CN113834873A - Guided wave imaging device and method for ceramic tile debonding detection - Google Patents
Guided wave imaging device and method for ceramic tile debonding detection Download PDFInfo
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Abstract
The invention provides a guided wave imaging device and a guided wave imaging method for ceramic tile debonding detection, which comprise the following steps: the positioning system is used for enabling the distributed electronic scanning knocking unit to be located at the corresponding position of the ceramic tile; the distributed electronic scanning knocking unit is used for knocking the ceramic tile to excite a zero group velocity mode of a non-propagating first-order symmetrical lamb wave in the ceramic tile and sending a lamb wave signal; the receiving unit is used for respectively collecting lamb wave signals excited at different knocking positions; a mechanical scanning device for moving the positioning system; and the analysis module is used for receiving the lamb wave signals, analyzing the frequency spectrum characteristics of the lamb wave signals and judging whether different knocking points are debonded or not. The invention reduces the influence of factors such as the bonding condition of other tiles and the frequency dispersion propagated in the tiles on the hollowing detection accuracy by using the zero group velocity mode of the non-propagated first-order symmetrical lamb wave, and further improves the detection speed by combining the electronic scanning and the mechanical scanning.
Description
Technical Field
The invention relates to the field of guided wave detection, in particular to an imaging device and method for detecting ceramic tile debonding through guided wave.
Background
The adhesion of ceramic tiles is an important link in interior decoration. The most common tile attachment method today is to attach the tile with cement, but this method is prone to hollowing at the back of the tile, so that the area of cement bonding to the tile is reduced and the tile easily falls off.
The evaluation of the bonding condition of the ceramic tile does not have a quantifiable standard in the industry, the traditional bonding condition detection is to knock the ceramic tile through a hollowing hammer and judge the bonding condition through sound, the detection method not only depends on the experience of detection personnel, but also has low accuracy and is easy to miss detection of hollowing. Therefore, the evaluation of the whole bonding condition of the wall surface is not facilitated, and potential safety hazards are easy to remain.
Patent 202110311972.2 proposes a detector for analyzing internal defects of objects based on acoustic frequency, which can be used to detect the empty-drum condition of tiles. According to the invention, the ceramic tile is intermittently knocked by the knocking hammer, the knocking route of the knocking hammer is obtained by the displacement sensor, meanwhile, the sound frequency is obtained by connecting the cable with the sonar device, and the hollowing position and size are determined by rough and precise analysis.
The detection method disclosed in patent 202110311972.2 regards the vibration of striking the tile as a bending vibration of the panel, using a mode of propagation of acoustic waves; however, the frequency of the received signal is affected by the conditions of connection to other tiles and by the phenomenon of acoustic dispersion in the panel, which affects the accuracy of the detection. And patent 202110311972.2 adopts a knocking hammer to intermittently knock the ceramic tile, so that the detection efficiency is low.
Disclosure of Invention
The invention aims to overcome the defects of strong subjectivity, low accuracy and incapability of judging the hollowing position of manual ceramic tile hollowing detection, reduce the influence of the bonding condition between ceramic tiles on the detection accuracy and further improve the detection efficiency, thereby providing the guided wave imaging device and the guided wave imaging method for ceramic tile debonding detection.
In order to solve the problems, the technical scheme of the invention provides a guided wave imaging method and a guided wave imaging device for tile debonding detection.
The utility model provides a guided wave imaging device that ceramic tile debonding detected, includes strikes the unit, the processing unit, its characterized in that includes:
the positioning system comprises a plurality of telescopic rods and a rotating shaft and is used for determining the position of the ceramic tile and enabling the distributed electronic scanning knocking unit to be located at the corresponding position of the ceramic tile;
the knocking unit adopts a distributed electronic scanning knocking unit, comprises a plurality of knocking sound sources and is used for knocking the ceramic tile so as to excite a zero group velocity mode (S) of a non-propagating first-order symmetrical lamb wave in the plate-shaped ceramic tile point by point1-ZGV mode) and emits a lamb wave signal;
the receiving unit is used for respectively collecting the lamb wave signals sent out from different knocking positions and sending the collected lamb wave signals to the processing unit;
a processing unit comprising an analysis module; the analysis module is used for receiving the lamb wave signals, analyzing the frequency spectrum characteristics of the lamb wave signals and judging whether different knocking points are debonded or not.
