CN113815342A - Laser etching sealing liquid and laser etching method for texture forming of die chamber - Google Patents

Laser etching sealing liquid and laser etching method for texture forming of die chamber Download PDF

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Publication number
CN113815342A
CN113815342A CN202111104862.5A CN202111104862A CN113815342A CN 113815342 A CN113815342 A CN 113815342A CN 202111104862 A CN202111104862 A CN 202111104862A CN 113815342 A CN113815342 A CN 113815342A
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China
Prior art keywords
laser etching
etching
layer
laser
liquid
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CN202111104862.5A
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段志宏
段世茂
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Suzhou Xingze Laser Technology Co ltd
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Suzhou Xingze Laser Technology Co ltd
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Priority to CN202111104862.5A priority Critical patent/CN113815342A/en
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B44DECORATIVE ARTS
    • B44CPRODUCING DECORATIVE EFFECTS; MOSAICS; TARSIA WORK; PAPERHANGING
    • B44C1/00Processes, not specifically provided for elsewhere, for producing decorative surface effects
    • B44C1/22Removing surface-material, e.g. by engraving, by etching
    • B44C1/227Removing surface-material, e.g. by engraving, by etching by etching
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B44DECORATIVE ARTS
    • B44CPRODUCING DECORATIVE EFFECTS; MOSAICS; TARSIA WORK; PAPERHANGING
    • B44C1/00Processes, not specifically provided for elsewhere, for producing decorative surface effects
    • B44C1/22Removing surface-material, e.g. by engraving, by etching
    • B44C1/228Removing surface-material, e.g. by engraving, by etching by laser radiation

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • General Health & Medical Sciences (AREA)
  • Optics & Photonics (AREA)
  • Toxicology (AREA)
  • Laser Beam Processing (AREA)

Abstract

The invention provides a laser etching sealing liquid and a laser etching method for texture forming of a die chamber, and belongs to the technical field of laser etching. The invention comprises the following steps: surface treatment, namely cleaning a groove chamber of the mold, and smoothing the processing surface in the groove chamber by a sand blasting process; covering the surface with an isolation layer, preparing isolation liquid, uniformly covering the isolation liquid on the processed surface, and curing the isolation liquid to form the isolation layer; laser etching windowing, wherein windowing is carried out on the seal layer according to the forming textures, and the metal body of the windowing part is exposed; and chemically etching the exposed metal body of the open window part. The invention adopts the combination of laser etching and etching process, shortens the forming period of the traditional etching texture and reduces the cost of the full-flow laser etching operation. The forming of the sealing layer is scientific, the laser breakdown is stable, the burning depth of the windowed metal surface is accurately controlled, the texture forming precision is improved, and the method is particularly suitable for processing surfaces with curved surfaces and bending surfaces.

