CN113906067A - 散热片材 - Google Patents
散热片材 Download PDFInfo
- Publication number
- CN113906067A CN113906067A CN202080040538.9A CN202080040538A CN113906067A CN 113906067 A CN113906067 A CN 113906067A CN 202080040538 A CN202080040538 A CN 202080040538A CN 113906067 A CN113906067 A CN 113906067A
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- Prior art keywords
- heat
- sheet
- heat dissipating
- dissipating sheet
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- 230000005855 radiation Effects 0.000 title claims description 9
- 239000002245 particle Substances 0.000 claims abstract description 47
- 229920005989 resin Polymers 0.000 claims abstract description 30
- 239000011347 resin Substances 0.000 claims abstract description 30
- 230000017525 heat dissipation Effects 0.000 claims description 23
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 claims description 19
- 229920001296 polysiloxane Polymers 0.000 claims description 11
- 238000010521 absorption reaction Methods 0.000 claims description 9
- 238000001723 curing Methods 0.000 claims description 9
- 238000003847 radiation curing Methods 0.000 claims description 7
- 238000005452 bending Methods 0.000 claims description 6
- BVKZGUZCCUSVTD-UHFFFAOYSA-L Carbonate Chemical compound [O-]C([O-])=O BVKZGUZCCUSVTD-UHFFFAOYSA-L 0.000 claims description 3
- 238000005336 cracking Methods 0.000 claims description 2
- 239000000203 mixture Substances 0.000 description 22
- 239000000523 sample Substances 0.000 description 19
- 239000010410 layer Substances 0.000 description 17
- NTHWMYGWWRZVTN-UHFFFAOYSA-N sodium silicate Chemical compound [Na+].[Na+].[O-][Si]([O-])=O NTHWMYGWWRZVTN-UHFFFAOYSA-N 0.000 description 14
- 238000000113 differential scanning calorimetry Methods 0.000 description 8
- 238000000576 coating method Methods 0.000 description 5
- 239000011872 intimate mixture Substances 0.000 description 5
- 238000002360 preparation method Methods 0.000 description 5
- 239000000126 substance Substances 0.000 description 5
- -1 2-ethylhexyl Chemical group 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 4
- 238000001938 differential scanning calorimetry curve Methods 0.000 description 4
- 239000000178 monomer Substances 0.000 description 4
- 150000001252 acrylic acid derivatives Chemical class 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 3
- 239000011230 binding agent Substances 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- 238000009472 formulation Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 229920001223 polyethylene glycol Polymers 0.000 description 3
- 150000003254 radicals Chemical class 0.000 description 3
- KWVGIHKZDCUPEU-UHFFFAOYSA-N 2,2-dimethoxy-2-phenylacetophenone Chemical compound C=1C=CC=CC=1C(OC)(OC)C(=O)C1=CC=CC=C1 KWVGIHKZDCUPEU-UHFFFAOYSA-N 0.000 description 2
- GJKGAPPUXSSCFI-UHFFFAOYSA-N 2-Hydroxy-4'-(2-hydroxyethoxy)-2-methylpropiophenone Chemical compound CC(C)(O)C(=O)C1=CC=C(OCCO)C=C1 GJKGAPPUXSSCFI-UHFFFAOYSA-N 0.000 description 2
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- 239000002585 base Substances 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- CDMADVZSLOHIFP-UHFFFAOYSA-N disodium;3,7-dioxido-2,4,6,8,9-pentaoxa-1,3,5,7-tetraborabicyclo[3.3.1]nonane;decahydrate Chemical compound O.O.O.O.O.O.O.O.O.O.[Na+].[Na+].O1B([O-])OB2OB([O-])OB1O2 CDMADVZSLOHIFP-UHFFFAOYSA-N 0.000 description 2
- 239000012777 electrically insulating material Substances 0.000 description 2
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- 239000002990 reinforced plastic Substances 0.000 description 2
- 229920002631 room-temperature vulcanizate silicone Polymers 0.000 description 2
