CN113903702A - Chuck device of semiconductor processing equipment and semiconductor processing equipment - Google Patents
Chuck device of semiconductor processing equipment and semiconductor processing equipment Download PDFInfo
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- CN113903702A CN113903702A CN202111262188.3A CN202111262188A CN113903702A CN 113903702 A CN113903702 A CN 113903702A CN 202111262188 A CN202111262188 A CN 202111262188A CN 113903702 A CN113903702 A CN 113903702A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge clamping, e.g. clamping ring
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/67034—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68728—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of separate clamping members, e.g. clamping fingers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68792—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the construction of the shaft
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Abstract
The embodiment of the invention provides a chuck device and semiconductor process equipment applying the same, which comprises: the wafer clamping device comprises a bearing disc for bearing a wafer, a driving disc connected with the bearing disc, a plurality of fixing structures distributed at intervals along the circumferential direction of the driving disc and a clamping driving device; wherein, the outer periphery of the driving disk is provided with a first transmission part; each fixing structure is provided with a second transmission part, and the second transmission part is matched with the first transmission part so that the driving disc can drive each fixing structure to rotate around the respective rotation axis; the clamping driving device is connected with the bearing plate and used for driving the driving plate to rotate for a specified angle along a first direction or a second direction opposite to the first direction, so that the driving plate drives the plurality of clamping parts to synchronously rotate to a first position capable of fixing the wafer together or a second position capable of releasing the wafer from being fixed. The chuck device and the semiconductor processing equipment provided by the embodiment of the invention can stably clamp the wafer so as to prevent the wafer from being thrown off when the chuck device rotates.
Description
Technical Field
The invention relates to the field of semiconductor manufacturing, in particular to a chuck device of semiconductor processing equipment and the semiconductor processing equipment.
Background
The wafer processing process usually employs a cleaning process and a spin-drying process to remove impurities and liquid remaining on the wafer surface, respectively. In the process of cleaning a wafer, the wafer and a chuck are usually fixed, so that the chuck drives the wafer to rotate at a constant speed, and thus, a liquid medicine can be uniformly sprayed on the surface of the wafer, and the uniformity of cleaning is improved; during the spin-drying process, the wafer is also fixed on the chuck and driven by the chuck to rotate at a high speed, so as to utilize the centrifugal force to spin the liquid (e.g. chemical liquid) remaining on the wafer surface away from the wafer surface.
Therefore, in both the wafer cleaning process and the spin-drying process, the wafer needs to be fixed on the chuck and rotated along with the chuck, and therefore, a chuck capable of stably clamping the wafer is proposed, which is a problem to be solved in the field of semiconductor processing.
Disclosure of Invention
The embodiment of the invention aims to solve at least one technical problem in the prior art, and provides a chuck device capable of stably clamping a wafer and semiconductor processing equipment using the same.
In order to achieve the object of the present invention, there is provided a chuck device in a semiconductor processing apparatus, for connecting with a rotation driving device for driving the chuck device to rotate, the chuck device comprising: the device comprises a bearing disc, a driving disc, a plurality of fixing structures and a clamping driving device; the bearing disc is provided with a bearing surface for bearing the wafer, and can rotate around the axis of the bearing disc; the driving disc is arranged on one side, away from the bearing surface, of the bearing disc, and a first transmission part is arranged on the outer periphery of the driving disc;
the fixing structures are distributed at intervals along the circumferential direction of the bearing disc, one end of each fixing structure is a clamping part, at least part of each clamping part is positioned above the bearing surface, the other end of each fixing structure is a second transmission part, and the second transmission parts are matched with the first transmission parts; the clamping driving device is connected with the driving disc and used for driving the driving disc to rotate for a specified angle along a first direction or a second direction opposite to the first direction, so that the driving disc drives the clamping parts to synchronously rotate to a first position capable of fixing the wafer together or synchronously rotate to a second position capable of releasing the wafer from being fixed.
Optionally, the first transmission part is a first gear tooth structure distributed on the outer peripheral surface of the driving disc, and the second transmission part is a second gear tooth structure engaged with the first gear tooth structure.
Optionally, each of the fixing structures includes a rotating shaft and an eccentric shaft connected to the rotating shaft and eccentrically disposed with respect to the rotating shaft, the eccentric shaft forms the clamping portion, and a side of the rotating shaft away from the eccentric shaft forms the second gear tooth structure; in the first position, the side wall of the eccentric shaft is abutted against the edge of the wafer; in the second position, the side wall of the eccentric shaft is separated from the edge of the wafer.
