CN113923883A - Method for improving sunken part of copper plate - Google Patents
Method for improving sunken part of copper plate Download PDFInfo
- Publication number
- CN113923883A CN113923883A CN202111155733.9A CN202111155733A CN113923883A CN 113923883 A CN113923883 A CN 113923883A CN 202111155733 A CN202111155733 A CN 202111155733A CN 113923883 A CN113923883 A CN 113923883A
- Authority
- CN
- China
- Prior art keywords
- copper
- circuit board
- groove
- embedding groove
- plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 95
- 229910052802 copper Inorganic materials 0.000 title claims abstract description 95
- 239000010949 copper Substances 0.000 title claims abstract description 95
- 238000000034 method Methods 0.000 title claims abstract description 37
- 238000009713 electroplating Methods 0.000 claims abstract description 12
- 238000003825 pressing Methods 0.000 claims abstract description 11
- 238000007747 plating Methods 0.000 claims abstract description 7
- 230000008021 deposition Effects 0.000 claims abstract description 6
- 238000011161 development Methods 0.000 claims description 3
- 230000005611 electricity Effects 0.000 claims description 3
- 238000007493 shaping process Methods 0.000 claims description 3
- 230000008719 thickening Effects 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 description 4
- 239000003292 glue Substances 0.000 description 3
- 238000010030 laminating Methods 0.000 description 3
- 230000017525 heat dissipation Effects 0.000 description 2
- 238000012805 post-processing Methods 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000000994 depressogenic effect Effects 0.000 description 1
- 239000003814 drug Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
- H05K3/244—Finish plating of conductors, especially of copper conductors, e.g. for pads or lands
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
- H05K1/183—Components mounted in and supported by recessed areas of the printed circuit board
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
The invention discloses a method for improving the sunken part of a copper-buried plate, which comprises the following steps of: the method comprises the following steps of a former procedure, an inner layer pattern, a forming groove, a pressing, a copper deposition and board electric, an outer layer pattern, a pattern electroplating, a film stripping, a board grinding and a later procedure; routing a region corresponding to the copper embedding position to form a copper embedding groove, and placing a copper block into the copper embedding groove, wherein the size of the copper embedding groove is larger than that of the copper block; pressing to form a multilayer circuit board; the outer layer graph is manufactured, and windowing is carried out on the outer layer graph corresponding to the position of the copper embedding groove, so that the copper embedding groove is exposed; and the pattern electroplating is to plate copper on the area between the copper block and the circuit board, so that no gap exists between the copper block and the circuit board. The invention can solve the problem that the position of the circuit board with copper is sunken, and the quality of the circuit board is improved by a method of windowing after pressing, exposing the copper-burying groove and then carrying out pattern electroplating to ensure that the sunken part is plated with enough copper; and a local copper plating mode is adopted, and the flow is optimized.
Description
Technical Field
The invention relates to the field of circuit boards, in particular to a method for improving the sunken part of a copper-buried plate.
Background
With the development of electronic information, customers have higher and higher requirements on products, and circuit boards with good heat dissipation performance are favored more and more. For some high-heat-dissipation circuit board products, heat dissipation is generally performed by embedding a copper block, and in the process of manufacturing the embedded copper plate, glue flows from a PP sheet, so that the circuit board has quality problems.
The conventional method for manufacturing the copper-buried plate comprises the following steps: preceding process, inlayer figure, shaping gong groove, pressfitting and back process are earlier through forming process, will bury copper position gong sky, and with the copper billet pressfitting to gong sky position through the pressfitting, make and bury the copper board, but the pressfitting in-process, because of there is the gap copper billet and inboard wall, the gummosis is unusual, leads to having the difference in height among the pressfitting process, and the circuit board buries the position of copper promptly and has sunken problem, leads to the circuit board to scrap because of the medicine water is hidden to the depressed place easily.
Disclosure of Invention
The invention provides a method for improving the sunken part of a buried copper plate, aiming at solving the problem that the existing buried copper plate has sunken parts.
