CN113923865A - Electronic assembly and electronic equipment - Google Patents
Electronic assembly and electronic equipment Download PDFInfo
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- CN113923865A CN113923865A CN202111068944.9A CN202111068944A CN113923865A CN 113923865 A CN113923865 A CN 113923865A CN 202111068944 A CN202111068944 A CN 202111068944A CN 113923865 A CN113923865 A CN 113923865A
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- electronic component
- filler
- substrate
- solder
- underfill
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/111—Pads for surface mounting, e.g. lay-out
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Wire Bonding (AREA)
Abstract
The application relates to an electronic assembly and electronic equipment, comprising a substrate, an electronic component and underfill; the substrate is provided with a plurality of first bonding pads; the electronic component is provided with a plurality of welding spots, the welding spot density of a first area surrounded by the welding spots is smaller than that of a second area, and the electronic component and the substrate are welded with the first welding spots through the welding spots; the underfill is used for filling a gap between the electronic component and the substrate; the substrate comprises a third area corresponding to the first area and a fourth area corresponding to the second area, the third area is provided with a filling piece, the difference between the thermal expansion coefficient of the filling piece and the thermal expansion coefficient of the welding point is smaller than the difference between the thermal expansion coefficient of the underfill and the thermal expansion coefficient of the welding point, the thermal expansion coefficient of the filling piece is usually smaller than the thermal expansion coefficient of the reworkable underfill used by the electronic component, the fatigue stress of the underfill on the welding point in the temperature cyclic variation process is reduced, and the risk of cracking of the welding point is relieved.
Description
Technical Field
The present application relates to the field of electronic devices, and in particular, to an electronic component and an electronic device.
Background
Among the present electronic equipment, PCB and electronic components pass through solder joint and pad and realize connecting, because there is the clearance after PCB and electronic components connect, electronic components is lower with PCB's reliability of being connected in the use, can fill underfill between electronic components and PCB usually, and the mode through the thermosetting makes underfill to solidify, and guarantee electronic components does not appear the solder joint fracture under scenes such as falling, impact, reaches the effect of reinforcing electronic components mechanical reliability. The temperature is easy to change in the use process of the electronic equipment, the thermal expansion coefficient of the underfill is far larger than that of the substrate and the electronic component, and the volume change of the underfill is far larger than that of a welding point between the substrate and the electronic component when the temperature is changed, so that the risk of cracking of the welding point is increased.
Disclosure of Invention
The embodiment of the application provides an electronic assembly and electronic equipment, which can reduce the risk of cracking of welding spots.
An embodiment of the present application provides an electronic component, including:
a substrate provided with a plurality of first pads;
the electronic component is provided with a plurality of welding spots, the welding spots are encircled to form a first area and a second area, the welding spot density of the first area is smaller than that of the second area, and the electronic component and the substrate are welded with the first welding disc through the welding spots;
the underfill is used for filling a gap between the electronic component and the substrate;
the substrate comprises a third area corresponding to the first area and a fourth area corresponding to the second area, a filling piece is arranged in the third area, and the difference between the thermal expansion coefficient of the filling piece and the thermal expansion coefficient of the welding point is smaller than the difference between the thermal expansion coefficient of the underfill and the thermal expansion coefficient of the welding point.
In the embodiment of this application, the base plate the third region is provided with the filler, the filler can occupy electronic components with space between the base plate reduces electronic components with be used for filling between the base plate the space of underfill reduces the volume of underfill has reduced the volume change volume after the temperature change of underfill has reduced because the underfill volume change is too big right electronic components with the effort is applyed to the base plate and leads to the risk of solder joint fracture has prolonged electronic components's life has promoted electronic component's job stabilization nature.
When the difference between the thermal expansion coefficient of the filling piece and the thermal expansion coefficient of the welding point is smaller than the difference between the thermal expansion coefficient of the underfill and the thermal expansion coefficient of the welding point, the thermal expansion coefficient of the filling piece is closer to the thermal expansion coefficient of the welding point than the thermal expansion coefficient of the underfill, so that the volume change amount of the filling piece after the temperature change is closer to the volume change amount of the welding point. When the filling piece is arranged between the electronic component and the substrate to reduce the underfill, the volume variation difference between the filling piece and the welding spot is small, the risk of cracking of the welding spot in the volume variation process of the filling piece due to temperature variation is low, and the strength and the service life of the welding spot are prolonged.
In the embodiment of the application, the thermal expansion coefficient of the filling piece is smaller than that of the underfill, after the temperature is changed, the volume change amount of the filling piece is smaller than that of the underfill with the same volume, and the volume change amount of the filling piece is closer to that of the welding point after the temperature is changed, so that the filling piece does not apply excessive acting force to the welding point to cause the welding point to crack after the temperature is changed, and the risk of cracking of the welding point is further reduced.
In an embodiment of the present application, the filler is not in contact with the electronic component.
In the embodiment of this application, the filler with electronic components contactless, even at machining error with the filler is heated the inflation after, still can reduce the filler with the risk that electronic components interfered reduces the filler is right electronic components applys and keeps away from the effort of base plate leads to electronic components warp the risk of solder joint fracture prolongs the solder joint with electronic components's life increases electronic component's job stabilization nature and safety in utilization.
In an embodiment of the present application, the filling member includes a first filling member, and the first filling member may be disposed between adjacent first pads of the third region, the first filling member being disposed at a distance from the first pads.
