CN113923865B - Electronic component and electronic equipment - Google Patents
Electronic component and electronic equipment Download PDFInfo
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- CN113923865B CN113923865B CN202111068944.9A CN202111068944A CN113923865B CN 113923865 B CN113923865 B CN 113923865B CN 202111068944 A CN202111068944 A CN 202111068944A CN 113923865 B CN113923865 B CN 113923865B
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- electronic component
- substrate
- solder
- filler
- region
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/111—Pads for surface mounting, e.g. lay-out
Abstract
The application relates to an electronic component and electronic equipment, comprising a substrate, electronic components and underfill; the substrate is provided with a plurality of first bonding pads; the electronic component is provided with a plurality of welding spots, the density of the welding spots of a first area surrounded by the welding spots is smaller than that of the welding spots of a second area, and the electronic component is welded with the first welding pad through the welding spots; the underfill is used for filling gaps between the electronic components and the substrate; the substrate comprises a third area corresponding to the first area and a fourth area corresponding to the second area, the third area is provided with a filling piece, the difference value between the thermal expansion coefficient of the filling piece and the thermal expansion coefficient of the welding point is smaller than the difference value between the thermal expansion coefficient of the bottom filling glue and the thermal expansion coefficient of the welding point, the thermal expansion coefficient of the filling piece is usually smaller than the thermal expansion coefficient of reworkable bottom filling glue used by the electronic component, the fatigue stress of the bottom filling glue to the welding point in the temperature cycle change process is reduced, and the risk of welding point cracking is relieved.
Description
Technical Field
The present application relates to the field of electronic devices, and in particular, to an electronic component and an electronic device.
Background
In current electronic equipment, PCB and electronic components pass through solder joint and pad realization connection, because there is the clearance behind PCB and the electronic components are connected, and the connection reliability of electronic components and PCB is lower in the use, can fill the underfill between electronic components and PCB usually, makes the underfill solidify through the mode of thermosetting, guarantees that the solder joint fracture does not appear in the scene such as dropping, impact of electronic components, reaches the effect of reinforcing electronic components mechanical reliability. The temperature is easy to change in the use process of the electronic equipment, the thermal expansion coefficient of the underfill is far greater than that of the substrate and the electronic components, the volume change quantity of the underfill when the temperature is changed is far greater than that of a welding spot between the substrate and the electronic components, and the risk of cracking of the welding spot is increased.
Disclosure of Invention
The embodiment of the application provides an electronic component and electronic equipment, which can reduce the risk of cracking welding spots.
An embodiment of the present application provides an electronic component including:
a substrate provided with a plurality of first pads;
the electronic component is provided with a plurality of welding spots, the welding spots enclose a first area and a second area, the density of the welding spots in the first area is smaller than that of the welding spots in the second area, and the electronic component and the substrate are welded with the first welding pads through the welding spots;
The underfill is used for filling gaps between the electronic components and the substrate;
the substrate comprises a third region corresponding to the first region and a fourth region corresponding to the second region, the third region is provided with a filling piece, and the difference between the thermal expansion coefficient of the filling piece and the thermal expansion coefficient of the welding point is smaller than the difference between the thermal expansion coefficient of the underfill and the thermal expansion coefficient of the welding point.
In the embodiment of the application, the filling member is arranged in the third area of the substrate, and can occupy the space between the electronic component and the substrate, so that the space between the electronic component and the substrate for filling the underfill is reduced, the volume of the underfill is reduced, the volume change of the underfill after temperature change is reduced, the risk of cracking of the welding spots caused by the fact that the volume change of the underfill is too large is reduced, the service life of the electronic component is prolonged, and the working stability of the electronic component is improved.
When the difference between the thermal expansion coefficient of the filling piece and the thermal expansion coefficient of the welding point is smaller than the difference between the thermal expansion coefficient of the underfill and the thermal expansion coefficient of the welding point, the thermal expansion coefficient of the filling piece is closer to the thermal expansion coefficient of the welding point than the thermal expansion coefficient of the underfill, so that the volume change amount of the filling piece after temperature change is closer to the volume change amount of the welding point. When the filling piece is arranged between the electronic component and the substrate to reduce the underfill, the volume change difference between the filling piece and the welding spot is small, the risk of cracking of the welding spot caused by temperature change in the volume change process of the filling piece is low, and the strength and the service life of the welding spot are prolonged.
In an embodiment of the present application, the thermal expansion coefficient of the filling member is smaller than the thermal expansion coefficient of the underfill, after the temperature change, the volume change amount of the filling member is smaller than the volume change amount of the underfill expansion of the same volume, and after the temperature change, the volume change amount of the filling member is closer to the volume change amount of the welding spot, so that the filling member does not apply excessive force to the welding spot to cause the welding spot to crack after the temperature change, thereby further reducing the risk of welding spot cracking.
In an embodiment of the application, the filler is not in contact with the electronic component.
In the embodiment of the application, the filling piece is not contacted with the electronic component, even after the processing error and the filling piece are heated and expanded, the risk of interference between the filling piece and the electronic component can be reduced, the risk of deformation of the electronic component and cracking of the welding spots caused by the fact that the filling piece exerts a force far away from the substrate on the electronic component is reduced, the service lives of the welding spots and the electronic component are prolonged, and the working stability and the use safety of the electronic component are improved.