Description

Laser etching sealing liquid and laser etching method for texture forming of die chamber
The application is a divisional application of Chinese patent application with the application number of CN201910334946.4 and the name of laser etching process filed in 24/4/2019 by the Chinese patent office.
Technical Field
The invention belongs to the technical field of laser etching, and particularly relates to laser etching sealing liquid and a laser etching method for texture forming of a mold groove chamber.
Background
The traditional texture manufacturing process mostly adopts film exposure, a layer of pattern is required to be manually and accurately aligned before each film exposure, the position tolerance precision between each layer of pattern is +/-0.03 mm, and the precision is poor; moreover, each manual film alignment consumes a lot of time and the positioning is inaccurate, so that rework is caused, and the cost is high. In addition, each layer of patterns in the mode needs to be sprayed with photosensitive resist, so that more process waste water is generated, and the environment is polluted.
The chinese patent application publication No. CN109277274A discloses a laser etching mixing process for mold appearance texture, which can realize texture forming by laser and etching processes, and improve the operation efficiency. However, the characteristics and the dosage of the photosensitive emulsion have great defects.
In the practical application process, the traditional photosensitive resist is difficult to control the laser etching strength, the uneven burning phenomenon exists on the metal surface after the photosensitive resist is broken down, the high-precision forming of textures is influenced, especially, errors are easy to occur under the conditions of curvature and bending surface, and the dosage of the photosensitive resist and the laser do not have necessary relation.
In addition, the breakdown layer needs to have higher chemical stability, so that the texture forming precision can be ensured during etching operation, and the traditional photosensitive adhesive is easy to have instability in the etching process, so that the texture forming precision is finally lower.
Disclosure of Invention
The invention aims to solve the defects of the prior art and provides a laser etching sealing liquid and a laser etching method for texture forming of a die chamber aiming at the problems of the traditional laser etching mixed process.
In order to achieve the purpose, the technical scheme adopted by the invention is as follows:
the invention provides a laser etching and sealing liquid, which comprises the following components in percentage by mass:
10 parts of black waterborne polyurethane finish paint,
5 parts of a curing agent, namely,
8-10 parts of a diluent;
the black waterborne polyurethane finish paint is formed by mixing waterborne polyurethane, polyethylene glycol, an organic silicon defoaming agent and carbon black.
The invention provides a laser etching method for texture forming of a die groove chamber, which comprises the following steps:
the surface treatment is carried out in the S1 way,
cleaning a groove chamber of the mold, and smoothing the processing surface in the groove chamber by a sand blasting process;
the surface of the S2 is covered with a sealing layer,
preparing a sealing liquid, uniformly covering the sealing liquid on the processing surface, and forming a sealing layer after the sealing liquid is cured by thermal light; the sealing liquid is the laser etching sealing liquid as defined in claim 1;
the layer thickness of the sealing and isolating liquid covering the processing surface is 0.3mm +/-0.05 mm; the curing time is 5min +/-20 s;
s3 laser etching to open the window,
carrying out laser etching windowing on the seal layer according to the forming textures, wherein a metal body of the laser etching windowing part is exposed; when the laser carving windowing is carried out, the laser intensity is controlled to be smaller than 0.001mm after the encapsulation liquid layer is broken down and the etching depth of the metal surface layer is smaller than 0.001 mm;
the chemical corrosion of the S4 is carried out,
and etching the exposed metal body of the windowing part by using the etching liquid.
Preferably, in step S1, the abrasive blasting uses 600-800 mesh silicon carbide abrasive particles.
Preferably, when the window is opened by laser etching, the laser intensity is controlled to be 0.00042 +/-0.00017 mm for puncturing the liquid-sealing layer and etching the metal surface layer.
Preferably, the machining surface is provided with a curved surface and/or a bent surface.
Preferably, the texture comprises at least two texture layers, and any texture layer is formed by steps S2-S4.
The invention has the following beneficial effects:
1. the laser etching and etching process is combined, so that the traditional etching texture forming period is shortened, and the cost of the full-flow laser etching operation is reduced.
2. The formation of the seal layer is scientific, the laser breakdown is stable, the burning depth of the windowed metal surface is accurately controlled, and the texture forming precision is improved.
3. The method is particularly suitable for processing surfaces with curved surfaces and bending surfaces, and meets the processing requirements of multilayer textures.
Drawings
FIG. 1 is a schematic flow chart of a laser etching process according to the present invention.
Detailed Description