In the embodiment of the application, the first filling piece and the first bonding pad are arranged at intervals, so that the volume of the underfill is reduced, the volume of the first filling piece is reduced, the material required for processing the first filling piece is reduced, and the cost is saved; the distance exists between the first filling piece and the welding spot, the risk that the welding spot is cracked due to the fact that the volume of the first filling piece is increased after the first filling piece is heated and lateral force is generated on the welding spot is reduced, and the service life of the welding spot is prolonged.
In an embodiment of the application, the third area may be further provided with the second pad, and the first pad and the second pad are both provided with solder, so that the first pad and the solder joint are welded by the solder arranged on the first pad, and the solder arranged on the second pad is the first filling member.
In the embodiment of the application, the first filling member is the solder, and in the processing process, the solder and the first filling member for welding the substrate and the electronic component can be formed by only one step of brushing the solder, so that the processes required in the processing of the first filling member can be reduced, the production mode of the substrate is simplified, and the production cost of the substrate is reduced.
In an embodiment of the present application, the solder may have a thickness of 30um to 70 um.
In the embodiment of this application, the thickness of solder is 30um ~ 70um, has reduced the underfill volume has reduced adjacent the solder connection leads to the risk of short circuit, has increased electronic component's job stabilization nature and safety in utilization have prolonged electronic component's life.
In an embodiment of the present application, the filling member may further include the second filling member, and both ends of the first filling member are respectively connected to the substrate and the second filling member.
In the embodiment of this application, set up the second filler above first filler, compare with only setting up first filler, can further reduce electronic components with be used for filling between the base plate the space of underfill, further reduce the volume of underfill reduces underfill because the volume change volume is too big to electronic components with the base plate exerts the effort and leads to the risk of solder joint fracture. The second filling member is connected with the substrate through the first filling member, so that the connection mode of the second filling member and the substrate is simplified, the structure of the second filling member and the substrate is simplified, and the production cost of the second filling member and the substrate is reduced.
In an embodiment of the present application, the thickness of the second filling member may be 80um to 120 um.
In the embodiment of this application, the thickness of second filler can be 80um ~ 120um, has reduced the underfill volume has reduced the second filler with electronic components interferes and leads to electronic components damages the risk of solder joint fracture has increased electronic components with the stability that the base plate is connected prolongs electronic components's life.
In an embodiment of the present application, the filling member may include a third filling member covering a region where the first pad is not disposed in the third region.
In the embodiment of the application, the third filling member covers the third area, and the third filling member can occupy more space between the electronic component and the substrate, so that the volume of the underfill filled between the electronic component and the substrate is further reduced, and the risk that the underfill is cracked due to the fact that the volume of the underfill is too large to exert the acting force on the electronic component and the substrate is reduced. The third filling piece occupies the space between the second welding pad and the welding spot welded with the second welding pad, so that the electronic component and the substrate can be normally welded.
In an embodiment of the present application, the substrate may include a first solder resist layer provided in the third region and a second solder resist layer provided in the fourth region, a thickness of the first solder resist layer being greater than a thickness of the second solder resist layer; the third filling member is the first solder resist layer.
In the embodiment of the application, the first solder mask layer with larger thickness is the third filling piece, so that more spaces between the electronic component and the substrate can be occupied, and the risk that the underfill is cracked due to the fact that the volume change is overlarge to the electronic component and the substrate to apply acting force is reduced. When the first solder mask layer located in the third area is used as the third filling member, the first solder mask layer can be used for preventing short circuit and preventing the welding spot from cracking, other parts which are used for occupying the space of the underfill do not need to be arranged between the electronic component and the substrate, and the structure of the electronic component is further simplified.
In an embodiment of the application, the substrate may include a preset filling adhesive disposed in the third region and a second solder resist layer disposed in the fourth region, and a thickness of the preset filling adhesive is greater than a thickness of the second solder resist layer; the third filling piece is the preset filling glue.
In an embodiment of the present application, the thickness of the third filling member may be 50um to 150 um.
In the embodiment of this application, the thickness of third filler can be 50um ~ 150um, has reduced the underfill volume has reduced the third filler with electronic components interferes and leads to electronic components damages the risk of solder joint fracture has increased electronic components with the stability that the base plate is connected prolongs electronic components's life.
In the embodiment of the application, the substrate can be a PCB (printed Circuit Board) or a packaging substrate or a silicon wafer, the electronic component can be a silicon wafer, and the minimum gap between the filling piece and the adjacent welding spot can be 20 um-200 um.
In the embodiment of this application, the filler piece is with adjacent minimum clearance between the solder joint can be 20um ~ 200um, can reduce the filler piece with the solder joint is connected and the risk of short circuit, has increased electronic components with the stability of base plate work has prolonged electronic components with the life of base plate.
In the embodiment of the application, the substrate can be a PCB, the electronic component can be a packaged chip, and the minimum gap between the filling piece and the adjacent welding spot can be 75 um-200 um.
In the embodiment of this application, the filler piece is with adjacent minimum clearance between the solder joint can be 75um ~ 200um, can reduce the filler piece with the solder joint is connected and the risk of short circuit, has increased electronic components with the stability of base plate work has prolonged electronic components with the life of base plate.