In an embodiment of the present application, the filling member includes a first filling member, and the first filling member may be disposed between adjacent first pads of the third region, and the first filling member may be disposed at a distance from the first pads.
In the embodiment of the application, the first filling piece and the first bonding pad are arranged at intervals, so that the volume of the first filling piece is reduced while the volume of the underfill is reduced, the material required for processing the first filling piece is reduced, and the cost is saved; the distance between the first filling piece and the welding point is reduced, the risk that the welding point is cracked due to the fact that the volume of the first filling piece is increased after the first filling piece is heated and lateral force is generated on the welding point is reduced, and the service life of the welding point is prolonged.
In an embodiment of the present application, the third region may further be provided with the second pad, and the first pad and the second pad may be provided with solder, so that the first pad and the solder joint are soldered by the solder provided on the first pad, and the solder provided on the second pad is the first filler.
In the embodiment of the application, the first filling member is the solder, and the solder and the first filling member for welding the substrate and the electronic component can be formed only by brushing the solder in one step in the processing process, so that the working procedures required by processing the first filling member can be reduced, the production mode of the substrate is simplified, and the production cost of the substrate is reduced.
In an embodiment of the present application, the thickness of the solder may be 30um to 70um.
In the embodiment of the application, the thickness of the solder is 30-70 um, the volume of the underfill is reduced, the risk of short circuit caused by adjacent solder connection is reduced, the working stability and the use safety of the electronic component are improved, and the service life of the electronic component is prolonged.
In an embodiment of the present application, the filling member may further include the second filling member, and both ends of the first filling member are connected to the substrate and the second filling member, respectively.
In the embodiment of the application, the second filling member is arranged above the first filling member, so that compared with the arrangement of only the first filling member, the space between the electronic component and the substrate for filling the underfill is further reduced, the volume of the underfill is further reduced, and the risk of cracking of the welding spots caused by the fact that the underfill exerts an acting force on the electronic component and the substrate due to the fact that the volume change amount is too large is reduced. The second filling piece is connected with the substrate through the first filling piece, so that the connection mode of the second filling piece and the substrate is simplified, the structures of the second filling piece and the substrate are simplified, and the production cost of the second filling piece and the substrate is reduced.
In an embodiment of the present application, the thickness of the second filling member may be 80um to 120um.
In the embodiment of the application, the thickness of the second filling piece can be 80-120 um, the volume of the underfill is reduced, the risk of damaging the electronic component and cracking the welding spot caused by interference of the second filling piece and the electronic component is reduced, the stability of connecting the electronic component and the substrate is improved, and the service life of the electronic component is prolonged.
In an embodiment of the present application, the filling member may include a third filling member covering an area of the third area where the first pad is not disposed.
In an embodiment of the present application, the third filling member covers the third area, and the third filling member can occupy more space between the electronic component and the substrate, so as to further reduce the volume of the underfill filled between the electronic component and the substrate, and reduce the risk of cracking the solder joints caused by the excessive application of force to the electronic component and the substrate by the underfill due to the increase of the volume. And the arrangement position of the third filling piece occupies the space of the second bonding pad and the welding spot welded with the second bonding pad, so that the electronic component and the substrate can be normally welded.
In an embodiment of the present application, the substrate may include a first solder resist layer disposed on the third region and a second solder resist layer disposed on the fourth region, wherein a thickness of the first solder resist layer is greater than a thickness of the second solder resist layer; the third filling piece is the first solder mask layer.
In the embodiment of the application, the first solder mask with larger thickness is the third filling piece, so that more space between the electronic component and the substrate can be occupied, and the risk of cracking of the welding spots caused by the fact that the underfill applies an acting force to the electronic component and the substrate due to overlarge volume change is reduced. When the first solder mask layer located in the third area is used as the third filling member, the first solder mask layer can be used for preventing short circuit, plays a role in preventing cracking of the welding spots, and does not need to arrange other components used for occupying the space of the underfill between the electronic component and the substrate, so that the structure of the electronic component is further simplified.
In an embodiment of the present application, the substrate may include a preset filler paste disposed in the third region and a second solder resist layer disposed in the fourth region, wherein a thickness of the preset filler paste is greater than a thickness of the second solder resist layer; the third filling piece is the preset filling glue.
In an embodiment of the present application, the thickness of the third filling member may be 50um to 150um.
In the embodiment of the application, the thickness of the third filling piece can be 50-150 um, the volume of the underfill is reduced, the risks of damage to the electronic component and cracking of the welding spot caused by interference between the third filling piece and the electronic component are reduced, the stability of connection between the electronic component and the substrate is improved, and the service life of the electronic component is prolonged.
In an embodiment of the present application, the substrate may be a PCB or a package substrate or a silicon wafer, the electronic component may be a silicon wafer, and a minimum gap between the filling member and the adjacent solder joint may be 20um to 200um.
In the embodiment of the application, the minimum gap between the filling piece and the adjacent welding point can be 20-200 um, so that the risk of short circuit caused by connection of the filling piece and the welding point can be reduced, the working stability of the electronic component and the substrate is improved, and the service lives of the electronic component and the substrate are prolonged.
In an embodiment of the present application, the substrate may be a PCB, the electronic component may be a packaged chip, and a minimum gap between the filling member and the adjacent solder joint may be 75um to 200um.
In the embodiment of the application, the minimum gap between the filling piece and the adjacent welding point can be 75-200 um, so that the risk of short circuit caused by connection of the filling piece and the welding point can be reduced, the working stability of the electronic component and the substrate is improved, and the service lives of the electronic component and the substrate are prolonged.
