CN113847817A

CN113847817A - Machine table cooling device and method

Info

Publication number: CN113847817A
Application number: CN202110994826.4A
Authority: CN
Inventors: 张福庭; 王志峰; 徐悠和; 张智文; 徐尚
Original assignee: Advanced Semiconductor Engineering Inc
Current assignee: Advanced Semiconductor Engineering Inc
Priority date: 2021-08-27
Filing date: 2021-08-27
Publication date: 2021-12-28

Abstract

The invention relates to a device and a method for cooling a machine table. This board heat sink includes: the water inlet pipe is connected to the water inlet of the machine table; the water return pipe is connected to a water outlet of the machine table; and the jumper pipe is bridged between the water inlet pipe and the water return pipe, wherein one part of the process cooling water flows into the machine table through the water inlet pipe and the water inlet to be cooled and form high-temperature return water, the high-temperature return water flows into the water return pipe through the water outlet, and the other part of the process cooling water flows into the water return pipe through the water inlet pipe and the jumper pipe to be mixed with the high-temperature return water.

Description

Machine table cooling device and method

Technical Field

The invention relates to the technical field of semiconductors, in particular to a device and a method for cooling a machine table.

Background

The thinned rectangular substrate is a novel dimension design (the substrate dimension is 600mm x 600mm) in the existing semiconductor packaging industry, and compared with the dimension of the traditional 300mm x 300mm substrate, the thinned rectangular substrate belongs to customized development in the machine configuration of the manufacturing process or the dimension of materials, and greatly influences the sharing performance of mass production machines.

As an example of the substrate process flow shown in fig. 1A-1G, a die 20 is placed on a carrier 10 and tape 14, as shown in fig. 1A; performing a pre-bake (pre-baker) process 22, as shown in FIG. 1B; forming a molding 24, as in fig. 1C; removing the carrier 10, as shown in fig. 1D; removing adhesive tape 14, as in FIG. 1E; then, a backside lamination process is performed to form the layer 16, as shown in fig. 1F; a post mold cure (post mold cure) process 26 is performed as shown in fig. 1G. In the above flow, a large oven is used to perform the pre-baking process 22 and the post-mold curing process 26, and the cooling rate of the large oven after the pre-baking process is generally low. Wherein the large oven is cooled by combining two steps of air cooling and water cooling, the air cooling in the first step uses air circulation to take out hot air in the oven, and the internal temperature can be reduced from 175 ℃ to 130 ℃; referring to fig. 2, the second step of water cooling is to inject Process Cooling Water (PCW) 32 at 22 ± 2 ℃ into the large-scale oven 30, and then discharge the high temperature water 34 to the plant end, so that the temperature inside the oven can be reduced from 130 ℃ to about 60 ℃ (maximum 62.4 ℃). However, the higher the temperature of the injected cooling water, the higher the return water temperature. However, the ideal return water temperature should be below 50 ℃, if the return water temperature is reduced to about 30 ℃, it takes more than half an Hour, which has a great influence on UPH (Unit Per Hour) of the factory, and the excessively high return water temperature may limit the water injection range of the cooling water and the temperature reduction efficiency of the oven, and the factory end must change the return water pipe into a stainless steel (SUS) pipe capable of resisting heat above 400 ℃ to avoid the work safety accident of pipe explosion, which further increases the overall installation cost.

Disclosure of Invention

Aiming at the problems in the prior art, the invention provides a machine cooling device and a machine cooling method, which can at least improve the capacity of controlling and managing the temperature of return water.

According to one aspect of an embodiment of the present invention, a machine cooling device is provided. The board heat sink includes: the water inlet pipe is connected to the water inlet of the machine station, the water return pipe is connected to the water outlet of the machine station, and the cross-over pipe is connected between the water inlet pipe and the water return pipe in a cross-over mode. Wherein, a part of the process cooling water flows into the machine station through the water inlet pipe and the water inlet to be cooled and form high-temperature return water, the high-temperature return water flows into the water return pipe through the water outlet, and the other part of the process cooling water flows into the water return pipe through the water inlet pipe and the jumper pipe to be mixed with the high-temperature return water.

In some embodiments, a portion of the process cooling water flowing into the platen may be greater than another portion of the process cooling water flowing into the return pipe.

