CN113815342A - Laser etching sealing liquid and laser etching method for texture forming of die chamber - Google Patents
Laser etching sealing liquid and laser etching method for texture forming of die chamber Download PDFInfo
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- CN113815342A CN113815342A CN202111104862.5A CN202111104862A CN113815342A CN 113815342 A CN113815342 A CN 113815342A CN 202111104862 A CN202111104862 A CN 202111104862A CN 113815342 A CN113815342 A CN 113815342A
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- laser etching
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- laser
- liquid
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- 238000010329 laser etching Methods 0.000 title claims abstract description 46
- 238000007789 sealing Methods 0.000 title claims abstract description 38
- 239000007788 liquid Substances 0.000 title claims abstract description 36
- 238000000034 method Methods 0.000 title claims abstract description 34
- 238000005530 etching Methods 0.000 claims abstract description 23
- 229910052751 metal Inorganic materials 0.000 claims abstract description 21
- 239000002184 metal Substances 0.000 claims abstract description 21
- 238000005488 sandblasting Methods 0.000 claims abstract description 6
- 238000004140 cleaning Methods 0.000 claims abstract description 4
- 238000009499 grossing Methods 0.000 claims abstract description 4
- 238000004381 surface treatment Methods 0.000 claims abstract description 4
- 239000010410 layer Substances 0.000 claims description 39
- 229920002635 polyurethane Polymers 0.000 claims description 10
- 239000004814 polyurethane Substances 0.000 claims description 10
- 239000002344 surface layer Substances 0.000 claims description 8
- 239000003973 paint Substances 0.000 claims description 6
- 239000003795 chemical substances by application Substances 0.000 claims description 5
- 238000002156 mixing Methods 0.000 claims description 4
- 239000000126 substance Substances 0.000 claims description 4
- 239000002202 Polyethylene glycol Substances 0.000 claims description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 3
- 239000006229 carbon black Substances 0.000 claims description 3
- 230000007797 corrosion Effects 0.000 claims description 3
- 238000005260 corrosion Methods 0.000 claims description 3
- 238000005538 encapsulation Methods 0.000 claims description 3
- 238000003754 machining Methods 0.000 claims description 3
- 239000002245 particle Substances 0.000 claims description 3
- 229920001223 polyethylene glycol Polymers 0.000 claims description 3
- 229910052710 silicon Inorganic materials 0.000 claims description 3
- 239000010703 silicon Substances 0.000 claims description 3
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 claims description 3
- 229910010271 silicon carbide Inorganic materials 0.000 claims description 3
- 239000002518 antifoaming agent Substances 0.000 claims description 2
- 239000003085 diluting agent Substances 0.000 claims description 2
- 238000005452 bending Methods 0.000 abstract description 6
- 230000015556 catabolic process Effects 0.000 abstract description 5
- 238000002955 isolation Methods 0.000 abstract 5
- 230000007547 defect Effects 0.000 description 3
- 238000012856 packing Methods 0.000 description 3
- 229910052705 radium Inorganic materials 0.000 description 3
- HCWPIIXVSYCSAN-UHFFFAOYSA-N radium atom Chemical compound [Ra] HCWPIIXVSYCSAN-UHFFFAOYSA-N 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 2
- 239000002699 waste material Substances 0.000 description 2
- 206010034960 Photophobia Diseases 0.000 description 1
- 238000005270 abrasive blasting Methods 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 239000013530 defoamer Substances 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 239000000839 emulsion Substances 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- 229910052736 halogen Inorganic materials 0.000 description 1
- 150000002367 halogens Chemical class 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 208000013469 light sensitivity Diseases 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000003921 oil Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
- 239000002351 wastewater Substances 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B44—DECORATIVE ARTS
- B44C—PRODUCING DECORATIVE EFFECTS; MOSAICS; TARSIA WORK; PAPERHANGING
- B44C1/00—Processes, not specifically provided for elsewhere, for producing decorative surface effects
- B44C1/22—Removing surface-material, e.g. by engraving, by etching
- B44C1/227—Removing surface-material, e.g. by engraving, by etching by etching
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B44—DECORATIVE ARTS
