CN113793817A - IGBT module cooling method - Google Patents

IGBT module cooling method Download PDF

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Publication number
CN113793817A
CN113793817A CN202111067991.1A CN202111067991A CN113793817A CN 113793817 A CN113793817 A CN 113793817A CN 202111067991 A CN202111067991 A CN 202111067991A CN 113793817 A CN113793817 A CN 113793817A
Authority
CN
China
Prior art keywords
cooling
igbt module
oven
cavity
igbt
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202111067991.1A
Other languages
Chinese (zh)
Inventor
杨幸运
陶少勇
陈小磊
罗凯
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Anhui Ruidi Microelectronics Co ltd
Original Assignee
Anhui Ruidi Microelectronics Co ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Anhui Ruidi Microelectronics Co ltd filed Critical Anhui Ruidi Microelectronics Co ltd
Priority to CN202111067991.1A priority Critical patent/CN113793817A/en
Publication of CN113793817A publication Critical patent/CN113793817A/en
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67121—Apparatus for making assemblies not otherwise provided for, e.g. package constructions
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F27—FURNACES; KILNS; OVENS; RETORTS
    • F27D—DETAILS OR ACCESSORIES OF FURNACES, KILNS, OVENS, OR RETORTS, IN SO FAR AS THEY ARE OF KINDS OCCURRING IN MORE THAN ONE KIND OF FURNACE
    • F27D9/00—Cooling of furnaces or of charges therein
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F27—FURNACES; KILNS; OVENS; RETORTS
    • F27D—DETAILS OR ACCESSORIES OF FURNACES, KILNS, OVENS, OR RETORTS, IN SO FAR AS THEY ARE OF KINDS OCCURRING IN MORE THAN ONE KIND OF FURNACE
    • F27D9/00—Cooling of furnaces or of charges therein
    • F27D2009/0002—Cooling of furnaces
    • F27D2009/001—Cooling of furnaces the cooling medium being a fluid other than a gas

Abstract

The invention discloses a method for cooling an IGBT module, which comprises the following steps: s1, providing an oven, wherein the oven is provided with a cooling cavity; and S2, placing the IGBT module in a cooling cavity of an oven, and cooling the IGBT module. According to the IGBT module cooling method, the cooling cavity is additionally arranged in the oven, so that the IGBT module is cooled, the cooling efficiency is high, and the production efficiency is improved.

Description

IGBT module cooling method
Technical Field
The invention belongs to the technical field of semiconductor product production processes, and particularly relates to a cooling method for an IGBT module.
Background
In the traditional IGBT module packaging, after the semi-finished module is installed on the shell, glue pouring technology is needed inside, and the glue is cured in an oven at a high temperature of 100 ℃ for half an hour. Because the solidified modules need to be cooled to 50 ℃ before being discharged from the furnace and the temperature inside the furnace has no cooling function, the cooling effect can be achieved only by adopting a natural cooling mode.
The size of the curing furnace equipment used in the prior art is too large, and the length of the curing furnace equipment generally reaches 5-6 meters. Occupies the workshop field of the factory, is heavy and is not beneficial to the implementation of the future planning of the factory. The IGBT module adopts the mode cooling of natural cooling, and the cooling time is long, leads to production efficiency low. The IGBT module reaches the monitoring means of tapping temperature and is less, and the IGBT module reaches the poor management and control of tapping temperature condition, is unfavorable for the management and control of technology uniformity.
Disclosure of Invention
The present invention is directed to solving at least one of the problems of the prior art. Therefore, the invention provides a cooling method of an IGBT module, and aims to improve the production efficiency.
In order to achieve the purpose, the invention adopts the technical scheme that: the IGBT module cooling method comprises the following steps:
s1, providing an oven, wherein the oven is provided with a cooling cavity;
and S2, placing the IGBT module in a cooling cavity of an oven, and cooling the IGBT module.
The IGBT modules are arranged in multiple layers in a cooling cavity of the oven.
A cooling pipe is arranged in a cooling cavity of the oven, and cooling liquid flows in the cooling pipe.
According to the IGBT module cooling method, the cooling cavity is additionally arranged in the oven, so that the IGBT module is cooled, the cooling efficiency is high, and the production efficiency is improved.
Drawings
The description includes the following figures, the contents shown are respectively:
FIG. 1 is a schematic view of the oven construction;
labeled as: 1. a cooling chamber; 2. a heating cavity; 3. an IGBT module; 4. a carrying track.
Detailed Description
The following detailed description of the embodiments of the present invention will be given with reference to the accompanying drawings for a purpose of helping those skilled in the art to more fully, accurately and deeply understand the concept and technical solution of the present invention and to facilitate its implementation.
As shown in fig. 1, the invention provides a method for cooling an IGBT module, comprising the following steps:
s1, providing an oven, wherein the oven is provided with a cooling cavity 1;
and S2, placing the IGBT module in the cooling cavity 1 of the oven, and cooling the IGBT module.
Specifically, as shown in fig. 1, a heating chamber 2 and a cooling chamber 1 are provided inside the oven, and the heating chamber 2 and the cooling chamber 1 are independently controlled. In the above step S2, the IGBT modules are transported by the carrying rail 4 into the cooling chamber 1 of the oven, and all the IGBT modules are arranged in multiple stages in the vertical direction in the cooling chamber 1 of the oven. And the cooling cavity 1 is adopted to complete the cooling of the module, so that the cooling efficiency is high.
As shown in figure 1, the length L of the oven is 2m, the width and the height of the oven are both 2m, the occupied area is small, and the transfer is convenient.
Preferably, a cooling pipe is arranged in the cooling cavity 1 of the oven, and cooling liquid flows in the cooling pipe. The cooling pipe is connected with the water pump, the water pump is connected with the liquid storage tank, cooling liquid is stored in the liquid storage tank, the cooling liquid circularly flows between the liquid storage tank and the cooling pipe, the water inlet end of the cooling pipe is connected with the water outlet end of the water pump, the water outlet end of the cooling pipe is connected with the liquid storage tank, and the water inlet end of the water pump is connected with the liquid storage tank. The cooling tube and the air in the cooling cavity 1 are subjected to heat exchange, so that the temperature in the cooling cavity 1 is controlled, the temperature in the cooling cavity 1 is controlled within a set range, and the IGBT module can be cooled.
The invention is described above with reference to the accompanying drawings. It is to be understood that the specific implementations of the invention are not limited in this respect. Various insubstantial improvements are made by adopting the method conception and the technical scheme of the invention; the present invention is not limited to the above embodiments, and can be modified in various ways.