In some embodiments, another portion of the process cooling water flowing into the return pipe via the jumper pipe is in a range of 30% to 50% of the total amount of the process cooling water. In some embodiments, a portion of the process cooling water flowing into the platen is in a range of 50% to 70% of the total amount of process cooling water.

In some embodiments, the platen cooling device further comprises a gas inlet hole and a gas outlet hole, and the gas inlet hole and the gas outlet hole are used for cooling gas to enter and leave the platen respectively. Wherein, the cooling gas cools the machine before the process cooling water enters the machine.

In some embodiments, the platen cooling device further comprises: a temperature sensor arranged at the water outlet; a control module connected to the temperature sensor. The control module controls the water quantity of the other part of the process cooling water flowing into the water return pipe through the jumper pipe according to the temperature of the high-temperature return water detected by the temperature sensor so as to keep the temperature of the high-temperature return water within a preset range.

In some embodiments, the platen cooling device further comprises a flow sensor connected to the control module and disposed at the jumper tube. The control module monitors the amount of the other part of the process cooling water flowing into the water return pipe through the jumper pipe according to the flow sensor.

In some embodiments, the predetermined range of temperature of the high temperature return water is in a range between 0 ℃ and 50 ℃. In some embodiments, the cooling efficiency of the platen cooling device is in the range of 2.5 ℃/min to 7 ℃/min.

According to another aspect of the embodiments of the present invention, there is provided a method for cooling a machine, including: connecting a water inlet of a machine table to a water inlet pipe, connecting a water outlet of the machine table to a water return pipe, and connecting a jumper pipe between the water inlet pipe and the water return pipe in a bridging manner, wherein one part of the process cooling water flows into the machine table through the water inlet pipe and the water inlet to be cooled and form high-temperature return water, the high-temperature return water flows into the water return pipe through the water outlet, and the other part of the process cooling water flows into the water return pipe through the water inlet pipe and the jumper pipe to be mixed with the high-temperature return water; the control module controls the amount of process cooling water flowing into the water return pipe from the jumper pipe according to the temperature of high-temperature return water flowing into the water return pipe from the water outlet.

In some embodiments, the method of cooling the platen further comprises: the temperature of the high-temperature return water is sensed by a temperature sensor which is arranged at the water outlet and electrically connected with the control module.

In some embodiments, the method of cooling the platen further comprises: the water quantity of the process cooling water flows into the water return pipe through the jumper pipe by a flow sensor which is arranged at the jumper pipe and connected with the control module.

In some embodiments, before the process cooling water enters the machine station, the method further comprises: and cooling gas is supplied to the machine station through the gas inlet hole to cool the machine station, and then the cooling gas leaves the machine station through the gas outlet hole.

In some embodiments, the control module is further configured to control the temperature of the high temperature return water to be maintained within a predetermined range.

In some embodiments, the control module controls the predetermined range of temperature of the high temperature return water to be within a range of less than 50 ℃.

In some embodiments, the cooling efficiency of the platen cooling device is in the range of 2.5 ℃/min to 7 ℃/min.

In some embodiments, the control module controls the amount of process cooling water flowing into the water return pipe through the jumper pipe to be within a range of 30% to 50% of the total amount of process cooling water provided by the water inlet pipe.

In some embodiments, the amount of process cooling water flowing into the platen is in a range of 50% to 70% of the total amount of process cooling water provided by the water inlet pipe.

Drawings

Various aspects of the invention are best understood from the following detailed description when read with the accompanying drawing figures. It should be noted that, in accordance with standard practice in the industry, the various components are not drawn to scale. In fact, the dimensions of the various elements may be arbitrarily increased or reduced for clarity of discussion.

Fig. 1A to 1G are schematic diagrams illustrating various stages of a conventional substrate process flow.

Fig. 2 is a schematic diagram illustrating a conventional cooling process performed by cooling water to cool a machine.

Fig. 3 is a schematic diagram illustrating a platen cooling device according to an embodiment of the invention.

Fig. 4 is a schematic flow chart illustrating a machine cooling method according to an embodiment of the invention.