And the mechanical scanning device is used for moving the positioning system, so that the guided wave imaging device for ceramic tile debonding detection moves to the next ceramic tile, and positioning, knocking, signal receiving, frequency spectrum analysis and image drawing are repeated until a bonding image is obtained on the whole wall surface.
As an improvement of the above device, the drawing module determines hollowing position information and draws a paste image cloud picture of a single tile according to the position of the distributed electronic scanning knocking unit and the frequency domain characteristics of the corresponding lamb wave signal, and after the scanning of all the tiles is completed, the paste image cloud pictures of each single tile are spliced into a full-wall paste image cloud picture according to the coordinate positions of the corresponding tiles;
and calculating the full wall surface hollowing rate through a hollowing rate calculation module based on the full wall surface pasted image cloud picture.
As an improvement of the above device, the telescopic rods are overlapped in a shape like a Chinese character 'mi', and the rotating shaft passes through the intersection point of the telescopic rods, so that the telescopic rods can rotate by taking the rotating shaft as a circle center;
the knocking sound sources are respectively arranged near the end points of the telescopic rods and are perpendicular to the plane formed by the overlapping of the telescopic rods; the air coupling transducers are respectively arranged between the end points of the telescopic rods and the knocking sound sources, are respectively arranged in close contact with each knocking sound source, and are perpendicular to the plane formed by the overlapping of the telescopic rods;
as an improvement of the device, the receiving unit adopts a plurality of air coupling transducers to respectively collect lamb wave signals excited at different knocking positions and sends the collected lamb wave signals to the processing unit.
As an improvement of the above device, the mechanical scanning device comprises a mechanical arm which can move parallel to the wall surface, and the mechanical arm is fixed with the positioning system.
As an improvement of the above device, the specific process of analyzing the frequency spectrum characteristics of the lamb wave signal and judging whether different knocking points are debonded includes:
fourier transform is performed on the received signal x (t) to obtain a frequency spectrum A (omega) of the signal, and a lower limit frequency f with the amplitude smaller than the maximum frequency amplitude max (A (omega)) by 3dB is taken1And an upper limit frequency f2(ii) a Wherein the amplitude smaller than the maximum frequency amplitude max (A (ω)) by 3dB is
By the formula
Calculating the center frequency f of the frequency peak of the maximum amplitude of the signal obtained at the tapping point0；
By the formula
Calculating to obtain the frequency f when there is empty drumkWhen f is0At fkAt a nearby frequency, the knock point is considered to have empty drum; wherein f iskBeta is an empirical correction factor for the frequency at hollowing, said beta being related to a physical parameter of the tile, requiring preliminary experimental measurements, and is a constant, V, for tiles of the same type of materialLThe body longitudinal wave velocity of the ceramic tile, and h is the thickness of the ceramic tile;
the specific algorithm for calculating the full wall surface hollowing rate is as follows:
wherein omega is the full wall surface hollowing rate, N is the hollowing number, N is the number of ceramic tiles, and S is the area of each ceramic tile.
A guided wave imaging method for tile debonding detection, comprising:
step 1) setting a movement distance in the mechanical scanning device based on the tile size; setting a moving route in the mechanical scanning device according to the number of the ceramic tiles; the guided wave imaging device that can make the ceramic tile debond the detection scans full wall ceramic tile. And the moving distance is set based on the size of the ceramic tile, so that the requirement for detecting the ceramic tiles with different sizes can be met.