An embodiment of the application provides an electronic device, which includes the electronic component described in any one of the above items.
In the embodiment of the application, electronic component the base plate with set up between the electronic components filler piece can reduce the risk of solder joint fracture has prolonged electronic component's life has promoted electronic component's job stabilization nature has increased electronic equipment's performance promotes user's use experience.
It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the application.
Drawings
FIG. 1 is a schematic structural diagram of an electronic assembly provided herein in one embodiment;
FIG. 2 is a cross-sectional view of the electronic component of FIG. 1;
FIG. 3 is a bottom view of FIG. 2;
FIG. 4 is a top view of the substrate of FIG. 1;
FIG. 5 is a schematic structural diagram of an electronic assembly provided herein in yet another embodiment;
FIG. 6 is a schematic structural diagram of an electronic assembly provided herein in another embodiment;
FIG. 7 is a schematic structural diagram of an electronic assembly provided in the present application in another embodiment;
FIG. 8 is a top view of the substrate of FIGS. 6 and 7;
FIG. 9 is a schematic structural diagram of an electronic assembly provided in the present application in another embodiment;
FIG. 10 is a top view of the substrate of FIG. 9;
fig. 11 is a schematic structural diagram of an electronic component provided in the present application in another embodiment.
Reference numerals:
10-an electronic component;
1-a substrate;
11-a first pad;
12-a third zone;
121-a first filler piece;
122-a second pad;
123-a second filling member;
124-a third infill;
124 a-first solder mask layer;
124 b-preset filling glue;
13-a fourth region;
131-a second solder mask layer;
2-electronic components;
21-welding spots;
22-a first area;
23-a second region;
3-underfill.
The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the present application and together with the description, serve to explain the principles of the application.
Detailed Description
For better understanding of the technical solutions of the present application, the following detailed descriptions of the embodiments of the present application are provided with reference to the accompanying drawings.
In one embodiment, the present application is described in further detail below with reference to specific embodiments and accompanying drawings.
An embodiment of the present application provides an electronic component 10, as shown in fig. 1 to 8, where the electronic component 10 may include a substrate 1 and an electronic component 2, and the substrate 1 may be provided with a plurality of first pads 11; the electronic component 2 may be provided with a plurality of solder joints 21, the solder joints 21 enclose a first area 22 and a second area 23, the density of the solder joints 21 in the first area 22 is less than that of the solder joints 21 in the second area 23, and the electronic component 2 and the substrate 1 are soldered to the first solder joints 11 through the solder joints 21.
In the embodiment of the present application, the shapes of the first region 22 and the second region 23 may be quadrangles, circle centers, or other irregular shapes, and the shape of the first region 22 and the second region 23 is not particularly limited in the embodiment of the present application. The distribution and the size of the first region 22 and the second region 23 are determined according to the type and the use of the electronic component 2, and the distribution and the size of the first region 22 and the second region 23 are not limited in the present application.
The electronic assembly 10 according to the embodiment of the present application may further include an underfill 3, where the underfill 3 is used to fill a gap between the electronic component 2 and the substrate 1; the substrate 1 comprises a third area 12 corresponding to the first area 22 and a fourth area 13 corresponding to the second area 23, the third area 12 is provided with a filling member, and the difference between the thermal expansion coefficient of the filling member and the thermal expansion coefficient of the welding point 21 is smaller than the difference between the thermal expansion coefficient of the underfill 3 and the thermal expansion coefficient of the welding point 21.
In the embodiment of the present application, the distribution position, size, and shape of the third region 12 in the substrate 1 are adapted to the first region 22 of the electronic component 2, and the distribution position, size, and shape of the fourth region 13 are adapted to the second region 23 of the electronic component 2, as shown in fig. 4, 8, and 10, a region in a dashed line frame indicates a structure of the third region 12 in three embodiments, and a portion outside the dashed line frame is the fourth region 13 of the corresponding embodiment.
In the embodiment of the application, as shown in fig. 2 and 3, on the electronic component 2, the solder joints 21 are unevenly distributed, and in the process of assembling, transporting or using the electronic component 10, the electronic component 2 is easy to deform or the solder joints 21 crack and the like, which affect the normal work and the service life of the electronic component 2, the electronic component 2 and the gap between the substrates 1 are filled with the underfill 3, so that the solder joints 21 are protected by the underfill 3, the electronic component 2 and the substrate 1 are connected with each other stably, and the service life of the electronic component 2 is prolonged. The difference between the thermal expansion coefficient of the underfill 3 and the thermal expansion coefficient of the solder joint 21 is large, and when the temperature of the use environment of the electronic component 10 increases or decreases, the volume expansion and contraction variation of the underfill 3 is much larger than that of the solder joint 21, which increases the risk of cracking of the solder joint 21. This application embodiment is in base plate 1 third region 12 is provided with the packing, the packing can occupy electronic components 2 with space between the base plate 1 has reduced electronic components 2 with be used for filling between the base plate 1 underfill 3's space has reduced underfill 3's volume has reduced underfill 3 volume change's volume after the temperature change volume has reduced because underfill 3 volume change is too big right the effort is applyed to solder joint 21 and has leaded to the risk of solder joint 21 fracture has prolonged electronic components 2's life, the job stabilization nature that has promoted.