- B44C—PRODUCING DECORATIVE EFFECTS; MOSAICS; TARSIA WORK; PAPERHANGING
- B44C1/00—Processes, not specifically provided for elsewhere, for producing decorative surface effects
- B44C1/22—Removing surface-material, e.g. by engraving, by etching
- B44C1/228—Removing surface-material, e.g. by engraving, by etching by laser radiation
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- General Health & Medical Sciences (AREA)
- Optics & Photonics (AREA)
- Toxicology (AREA)
- Laser Beam Processing (AREA)
Abstract
The invention provides a laser etching sealing liquid and a laser etching method for texture forming of a die chamber, and belongs to the technical field of laser etching. The invention comprises the following steps: surface treatment, namely cleaning a groove chamber of the mold, and smoothing the processing surface in the groove chamber by a sand blasting process; covering the surface with an isolation layer, preparing isolation liquid, uniformly covering the isolation liquid on the processed surface, and curing the isolation liquid to form the isolation layer; laser etching windowing, wherein windowing is carried out on the seal layer according to the forming textures, and the metal body of the windowing part is exposed; and chemically etching the exposed metal body of the open window part. The invention adopts the combination of laser etching and etching process, shortens the forming period of the traditional etching texture and reduces the cost of the full-flow laser etching operation. The forming of the sealing layer is scientific, the laser breakdown is stable, the burning depth of the windowed metal surface is accurately controlled, the texture forming precision is improved, and the method is particularly suitable for processing surfaces with curved surfaces and bending surfaces.
Description
The application is a divisional application of Chinese patent application with the application number of CN201910334946.4 and the name of laser etching process filed in 24/4/2019 by the Chinese patent office.
Technical Field
The invention belongs to the technical field of laser etching, and particularly relates to laser etching sealing liquid and a laser etching method for texture forming of a mold groove chamber.
Background
The traditional texture manufacturing process mostly adopts film exposure, a layer of pattern is required to be manually and accurately aligned before each film exposure, the position tolerance precision between each layer of pattern is +/-0.03 mm, and the precision is poor; moreover, each manual film alignment consumes a lot of time and the positioning is inaccurate, so that rework is caused, and the cost is high. In addition, each layer of patterns in the mode needs to be sprayed with photosensitive resist, so that more process waste water is generated, and the environment is polluted.
The chinese patent application publication No. CN109277274A discloses a laser etching mixing process for mold appearance texture, which can realize texture forming by laser and etching processes, and improve the operation efficiency. However, the characteristics and the dosage of the photosensitive emulsion have great defects.
In the practical application process, the traditional photosensitive resist is difficult to control the laser etching strength, the uneven burning phenomenon exists on the metal surface after the photosensitive resist is broken down, the high-precision forming of textures is influenced, especially, errors are easy to occur under the conditions of curvature and bending surface, and the dosage of the photosensitive resist and the laser do not have necessary relation.
In addition, the breakdown layer needs to have higher chemical stability, so that the texture forming precision can be ensured during etching operation, and the traditional photosensitive adhesive is easy to have instability in the etching process, so that the texture forming precision is finally lower.
Disclosure of Invention
The invention aims to solve the defects of the prior art and provides a laser etching sealing liquid and a laser etching method for texture forming of a die chamber aiming at the problems of the traditional laser etching mixed process.
In order to achieve the purpose, the technical scheme adopted by the invention is as follows:
the invention provides a laser etching and sealing liquid, which comprises the following components in percentage by mass:
10 parts of black waterborne polyurethane finish paint,
5 parts of a curing agent, namely,
8-10 parts of a diluent;
the black waterborne polyurethane finish paint is formed by mixing waterborne polyurethane, polyethylene glycol, an organic silicon defoaming agent and carbon black.