Step 2) determining the position of the ceramic tile through the positioning system, and enabling the distributed electronic scanning knocking unit to be located at the corresponding position of the ceramic tile;
step 3) knocking the ceramic tile through the distributed electronic scanning knocking unit, exciting a zero group velocity mode of a non-propagated first-order symmetrical lamb wave in the ceramic tile, and sending a lamb wave signal; the lamb wave signals sent out at different knocking positions are respectively collected through the receiving unit, and the receiving unit is connected to a computer and used for transmitting the received lamb wave signals to the processing unit;
step 4) receiving the lamb wave signals through an analysis module of a processing unit, analyzing the frequency spectrum characteristics of the lamb wave signals, and judging whether different knocking points are debonded or not;
step 5), determining hollowing position information and drawing a pasting image cloud picture of a single ceramic tile by a drawing module of the processing unit through combining the knocking position of the distributed electronic scanning knocking unit and the frequency domain characteristics of the corresponding lamb wave signal;
step 6) moving the positioning system through the mechanical scanning device based on the moving distance and the moving route set in the step 1), and repeating the steps 2) to 4) until the moving route set in the step 1) is completed;
step 7), after the set moving route is finished, splicing the pasting image cloud pictures of each single tile into a pasting image cloud picture of the whole wall surface by the drawing module according to the coordinate position of the corresponding tile; and calculating the full-wall surface empty drum rate through an empty drum rate calculation module of the processing unit based on the full-wall surface pasted image cloud picture.
As an improvement of the device, the distributed electronic scanning knocking unit can be respectively positioned close to the middle point of the upper edge, the lower edge, the left edge, the right edge and the four corners of the ceramic tile and close to the four corners by a positioning system; the mechanical scanning device moves the positioning system through the mechanical arm. As an improvement of the above device, the specific process of analyzing the frequency spectrum characteristics of the lamb wave signal and judging whether different knocking points are debonded includes:
fourier transform is performed on the received signal x (t) to obtain a frequency spectrum A (omega) of the signal, and a lower limit frequency f with the amplitude smaller than the maximum frequency amplitude max (A (omega)) by 3dB is taken1And an upper limit frequency f2(ii) a Wherein the amplitude smaller than the maximum frequency amplitude max (A (ω)) by 3dB is
By the formula
Calculating a frequency peak of maximum amplitude of the signal obtained at the tap pointCenter frequency f of value0；
By the formula
Calculating to obtain the frequency f when there is empty drumkWhen f is0At fkAt a nearby frequency, the knock point is considered to have empty drum; wherein f iskBeta is an empirical correction factor for the frequency at hollowing, said beta being related to a physical parameter of the tile, requiring preliminary experimental measurements and being a constant, V, for tiles of the same type of materialLThe body longitudinal wave velocity of the ceramic tile, and h is the thickness of the ceramic tile;
the specific algorithm for calculating the wall surface hollowing rate is as follows:
wherein omega is the hollowing rate of the wall surface, N is the number of hollowing, N is the number of ceramic tiles, and S is the area of each ceramic tile.
As an improvement of the device, the drawing module divides a tile into a plurality of rectangular areas, represents good bonding and hollowing by using different colors and draws a pasting image cloud picture of a single tile; and after all the tiles are scanned, splicing the pasting image cloud pictures of all the tiles into the pasting image cloud pictures of the whole wall surface according to the coordinate positions of the corresponding tiles.
The invention provides a guided wave imaging method and a guided wave imaging device for tile debonding detection, which quantize the bonding condition of tiles through the influence of hollowing on the frequency of ultrasonic guided waves, and form a bonding image of a full-wall tile and calculate the hollowing rate by combining the electronic scanning of a single tile and the mechanical scanning method of the whole wall. The guided wave imaging method and the guided wave imaging device for tile debonding detection eliminate the subjectivity of the manual tile hollowing detection method, have high accuracy and can judge the tile hollowing position. Zero group velocity mode (S) by using non-propagating first order symmetric lamb waves, as opposed to the propagation model method1-ZGV mode) reduces the adhesion of the remaining tiles andfactors such as frequency dispersion propagated in the ceramic tile and the like influence the hollowing detection accuracy, and the detection speed is further improved in a mode of combining electronic scanning and mechanical scanning.
Drawings
FIG. 1 is a flow chart of a guided wave imaging method for tile adhesion detection provided by the present invention;
FIG. 2 is a schematic view of a positioning system in a guided wave imaging system for tile adhesion detection according to the present invention;
FIG. 3 is a schematic view of a single tile bonding image provided by the present invention;
fig. 4 is a schematic view of a full wall tile bonding image provided by the present invention.