In the embodiment of the present application, when the difference between the thermal expansion coefficient of the filler and the thermal expansion coefficient of the solder joint 21 is smaller than the difference between the thermal expansion coefficient of the underfill 3 and the thermal expansion coefficient of the solder joint 21, the thermal expansion coefficient of the filler is closer to the thermal expansion coefficient of the solder joint 21 than the thermal expansion coefficient of the underfill 3 and the thermal expansion coefficient of the solder joint 21, so that the volume change amount of the filler after temperature change is closer to the volume change amount of the solder joint 21. When the filling piece is arranged between the electronic component 2 and the substrate 1 to reduce the underfill 3, the volume variation difference between the filling piece and the solder joint 21 is small, the risk of cracking of the solder joint 21 caused by temperature change in the volume variation process of the filling piece is low, and the service life of the solder joint 21 is prolonged.
In the embodiment of the present application, the underfill 3 between the electronic component 2 and the substrate 1 may be a reworkable underfill 3. The coefficient of thermal expansion of the filler is less than the coefficient of thermal expansion of the underfill 3.
In the embodiment of the present application, the thermal expansion coefficient of the filler may be smaller than that of the underfill 3, after the temperature is changed, the volume change amount of the filler is smaller than the volume change amount of the underfill 3 with the same volume, and the volume change amount of the filler after the temperature is changed is closer to that of the solder joint 21, so that the filler does not exert an excessive acting force on the solder joint 21 after the temperature is changed to cause the solder joint 21 to crack, thereby further reducing the risk of cracking of the solder joint 21.
In the embodiment of the present application, as shown in fig. 1, 5, and 6, the filler and the electronic component 2 may not be in contact.
In this application embodiment, if the filler with electronic component 2 contacts, machining error under the influence of factors such as filler thermal expansion, take place easily the filler with the phenomenon that electronic component 2 interferes makes the filler exist right electronic component 2 applys and keeps away from the risk of the effort of base plate 1 has increased electronic component 2 warp risk such as solder joint 21 fracture. The filler is not in contact with the electronic component 2, so that even after processing errors and thermal expansion of the filler, the risk of interference between the filler and the electronic component 2 can be still avoided, the risk that the filler applies an acting force on the electronic component 2 far away from the substrate 1 to cause deformation of the electronic component 2 and cracking of the welding spot 21 is avoided, the service lives of the welding spot 21 and the electronic component 2 are prolonged, and the working stability and the use safety of the electronic component 10 are improved.
In an embodiment of the present application, after the substrate 1 is soldered to the electronic component 2, the minimum gap between the filling member and the electronic component 2 may be: 100um, 150um, 300um, this minimum clearance makes when the filler is heated the inflation with electronic components 2 contactless.
In the embodiment of the present application, as shown in fig. 1 and 4, the filling member may include a first filling member 121, the first filling member 121 may be disposed between adjacent first pads 11 of the third region 12, and the first filling member 121 and the first pads 11 may be disposed at an interval.
In the embodiment of the present application, the first filling member 121 may be disposed between the adjacent first pads 11 of the third region 12, and the first filling member 121 and the first pads 11 may be disposed at an interval, so that the volume of the underfill 3 may be reduced, the volume of the first filling member 121 may be reduced, the material required for processing the first filling member 121 is reduced, and the cost is saved; first filler 121 with first pad 11 can the interval set up, works as electronic components 2 with the back is connected to base plate 1, first filler 121 with there can be the clearance between the solder joint 21, reduce volume increase and right after first filler 121 is heated solder joint 21 produces the yawing force and leads to solder joint 21 risk of ftractureing has promoted solder joint 21's life, has increased electronic components 2 with the steadiness that base plate 1 connects.
In the embodiment of the present application, as shown in fig. 1 and 4, the third region 12 may further be provided with a second pad 122, the first pad 11 and the second pad 122 may both be provided with solder, the first pad 11 and the solder joint 21 may be welded by the solder provided on the first pad 11, and the solder provided on the second pad 122 may be the first filler 121.
In the embodiment of the present application, when the substrate 1 and the electronic component 2 are soldered, a solder (for example, solder paste) is applied to each of the first pads 11 of the substrate 1, so that the first pads 11 and the solder joints 21 are soldered by the solder, which can simplify a connection manner between the first pads 11 and the solder joints 21, simplify a structure of the electronic component 2 and the substrate 1, reduce a size of the electronic component 10, reduce a production cost of the electronic component 10, reduce a space required for mounting the electronic component 10, and increase an application range of the electronic component 10. When the solder is brushed on each first pad 11 of the substrate 1, the solder is brushed on each second pad 122 of the substrate 1, the first filler 121 is the solder, and in the processing process, the solder for soldering the substrate 1 and the electronic component 2 and the first filler 121 can be formed only by brushing the solder in one step, so that the processes required in processing the first filler 121 can be reduced, the production mode of the substrate 1 can be simplified, and the production cost of the substrate 1 can be reduced.
The thickness of the solder may be in a range of 30um to 70um, that is, the thickness of the solder provided to the first pad 11 may be the same as the thickness of the solder provided to the second pad 122. For example, the thickness of the solder may be: 40um, 50um, 60um base plate 1 with in the 2 welding process of electronic components, be used for the welding first pad 11 with solder joint 21 the thickness of solder can be 50 um.