An embodiment of the application provides an electronic device, which comprises the electronic component.
In the embodiment of the application, the filling piece is arranged between the substrate of the electronic component and the electronic component, so that the risk of cracking of the welding spots can be reduced, the service life of the electronic component is prolonged, the working stability of the electronic component is improved, the service performance of the electronic equipment is improved, and the use experience of a user is improved.
It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the application as claimed.
Drawings
FIG. 1 is a schematic diagram of an electronic component according to an embodiment of the present application;
FIG. 2 is a cross-sectional view of the electronic component of FIG. 1;
FIG. 3 is a bottom view of FIG. 2;
FIG. 4 is a top view of the substrate of FIG. 1;
FIG. 5 is a schematic diagram of an electronic component according to another embodiment of the present application;
FIG. 6 is a schematic diagram of an electronic component according to another embodiment of the present application;
FIG. 7 is a schematic diagram of an electronic component according to another embodiment of the present application;
FIG. 8 is a top view of the substrate of FIGS. 6 and 7;
FIG. 9 is a schematic diagram of an electronic component according to another embodiment of the present application;
FIG. 10 is a top view of the substrate of FIG. 9;
fig. 11 is a schematic structural diagram of an electronic component according to another embodiment of the application.
Reference numerals:
10-an electronic component;
1-a substrate;
11-a first bonding pad;
12-a third region;
121-a first filler;
122-a second bonding pad;
123-a second filler;
124-a third filler;
124 a-a first solder mask layer;
124 b-presetting filling glue;
13-fourth region;
131-a second solder mask layer;
2-electronic components;
21-welding spots;
22-a first region;
23-a second region;
3-underfill.
The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the application and together with the description, serve to explain the principles of the application.
Detailed Description
For a better understanding of the technical solution of the present application, the following detailed description of the embodiments of the present application refers to the accompanying drawings.
In one embodiment, the present application is described in further detail below by way of specific embodiments in conjunction with the accompanying drawings.
An embodiment of the present application provides an electronic component 10, as shown in fig. 1 to 8, the electronic component 10 may include a substrate 1 and an electronic component 2, and the substrate 1 may be provided with a plurality of first pads 11; the electronic component 2 may be provided with a plurality of solder joints 21, the solder joints 21 enclose a first area 22 and a second area 23, the density of the solder joints 21 in the first area 22 is smaller than that of the solder joints 21 in the second area 23, and the electronic component 2 and the substrate 1 are soldered with the first solder pads 11 through the solder joints 21.
In the embodiment of the present application, the shapes of the first area 22 and the second area 23 may be quadrilateral, circular, or other irregular shapes, and the embodiment of the present application is not particularly limited to the shapes of the first area 22 and the second area 23. The distribution of the first region 22 and the second region 23 and the region size are determined according to the specific type and application of the electronic component 2, and the present application is not limited to the distribution of the first region 22 and the second region 23 and the region size.
The electronic component 10 according to the embodiment of the present application may further include an underfill 3, where the underfill 3 is used to fill a gap between the electronic component 2 and the substrate 1; the substrate 1 comprises a third region 12 corresponding to the first region 22 and a fourth region 13 corresponding to the second region 23, wherein the third region 12 is provided with a filler, and the difference between the thermal expansion coefficient of the filler and the thermal expansion coefficient of the welding spot 21 is smaller than the difference between the thermal expansion coefficient of the underfill 3 and the thermal expansion coefficient of the welding spot 21.
In the embodiment of the present application, the distribution position, size and shape of the third area 12 in the substrate 1 are adapted to the first area 22 of the electronic component 2, the distribution position, size and shape of the fourth area 13 are adapted to the second area 23 of the electronic component 2, as shown in fig. 4, 8 and 10, the area in the dashed frame represents the structure of the third area 12 in three embodiments, and the portion outside the dashed frame is the fourth area 13 of the corresponding embodiment.
In the embodiment of the present application, as shown in fig. 2 and 3, the distribution of the solder joints 21 on the electronic component 2 is uneven, and in the process of assembling, transporting or using the electronic assembly 10, the problems of deformation of the electronic component 2 or cracking of the solder joints 21 easily occur, which affect the normal operation and service life of the electronic component 2, and the underfill 3 is filled in the gap between the electronic component 2 and the substrate 1, so that the underfill 3 protects the solder joints 21, improving the connection stability of the electronic component 2 and the substrate 1, and prolonging the service life of the electronic component 2. The difference between the thermal expansion coefficient of the underfill 3 and the thermal expansion coefficient of the solder joint 21 is large, and when the temperature of the environment in which the electronic component 10 is used increases or decreases, the volume expansion and contraction variation of the underfill 3 is much larger than that of the solder joint 21, increasing the risk of cracking of the solder joint 21. According to the embodiment of the application, the filling piece is arranged in the third area 12 of the substrate 1, and can occupy the space between the electronic component 2 and the substrate 1, so that the space between the electronic component 2 and the substrate 1 for filling the underfill 3 is reduced, the volume of the underfill 3 is reduced, the volume change amount of the underfill 3 after the temperature change is reduced, the risk of cracking of the welding spot 21 caused by the fact that the volume change of the underfill 3 excessively applies an acting force to the welding spot 21 is reduced, the service life of the electronic component 2 is prolonged, and the working stability is improved.
