CN113903727A - 功率半导体模块和用于制造功率半导体模块的方法 - Google Patents
功率半导体模块和用于制造功率半导体模块的方法 Download PDFInfo
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Abstract
一种用于制造功率半导体模块装置的方法,包括:将至少一个半导体衬底(10)布置在外壳(40)中,每个半导体衬底(10)包括电介质绝缘层(11)和附接到电介质绝缘层(11)的第一金属化层(111),并且外壳(40)包括延伸穿过外壳(40)的部件(66、662)的至少一个通孔(64);将至少一个销或螺栓(62)插入到至少一个通孔(64)中,其中,销或螺栓(62)的上端未插入到通孔(64)中;将印刷电路板(44)布置在外壳(40)上;将外壳(40)布置在热沉(12)上,热沉(12)包括至少一个孔(64),其中,外壳(40)布置在热沉(12)上,使得至少一个通孔(64)中的每一个与热沉(12)中的至少一个孔(64)中的一个对准;以及使用第一压制工具(70),由此在印刷电路板(44)的至少一个限定的接触区域上施加力,并且将至少一个销或螺栓(62)中的每一个压入到热沉(12)中的相应的孔(64)中,其中,至少一个限定的接触区域中的每一个直接布置在至少一个销或螺栓(62)中的一个上方。
Description
技术领域
本公开涉及功率半导体模块以及用于制造这种功率半导体模块的方法。
背景技术
功率半导体模块通常包括布置在外壳中的半导体衬底。包括多个可控半导体元件(例如,在半桥构造中的两个IGBT)的半导体装置可以布置在衬底上。衬底通常包括衬底层(例如,陶瓷层)、沉积在衬底层的第一侧上的第一金属化层以及沉积在衬底层的第二侧上的第二金属化层。例如,可控半导体元件安装在第一金属化层上。第二金属化层可以附接到热沉、附接到基板或附接到外壳的地表面。可控半导体器件通常通过焊接或烧结技术安装到半导体衬底。通常提供一个或多个接触元件,一个或多个接触元件允许从外壳的外部接触这种半导体装置。已知这样的功率半导体模块,其中接触元件布置在衬底上,并且在基本上垂直于衬底的主表面的方向上穿过外壳的盖突出。接触元件的从外壳突出的区段可以机械且电气地耦合到印刷电路板。印刷电路板通常包括通孔,并且接触元件插入穿过相应的通孔。
为了将其中布置有半导体衬底的外壳附接到热沉,外壳(或者附接到外壳的合适的突起)以及热沉可以包括螺纹孔。螺钉可以插入穿过这些螺纹孔,由此将其上附接有印刷电路板的外壳固定在热沉上。印刷电路中的通孔还需要能够用适当的工具(例如,螺丝刀)将螺钉固定在螺纹孔中。然而,在印刷电路板中提供通孔的缺点在于,印刷电路板的某些区域被丢失,这些丢失的区域不能用于提供导电路径。因此,印刷电路板需要更大或需要具有更多层的导电路径,这增加了装置的总成本。
需要一种可以安装在热沉上的半导体模块装置,其中,该装置的印刷电路板尽可能小且便宜。
发明内容
一种用于制造功率半导体模块装置的方法,包括:将至少一个半导体衬底布置在外壳中,每个半导体衬底包括电介质绝缘层和附接到电介质绝缘层的第一金属化层,并且外壳包括延伸穿过外壳的部件的至少一个通孔;将至少一个销或螺栓插入到至少一个通孔中,其中,销或螺栓的上端未插入到通孔中;将印刷电路板布置在外壳上;将外壳布置在热沉上,热沉包括至少一个孔,其中,外壳布置在热沉上,使得至少一个通孔中的每一个与热沉中的至少一个孔中的一个对准;以及使用第一压制工具,由此在印刷电路板的至少一个限定的接触区域上施加力,并且将至少一个销或螺栓中的每一个压入到热沉中的相应的孔中,其中,至少一个限定的接触区域中的每一个直接布置在至少一个销或螺栓中的一个上方。