Optionally, the clamping driving device includes a swing motor and a transmission mechanism; one end of the transmission mechanism is connected with a power output end of the swing motor, and the other end of the transmission mechanism is connected with the driving disc; the swing motor is used for driving the transmission mechanism to swing for a specified angle along a third direction or a fourth direction opposite to the third direction so as to drive the driving disc to rotate for a specified angle along the first direction or the second direction.
Optionally, the driving disc includes an outer ring, an inner ring and a plurality of connecting bars, and the plurality of connecting bars are arranged between the outer ring and the inner ring at intervals; the first transmission part is arranged on the outer side wall of the outer ring; the transmission mechanism comprises a transmission rod and a transmission claw; the transmission claw is used for fixing the connecting strip; and two ends of the transmission rod are respectively connected with the transmission claw and the power output end of the swing motor.
Optionally, the driving claw comprises a driving claw main body, a plurality of movable claw heads and a buffer structure; wherein the driving pawl body is formed with a recess for receiving the connecting bar; one end of each movable claw head is rotatably connected with the top of the concave part of the transmission claw main body, and the other end of each movable claw head faces the concave part direction and is used for clamping the connecting strip; the buffer structure is arranged between the movable claw head and the transmission claw main body and is used for buffering impact force applied to the movable claw head.
Optionally, the spring and the two ends of the damper are respectively connected with the movable claw head and the transmission claw main body.
Optionally, the clamping driving device includes a stepping motor and a transmission mechanism; the transmission mechanism comprises a third gear structure and a fourth gear structure which are meshed with each other, and the third gear structure is connected with the driving disc, coaxial with the driving disc and synchronously rotated; the fourth gear structure is connected with the power output end of the stepping motor, is coaxial with the power output end of the stepping motor and synchronously rotates; the step motor is used for driving the fourth gear structure to rotate for a specified angle along a fifth direction or a sixth direction opposite to the fifth direction.
Optionally, the chuck device further comprises a controller, and the controller is used for controlling the clamping driving device to drive the driving disc to rotate at a preset rotation speed; when the plurality of clamping parts rotate from the second position to the first position, the preset rotating speed is gradually reduced; when the plurality of clamping parts rotate from the first position to the second position, the preset rotating speed is gradually increased.
As another technical solution, the present invention also provides a semiconductor processing apparatus, which is characterized by comprising a chuck device and a rotation driving device; wherein the chuck device adopts the chuck device of any one of the above embodiments; the rotation driving device is used for driving the chuck device to rotate.
The embodiment of the invention has the following beneficial effects:
according to the chuck device of the semiconductor processing equipment provided by the embodiment of the invention, the first transmission part is arranged on the driving disc, the second transmission part matched with the first transmission part is arranged on each fixing structure, and the clamping driving device is utilized to control the driving disc to rotate towards the appointed direction by the appointed angle, so that the positions of the clamping parts of the fixing structures can be adjusted by adjusting the driving force output by the clamping driving device, the clamping parts are abutted against the edge of the wafer, and the wafer is clamped by the chuck device. Moreover, the clamping part can be adjusted to the position capable of applying proper clamping force to the wafer by adjusting the rotation angle of the driving disc, so that the problem that the wafer cannot be clamped by the chuck due to insufficient clamping force can be avoided, the wafer is thrown off in the rotation process, and the problem that the wafer is crushed due to the fact that the wafer is clamped by the chuck due to too high clamping force can be avoided.
According to the semiconductor processing equipment provided by the embodiment of the invention, the wafer is clamped by the chuck device in the embodiment, so that the wafer is stably clamped on the chuck device in the process, and the wafer is prevented from being thrown off to collide with other parts of the semiconductor processing equipment to be broken.
Drawings
Fig. 1 is a schematic structural diagram of a chuck apparatus according to an embodiment of the present invention;
fig. 2 is a schematic structural diagram of a carrier tray and a drive tray according to an embodiment of the present invention;
fig. 3 is a schematic structural diagram of a driving disc according to an embodiment of the present invention;
FIG. 4 is a schematic structural diagram of a fixing structure according to an embodiment of the present invention;
fig. 5 is a schematic structural diagram of a driving device according to an embodiment of the present invention;
fig. 6 is a partial structural schematic view of a driving pawl according to an embodiment of the present invention.
