CN113899692A - Method for verifying lead bonding strength test capability of semiconductor device - Google Patents
Method for verifying lead bonding strength test capability of semiconductor device Download PDFInfo
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Abstract
The invention relates to a method for verifying the wire bonding strength test capability of a semiconductor device, which comprises the following steps: tracing the standard force value of the wire bonding strength; wire bonding strength standard force value transfer: establishing a new force value standard database; checking the calibration of a standard force value; checking the calibration linearity; and verifying the capability of the overall test system. The invention provides an accurate, reliable and systematic verification method for the lead bonding strength test capability of a semiconductor device. By adopting the invention, the lead bonding strength test system used in the semiconductor device production line and the laboratory can be subjected to irregular traceability, quantity value transfer, linearity calibration and overall comparison, and the overall test capability of the lead bonding strength test system can be verified. The invention successfully solves the problems of data accuracy, consistency and reliability in the lead bonding strength test of the semiconductor device, eliminates question and hidden danger for the purchasing party and the using party of the semiconductor device, and also provides technical support and data guarantee for manufacturers and laboratories.
Description
Technical Field
The invention relates to destructive physical analysis of a semiconductor device, in particular to a verification method of the wire bonding strength test capability of the semiconductor device.
Background
Wire bonding in semiconductor devices, in which wires are used to connect the I/O terminals of a chip to corresponding package leads or wiring lands on a substrate, is a very important process, and any defect of unreliable connection may cause significant failure or hidden danger in the function and performance of the semiconductor device. The semiconductor device which has completed the wire bonding process needs to test the minimum bonding strength of the lead according to different test conditions according to the lead material and the lead diameter before packaging, after packaging or during screening, identifying and testing, and the prior art has detailed description and regulation on different test conditions of the wire bonding strength, test methods, minimum bonding strength standards which the lead of different materials and diameters should reach, and the like. The lead bonding strength test value relates to a plurality of ranges, the minimum force value range is accurate to 10gf +/-0.1 gf, the precision requirement is very high, when the lead bonding strength is subjected to destructive test, test errors caused by test equipment, personnel, laboratory environmental conditions and the like cannot be ignored, and in order to eliminate system and period errors during the lead bonding strength test and ensure the accuracy and reliability of lead bonding strength test data provided by a laboratory, the lead bonding strength test capability needs to be verified. In practice, often there is a question of the customer, the data tested by you are not accurate, and the comparison of your test equipment, people and methods? Do your test report that the conclusion of acceptable and unacceptable wire bond strengths survive?
In view of the above-mentioned deficiencies of the prior art, the present invention provides an accurate, reliable and systematic method for verifying the capability of a wire bonding strength test of a semiconductor device. By adopting the invention, the source tracing is carried out fundamentally, the test of the bonding strength test is ensured to be accurate and reliable, and the accuracy of +/-0.1% can be ensured even if the minimum measuring range is 10 gf; standard quantity value transmission and linearity calibration are carried out on each test module and sub-range of the equipment, and consistency and linearity of different ranges are guaranteed; and comparing the whole test system including equipment, personnel and methods, and verifying the wire bonding strength test capability.
Disclosure of Invention
The invention aims to provide a set of accurate, reliable and systematic verification method for the bonding strength test capability of a lead in a semiconductor device.
In order to achieve the purpose, the invention adopts the following technical scheme: a method for verifying the wire bonding strength test capability of a semiconductor device comprises the following steps:
s1, tracing the standard force value of the lead bonding strength:
s1.1, preparing a set of +/-0.1% grade special weights with nominal masses of 10g, 20g, 50g, 100g, 200g, 500g and 1kg respectively;
s1.2, sending the special weights in the step S1.1 to a metrological verification mechanism which can be traced to national measurement standards or national defense highest measurement standards for calibration, and recording the converted mass of each weight on a calibration certificate after a calibration result meets the grade requirement;
s1.3, retrieving the special weight in the step S1.2, and recording the special weight as a standard weight;
s2, standard force value transmission of lead bonding strength:
s2.1, preparing the following objects: lead bonding strength test equipment; the device comprises a tension testing module, a tension calibration clamping hook and a mouse pad; standard weights;
s2.2, establishing a new force value standard database;
s2.2.1, turning on a power supply of the lead bonding strength test equipment;
s2.2.2, logging in a software system of the lead bonding strength test equipment;
s2.2.3, selecting 'Home', using an equipment platform controller to move an X axis of an equipment operation platform to the leftmost position, wherein all directions of a Y axis face the front of the system;
s2.2.4, horizontally placing the mouse pad on the X axis;
s2.2.5, installing the tension testing module into a lead bonding strength testing device and fixing and locking the tension testing module;
s2.2.6, selecting 'Service' -Module '-Calibration Wizard' from a menu bar at the top of the equipment software system, defaulting an installed test Module when a window to be calibrated is displayed, selecting 'Next' to continue, selecting a sub-range 100gf option of the test Module, clicking 'Calibration', and then clicking 'Next';
s2.2.7, installing the prepared tension calibration clamping hook on a test module according to screen prompt, screwing a fixing screw on a pull rod, lowering the module to a sufficiently low and stable height by using a Z-axis operating lever, hanging a standard weight on the tension calibration clamping hook, and slightly lowering the Z axis until a collision indicator lamp is turned on until the lamp is turned off;
s2.2.8, selecting 'Next', clicking a 'Start' button, and starting a calibration routine;
s2.2.9, after the calibration is finished, observing a pop-up window:
s2.2.9.1, if the popup window displays Data collected success, selecting Next, and storing the calibrated Data in a test module;