The invention provides a laser etching method for texture forming of a die groove chamber, which comprises the following steps:
the surface treatment is carried out in the S1 way,
cleaning a groove chamber of the mold, and smoothing the processing surface in the groove chamber by a sand blasting process;
the surface of the S2 is covered with a sealing layer,
preparing a sealing liquid, uniformly covering the sealing liquid on the processing surface, and forming a sealing layer after the sealing liquid is cured by thermal light; the sealing liquid is the laser etching sealing liquid as defined in claim 1;
the layer thickness of the sealing and isolating liquid covering the processing surface is 0.3mm +/-0.05 mm; the curing time is 5min +/-20 s;
s3 laser etching to open the window,
carrying out laser etching windowing on the seal layer according to the forming textures, wherein a metal body of the laser etching windowing part is exposed; when the laser carving windowing is carried out, the laser intensity is controlled to be smaller than 0.001mm after the encapsulation liquid layer is broken down and the etching depth of the metal surface layer is smaller than 0.001 mm;
the chemical corrosion of the S4 is carried out,
and etching the exposed metal body of the windowing part by using the etching liquid.
Preferably, in step S1, the abrasive blasting uses 600-800 mesh silicon carbide abrasive particles.
Preferably, when the window is opened by laser etching, the laser intensity is controlled to be 0.00042 +/-0.00017 mm for puncturing the liquid-sealing layer and etching the metal surface layer.
Preferably, the machining surface is provided with a curved surface and/or a bent surface.
Preferably, the texture comprises at least two texture layers, and any texture layer is formed by steps S2-S4.
The invention has the following beneficial effects:
1. the laser etching and etching process is combined, so that the traditional etching texture forming period is shortened, and the cost of the full-flow laser etching operation is reduced.
2. The formation of the seal layer is scientific, the laser breakdown is stable, the burning depth of the windowed metal surface is accurately controlled, and the texture forming precision is improved.
3. The method is particularly suitable for processing surfaces with curved surfaces and bending surfaces, and meets the processing requirements of multilayer textures.
Drawings
FIG. 1 is a schematic flow chart of a laser etching process according to the present invention.
Detailed Description
The invention provides a laser etching sealing liquid and a laser etching method for texture forming of a die chamber. The technical solution of the present invention is described in detail below with reference to the accompanying drawings so that it can be more easily understood and appreciated.
The laser etching process is used for texture forming of a mold groove chamber, and comprises the following steps as shown in figure 1:
the surface treatment is carried out in the S1 way,
and cleaning the groove chamber of the mold, and smoothing the processing surface in the groove chamber by a sand blasting process.
The processing surface of the die has the conditions of oil stain, dust and the like, and the surface flatness of the die also has certain defects. The sand blasting adopts 600-800 meshes of silicon carbide grinding particles, meets the surface smoothness requirement of texture forming, and is flat and reliable in bonding with the sealing liquid.
The surface of the S2 is covered with a sealing layer,
and (3) preparing a sealing liquid, uniformly covering the sealing liquid on the processing surface, and curing the sealing liquid to form a sealing layer.
The packing fluid comprises the following components in percentage by mass: 10 parts of black waterborne polyurethane finish, 5 parts of curing agent and 8-10 parts of thinner.
The invention adopts the black waterborne polyurethane finish paint, has better light sensitivity, can uniformly mix the sealing liquid and the curing agent by using the thinner, realizes spraying at the same time, and can harden the sealing layer after curing by using the curing agent to form a more uniform and stable sealing layer.
More specifically, the black waterborne polyurethane finish paint is formed by mixing waterborne polyurethane, polyethylene glycol, an organic silicon defoamer and carbon black.
The thickness of the layer of the sealing liquid covering the work surface was 0.3 mm. + -. 0.05mm, and the curing was carried out by thermal irradiation for 5 min. + -. 20 s.
This thickness satisfies the intensity setting of radium carving to it is better to puncture the degree of consistency, and when the seal layer was less than this scope, radium carving produced great burning depth deviation at the metal surface very easily, and when surpassing this scope, the packing liquid quantity was too much, caused the waste of packing liquid and blowdown treatment cost to increase on the one hand, and on the other hand has increased radium carving intensity and has caused the energy waste.
The curing time also needs to be explained, the high-wattage halogen lamp can be used for curing by adopting proper thermal illumination, the internal stress can be released during the curing of the sealing and isolating layer by the curing time, the phenomena of dry cracking, bending and the like are not easy to generate, the size difference caused by laser etching breakdown is prevented, and the stability of windowing is ensured.
S3 laser etching to open the window,
and carrying out laser etching windowing on the seal layer according to the forming textures, wherein the metal body of the laser etching windowing part is exposed.