- 239000002356 single layer Substances 0.000 description 2
- 235000010339 sodium tetraborate Nutrition 0.000 description 2
- 238000003892 spreading Methods 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- HJUGFYREWKUQJT-UHFFFAOYSA-N tetrabromomethane Chemical compound BrC(Br)(Br)Br HJUGFYREWKUQJT-UHFFFAOYSA-N 0.000 description 2
- DTGKSKDOIYIVQL-WEDXCCLWSA-N (+)-borneol Chemical group C1C[C@@]2(C)[C@@H](O)C[C@@H]1C2(C)C DTGKSKDOIYIVQL-WEDXCCLWSA-N 0.000 description 1
- QNODIIQQMGDSEF-UHFFFAOYSA-N (1-hydroxycyclohexyl)-phenylmethanone Chemical compound C=1C=CC=CC=1C(=O)C1(O)CCCCC1 QNODIIQQMGDSEF-UHFFFAOYSA-N 0.000 description 1
- XIOUDVJTOYVRTB-UHFFFAOYSA-N 1-(1-adamantyl)-3-aminothiourea Chemical compound C1C(C2)CC3CC2CC1(NC(=S)NN)C3 XIOUDVJTOYVRTB-UHFFFAOYSA-N 0.000 description 1
- JWYVGKFDLWWQJX-UHFFFAOYSA-N 1-ethenylazepan-2-one Chemical compound C=CN1CCCCCC1=O JWYVGKFDLWWQJX-UHFFFAOYSA-N 0.000 description 1
- 239000012956 1-hydroxycyclohexylphenyl-ketone Substances 0.000 description 1
- BDKLKNJTMLIAFE-UHFFFAOYSA-N 2-(3-fluorophenyl)-1,3-oxazole-4-carbaldehyde Chemical compound FC1=CC=CC(C=2OC=C(C=O)N=2)=C1 BDKLKNJTMLIAFE-UHFFFAOYSA-N 0.000 description 1
- KEZYHIPQRGTUDU-UHFFFAOYSA-N 2-[dithiocarboxy(methyl)amino]acetic acid Chemical compound SC(=S)N(C)CC(O)=O KEZYHIPQRGTUDU-UHFFFAOYSA-N 0.000 description 1
- XMLYCEVDHLAQEL-UHFFFAOYSA-N 2-hydroxy-2-methyl-1-phenylpropan-1-one Chemical compound CC(C)(O)C(=O)C1=CC=CC=C1 XMLYCEVDHLAQEL-UHFFFAOYSA-N 0.000 description 1
- 125000000954 2-hydroxyethyl group Chemical group [H]C([*])([H])C([H])([H])O[H] 0.000 description 1
- LWRBVKNFOYUCNP-UHFFFAOYSA-N 2-methyl-1-(4-methylsulfanylphenyl)-2-morpholin-4-ylpropan-1-one Chemical compound C1=CC(SC)=CC=C1C(=O)C(C)(C)N1CCOCC1 LWRBVKNFOYUCNP-UHFFFAOYSA-N 0.000 description 1
- RIWRBSMFKVOJMN-UHFFFAOYSA-N 2-methyl-1-phenylpropan-2-ol Chemical compound CC(C)(O)CC1=CC=CC=C1 RIWRBSMFKVOJMN-UHFFFAOYSA-N 0.000 description 1
- FQMIAEWUVYWVNB-UHFFFAOYSA-N 3-prop-2-enoyloxybutyl prop-2-enoate Chemical compound C=CC(=O)OC(C)CCOC(=O)C=C FQMIAEWUVYWVNB-UHFFFAOYSA-N 0.000 description 1
- LABQKWYHWCYABU-UHFFFAOYSA-N 4-(3-sulfanylbutanoyloxy)butyl 3-sulfanylbutanoate Chemical compound CC(S)CC(=O)OCCCCOC(=O)CC(C)S LABQKWYHWCYABU-UHFFFAOYSA-N 0.000 description 1
- JHWGFJBTMHEZME-UHFFFAOYSA-N 4-prop-2-enoyloxybutyl prop-2-enoate Chemical compound C=CC(=O)OCCCCOC(=O)C=C JHWGFJBTMHEZME-UHFFFAOYSA-N 0.000 description 1
- HRPVXLWXLXDGHG-UHFFFAOYSA-N Acrylamide Chemical compound NC(=O)C=C HRPVXLWXLXDGHG-UHFFFAOYSA-N 0.000 description 1
- RWSOTUBLDIXVET-UHFFFAOYSA-N Dihydrogen sulfide Chemical class S RWSOTUBLDIXVET-UHFFFAOYSA-N 0.000 description 1
- 101000618467 Hypocrea jecorina (strain ATCC 56765 / BCRC 32924 / NRRL 11460 / Rut C-30) Endo-1,4-beta-xylanase 2 Proteins 0.000 description 1
- HBBGRARXTFLTSG-UHFFFAOYSA-N Lithium ion Chemical compound [Li+] HBBGRARXTFLTSG-UHFFFAOYSA-N 0.000 description 1
- WHNWPMSKXPGLAX-UHFFFAOYSA-N N-Vinyl-2-pyrrolidone Chemical compound C=CN1CCCC1=O WHNWPMSKXPGLAX-UHFFFAOYSA-N 0.000 description 1
- UIIMBOGNXHQVGW-DEQYMQKBSA-M Sodium bicarbonate-14C Chemical compound [Na+].O[14C]([O-])=O UIIMBOGNXHQVGW-DEQYMQKBSA-M 0.000 description 1
- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 description 1
- 238000003848 UV Light-Curing Methods 0.000 description 1
- VTLHIRNKQSFSJS-UHFFFAOYSA-N [3-(3-sulfanylbutanoyloxy)-2,2-bis(3-sulfanylbutanoyloxymethyl)propyl] 3-sulfanylbutanoate Chemical compound CC(S)CC(=O)OCC(COC(=O)CC(C)S)(COC(=O)CC(C)S)COC(=O)CC(C)S VTLHIRNKQSFSJS-UHFFFAOYSA-N 0.000 description 1