一种功率半导体模块装置,包括:外壳,外壳具有延伸穿过外壳的部件的至少一个通孔;至少一个半导体衬底,至少一个半导体衬底布置在外壳中,并且包括电介质绝缘层和附接到电介质绝缘层的第一金属化层;印刷电路板,印刷电路板布置在外壳的外部;热沉,热沉包括至少一个孔,其中,外壳布置在热沉上,使得至少一个通孔中的每一个与热沉中的至少一个孔中的一个对准;以及至少一个销或螺栓,其中,至少一个销或螺栓中的每一个延伸穿过至少一个通孔中的一个,并且进入到热沉中的对应的孔中,并且其中,销或螺栓的上端未插入到通孔中;其中至少一个销或螺栓中的每一个布置在印刷电路板的至少一个限定的接触区域中的一个下方,其中,至少一个限定的接触区域被配置为暴露于由第一压制工具施加的压力。
参考以下附图和说明书可以更好地理解本发明。附图中的部件不一定是按比例绘制的,相反重点在于说明本发明的原理。此外,在附图中,类似的附图标记在不同的视图中指定对应的部分。
附图说明
图1是功率半导体模块装置的截面图。
图2是根据示例的功率半导体模块装置的截面图。
图3是根据另一示例的功率半导体模块装置的截面图。
图4是根据另一示例的功率半导体模块装置的截面图。
图5是根据另一示例的功率半导体模块装置的截面图。
图6是根据另一示例的功率半导体模块装置的截面图。
包括图7A到图7D的图7示意性地示出了用于制造功率半导体模块装置的方法。
具体实施方式
在以下具体实施方式中,参考附图。附图示出了其中可以实践本发明的具体示例。应当理解,除非另外特别指出,否则关于各种示例描述的特征和原理可以彼此结合。在说明书和权利要求中,将某些元件指定为“第一元件”、“第二元件”、“第三元件”等不应被理解为列举性的。相反,这样的指定仅用于寻址不同的“元件”。也就是说,例如,“第三元件”的存在不要求“第一元件”和“第二元件”的存在。如本文描述的电线或电连接可以是单个导电元件,或者包括串联和/或并联连接的至少两个单独的导电元件。电线和电连接可以包括金属和/或半导体材料,并且可以永久导电(即,不可切换)。如本文描述的半导体主体可以由(掺杂)半导体材料制成,并且可以是半导体芯片或者可以被包括在半导体芯片中。半导体主体具有电连接焊盘,并且包括具有电极的至少一个半导体元件。
参考图1,其示出了功率半导体模块的截面图。功率半导体模块包括外壳和半导体衬底10。半导体衬底10包括电介质绝缘层11、附接到电介质绝缘层11的(结构化)第一金属化层111、以及附接到电介质绝缘层11的第二(结构化)金属化层112。电介质绝缘层11设置在第一金属化层111与第二金属化层112之间。然而,也有可能半导体衬底10仅包括第一金属化层111,同时省略第二金属化层112。
第一金属化层111和第二金属化层112中的每一个可以由以下材料中的一种组成或者包括以下材料中的一种:铜;铜合金;铝;铝合金;在功率半导体模块装置的操作期间保持固态的任何其他金属或合金。半导体衬底10可以是陶瓷衬底,也就是说,其中电介质绝缘层11是陶瓷(例如,薄陶瓷层)的衬底。陶瓷可以由以下材料中的一种组成或者包括以下材料中的一种:氧化铝;氮化铝;氧化锆;氮化硅;氮化硼;或者任何其他电介质陶瓷。例如,电介质绝缘层11可以由以下材料中的一种组成或者包括以下材料中的一种:Al2O3、AlN、SiC、BeO或Si3N4。例如,衬底10可以是例如直接铜接合(DCB)衬底、直接铝接合(DAB)衬底或者活性金属钎焊(AMB)衬底。此外,衬底10可以是绝缘金属衬底(IMS)。例如,绝缘金属衬底一般地包括电介质绝缘层11,电介质绝缘层11包括(填充有)诸如环氧树脂或聚酰亚胺的材料。例如,可以用陶瓷颗粒填充电介质绝缘层11的材料。这种颗粒可以包括例如Si2O、Al2O3、AlN或BN,并且可以具有在约1μm与约50μm之间的直径。衬底10还可以是具有非陶瓷电介质绝缘层11的常规印刷电路板(PCB)。例如,非陶瓷电介质绝缘层11可以由固化树脂组成或者包括固化树脂。