A method for improving the sunken part of a buried copper plate comprises the following steps which are carried out in sequence: the method comprises the following steps of a former procedure, an inner layer pattern, a forming groove, a pressing, a copper deposition and board electric, an outer layer pattern, a pattern electroplating, a film stripping, a board grinding and a later procedure;
routing a region corresponding to the copper embedding position to form a copper embedding groove, and placing a copper block into the copper embedding groove, wherein the size of the copper embedding groove is larger than that of the copper block;
pressing to form a multilayer circuit board;
the outer layer pattern is manufactured by film pasting, exposure and development on the circuit board, and windowing is performed corresponding to the position of the copper embedding groove to expose the copper embedding groove;
the pattern electroplating is to plate copper on the area between the copper block and the circuit board, so that no gap exists between the copper block and the circuit board;
and the plate is ground, and the convex part on the surface of the copper-plated convex circuit board is ground to be flat.
Optionally, the board comprises a thickened copper layer in a flash plating mode by 5-7 microns.
Optionally, the grinding plate is ground by using an abrasive belt.
Optionally, the distance between shaping gong groove, the buried copper inslot wall and the copper billet is 6mil at least.
Compared with the prior art, the invention has the beneficial effects that: the invention provides a method for improving the sunken part of a copper-buried plate, which can solve the problem that the position of a circuit board where copper is buried is sunken, and ensures that the sunken part is plated with enough copper by a method of windowing after pressing, exposing a copper-buried groove and then carrying out pattern electroplating, thereby improving the quality of the circuit board; and a local copper plating mode is adopted, the process is optimized, the operation is convenient, and the quality of the copper plate is improved.
Detailed Description
In order to explain the technical solution of the present invention in detail, the technical solution of the embodiment of the present invention will be clearly and completely described below.
A method for improving the sunken part of a buried copper plate comprises the following steps which are carried out in sequence: the method comprises the following steps of a former procedure, an inner layer pattern, a forming groove, a pressing, a copper deposition and board electric, an outer layer pattern, a pattern electroplating, a film stripping, a board grinding and a later procedure;
the former process: comprises cutting the base plate and the PP sheet into preset sizes.
Inner layer pattern: and manufacturing an inner layer pattern.
Forming routing grooves: routing a region corresponding to the copper embedding position to form a copper embedding groove, and placing a copper block into the copper embedding groove, wherein the size of the copper embedding groove is larger than that of the copper block; in some embodiments, the distance between the inner wall of the buried copper channel and the copper block is at least 6 mils. The thickness of the gong plate is determined according to the position of the embedded copper block.
Specifically, the size of the copper embedding groove is larger than that of the copper block, and due to the fact that PP glue flowing exists, a gap is formed between the copper embedding groove and the copper block, and therefore the situation that PP sheet glue flowing overflows the surface of the copper block or the plate can be avoided.
And (3) laminating: and laminating the multilayer substrate and the PP sheets arranged on the adjacent substrates after laminating to form the multilayer circuit board.
Copper deposition and plate electric: and carrying out copper deposition and board electricity on the circuit board, wherein the board electricity thickens the copper layer by 5-7 microns in a flash plating mode.
Outer layer pattern: and pasting a film on the circuit board, exposing and developing to manufacture an outer layer pattern, and windowing corresponding to the position of the copper embedding groove to expose the copper embedding groove.
Pattern electroplating: and the area between the copper block and the circuit board is plated with copper, so that no gap exists between the copper block and the circuit board, and the condition of depression is avoided. After the pressing, the window is opened, then the electroplating mode is carried out, the condition that the sunken position can be plated with enough copper is ensured, and the sunken problem can be completely solved.
Grinding a plate: and polishing the raised part on the surface of the raised circuit board after copper plating. And grinding the plate by adopting an abrasive belt.
And (3) post-processing: the post-processing comprises solder mask, characters, FQC and packaging.
The invention provides a method for improving the sunken part of a copper-buried plate, which can solve the problem that the position of a circuit board where copper is buried is sunken, and ensures that the sunken part is plated with enough copper by a method of windowing after pressing, exposing a copper-buried groove and then carrying out pattern electroplating, thereby improving the quality of the circuit board; and a local copper plating mode is adopted, the process is optimized, the operation is convenient, and the quality of the copper plate is improved.
Although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that changes may be made in the embodiments and/or equivalents thereof without departing from the spirit and scope of the invention. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention shall fall within the protection scope of the present invention.