s2.2.9.2. if the pop-up window displays "process load viewing", then first check if the weight of the standard weight attached to the hook matches the selected sub-range? If the weights do not accord with each other, selecting 'Back', and hanging Back the correct weight; if the hook is in line with the preset hook, checking the loosening condition of the hook, and if the hook is too large, moving the Z axis upwards until the loosening of the hook is calibrated; repeating the steps S2.2.8-S2.2.9 until the pop-up window displays "Data collected success";
s2.2.10, repeating the steps S2.2.6-S2.2.9, selecting the sub-measuring ranges of 50gf, 20gf and 10gf of the tensile force testing module respectively, and establishing a standard force value database;
s2.2.11, repeating the steps S2.2.5-S2.2.10, and establishing a standard force value database of each sub-measuring range (1000gf, 500gf, 200gf, 100gf) of other tension testing modules;
s2.3, checking the calibration of a standard force value;
s2.3.1, repeating the steps S2.2.1-S2.2.5;
s2.3.2, selecting 'Service' -Module '-Calibration Wizard' from a menu bar at the top of the equipment software system, defaulting an installed Module when a Module Calibration window is displayed, selecting 'Next' to continue, selecting a sub-range 100gf option of the Module, clicking 'Check Calibration', and then clicking 'Next';
s2.3.3, repeating the steps S2.2.7-S2.2.8;
s2.3.4, after the calibration check is finished, observing a pop-up window:
s2.3.4.1, if the popup window displays 'Module performance with specification', selecting a 'Low force details' option to check calibration check data, selecting 'Next' to return to a selection sub-range menu and generate a calibration report, or selecting 'Quit' to finish calibration check;
s2.3.4.2. if the pop-up window displays "Module not performing with specification", first, determine whether the test Module needs to be calibrated? If yes, go back to step S2.2, otherwise check if the calibration hook is too loose? If so, moving the Z axis upwards until the calibration hook removes the slack; not then check if the standard weight for transfer calibration is incorrect? If yes, returning and hanging back the correct weight; then, steps S2.2.8-S2.3.4.1 are repeated;
s2.3.4.3. if the pop-up window displays "process load simulation", first, determine whether there is too much weight swing during the calibration process? If the weight is not loose, the Z shaft is moved upwards, and the weight does not swing; not then check if the weight is incorrect? If yes, returning and replacing the correct weight; not then check if is because the module was in tension prior to calibration? If so, returning and moving the Z axis downwards until the hook is not in a tension state any more in circulation; then, steps S2.2.8-S2.3.4.1 are repeated;
s2.3.5, repeating the steps S2.3.2-S2.3.4, respectively selecting the sub-measuring ranges of 50gf, 20gf and 10gf of the testing module, and finishing the standard force value calibration check of the tension testing module;
s2.3.6, repeating the steps S2.3.1-S2.3.4, and completing the standard force value calibration check of each sub-measuring range (1000gf, 500gf, 200gf, 100gf) of other tension test modules;
s2.4, checking and calibrating linearity;
s2.4.1, repeating the steps S2.2.1-S2.2.5;
s2.4.2, selecting 'Service' -Module '-Calibration Wizard' by a menu bar, defaulting an installed Module when a Module Calibration window is displayed, selecting 'Next' to continue, selecting a sub-range 100gf option of the Module, clicking 'Linear Check', and then clicking 'Next';
s2.4.3, S2.2.7 is repeated;
s2.4.4, inputting a numerical value of 'Linear check mass', and then selecting 'Next';
s2.4.5, clicking a Start button to Start a calibration routine;
s2.4.6, after the linearity check is finished, observing a pop-up window:
s2.4.6.1, if the popup window displays 'Module performance with specification', selecting a 'Low force details' option to view data captured in the linearity checking process, selecting 'Next' to return to a selection sub-range menu, or selecting 'Quit' to exit a calibration guide;
s2.4.6.2. if the pop-up window displays "Module not performing with specification", first, determine whether the test Module needs to be calibrated? Is the "Low force details" option selected to view the data captured during the linearity check, is the "Next" selected to return to the sub-range menu, generate a calibration report or perform s2.2. recalibration, but not to check if the weight used is incorrect? If yes, selecting 'Back', hanging Back the correct weight, and repeating the steps S2.4.5-S2.4.6.1;
s2.4.6.3. if the pop-up window displays "process load vibration", first, determine whether there is too much weight swing during the calibration process? Is "Back" selected and the Z axis is moved up so that the weight no longer swings loosely, but instead checks to see if is the calibration hook is in tension before starting calibration? If so, the Z axis is moved downwards until the hook is no longer in a tension state in a circulating manner; repeating steps S2.4.5-S2.4.6.1;
s2.4.7, clicking a 'Calibration report' button, inputting report parameters, and then selecting 'Show report';
s2.4.8, repeating the steps S2.4.2-S2.4.7, and completing the calibration linearity check of other sub-measuring ranges (50gf, 20gf, 10gf) of the tensile testing module;
s2.4.9, S2.4.1-S2.4.7 is repeated, and calibration linearity check of each sub-measuring range (1000gf, 500gf, 200gf, 100gf) of other tensile testing modules is completed;
s3, verifying the capability of the overall test system:
s3.1, selecting a tested sample from devices which need to be subjected to bonding strength test in the same batch of the same manufacturer;
s3.2, unifying test conditions including the diameter of a used tension crochet hook, the lifting speed of the crochet hook, a test position and a test module sub-range, and requiring to record a lead bonding strength value and a separation mode of each bonding wire;
s3.3, selecting a plurality of sets of integral test systems representing different test capabilities or a plurality of laboratories with different lead bonding strength test equipment and personnel, counting the data of the lead bonding strength test of each test system according to the mean value of the selected range, and calculating the mean value by using the following formula:
in the formula: n-total number of test data; xi-statistical test data by relative mean;
s3.4, judging the test result of each test system for testing the bonding strength of the lead according to the following formula, and verifying whether the equipment capability of the test system determined by the method is accurate and the process is effective:
in the formula: sigma-standard deviation;
-an average of the relative averages of the wire bond strengths tested by the respective test systems;
-an average of the relative averages of the wire bond strengths of the N sets of test systems;
s3.5 if sigma is less than or equal to 1, and
the calculated statistical data is good in consistency, and the method is effective and accurate in capability of confirming the lead bonding strength test of the test system.