半导体衬底10布置在外壳40中。图1中所示的外壳40仅包括侧壁和盖,但是没有地表面。相反,半导体衬底10形成外壳的地表面。然而,这仅仅是示例。外壳40也可以包括地表面,使得外壳40形成封闭的壳体。例如,半导体衬底10可以布置在热沉12上。然而,也有可能功率半导体模块还包括布置在半导体衬底10与热沉12之间的附加基板(附图中未示出)。例如,这种基板可以形成外壳40的地表面。在图1中,仅示出了一个半导体衬底10。在一些功率半导体模块装置中,多于一个的半导体衬底10可以布置在单个外壳40中。例如,外壳40可以包括金属或金属合金。然而,例如,也有可能外壳40包括诸如塑料或陶瓷材料的电绝缘材料。例如,外壳40还可以包括液晶聚合物。
一个或多个半导体主体20可以布置在半导体衬底10上。布置在半导体衬底10上的半导体主体20中的每一个可以包括二极管、IGBT(绝缘栅极双极型晶体管)、MOSFET(金属氧化物半导体场效应晶体管)、JFET(结型场效应晶体管)、HEMT(高电子迁移率晶体管)或者任何其他合适的可控半导体元件。
一个或多个半导体主体20可以在半导体衬底10上形成半导体装置。在图1中,仅示例性地示出了两个半导体主体20。图1中的半导体衬底10的第二金属化层112是连续层。图1中示例的第一金属化层111也是连续层。然而,第一金属化层111或第二金属化层112或两者也可以是结构化层。“结构化层”意味着例如相应的金属化层111、112不是连续层,而是包括在该层的不同区段之间的凹陷。不同的半导体主体20可以安装到第一金属化层111的相同区段或不同区段。第一金属化层111的不同区段可以不具有电连接,或者可以使用例如接合导线电连接到一个或多个其他区段。例如,仅举几个例子,电连接还可以包括连接板或导体轨。一个或多个半导体主体20可以通过导电连接层22电气且机械地连接到半导体衬底10。例如,这种导电连接层22可以是焊料层、导电粘合剂层或者烧结金属粉末(例如,烧结银粉末)层。半导体主体20还可以通过诸如接合导线或接合带的电连接24而电连接到半导体衬底10。
功率半导体模块还包括端子元件30。端子元件30电连接到半导体衬底10,例如,电连接到半导体衬底10的第一金属化层111,并且形成在外壳40的内部与外部之间提供电连接的接触元件。端子元件30的第一端部可以通过导电连接层(未具体示出)电气且机械地连接到第一金属化层111。例如,这种导电连接层可以是焊料层、导电粘合剂层或者烧结金属粉末(例如,烧结银粉末)层。端子元件30的第二端部从外壳40突出,以允许从外部电接触接触元件。外壳40的盖可以包括开口,端子元件30可以通过开口突出,使得它们的第一侧在外壳40的内部,并且它们的第二侧在外壳40的外部。在外壳40被布置为围绕半导体衬底10时,端子元件30可以垂直地从外壳40突出。
功率半导体模块还可以包括浇注化合物5。例如,浇注化合物5可以由硅凝胶组成或者包括硅凝胶,或者可以是刚性模制化合物。浇注化合物5可以部分地填充外壳40的内部,由此覆盖半导体衬底10和半导体主体20、以及布置在半导体衬底10上的任何其他部件和电连接24。电连接24(例如,接合导线或接合带)可以将半导体主体20电耦合到第一金属化层111、电耦合到其他半导体主体20、或者电耦合到可以布置在外壳的内部的任何其他部件。端子元件30可以部分地嵌入在浇注化合物5中。然而,至少端子元件30的第二端部可以不被浇注化合物5覆盖,并且可以从浇注化合物5突出。浇注化合物5被配置为保护功率半导体模块装置内部(特别是外壳40内部)的部件和电连接免受某些环境条件、机械损坏和绝缘故障的影响。
半导体衬底10可以通过连接层(在图1中未具体示出)连接到热沉12。例如,这种连接层可以是焊料层、粘合剂材料层或烧结金属粉末(例如,烧结银粉末)层。任何其他种类的导电或非导电连接层也是可能的。