The laser intensity is controlled to be less than 0.001mm when the encapsulation liquid layer is broken down and the metal surface layer is etched.
Theoretically, it is most reasonable to puncture the liquid-barrier layer without damaging the metal surface layer, but under the condition of multiple tests, the laser intensity is controlled to be 0.00042 +/-0.00017 mm fluctuation on the metal surface layer under the condition of completely puncturing the liquid-barrier layer by adopting the liquid-barrier layer formed by the liquid-barrier layer, and the precision requirement is met when the etching depth of the metal surface layer is less than 0.02mm in texture processing. The thickness of the coating can be controlled to be at least below 0.001 mm.
The chemical corrosion of the S4 is carried out,
and etching the exposed metal body of the window portion.
The window is etched by the etching solution to form a texture. The sealing layer is stable in adhesion and form and high in texture forming precision in the etching process.
The present invention is particularly suitable for machining surfaces having curved surfaces and/or bending surfaces. Through the setting of radium-shine intensity, can carry out high accuracy windowing when plane and curved surface or the face of buckling the transition.
In one embodiment, the texture comprises at least two texture layers, and any texture layer is formed by steps S2-S4. Namely, laser windowing and etching are sequentially carried out according to the texture layer.
Through the above description, it can be found that the laser etching method provided by the invention adopts the combination of the laser etching and the etching process, so that the traditional etching texture forming period is shortened, and the cost of the full-flow laser etching operation is reduced. The formation of the seal layer is scientific, the laser breakdown is stable, the burning depth of the windowed metal surface is accurately controlled, and the texture forming precision is improved. The method is particularly suitable for processing surfaces with curved surfaces and bending surfaces, and meets the processing requirements of multilayer textures.
The technical solutions of the present invention are fully described above, it should be noted that the specific embodiments of the present invention are not limited by the above description, and all technical solutions formed by equivalent or equivalent changes in structure, method, or function according to the spirit of the present invention by those skilled in the art are within the scope of the present invention.
Claims (6)
1. A laser etching and sealing liquid comprises the following components in percentage by mass:
10 parts of black waterborne polyurethane finish paint,
5 parts of a curing agent, namely,
8-10 parts of a diluent;
the black waterborne polyurethane finish paint is formed by mixing waterborne polyurethane, polyethylene glycol, an organic silicon defoaming agent and carbon black.
2. A laser etching method for texture forming of a mold groove chamber comprises the following steps:
the surface treatment is carried out in the S1 way,
cleaning a groove chamber of the mold, and smoothing the processing surface in the groove chamber by a sand blasting process;
the surface of the S2 is covered with a sealing layer,
preparing a sealing liquid, uniformly covering the sealing liquid on the processing surface, and forming a sealing layer after the sealing liquid is cured by thermal light; the sealing liquid is the laser etching sealing liquid as defined in claim 1;
the layer thickness of the sealing and isolating liquid covering the processing surface is 0.3mm +/-0.05 mm; the curing time is 5min +/-20 s;
s3 laser etching to open the window,
carrying out laser etching windowing on the seal layer according to the forming textures, wherein a metal body of the laser etching windowing part is exposed; when the laser carving windowing is carried out, the laser intensity is controlled to be smaller than 0.001mm after the encapsulation liquid layer is broken down and the etching depth of the metal surface layer is smaller than 0.001 mm;
the chemical corrosion of the S4 is carried out,
and etching the exposed metal body of the windowing part by using the etching liquid.
3. The method of claim 2, wherein in the step S1, the sand blasting uses 600-800 mesh silicon carbide abrasive particles.
4. The method as claimed in claim 2, wherein the laser intensity is controlled to 0.00042 +/-0.00017 mm of the etching depth of the metal surface layer by puncturing the liquid-proof layer during laser etching windowing.
5. Method according to claim 2, characterized in that the machining surface is provided with a curved and/or bent surface.