By adopting the invention, the lead bonding strength test system used in the semiconductor device production line and the laboratory can be subjected to irregular traceability, quantity value transfer, linearity calibration and overall comparison, and the overall test capability of the lead bonding strength test system can be verified. The method successfully solves the problems of data accuracy, consistency and reliability in the lead bonding strength test of the semiconductor device, eliminates question and hidden danger for a purchasing party and a using party of the semiconductor device, and provides technical support and data guarantee for manufacturers and laboratories.
Drawings
FIG. 1 is a functional block diagram of the present invention;
fig. 2 is a block flow diagram of the present invention.
Detailed Description
The present invention is described in further detail below with reference to specific examples, which should not be construed as limiting the invention.
Example one
Equipment and equipment: royce 650 lead bonding strength test equipment, tensile test modules SMW-100G and SMW-1KG, a set of +/-0.1% grade special weights, a calibration clamp hook and 9 phase detectors which are manufactured by the same batch of vibration core technology company Limited and have the model number of GM 4705B.
The wire bonding strength test capability verification is carried out according to the following method and steps:
s1, tracing to the source of the standard force value of the bonding strength of the lead
S1.1, preparing a set of +/-0.1% grade special weights with nominal masses of 10g, 20g, 50g, 100g, 200g, 500g and 1kg respectively;
s1.2, sending the special weights in the step S1.1 to a first-level second-level metrological verification mechanism in the national defense science and technology industry for calibration, wherein the calibration result meets the level requirement, and recording the converted mass of each weight on a calibration certificate;
s1.3, retrieving the special weight in the step S1.2, and recording the special weight as a standard weight;
s2, standard force value transmission of lead bonding strength:
s2.1, preparing the following objects before force value transmission: lead bonding strength test equipment; the device comprises a tension testing module, a tension calibration clamping hook and a mouse pad; standard weights;
s2.2, establishing a new force value standard database;
s2.2.1, turning on a power supply of the lead bonding strength test equipment;
s2.2.2, logging in a software system of the lead bonding strength test equipment;
s2.2.3, selecting 'Home', using an equipment platform controller to move an X axis of an equipment operation platform to the leftmost position, wherein all directions of a Y axis face the front of the system;
s2.2.4, horizontally placing the mouse pad on the X axis;
s2.2.5, installing the tensile test module SMW-100G into a lead bonding strength test device and fixing and locking;
s2.2.6, selecting 'Service' -Module '-Calibration Wizard' from a menu bar at the top of the equipment software system, defaulting an installed test Module when a window to be calibrated is displayed, selecting 'Next' to continue, selecting a sub-range 100gf option of the test Module, clicking 'Calibration', and then clicking 'Next';
s2.2.7, installing the prepared tension calibration clamping hook on a test module according to screen prompt, screwing a fixing screw on a pull rod, lowering the module to a sufficiently low and stable height by using a Z-axis operating lever, hanging a standard weight on the tension calibration clamping hook, and slightly lowering the Z axis until a collision indicator lamp is turned on until the lamp is turned off;
s2.2.8, selecting 'Next', clicking a 'Start' button, and starting a calibration routine;
s2.2.9, after the calibration is finished, observing a pop-up window:
s2.2.9.1 pop-up window showing "process load visibility", first check if the weight of the standard weight attached to the hook matches the selected sub-range? If the result is consistent, checking the hook looseness, finding the hook looseness, moving the Z axis upwards until the hook looseness is calibrated to remove, selecting 'Next', clicking the 'Start' button, popping up a window to display 'Data collected success', selecting 'Next', and storing the calibrated Data in a test module;
s2.2.10, repeating the steps S2.2.6-S2.2.9, selecting the sub-measuring ranges of 50gf, 20gf and 10gf of the tensile force testing module respectively, and establishing a standard force value database;
s2.2.11, repeating the steps S2.2.5-S2.2.10, and establishing a standard force value database of each sub-measuring range (1000gf, 500gf, 200gf, 100gf) of the tensile force testing module SMW-1 KG;
s2.3, checking the calibration of a standard force value;
s2.3.1, selecting 'Home', using an equipment platform controller to move an X axis of an equipment operation platform to the leftmost position, wherein all directions of a Y axis face the front of the system; horizontally placing the mouse pad on an X axis; taking down the tensile test module SMW-1KG, and reloading the tensile test module SMW-100G into the lead bonding strength test equipment and fixing and locking the tensile test module SMW-100G;
s2.3.2, selecting 'Service' -Module '-Calibration Wizard' from a menu bar at the top of the equipment software system, defaulting an installed Module when a Module Calibration window is displayed, selecting 'Next' to continue, selecting a sub-range 100gf option of the Module, clicking 'Check Calibration', and then clicking 'Next';
s2.3.3, repeating the steps S2.2.7-S2.2.8;
s2.3.4, after the calibration check is finished, observing a pop-up window:
s2.3.4.1, displaying 'Module performance with specification' on a pop-up window, selecting a 'Low force details' option to check calibration check data, selecting 'Next' to return to a selection sub-range menu and generating a calibration report;
s2.3.5, repeating the steps S2.3.2-S2.3.4, respectively selecting the sub-measuring ranges of 50gf, 20gf and 10gf of the testing module, and finishing the standard force value calibration check of the tension testing module;
s2.3.6, repeating the steps S2.3.1-S2.3.4, and completing the calibration check of the standard force value of each sub-measuring range (1000gf, 500gf, 200gf, 100gf) of the tensile force testing module SMW-1 KG;
s2.4, checking and calibrating linearity;