Detailed Description
The technical scheme provided by the invention is further illustrated by combining the following embodiments.
As shown in fig. 2, the positioning system of the guided wave imaging device for tile debonding detection of the present embodiment includes eight telescopic rods and a rotating shaft, and is used to determine the position of a tile, so that the distributed electronic scanning tapping unit is located at the corresponding position of the tile;
distributed electronically scanned rapping unit comprising eight rapping sound sources for rapping a tile to excite a zero group velocity mode (S) of non-propagating first-order symmetric lamb waves within the tile1-ZGV mode) and emits a lamb wave signal;
the receiving unit is used for acquiring lamb wave signals sent out at different knocking positions respectively by adopting eight air coupling transducers and sending the acquired lamb wave signals to the processing unit; the eight telescopic rods are overlapped in a shape like a Chinese character 'mi', and the rotating shaft penetrates through the intersection points of the eight telescopic rods, so that the telescopic rods can rotate by taking the rotating shaft as a circle center;
the eight knocking sound sources are respectively arranged near the end points of the telescopic rods and are perpendicular to the plane formed by the overlapping of the telescopic rods; the eight air coupling transducers are respectively arranged between the end points of the telescopic rods and the knocking sound sources, are respectively arranged in close contact with each knocking sound source, and are perpendicular to the plane formed by the overlapping of the telescopic rods;
a mechanical scanning device for moving the positioning system; the mechanical scanning device comprises a mechanical arm capable of moving parallel to the wall surface, and the mechanical arm is fixed with the positioning system.
A processing unit comprising an analysis module; the analysis module is used for receiving the lamb wave signals, analyzing the frequency spectrum characteristics of the lamb wave signals and judging whether different knocking points are debonded. The processing unit further comprises a drawing module and an empty-drum rate calculation module, wherein,
the drawing module determines hollowing position information and draws a pasting image cloud picture of a single tile according to the position of the distributed electronic scanning knocking unit and the frequency domain characteristics of the corresponding lamb wave signal, and after all tiles are scanned, the pasting image cloud picture of each single tile is spliced into a full-wall pasting image cloud picture according to the coordinate position of the corresponding tile;
and the hollowing rate calculation module is used for calculating the hollowing rate of the whole wall surface based on the pasting image cloud picture of the whole wall surface.
Analyzing the frequency spectrum characteristics of the lamb wave signals, and judging whether different knocking points are debonded or not comprises the following specific processes:
fourier transform is performed on the received signal x (t) to obtain a frequency spectrum A (omega) of the signal, and a lower limit frequency f with the amplitude smaller than the maximum frequency amplitude max (A (omega)) by 3dB is taken1And an upper limit frequency f2(ii) a Wherein the amplitude smaller than the maximum frequency amplitude max (A (ω)) by 3dB is
By the formula
Calculating the center frequency f of the frequency peak of the maximum amplitude of the signal obtained at the tapping point0；
By the formula
Calculating to obtain the frequency f when there is empty drumkWhen f is0At fkAt a nearby frequency, the knock point is considered to have empty drum; wherein f iskBeta is an empirical correction factor for the frequency at hollowing, said beta being related to a physical parameter of the tile, requiring preliminary experimental measurements, and said beta being a constant, V, for tiles of the same type of materialLThe body longitudinal wave velocity of the ceramic tile and h is the thickness of the ceramic tile.
The specific algorithm for calculating the full wall surface hollowing rate is as follows:
wherein omega is the full wall surface hollowing rate, N is the hollowing number, N is the number of ceramic tiles, and S is the area of each ceramic tile.
Fig. 1 is a flowchart of a guided wave imaging method for tile adhesion detection according to the present invention. As shown in fig. 1, the guided wave imaging step of tile adhesion detection includes:
step 1) the width of the tile is lxLength of lySetting the transverse single movement distance to l in the mechanical scanning devicexA single longitudinal movement distance of lySetting a moving route in the mechanical scanning device in combination with the number of tiles;
step 2) determining the position of the ceramic tile through the positioning system, and enabling the distributed electronic scanning knocking unit to be located at the corresponding position of the ceramic tile; specifically, the distributed electronic scanning and knocking unit can be respectively positioned near the middle point of the upper edge, the lower edge, the left edge, the right edge and the four corners of the ceramic tile through a positioning system, as shown in fig. 2, the length and the angle of the eight telescopic rods are adjusted according to the size of the ceramic tile, so that the position of the knocking sound source is 5cm away from the edge of the ceramic tile.