- GUCYFKSBFREPBC-UHFFFAOYSA-N [phenyl-(2,4,6-trimethylbenzoyl)phosphoryl]-(2,4,6-trimethylphenyl)methanone Chemical compound CC1=CC(C)=CC(C)=C1C(=O)P(=O)(C=1C=CC=CC=1)C(=O)C1=C(C)C=C(C)C=C1C GUCYFKSBFREPBC-UHFFFAOYSA-N 0.000 description 1
- 239000011358 absorbing material Substances 0.000 description 1
- 239000011149 active material Substances 0.000 description 1
- 230000006978 adaptation Effects 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 150000001298 alcohols Chemical class 0.000 description 1
- RREGISFBPQOLTM-UHFFFAOYSA-N alumane;trihydrate Chemical compound O.O.O.[AlH3] RREGISFBPQOLTM-UHFFFAOYSA-N 0.000 description 1
- AMVQGJHFDJVOOB-UHFFFAOYSA-H aluminium sulfate octadecahydrate Chemical compound O.O.O.O.O.O.O.O.O.O.O.O.O.O.O.O.O.O.[Al+3].[Al+3].[O-]S([O-])(=O)=O.[O-]S([O-])(=O)=O.[O-]S([O-])(=O)=O AMVQGJHFDJVOOB-UHFFFAOYSA-H 0.000 description 1
- JGDITNMASUZKPW-UHFFFAOYSA-K aluminium trichloride hexahydrate Chemical compound O.O.O.O.O.O.Cl[Al](Cl)Cl JGDITNMASUZKPW-UHFFFAOYSA-K 0.000 description 1
- 229940009861 aluminum chloride hexahydrate Drugs 0.000 description 1
- MSMNVXKYCPHLLN-UHFFFAOYSA-N azane;oxalic acid;hydrate Chemical compound N.N.O.OC(=O)C(O)=O MSMNVXKYCPHLLN-UHFFFAOYSA-N 0.000 description 1
- MQDJYUACMFCOFT-UHFFFAOYSA-N bis[2-(1-hydroxycyclohexyl)phenyl]methanone Chemical compound C=1C=CC=C(C(=O)C=2C(=CC=CC=2)C2(O)CCCCC2)C=1C1(O)CCCCC1 MQDJYUACMFCOFT-UHFFFAOYSA-N 0.000 description 1
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical class C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 1
- KGBXLFKZBHKPEV-UHFFFAOYSA-N boric acid Chemical compound OB(O)O KGBXLFKZBHKPEV-UHFFFAOYSA-N 0.000 description 1
- 239000004327 boric acid Substances 0.000 description 1
- QHFQAJHNDKBRBO-UHFFFAOYSA-L calcium chloride hexahydrate Chemical compound O.O.O.O.O.O.[Cl-].[Cl-].[Ca+2] QHFQAJHNDKBRBO-UHFFFAOYSA-L 0.000 description 1
- PASHVRUKOFIRIK-UHFFFAOYSA-L calcium sulfate dihydrate Chemical compound O.O.[Ca+2].[O-]S([O-])(=O)=O PASHVRUKOFIRIK-UHFFFAOYSA-L 0.000 description 1
- 239000012986 chain transfer agent Substances 0.000 description 1
- JZCCFEFSEZPSOG-UHFFFAOYSA-L copper(II) sulfate pentahydrate Chemical compound O.O.O.O.O.[Cu+2].[O-]S([O-])(=O)=O JZCCFEFSEZPSOG-UHFFFAOYSA-L 0.000 description 1
- 125000000113 cyclohexyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 description 1
- KPUWHANPEXNPJT-UHFFFAOYSA-N disiloxane Chemical class [SiH3]O[SiH3] KPUWHANPEXNPJT-UHFFFAOYSA-N 0.000 description 1
- PYLIXCKOHOHGKQ-UHFFFAOYSA-L disodium;hydrogen phosphate;heptahydrate Chemical compound O.O.O.O.O.O.O.[Na+].[Na+].OP([O-])([O-])=O PYLIXCKOHOHGKQ-UHFFFAOYSA-L 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 230000009970 fire resistant effect Effects 0.000 description 1
- 238000001595 flow curve Methods 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- XXMIOPMDWAUFGU-UHFFFAOYSA-N hexane-1,6-diol Chemical compound OCCCCCCO XXMIOPMDWAUFGU-UHFFFAOYSA-N 0.000 description 1
- 239000003999 initiator Substances 0.000 description 1
- 229910001416 lithium ion Inorganic materials 0.000 description 1
- 229920001427 mPEG Polymers 0.000 description 1
- 229940050906 magnesium chloride hexahydrate Drugs 0.000 description 1
- DHRRIBDTHFBPNG-UHFFFAOYSA-L magnesium dichloride hexahydrate Chemical compound O.O.O.O.O.O.[Mg+2].[Cl-].[Cl-] DHRRIBDTHFBPNG-UHFFFAOYSA-L 0.000 description 1
- WRUGWIBCXHJTDG-UHFFFAOYSA-L magnesium sulfate heptahydrate Chemical compound O.O.O.O.O.O.O.[Mg+2].[O-]S([O-])(=O)=O WRUGWIBCXHJTDG-UHFFFAOYSA-L 0.000 description 1
- 229940061634 magnesium sulfate heptahydrate Drugs 0.000 description 1
- VTYCBVOPODCEFZ-UHFFFAOYSA-L magnesium;carbonate;pentahydrate Chemical compound O.O.O.O.O.[Mg+2].[O-]C([O-])=O VTYCBVOPODCEFZ-UHFFFAOYSA-L 0.000 description 1