In the embodiment of the present application, when the difference between the thermal expansion coefficient of the filler and the thermal expansion coefficient of the solder joint 21 is smaller than the difference between the thermal expansion coefficient of the underfill 3 and the thermal expansion coefficient of the solder joint 21, the thermal expansion coefficient of the filler is closer to the thermal expansion coefficient of the solder joint 21 than the thermal expansion coefficient of the underfill 3 and the thermal expansion coefficient of the solder joint 21, so that the volume change amount of the filler after the temperature change is closer to the volume change amount of the solder joint 21. When the filling piece is arranged between the electronic component 2 and the substrate 1 to reduce the underfill 3, the volume change difference between the filling piece and the welding spot 21 is smaller, the risk of cracking the welding spot 21 caused by temperature change in the volume change process of the filling piece is lower, and the service life of the welding spot 21 is prolonged.
In the embodiment of the present application, the underfill 3 between the electronic component 2 and the substrate 1 may be the reworkable underfill 3. The coefficient of thermal expansion of the filler is smaller than the coefficient of thermal expansion of the underfill 3.
In an embodiment of the present application, the thermal expansion coefficient of the filling member may be smaller than the thermal expansion coefficient of the underfill 3, after the temperature change, the volume change amount of the filling member is smaller than the volume change amount of the expansion of the underfill 3 with the same volume, and after the temperature change, the volume change amount of the filling member is closer to the volume change amount of the solder joint 21, so that the filling member will not apply excessive force to the solder joint 21 after the temperature change, resulting in cracking of the solder joint 21, thereby further reducing the risk of cracking of the solder joint 21.
In an embodiment of the present application, as shown in fig. 1, 5 and 6, the filler may not be in contact with the electronic component 2.
In the embodiment of the present application, if the filling member contacts the electronic component 2, the phenomenon that the filling member interferes with the electronic component 2 is easy to occur under the influence of factors such as processing errors and thermal expansion of the filling member, so that the filling member has a risk of applying an acting force to the electronic component 2 away from the substrate 1, and the risk of deforming the electronic component 2, cracking the solder joint 21, and the like is increased. The filling member is not in contact with the electronic component 2, even after the processing error and the filling member is heated and expanded, the risk that the filling member and the electronic component 2 do not interfere is still guaranteed, the risk that the filling member applies a force far away from the substrate 1 to the electronic component 2 to cause the deformation of the electronic component 2 and the cracking of the welding spot 21 is avoided, the service lives of the welding spot 21 and the electronic component 2 are prolonged, and the working stability and the use safety of the electronic component 10 are improved.
In an embodiment of the present application, after the substrate 1 is soldered to the electronic component 2, a minimum gap between the filler and the electronic component 2 may be: 100um,150um,300um, which minimum gap allows the filler to thermally expand without contacting the electronic component 2.
In an embodiment of the present application, as shown in fig. 1 and 4, the filling member may include a first filling member 121, the first filling member 121 may be disposed between adjacent first pads 11 of the third region 12, and the first filling member 121 may be disposed at a distance from the first pads 11.
In the embodiment of the present application, the first filling member 121 may be disposed between the adjacent first bonding pads 11 of the third area 12, and the first filling member 121 and the first bonding pads 11 may be disposed at intervals, so that the volume of the underfill 3 may be reduced, the volume of the first filling member 121 may be reduced, materials required for processing the first filling member 121 may be reduced, and cost may be saved; the first filling member 121 and the first bonding pad 11 may be disposed at intervals, after the electronic component 2 is connected with the substrate 1, a gap may exist between the first filling member 121 and the bonding pad 21, so that the risk that the bonding pad 21 is cracked due to the lateral force generated by the bonding pad 21 due to the increase of the volume of the heated first filling member 121 is reduced, the service life of the bonding pad 21 is prolonged, and the connection stability of the electronic component 2 and the substrate 1 is increased.
In an embodiment of the present application, as shown in fig. 1 and 4, the third area 12 may further be provided with a second pad 122, each of the first pad 11 and the second pad 122 may be provided with solder, the first pad 11 and the solder joint 21 may be soldered by the solder provided on the first pad 11, and the solder provided on the second pad 122 may be the first filler 121.
In the embodiment of the present application, when the substrate 1 and the electronic component 2 are soldered, solder (for example, solder paste) is brushed on each of the first pads 11 of the substrate 1, so that the first pads 11 and the solder joints 21 are soldered by the solder, the connection manner between the first pads 11 and the solder joints 21 can be simplified, the structure of the electronic component 2 and the substrate 1 can be simplified, the size of the electronic component 10 can be reduced, the production cost of the electronic component 10 can be reduced, the space required for mounting the electronic component 10 can be reduced, and the application range of the electronic component 10 can be increased. When the solder is brushed on each first bonding pad 11 of the substrate 1, each second bonding pad 122 of the substrate 1 is brushed with the solder, the first filling member 121 is the solder, and the solder for soldering the substrate 1 and the electronic component 2 and the first filling member 121 can be formed by only one step of brushing the solder in the processing process, so that the working procedures required for processing the first filling member 121 can be reduced, the production mode of the substrate 1 is simplified, and the production cost of the substrate 1 is reduced.