Detailed Description
In order to make those skilled in the art better understand the technical solution of the present invention, the chuck device of a semiconductor processing apparatus and the semiconductor processing apparatus using the same provided by the present invention will be described in detail below with reference to the accompanying drawings.
The present invention provides a chuck device, which is applied to semiconductor processing equipment, and particularly, for example, to wafer cleaning equipment, when these equipment are used for processing, a wafer needs to be fixed on a chuck and driven by the chuck to rotate at a high speed, so as to uniformly spray a chemical solution on the surface of the wafer or to spin the residual liquid (e.g., chemical solution) on the surface of the wafer away from the surface of the wafer by using a centrifugal force. In the prior art, an elastic chuck is usually used for fixing a wafer, specifically, a spring structure is arranged between a plurality of fixing structures for fixing the wafer in the elastic chuck and a bearing disc so as to clamp the wafer by using the elasticity of the spring, but due to the strength and fatigue degree of the spring, the elastic chuck may apply an excessive clamping force to the wafer or cannot clamp the wafer in practical application; if the chuck cannot clamp the wafer, the wafer is thrown out under the action of centrifugal force in the process of high-speed rotation, and then the wafer collides with other parts of equipment to be broken, and the equipment is easily damaged; if the chuck holds the wafer too tightly, the wafer will be broken due to the external force exceeding the elastic limit.
Referring to fig. 1 and fig. 2, in order to solve the above technical problem, the chuck apparatus provided in this embodiment includes the following structures: a driving disc 1, a plurality of fixing structures 2, a clamping driving device 3 and a bearing disc 4. The bearing disc 4 is provided with a bearing surface S for bearing the wafer and can rotate around the axis of the bearing surface S; the driving disk 1 is arranged on one side of the bearing disk 4, which is far away from the bearing surface S, and is relatively fixed with the bearing disk 4, and the outer periphery of the driving disk 1 is provided with a first transmission part 11; a plurality of fastening structures 2 are spaced apart along the circumference of the carrier plate 4. Specifically, one end of the fixing structure 2 is a clamping portion 23, and at least a part of the clamping portion 23 is located above the plane of the bearing surface S; the other end of the fixed structure 2 is provided with a second transmission part 21, and the second transmission part 21 is matched with the first transmission part 11, so that the driving disc 1 can drive each fixed structure 2 to rotate around the respective rotation axis; specifically, the first transmission part 11 and the second transmission part 21 may be engaged by a mechanical transmission method such as gear engagement transmission, pulley transmission, or crank-link transmission, as long as each of the fixing structures 2 can rotate around its own rotation axis under the driving of the driving disc 1.
The clamping driving device 3 is connected with the driving disc 1, and is used for driving the driving disc 1 to rotate by a specified angle along a first direction, so that the driving disc 1 drives the plurality of clamping portions 23 to synchronously rotate to a first position, the first position can meet the requirement that the plurality of clamping portions 23 jointly fix the wafer, specifically, when the plurality of clamping portions 23 are simultaneously located at the first position, the wafer is subjected to pressure applied to the edge of the wafer by the plurality of clamping portions 23, and the degree of freedom in the horizontal direction is limited, so that the wafer is fixed in an area limited by the plurality of clamping portions 23; moreover, since the pressure applied to the wafer by the clamping portion 23 is equal to the elastic stress generated by the elastic deformation of the wafer due to the extrusion, and the amount of the elastic deformation of the wafer is equal to the distance difference between the first position of the clamping portion 23 and the original state of the edge of the wafer, it can be easily understood that the magnitude of the pressure applied to the edge of the wafer by the clamping portion 23 can be adjusted by adjusting the position of the clamping portion 23, specifically, the closer the first position of the clamping portion 23 is to the center of the wafer, the greater the pressure applied to the wafer by the clamping portion 23 is; the clamping driving device 3 is further configured to drive the driving disc 1 to rotate by a designated angle in a second direction opposite to the first direction, so that the driving disc 1 drives the plurality of clamping portions 23 to synchronously rotate to a second position, where the second position can satisfy that the plurality of clamping portions 23 can release the wafer from being fixed, that is, the plurality of clamping portions 23 are all separated from the edge of the wafer. Specifically, the first direction and the second direction are a counterclockwise direction and a clockwise direction on the plane of the bearing surface of the drive disc 1, respectively.