外壳40的侧壁一般地可以通过接头(在附图中未具体示出)机械地连接到半导体衬底10。例如,该接头可以是焊料接头、冷焊接头或者粘合剂接头。任何其他合适的接头也可以将外壳40的侧壁机械地连接到半导体衬底,这也提供了合适的密封,使得没有或至少较少的气体可以进入外壳40。侧壁和地表面可以替代地被提供为单个件(未具体示出)。这意味着在外壳40的侧壁与地表面之间没有接头。
端子元件30从外壳40突出的区段可以机械且电气地耦合到印刷电路板44。通常,印刷电路板44包括通孔,并且端子元件30插入穿过相应的通孔。印刷电路板44可以包括导电迹线(未具体示出),并且端子元件30可以通过一个或多个导电迹线电耦合到一个或多个其他端子元件30。以这种方式,电连接可以提供在第一金属化层111的不同区段之间、提供在不同的半导体主体20之间、和/或提供在布置在半导体衬底10上或同一外壳40内的其他衬底上的任何其他部件之间。通常,具有包括半导体主体20和端子元件30的半导体装置的功率半导体模块是预制的,并且客户可以将他们自己的定制印刷电路板44安装到预制的功率半导体模块。
在具有半导体衬底10、外壳40和印刷电路板44的半导体模块装置完全地组装时,将该装置安装到热沉12。通常,外壳40包括具有螺纹孔54的突起。热沉12也可以包括螺纹孔54。因此,外壳40可以通过插入到螺纹孔54中的螺钉52附接到热沉12。
在外壳安装到热沉12上时,印刷电路板44通常已经附接到外壳40。在很多情况下,在印刷电路板44上需要大量的导电迹线。因此,印刷电路板44通常尺寸大,和/或包括两个或更多导电层(例如,多层电路板)。印刷电路板44的截面面积通常比外壳40的截面面积大。因此,印刷电路板44可以在水平平面中显著地突出超过外壳40的侧壁。然而,这使得难以触及螺纹孔54和螺钉52,以便将外壳40安装到热沉12上。出于此原因,在印刷电路板44中提供开口56。这种开口56直接布置在具有通孔54的相应的突起上方,并且直径足够大,以能够将螺钉52插入到螺纹孔54中,并且能够用适当的工具触及螺钉52,以拧紧螺钉52。然而,这种开口56要求印刷电路板44的空间,因此这些空间不能用于提供导电迹线。这进一步增加了印刷电路板44的整体尺寸以及整个功率半导体模块装置的成本。
现在参考图2中所示的示例,其示意性地示出了功率半导体模块,该功率半导体模块不要求印刷电路板44中的任何开口,以便能够将外壳40安装到热沉12上。图2中所示的装置包括销或螺栓62(即,压制螺栓),以用于将外壳40安装在热沉12上,而不是如上文关于图1描述的螺钉52。销或螺栓62可以插入到提供在外壳40的部件中的通孔64中。例如,该部件可以是外壳40的侧壁。替代地,例如,该部件可以包括耦合到外壳40的侧壁的突起66。这种突起66可以与外壳40的侧壁一体地形成,或者可以以任何合适的方式(例如,通过粘合剂层)附接到侧壁。在将印刷电路板44安装到外壳40上之前,销或螺栓62可以插入到提供在外壳40的部件中的通孔64中。此时,通孔64仍然容易触及。在将印刷电路板44安装到外壳40之后,外壳40然后可以容易地安装到热沉12上。热沉12还包括孔64。销或螺栓62可以被推入到提供在热沉12中的孔64中。不要求销或螺栓62的旋转运动。热沉12中的孔64的直径可以等于或仅稍大于销或螺栓62的直径。至少一个销或螺栓62中的每一个通过按压动力而压入到热沉12中的相应的孔64中。
其中插入有销或螺栓62的外壳40的通孔64可以直接布置在印刷电路板44的限定的接触区域下面。第一压制工具70可以用于在印刷电路板44的至少一个限定的接触区域施上加力,由此将至少一个销或螺栓62中的每一个压入到热沉12中的相应的孔64中。外壳40可以布置在热沉12上,使得外壳40的部件中的通孔64与提供在热沉12中的孔64对准。销或螺栓62可以具有在垂直方向y上足够长的长度,以允许销或螺栓62插入到热沉12中的孔64中,并且仍然与印刷电路板44直接接触,如图3中示意性所示,其示出了处于完全组装状态的图2的装置。