The thickness of the solder may be in the range of 30um to 70um, that is, the thickness of the solder provided on the first pad 11 and the thickness of the solder provided on the second pad 122 may be the same. For example, the thickness of the solder may be: the thickness of the solder used for soldering the first pad 11 and the solder joint 21 may be 50um during the soldering process of the substrate 1 and the electronic component 2, 40um, 50um, 60 um.
In the embodiment of the present application, if the thickness of the solder is too small, the volume of the solder is small, the space occupied by the solder in the gap between the electronic component 2 and the substrate 1 is small, the volume of the underfill 3 is large, the solder joint 21 is easy to break, and when the thickness of the solder of the first pad 11 is too small, the reliability of the soldering between the first pad 11 and the solder joint 21 is too small; if the thickness of the solder is too large, the area of the substrate 1 covered by the solder flowing outward after melting is large during the soldering process of the electronic component 2 and the substrate 1, and there is a risk of short circuit caused by the connection with the adjacent solder. The thickness of the solder can be 30 um-70 um, the volume of the underfill 3 can be reduced, the risk of short circuit caused by adjacent solder connection is reduced, the working stability and the use safety of the electronic component 10 are improved, and the service life of the electronic component 10 is prolonged.
In an embodiment of the present application, as shown in fig. 5, the filling member may further include a second filling member 123, and both ends of the first filling member 121 are connected to the substrate 1 and the second filling member 123, respectively.
In the embodiment of the present application, the second filling member 123 may be disposed above the first filling member 121, where the filling members include the first filling member 121 and the second filling member 123 stacked on each other, and under the condition that the first filling member 121 is disposed between the electronic component 2 and the substrate 1 with the same volume, the disposition of the first filling member 121 and the second filling member 123 between the electronic component 2 and the substrate 1 can reduce the space between the electronic component 2 and the substrate 1 for filling the underfill 3, reduce the volume of the underfill 3, reduce the volume change amount of the underfill 3 after the temperature change, and reduce the risk that the underfill 3 will crack due to the application of force to the electronic component 2 and the substrate 1 due to the volume change amount being too large, compared with the disposition of the first filling member 121 alone. The second filling member 123 is connected with the substrate 1 through the first filling member 121, so that a connection mode of the second filling member 123 and the substrate 1 is simplified, a structure of the second filling member 123 and the substrate 1 is simplified, and production cost of the second filling member 123 and the substrate 1 is reduced.
In the embodiment of the present application, the second filling member 123 may be the same material as the first filling member 121 or may be a material different from the first filling member, as long as the difference between the thermal expansion coefficient of the second filling member 123 and the thermal expansion coefficient of the solder joint 21 is smaller than the difference between the thermal expansion coefficient of the underfill 3 and the thermal expansion coefficient of the solder joint 21.
The thickness of the second filling member 123 may range from 80um to 120um. For example, the thickness of the second filling member 123 may specifically be: 90um, 100um, 110um.
In the embodiment of the present application, if the thickness of the second filling member 123 is too small, the volume of the second filling member 123 is small, the space occupied by the second filling member 123 in the gap between the electronic component 2 and the substrate 1 is small, the volume of the underfill 3 is large, and the breaking of the solder joint 21 is likely to occur; if the thickness of the second filling member 123 is too large, the risk of interference between the second filling member 123 and the electronic component 2 may easily occur during the process of mounting the electronic component 2 on the substrate 1. The thickness of the second filling member 123 may be 80 um-120 um, which can reduce the volume of the underfill 3, reduce the risk of damaging the electronic component 2 and cracking the welding spot 21 caused by interference between the second filling member 123 and the electronic component 2, increase the stability of connection between the electronic component 2 and the substrate 1, prolong the service life of the electronic component 2, and further improve the working stability of the electronic component 10.
In an embodiment of the present application, as shown in fig. 6 and 8, the filling member may further include a third filling member 124, and the third filling member 124 may cover an area of the third area 12 where the solder joint 21 and the first pad 11 are not disposed.
In an embodiment of the present application, the third filling member 124 may cover the third area 12, and the third filling member 124 may occupy more space between the electronic component 2 and the substrate 1, so as to reduce the volume of the underfill 3 filled between the electronic component 2 and the substrate 1, reduce the volume change of the underfill 3 after the temperature change, and reduce the risk of cracking the solder joint 21 caused by applying an excessive force to the electronic component 2 and the substrate 1 by the underfill 3 due to the volume change. The third filler 124 occupies the space between the second pad 122 and the solder joint 21 soldered to the second pad 122, so that the electronic component 2 and the substrate 1 can be soldered normally.
In an embodiment of the present application, as shown in fig. 9 and 10, the packing may include the first packing 121 and the third packing 124; the first filling member 121 may be disposed between adjacent first bonding pads 11 of the third region 12, the third region 12 may further be provided with second bonding pads 122 disposed at intervals from the first bonding pads 11, the first filling member 121 may be disposed on the second bonding pads 122, and the first filling member 121 may be disposed at intervals from the first bonding pads 11; the third filling member 124 may cover an area of the third area 12 where the solder joint 21, the first pad 11, the second pad 122, and the first filling member 121 are not disposed.
In the embodiment of the application, the first filling member 121 and the third filling member 124 are arranged between the electronic component 2 and the substrate 1, so that the volume of the underfill 3 filled between the electronic component 2 and the substrate 1 can be reduced, the volume change of the underfill 3 after the temperature change is reduced, and the risk of cracking the solder joints 21 caused by the fact that the force is applied to the electronic component 2 and the substrate 1 by the underfill 3 due to the excessive volume change is reduced.