The chuck device provided by the embodiment is characterized in that a transmission part is arranged between the driving disc 1 and each fixing structure 2, and the clamping driving device 3 is utilized to control the driving disc 1 to rotate towards a specified direction by a specified angle, so that the driving disc 1 can drive each fixing structure 2 matched with the driving disc 1 to synchronously rotate to a specified position, therefore, the chuck device provided by the embodiment can adjust the rotation angle of the driving disc 1 by adjusting the power output quantity and direction of the clamping driving device 3, further, the driving disc 1 drives the fixing structure 2 to rotate to the specified position, and the position can be a position where the clamping part 23 can apply proper clamping force to a wafer, thereby not only preventing the wafer from being clamped by the chuck due to insufficient clamping force, and throwing off the wafer in the rotating process, but also preventing the wafer from being clamped by the chuck due to excessive clamping force, causing the wafer to be crushed.
It should be noted that, when the chuck apparatus provided in this embodiment is applied to a wafer cleaning apparatus or other apparatuses that require a wafer to be driven by a chuck to rotate at a high speed, the process of controlling the clamping portion 23 to rotate from the first position to the second position and the process of controlling the clamping portion 23 to rotate from the second position to the first position are performed before the wafer cleaning process is started and after the process is completed, respectively, so as to fix the wafer to the chuck apparatus before the chuck apparatus starts to rotate, and to remove the wafer from the chuck apparatus after the chuck apparatus finishes rotating. And in the process that the wafer cleaning equipment carries out the technology, the chuck device wholly rotates, namely, in the rotation process of the chuck device, a driving disc 1, a plurality of fixing structures 2, a clamping driving device 3 and a bearing disc 4 in the chuck device are relatively static, the clamping driving device 3 continuously controls the driving disc 1 to keep the current position, so that the fixing structures 2 are continuously positioned at the first position, therefore, in the rotation process of the chuck device, the wafer is stably clamped, and the wafer is prevented from being thrown and taken off in the rotation process.
In some embodiments, as shown in fig. 3 and 4, the aforementioned first transmission part 11 is a first gear tooth structure distributed on the outer peripheral surface of the drive disc 1; the second transmission part 21 is a second gear structure engaged with the first gear structure. Specifically, the first gear structure 11 is, for example, a plurality of gear teeth uniformly arranged on the outer peripheral surface of the drive disk 1, and the plurality of gear teeth and the drive disk 1 having a substantially disk shape can form a drive gear; the second gear structure 21 is a driven gear with a module equal to that of the driving gear, so that when the driving disc 1 is controlled by the clamping driving device 3 to rotate by a specified angle, the driving gear can drive each driven gear to rotate by a corresponding angle; it should be noted that, since the diameter of the driving disk 1 is generally larger than that of each fixed structure 2, when the driving disk 1 rotates by a given angle, each fixed structure 2 rotates by a corresponding angle larger than the given angle.
In some embodiments, as shown in fig. 1 and 4, each fixed structure 2 comprises a rotation shaft 22 and an eccentric shaft. Wherein, the eccentric shaft is fixed on the upper surface of the rotating shaft 22 to form the above-mentioned clamping portion 23, and the side of the rotating shaft departing from the eccentric shaft is formed with the above-mentioned second gear structure to form the above-mentioned second transmission portion 21. Specifically, the position of the axis of the rotating shaft 22 is relatively fixed with the position of the axis of the driving disc 1; the eccentric shaft is connected to the rotary shaft 22 and is eccentrically disposed with respect to the axis of the rotary shaft 22 such that when the eccentric shaft (the clamping portion 23) is in a first position, the side wall of the eccentric shaft abuts against the edge of the wafer, and when the eccentric shaft is in a second position, the side wall of the eccentric shaft is spaced apart from the edge of the wafer. Specifically, since most wafers are perfectly circular in actual production, in order to enable uniform stress at the edges of the wafers, the diameters of the rotation shafts 22 in each of the fixed structures 2 are all equal, the diameters of the eccentric shafts in each of the fixed structures 2 are also all equal, and the distances from the axes of the eccentric shafts to the axes of the rotation shafts 22 are also all equal.
In some embodiments, since the eccentric shaft (the clamping portion 23) is in direct contact with the wafer, in an actual process, the eccentric shaft is easily contacted with the chemical liquid thrown away from the surface of the wafer, and in order to prevent the eccentric shaft from being corroded by the chemical liquid, the eccentric shaft can be made of Polychlorotrifluoroethylene (PCTFE) material, and the PCTFE has good wear resistance and corrosion resistance and high hardness, so that the service life of the eccentric shaft can be prolonged, and frequent maintenance is not needed.