- NEKPCAYWQWRBHN-UHFFFAOYSA-L magnesium;carbonate;trihydrate Chemical compound O.O.O.[Mg+2].[O-]C([O-])=O NEKPCAYWQWRBHN-UHFFFAOYSA-L 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 150000002734 metacrylic acid derivatives Chemical class 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 125000004108 n-butyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- WXZMFSXDPGVJKK-UHFFFAOYSA-N pentaerythritol Chemical class OCC(CO)(CO)CO WXZMFSXDPGVJKK-UHFFFAOYSA-N 0.000 description 1
- JZDGWLGMEGSUGH-UHFFFAOYSA-N phenyl-(2,4,6-trimethylbenzoyl)phosphinic acid Chemical compound CC1=CC(C)=CC(C)=C1C(=O)P(O)(=O)C1=CC=CC=C1 JZDGWLGMEGSUGH-UHFFFAOYSA-N 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- GNHOJBNSNUXZQA-UHFFFAOYSA-J potassium aluminium sulfate dodecahydrate Chemical compound O.O.O.O.O.O.O.O.O.O.O.O.[Al+3].[K+].[O-]S([O-])(=O)=O.[O-]S([O-])(=O)=O GNHOJBNSNUXZQA-UHFFFAOYSA-J 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 235000017281 sodium acetate Nutrition 0.000 description 1
- 229940087562 sodium acetate trihydrate Drugs 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 238000007655 standard test method Methods 0.000 description 1
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- UWHCKJMYHZGTIT-UHFFFAOYSA-N tetraethylene glycol Chemical compound OCCOCCOCCOCCO UWHCKJMYHZGTIT-UHFFFAOYSA-N 0.000 description 1
- ZIBGPFATKBEMQZ-UHFFFAOYSA-N triethylene glycol Chemical compound OCCOCCOCCO ZIBGPFATKBEMQZ-UHFFFAOYSA-N 0.000 description 1
- ASTWEMOBIXQPPV-UHFFFAOYSA-K trisodium;phosphate;dodecahydrate Chemical compound O.O.O.O.O.O.O.O.O.O.O.O.[Na+].[Na+].[Na+].[O-]P([O-])([O-])=O ASTWEMOBIXQPPV-UHFFFAOYSA-K 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
- RZLVQBNCHSJZPX-UHFFFAOYSA-L zinc sulfate heptahydrate Chemical compound O.O.O.O.O.O.O.[Zn+2].[O-]S([O-])(=O)=O RZLVQBNCHSJZPX-UHFFFAOYSA-L 0.000 description 1
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K5/00—Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
- C09K5/16—Materials undergoing chemical reactions when used
- C09K5/18—Non-reversible chemical reactions
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F222/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a carboxyl radical and containing at least one other carboxyl radical in the molecule; Salts, anhydrides, esters, amides, imides, or nitriles thereof
- C08F222/10—Esters
- C08F222/1006—Esters of polyhydric alcohols or polyhydric phenols
- C08F222/102—Esters of polyhydric alcohols or polyhydric phenols of dialcohols, e.g. ethylene glycol di(meth)acrylate or 1,4-butanediol dimethacrylate
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F283/00—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G
- C08F283/006—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G on to polymers provided for in C08G18/00
- C08F283/008—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G on to polymers provided for in C08G18/00 on to unsaturated polymers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/18—Manufacture of films or sheets
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/34—Silicon-containing compounds
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D183/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers
- C09D183/04—Polysiloxanes
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D4/00—Coating compositions, e.g. paints, varnishes or lacquers, based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; Coating compositions, based on monomers of macromolecular compounds of groups C09D183/00 - C09D183/16
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K5/00—Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