DETAILED DESCRIPTION OF EMBODIMENT (S) OF INVENTION

The following disclosure provides many different embodiments, or examples, for implementing different features of the provided subject matter. Specific examples of components and arrangements are described below to simplify the present disclosure. These are, of course, merely examples and are not intended to be limiting. For example, in the following description, forming a first feature over or on a second feature may include embodiments in which the first and second features are in direct contact, as well as embodiments in which additional features are formed between the first and second features such that the first and second features may not be in direct contact. Moreover, the present disclosure may repeat reference numerals and/or letters in the various examples. This repetition is for the purpose of simplicity and clarity and does not in itself dictate a relationship between the various embodiments and/or configurations discussed.

The invention provides a machine cooling device. Fig. 3 is a schematic diagram illustrating a platen cooling device according to an embodiment of the invention. As shown in FIG. 3, the machine 310 has a water inlet 312 and a water outlet 318. According to some embodiments, the tool 310 may be an oven used in a thermal processing process. The water inlet 312 of the machine 310 is connected with the water inlet pipe 320, and the water outlet 318 of the machine 310 is connected with the water return pipe 330. The crossover pipe 340 is bridged between the water inlet pipe 320 and the water return pipe 330. After the Process Cooling Water (PCW) 550 is injected into the water inlet pipe 320, a part of the process cooling water 551 in the process cooling water 550 flows into the machine 310 through the water inlet pipe 320 and the water inlet 312 of the machine 310, and cools the machine 310, and a part of the process cooling water 551 entering the machine 310 absorbs heat during cooling to form high temperature return water 553. The high-temperature return water 553 flows into the return pipe 330 via the outlet 318. On the other hand, another part of the process cooling water 552 injected into the process cooling water 550 of the water inlet pipe 320 flows into the water return pipe 330 through the crossover pipe 340 (instead of entering the machine 310) to be mixed with the high temperature return water 553.

The technical scheme of the invention provides a solution for improving the temperature of high-temperature return water discharged by a machine (oven), and is mainly characterized in that a jumper 340 is bridged between a water inlet pipe 320 and a water return pipe 330 of a machine 310, a part of process cooling water 551 of process cooling water 550 used for cooling originally enters the machine 310 to continuously perform machine cooling action, and the other part of process cooling water 552 of the process cooling water 550 flows to the water return pipe 330 from the jumper 340 and cools the high-temperature return water 553 in the water return pipe 330, so that a parallel bidirectional return water temperature control system is formed. The high-temperature return water 553 which is to be returned to the return water pipe 330 of the plant service end can be effectively reduced to about 30 ℃ (the maximum is 33.4 ℃), and the temperature control capacity of the process is greatly improved. The temperature of the high-temperature return water 553 in the return pipe 330 is reduced, and thus the cooling efficiency is also improved, so that the cooling efficiency can be improved from the conventional 2.5 ℃/min to 7 ℃/min. In some embodiments, the cooling efficiency of the machine cooling device provided by the invention is within a range from 2.5 ℃/min to 7 ℃/min.

In addition, since the temperature of the high-temperature return water 553 in the return pipe 330 is reduced, a Plastic (PVC) material may be used for the return pipe 330. This can reduce the setup cost by about 30% by using a plastic pipe instead of a stainless steel (SUS) pipe originally used for high temperature resistance.

In some embodiments, the temperature of the high-temperature return water 553 of the return pipe 330 may be reduced in a fixed amount of water. In some embodiments, a portion of the process cooling water 551 flowing into the platform 310 may be greater than another portion of the process cooling water 552 flowing into the return pipe 330 via the jumper 340. In some embodiments, the amount of water flowing into the another portion of process cooling water 552 of the return pipe 330 via the jumper 340 is in the range of 30% to 50% of the total amount of process cooling water 550. The amount of water flowing into a portion of the process cooling water 551 of the platen 310 is in the range of 50% to 70% of the total amount of the process cooling water 550. For example, in one example, if the total amount of process cooling water 550 is 13 liters, the amount of water entering a portion of process cooling water 551 of the tool 310 is 8 liters (about 60%) and the amount of water entering another portion of process cooling water 552 of the return pipe 330 via the jumper 340 is 5 liters (about 40%). So that the temperature of the high-temperature return water 553 in the return pipe 330 may be reduced from 62.4 c to 33.4 c.