In some embodiments, as shown in fig. 5, the clamping drive 3 comprises a swing motor 31 and a transmission mechanism 32. Wherein, one end of the transmission mechanism 32 is connected with the power output end of the swing motor 31, and the other end of the transmission mechanism 32 is connected with the driving disc 1. The swing motor 31 can control the transmission mechanism 32 to perform a reciprocating swing action, and specifically, is configured to drive the transmission mechanism 32 to swing for a specified angle in a third direction or a fourth direction opposite to the third direction, so as to drive the driving disc 1 to rotate for a specified angle in the first direction or the second direction. Specifically, the first direction and the second direction are respectively an anticlockwise direction and a clockwise direction on a plane where the wafer bearing surface S is located, the third direction and the fourth direction are respectively an anticlockwise direction and a clockwise direction on a plane perpendicular to the wafer bearing surface S, a tangential direction of the third direction is the same as a tangential direction of the first direction, and a tangential direction of the fourth direction is the same as a tangential direction of the second direction.
In some embodiments, as shown in fig. 1, in order to avoid the clamping driving device 3 from obstructing the placement of the wafer and to uniformly spray the liquid on the surface of the wafer in the subsequent process, the swing motor 31 and the transmission mechanism 32 are both disposed below the driving disk 1. Furthermore, in order to prevent the transmission mechanism 32 from being corroded by the liquid medicine flowing from above, the transmission mechanism 32 may be made of a corrosion-resistant material. In addition, in some embodiments, the swing motor 31 and the transmission mechanism 32 may be connected by a screw connection.
In some embodiments, as shown in fig. 3, the drive disc 1 includes an outer ring 12, an inner ring 13, and a plurality of connecting bars 14, the plurality of connecting bars 14 being disposed at intervals between the outer ring 12 and the inner ring 13; the first transmission portion 11 is provided on an outer side wall of the outer ring 12. As shown in fig. 5, the transmission mechanism 32 includes a transmission lever 321 and a transmission pawl 322. The driving claw 322 is used for clamping the driving disc 1, and specifically, the driving claw 322 can be clamped on the connecting strip 14 arranged on the lower surface of the driving disc 1; taking the chuck device shown in fig. 1 as an example, the bottom of the driving disk 1 is provided with a plurality of connecting strips 14 arranged along the radial direction, and the plurality of connecting strips 14 are spaced and uniformly distributed along the circumferential direction of the driving disk 1. The driving pawl 322 is clamped to one of the connecting strips 14. Two ends of the transmission rod 321 are respectively connected with the transmission claw 322 and the power output end of the swing motor 31; the swing motor 31 can control the transmission rod 321 to swing by a specified angle along a specified direction, and the transmission rod 321 drives the transmission claw 322 to swing along with the transmission claw, so as to drive the driving disc 1 to rotate between the first position and the second position. Because the power transmission is carried out between the swing motor 31 and the driving disk 1 by only one transmission rod 321, the swing motor 31 and the driving disk 1 are in a single-stage transmission relationship, and the transmission efficiency is high; in addition, since the power transmission between the swing motor 31 and the driving disc 1 is performed by only one transmission rod 321, the swing angle of the transmission rod 321 is equal to or corresponds to the rotation angle output by the swing motor 31, so that the swing angle of the transmission rod 321 can be controlled by adjusting the rotation angle output by the swing motor 31, and the rotation angle of the driving disc 1 can be easily controlled.
Preferably, the transmission rod 321 is a rigid rod, so that when the transmission rod 321 drives the transmission claw 322, the transmission rod 321 only slightly deforms elastically, thereby reducing the influence of the elastic deformation of the transmission rod 321 on the swing angle of the transmission rod 321 as much as possible, and further adjusting the rotation angle of the driving disk 1 only by adjusting the swing angle and the length of the transmission rod 321. In some embodiments, the driving rod 321 and the driving pawl 322 can be connected by a threaded connection.
In some embodiments, to avoid corrosion of the transmission rod 321 by the chemical, the transmission rod 321 may be made of a corrosion-resistant material, such as PCTFE, so that the transmission rod 321 has good wear resistance, corrosion resistance and high hardness, thereby prolonging the service life of the transmission rod 321 and avoiding frequent maintenance.
