CN113811089A - Method for manufacturing circuit board acyclic metallized hole - Google Patents
Method for manufacturing circuit board acyclic metallized hole Download PDFInfo
- Publication number
- CN113811089A CN113811089A CN202111090391.7A CN202111090391A CN113811089A CN 113811089 A CN113811089 A CN 113811089A CN 202111090391 A CN202111090391 A CN 202111090391A CN 113811089 A CN113811089 A CN 113811089A
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- China
- Prior art keywords
- hole
- circuit board
- dry film
- acyclic
- metallized
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0073—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces
- H05K3/0079—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces characterised by the method of application or removal of the mask
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/423—Plated through-holes or plated via connections characterised by electroplating method
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
Abstract
The invention relates to the technical field of PCB manufacturing, and discloses a method for manufacturing a circuit board non-ring metallized hole, which comprises the following steps: s1, after the circuit board with the acyclic metallized through hole is plated, covering a dry film, and developing the circuit board covered with the dry film to make a small hole in the dry film corresponding to the position of the acyclic metallized through hole; s2, carrying out whole board electroplating on the circuit board which is subjected to the step S1, and electroplating a corrosion-resistant layer on the hole wall of the non-ring metalized through hole; s3, removing the dry film covering the board surface of the circuit board which is subjected to the step S2; s4, manufacturing a negative film dry film on the circuit board which is subjected to the step S3, manufacturing a light blocking PAD at the position of the metalized through hole which is designed to be ring-free, and leaking an unnecessary annular copper sheet at the position which is designed to be ring-free after development; and S5, etching the circuit board which is subjected to the step S4 to remove the unnecessary copper sheet, and then sequentially stripping and stripping the corrosion-resistant layer to obtain the circuit board without the ring metalized hole.
Description
Technical Field
The invention relates to the technical field of PCB manufacturing, in particular to a method for manufacturing a circuit board acyclic metalized hole.
Background
At present, the metalized through holes of the PCB contain products with ringless design, and since the ringless through holes can not be manufactured by a negative film, the ringless through holes can only be manufactured by a positive film in the industry. However, the product produced in the positive wafer process has isolated circuit positions due to circuit electroplating, so that the current is larger during electroplating, the copper plating thickness is larger, the copper thickness of the copper sheet and the copper thickness of the dense circuit positions are thicker, the uniformity of the whole plate thickness is poorer, and the design requirements of customers cannot be met.
Disclosure of Invention
In order to solve the technical problem, the invention provides a method for manufacturing a circuit board non-ring metalized hole, which comprises the following steps:
s1, covering a dry film after the circuit board with the acyclic metallized through hole is subjected to board surface electroplating, and developing the circuit board covered with the dry film to enable the dry film corresponding to the position of the acyclic metallized through hole to manufacture a small hole, wherein the aperture of the small hole in the dry film is smaller than that of the acyclic metallized through hole;
s2, carrying out whole board electroplating on the circuit board which is finished by the step S1, and electroplating a corrosion-resistant layer on the hole wall of the designed acyclic metalized through hole and the position which does not need to be etched;
s3, removing the dry film covering the board surface of the circuit board which is subjected to the step S2;
s4, manufacturing a negative film dry film on the circuit board which is subjected to the step S3, manufacturing a light blocking PAD at the position of the metalized through hole which is designed to be ring-free, and leaking an unnecessary annular copper sheet at the position which is designed to be ring-free after development;
and S5, etching the circuit board which is subjected to the step S4 to remove the unnecessary copper sheet, and then sequentially stripping and stripping the corrosion-resistant layer to obtain the circuit board without the ring metalized hole.
Preferably, the aperture of the small hole on the dry film in the step S1 is 1-2.5 mil smaller than the aperture of the non-cyclometalated through hole.
Preferably, the aperture of the small hole on the dry film in step S1 is smaller than the aperture of the non-metallized through hole by 2 mils.
Preferably, the etching stopper in step S2 is a tin layer.
Compared with the prior art, the invention has the following advantages:
the manufacturing method of the circuit board acyclic metalized hole solves the problem that the negative film process can not realize the acyclic design of the metalized through hole, and the hole copper tinning process is added in the conventional negative film process to play a role in corrosion resistance, so that the hole copper is prevented from being excessively etched and thinned or completely etched; and by optimizing the imaging negative film with the positions of the non-ring metallized holes, the product with the negative film non-ring metallized holes can be processed only by the conventional equipment, so that the manufacturing problem of the circuit board without the ring metallized holes is solved, and the cost for purchasing new equipment is saved.
Drawings
Fig. 1 is a schematic process diagram of step S1 according to the embodiment of the present invention.
Fig. 2 is a structural diagram of the step S2 according to the embodiment of the present invention.
Fig. 3 is a structural diagram of the step S3 according to the embodiment of the present invention.
Fig. 4 is a structural diagram of the step S4 according to the embodiment of the present invention.
Fig. 5 is a structural diagram of the etching in step S5 according to the embodiment of the present invention.
Fig. 6 is a structural diagram of the embodiment of the present invention for completing the film stripping in step S5.
Fig. 7 is a structural diagram of the embodiment of the invention for completing the tin stripping in step S5.
In the figure, 1, a circuit board; 10. metallizing the through-hole; 2. drying the film; 20. dry film pinholes; 3. a tin layer; 4. light blocking PAD; 5. an undesirable ring of copper skin.
Detailed Description
The technical solutions of the present invention will be described clearly and completely with reference to the accompanying drawings and embodiments, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be obtained by a person skilled in the art without any inventive step based on the embodiments of the present invention, belong to the scope of the present invention.
