photoresist layer can be easily separated from the uncured photoresist layer, so that the photoresist layer can be automatically disconnected and is convenient to demould.
Meanwhile, the curing residual rubber ring after exposure can be prevented, and the demolding speed and quality are improved.
Further, in the step D, "the ultraviolet-proof film 3 and the PET soft film 4 are stacked and covered on the photoresist layer 2 in sequence" specifically includes:
Attaching and covering the ultraviolet-proof film 3 on the photoresist layer 2, so that the light-transmitting area 31 and the pattern structure 11 are aligned in the vertical direction;
the PET film 4 is attached to and covered on the ultraviolet-proof film 3 such that both the pattern transfer region and the light-transmitting region 31 are aligned in the vertical direction.
In practice, the apertured film is covered over the mold gel with the apertures and pattern areas centered and aligned, and the pet is then bonded together.
Thus, the pattern structure 11, the light-transmitting region 31 and the pattern transfer region are aligned in sequence from bottom to top; after exposure, the photoresist layer 2 in the light-transmitting region 31 is cured to form a transfer pattern structure on the lower surface of the PET film 4.
Therefore, not only enough exposure can be ensured, but also the symmetry and reasonable arrangement of the whole structure can be ensured.
Further, in step E, the PET film 4 is exposed to UV light by an ultraviolet lamp.
After the attachment is completed, the pet is then exposed to an ultraviolet lamp, and the light-transmitting place (i.e., the light-transmitting area 31 of the film) is cured and left on the pet.
As shown in fig. 6, further, the motherboard 1 is a circular silicon wafer, and the planar shape of the pattern structure 11 is rectangular.
Further, the plane sizes and shapes of the ultraviolet-proof film 3 and the mother board 1 are matched.
Thus, each pattern transfer area uses a new ultraviolet-proof film when transferring the pattern structure; the ultraviolet-proof film with smaller size has small area and can save materials.
As shown in fig. 7, an embodiment of the present invention further provides a composite PET soft film, produced by the method for producing a composite PET soft film according to any one of the above, the composite PET soft film comprising:
a PET soft film 4 including two or more pattern transfer areas;
And the transfer pattern structures are matched with the number of the transfer pattern structures, and the transfer pattern structures are respectively attached to the pattern transfer areas.
Further, all pattern transfer areas are arranged on the PET soft film 4 in a 4*4 array structure.
In actual use, the final composite PET soft film is provided with 16 transfer pattern structures which are regularly arranged in a matrix form, so that the efficiency of subsequent stamping samples can be greatly improved, and the yield can be improved.
In a specific embodiment, the whole process of the preparation method of the composite PET soft film comprises the following steps:
According to the size of the pattern area on the motherboard, an ultraviolet-proof film is firstly manufactured, and a hole with the same size as the pattern area of the motherboard or a hole with a bit larger than the pattern area is arranged on the film.
Then coating a layer of mold glue on the motherboard, covering a film with holes on the mold glue, aligning the holes with pattern areas in the middle, attaching the pet together, exposing the pet by an ultraviolet lamp, curing the mold glue at a light-transmitting place (namely a light-transmitting area of the film) and leaving the mold glue on the pet, and separating the pet and the film from the motherboard in sequence;
Repeatedly, the mother board is glued and covered with a film, and the next soft mold copying is performed by precisely moving the position of the pet until the number of patterns on the pet soft mold reaches the requirement.
It should be understood that although the present disclosure describes embodiments, not every embodiment is provided with a separate embodiment, and that this description is for clarity only, and that the skilled artisan should recognize that the embodiments may be combined as appropriate to form other embodiments that will be understood by those skilled in the art.
The above list of detailed descriptions is only specific to practical embodiments of the present invention, and is not intended to limit the scope of the present invention, and all equivalent embodiments or modifications that do not depart from the spirit of the present invention should be included in the scope of the present invention.