In some embodiments, as shown in fig. 5, the driving pawl 322 includes a driving pawl main body 3221, a plurality of movable pawl heads 3222, and a buffering structure (not shown), and specifically, taking the driving pawl 322 shown in fig. 5 as an example, it includes two movable pawl heads 3222, but the embodiment is not limited thereto, and the number of the movable pawl heads 3222 may also be three, four, or five … …. Wherein, as shown in FIG. 5, drive pawl body 3221 is formed with a recess for receiving connecting strip 14; referring to FIG. 6, a movable jaw 3222 and a portion of the movable jaw body 3221, the movable jaw body 3221 and the plurality of movable jaw heads 3222 may be connected by a positioning pin 3225, such that the movable jaw head 3222 can rotate clockwise or counterclockwise about the positioning pin 3225 in a plane parallel to the surface of the movable jaw body 3221; the other ends of the plurality of movable claw heads 3222 are oriented toward the recess for clamping the connecting rod 14, and specifically, two movable claw heads 3222 are disposed oppositely, and more than two movable claw heads 3222 are disposed at intervals, so that the ends of the plurality of movable claw heads 3222 can define an area for clamping the driving disc 1. The buffer structure is disposed between the movable claw head 3222 and the driving claw main body 3221, and is used for buffering the impact force applied to the movable claw head 3222.
When the chuck device rotates, the chuck device inevitably vibrates, so that the driving claws 322 receive impact due to the vibration of the driving disc 1 when clamping the connecting strips 14 of the driving disc 1, the direction of the impact is usually opposite to the force application direction of the movable claw heads 3222, and the connecting strips 14 are easily separated from the conveying claws; alternatively, the driving pawl 322 may cause the movable pawl head 3222 to loosen due to its own vibration when holding the connecting rod 14, and may easily cause the connecting rod 14 to come off from the conveying pawl.
Referring to fig. 6, which is a partial view of the driving pawl 322, in order to solve the above technical problem, in some embodiments, the buffer structure includes a spring 3223 and a damper 3224. Both ends of the spring 3223 are respectively connected to the movable claw head 3222 and the driving claw main body 3221, so as to apply a pulling force to the movable claw head 3222, which is perpendicular to the rotating direction of the movable claw head 3222, and thus pull the movable claw head 3222 toward the driving claw main body 3221, so that the driving claw 322 can clamp the connecting strip 14. Specifically, FIG. 6 shows a partial structure of the driving pawl 322, for example, a spring 3223 has one end connected to a point A on the movable pawl head 3222 and the other end connected to a point B on the driving pawl body 3221; moreover, in the process of making the driving claw 322 clamp the driving disc 1, the driving claw 322 can be opened by directly pulling the movable claw head 3222 to place the driving disc 1 in the driving claw body 3221, and then the movable claw head 3222 can be released to be rebounded by the pulling force of the spring 3223, so that the clamping portion 23 of the driving disc 1 is clamped and fixed by the driving claw 322. The buffer structure 3223 further includes a damper 3224, two ends of the damper 3224 are respectively connected to the movable claw head 3222 and the driving claw main body 3221, so as to apply a supporting force to the movable claw head 3222, the supporting force being perpendicular to the rotating direction of the movable claw head 3222, so as to absorb an impact force applied to the chuck device during rotation in a direction opposite to the applying direction of the movable claw head 3222, thereby preventing the driving disc 1 from being disengaged from the transmitting claw; specifically, taking the driving claw 322 shown in fig. 6 as an example, one end of the damper 3224 is connected to a point C on the movable claw head 3222, and the other end is connected to a point D on the driving claw body 3221, so that the impact force applied to the movable claw head 3222 during the rotation of the chuck device can be effectively buffered.
As another embodiment, in some embodiments, the clamp driving device 3 may further include a stepping motor and a transmission mechanism. The transmission mechanism comprises a third gear structure and a fourth gear structure which are meshed with each other, and the third gear structure is connected with the driving disc 1, coaxial with the driving disc 1 and synchronously rotated; the fourth gear structure is connected with the power output end of the stepping motor, is coaxial with the power output end of the stepping motor and synchronously rotates; the stepping motor is used for driving the fourth gear structure to rotate for a specified angle along the fifth direction or a sixth direction opposite to the fifth direction. Specifically, the tangential direction of the fifth direction is the same as the tangential direction of the first direction, and the tangential direction of the sixth direction is the same as the tangential direction of the second direction.