In the embodiment of the application, if the thickness of the solder is too small, the volume of the solder is small, the space of the gap between the electronic component 2 and the substrate 1 occupied by the solder is small, the volume of the underfill 3 is large, and the fracture of the solder joint 21 is easy to occur, and when the thickness of the solder of the first pad 11 is too small, the welding reliability between the first pad 11 and the solder joint 21 is too small; if the thickness of the solder is too large, in the process of soldering the electronic component 2 and the substrate 1, the area of the substrate 1 covered by the outward flowing solder after being melted is large, and the risk of short circuit caused by connection with the adjacent solder exists. The thickness of solder can be 30um ~ 70um, can reduce underfill 3 volume reduces adjacently the solder connection leads to the risk of short circuit, has increased electronic component 10's job stabilization nature and safety in utilization have prolonged electronic component 10's life.
In the embodiment of the present application, as shown in fig. 5, the filling member may further include a second filling member 123, and both ends of the first filling member 121 are respectively connected to the substrate 1 and the second filling member 123.
In the embodiment of the present application, the second filling member 123 may be disposed above the first filling member 121, the filling member includes the first filling member 121 and the second filling member 123 stacked on each other, and under the condition that the first filling member 121 has the same volume, the first filling member 121 and the second filling member 123 are disposed between the electronic component 2 and the substrate 1, compared with the case that only the first filling member 121 is disposed, the disposing the first filling member 121 and the second filling member 123 between the electronic component 2 and the substrate 1 can reduce a space between the electronic component 2 and the substrate 1 for filling the underfill 3, reduce the volume of the underfill 3, reduce a volume change amount of the underfill 3 after temperature change, and reduce wind that the underfill 3 applies an acting force to the electronic component 2 and the substrate 1 due to an excessively large volume change amount to crack the solder joint 21 And (5) risking. The second filling member 123 is connected to the substrate 1 through the first filling member 121, so that a connection manner between the second filling member 123 and the substrate 1 is simplified, a structure between the second filling member 123 and the substrate 1 is simplified, and production costs of the second filling member 123 and the substrate 1 are reduced.
In the embodiment of the present application, the second filling member 123 may be a member made of the same material as the first filling member 121, or a member made of a different material, as long as the difference between the thermal expansion coefficient of the second filling member 123 and the thermal expansion coefficient of the solder joint 21 is smaller than the difference between the thermal expansion coefficient of the underfill 3 and the thermal expansion coefficient of the solder joint 21.
The thickness of the second filling member 123 may range from 80um to 120 um. For example, the thickness of the second filling member 123 may be specifically: 90um, 100um, 110 um.
In the embodiment of the application, if the thickness of the second filling member 123 is too small, the volume of the second filling member 123 is small, the space of the gap between the electronic component 2 and the substrate 1 occupied by the second filling member 123 is small, the volume of the underfill 3 is large, and the solder joint 21 is prone to fracture; if the thickness of the second filler 123 is too large, a risk of interference between the second filler 123 and the electronic component 2 is likely to occur during the process of mounting the electronic component 2 and the substrate 1. The thickness of second filler 123 can be 80um ~ 120um, can reduce underfill 3's volume reduces second filler 123 with electronic components 2 interferes and leads to electronic components 2 damages the risk of solder joint 21 fracture increases electronic components 2 with the stability that base plate 1 is connected prolongs electronic components 2's life, and then promotes electronic component 10's job stabilization nature.
In the embodiment of the present application, as shown in fig. 6 and 8, the filling member may further include a third filling member 124, and the third filling member 124 may cover a region where the solder point 21 and the first pad 11 are not disposed in the third region 12.
In the embodiment of the present application, the third filling member 124 may cover the third area 12, and the third filling member 124 may occupy more space between the electronic component 2 and the substrate 1, so as to reduce the volume of the underfill 3 filled between the electronic component 2 and the substrate 1, reduce the volume change of the underfill 3 after the temperature change, and reduce the risk that the underfill 3 applies an acting force to the electronic component 2 and the substrate 1 due to the excessive volume change to crack the solder joint 21. The third filling member 124 is disposed to occupy the space between the second pad 122 and the solder joint 21 bonded to the second pad 122, so that the electronic component 2 and the substrate 1 can be normally bonded.
In an embodiment of the present application, as shown in fig. 9 and 10, the filling member may include the first filling member 121 and the third filling member 124; the first filler 121 may be disposed between adjacent first pads 11 of the third region 12, the third region 12 may be further disposed with the second pads 122 disposed at intervals from the first pads 11, the first filler 121 may be disposed on the second pads 122, and the first filler 121 is disposed at intervals from the first pads 11; the third filling member 124 may cover a region where the solder point 21, the first pad 11, the second pad 122, and the first filling member 121 are not disposed in the third region 12.
In the embodiment of the present application, the first filler 121 and the third filler 124 are disposed between the electronic component 2 and the substrate 1, so that the volume of the underfill 3 filled between the electronic component 2 and the substrate 1 can be reduced, the volume change of the underfill 3 after temperature change is reduced, and the risk that the solder joint 21 cracks due to an action force applied to the electronic component 2 and the substrate 1 by the underfill 3 due to an excessive volume change is reduced.