The invention provides a laser etching sealing liquid and a laser etching method for texture forming of a die chamber. The technical solution of the present invention is described in detail below with reference to the accompanying drawings so that it can be more easily understood and appreciated.
The laser etching process is used for texture forming of a mold groove chamber, and comprises the following steps as shown in figure 1:
the surface treatment is carried out in the S1 way,
and cleaning the groove chamber of the mold, and smoothing the processing surface in the groove chamber by a sand blasting process.
The processing surface of the die has the conditions of oil stain, dust and the like, and the surface flatness of the die also has certain defects. The sand blasting adopts 600-800 meshes of silicon carbide grinding particles, meets the surface smoothness requirement of texture forming, and is flat and reliable in bonding with the sealing liquid.
The surface of the S2 is covered with a sealing layer,
and (3) preparing a sealing liquid, uniformly covering the sealing liquid on the processing surface, and curing the sealing liquid to form a sealing layer.
The packing fluid comprises the following components in percentage by mass: 10 parts of black waterborne polyurethane finish, 5 parts of curing agent and 8-10 parts of thinner.
The invention adopts the black waterborne polyurethane finish paint, has better light sensitivity, can uniformly mix the sealing liquid and the curing agent by using the thinner, realizes spraying at the same time, and can harden the sealing layer after curing by using the curing agent to form a more uniform and stable sealing layer.
More specifically, the black waterborne polyurethane finish paint is formed by mixing waterborne polyurethane, polyethylene glycol, an organic silicon defoamer and carbon black.
The thickness of the layer of the sealing liquid covering the work surface was 0.3 mm. + -. 0.05mm, and the curing was carried out by thermal irradiation for 5 min. + -. 20 s.
This thickness satisfies the intensity setting of radium carving to it is better to puncture the degree of consistency, and when the seal layer was less than this scope, radium carving produced great burning depth deviation at the metal surface very easily, and when surpassing this scope, the packing liquid quantity was too much, caused the waste of packing liquid and blowdown treatment cost to increase on the one hand, and on the other hand has increased radium carving intensity and has caused the energy waste.
The curing time also needs to be explained, the high-wattage halogen lamp can be used for curing by adopting proper thermal illumination, the internal stress can be released during the curing of the sealing and isolating layer by the curing time, the phenomena of dry cracking, bending and the like are not easy to generate, the size difference caused by laser etching breakdown is prevented, and the stability of windowing is ensured.
S3 laser etching to open the window,
and carrying out laser etching windowing on the seal layer according to the forming textures, wherein the metal body of the laser etching windowing part is exposed.
The laser intensity is controlled to be less than 0.001mm when the encapsulation liquid layer is broken down and the metal surface layer is etched.
Theoretically, it is most reasonable to puncture the liquid-barrier layer without damaging the metal surface layer, but under the condition of multiple tests, the laser intensity is controlled to be 0.00042 +/-0.00017 mm fluctuation on the metal surface layer under the condition of completely puncturing the liquid-barrier layer by adopting the liquid-barrier layer formed by the liquid-barrier layer, and the precision requirement is met when the etching depth of the metal surface layer is less than 0.02mm in texture processing. The thickness of the coating can be controlled to be at least below 0.001 mm.
The chemical corrosion of the S4 is carried out,
and etching the exposed metal body of the window portion.
The window is etched by the etching solution to form a texture. The sealing layer is stable in adhesion and form and high in texture forming precision in the etching process.
The present invention is particularly suitable for machining surfaces having curved surfaces and/or bending surfaces. Through the setting of radium-shine intensity, can carry out high accuracy windowing when plane and curved surface or the face of buckling the transition.
In one embodiment, the texture comprises at least two texture layers, and any texture layer is formed by steps S2-S4. Namely, laser windowing and etching are sequentially carried out according to the texture layer.
Through the above description, it can be found that the laser etching method provided by the invention adopts the combination of the laser etching and the etching process, so that the traditional etching texture forming period is shortened, and the cost of the full-flow laser etching operation is reduced. The formation of the seal layer is scientific, the laser breakdown is stable, the burning depth of the windowed metal surface is accurately controlled, and the texture forming precision is improved. The method is particularly suitable for processing surfaces with curved surfaces and bending surfaces, and meets the processing requirements of multilayer textures.
The technical solutions of the present invention are fully described above, it should be noted that the specific embodiments of the present invention are not limited by the above description, and all technical solutions formed by equivalent or equivalent changes in structure, method, or function according to the spirit of the present invention by those skilled in the art are within the scope of the present invention.