Specifically, the third gear structure and the fourth gear structure may be two bevel gears that are arranged perpendicular to each other; alternatively, the third gear structure and the fourth gear structure may be two spur gears arranged in parallel.
In some embodiments, the chuck apparatus further comprises a controller. The controller is used for controlling the clamping driving device 3 to drive the driving disk 1 to rotate at a preset rotating speed. Specifically, when the plurality of clamping portions 23 rotate from the second position to the first position, the preset rotating speed is gradually reduced so as to clamp the wafer at a first-speed and a second-speed in the process of clamping the wafer, so that the clamping portions 23 can be quickly close to the wafer, and the pressure applied to the edge of the wafer can be slowly increased, thereby preventing the wafer from being broken; when the plurality of clamping parts 23 rotate from the first position to the second position, the preset rotating speed is gradually increased, so that the wafer can be released at a slow speed first and then at a fast speed in the process of releasing the wafer, therefore, the pressure applied to the edge of the wafer can be slowly reduced, the wafer is prevented from vibrating when being restored from an elastic deformation state, the clamping parts 23 can be quickly far away from the wafer, and the process time is saved.
As another technical solution, the present embodiment further provides a semiconductor processing apparatus, which includes a chuck device and a rotation driving device; wherein, the chuck device adopts the chuck device in the plurality of embodiments; the rotation driving device is used for driving the chuck device to rotate integrally, and various components in the chuck device are relatively static during rotation.
The chuck device that this embodiment provided, through set up transmission portion between driving-disc and each fixed knot constructs, and utilize and press from both sides tight drive arrangement control driving-disc towards the rotatory appointed angle of appointed orientation, in order to enable driving-disc drive each fixed knot structure of complex with it to rotate to the assigned position in step, therefore, it is visible that the chuck device that this embodiment provided can be through adjusting the power output quantity and the direction that press from both sides tight drive arrangement, adjust the position of fixed knot structure, and this position can be for the fixed knot structure can apply the position of appropriate clamping-force to the wafer, thereby can enough avoid not enough causing the chuck to press from both sides tight wafer of clamping-force, make the wafer get rid of in the rotation process, also can avoid too big and cause the too tight centre gripping wafer of chuck, make the wafer crushed.
According to the semiconductor process equipment provided by the embodiment of the invention, the wafer is clamped by the chuck device in the embodiment, so that the wafer is stably clamped on the chuck device in the process, and the wafer is prevented from being thrown off to cause collision and fragmentation of the wafer and other parts of the semiconductor process equipment.
It will be understood that the above embodiments are merely exemplary embodiments taken to illustrate the principles of the present invention, which is not limited thereto. It will be apparent to those skilled in the art that various modifications and improvements can be made without departing from the spirit and substance of the invention, and these modifications and improvements are also considered to be within the scope of the invention.
Claims (10)
1. A chuck assembly for use in a semiconductor processing apparatus, the chuck assembly being adapted to be coupled to a rotary drive assembly for rotating the chuck assembly, the chuck assembly comprising: the device comprises a bearing disc, a driving disc, a plurality of fixing structures and a clamping driving device; the bearing disc is provided with a bearing surface for bearing the wafer, and can rotate around the axis of the bearing disc; the driving disc is arranged on one side, away from the bearing surface, of the bearing disc, and a first transmission part is arranged on the outer periphery of the driving disc;
the fixing structures are distributed at intervals along the circumferential direction of the bearing disc, one end of each fixing structure is a clamping part, at least part of each clamping part is positioned above the bearing surface, the other end of each fixing structure is a second transmission part, and the second transmission parts are matched with the first transmission parts; the clamping driving device is connected with the driving disc and used for driving the driving disc to rotate for a specified angle along a first direction or a second direction opposite to the first direction, so that the driving disc drives the clamping parts to synchronously rotate to a first position capable of fixing the wafer together or synchronously rotate to a second position capable of releasing the wafer from being fixed.
2. The chuck assembly according to claim 1, wherein said first drive portion is a first gear tooth formation distributed about an outer peripheral surface of said drive plate and said second drive portion is a second gear tooth formation for meshing engagement with said first gear tooth formation.
3. The chuck assembly according to claim 2, wherein each of said fixed structures includes a rotating shaft and an eccentric shaft connected to said rotating shaft and eccentrically disposed with respect to said rotating shaft, said eccentric shaft forming said gripping portion, said rotating shaft being formed with said second tooth structure on a side thereof facing away from said eccentric shaft;
in the first position, the side wall of the eccentric shaft is abutted against the edge of the wafer; in the second position, the side wall of the eccentric shaft is separated from the edge of the wafer.