- C09K5/08—Materials not undergoing a change of physical state when used
- C09K5/14—Solid materials, e.g. powdery or granular
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M10/00—Secondary cells; Manufacture thereof
- H01M10/05—Accumulators with non-aqueous electrolyte
- H01M10/052—Li-accumulators
- H01M10/0525—Rocking-chair batteries, i.e. batteries with lithium insertion or intercalation in both electrodes; Lithium-ion batteries
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M10/00—Secondary cells; Manufacture thereof
- H01M10/60—Heating or cooling; Temperature control
- H01M10/61—Types of temperature control
- H01M10/613—Cooling or keeping cold
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M10/00—Secondary cells; Manufacture thereof
- H01M10/60—Heating or cooling; Temperature control
- H01M10/65—Means for temperature control structurally associated with the cells
- H01M10/651—Means for temperature control structurally associated with the cells characterised by parameters specified by a numeric value or mathematical formula, e.g. ratios, sizes or concentrations
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M10/00—Secondary cells; Manufacture thereof
- H01M10/60—Heating or cooling; Temperature control
- H01M10/65—Means for temperature control structurally associated with the cells
- H01M10/653—Means for temperature control structurally associated with the cells characterised by electrically insulating or thermally conductive materials
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Abstract
本发明公开了一种散热片材,该散热片材包含多个吸热颗粒和将该吸热颗粒粘结在一起的化学固化或辐射固化树脂。该散热片材包含大于60重量%的该吸热颗粒,具有小于3000MPa的挠曲模量和大于0.15MPa的挠曲强度。该散热片材是单个自立式层。
Description
背景技术
涂层可包含分散在粘结剂中的热活性材料。
发明内容
在本说明书的一些方面,提供了一种散热片材,所述散热片材包含多个吸热颗粒和将所述吸热颗粒粘结在一起的化学固化或辐射固化树脂。所述散热片材包含大于60重量%的所述吸热颗粒,具有小于3000MPa的挠曲模量和大于0.15MPa的挠曲强度。所述散热片材是单个自立式层。
附图说明
图1为散热片材的示意性剖视图;
图2为弯曲至曲率半径R的散热片材的示意性剖视图;
图3为散热片材的吸热速率的示意性曲线图;
图4为电池的示意性剖视图;并且
图5至图6为散热片材的热流速率的曲线图。
具体实施方式
在以下说明中参考附图,该附图形成本发明的一部分并且其中以举例说明的方式示出各种实施方案。附图未必按比例绘制。应当理解,在不脱离本说明书的范围或实质的情况下,可设想并进行其他实施方案。因此,以下具体实施方式不应被视为具有限制意义。
常规的散热片材通常包括基底层上的涂层,其中该涂层包含吸热颗粒。在本文所述的一些应用中,优选的是,散热片材具有每单位质量的散热片材的高吸热速率(例如,对于60℃至170℃范围内的至少一个温度,为至少1.5W/g、或至少1.8W/g、或至少2W/g)。由于基底的质量,基底层降低了每单位质量的吸热速率。根据本说明书的一些实施方案,已经发现,散热片材可作为单个自立式层提供,该单个自立式层具有所需机械性能和每单位质量的高吸热速率。自立式层不需要单独的基底来保持结构完整性。
本说明书的吸热片材可用于电池应用中以在热失控事件期间从电池单元移除热量(例如,如已知的在一些锂离子电池中发生的)。用于吸热片材中的吸热材料可被选择为在比常规防火涂层中的温度更低的温度下吸收热量。例如,吸热片材可具有60℃至170℃、或70℃至150℃范围内的吸热峰值温度和/或可具有60℃至120℃、或70℃至110℃范围内的吸热起始温度。
图1为散热片材100的示意性剖视图,该散热片材100包含多个吸热颗粒110和将吸热颗粒粘结在一起的化学固化或辐射固化树脂120。在一些实施方案中,散热片材100包含大于60重量%、或大于70重量%、或大于80重量%、或大于85重量%的吸热颗粒110。此处,重量%是基于散热片材100的总重量计的。在一些实施方案中,散热片材100包含大于55体积%、或大于60体积%、或大于65体积%的吸热颗粒110。此处,体积%是基于散热片材100的总体积的(例如,长度乘以宽度乘以片材的平均厚度)。在一些实施方案中,散热片材100基本上由化学固化或辐射固化树脂120和吸热颗粒110组成。例如,散热片材100可以包含小于1重量%或小于0.5重量%的任何其他组分。换句话讲,散热片材100可以包含含量不小于散热片材100的99重量%或99.5重量%的化学固化或辐射固化树脂120和吸热颗粒110。
散热片材100是单个自立式层。术语“自立式”或“自支承”是指这样的材料膜、材料片或材料层,这种材料膜、材料片或材料层具有足够的结构完整性,使得其能够在无需单独的支承层的情况下被处理和/或经受标准制造工艺。单个层不包括不同层之间的任何界面。如果附加元件或附加层置于散热片材100上,则附加元件或附加层和散热片材100的组合将不是单个层,但是将与附加元件或附加层接触的散热片材100将仍然是单个自立式层。在一些实施方案中,散热片材100作为不粘结到任何其他自立式层的单个自立式层提供。
在一些实施方案中,例如,散热片材100的平均厚度在1mm至10mm或2mm至8mm的范围内。
在一些实施方案中,颗粒110分散在树脂120中。例如,颗粒可分散在未固化树脂中,该未固化树脂随后在模具中固化以形成片材。在一些实施方案中,颗粒可涂覆有树脂,并且涂覆的颗粒通过例如树脂涂层粘结在一起。
在一些实施方案中,化学固化或辐射固化树脂120由可自由基聚合的单体形成。在一些实施方案中,合适的可自由基聚合的单体包括单官能丙烯酸酯或单官能甲基丙烯酸酯。合适的单官能(甲基)丙烯酸酯可包括(甲基)丙烯酸正丁酯、(甲基)丙烯酸叔丁酯、(甲基)丙烯酸-2-乙基己酯、(甲基)丙烯酸-2-羟乙酯、(甲基)丙烯酸环己酯、(甲基)丙烯酸异冰片酯、甲氧基聚(乙二醇)(甲基)丙烯酸酯、聚(乙二醇)(甲基)丙烯酸酯。
在一些实施方案中,可自由基聚合的单体可包括乙烯基单体,诸如例如苯乙烯、N-乙烯基2-吡咯烷酮、N,N-二甲基丙烯酰胺、丙烯酰胺、N-乙烯基己内酰胺和三烯丙基-1,3,5-三嗪-2,3,4-三酮。