Claims (4)
1. A method for improving the sunken part of a buried copper plate is characterized in that: comprises the following steps which are carried out in sequence: the method comprises the following steps of a former procedure, an inner layer pattern, a forming groove, a pressing, a copper deposition and board electric, an outer layer pattern, a pattern electroplating, a film stripping, a board grinding and a later procedure;
routing a region corresponding to the copper embedding position to form a copper embedding groove, and placing a copper block into the copper embedding groove, wherein the size of the copper embedding groove is larger than that of the copper block;
pressing to form a multilayer circuit board;
the outer layer pattern is manufactured by film pasting, exposure and development on the circuit board, and windowing is performed corresponding to the position of the copper embedding groove to expose the copper embedding groove;
the pattern electroplating is to plate copper on the area between the copper block and the circuit board, so that no gap exists between the copper block and the circuit board;
and the plate is ground, and the convex part on the surface of the copper-plated convex circuit board is ground to be flat.
2. The method for improving the sag of a buried copper plate according to claim 1, wherein: the board electricity is including adopting flash plating's mode thickening copper layer 5 ~ 7 microns.
3. The method for improving the sag of a buried copper plate according to claim 1, wherein: and the grinding plate is ground by adopting an abrasive belt.
4. The method for improving the sag of a buried copper plate according to claim 1, wherein: the distance between shaping gong groove, the copper groove inner wall of burying and the copper billet is 6 mils at least.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111155733.9A CN113923883A (en) | 2021-09-29 | 2021-09-29 | Method for improving sunken part of copper plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111155733.9A CN113923883A (en) | 2021-09-29 | 2021-09-29 | Method for improving sunken part of copper plate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN113923883A true CN113923883A (en) | 2022-01-11 |
Family
ID=79237176
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202111155733.9A Pending CN113923883A (en) | 2021-09-29 | 2021-09-29 | Method for improving sunken part of copper plate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN113923883A (en) |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103228112A (en) * | 2013-04-03 | 2013-07-31 | 深圳崇达多层线路板有限公司 | Electroless copper plating method for PCBs (printed circuit boards) with high aspect ratios |
| CN107231752A (en) * | 2017-06-20 | 2017-10-03 | 广州美维电子有限公司 | It is a kind of to reduce the pcb board boring method for electroplating copper thickness below |
| CN108012459A (en) * | 2017-12-04 | 2018-05-08 | 广州兴森快捷电路科技有限公司 | The production method for burying copper billet circuit board |
| CN108925065A (en) * | 2018-08-20 | 2018-11-30 | 胜宏科技（惠州）股份有限公司 | Copper billet method for manufacturing circuit board is buried in one kind |
| CN109327967A (en) * | 2018-11-23 | 2019-02-12 | 开平依利安达电子第三有限公司 | A kind of resin plate buries the production technology of copper billet |
| CN111107715A (en) * | 2020-01-15 | 2020-05-05 | 江门崇达电路技术有限公司 | Manufacturing method of HDI plate back drilling hole |
| CN112235956A (en) * | 2020-11-06 | 2021-01-15 | 惠州市盈帆实业有限公司 | Production and manufacturing process of copper-embedded circuit board based on PVC material |
-
2021
- 2021-09-29 CN CN202111155733.9A patent/CN113923883A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103228112A (en) * | 2013-04-03 | 2013-07-31 | 深圳崇达多层线路板有限公司 | Electroless copper plating method for PCBs (printed circuit boards) with high aspect ratios |
| CN107231752A (en) * | 2017-06-20 | 2017-10-03 | 广州美维电子有限公司 | It is a kind of to reduce the pcb board boring method for electroplating copper thickness below |
| CN108012459A (en) * | 2017-12-04 | 2018-05-08 | 广州兴森快捷电路科技有限公司 | The production method for burying copper billet circuit board |
| CN108925065A (en) * | 2018-08-20 | 2018-11-30 | 胜宏科技（惠州）股份有限公司 | Copper billet method for manufacturing circuit board is buried in one kind |
| CN109327967A (en) * | 2018-11-23 | 2019-02-12 | 开平依利安达电子第三有限公司 | A kind of resin plate buries the production technology of copper billet |
| CN111107715A (en) * | 2020-01-15 | 2020-05-05 | 江门崇达电路技术有限公司 | Manufacturing method of HDI plate back drilling hole |
| CN112235956A (en) * | 2020-11-06 | 2021-01-15 | 惠州市盈帆实业有限公司 | Production and manufacturing process of copper-embedded circuit board based on PVC material |
Non-Patent Citations (1)
| Title |
|---|
| 田文超等: "《高等院校试用教材 磨削加工学》", 西安：西安电子科技大学出版社, pages: 308 - 41 * |
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