销或螺栓62可以均包括主体和头部,头部的直径大于主体,以便防止销或螺栓62穿过外壳40的通孔64掉落。因此,销或螺栓62的上端(其是指向印刷电路板44的端部)总是保持在外壳40的部件中的通孔64的外部。头部的直径越大,施加在销或螺栓62上的任何压力将被分散得越多。也就是说,如果销或螺栓62的头部的直径变得越大,则印刷电路板44的限定的区域的直径将变得越大。因此,每单位面积需要施加到印刷电路板44的压力减小,这降低了损坏印刷电路板44的风险。例如,第一压制工具70的直径可以根据头部的直径来选择。即使压力直接施加到印刷电路板44,也可以在限定的接触区域中提供导电迹线。不需要保持印刷电路板44的接触区域没有导电迹线。为了降低损坏布置在接触区域中的任何导电迹线的风险,例如,导电迹线可以通过在形成导电迹线时沉积较厚的导电材料层来实施。
销或螺栓62可以包括在暴露于高温时不会变形或收缩的材料。在功率半导体模块装置的使用期间,通常由布置在至少一个半导体衬底10上的半导体装置生成热量。该热量被传递到热沉12,以避免部件过热。销或螺栓62应当在任何时候都牢固地压入到热沉12的孔64中,以避免外壳从热沉12脱落。因此,销或螺栓62可以由即使在高于50℃或高于100℃的温度下也能保持其形状的材料或材料的混合物制成。以这种方式,即使在高温下,销或螺栓62的直径也基本保持恒定,并且保持牢固地压在孔62中。
在图2和图3中所示的示例中,销或螺栓62与印刷电路板44直接接触。然而,这仅仅是示例。如图4的示例中示意性地所示,间隔体元件68可以布置在至少一个销或螺栓62中的每一个的上端与印刷电路板44之间,并且在印刷电路板44的相应的接触区域下方。以这种方式,销或螺栓62在垂直方向上的总长度可以减小。例如,间隔体元件68可以是单独的部分,或者可以附接到外壳40。间隔体元件68被配置为跨越并且绕过销或螺栓62与印刷电路板44之间的距离。由第一压制工具70施加到印刷电路板44上的压力然后被传递到间隔体元件68,并且从那里被传递到销或螺栓62,销或螺栓62然后被推入到热沉12中的孔64中。然而,无论该装置包括间隔体元件68(参见图4)还是不包括间隔体元件68(参见图2和图3),压入力总是经由印刷电路板44被施加,并且被直接或间接地传递到销或螺栓62。
在图2、图3和图4中所示的示例中,热沉12中的孔64具有在垂直方向y上的深度,该深度小于热沉12在相同方向y上的厚度。然而,这仅仅是示例。如图5中示例性地所示,热沉12中的孔64也可以是通孔,其在垂直方向y上具有等于热沉12在相同方向y上的厚度的深度。以这种方式,销或螺栓62可从功率半导体模块装置的底侧触及,其中,底侧是功率半导体模块装置的其上布置有热沉12的一侧。如果销或螺栓62是可以从底侧触及,则如果需要,他们可以从热沉12中的孔64推出,以便从热沉12去除外壳40。例如,可以使用特殊的去除工具(未具体示出)。例如,这种去除工具可以包括销,其具有小于孔64的直径的直径。以这种方式,可以从底侧将力施加在销或螺栓62上,并且从底侧将去除工具插入到孔64中,以便将销或螺栓62从孔64完全地推出。
现在参考图6,弹性或弹力元件661可以布置在外壳40的部件66、662(例如,突起)与印刷电路板44之间。销或螺栓62的头部可以布置在弹性或弹力元件661与印刷电路板44之间。每个弹性或弹力元件661可以包括通孔64。至少一个弹性或弹力元件661可以布置在外壳40的部件66、662上,使得弹性或弹力元件661的通孔64与相应的部件66、662的通孔64对准。弹性或弹力元件661可以被配置为限制施加到热沉12的力。只要施加在弹性或弹力元件661上的压力低于定义的阈值,弹性或弹力元件661就可以保持其原始形状。如果压力超过阈值,则弹性或弹力元件661发生变形或被压缩。
在图5和图6中所示的示例中,该装置包括如已经关于图4描述的间隔体元件68。然而,在这些示例中,也可以省略间隔体元件68。更进一步地,如关于图5描述的热沉12中的通孔64可以存在于任何其他所示的示例中。