在一些实施方案中,可自由基聚合树脂可包含多官能(甲基)丙烯酸酯。多官能(甲基)丙烯酸酯的示例包括1,3-丁二醇二丙烯酸酯、1,4-丁二醇二丙烯酸酯、聚(乙二醇)二(甲基)丙烯酸酯、乙氧基化双酚A二(甲基)丙烯酸酯、三甘醇二(甲基)丙烯酸酯、四甘醇二(甲基)丙烯酸酯、三羟甲基丙烷三(甲基)丙烯酸酯和1,6-己二醇二(甲基)丙烯酸酯以及乙氧基化季戊四醇四(甲基)丙烯酸酯。在一些实施方案中,化学固化或辐射固化树脂120为或包括自由基固化树脂,诸如紫外线(UV)固化丙烯酸酯。合适的自由基固化树脂包括UV固化的脂族聚氨酯丙烯酸酯。合适的脂族聚氨酯丙烯酸酯包括例如EBECRYL 230(购自德国美因河畔法兰克福湛新公司(Allnex,Frankfurt am Main,Germany)、UX-0937(购自日本东京的日本化药株式会社(Nippon Kayaku,Tokyo,Japan)和CN9009(购自宾夕法尼亚州埃克斯顿的沙多玛美国公司(Sartomer USA,Exton,PA)。
在一些实施方案中,可自由基聚合树脂还可包含链转移剂以控制所得粘结剂的分子量和交联密度。可用的链转移剂的示例包括但不限于选自由以下项组成的组的那些:四溴化碳、醇、硫醇以及它们的混合物。可用的链转移剂的示例包括1,4-双(3-巯基丁酰氧基)丁烷)和季戊四醇四(3-巯基丁酸酯)。
在一些实施方案中,可自由基聚合树脂还可包含UV自由基引发剂或光引发剂。示例性光引发剂为可以商品名IRGACURE和DAROCUR购自纽约州塔里敦的汽巴精化公司(CibaSpeciality Chemical Corp.,Tarrytown,NY)的那些,并且包括1-羟基环己基苯基酮(IRGACURE 184)、2,2-二甲氧基-1,2-二苯乙-1-酮(IRGACURE 651)、双(2,4,6-三甲基苯甲酰)苯基氧化膦(IRGACURE 819)、1-[4-(2-羟乙氧基)苯基]-2-羟基-2-甲基-1-丙烷-1-酮(IRGACURE 2959)、2-苄基-2-二甲基氨基-1-(4-吗啉代苯基)丁酮(IRGACURE 369)、2-甲基-1-[4-(甲硫基)苯基]-2-吗啉基丙-1-酮(IRGACURE 907)、和2-羟基-2-甲基-1-苯基丙-1-酮(DAROCUR1173)和2,4,6-三甲基苯甲酰基苯基次膦酸酯。
在一些实施方案中,化学固化或辐射固化树脂120为或包括化学固化硅氧烷或化学固化环氧树脂。合适的化学固化硅氧烷包括例如由双组分Pt催化的硅氧烷(例如,购自明尼苏达州圣保罗的3M公司(3M Company,St.,Paul,MN)的3M IMPRINT 3VPS ImpressionMaterial)或单组分湿固化硅氧烷(例如,购自宾夕法尼亚州霍舍姆镇的CRC工业公司(CRCIndustries,Horsham Township,PA)的RTV硅氧烷)制备的那些。合适的化学固化环氧树脂包括由双组分环氧粘合剂体系制备的那些,诸如可以商品名SCOTCH-WELD(例如3M Scotch-Weld Epoxy Adhesive DP100)购自3M公司的那些。
图2是示出弯曲至曲率半径R的散热片材100的示意性剖视图。曲率半径是弯曲片材的内半径。例如,可围绕具有半径R的圆柱形芯轴弯曲散热片材100(例如,当样品的长度小于πR时,围绕芯轴弯曲180度或仅沿芯轴的一部分弯曲)。在一些实施方案中,散热片材100在不屈服或破裂的情况下可弯曲至具有小于50cm、或小于30cm、或小于20cm、或小于10cm、或小于5cm、或小于2cm、或小于1cm、或小于0.5cm的内曲率半径。通常,较薄的片材(例如,1mm-4mm厚)在不屈服或破裂的情况下可比较厚的片材(例如,6mm-10mm厚)弯曲至具有更紧密的曲率半径。屈服是指至少0.2%的不可恢复塑性变形应变。另选地或除此之外,散热片材的可弯曲性可以通过片材在不屈服或破裂的情况下可弯曲的弯曲度(当片材弯曲成圆柱形弧时其所对的中心角)来表征。在一些实施方案中,散热片材在不屈服或破裂的情况下可弯曲至具有至少8度、或至少10度、或至少12度、或至少15度、或至少20度、或至少25度、或至少30度的弯曲度。在一些此类实施方案中,散热片材具有小于50cm、或小于30cm、或小于20cm、或小于10cm的长度,并且弯曲度通过将片材弯曲成圆柱形弧来确定,其中片材的长度沿着弧的圆周。
在一些实施方案中,散热片材具有小于3000MPa的挠曲模量和大于0.15MPa的挠曲强度。在一些此类实施方案中,挠曲模量小于1000MPa、或小于500MPa、或小于300MPa、或小于200MPa。在一些此类实施方案中或在其他实施方案中,挠曲强度大于0.2MPa、或大于0.3MPa、或大于0.5MPa、或大于1MPa、或大于2MPa、或大于3MPa。在一些实施方案中,散热片材100具有小于300MPa、或小于200MPa、或小于100MPa的挠曲模量,并且具有大于0.3MPa的挠曲强度。在一些实施方案中,散热片材100具有小于50MPa的挠曲模量和大于0.4MPa的挠曲强度。在一些实施方案中,挠曲模量可例如低至1MPa、或3MPa、或5MPa、或10MPa。在一些实施方案中,挠曲强度可例如高达20MPa、或10MPa、或5MPa、或4MPa、或3.5MPa。
挠曲模量和挠曲强度可使用3点弯曲测试根据ASTM D790-17测试标准“未增强和增强塑料以及电绝缘材料的挠曲特性的标准测试方法(Standard Test Methods forFlexural Properties of Unreinforced and Reinforced Plastics and ElectricalInsulating Materials)”来测定。如实施例中进一步所述,在该测试中,挠曲强度是在弯曲测试期间由试样承受的最大挠曲应力,并且挠曲模量是在弯曲测试中测定的正切弹性模量(应力与弹性极限中的对应应变的比率)。
在一些实施方案中,多个吸热颗粒110包括水合物(例如无机水合物)或碳酸盐中的至少一种。在一些实施方案中,多个吸热颗粒110选自氯化镁六水合物、硫酸镁七水合物、四硼酸钠十水合物、磷酸三钠十二水合物、磷酸氢二钠七水合物、硫酸铝十八水合物、硫酸钙二水合物、偏硅酸钠五水合物、三水合铝、碳酸氢钠、碳酸镁三水合物、碳酸镁五水合物、硫酸铜五水合物、硝酸锌六水合物、四硼酸钠十水合物、乙酸钠三水合物、硫酸锌七水合物、氯化铝六水合物、硫酸钾铝十二水合物、氯化钙六水合物、草酸铵一水合物、硼酸、以及它们的组合。颗粒110可具有任何合适的粒度分布(例如,单峰或多峰)和任何合适的平均(例如D50)粒度(例如,1微米至10mm、或10微米至5mm、或100微米至2mm)。可选择所用的颗粒110的类型以在所需温度范围内提供吸热峰值温度。
图3是散热片材(诸如散热片材100)的吸热速率对温度的示意性曲线图。吸热速率可使用差示扫描量热法(DSC)测定。在一些情况下,DSC热吸收曲线通过将样品在0℃下保持5分钟,然后以10℃/min的加热速率升温至300℃来确定。在一些实施方案中,多个吸热颗粒110的吸热峰值温度T1在60℃至170℃或70℃至150℃的范围内。在一些此类实施方案中,多个吸热颗粒具有一个或多个另外的吸热峰值温度。例如,图3中示意性地示出了高于T1的第二吸热峰值温度T2。在一些实施方案中,对于60℃至170℃范围内的至少一个温度,散热片材100具有至少1.5W/g、或至少1.8W/g、或至少2W/g的吸热速率(例如,H1)。在一些实施方案中,对于70℃至150℃范围内的至少一个温度,吸热速率为至少1.5W/g、或至少1.8W/g、或至少2W/g。吸热速率曲线下的面积与温度斜升期间吸收的总热量成比例。在一些实施方案中,当以10℃/min的速率从20℃加热至240℃时,散热片材100吸收至少600J/g、或至少700J/g、或至少800J/g。
在一些实施方案中,电池包括电池单元和邻近电池单元设置的散热片材100。电池可包括一个或多个电池单元和多个散热片材100。
图4为电池200的示意性剖视图,该电池包括多个电池单元250和多个散热片材100。在一些实施方案中,每个电池单元250邻近至少一个(在所示实施方案中为两个)散热片材100设置。可利用本领域已知的电池单元的其他布置。电池200中的散热片材100中的每一者为单个自立式层,优选地具有每单位质量的散热片材的高吸热速率(例如,对于60℃至170℃范围内的至少一个温度,至少1.5W/g、或至少1.8W/g、或至少2W/g)。在一些实施方案中,电池包括设置在两个电池单元之间的散热片材100,其中散热片材100的主表面与每个电池单元直接接触。散热片材100优选地为柔性的(例如,具有在其他地方所述范围内的挠曲模量),使得相邻的电池单元可膨胀而不损坏散热片材100。
以下为本说明书的示例性实施方案的列表。
在第一实施方案中,散热片材包括:
多个吸热颗粒;以及