6. The method of claim 2, wherein the texture comprises at least two texture layers, and any texture layer is formed by steps S2-S4.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111104862.5A CN113815342A (en) | 2019-04-24 | 2019-04-24 | Laser etching sealing liquid and laser etching method for texture forming of die chamber |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111104862.5A CN113815342A (en) | 2019-04-24 | 2019-04-24 | Laser etching sealing liquid and laser etching method for texture forming of die chamber |
| CN201910334946.4A CN109955636A (en) | 2019-04-24 | 2019-04-24 | Laser carving etch process |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910334946.4A Division CN109955636A (en) | 2019-04-24 | 2019-04-24 | Laser carving etch process |
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| Publication Number | Publication Date |
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| CN113815342A true CN113815342A (en) | 2021-12-21 |
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| CN202111104862.5A Pending CN113815342A (en) | 2019-04-24 | 2019-04-24 | Laser etching sealing liquid and laser etching method for texture forming of die chamber |
| CN201910334946.4A Pending CN109955636A (en) | 2019-04-24 | 2019-04-24 | Laser carving etch process |
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Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113737182A (en) * | 2020-05-29 | 2021-12-03 | 昆山建荣模具标准件有限公司 | Embossing process for machining die parts |
| CN114501872A (en) * | 2020-10-23 | 2022-05-13 | 深圳市万普拉斯科技有限公司 | Texture preparation method of cover plate, cover plate and electronic equipment |
| CN113894019A (en) * | 2021-10-19 | 2022-01-07 | 安徽华深铝业有限公司 | Method for processing surface grains of aluminum alloy profile |
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| US6352646B1 (en) * | 1998-07-07 | 2002-03-05 | Benecke-Kaliko Ag | Processing method for a metal surface |
| CN104789100A (en) * | 2015-03-30 | 2015-07-22 | 广西吉宽太阳能设备有限公司 | Waterborne polyurethane dampproof anticorrosive coating and preparation method thereof |
| CN107333396A (en) * | 2017-07-04 | 2017-11-07 | 东莞光韵达光电科技有限公司 | Method for manufacturing film stereo antenna |
| CN109003904A (en) * | 2018-07-13 | 2018-12-14 | 无锡天杨电子有限公司 | A kind of preparation method of rail traffic chip ceramic copper-clad plate surfacial pattern |
| CN109277274A (en) * | 2018-10-19 | 2019-01-29 | 昆山市极点精密模具有限公司 | The laser-induced thermal etching hybrid process technique of mould appearance texture |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0474567A (en) * | 1990-07-18 | 1992-03-09 | Yoshida Kogyo Kk <Ykk> | Accessories having multicolored patterned coating layer and method for manufacturing the same |
| CN101456331B (en) * | 2007-12-14 | 2012-07-25 | 比亚迪股份有限公司 | Method for marking pattern on metal work piece surface |
| CN201881814U (en) * | 2010-11-25 | 2011-06-29 | 胡宁 | Metal painting |
| CN103802576B (en) * | 2012-11-05 | 2018-05-08 | 上海英雄礼赞文具礼品有限公司 | A kind of gold-plated Lacquer finish technique of laser carving |
| CN104846372B (en) * | 2014-02-13 | 2017-12-05 | 昆山均瑞电子科技有限公司 | Local etching makes the method and localization tool of three-dimensional part |
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2019
- 2019-04-24 CN CN202111104862.5A patent/CN113815342A/en active Pending
- 2019-04-24 CN CN201910334946.4A patent/CN109955636A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6352646B1 (en) * | 1998-07-07 | 2002-03-05 | Benecke-Kaliko Ag | Processing method for a metal surface |
| CN104789100A (en) * | 2015-03-30 | 2015-07-22 | 广西吉宽太阳能设备有限公司 | Waterborne polyurethane dampproof anticorrosive coating and preparation method thereof |
| CN107333396A (en) * | 2017-07-04 | 2017-11-07 | 东莞光韵达光电科技有限公司 | Method for manufacturing film stereo antenna |
| CN109003904A (en) * | 2018-07-13 | 2018-12-14 | 无锡天杨电子有限公司 | A kind of preparation method of rail traffic chip ceramic copper-clad plate surfacial pattern |
| CN109277274A (en) * | 2018-10-19 | 2019-01-29 | 昆山市极点精密模具有限公司 | The laser-induced thermal etching hybrid process technique of mould appearance texture |
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Application publication date: 20211221 |