Claims (10)

1. The preparation method of the composite PET soft film is characterized by comprising the following steps:
Step A: coating a photoresist mold on a motherboard to cover a pattern structure on the motherboard and form a photoresist layer; wherein the photoresist layer is higher than the pattern structure, and the pattern structure has an area smaller than three fifths of the motherboard area;
and (B) step (B): dividing more than two pattern transfer areas on the PET soft film, so that the plane size and shape of the pattern transfer areas and the plane size and shape of the pattern structures are matched;
step C: a transparent light-transmitting area is formed on the ultraviolet-proof film; the plane sizes and shapes of the pattern structure and the light-transmitting area are matched;
Step D: the ultraviolet-proof film and the PET soft film are sequentially stacked and covered on the photoresist layer, so that the pattern transfer area, the light transmission area and the pattern structure are sequentially aligned in the vertical direction; meanwhile, at the position of the light transmission area, the PET soft film and the photoresist layer are mutually attached;
Step E: exposing the PET soft film in the vertical direction, so that the photoresist layer positioned in the plane range of the light transmission area is solidified, and a transfer pattern structure is formed on the lower surface of the PET soft film;
step F: sequentially separating the PET soft film and the ultraviolet-proof film attached with the transfer pattern structure from the mother board to finish demolding;
Step G: shifting the PET soft film to enable the next pattern transfer area to be aligned with the pattern structure, and sequentially repeating the step A, the step C, the step D, the step E and the step F; and finishing pattern transfer until all pattern transfer areas on the PET soft film are completed.
2. The method for producing a composite PET film according to claim 1, wherein the number of the ultraviolet-proof film and the number of the pattern transfer regions are matched; the light-transmitting areas on each ultraviolet-proof film are in one-to-one correspondence with each pattern transfer area.
3. The method for preparing a composite PET soft film according to claim 2, wherein the plane size relationship among the pattern transfer region, the light transmission region and the pattern structure is: the pattern transfer area is larger than the light transmission area and larger than the pattern structure.
4. The method for producing a composite PET film according to claim 3, wherein the planar size and shape of the light-transmitting region and the graphic structure are the same;
In the step D, the edge of the ultraviolet-proof film presses the photoresist layer and is in contact with the pattern structure.
5. The method for preparing a composite PET soft film according to claim 1, wherein in step D, the step of sequentially stacking the ultraviolet-proof film and the PET soft film on the photoresist layer specifically comprises:
attaching and covering the ultraviolet-proof film on the photoresist layer, so that the light-transmitting area and the pattern structure are aligned in the middle in the vertical direction;
And attaching and covering the PET soft film on the ultraviolet-proof film, so that the pattern transfer area and the light transmission area are aligned in the middle in the vertical direction.
6. The method for producing a composite PET film according to claim 1, wherein in step E, the PET film is exposed to UV light by an ultraviolet lamp.
7. The method for producing a composite PET film according to claim 1, wherein the mother substrate is a circular silicon wafer, and the planar shape of the pattern structure is rectangular.
8. The method for producing a composite PET film according to claim 1, wherein the ultraviolet-proof film and the master plate are matched in planar size and shape.
9. A composite PET film produced by the method of producing a composite PET film according to any one of claims 1 to 8, the composite PET film comprising:
a PET soft film comprising more than two pattern transfer areas;
And the transfer pattern structures are matched with the number of the transfer pattern structures, and the transfer pattern structures are respectively attached to the pattern transfer areas.
10. The composite PET film of claim 9, wherein all pattern transfer areas are arranged on the PET film in a 4*4 array configuration.
CN202111037116.9A 2021-09-06 2021-09-06 Composite PET soft film and preparation method thereof Active CN113934108B (en)

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Publication number Priority date Publication date Assignee Title
KR100832298B1 (en) * 2006-06-29 2008-05-26 엘지디스플레이 주식회사 RESIST FOR FORMING PATTERN AND METHOD FOR making softmold USING THE SAME
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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20070002171A (en) * 2005-06-30 2007-01-05 엘지.필립스 엘시디 주식회사 Soft mold and fabrication thereof
CN109683445A (en) * 2019-01-10 2019-04-26 京东方科技集团股份有限公司 A kind of joining method of nano-pattern, nano impression plate, grating and production method
CN109541885A (en) * 2019-01-14 2019-03-29 京东方科技集团股份有限公司 Joining method, nano impression plate, grating and the production method of nano-pattern

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