Claims (6)

1. A laser etching and sealing liquid comprises the following components in percentage by mass:
10 parts of black waterborne polyurethane finish paint,
5 parts of a curing agent, namely,
8-10 parts of a diluent;
the black waterborne polyurethane finish paint is formed by mixing waterborne polyurethane, polyethylene glycol, an organic silicon defoaming agent and carbon black.
2. A laser etching method for texture forming of a mold groove chamber comprises the following steps:
the surface treatment is carried out in the S1 way,
cleaning a groove chamber of the mold, and smoothing the processing surface in the groove chamber by a sand blasting process;
the surface of the S2 is covered with a sealing layer,
preparing a sealing liquid, uniformly covering the sealing liquid on the processing surface, and forming a sealing layer after the sealing liquid is cured by thermal light; the sealing liquid is the laser etching sealing liquid as defined in claim 1;
the layer thickness of the sealing and isolating liquid covering the processing surface is 0.3mm +/-0.05 mm; the curing time is 5min +/-20 s;
s3 laser etching to open the window,
carrying out laser etching windowing on the seal layer according to the forming textures, wherein a metal body of the laser etching windowing part is exposed; when the laser carving windowing is carried out, the laser intensity is controlled to be smaller than 0.001mm after the encapsulation liquid layer is broken down and the etching depth of the metal surface layer is smaller than 0.001 mm;
the chemical corrosion of the S4 is carried out,
and etching the exposed metal body of the windowing part by using the etching liquid.
3. The method of claim 2, wherein in the step S1, the sand blasting uses 600-800 mesh silicon carbide abrasive particles.
4. The method as claimed in claim 2, wherein the laser intensity is controlled to 0.00042 +/-0.00017 mm of the etching depth of the metal surface layer by puncturing the liquid-proof layer during laser etching windowing.
5. Method according to claim 2, characterized in that the machining surface is provided with a curved and/or bent surface.
6. The method of claim 2, wherein the texture comprises at least two texture layers, and any texture layer is formed by steps S2-S4.
CN202111104862.5A 2019-04-24 2019-04-24 Laser etching sealing liquid and laser etching method for texture forming of die chamber Pending CN113815342A (en)

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CN201910334946.4A CN109955636A (en) 2019-04-24 2019-04-24 Laser carving etch process
CN202111104862.5A CN113815342A (en) 2019-04-24 2019-04-24 Laser etching sealing liquid and laser etching method for texture forming of die chamber

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Publication number Priority date Publication date Assignee Title
CN113737182A (en) * 2020-05-29 2021-12-03 昆山建荣模具标准件有限公司 Embossing process for machining die parts
CN114501872A (en) * 2020-10-23 2022-05-13 深圳市万普拉斯科技有限公司 Texture preparation method of cover plate, cover plate and electronic equipment
CN113894019A (en) * 2021-10-19 2022-01-07 安徽华深铝业有限公司 Method for processing surface grains of aluminum alloy profile

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6352646B1 (en) * 1998-07-07 2002-03-05 Benecke-Kaliko Ag Processing method for a metal surface
CN104789100A (en) * 2015-03-30 2015-07-22 广西吉宽太阳能设备有限公司 Waterborne polyurethane dampproof anticorrosive coating and preparation method thereof
CN107333396A (en) * 2017-07-04 2017-11-07 东莞光韵达光电科技有限公司 A kind of manufacture method of film stereo antenna
CN109003904A (en) * 2018-07-13 2018-12-14 无锡天杨电子有限公司 A kind of preparation method of rail traffic chip ceramic copper-clad plate surfacial pattern
CN109277274A (en) * 2018-10-19 2019-01-29 昆山市极点精密模具有限公司 The laser-induced thermal etching hybrid process technique of mould appearance texture

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0474567A (en) * 1990-07-18 1992-03-09 Yoshida Kogyo Kk <Ykk> Accessory having coating layer of multicolor pattern and preparation thereof
CN101456331B (en) * 2007-12-14 2012-07-25 比亚迪股份有限公司 Method for marking pattern on metal work piece surface
CN201881814U (en) * 2010-11-25 2011-06-29 胡宁 Metal painting
CN103802576B (en) * 2012-11-05 2018-05-08 上海英雄礼赞文具礼品有限公司 A kind of gold-plated Lacquer finish technique of laser carving
CN104846372B (en) * 2014-02-13 2017-12-05 昆山均瑞电子科技有限公司 Local etching makes the method and localization tool of three-dimensional part

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6352646B1 (en) * 1998-07-07 2002-03-05 Benecke-Kaliko Ag Processing method for a metal surface
CN104789100A (en) * 2015-03-30 2015-07-22 广西吉宽太阳能设备有限公司 Waterborne polyurethane dampproof anticorrosive coating and preparation method thereof
CN107333396A (en) * 2017-07-04 2017-11-07 东莞光韵达光电科技有限公司 A kind of manufacture method of film stereo antenna
CN109003904A (en) * 2018-07-13 2018-12-14 无锡天杨电子有限公司 A kind of preparation method of rail traffic chip ceramic copper-clad plate surfacial pattern
CN109277274A (en) * 2018-10-19 2019-01-29 昆山市极点精密模具有限公司 The laser-induced thermal etching hybrid process technique of mould appearance texture

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Application publication date: 20211221