将所述吸热颗粒粘结在一起的化学固化或辐射固化树脂,其中所述散热片材包含大于60重量%的所述吸热颗粒,具有小于3000MPa的挠曲模量和大于0.15MPa的挠曲强度,并且其中所述散热片材是单个自立式层。
第二实施方案为根据第一实施方案所述的散热片材,其中所述散热片材基本上由所述化学固化或辐射固化树脂和所述吸热颗粒组成。
第三实施方案为根据第一或第二实施方案所述的散热片材,其中所述散热片材包含大于70重量%、或大于80重量%、或大于85重量%的吸热颗粒。
第四实施方案为根据第一至第三实施方案中任一项所述的散热片材,其中所述散热片材包含大于55体积%、或大于60体积%、或大于65体积%的吸热颗粒。
第五实施方案为根据第一至第四实施方案中任一项所述的散热片材,所述散热片材具有小于1000MPa、或小于500MPa、或小于300MPa、或小于200MPa的挠曲模量。
第六实施方案为根据第一至第五实施方案中任一项所述的散热片材,所述散热片材具有大于0.2MPa、或大于0.3MPa、或大于0.5MPa、或大于1MPa、或大于2MPa、或大于3MPa的挠曲强度。
第七实施方案为根据第一至第四实施方案中任一项所述的散热片材,所述散热片材具有小于300MPa、或小于200MPa、或小于100MPa的挠曲模量和大于0.3MPa的挠曲强度。
第八实施方案为根据第一至第七实施方案中任一项所述的散热片材,其中所述散热片材在不屈服或破裂的情况下可弯曲至具有小于50cm、或小于30cm、或小于20cm、或小于10cm、或小于5cm、或小于2cm、或小于0.5cm的内曲率半径。
第九实施方案为根据第一至第八实施方案中任一项所述的散热片材,其中所述多个吸热颗粒具有在60℃至170℃、或70℃至150℃范围内的吸热峰值温度。
第十实施方案为根据第一至第九实施方案中任一项所述的散热片材,其中对于60℃至170℃范围内的至少一个温度,所述散热片材具有至少1.5W/g、或至少1.8W/g、或至少2W/g的吸热速率。
第十一实施方案为根据第一至第十实施方案中任一项所述的散热片材,其中所述散热片材在以10℃/min的速率从20℃加热至240℃时吸收至少600J/g、或至少700J/g、或至少800J/g。
第十二实施方案为根据第一至第十一实施方案中任一项所述的散热片材,其中所述化学固化或辐射固化树脂包括紫外线(UV)固化丙烯酸酯。
第十三实施方案为根据第一至第十一实施方案中任一项所述的散热片材,其中所述化学固化或辐射固化树脂包括化学固化硅氧烷。
第十四实施方案为根据第一至第十三实施方案中任一项所述的散热片材,其中所述多个吸热颗粒包括水合物或碳酸盐中的至少一种。
第十五实施方案为一种电池,所述电池包括电池单元和邻近所述电池单元设置的根据第一至第十四实施方案中任一项所述的散热片材。
实施例
实施例中所用的材料
测试方法
差示扫描量热法(DSC)
使用TA仪器型号Q200差示扫描量热仪(特拉华州纽卡斯尔的TA仪器公司(TAInstruments,New Castle,DE)对样品进行差示扫描量热分析。将样品(通常为2mg-10mg)置于无盖的铝盘(以商品名“TZERO”获自特拉华州纽卡斯尔的TA仪器公司(TA Instruments,New Castle,DE)中,并且将无盖的空铝盘用作参考。将样品和参考物初始冷却至0℃,并在该温度下保持5分钟以达到平衡,然后以10℃/min的加热速率升温至300℃。将热流的测量值对温度作图,以确定样品的吸热性质。使用来自特拉华州纽卡斯尔的TA仪器公司(TAInstruments,New Castle,DE)的TA INSTRUMENTS UNIVERSAL ANALYSIS 2000软件在热流对温度曲线的选定温度范围内(热流的负方向上的峰)进行积分,从而提供在选定温度范围内由样品吸收的热量的量度。
挠曲强度和挠曲模量:质构分析仪
使用TA.XT Plus质构分析仪(马萨诸塞州汉密尔顿的Texture Technologies公司(Texture Technologies,Hamilton,MA))和3点弯曲装置(型号TA-92N,获自马萨诸塞州汉密尔顿的Texture Technologies公司(Texture Technologies,Hamilton,MA))进行挠曲强度和挠曲模量的测量。支撑跨距设定为50mm,并且矩形样品在整个跨距上居中放置。将约3.0mm半径的不锈钢平坦探针居中放置在支撑跨距的中间(在样品上方),并且以1.2mm/min的测试速度压缩到样品上,直到样品破裂或永久变形,这用于所有测试。使用获自英国萨里的稳定微系统公司(Stable Micro Systems,Surrey,United Kingdom)的EXPONENT软件记录所施加的力和所行进的探针距离,以生成每个样品的负载-挠曲曲线。相同软件用于受试样品的典型尺寸,为2mm-3mm×12mm-13mm×约75mm-76mm。
使用以下公式(来自ASTM D790-17的挠曲应力公式3),计算负载-挠曲曲线上最大负载点处的挠曲强度(σf,单位为MPa(psi)):
其中:
P=负载-挠曲曲线上给定点处的负载,N(lbf)
L=支撑跨距,mm(英寸)
b=所测试支梁的宽度,mm(英寸),并且
d=所测试支梁的深度,mm(英寸)。
使用以下公式(来自ASTM D790-17的正切弹性模量公式6)计算挠曲模量(弯曲时的正切弹性模量EB,MPa(psi)):
其中:
L=支撑跨距,mm(英寸)
b=所测试支梁的宽度,mm(英寸),
d=所测试支梁的深度,mm(英寸),并且
m=负载-挠曲曲线的初始直线部分的切线的斜率,N/mm(lbf/英寸)的挠曲。
制备例
制备例PE1
使用以下步骤制备UV可固化粘结剂制剂。将55g的EBECRYL 230、25g的UX-0937和20g的HEA、0.3g的IRGACURE 651和0.5g的IRGACURE TPO-L添加到琥珀色着色广口瓶中,并且在轻微滚动下混合24小时。
制备例PE2-PE5
根据下表1中以克为单位的用量,以与PE1类似的方式制备UV固化粘结剂制剂PE2-PE5。
表1:制备例制剂概述
实施例
实施例EX1.Metso
20:PE1(75:25重量比)
使用木制刮刀将大约7.5g Metso 20与2.5g PE1手动混合一分钟,以得到Metso20颗粒和树脂的紧密混合物。然后用手将混合物铺展并压实到40mm直径×3/16"深的圆形硅氧烷模具中,其中移除任何过量的混合物以在模具中提供混合物的平坦、水平的顶部表面。然后使用具有大约60mW/cm2的输出强度的定制380nm UV LED光源在空气中以大约4cm的样品到光源距离在片材样品的每个面上固化模具中的混合物5分钟,以产生柔性的自立式散热片材。实施例EX1的DSC分析示出在20℃和240℃之间吸收的836.3J/g的热量。实施例EX1的DSC曲线示于图5中。DSC曲线在91.91℃的温度下具有-2.08W/g的峰值热流速率(即,样品具有2.08W/g的吸热速率)。
实施例EX2.Metso
20:PE5(75:25重量比)
使用木制刮刀将大约18.02g Metso 20与5.99g PE5手动混合一分钟,以得到Metso 20颗粒和树脂的紧密混合物。然后用手将混合物铺展并压实到4cm×11cm×3/16"深的矩形硅氧烷模具中,其中移除任何过量的混合物以在模具中提供混合物的平坦、水平的顶部表面。然后使用来自实施例EX1的UV LED光源在空气中以大约4cm的样品到光源距离在片材样品的每个面上固化模具中的混合物5分钟,以产生柔性的自立式散热片材。实施例EX2的DSC分析示出在20℃和240℃之间吸收的816.7J/g的热量。
实施例EX3-EX10和比较例CE1-CE4
实施例EX3-EX10和比较例CE1-CE4以与EX2类似的方式制备:使用木制刮刀将Metso 20与PE1、PE2、PE3或PE4以表2中所示的给定重量比手动混合一分钟,得到Metso 20颗粒和树脂的紧密混合物。然后用手将混合物铺展并压实到0.5英寸×3英寸×1/8英寸深的矩形铝模具中,其中移除任何过量的混合物以在模具中提供混合物的平坦、水平的顶部表面。然后使用来自实施例EX1的UV LED光源在空气中以大约4cm的样品到光源距离在片材样品的每个面上固化模具中的混合物5分钟,以产生柔性的自立式散热片材。挠曲强度和挠曲模量报告于表2中。
表2.实施例EX3-EX11和比较例CE1-CE3制剂的汇总
实施例EX11.Metso 20:Imprint 3 LB(80:20重量比)