Step 3) controlling eight knocking sound sources to sequentially knock the ceramic tile by using the distributed electronic scanning knocking units, and exciting a zero group velocity mode (S) of a non-propagated first-order symmetrical lamb wave in the ceramic tile1-ZGV mode) and emits a lamb wave signal; an air coupling transducer beside the knocking sound source receives lamb wave signals sent after knocking, namely airThe air coupling transducer is connected to the computer and used for transmitting the received lamb wave signals to the processing unit.
Step 4) receiving the lamb wave signals through an analysis module of a processing unit, analyzing the frequency spectrum characteristics of the lamb wave signals, and judging whether different knocking points are debonded or not; specifically, the received signal x (t) is fourier-transformed to obtain a frequency spectrum a (ω) of the signal, and a lower limit frequency f having an amplitude smaller than the maximum frequency amplitude max (a (ω)) by 3dB is selected1And an upper limit frequency f2(ii) a Wherein the amplitude smaller than the maximum frequency amplitude max (A (ω)) by 3dB is
By the formula
Calculating the center frequency f of the frequency peak of the maximum amplitude of the signal obtained at the tapping point0。
By the formula
Calculating to obtain the frequency f when there is empty drumkWhen f is0At fkAt a nearby frequency, the knock point is considered to have empty drum; wherein f iskBeta is an empirical correction factor for the frequency at hollowing, said beta being related to a physical parameter of the tile, requiring preliminary experimental measurements and being a constant, V, for tiles of the same type of materialLThe body longitudinal wave velocity of the ceramic tile and h is the thickness of the ceramic tile.
Step 5), determining hollowing position information and drawing a pasting image cloud picture of a single ceramic tile by a drawing module of the processing unit through combining the knocking position of the distributed electronic scanning knocking unit and the frequency domain characteristics of the corresponding lamb wave signal; specifically, as shown in fig. 3, a tile is divided into 8 rectangular areas, and a bonding image of a single tile is drawn by using different colors to represent good bonding and empty drums according to the tapping position of the distributed electronic scanning tapping unit and the frequency domain characteristics of the corresponding lamb wave signal, wherein a gray area represents that the empty drums exist, and a black area represents that the bonding is intact.
Step 6) based on the moving distance and the moving route set in the step 1), adopting a mechanical arm to move a positioning system, and repeating the steps 2) to 4) until the moving route set in the step 1) is finished; specifically, the mechanical arm is used for moving the positioning system, and the distance l is moved transversely every timexAnd (5) repeating the steps (2) to (4) until the transverse wall surface is scanned. Then longitudinally moved by a distance lyAnd (5) re-scanning transversely, namely repeating the steps (2) to (4) until the full wall surface is scanned.
Step 7), after the set moving route is finished, namely all the tiles are scanned, the drawing module is shown in fig. 4; as shown in fig. 4, the cloud pictures of the pasted images drawn by each tile are spliced into the pasted images of the whole wall surface according to the position coordinates; the hollowing rate of the wall surface is calculated by a hollowing rate calculation module of the processing unit, specifically according to a formula
And calculating the hollowing rate omega, wherein N is the number of hollowing, N is the number of tiles, and S is the area of each tile.
As can be seen from the above detailed description of the present invention, the guided wave imaging method and apparatus for tile debonding detection provided by the present invention quantizes the bonding condition of the tiles through the influence of the hollowing on the frequency of the ultrasonic guided wave, forms the bonding image of the full-wall tiles by combining the electronic scanning of a single tile and the mechanical scanning method of the entire wall, and calculates the hollowing rate. The subjectivity of the manual ceramic tile hollowing detection method is eliminated, the accuracy is high, and the ceramic tile hollowing position can be judged. Relative to the propagation model approach, the present invention uses the zero group velocity mode (S) of the non-propagating first order symmetric lamb wave1ZGV mode) reduces the influence of factors such as the bonding condition of the rest tiles and the dispersion spread in the tiles on the detection accuracy of the hollowing, and further improves the detection speed by combining the electronic scanning and the mechanical scanning.