s2.4.1, selecting 'Home', using an equipment platform controller to move an X axis of an equipment operation platform to the leftmost position, wherein all directions of a Y axis face the front of the system; horizontally placing the mouse pad on an X axis; taking down the tensile test module SMW-1KG, and loading the tensile test module SMW-100G into lead bonding strength test equipment and fixing and locking the tensile test module SMW-100G;
s2.4.2, selecting 'Service' -Module '-Calibration Wizard' by a menu bar, defaulting an installed Module when a Module Calibration window is displayed, selecting 'Next' to continue, selecting a sub-range 100gf option of the Module, clicking 'Linear Check', and then clicking 'Next';
s2.4.3, S2.2.7 is repeated;
s2.4.4. inputting a numerical value 10gf of 'Linear check mass', and then selecting 'Next';
s2.4.5, clicking a Start button to Start a calibration routine;
s2.4.6, after the linearity check is finished, observing a pop-up window:
s2.4.6.1, displaying 'Excess load simulation' through a pop-up window, selecting 'Back', moving a Z axis upwards to enable the weight not to loose and swing, clicking a 'Start' button, and starting a calibration routine; the pop-up window still displays the 'Excess load visibility', selects 'Back', and moves the Z axis downwards until the hook cycle is not in the tension state any more; clicking a Start button, displaying a Module performance with specification in a pop-up window, selecting a Low force details option to view data captured in the linearity checking process, and selecting a Next to return to a selection sub-range menu;
s2.4.7, clicking a 'Calibration report' button, inputting report parameters such as check date, temperature and humidity, and then selecting 'Show report';
s2.4.8, repeating the steps S2.4.2-S2.4.7, and completing the calibration linearity check of other sub-measuring ranges (50gf, 20gf, 10gf) of the tensile testing module;
s2.4.9, repeating S2.4.1-S2.4.7, and finishing the calibration linearity check of each sub-measuring range (1000gf, 500gf, 200gf, 100gf) of the tensile force testing module SMW-1 KG;
s3, verifying the capability of the overall test system:
s3.1, preparing a sample to be tested (9 phase discriminators GM4705B produced by the same batch of core vibration science and technology Limited);
s3.2, stipulating the same test conditions (including the diameter of a used tension crochet hook is 75um, the lifting speed of the crochet hook is 300um/s, the test position is the center of the bonding wire, the sub-range of a test module is 100gf), and recording the lead bonding strength value and the separation mode of each bonding wire;
s3.3, selecting 3 laboratories with different lead bonding strength test equipment and personnel, counting the data of the lead bonding strength test of each test system according to the average value of the relatively selected range, and calculating the average value by using the following formula:
in the formula: n-total number of test data; xi-statistical test data by relative mean;
wire bond Strength test averageValue statistical table
S3.4, judging the test result of each test system for testing the bonding strength of the lead according to the following formula, and verifying whether the equipment capability of the test system determined by the method is accurate and the process is effective:
in the formula: sigma-standard deviation;
-an average of the relative averages of the wire bond strengths tested by the respective test systems;
-an average of the relative averages of the wire bond strengths of the N sets of test systems;
and S3.5, obtaining a result that sigma is not more than 0.019 and not more than 1 through calculation, showing that the consistency of test data of the lead bonding strength test of the 3 sets of test systems is better, and confirming that the lead bonding strength test capability of the test systems is accurate and the method is effective.
Example two
Equipment and equipment: the device comprises Royce 620 lead bonding strength test equipment, tensile test modules SMG-100G and SMG-1KG, a set of +/-0.1% grade special weights, a calibration clamping hook and 25 12 ADCs (analog to digital converters) which are produced by the same batch of AD company and have the model number of AD574 AKD.
The wire bonding strength test capability verification is carried out according to the following method and steps:
s1, tracing to the source of the standard force value of the bonding strength of the lead
S1.1, preparing a set of +/-0.1% grade special weights with nominal masses of 10g, 20g, 50g, 100g, 200g, 500g and 1kg respectively;
s1.2, sending the special weights in the step S1.1 to a first-level second-level metrological verification mechanism in the national defense science and technology industry for calibration, wherein the calibration result meets the level requirement, and recording the converted mass of each weight on a calibration certificate;
s1.3, retrieving the special weight in the step S1.2, and recording the special weight as a standard weight;
s2, standard force value transmission of lead bonding strength:
s2.1, preparing the following objects before force value transmission: lead bonding strength test equipment; the device comprises a tension testing module, a tension calibration clamping hook and a mouse pad; standard weights;
s2.2, establishing a new force value standard database;
s2.2.1, turning on a power supply of the lead bonding strength test equipment;
s2.2.2, logging in a software system of the lead bonding strength test equipment;
s2.2.3, selecting 'Home', using an equipment platform controller to move an X axis of an equipment operation platform to the leftmost position, wherein all directions of a Y axis face the front of the system;
s2.2.4, horizontally placing the mouse pad on the X axis;
s2.2.5, installing the tensile test module SMG-100G into a lead bonding strength test device and fixing and locking the device;
s2.2.6, selecting 'Service' -Module '-Calibration Wizard' from a menu bar at the top of the equipment software system, defaulting an installed test Module when a window to be calibrated is displayed, selecting 'Next' to continue, selecting a sub-range 100gf option of the test Module, clicking 'Calibration', and then clicking 'Next';