In an embodiment of the present application, as shown in fig. 11, the filling member may include the first filling member 121, the second filling member 123, and the third filling member 124; the first filling member 121 may be disposed between adjacent first bonding pads 11 of the third region 12, the third region 12 may be further provided with second bonding pads 122 disposed at intervals from the first bonding pads 11, the first filling member 121 may be disposed on the second bonding pads 122, and the second filling member 123 may be disposed on the first filling member 121, so that the first filling member 121 and the second filling member 123 are disposed at intervals from the first bonding pads 11; the third filling member 124 may cover the area of the third area 12 where the solder joint 21, the first pad 11, the second pad 122, the first filling member 121, and the second filling member 123 are not disposed.
In the embodiment of the present application, the first filling member 121, the second filling member 123 and the third filling member 124 are disposed between the electronic component 2 and the substrate 1, so that the volume of the underfill 3 filled between the electronic component 2 and the substrate 1 can be further reduced, the volume change of the underfill 3 after the temperature change is reduced, and the risk that the solder joint 21 is cracked due to the fact that the force is applied to the electronic component 2 and the substrate 1 by the underfill 3 due to the excessive volume change is reduced.
In an embodiment of the present application, as shown in fig. 6, 9 and 10, the substrate 1 may include a first solder resist layer 124a disposed at the third region 12 and a second solder resist layer 131 disposed at the fourth region 13, and a thickness of the first solder resist layer 124a may be greater than a thickness of the second solder resist layer 131; in an embodiment of the present application, the third filler 124 is the first solder mask 124a.
In the embodiment of the present application, the first solder mask layer 124a and the second solder mask layer 131 may be made of insulating materials, and the first solder mask layer 124a can insulate the adjacent second pads 122 located in the third area 12, can insulate the adjacent welding spots 21 where the second pads 122 are welded to the electronic component 1, and reduces the risk of short-circuiting caused by electrical connection between the adjacent second pads 122 and the adjacent welding spots 21; the second solder mask 131 can insulate the adjacent first pads 11 located in the fourth area 13, and can insulate the adjacent solder joints 21 between the first pads 11 and the electronic component 2, so as to reduce the risk of short-circuiting due to electrical connection between the adjacent first pads 11 and the adjacent solder joints 21, and improve the working stability and the use safety of the electronic component 10. The third filling member 124 may be the first solder mask layer 124a with a larger thickness, and may occupy more space between the electronic component 2 and the substrate 1, so as to reduce the volume of the underfill 3 filled between the electronic component 2 and the substrate 1, reduce the volume change of the underfill 3 after the temperature change, and reduce the risk that the underfill 3 applies an acting force to the electronic component 2 and the substrate 1 due to the excessive volume change to crack the solder joint 21.
The third filler 124 (may be the first solder mask 124a having a thickness greater than that of the second solder mask 131) is already covered on the third region 12 when the substrate 1 is fed, so that the process of mounting the third filler 124 on the substrate 1 can be simplified, and the production cost of the electronic component 10 can be reduced. When the first solder mask 124a located in the third area 12 is used as the third filler 124, the first solder mask 124a can be used to prevent short circuits and cracking of the solder joint 21, and other components for occupying the space of the underfill 3 are not required to be disposed between the electronic component 2 and the substrate 1, so that the structure of the electronic component 10 is simplified.
The first solder resist layer 124a and the second solder resist layer 131 may be specifically ink. In an embodiment of the present application, the thickness of the first solder mask layer 124a may be 50um to 150um, and correspondingly, the thickness of the second solder mask layer 131 may be 10um to 30um.
In an embodiment of the present application, as shown in fig. 7, the substrate 1 may include a preset paste 124b disposed in the third region 12 and the second solder resist layer 131 disposed in the fourth region 13, and a thickness of the preset paste 124b may be greater than a thickness of the second solder resist layer 131; the third filler 124 is the pre-filling compound 124b, and the difference between the thermal expansion coefficient of the pre-filling compound 124b and the thermal expansion coefficient of the solder joint 21 may be smaller than the difference between the thermal expansion coefficient of the underfill compound 3 and the thermal expansion coefficient of the solder joint 21.
In the embodiment of the present application, the preset filling glue 124b with a larger thickness is the third filling member 124, which can occupy more space between the electronic component 2 and the substrate 1, reduce the volume of the underfill glue 3 filled between the electronic component 2 and the substrate 1, reduce the volume change of the underfill glue 3 after the temperature change, and reduce the risk of cracking the solder joint 21 caused by applying an acting force to the electronic component 2 and the substrate 1 by the underfill glue 3 due to the excessive volume change.
The pre-filling glue 124b may be a glue different from the underfill glue 3, and the coefficients of thermal expansion of the pre-filling glue and the underfill glue may be different, and the coefficient of thermal expansion of the filling member 124b may be smaller than the coefficient of thermal expansion of the underfill glue 3.
In an embodiment of the present application, the thickness of the third filler 124 may range from 50um to 150um. For example, the thickness of the third filler 124 may specifically be: 50um, 100um, 150um.