Example (b): as shown in fig. 1 to 7, the present embodiment provides a method for manufacturing a circuit board with a non-ring metalized hole, including the following steps:
s1, after the board surface of the circuit board 1 designed with the acyclic metallized through hole 10 is plated, a dry film 2 is covered, then the circuit board 1 covered with the dry film is developed, so that a small hole is made on the dry film corresponding to the position of the acyclic metallized through hole 10, namely, the small hole is made through the developing operation, so that the aperture of the small hole 20 on the dry film is 2mil smaller than that of the acyclic metallized through hole 10, wherein the acyclic metallized through hole designed means the circuit board which has finished the preorder manufacturing processes of laminating, pressing plate, chemical copper plating and the like;
s2, carrying out whole board electroplating on the circuit board which is finished by the step S1, and electroplating a tin layer 3 which prevents copper of the circuit part and the hole wall from being etched away on the hole wall of the designed acyclic metalized through hole and the position which does not need to be etched;
s3, removing the dry film 2 covered on the board surface of the circuit board which is subjected to the step S2;
s4, manufacturing a negative film dry film on the circuit board after the step S3 is completed, manufacturing a light-blocking PAD4 at the position of the metalized through hole designed to be acyclic, and developing to be the acyclic position to achieve the effect of copper sheet leakage, namely leaking the unnecessary annular copper sheet 5;
and S5, etching the circuit board which is subjected to the step S4 to remove the unnecessary copper sheet, namely etching and removing the unnecessary annular copper sheet 5, only leaving the copper on the inner wall of the metalized through hole and the circuit part on the board surface, and then sequentially stripping the film and the tin layer for corrosion resistance to obtain the circuit board without the ring metalized through hole.
According to the manufacturing method of the circuit board acyclic metalized hole, the hole copper tinning process is added in the conventional negative film process to play a role in corrosion resistance, so that the hole copper is prevented from being excessively etched and thinned or completely etched; by optimizing the imaging negative film of the position of the non-ring metallized hole, the product with the negative film non-ring metallized hole design can be processed only by the existing equipment, the problem is solved, the manufacturing problem that the negative film flow can not realize the non-ring metallized hole circuit board with the metallized through hole non-ring design is solved, and the cost for purchasing new equipment is saved.
The above description is only a preferred embodiment of the present invention, and it should be noted that, for those skilled in the art, various modifications and substitutions can be made without departing from the technical principle of the present invention, and these modifications and substitutions should also be regarded as the protection scope of the present invention.
Claims (4)
1. A method for manufacturing a circuit board acyclic metallization hole is characterized by comprising the following steps:
s1, covering a dry film after the circuit board with the acyclic metallized through hole is subjected to board surface electroplating, and developing the circuit board covered with the dry film to enable the dry film corresponding to the position of the acyclic metallized through hole to manufacture a small hole, wherein the aperture of the small hole in the dry film is smaller than that of the acyclic metallized through hole;
s2, carrying out whole board electroplating on the circuit board which is finished by the step S1, and electroplating a corrosion-resistant layer on the hole wall of the designed acyclic metalized through hole and the position which does not need to be etched;
s3, removing the dry film covering the board surface of the circuit board which is subjected to the step S2;
s4, manufacturing a negative film dry film on the circuit board which is subjected to the step S3, manufacturing a light blocking PAD at the position of the metalized through hole which is designed to be ring-free, and leaking an unnecessary annular copper sheet at the position which is designed to be ring-free after development;
and S5, etching the circuit board which is subjected to the step S4 to remove the unnecessary copper sheet, and then sequentially stripping and stripping the corrosion-resistant layer to obtain the circuit board without the ring metalized hole.
2. The method of claim 1, wherein the method comprises: in the step S1, the aperture of the small hole on the dry film is 1-2.5 mil smaller than that of the non-cyclometalated through hole.
3. The method of claim 2, wherein the step of forming the metal hole comprises: the aperture of the small hole on the dry film in the step S1 is 2mil smaller than that of the non-metallized through hole.
4. The method of claim 1, wherein the method comprises: the etching stopper in step S2 is a tin layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111090391.7A CN113811089A (en) | 2021-09-16 | 2021-09-16 | Method for manufacturing circuit board acyclic metallized hole |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111090391.7A CN113811089A (en) | 2021-09-16 | 2021-09-16 | Method for manufacturing circuit board acyclic metallized hole |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN113811089A true CN113811089A (en) | 2021-12-17 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202111090391.7A Withdrawn CN113811089A (en) | 2021-09-16 | 2021-09-16 | Method for manufacturing circuit board acyclic metallized hole |
Country Status (1)
| Country | Link |
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| CN (1) | CN113811089A (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109714890A (en) * | 2019-01-22 | 2019-05-03 | 广州安费诺诚信软性电路有限公司 | A method of preparing the acyclic electric hole of flexible circuit thin plate |
| CN109843000A (en) * | 2019-03-26 | 2019-06-04 | 新华三技术有限公司 | The preparation method and pcb board of pcb board |
| CN111741605A (en) * | 2020-08-17 | 2020-10-02 | 昆山沪利微电有限公司 | Method for manufacturing PCB without hole ring |
-
2021
- 2021-09-16 CN CN202111090391.7A patent/CN113811089A/en not_active Withdrawn
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109714890A (en) * | 2019-01-22 | 2019-05-03 | 广州安费诺诚信软性电路有限公司 | A method of preparing the acyclic electric hole of flexible circuit thin plate |
| CN109843000A (en) * | 2019-03-26 | 2019-06-04 | 新华三技术有限公司 | The preparation method and pcb board of pcb board |
| CN111741605A (en) * | 2020-08-17 | 2020-10-02 | 昆山沪利微电有限公司 | Method for manufacturing PCB without hole ring |
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| WW01 | Invention patent application withdrawn after publication | ||
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Application publication date: 20211217 |