在使用如上文已经关于图2到图6描述的销或螺栓62时,与包括螺钉52的装置相比,可以需要更少的时间来执行实际安装工艺,因为拧入螺钉52一般地比推入销或螺栓62需要更多的时间。
现在参考图7,其示例性地示出了用于制造功率半导体模块装置的方法。参考图7A,该方法可以包括将至少一个半导体衬底10布置在外壳40中。每个半导体衬底10可以包括电介质绝缘层11和附接到电介质绝缘层11的第一金属化层111。外壳40可以包括延伸穿过外壳40的部件66、662的至少一个通孔64。参考图7B,该方法还包括将至少一个销或螺栓62插入到至少一个通孔64中,其中,销或螺栓62的上端未插入到通孔64中。随后,如图7C中所示,将印刷电路板44布置在外壳40上。现在参考图7D,该方法还包括将外壳40布置在热沉12上,热沉12包括至少一个孔64,其中,外壳40布置到热沉12上,使得至少一个通孔64中的每一个与热沉12中的至少一个孔64中的一个对准。使用第一压制工具70,将力施加在印刷电路板44的至少一个限定的接触区域上。由此,将至少一个销或螺栓62中的每一个压入到热沉12中的相应的孔64中,其中,至少一个限定的接触区域中的每一个直接布置在至少一个销或螺栓62中的一个上方。
Claims (13)
1.一种用于制造功率半导体模块装置的方法,所述方法包括:
将至少一个半导体衬底(10)布置在外壳(40)中,每个半导体衬底(10)包括电介质绝缘层(11)和附接到所述电介质绝缘层(11)的第一金属化层(111),并且所述外壳(40)包括延伸穿过所述外壳(40)的部件(66、662)的至少一个通孔(64);
将至少一个销或螺栓(62)插入到所述至少一个通孔(64)中,其中,所述销或螺栓(62)的上端未插入到所述通孔(64)中;
将印刷电路板(44)布置在所述外壳(40)上;
将所述外壳(40)布置在热沉(12)上,所述热沉(12)包括至少一个孔(64),其中,所述外壳(40)布置在所述热沉(12)上,使得所述至少一个通孔(64)中的每一个与所述热沉(12)中的所述至少一个孔(64)中的一个对准;以及
使用第一压制工具(70),由此在所述印刷电路板(44)的至少一个限定的接触区域上施加力,并且将所述至少一个销或螺栓(62)中的每一个压入到所述热沉(12)中的相应的孔(64)中,其中,所述至少一个限定的接触区域中的每一个直接布置在所述至少一个销或螺栓(62)中的一个上方。
2.根据权利要求1所述的方法,还包括:
将至少一个导电端子元件(30)中的每一个布置在所述至少一个半导体衬底(10)中的一个上,由此将所述至少一个端子元件(30)中的每一个的第一端部电气且机械地耦合到相应的半导体衬底(10),其中
将所述印刷电路板(44)布置在所述外壳(40)上还包括将所述印刷电路板(44)电气且机械地耦合到所述至少一个端子元件(30)中的每一个的第二端部。
3.根据权利要求1或2所述的方法,还包括将间隔体元件(68)布置在所述至少一个销或螺栓(62)中的每一个的所述上端与所述印刷电路板(44)之间,并且布置在所述印刷电路板(44)的相应的接触区域下方。
4.根据权利要求1到3中的任何一项所述的方法,其中,所述至少一个销或螺栓(62)中的每一个通过按压动力而被压入到所述热沉(12)中的所述相应的孔(64)中,而不执行所述至少一个销或螺栓(62)的任何旋转运动。
5.根据权利要求1到4中的任何一项所述的方法,还包括
将至少一个弹性或弹力元件(661)布置在所述外壳(40)的所述部件(66、662)上,其中
所述弹性或弹力元件(661)中的每一个包括通孔(64),
将所述至少一个弹性或弹力元件(661)布置在所述外壳(40)的所述部件(66、662)上包括将每个弹性或弹力元件(661)的所述通孔(64)与所述外壳(40)的所述部件(66、662)中的所述通孔(64)中的一个对准,并且