In the embodiment of the present application, if the thickness of the third filling member 124 is too small, the volume of the third filling member 124 is small, the space occupied by the third filling member 124 in the gap between the electronic component 2 and the substrate 1 is small, the volume of the underfill 3 is large, and the breaking of the solder joint 21 is likely to occur; if the thickness of the third filling member 124 is too large, the electronic component 2 is likely to interfere with the electronic component 2 during the process of soldering the electronic component 2 to the substrate 1. The thickness of the third filling member 124 may be 50 um-150 um, which reduces the volume of the underfill 3, reduces the risk of damaging the electronic component 2 and cracking the solder joint 21 caused by interference between the third filling member 124 and the electronic component 2, increases the connection stability of the electronic component 2 and the substrate 1, prolongs the service life of the electronic component 2, and improves the working stability of the electronic component 10.
In an embodiment of the present application, the electronic component 2 may be a silicon chip, and the substrate 1 may be a package substrate, a PCB, or a silicon chip. The minimum gap between the filling member (which may be the first filling member 121 and/or the second filling member 123) and the adjacent second bonding pad 122 (or the bonding pad 21) may be 20um to 200um, for example, the minimum gap between the filling member and the adjacent second bonding pad 122 (or the bonding pad 21) may be: 20um, 100um, 150um, 200um.
In the embodiment of the present application, the minimum gap between the filling member (the first filling member 121 and/or the second filling member 123) and the adjacent second bonding pad 122 (or the bonding pad 21) is too small, and the filling member has a risk of contacting with the adjacent second bonding pad 122 (or the bonding pad 21) to cause short circuit during the operation of the electronic component 10, so that the safety of the electronic component 10 is reduced; the distance between the adjacent second bonding pads 122 (or the bonding pads 21) is certain, the distance between the filling member and the adjacent second bonding pads 122 (or the bonding pads 21) is too large, the minimum gap between the filling member and other adjacent second bonding pads 122 (or the bonding pads 21) is too small, the risk of short circuit caused by the contact of the filling member with other adjacent second bonding pads 122 (or the bonding pads 21) exists in the working process of the electronic component 10, when the minimum gap between the filling member and the adjacent second bonding pads 122 (or the bonding pads 21) is too large, the volume of the underfill 3 filled between the filling member and the adjacent second bonding pads 122 (or the bonding pads 21) is too large, and when the temperature changes, the underfill 3 with the too large volume expands or contracts to cause the bonding pads 21 to crack. The minimum gap between the filling member and the second bonding pad 122 (or the bonding pad 21) adjacent thereto may be 20 um-200 um, which reduces the risk of short-circuiting due to connection between the filling member and the second bonding pad 122 (or the bonding pad 21), increases the stability of the operation of the electronic component 2 and the substrate 1, and prolongs the service lives of the electronic component 2 and the substrate 1.
The minimum gap between the filler and the adjacent second pad 122 (or the pad 21) may be the same as or different from the minimum gap between the adjacent first pad 11 in the fourth region 13. Typically, the minimum gap between adjacent first pads 11 in the fourth region 13 may be 20um to 200um.
In an embodiment of the present application, the substrate 1 may be a PCB, the electronic component 2 may be a packaged chip, and the electronic assembly 10 may be a circuit board assembly. The minimum gap between the filling member (which may be the first filling member 121 and/or the second filling member 123) and the adjacent second bonding pad 122 (or the bonding pad 21) may be 75um to 200um, for example, the minimum gap between the filling member and the adjacent second bonding pad 122 (or the bonding pad 21) may be: 75um, 150um, 200um.
In an embodiment of the present application, for similar reasons, the minimum gap between the filling member and the adjacent second bonding pad 122 (or the bonding pad 21) may be 75um to 200um, which reduces the risk of short-circuiting due to the connection between the filling member and the second bonding pad 122 (or the bonding pad 21), increases the stability of the operation of the electronic component 2 and the substrate 1, and prolongs the service lives of the electronic component 2 and the substrate 1.
The minimum gap between the filling member and the adjacent second pad 122 may be the same as or different from the minimum gap between the adjacent first pad 11 in the fourth region 13. Typically, the minimum gap between adjacent first pads 11 in the fourth region 13 may be 75um to 200um.
In an embodiment of the present application, as shown in fig. 3 and 8, the center distance of the pads 21 in the first region 22 of the electronic component 2 and the center distance of the second pads 122 in the third region 12 of the substrate 1 may be 50um to 650um, the direction is in the horizontal or vertical direction, the center distance of the pads 21 in the second region 23 and the center distance of the first pads 11 in the fourth region 13 may be 300um to 500um, and the direction is in the diagonal direction. In addition, the thickness of the solder joint 21 may be 75um to 300um.
The embodiment of the application also provides an electronic device comprising the electronic assembly 10 described in any of the above embodiments. The electronic device may be a camera, a cell phone, a tablet computer, a desktop computer, a laptop computer, a handheld computer, a notebook computer, an ultra-mobile personal computer (UMPC), a netbook, a cellular telephone, a personal digital assistant (personal digital assistant, PDA), an augmented reality (augmented reality, AR) device, a Virtual Reality (VR) device, an artificial intelligence (artificial intelligence, AI) device, a wearable device, a vehicle-mounted device, a smart home device, and/or a smart city device, and embodiments of the application are not particularly limited as to the particular type of electronic device.
In the embodiment of the present application, the filler is disposed between the substrate 1 and the electronic component 2 of the electronic component 10, which reduces the risk of cracking of the solder joint 21, prolongs the service life of the electronic component 10, improves the working stability of the electronic component 10, increases the usability of the electronic device, and improves the use experience of the user.