s2.2.7, installing the prepared tension calibration clamping hook on a test module according to screen prompt, screwing a fixing screw on a pull rod, lowering the module to a sufficiently low and stable height by using a Z-axis operating lever, hanging a standard weight on the tension calibration clamping hook, and slightly lowering the Z axis until a collision indicator lamp is turned on until the lamp is turned off;
s2.2.8, selecting 'Next', clicking a 'Start' button, and starting a calibration routine;
s2.2.9, after the calibration is finished, observing a pop-up window:
s2.2.9.1 pop-up window displaying "process load clearance", checking to find the hook slack, moving Z axis upwards until the hook slack is removed, selecting "Next", then clicking "Start" button, pop-up window displaying "Data collected success", selecting "Next", and storing the calibrated Data in the test module;
s2.2.10, repeating the steps S2.2.6-S2.2.9, selecting the sub-measuring ranges of 50gf, 20gf and 10gf of the tensile force testing module respectively, and establishing a standard force value database;
s2.2.11, repeating the steps S2.2.5-S2.2.10, and establishing a standard force value database of each sub-measuring range (1000gf, 500gf, 200gf, 100gf) of the tensile force testing module SMG-1 KG;
s2.3, checking the calibration of a standard force value;
s2.3.1, selecting 'Home', using an equipment platform controller to move an X axis of an equipment operation platform to the leftmost position, wherein all directions of a Y axis face the front of the system; horizontally placing the mouse pad on an X axis; taking down the tensile test module SMG-1KG, and reloading the tensile test module SMG-100G into the lead bonding strength test equipment and fixing and locking the tensile test module SMG-100G;
s2.3.2, selecting 'Service' -Module '-Calibration Wizard' from a menu bar at the top of the equipment software system, defaulting an installed Module when a Module Calibration window is displayed, selecting 'Next' to continue, selecting a sub-range 100gf option of the Module, clicking 'Check Calibration', and then clicking 'Next';
s2.3.3, repeating the steps S2.2.7-S2.2.8;
s2.3.4, after the calibration check is finished, observing a pop-up window:
s2.3.4.1, displaying 'Module performance with specification' on a pop-up window, selecting a 'Low force details' option to check calibration check data, selecting 'Next' to return to a selection sub-range menu and generating a calibration report;
s2.3.5, repeating the steps S2.3.2-S2.3.4, respectively selecting the sub-measuring ranges of 50gf, 20gf and 10gf of the testing module, and finishing the standard force value calibration check of the tension testing module;
s2.3.6, repeating the steps S2.3.1-S2.3.4, and completing the calibration check of the standard force value of each sub-measuring range (1000gf, 500gf, 200gf, 100gf) of the tensile force testing module SMG-1 KG;
s2.4, checking and calibrating linearity;
s2.4.1, selecting 'Home', using an equipment platform controller to move an X axis of an equipment operation platform to the leftmost position, wherein all directions of a Y axis face the front of the system; horizontally placing the mouse pad on an X axis; taking down the tensile test module SMW-1KG, and loading the tensile test module SMW-100G into lead bonding strength test equipment and fixing and locking the tensile test module SMW-100G;
s2.4.2, selecting 'Service' -Module '-Calibration Wizard' by a menu bar, defaulting an installed Module when a Module Calibration window is displayed, selecting 'Next' to continue, selecting a sub-range 100gf option of the Module, clicking 'Linear Check', and then clicking 'Next';
s2.4.3, S2.2.7 is repeated;
s2.4.4. inputting a numerical value 10gf of 'Linear check mass', and then selecting 'Next';
s2.4.5, clicking a Start button to Start a calibration routine;
s2.4.6, after the linearity check is finished, observing a pop-up window:
s2.4.6.1, displaying 'Excess load visibility' through a pop-up window, selecting 'Back', moving a Z axis upwards to enable the weight not to swing loosely any more, clicking a 'Start' button, displaying 'Module performing with specification' through the pop-up window, selecting a 'Low force details' option to check data captured in a linearity checking process, and selecting 'Next' to return to a selection sub-range menu;
s2.4.7, clicking a 'Calibration report' button, inputting report parameters such as check date, temperature and humidity, and then selecting 'Show report';
s2.4.8, repeating the steps S2.4.2-S2.4.7, and completing the calibration linearity check of other sub-measuring ranges (50gf, 20gf, 10gf) of the tensile testing module;
s2.4.9, repeating S2.4.1-S2.4.7, and finishing the calibration linearity check of each sub-measuring range (1000gf, 500gf, 200gf, 100gf) of the tensile force testing module SMG-1 KG;
s3, verifying the capability of the overall test system:
s3.1, preparing a sample to be tested (25 ADCs with 12 bits of AD574AKD produced by the same AD company in the same batch);
s3.2, stipulating the same test conditions (including the diameter of a used tension crochet hook is 75um, the lifting speed of the crochet hook is 300um/s, the test position is the center of the bonding wire, the sub-range of a test module is 10gf), and recording the lead bonding strength value and the separation mode of each bonding wire;
s3.3, selecting 5 laboratories with different lead bonding strength test equipment and personnel, counting 5 tested samples in each laboratory according to the mean value of the selected range, and calculating the mean value by using the following formula:
in the formula: n-total number of test data; xi-statistical test data by relative mean;
statistical table of mean values of lead bonding strength tests
S3.4, judging the test result of each test system for testing the bonding strength of the lead according to the following formula, and verifying whether the equipment capability of the test system determined by the method is accurate and the process is effective:
in the formula: sigma-standard deviation;
each test lineAverage value of the lead bonding strength of the conventional test relative to the average value;
-an average of the relative averages of the wire bond strengths of the N sets of test systems;
and S3.5, obtaining a result that sigma is 0.079 or less than or equal to 1 through calculation, showing that the consistency of test data of the lead bonding strength test of the 5 sets of test systems is good, and confirming that the lead bonding strength test capability of the test systems is accurate and the method is effective.