只要施加在所述弹性或弹力元件(661)上的压力低于定义的阈值,所述弹性或弹力元件(661)就保持其原始形式,并且如果所述压力超过所述定义的阈值,则所述弹性或弹力元件(661)发生变形或被压缩。
6.一种功率半导体模块装置,包括:
外壳(40),所述外壳(40)具有延伸穿过所述外壳(40)的部件(66、662)的至少一个通孔(64);
至少一个半导体衬底(10),所述至少一个半导体衬底(10)布置在所述外壳(40)中,并且包括电介质绝缘层(11)和附接到所述电介质绝缘层(11)的第一金属化层(111);
印刷电路板(44),所述印刷电路板(44)布置在所述外壳(40)的外部;
热沉(12),所述热沉(12)包括至少一个孔(64),其中,所述外壳(40)布置在所述热沉(12)上,使得所述至少一个通孔(64)中的每一个与所述热沉(12)中的所述至少一个孔(64)中的一个对准;以及
至少一个销或螺栓(62),其中,所述至少一个销或螺栓(62)中的每一个延伸穿过所述至少一个通孔(64)中的一个,并且进入到所述热沉(12)中的对应的孔(64)中,并且其中,所述销或螺栓(62)的上端未插入到所述通孔(64)中;其中
所述至少一个销或螺栓(62)中的每一个布置在所述印刷电路板(44)的至少一个限定的接触区域中的一个下方,其中,所述至少一个限定的接触区域被配置为暴露于由第一压制工具(70)施加的压力。
7.根据权利要求6所述的功率半导体模块装置,还包括至少一个导电端子元件(30),所述至少一个导电端子元件(30)利用第一端部电气且机械地耦合到所述至少一个半导体衬底(10)中的一个,其中,所述印刷电路板(44)电气且机械地耦合到所述至少一个端子元件(30)中的每一个的第二端部。
8.根据权利要求6或7所述的功率半导体模块装置,还包括间隔体元件(68),所述间隔体元件(68)在所述至少一个销或螺栓(62)中的每一个的所述上端与所述印刷电路板(44)之间,并且在所述印刷电路板(44)的相应的接触区域下方。
9.根据权利要求6到8中的任何一项所述的功率半导体模块装置,还包括至少一个弹性或弹力元件(661),所述至少一个弹性或弹力元件(661)布置在所述外壳(40)的所述部件(66、662)上,其中,所述弹性或弹力元件(661)中的每一个包括通孔(64),其中,每个弹性或弹力元件(661)的所述通孔(64)与所述外壳(40)的所述部件(66、662)中的所述通孔(64)中的一个对准,并且其中,所述至少一个销或螺栓(62)中的每一个延伸穿过所述至少一个弹性或弹力元件(661)中的一个的所述通孔(64),穿过对应的部件(66、662)的所述通孔(64),并且进入到所述热沉(12)中的所述对应的孔(64)中。
10.根据权利要求6到9中的任何一项所述的功率半导体模块装置,其中,所述至少一个弹性或弹力元件(661)被配置为在施加到所述弹性或弹力元件(661)的压力超过预定义的阈值时发生变形。
11.根据权利要求6到10中的任何一项所述的功率半导体模块装置,其中,所述热沉(12)中的所述至少一个孔(64)是从所述热沉(12)的上表面延伸到与所述上表面相对的底表面的通孔,其中,所述至少一个销或螺栓(62)从所述上表面朝向所述印刷电路板(44)延伸,并且其中,所述至少一个销或螺栓(62)能够从所述热沉(12)的所述底表面触及。
12.根据权利要求6到11中的任何一项所述的功率半导体模块装置,其中,所述至少一个销或螺栓(62)包括在高于50℃或高于100℃的温度下基本保持其原始形状的材料。
13.根据权利要求6到12中的任何一项所述的功率半导体模块装置,其中,所述至少一个销或螺栓(62)中的每一个包括主体和在所述主体的上端处的头部,并且其中,所述头部的截面面积大于所述主体的截面面积。
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