In an embodiment of the present application, as shown in fig. 11, the filling members may include the first filling member 121, the second filling member 123, and the third filling member 124; the first filler 121 may be disposed between adjacent first pads 11 of the third region 12, the third region 12 may be further provided with second pads 122 disposed at intervals from the first pads 11, the first filler 121 may be disposed on the second pads 122, and the second filler 123 may be disposed on the first filler 121, such that the first filler 121 and the second filler 123 are both disposed at intervals from the first pads 11; the third filling member 124 may cover a region where the solder point 21, the first pad 11, the second pad 122, the first filling member 121, and the second filling member 123 are not disposed in the third region 12.
In the embodiment of the present application, the first filler 121, the second filler 123, and the third filler 124 are disposed between the electronic component 2 and the substrate 1, so that the volume of the underfill 3 filled between the electronic component 2 and the substrate 1 can be further reduced, the volume change of the underfill 3 after temperature change is reduced, and the risk that the solder joint 21 is cracked due to an acting force applied to the electronic component 2 and the substrate 1 by the underfill 3 due to an excessively large volume change is reduced.
In the embodiment of the present application, as shown in fig. 6, 9 and 10, the substrate 1 may include a first solder resist layer 124a provided to the third region 12 and a second solder resist layer 131 provided to the fourth region 13, and a thickness of the first solder resist layer 124a may be greater than a thickness of the second solder resist layer 131; in an embodiment of the present application, the third filler 124 is the first solder resist layer 124 a.
In the embodiment of the present application, the first solder resist layer 124a and the second solder resist layer 131 may be made of insulating materials, and the first solder resist layer 124a may insulate the adjacent second pad 122 located in the third region 12, insulate the adjacent solder joint 21 where the second pad 122 is soldered to the electronic component 1, and reduce the risk of short circuit caused by electrical connection between the adjacent second pad 122 and the adjacent solder joint 21; the second solder mask layer 131 can insulate the first solder pads 11 adjacent to the fourth region 13, insulate the solder joints 21 adjacent to the electronic component 2 to solder the first solder pads 11, reduce the risk of short circuit caused by electrical connection between the adjacent first solder pads 11 and the adjacent solder joints 21, and improve the working stability and the use safety of the electronic component 10. The third filling member 124 may be the first solder resist layer 124a with a larger thickness, and may occupy more space between the electronic component 2 and the substrate 1, reduce the volume of the underfill 3 filled between the electronic component 2 and the substrate 1, reduce the volume change amount of the underfill 3 after temperature change, and reduce the risk of cracking of the solder joint 21 caused by applying a force to the electronic component 2 and the substrate 1 due to an excessively large volume change of the underfill 3.
The third filling member 124 (which may be the first solder resist layer 124a with a thickness greater than that of the second solder resist layer 131) is already covered on the third area 12 when the substrate 1 is fed, so that the process of mounting the third filling member 124 on the substrate 1 can be simplified, and the production cost of the electronic component 10 can be reduced. When the first solder resist layer 124a in the third region 12 is used as the third filler 124, the first solder resist layer 124a can be used to prevent short circuit and cracking of the solder joints 21, and there is no need to provide other components between the electronic component 2 and the substrate 1 to occupy the space of the underfill 3, thereby simplifying the structure of the electronic component 10.
The first solder resist layer 124a and the second solder resist layer 131 may be ink. In the embodiment of the present application, the thickness of the first solder resist layer 124a may be 50um to 150um, and correspondingly, the thickness of the second solder resist layer 131 may be 10um to 30 um.
In an embodiment of the present application, as shown in fig. 7, the substrate 1 may include a preset underfill 124b disposed on the third region 12 and the second solder resist layer 131 disposed on the fourth region 13, and a thickness of the preset underfill 124b may be greater than a thickness of the second solder resist layer 131; the third filling member 124 is the pre-set filling adhesive 124b, and a difference between a thermal expansion coefficient of the pre-set filling adhesive 124b and a thermal expansion coefficient of the welding spot 21 may be smaller than a difference between a thermal expansion coefficient of the underfill 3 and a thermal expansion coefficient of the welding spot 21.
In the embodiment of the application, the preset underfill 124b with a larger thickness is the third underfill 124, and can occupy more space between the electronic component 2 and the substrate 1, reduce the volume of the underfill 3 filled between the electronic component 2 and the substrate 1, reduce the volume change of the underfill 3 after temperature change, and reduce the risk that the underfill 3 applies an acting force to the electronic component 2 and the substrate 1 due to an overlarge volume change to crack the solder joint 21.
The pre-applied underfill 124b may be a different adhesive than the underfill 3, and may have a different coefficient of thermal expansion, and the coefficient of thermal expansion of the filler 124b may be less than that of the underfill 3.
In an embodiment of the present application, the thickness of the third filling member 124 may range from 50um to 150 um. For example, the thickness of the third filling member 124 may be specifically: 50um, 100um, 150 um.
In the embodiment of the application, if the thickness of the third filling member 124 is too small, the volume of the third filling member 124 is small, the space of the gap between the electronic component 2 and the substrate 1 occupied by the third filling member 124 is small, the volume of the underfill 3 is large, and the solder joint 21 is easy to break; if the thickness of the third filling member 124 is too large, the risk that the third filling member 124 interferes with the electronic component 2 is likely to occur in the electronic component 2 during the soldering process of the electronic component 2 and the substrate 1. The thickness of third filler 124 can be 50um ~ 150um, reduces the volume of underfill 3 reduces third filler 124 with electronic components 2 interferes and leads to electronic components 2 damages the risk of solder joint 21 fracture increases electronic components 2 with the stability that base plate 1 is connected prolongs electronic components 2's life promotes electronic component 10's job stabilization nature.