In some embodiments, a gas inlet hole and a gas outlet hole (not shown) for allowing cooling gas to enter and exit the platen, respectively, may also be provided. The process cooling water 550 may cool the tool 310 by cooling the tool 310 with cooling gas in an air cooling manner, and the air cooling uses air circulation to carry out the hot air in the tool 310 to achieve the cooling.

With continued reference to FIG. 3, in some embodiments, a temperature sensor 362 may also be disposed at the water outlet 318 of the machine 310. The temperature sensor 362 is connected to a control module 364. The temperature sensor 362 may be communicatively coupled to the control module 364 via wires or wirelessly. A temperature sensor 362 may be used to detect the temperature of the high temperature return water 553 flowing from the outlet 318. The control module 364 may control the amount of the other portion of the process cooling water 552 flowing into the return pipe 330 via the jumper 340 according to the temperature of the high-temperature return water 553 detected by the temperature sensor 362, so as to maintain the temperature of the high-temperature return water 553 within a predetermined range. In some embodiments, the control module 364 maintains the temperature of the high temperature return water 553 in a range between 0 ℃ and 50 ℃.

Additionally, a flow sensor 366 may be provided at the jumper 340, the flow sensor 366 also being communicatively coupled to the control module 364. The flow sensor 366 may monitor the amount of another portion of the process cooling water 552 flowing into the return pipe 330 via the jumper 340. The control module 364 may monitor the amount of process cooling water 552 flowing into the return pipe 330 via the jumper pipe 340 based on the flow sensor 366.

The embodiment of the invention also provides a machine cooling method. Fig. 4 is a schematic flow chart illustrating a machine cooling method according to an embodiment of the invention.

As shown in fig. 4, at step S402, a water inlet (e.g., the water inlet 312 in fig. 3) of a machine (e.g., the machine 310 in fig. 3) is connected to a water inlet pipe (e.g., the water inlet pipe 320 in fig. 3), a water outlet (e.g., the water outlet 318 in fig. 3) of the machine is connected to a water return pipe (e.g., the water return pipe 330 in fig. 3), and a jumper (e.g., the jumper 340 in fig. 3) is connected between the water inlet pipe and the water return pipe in a jumper manner. Wherein, a part of the process cooling water (for example, a part of the process cooling water 551 in fig. 3) flows into the machine through the water inlet pipe and the water inlet to cool and form high-temperature return water (for example, the high-temperature return water 553 in fig. 3), the high-temperature return water flows into the water return pipe through the water outlet, and another part of the process cooling water (for example, another part of the process cooling water 552 in fig. 3) flows into the water return pipe through the water inlet pipe and the jumper pipe to be mixed with the high-temperature return water.

At step S404, the amount of process cooling water flowing from the jumper into the water return is controlled by a control module (e.g., control module 364 in FIG. 3) according to the temperature of the high temperature return water flowing from the water outlet into the water return.

In some embodiments, the temperature of the high-temperature return water may be sensed by a temperature sensor (e.g., the temperature sensor 362 in fig. 3) disposed at the water outlet and electrically connected to the control module. The control module can control the temperature of the high-temperature backwater to be kept within a preset range. In some embodiments, the amount of process cooling water flowing through the jumper into the return pipe may also be measured by a flow sensor (e.g., flow sensor 366 of FIG. 3) disposed at the jumper and coupled to the control module.

In some embodiments, the cooling gas may be provided to the tool through the gas inlet before the process cooling water is injected into the tool to cool the tool, and then the cooling gas may exit the tool through the gas outlet.

The foregoing outlines features of several embodiments so that those skilled in the art may better understand the aspects of the present disclosure. Those skilled in the art should appreciate that they may readily use the present disclosure as a basis for designing or modifying other processes and structures for carrying out the same purposes and/or achieving the same advantages of the embodiments introduced herein. Those skilled in the art should also realize that such equivalent constructions do not depart from the spirit and scope of the present disclosure, and that they may make various changes, substitutions and alterations herein without departing from the spirit and scope of the present disclosure.