EXAMPLE III
Equipment and equipment: royce 650 lead bonding strength test equipment, tensile test modules SMW-100G and SMW-1KG, a set of +/-0.1% grade special weights, a calibration clamping hook and 15 rectifier diodes of which the models are 2DK14F and are produced by the same batch of Minnan semiconductor general works.
The wire bonding strength test capability verification is carried out according to the following method and steps:
s1, tracing to the source of the standard force value of the bonding strength of the lead
S1.1, preparing a set of +/-0.1% grade special weights with nominal masses of 10g, 20g, 50g, 100g, 200g, 500g and 1kg respectively;
s1.2, sending the special weights in the step S1.1 to a first-level second-level metrological verification mechanism in the national defense science and technology industry for calibration, wherein the calibration result meets the level requirement, and recording the converted mass of each weight on a calibration certificate;
s1.3, retrieving the special weight in the step S1.2, and recording the special weight as a standard weight;
s2, standard force value transmission of lead bonding strength:
s2.1, preparing the following objects before force value transmission: lead bonding strength test equipment; the device comprises a tension testing module, a tension calibration clamping hook and a mouse pad; standard weights;
s2.2, establishing a new force value standard database;
s2.2.1, turning on a power supply of the lead bonding strength test equipment;
s2.2.2, logging in a software system of the lead bonding strength test equipment;
s2.2.3, selecting 'Home', using an equipment platform controller to move an X axis of an equipment operation platform to the leftmost position, wherein all directions of a Y axis face the front of the system;
s2.2.4, horizontally placing the mouse pad on the X axis;
s2.2.5, installing the tensile test module SMW-100G into a lead bonding strength test device and fixing and locking;
s2.2.6, selecting 'Service' -Module '-Calibration Wizard' from a menu bar at the top of the equipment software system, defaulting an installed test Module when a window to be calibrated is displayed, selecting 'Next' to continue, selecting a sub-range 100gf option of the test Module, clicking 'Calibration', and then clicking 'Next';
s2.2.7, installing the prepared tension calibration clamping hook on a test module according to screen prompt, screwing a fixing screw on a pull rod, lowering the module to a sufficiently low and stable height by using a Z-axis operating lever, hanging a standard weight on the tension calibration clamping hook, and slightly lowering the Z axis until a collision indicator lamp is turned on until the lamp is turned off;
s2.2.8, selecting 'Next', clicking a 'Start' button, and starting a calibration routine;
s2.2.9, after the calibration is finished, observing a pop-up window:
s2.2.9.1 pop-up window showing "process load visibility", first check if the weight of the standard weight attached to the hook matches the selected sub-range? If the Data is consistent, checking the hook looseness, finding the hook looseness, moving the Z axis upwards until the hook looseness is calibrated to remove, selecting 'Next', clicking a 'Start' button, popping up a window to display 'Data collected success', selecting 'Next', and storing the calibrated Data in a test module;
s2.2.10, repeating the steps S2.2.6-S2.2.9, selecting the sub-measuring ranges of 50gf, 20gf and 10gf of the tensile force testing module respectively, and establishing a standard force value database;
s2.2.11, repeating the steps S2.2.5-S2.2.10, and establishing a standard force value database of each sub-measuring range (1000gf, 500gf, 200gf, 100gf) of the tensile force testing module SMW-1 KG;
s2.3, checking the calibration of a standard force value;
s2.3.1, selecting 'Home', using an equipment platform controller to move an X axis of an equipment operation platform to the leftmost position, wherein all directions of a Y axis face the front of the system; horizontally placing the mouse pad on an X axis; taking down the tensile test module SMW-1KG, and reloading the tensile test module SMW-100G into the lead bonding strength test equipment and fixing and locking the tensile test module SMW-100G;
s2.3.2, selecting 'Service' -Module '-Calibration Wizard' from a menu bar at the top of the equipment software system, defaulting an installed Module when a Module Calibration window is displayed, selecting 'Next' to continue, selecting a sub-range 100gf option of the Module, clicking 'Check Calibration', and then clicking 'Next';
s2.3.3, repeating the steps S2.2.7-S2.2.8;
s2.3.4, after the calibration check is finished, observing a pop-up window:
s2.3.4.1, displaying 'Module performance with specification' on a pop-up window, selecting a 'Low force details' option to check calibration check data, selecting 'Next' to return to a selection sub-range menu and generating a calibration report;
s2.3.5, repeating the steps S2.3.2-S2.3.4, respectively selecting the sub-measuring ranges of 50gf, 20gf and 10gf of the testing module, and finishing the standard force value calibration check of the tension testing module;
s2.3.6, repeating the steps S2.3.1-S2.3.4, and completing the calibration check of the standard force value of each sub-measuring range (1000gf, 500gf, 200gf, 100gf) of the tensile force testing module SMW-1 KG;
s2.4, checking and calibrating linearity;
s2.4.1, selecting 'Home', using an equipment platform controller to move an X axis of an equipment operation platform to the leftmost position, wherein all directions of a Y axis face the front of the system; horizontally placing the mouse pad on an X axis; taking down the tensile test module SMW-1KG, and loading the tensile test module SMW-100G into lead bonding strength test equipment and fixing and locking the tensile test module SMW-100G;
s2.4.2, selecting 'Service' -Module '-Calibration Wizard' by a menu bar, defaulting an installed Module when a Module Calibration window is displayed, selecting 'Next' to continue, selecting a sub-range 100gf option of the Module, clicking 'Linear Check', and then clicking 'Next';
s2.4.3, S2.2.7 is repeated;
s2.4.4. inputting a numerical value 10gf of 'Linear check mass', and then selecting 'Next';
s2.4.5, clicking a Start button to Start a calibration routine;
s2.4.6, after the linearity check is finished, observing a pop-up window:
s2.4.6.1, displaying 'Excess load simulation' through a pop-up window, selecting 'Back', moving a Z axis upwards to enable the weight not to loose and swing, clicking a 'Start' button, and starting a calibration routine; the pop-up window still displays the 'Excess load visibility', selects 'Back', and moves the Z axis downwards until the hook cycle is not in the tension state any more; clicking a Start button, displaying a Module performance with specification in a pop-up window, selecting a Low force details option to view data captured in the linearity checking process, and selecting a Next to return to a selection sub-range menu;
s2.4.7, clicking a 'Calibration report' button, inputting report parameters such as check date, temperature and humidity, and then selecting 'Show report';
s2.4.8, repeating the steps S2.4.2-S2.4.7, and completing the calibration linearity check of other sub-measuring ranges (50gf, 20gf, 10gf) of the tensile testing module;
s2.4.9, repeating S2.4.1-S2.4.7, and finishing the calibration linearity check of each sub-measuring range (1000gf, 500gf, 200gf, 100gf) of the tensile force testing module SMW-1 KG;
s3, verifying the capability of the overall test system:
s3.1, preparing a sample to be tested (15 rectifier diodes of which the models are 2DK14F and are produced by the same Jinan semiconductor central plant in the same batch);
s3.2, stipulating the same test conditions (including the diameter of a used tension crochet hook is 250um, the lifting speed of the crochet hook is 1200um/s, the test position is the center of the bonding wire, the sub-range of the test module is 500gf), and recording the lead bonding strength value and the separation mode of each bonding wire;
s3.3, selecting 3 laboratories with different lead bonding strength test equipment and personnel, each laboratory having 5 DK14F rectifier diodes, counting the data of the lead bonding strength test of each test system according to the average value of the relatively selected range, and calculating the average value by using the following formula:
in the formula: n-total number of test data; xi-statistical test data by relative mean;
statistical table of mean values of lead bonding strength tests
S3.4, judging the test result of each test system for testing the bonding strength of the lead according to the following formula, and verifying whether the equipment capability of the test system determined by the method is accurate and the process is effective:
in the formula: sigma-standard deviation;
-an average of the relative averages of the wire bond strengths tested by the respective test systems;
-an average of the relative averages of the wire bond strengths of the N sets of test systems;
and S3.5, the result obtained by calculation is that sigma is 1.575 & gt 1, which indicates that the consistency of the test data of the lead bonding strength test of the 3 sets of test systems is poor, the test capability of the lead bonding strength test of the test systems is not confirmed, and the difference between the test data of the lead bonding strength test of the test system C and the test data of the lead bonding strength test of the other two sets of test systems is far, so that the test data needs to be confirmed again.
Details not described in the present specification belong to the prior art known to those skilled in the art.
Claims (1)
1. A method for verifying the wire bonding strength test capability of a semiconductor device comprises the following steps:
s1, tracing the standard force value of the lead bonding strength:
s1.1, preparing a set of +/-0.1% grade special weights with nominal masses of 10g, 20g, 50g, 100g, 200g, 500g and 1kg respectively;
s1.2, sending the special weights in the step S1.1 to a metrological verification mechanism which can be traced to national measurement standards or national defense highest measurement standards for calibration, and recording the converted mass of each weight on a calibration certificate after a calibration result meets the grade requirement;
s1.3, retrieving the special weight in the step S1.2, and recording the special weight as a standard weight;
s2, standard force value transmission of lead bonding strength:
s2.1, preparing the following objects: lead bonding strength test equipment; the device comprises a tension testing module, a tension calibration clamping hook and a mouse pad; standard weights;
s2.2, establishing a new force value standard database;
s2.2.1, turning on a power supply of the lead bonding strength test equipment;
s2.2.2, logging in a software system of the lead bonding strength test equipment;
s2.2.3, selecting 'Home', using an equipment platform controller to move an X axis of an equipment operation platform to the leftmost position, wherein all directions of a Y axis face the front of the system;
s2.2.4, horizontally placing the mouse pad on the X axis;
s2.2.5, installing the tension testing module into a lead bonding strength testing device and fixing and locking the tension testing module;
s2.2.6, selecting 'Service' -Module '-Calibration Wizard' from a menu bar at the top of the equipment software system, defaulting an installed test Module when a window to be calibrated is displayed, selecting 'Next' to continue, selecting a sub-range 100gf option of the test Module, clicking 'Calibration', and then clicking 'Next';
s2.2.7, installing the prepared tension calibration clamping hook on a test module according to screen prompt, screwing a fixing screw on a pull rod, lowering the module to a sufficiently low and stable height by using a Z-axis operating lever, hanging a standard weight on the tension calibration clamping hook, and slightly lowering the Z axis until a collision indicator lamp is turned on until the lamp is turned off;
s2.2.8, selecting 'Next', clicking a 'Start' button, and starting a calibration routine;
s2.2.9, after the calibration is finished, observing a pop-up window:
s2.2.9.1, if the popup window displays Data collected success, selecting Next, and storing the calibrated Data in a test module;
s2.2.9.2. if the pop-up window displays "process load viewing", then first check if the weight of the standard weight attached to the hook matches the selected sub-range? If the weights do not accord with each other, selecting 'Back', and hanging Back the correct weight; if the hook is in line with the preset hook, checking the loosening condition of the hook, and if the hook is too large, moving the Z axis upwards until the loosening of the hook is calibrated; repeating the steps S2.2.8-S2.2.9 until the pop-up window displays "Data collected success";
s2.2.10, repeating the steps S2.2.6-S2.2.9, selecting the sub-measuring ranges of 50gf, 20gf and 10gf of the tensile force testing module respectively, and establishing a standard force value database;