In the embodiment of the application, the electronic component 2 may be a silicon chip, and the substrate 1 may be a package substrate, a PCB or a silicon chip. The minimum gap between the filler (which may be the first filler 121 and/or the second filler 123) and the adjacent second pad 122 (or the solder joint 21) may be 20um to 200um, for example, the minimum gap between the filler and the adjacent second pad 122 (or the solder joint 21) may be: 20um, 100um, 150um, 200 um.
In the embodiment of the present application, the minimum gap between the filler (the first filler 121 and/or the second filler 123) and the adjacent second pad 122 (or the solder joint 21) is too small, and there is a risk that the filler may contact the adjacent second pad 122 (or the solder joint 21) during the operation of the electronic component 10 to cause a short circuit, which reduces the safety of the electronic component 10; the distance between the adjacent second pads 122 (or the solder joints 21) is fixed, the distance between the filler and the adjacent second pads 122 (or the solder joints 21) is too large, the minimum gap between the filler and the other adjacent second pads 122 (or the solder joints 21) is too small, the filler has a risk of contacting with the other adjacent second pads 122 (or the solder joints 21) to cause short circuit in the operation process of the electronic component 10, when the minimum gap between the filler and the adjacent second pads 122 (or the solder joints 21) is too large, the volume of the underfill 3 filled between the filler and the adjacent second pads 122 (or the solder joints 21) is too large, and when the temperature changes, the underfill 3 with too large volume expands or contracts to cause the solder joints 21 to crack. The minimum clearance between filler and adjacent second pad 122 (or solder joint 21) can be 20um ~ 200um, has reduced the filler with second pad 122 (or solder joint 21) is connected and the risk of short circuit, has increased electronic components 2 with the stability of base plate 1 work, extension electronic components 2 with the life of base plate 1.
The minimum gap between the filler and the adjacent second pad 122 (or the solder joint 21) may be the same as or different from the minimum gap between the adjacent first pads 11 in the fourth region 13. In general, the minimum gap between adjacent first pads 11 in the fourth region 13 may be 20um to 200 um.
In the embodiment of the present application, the substrate 1 may be a PCB, the electronic component 2 may be a packaged chip, and the electronic component 10 may be a circuit board assembly. The minimum gap between the filler (which may be the first filler 121 and/or the second filler 123) and the adjacent second pad 122 (or the solder joint 21) may be 75um to 200um, for example, the minimum gap between the filler and the adjacent second pad 122 (or the solder joint 21) may be: 75um, 150um, 200 um.
In the embodiment of the present application, for similar reasons, the minimum gap between the filler and the adjacent second pad 122 (or the solder joint 21) can be 75 um-200 um, so that the risk of short circuit caused by the connection of the filler and the second pad 122 (or the solder joint 21) is reduced, the stability of the operation of the electronic component 2 and the substrate 1 is increased, and the service life of the electronic component 2 and the substrate 1 is prolonged.
The minimum gap between the filler and the adjacent second pad 122 may be the same as or different from the minimum gap between the adjacent first pads 11 in the fourth region 13. In general, the minimum gap between adjacent first pads 11 in the fourth region 13 may be 75um to 200 um.
In the embodiment of this application, as shown in fig. 3 and 8, electronic component 2 first region 22 the centre-to-centre spacing of solder joint 21 of base plate 1 third region 12 the centre-to-centre spacing of second pad 122 can be 50um ~ 650um, and the direction is along horizontal or vertical direction, second region 23 the centre-to-centre spacing of solder joint 21 the fourth region 13 the centre-to-centre spacing of first pad 11 can be 300um ~ 500um, and the direction is along diagonal direction. In addition, the thickness of the solder joint 21 may be 75um to 300 um.
The embodiment of the present application further provides an electronic device, which includes the electronic component 10 described in any of the above embodiments. The electronic device may be a camera, a mobile phone, a tablet computer, a desktop computer, a laptop computer, a handheld computer, a notebook computer, an ultra-mobile personal computer (UMPC), a netbook, a cellular phone, a Personal Digital Assistant (PDA), an Augmented Reality (AR) device, a Virtual Reality (VR) device, an Artificial Intelligence (AI) device, a wearable device, a vehicle-mounted device, an intelligent home device, and/or a smart city device, and embodiments of the present application do not particularly limit specific types of the electronic device.
In the embodiment of this application, electronic component 10 base plate 1 with set up between electronic components 2 the filler has reduced the risk of solder joint 21 fracture has prolonged electronic component 10's life has promoted electronic component 10's job stabilization nature has increased electronic equipment's performance promotes user's use experience.
It is noted that a portion of this patent application contains material which is subject to copyright protection. The copyright owner reserves the copyright rights whatsoever, except for making copies of the patent files or recorded patent document contents of the patent office.