Finally, it should be noted that the above embodiments are only used for illustrating the technical solutions of the present invention and are not limited. Although the present invention has been described in detail with reference to the embodiments, it will be understood by those skilled in the art that various changes may be made and equivalents may be substituted without departing from the spirit and scope of the invention as defined in the appended claims.
Claims (10)
1. The utility model provides a guided wave image device that ceramic tile debonding detected, includes strikes unit and processing unit, its characterized in that includes:
the positioning system comprises a plurality of telescopic rods and a rotating shaft and is used for determining the position of the ceramic tile and enabling the distributed electronic scanning knocking unit to be located at the corresponding position of the ceramic tile;
the knocking unit adopts a distributed electronic scanning knocking unit, comprises a plurality of knocking sound sources and is used for knocking the ceramic tile so as to excite a zero group velocity mode of non-propagating first-order symmetrical lamb waves in the ceramic tile and send lamb wave signals;
the receiving unit is used for respectively collecting the lamb wave signals sent out from different knocking positions and sending the collected lamb wave signals to the processing unit;
a mechanical scanning device for moving the positioning system;
a processing unit comprising an analysis module; the analysis module is used for receiving the lamb wave signals, analyzing the frequency spectrum characteristics of the lamb wave signals and judging whether different knocking points are debonded.
2. The guided wave imaging device for tile debonding detection according to claim 1, wherein the processing unit comprises a drawing module and a hollowing rate calculation module; wherein,
the drawing module determines hollowing position information and draws a pasting image cloud picture of a single tile according to the position of the distributed electronic scanning knocking unit and the frequency domain characteristics of the corresponding lamb wave signal, and after all tiles are scanned, the pasting image cloud picture of each single tile is spliced into a full-wall pasting image cloud picture according to the coordinate position of the corresponding tile;
and the hollowing rate calculation module is used for calculating the hollowing rate of the whole wall surface based on the pasting image cloud picture of the whole wall surface.
3. The guided wave imaging device for tile debonding detection according to claim 1, wherein the plurality of telescopic links are overlapped in a shape like a Chinese character 'mi', and the telescopic links can rotate around a rotating shaft; the knocking sound sources are respectively arranged near the end points of the telescopic rods and are perpendicular to the plane formed by the overlapping of the telescopic rods; the air coupling transducers are respectively arranged between the end points of the telescopic rods and the knocking sound sources, are respectively arranged in a manner of being tightly attached to each knocking sound source, and are arranged perpendicular to the plane formed by overlapping of the telescopic rods.
4. The guided wave imaging device for tile debonding detection according to claim 1, wherein the receiving unit respectively collects lamb wave signals excited at different knocking positions by using a plurality of air-coupled transducers, and sends the collected lamb wave signals to the processing unit.
5. The guided wave imaging apparatus for tile debonding detection according to claim 1, wherein the mechanical scanning device comprises a robotic arm movable parallel to the wall surface, the robotic arm being affixed to the positioning system.
6. The guided wave imaging device for tile debonding detection according to claim 1, wherein the specific process of analyzing the frequency spectrum characteristics of the lamb wave signals and determining whether different knocking points are debonded comprises:
fourier transform is performed on the received signal x (t) to obtain a frequency spectrum A (omega) of the signal, and a lower limit frequency f with the amplitude smaller than the maximum frequency amplitude max (A (omega)) by 3dB is taken1And an upper limit frequency f2(ii) a Wherein the amplitude smaller than the maximum frequency amplitude max (A (ω)) by 3dB is
By the formula
Calculating the center frequency f of the frequency peak of the maximum amplitude of the signal obtained at the tapping point0；
By the formula
Calculating to obtain the frequency f when there is empty drumkWhen f is0At fkAt a nearby frequency, the knock point is considered to have empty drum; wherein f iskBeta is an empirical correction factor for the frequency at hollowing, said beta being related to a physical parameter of the tile, requiring preliminary experimental measurements, and said beta being a constant, V, for tiles of the same type of materialLThe body longitudinal wave velocity of the ceramic tile, and h is the thickness of the ceramic tile;
the specific algorithm for calculating the full wall surface hollowing rate is as follows:
wherein omega is the full wall surface hollowing rate, N is the hollowing number, N is the number of ceramic tiles, and S is the area of each ceramic tile.