使用木制刮刀将大约17.67g Metso 20与2.28g来自Imp3LB硅氧烷的黄色糊剂部分手动混合一分钟,以得到Metso 20颗粒和树脂的紧密混合物。然后将颗粒混合物添加到2.14g来自Imp3LB硅氧烷的白色糊剂部分中并混合大约一分钟。然后用手将混合物铺展并压实到4cm×11cm×3/16"深的矩形硅氧烷模具中,其中移除任何过量的混合物以在模具中提供混合物的平坦、水平的顶部表面。然后将模具中的混合物在室温下在空气中固化30分钟,以制备柔性的自立式散热片材。EX11的DSC分析示出在20℃和240℃之间吸收的911.0J/g的热量。实施例EX11的DSC曲线示于图6中。DSC曲线在112.0℃的温度下具有-2.23W/g的峰值热流速率(即,样品具有2.23W/g的吸热速率)。
实施例EX12.Metso
20:RTV(90:10重量比)
使用木制刮刀将大约10g Metso 20与2.85g RTV硅氧烷手动混合一分钟,以得到Metso 20颗粒和树脂的紧密混合物。然后用手将混合物铺展并压实到4cm×11cm×3/16"深的矩形硅氧烷模具,以填充模具体积的大约1/2。使样品在室温下在空气中固化超过3天以产生柔性的自立式散热片材。实施例EX12的DSC分析示出在20℃至240℃之间吸收的1023J/g的热量。
上述所有引用的参考文献、专利和专利申请以一致的方式全文据此以引用方式并入本文。在并入的参考文献部分与本申请之间存在不一致或矛盾的情况下,应以前述说明中的信息为准。
除非另外指明,否则针对附图中元件的描述应被理解为同样应用于其他附图中的对应的元件。虽然本文已经例示并描述了具体实施方案,但本领域的普通技术人员将会知道,在不脱离本公开范围的情况下,可用多种另选的和/或等同形式的具体实施来代替所示出和所描述的具体实施方案。本申请旨在涵盖本文所讨论的具体实施方案的任何改型或变型。因此,本公开旨在仅受权利要求及其等同形式的限制。
Claims (15)
1.一种散热片材,所述散热片材包含:
多个吸热颗粒;以及
将所述吸热颗粒粘结在一起的化学固化或辐射固化树脂,其中所述散热片材包含大于60重量%的所述吸热颗粒,具有小于3000MPa的挠曲模量和大于0.15MPa的挠曲强度,并且
其中所述散热片材是单个自立式层。
2.根据权利要求1所述的散热片材,其中所述散热片材基本上由所述化学固化或辐射固化树脂和所述吸热颗粒组成。
3.根据权利要求1所述的散热片材,其中所述散热片材包含大于80重量%的所述吸热颗粒。
4.根据权利要求1所述的散热片材,其中所述散热片材包含大于60体积%的所述吸热颗粒。
5.根据权利要求1所述的散热片材,所述散热片材具有小于500MPa的挠曲模量。
6.根据权利要求1所述的散热片材,所述散热片材具有大于0.5MPa的挠曲强度。
7.根据权利要求1所述的散热片材,所述散热片材具有小于200MPa的挠曲模量和大于0.3MPa的挠曲强度。
8.根据权利要求1所述的散热片材,其中所述散热片材在不屈服或破裂的情况下能够弯曲至具有小于10cm的内曲率半径。
9.根据权利要求1所述的散热片材,其中所述多个吸热颗粒具有在60℃至170℃范围内的吸热峰值温度。
10.根据权利要求1所述的散热片材,其中所述散热片材对于60℃至170℃范围内的至少一个温度具有至少1.8W/g的吸热速率。
11.根据权利要求1所述的散热片材,其中所述散热片材在以10℃/min的速率从20℃加热至240℃时吸收至少700J/g。
12.根据权利要求1所述的散热片材,其中所述化学固化或辐射固化树脂包括紫外线(UV)固化丙烯酸酯。
13.根据权利要求1所述的散热片材,其中所述化学固化或辐射固化树脂包括化学固化硅氧烷。
14.根据权利要求1所述的散热片材,其中所述多个吸热颗粒包括水合物或碳酸盐中的至少一种。
15.一种电池,所述电池包括电池单元和邻近所述电池单元设置的根据权利要求1所述的散热片材。
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US201962859399P | 2019-06-10 | 2019-06-10 | |
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PCT/IB2020/055205 WO2020250084A1 (en) | 2019-06-10 | 2020-06-02 | Heat-removing sheet |
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Citations (4)
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WO2001005581A1 (en) * | 1999-07-14 | 2001-01-25 | Hayes Claude Q C | Thermal control composite |
CN102017226A (zh) * | 2008-09-22 | 2011-04-13 | 松下电器产业株式会社 | 便携式电子设备 |
CN102781868A (zh) * | 2010-03-02 | 2012-11-14 | 株式会社普利司通 | 热射线屏蔽多层玻璃 |
CN104093388A (zh) * | 2013-06-11 | 2014-10-08 | 尤妮佳股份有限公司 | 吸收体和包含该吸收体的吸收性物品 |
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KR100942787B1 (ko) * | 2009-04-03 | 2010-02-18 | 두성산업 주식회사 | 열흡수 시트 조성물 및 열흡수 시트 제조방법 |
WO2013054897A1 (ja) * | 2011-10-13 | 2013-04-18 | アイカ工業株式会社 | 化粧板 |
US20140146477A1 (en) * | 2012-11-28 | 2014-05-29 | Illinois Tool Works Inc. | Hybrid sheet materials and methods of producing same |
US20220213372A1 (en) * | 2019-05-15 | 2022-07-07 | 3M Innovative Properties Company | (co)polymer matrix composites comprising thermally-conductive particles and endothermic particles and methods of making the same |
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- 2020-06-02 EP EP20822334.7A patent/EP3980485A4/en active Pending
- 2020-06-02 WO PCT/IB2020/055205 patent/WO2020250084A1/en unknown
- 2020-06-02 CN CN202080040538.9A patent/CN113906067A/zh active Pending
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Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2001005581A1 (en) * | 1999-07-14 | 2001-01-25 | Hayes Claude Q C | Thermal control composite |
CN102017226A (zh) * | 2008-09-22 | 2011-04-13 | 松下电器产业株式会社 | 便携式电子设备 |
CN102781868A (zh) * | 2010-03-02 | 2012-11-14 | 株式会社普利司通 | 热射线屏蔽多层玻璃 |
CN104093388A (zh) * | 2013-06-11 | 2014-10-08 | 尤妮佳股份有限公司 | 吸收体和包含该吸收体的吸收性物品 |
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WO2020250084A1 (en) | 2020-12-17 |
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