Claims (15)
1. An electronic assembly, comprising: the substrate, the electronic component and the underfill adhesive;
the substrate is provided with a plurality of first bonding pads;
the electronic component is provided with a plurality of welding spots, the welding spots enclose a first area and a second area, the welding spot density of the first area is smaller than that of the second area, and the electronic component and the substrate are welded with the first welding pad through the welding spots;
the underfill is used for filling a gap between the electronic component and the substrate;
the substrate comprises a third area corresponding to the first area and a fourth area corresponding to the second area, a filling piece is arranged in the third area, and the difference between the thermal expansion coefficient of the filling piece and the thermal expansion coefficient of the welding point is smaller than the difference between the thermal expansion coefficient of the underfill and the thermal expansion coefficient of the welding point.
2. The electronic assembly of claim 1, wherein the filler has a coefficient of thermal expansion that is less than a coefficient of thermal expansion of the underfill.
3. The electronic assembly of claim 1, wherein the filler is not in contact with the electronic component.
4. The electronic assembly of claim 3, wherein the filler comprises a first filler disposed between adjacent first pads of the third region, the first filler being spaced apart from the first pads.
5. The electronic component according to claim 4, wherein the third region is further provided with a second pad, and the first pad and the second pad are both provided with solder so that the first pad and the solder joint are soldered by the solder provided on the first pad, and the solder provided on the second pad is the first filler.
6. The electronic assembly of claim 5, wherein the solder has a thickness of 30um to 70 um.
7. The electronic assembly of claim 5, wherein the filler further comprises a second filler, and both ends of the first filler are connected to the substrate and the second filler, respectively.
8. The electronic assembly of claim 7, wherein the thickness of the second filling member is 80um to 120 um.
9. The electronic component according to any one of claims 3 to 8, wherein the filler includes a third filler covering a region where the first pad is not provided in the third region.
10. The electronic assembly of claim 9, wherein the substrate comprises a first solder mask layer disposed in the third region and a second solder mask layer disposed in the fourth region, the first solder mask layer having a thickness greater than a thickness of the second solder mask layer;
the third filling member is the first solder resist layer.
11. The electronic component of claim 9, wherein the substrate comprises a pre-filled glue disposed in the third region and a second solder mask disposed in the fourth region, the pre-filled glue having a thickness greater than a thickness of the second solder mask;
the third filling piece is the preset filling glue.
12. The electronic assembly of claim 9, wherein the thickness of the third filling member is 50um to 150 um.
13. The electronic component according to any one of claims 1 to 8, wherein the substrate is a PCB or a package substrate or a silicon wafer, the electronic component is a silicon wafer, and a minimum gap between the filler and the adjacent solder joint is 20 to 200 um.
14. The electronic assembly according to any one of claims 1 to 8, wherein the substrate is a PCB, the electronic component is a packaged chip, and a minimum gap between the filler and the adjacent solder joint is 75 to 200 um.
15. An electronic device, characterized in that the electronic device comprises an electronic assembly according to any one of claims 1 to 14.
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| CN202111068944.9A CN113923865B (en) | 2021-09-13 | 2021-09-13 | Electronic component and electronic equipment |
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| CN202111068944.9A CN113923865B (en) | 2021-09-13 | 2021-09-13 | Electronic component and electronic equipment |
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| US5891754A (en) * | 1997-02-11 | 1999-04-06 | Delco Electronics Corp. | Method of inspecting integrated circuit solder joints with x-ray detectable encapsulant |
| US6121689A (en) * | 1997-07-21 | 2000-09-19 | Miguel Albert Capote | Semiconductor flip-chip package and method for the fabrication thereof |
| US6774497B1 (en) * | 2003-03-28 | 2004-08-10 | Freescale Semiconductor, Inc. | Flip-chip assembly with thin underfill and thick solder mask |
| US20050224252A1 (en) * | 2004-04-09 | 2005-10-13 | Fujitsu Limited | Component mounting substrate and structure |
| US20150021762A1 (en) * | 2013-07-18 | 2015-01-22 | Texas Instruments Incorporated | Semiconductor substrate having stress-absorbing surface layer |
| US20190059159A1 (en) * | 2016-02-25 | 2019-02-21 | Huawei Technologies Co., Ltd. | Glue dispensing method and circuit board |
| CN110429066A (en) * | 2019-07-29 | 2019-11-08 | 上海先方半导体有限公司 | A kind of electronic encapsulation device and bottom embankment method |
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|---|---|---|---|---|
| US5891754A (en) * | 1997-02-11 | 1999-04-06 | Delco Electronics Corp. | Method of inspecting integrated circuit solder joints with x-ray detectable encapsulant |
| US6121689A (en) * | 1997-07-21 | 2000-09-19 | Miguel Albert Capote | Semiconductor flip-chip package and method for the fabrication thereof |
| US6774497B1 (en) * | 2003-03-28 | 2004-08-10 | Freescale Semiconductor, Inc. | Flip-chip assembly with thin underfill and thick solder mask |
| US20050224252A1 (en) * | 2004-04-09 | 2005-10-13 | Fujitsu Limited | Component mounting substrate and structure |
| US20150021762A1 (en) * | 2013-07-18 | 2015-01-22 | Texas Instruments Incorporated | Semiconductor substrate having stress-absorbing surface layer |
| US20190059159A1 (en) * | 2016-02-25 | 2019-02-21 | Huawei Technologies Co., Ltd. | Glue dispensing method and circuit board |
| CN110429066A (en) * | 2019-07-29 | 2019-11-08 | 上海先方半导体有限公司 | A kind of electronic encapsulation device and bottom embankment method |
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| CN113923865B (en) | 2023-08-22 |
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