Claims (3)

  1. The IGBT module cooling method is characterized by comprising the following steps:
    s1, providing an oven, wherein the oven is provided with a cooling cavity;
    and S2, placing the IGBT module in a cooling cavity of an oven, and cooling the IGBT module.
  2. 2. The IGBT module cooling method of claim 1, wherein the IGBT modules are arranged in multiple layers in a cooling cavity of the oven.
  3. 3. The IGBT module cooling method according to claim 1 or 2, characterized in that a cooling pipe is arranged in the cooling cavity of the oven, and cooling liquid flows in the cooling pipe.
CN202111067991.1A 2021-09-13 2021-09-13 IGBT module cooling method Pending CN113793817A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202111067991.1A CN113793817A (en) 2021-09-13 2021-09-13 IGBT module cooling method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202111067991.1A CN113793817A (en) 2021-09-13 2021-09-13 IGBT module cooling method

Publications (1)

Publication Number Publication Date
CN113793817A true CN113793817A (en) 2021-12-14

Family

ID=78880030

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202111067991.1A Pending CN113793817A (en) 2021-09-13 2021-09-13 IGBT module cooling method

Country Status (1)

Country Link
CN (1) CN113793817A (en)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20120196242A1 (en) * 2011-01-27 2012-08-02 Applied Materials, Inc. Substrate support with heater and rapid temperature change
CN204006982U (en) * 2014-06-12 2014-12-10 志圣科技（广州）有限公司 A kind of high-efficiency and energy-saving type baking box
CN106206360A (en) * 2014-12-17 2016-12-07 四川虹视显示技术有限公司 A kind of intelligence OLED glass substrate baking cooling integrated machine
CN211047279U (en) * 2019-11-12 2020-07-17 中海安盟（北京）海事技术服务有限公司 IGBT induction heating equipment

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20120196242A1 (en) * 2011-01-27 2012-08-02 Applied Materials, Inc. Substrate support with heater and rapid temperature change
CN103370778A (en) * 2011-01-27 2013-10-23 应用材料公司 Substrate support with heater and rapid temperature change
CN204006982U (en) * 2014-06-12 2014-12-10 志圣科技（广州）有限公司 A kind of high-efficiency and energy-saving type baking box
CN106206360A (en) * 2014-12-17 2016-12-07 四川虹视显示技术有限公司 A kind of intelligence OLED glass substrate baking cooling integrated machine
CN211047279U (en) * 2019-11-12 2020-07-17 中海安盟（北京）海事技术服务有限公司 IGBT induction heating equipment

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