Claims

1. The utility model provides a machine cooling device which characterized in that includes:

the water inlet pipe is connected to the water inlet of the machine table;

the water return pipe is connected to a water outlet of the machine table;

and the jumper pipe is bridged between the water inlet pipe and the water return pipe, wherein one part of the process cooling water flows into the machine table through the water inlet pipe and the water inlet to be cooled and forms high-temperature return water, the high-temperature return water flows into the water return pipe through the water outlet, and the other part of the process cooling water flows into the water return pipe through the water inlet pipe and the jumper pipe to be mixed with the high-temperature return water.

2. The apparatus as claimed in claim 1, wherein a portion of the process cooling water flowing into the apparatus is larger than another portion of the process cooling water flowing into the return pipe.

3. The machine station cooling device of claim 1,

the water amount of the other part of the process cooling water flowing into the water return pipe through the jumper pipe is in the range of 30-50% of the total amount of the process cooling water.

4. The apparatus as claimed in claim 1, wherein a portion of the process cooling water flowing into the apparatus is in a range of 50% to 70% of the total amount of the process cooling water.

5. The machine station cooling device of claim 1, further comprising:

and the gas inlet hole and the gas outlet hole are respectively used for cooling gas to enter and leave the machine, wherein the cooling gas cools the machine before the process cooling water enters the machine.

6. The machine station cooling device of claim 1, further comprising:

a temperature sensor arranged at the water outlet,

and the control module is connected with the temperature sensor and used for controlling the water amount of the other part of the process cooling water flowing into the water return pipe through the jumper pipe according to the temperature of the high-temperature return water detected by the temperature sensor so as to keep the temperature of the high-temperature return water within a preset range.

7. The machine station cooling device of claim 6, further comprising:

and the flow sensor is connected with the control module and arranged at the jumper pipe, wherein the control module monitors the water quantity of the other part of the process cooling water flowing into the water return pipe through the jumper pipe according to the flow sensor.

8. The machine station cooling device according to claim 6, wherein the predetermined range of the temperature of the high temperature return water is in a range between 0 ℃ and 50 ℃.

9. The machine station cooling device according to claim 1, wherein the cooling efficiency of the machine station cooling device is within a range of 2.5 ℃/min to 7 ℃/min.

10. A machine cooling method is characterized by comprising the following steps:

connecting a water inlet of a machine table to a water inlet pipe, connecting a water outlet of the machine table to a water return pipe, and connecting a jumper pipe between the water inlet pipe and the water return pipe in a bridging manner,

part of the cooling water in the manufacturing process flows into the machine table through the water inlet pipe and the water inlet to be cooled and forms high-temperature return water, the high-temperature return water flows into the water return pipe through the water outlet,

flowing the other part of the process cooling water into the water return pipe through the water inlet pipe and the jumper pipe to be mixed with the high-temperature return water;

and the control module is used for controlling the amount of process cooling water flowing into the water return pipe from the jumper pipe according to the temperature of high-temperature return water flowing into the water return pipe from the water outlet.

11. The method for cooling down a machine platform of claim 10, further comprising:

and sensing the temperature of the high-temperature return water by a temperature sensor which is arranged at the water outlet and electrically connected with the control module.

12. The method for cooling down a machine platform of claim 10, further comprising:

and the water quantity of the process cooling water flows into the water return pipe through the jumper pipe by a flow sensor which is arranged at the jumper pipe and connected with the control module.

13. The method of claim 10, further comprising, before the process cooling water enters the tool:

and cooling the machine table by supplying cooling gas to the machine table through the gas inlet hole, and then enabling the cooling gas to leave the machine table through the gas outlet hole.

14. The method of claim 10, wherein the cooling of the machine,

the control module is also used for controlling the temperature of the high-temperature return water to be kept within a preset range.

15. The method of claim 14, wherein the cooling of the machine,

the control module controls the preset range of the temperature of the high-temperature backwater to be within a range less than 50 ℃.

16. The machine cooling method as claimed in claim 10, wherein the cooling efficiency of the machine cooling device is in a range of 2.5 ℃/min to 7 ℃/min.

17. The method of claim 10, wherein the cooling of the machine,

the control module controls the amount of the process cooling water flowing into the water return pipe through the jumper pipe to be within a range of 30-50% of the total amount of the process cooling water provided by the water inlet pipe.

18. The method of claim 10, wherein the cooling of the machine,

the amount of the process cooling water flowing into the machine is 50% to 70% of the total amount of the process cooling water provided by the water inlet pipe.