It is noted that a portion of this patent document contains material which is subject to copyright protection. The copyright owner has reserved copyright rights, except for making copies of patent documents or recorded patent document content of the patent office.
Claims (15)
1. An electronic assembly, the electronic assembly comprising: the electronic component comprises a substrate, an electronic component and underfill;
the substrate is provided with a plurality of first bonding pads;
the electronic component is provided with a plurality of welding spots, the welding spots enclose a first area and a second area, the density of the welding spots in the first area is smaller than that of the welding spots in the second area, and the electronic component and the substrate are welded with the first welding pads through the welding spots;
the underfill is used for filling gaps between the electronic components and the substrate;
The substrate comprises a third region corresponding to the first region and a fourth region corresponding to the second region, the first region and the third region are oppositely arranged along the thickness direction of the electronic component, the first bonding pad in the third region and the welding point in the first region are correspondingly welded, the third region is provided with a filling piece, and the difference value between the thermal expansion coefficient of the filling piece and the thermal expansion coefficient of the welding point is smaller than the difference value between the thermal expansion coefficient of the underfill and the thermal expansion coefficient of the welding point.
2. The electronic assembly of claim 1, wherein the filler has a coefficient of thermal expansion that is less than a coefficient of thermal expansion of the underfill.
3. The electronic assembly of claim 1, wherein the filler is not in contact with the electronic component.
4. The electronic assembly of claim 3, wherein the filler comprises a first filler disposed between adjacent ones of the first pads of the third region, the first filler being spaced apart from the first pads.
5. The electronic component of claim 4, wherein the third region is further provided with a second pad, the first pad and the second pad are each provided with solder such that between the first pad and the solder joint, the solder provided to the second pad is the first filler, and the solder provided to the first pad is soldered to the solder joint.
6. The electronic assembly of claim 5, wherein the solder has a thickness of 30um to 70um.
7. The electronic assembly of claim 5, wherein the filler further comprises a second filler, and wherein the first filler is connected to the substrate and the second filler at each end.
8. The electronic assembly of claim 7, wherein the second filler has a thickness of 80um to 120um.
9. The electronic assembly of any of claims 3-8, wherein the filler comprises a third filler that covers an area of the third area where the first pads are not disposed.
10. The electronic assembly of claim 9, wherein the substrate comprises a first solder mask layer disposed on the third region and a second solder mask layer disposed on the fourth region, the first solder mask layer having a thickness greater than a thickness of the second solder mask layer;
the third filling piece is the first solder mask layer.
11. The electronic assembly of claim 9, wherein the substrate comprises a pre-filled paste disposed in the third region and a second solder resist layer disposed in the fourth region, the pre-filled paste having a thickness greater than a thickness of the second solder resist layer;
The third filling piece is the preset filling glue.
12. The electronic assembly of claim 9, wherein the thickness of the third filler is 50um to 150um.
13. The electronic assembly of any one of claims 1-8, wherein the substrate is a PCB or a package substrate or a silicon wafer, the electronic component is a silicon wafer, and a minimum gap between the filler and the adjacent solder joint is 20-200 um.
14. The electronic assembly of any one of claims 1-8, wherein the substrate is a PCB and the electronic component is a packaged chip, and a minimum gap between the filler and adjacent solder joints is 75 um-200 um.
15. An electronic device, characterized in that it comprises an electronic assembly according to any one of claims 1 to 14.
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| CN202111068944.9A CN113923865B (en) | 2021-09-13 | 2021-09-13 | Electronic component and electronic equipment |
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| US5891754A (en) * | 1997-02-11 | 1999-04-06 | Delco Electronics Corp. | Method of inspecting integrated circuit solder joints with x-ray detectable encapsulant |
| US6121689A (en) * | 1997-07-21 | 2000-09-19 | Miguel Albert Capote | Semiconductor flip-chip package and method for the fabrication thereof |
| US6774497B1 (en) * | 2003-03-28 | 2004-08-10 | Freescale Semiconductor, Inc. | Flip-chip assembly with thin underfill and thick solder mask |
| CN110429066A (en) * | 2019-07-29 | 2019-11-08 | 上海先方半导体有限公司 | A kind of electronic encapsulation device and bottom embankment method |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4340578B2 (en) * | 2004-04-09 | 2009-10-07 | 富士通株式会社 | Component mounting board and component mounting structure |
| US9673065B2 (en) * | 2013-07-18 | 2017-06-06 | Texas Instruments Incorporated | Semiconductor substrate having stress-absorbing surface layer |
| US10834826B2 (en) * | 2016-02-25 | 2020-11-10 | Huawei Technologies Co., Ltd. | Glue dispensing method and circuit board |
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Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5891754A (en) * | 1997-02-11 | 1999-04-06 | Delco Electronics Corp. | Method of inspecting integrated circuit solder joints with x-ray detectable encapsulant |
| US6121689A (en) * | 1997-07-21 | 2000-09-19 | Miguel Albert Capote | Semiconductor flip-chip package and method for the fabrication thereof |
| US6774497B1 (en) * | 2003-03-28 | 2004-08-10 | Freescale Semiconductor, Inc. | Flip-chip assembly with thin underfill and thick solder mask |
| CN110429066A (en) * | 2019-07-29 | 2019-11-08 | 上海先方半导体有限公司 | A kind of electronic encapsulation device and bottom embankment method |
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