s2.2.11, repeating the steps S2.2.5-S2.2.10, and establishing a standard force value database of each sub-measuring range (1000gf, 500gf, 200gf, 100gf) of other tension testing modules;
s2.3, checking the calibration of a standard force value;
s2.3.1, repeating the steps S2.2.1-S2.2.5;
s2.3.2, selecting 'Service' -Module '-Calibration Wizard' from a menu bar at the top of the equipment software system, defaulting an installed Module when a Module Calibration window is displayed, selecting 'Next' to continue, selecting a sub-range 100gf option of the Module, clicking 'Check Calibration', and then clicking 'Next';
s2.3.3, repeating the steps S2.2.7-S2.2.8;
s2.3.4, after the calibration check is finished, observing a pop-up window:
s2.3.4.1, if the popup window displays 'Module performance with specification', selecting a 'Low force details' option to check calibration check data, selecting 'Next' to return to a selection sub-range menu and generate a calibration report, or selecting 'Quit' to finish calibration check;
s2.3.4.2. if the pop-up window displays "Module not performing with specification", first, determine whether the test Module needs to be calibrated? If yes, go back to step S2.2, otherwise check if the calibration hook is too loose? If so, moving the Z axis upwards until the calibration hook removes the slack; not then check if the standard weight for transfer calibration is incorrect? If yes, returning and hanging back the correct weight; then, steps S2.2.8-S2.3.4.1 are repeated;
s2.3.4.3. if the pop-up window displays "process load simulation", first, determine whether there is too much weight swing during the calibration process? If the weight is not loose, the Z shaft is moved upwards, and the weight does not swing; not then check if the weight is incorrect? If yes, returning and replacing the correct weight; not then check if is because the module was in tension prior to calibration? If so, returning and moving the Z axis downwards until the hook is not in a tension state any more in circulation; then, steps S2.2.8-S2.3.4.1 are repeated;
s2.3.5, repeating the steps S2.3.2-S2.3.4, respectively selecting the sub-measuring ranges of 50gf, 20gf and 10gf of the testing module, and finishing the standard force value calibration check of the tension testing module;
s2.3.6, repeating the steps S2.3.1-S2.3.4, and completing the standard force value calibration check of each sub-measuring range (1000gf, 500gf, 200gf, 100gf) of other tension test modules;
s2.4, checking and calibrating linearity;
s2.4.1, repeating the steps S2.2.1-S2.2.5;
s2.4.2, selecting 'Service' -Module '-Calibration Wizard' by a menu bar, defaulting an installed Module when a Module Calibration window is displayed, selecting 'Next' to continue, selecting a sub-range 100gf option of the Module, clicking 'Linear Check', and then clicking 'Next';
s2.4.3, S2.2.7 is repeated;
s2.4.4, inputting a numerical value of 'Linear check mass', and then selecting 'Next';
s2.4.5, clicking a Start button to Start a calibration routine;
s2.4.6, after the linearity check is finished, observing a pop-up window:
s2.4.6.1, if the popup window displays 'Module performance with specification', selecting a 'Low force details' option to view data captured in the linearity checking process, selecting 'Next' to return to a selection sub-range menu, or selecting 'Quit' to exit a calibration guide;
s2.4.6.2. if the pop-up window displays "Module not performing with specification", first, determine whether the test Module needs to be calibrated? Is the "Low force details" option selected to view the data captured during the linearity check, is the "Next" selected to return to the sub-range menu, generate a calibration report or perform s2.2. recalibration, but not to check if the weight used is incorrect? If yes, selecting 'Back', hanging Back the correct weight, and repeating the steps S2.4.5-S2.4.6.1;
s2.4.6.3. if the pop-up window displays "process load vibration", first, determine whether there is too much weight swing during the calibration process? Is "Back" selected and the Z axis is moved up so that the weight no longer swings loosely, but instead checks to see if is the calibration hook is in tension before starting calibration? If so, the Z axis is moved downwards until the hook is no longer in a tension state in a circulating manner; repeating steps S2.4.5-S2.4.6.1;
s2.4.7, clicking a 'Calibration report' button, inputting report parameters, and then selecting 'Show report';
s2.4.8, repeating the steps S2.4.2-S2.4.7, and completing the calibration linearity check of other sub-measuring ranges (50gf, 20gf, 10gf) of the tensile testing module;
s2.4.9, S2.4.1-S2.4.7 is repeated, and calibration linearity check of each sub-measuring range (1000gf, 500gf, 200gf, 100gf) of other tensile testing modules is completed;
s3, verifying the capability of the overall test system:
s3.1, selecting a tested sample from devices which need to be subjected to bonding strength test in the same batch of the same manufacturer;
s3.2, unifying test conditions including the diameter of a used tension crochet hook, the lifting speed of the crochet hook, a test position and a test module sub-range, and requiring to record a lead bonding strength value and a separation mode of each bonding wire;
s3.3, selecting a plurality of sets of integral test systems representing different test capabilities or a plurality of laboratories with different lead bonding strength test equipment and personnel, counting the data of the lead bonding strength test of each test system according to the mean value of the selected range, and calculating the mean value by using the following formula:
in the formula: n-total number of test data; xi-statistical test data by relative mean;
s3.4, judging the test result of each test system for testing the bonding strength of the lead according to the following formula, and verifying whether the equipment capability of the test system determined by the method is accurate and the process is effective:
in the formula: sigma-standard deviation;
-an average of the relative averages of the wire bond strengths tested by the respective test systems;
the average value of the relative average value of the bonding strength of the lead tested by the set of test system;
and S3.5, if the sigma is less than or equal to 1, confirming that the lead bonding strength test capability of the test system is accurate and the method is effective.
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