4. The chuck assembly according to claim 1, wherein the clamping drive assembly includes an oscillating motor and a transmission; one end of the transmission mechanism is connected with a power output end of the swing motor, and the other end of the transmission mechanism is connected with the driving disc;
the swing motor is used for driving the transmission mechanism to swing for a specified angle along a third direction or a fourth direction opposite to the third direction so as to drive the driving disc to rotate for a specified angle along the first direction or the second direction.
5. The chuck assembly of claim 4, wherein said drive disk includes an outer ring, an inner ring, and a plurality of connecting strips spaced between said outer and inner rings; the first transmission part is arranged on the outer side wall of the outer ring;
the transmission mechanism comprises a transmission rod and a transmission claw; wherein the content of the first and second substances,
the transmission claw is used for fixing the connecting strip;
and two ends of the transmission rod are respectively connected with the transmission claw and the power output end of the swing motor.
6. The chuck assembly according to claim 5, wherein the drive jaw includes a drive jaw body, a plurality of movable jaw heads, and a cushion structure; wherein the content of the first and second substances,
the transmission claw main body is provided with a concave part for accommodating the connecting strip;
one end of each movable claw head is rotatably connected with the top of the concave part of the transmission claw main body, and the other end of each movable claw head faces the concave part direction and is used for clamping the connecting strip;
the buffer structure is arranged between the movable claw head and the transmission claw main body and is used for buffering impact force applied to the movable claw head.
7. The chuck assembly according to claim 6, wherein said spring and said damper are connected at both ends to said movable jaw head and said driving jaw body, respectively.
8. The chuck assembly according to claim 1, wherein the clamping drive assembly includes a stepper motor and a transmission mechanism;
the transmission mechanism comprises a third gear structure and a fourth gear structure which are meshed with each other, and the third gear structure is connected with the driving disc, coaxial with the driving disc and synchronously rotated;
the fourth gear structure is connected with the power output end of the stepping motor, is coaxial with the power output end of the stepping motor and synchronously rotates;
the step motor is used for driving the fourth gear structure to rotate for a specified angle along a fifth direction or a sixth direction opposite to the fifth direction.
9. The chuck assembly according to claim 1, further comprising a controller for controlling said clamping drive assembly to rotate said drive disk at a predetermined rotational speed; wherein the content of the first and second substances,
when the plurality of clamping parts rotate from the second position to the first position, the preset rotating speed is gradually reduced;
when the plurality of clamping parts rotate from the first position to the second position, the preset rotating speed is gradually increased.
10. A semiconductor processing apparatus, comprising chuck means and rotation driving means; wherein the content of the first and second substances,
the chuck device adopts the chuck device of any one of claims 1 to 9; the rotation driving device is used for driving the chuck device to rotate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111262188.3A CN113903702A (en) | 2021-10-28 | 2021-10-28 | Chuck device of semiconductor processing equipment and semiconductor processing equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111262188.3A CN113903702A (en) | 2021-10-28 | 2021-10-28 | Chuck device of semiconductor processing equipment and semiconductor processing equipment |
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| Publication Number | Publication Date |
|---|---|
| CN113903702A true CN113903702A (en) | 2022-01-07 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202111262188.3A Pending CN113903702A (en) | 2021-10-28 | 2021-10-28 | Chuck device of semiconductor processing equipment and semiconductor processing equipment |
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| Country | Link |
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| CN (1) | CN113903702A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115020315A (en) * | 2022-06-28 | 2022-09-06 | 北京北方华创微电子装备有限公司 | Chuck device of cleaning equipment and cleaning equipment |
| CN115346905A (en) * | 2022-10-18 | 2022-11-15 | 智程半导体设备科技(昆山)有限公司 | Thin semiconductor substrate rotary positioning device |
-
2021
- 2021-10-28 CN CN202111262188.3A patent/CN113903702A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115020315A (en) * | 2022-06-28 | 2022-09-06 | 北京北方华创微电子装备有限公司 | Chuck device of cleaning equipment and cleaning equipment |
| CN115346905A (en) * | 2022-10-18 | 2022-11-15 | 智程半导体设备科技(昆山)有限公司 | Thin semiconductor substrate rotary positioning device |
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