7. A guided wave imaging method for tile debonding detection, comprising:
step 1) setting a movement distance in the mechanical scanning device based on the tile size; setting a moving route in the mechanical scanning device according to the number of the ceramic tiles;
step 2) determining the position of the ceramic tile through the positioning system, and enabling the distributed electronic scanning knocking unit to be located at the corresponding position of the ceramic tile;
step 3) knocking the ceramic tile through the distributed electronic scanning knocking unit, exciting a zero group velocity mode of a non-propagated first-order symmetrical lamb wave in the ceramic tile, and sending a lamb wave signal; the lamb wave signals sent out at different knocking positions are respectively collected through the receiving unit, and the receiving unit is connected to a computer and used for transmitting the received lamb wave signals to the processing unit;
step 4) receiving the lamb wave signals through an analysis module of a processing unit, analyzing the frequency spectrum characteristics of the lamb wave signals, and judging whether different knocking points are debonded or not;
step 5), determining hollowing position information and drawing a pasting image cloud picture of a single ceramic tile by a drawing module of the processing unit through combining the knocking position of the distributed electronic scanning knocking unit and the frequency domain characteristics of the corresponding lamb wave signal;
step 6) moving a positioning system by a mechanical scanning device based on the moving distance and the moving route set in the step 1), and repeating the steps 2) to 4) until the moving route set in the step 1) is completed;
step 7), after the set moving route is finished, splicing the pasting image cloud pictures of each single tile into a pasting image cloud picture of the whole wall surface by the drawing module according to the coordinate position of the corresponding tile; and calculating the full-wall surface empty drum rate through an empty drum rate calculation module of the processing unit based on the full-wall surface pasted image cloud picture.
8. The guided wave imaging method for tile debonding detection according to claim 7,
the distributed electronic scanning knocking unit can be respectively positioned at the middle point and the four corners near the upper edge, the lower edge, the left edge and the right edge of the ceramic tile through a positioning system;
the mechanical scanning device moves the positioning system through the mechanical arm.
9. The guided wave imaging method for tile debonding detection according to claim 7, wherein the specific process of analyzing the frequency spectrum characteristics of the lamb wave signals and determining whether different knocking points are debonded comprises:
by subjecting the received signal x (t) toFourier transform to obtain a frequency spectrum A (omega) of the signal, and the frequency f of the signal is 3dB lower than the maximum frequency amplitude max (A (omega))1、f2By the formula
Calculating the center frequency f of the frequency peak of the maximum amplitude of the signal obtained at the tapping point0；
By the formula
Calculating to obtain the frequency f when there is empty drumk(ii) a When f is0At fkAt a nearby frequency, the knock point is considered to have empty drum; wherein f iskBeta is an empirical correction factor for the frequency at hollowing, said beta being related to a physical parameter of the tile, requiring preliminary experimental measurements and being a constant, V, for tiles of the same type of materialLThe body longitudinal wave velocity of the ceramic tile, and h is the thickness of the ceramic tile;
the specific algorithm for calculating the full wall surface hollowing rate is as follows:
wherein omega is the full wall surface hollowing rate, N is the hollowing number, N is the number of ceramic tiles, and S is the area of each ceramic tile.
10. The guided wave imaging method for tile debonding detection according to claim 7, wherein the drawing module divides a tile into a plurality of rectangular areas, and draws a cloud image of the pasted image of a single tile by using different colors to represent good adhesion and empty drum; and after all the tiles are scanned, splicing the pasting image cloud pictures of all the tiles into the pasting image cloud pictures of the whole wall surface according to the coordinate positions of the corresponding tiles.
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