CN113809509A - Antenna forming method, cover plate assembly and terminal equipment - Google Patents
Antenna forming method, cover plate assembly and terminal equipment Download PDFInfo
- Publication number
- CN113809509A CN113809509A CN202010529495.2A CN202010529495A CN113809509A CN 113809509 A CN113809509 A CN 113809509A CN 202010529495 A CN202010529495 A CN 202010529495A CN 113809509 A CN113809509 A CN 113809509A
- Authority
- CN
- China
- Prior art keywords
- cover plate
- antenna
- catalyst
- cover
- assembly
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/12—Supports; Mounting means
- H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
- H01Q1/2258—Supports; Mounting means by structural association with other equipment or articles used with computer equipment
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/02—Electroplating of selected surface areas
- C25D5/022—Electroplating of selected surface areas using masking means
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/12—Supports; Mounting means
- H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/12—Supports; Mounting means
- H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
- H01Q1/24—Supports; Mounting means by structural association with other equipment or articles with receiving set
- H01Q1/241—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM
- H01Q1/242—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM specially adapted for hand-held use
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Computer Hardware Design (AREA)
- General Engineering & Computer Science (AREA)
- Computer Networks & Wireless Communication (AREA)
- Support Of Aerials (AREA)
- Telephone Set Structure (AREA)
Abstract
An antenna molding method, a cover plate assembly and a terminal device, the antenna molding method can form an antenna on a cover plate. The antenna forming method comprises the following steps: providing a cover plate and a shading mask plate matched with the surface of the cover plate, wherein the shading mask plate is provided with a light transmission area matched with the shape of the antenna; carrying out UV selective exposure treatment on the surface of the cover plate by matching with a shading mask plate so as to form an irradiation area and a non-irradiation area on the surface of the cover plate; performing alkali liquor treatment on the surface of the cover plate; inoculating a catalyst on the surface of the cover plate; carrying out inhibition treatment on the catalyst adsorbed on the surface of the cover plate; plating a conductive metal on the surface of the cover plate to form an antenna; a protective layer is formed on the surface of the cover plate to cover the antenna. The cover plate with the antenna formed by the antenna forming method is applied to terminal equipment, and good signal transceiving effect can be achieved.
Description
Technical Field
The application relates to the technical field of terminal equipment, in particular to an antenna forming method, a cover plate assembly and terminal equipment.
Background
Along with the development of science and technology, mobile communication terminals are increasingly popularized in daily life of people, and the mobile communication terminals comprise smart phones, smart watches, tablet computers, wearable intelligent devices and the like. In order to improve the portability and operability of mobile communication terminals, these mobile communication terminals are being developed toward the diversification of functions, the reduction of weight and size, and the like without affecting the visual appearance, and are also being developed iteratively as antenna modules of the signal transceiving end of the mobile communication terminals. However, the development trend of mobile communication terminals means that the number of components of the mobile communication terminals is increased, and the space inside the mobile communication terminals is utilized as much as possible, that is, the internal space reserved for the design of the antenna module is decreased, and higher requirements are put on the design of the antenna module.
For example, after the communication technology is upgraded from 4G to 5G millimeter wave technology, an 8 × 8MIMO (multiple-input and multiple-output) antenna design scheme is generally adopted, and the number of antennas is increased to 64. Fig. 1a to 1c illustrate several possible embodiments of a 5G antenna arrangement scheme in a mobile communication terminal, where the antenna module 101 in fig. 1a is equivalently disposed outside the front cover 102 or the back cover 103, the antenna module 101 in fig. 1b is equivalently disposed inside the front cover 102 or the back cover 103, specifically between the front cover 102 and the OCA (optical cement) 104 or the back cover 103 and the OCA104, and the antenna module 101 in fig. 1c is equivalently disposed on the touch sensor 105 (specifically between the OCA104 and the touch sensor 105), and of course, other structures in fig. 1a to 1c further include a display unit 106, a protective coating 107 for protecting the antenna module 101, and other common structures of the mobile communication terminal. As a general knowledge, energy loss exists when the transmission and reception signals of the antenna module 101 penetrate through the dielectric layer, so that the position of the antenna module 101 in the mobile communication terminal has a large influence on the transmission and reception efficiency of the signals; with reference to the implementation of the antenna module 101 in fig. 1a to 1c, the priority order of the efficiency of the antenna module 101 for transmitting and receiving signals is as follows: antenna module 101 in fig. 1a > antenna module 101 in fig. 1b > antenna module 101 in fig. 1c, it can be seen that relatively good transceiving efficiency can be achieved when antenna module 101 is disposed on front cover 102 or rear cover 103.
A conventional antenna forming process may adopt a photolithography process, and as illustrated in fig. 2a to 2g, a metal conductive film 202 is formed on a substrate 201 as illustrated in fig. 2a, a photoresist 203 is coated on the metal conductive film 202 and dried as illustrated in fig. 2b, then a structure is exposed in cooperation with a mask 204 as illustrated in fig. 2c, the structure is developed as illustrated in fig. 2d, etched as illustrated in fig. 2e, the photoresist 203 is removed as illustrated in fig. 2f, and finally a protective coating 107 is coated as illustrated in fig. 2g, and a structure obtained finally is transferred and printed on a transparent film (not illustrated here) to form an MIMO antenna on a touch panel, which is complicated in process flow and high in cost, and the antenna module can only be disposed in the substrate 201, resulting in an unsatisfactory transceiving effect of the antenna module; in another antenna forming process, namely a nanoimprint technology, the process flow can be shown in fig. 3a to 3f, firstly, as shown in fig. 3a, a UV curing coating 302 is coated on a resin film 301, as shown in fig. 3b to 3d, a nano convex structure male die 303 corresponding to the antenna design is adopted to form a microstructure on the UV curing coating 302, the microstructure is provided with a groove 304, then, as shown in fig. 3e, a conductive layer 305 is injected into the groove 304 of the microstructure, and finally, as shown in fig. 3f, a protective coating 107 is coated to obtain an antenna module formed on the resin film 301.
Therefore, the traditional antenna structure design can not meet the design requirements of the development of the current mobile communication equipment on the antenna module.
Disclosure of Invention
The application provides an antenna forming method, a cover plate assembly and a terminal device, which can directly form an antenna on a cover plate of the terminal device and meet the efficiency requirement of the terminal device on receiving and transmitting signals of the antenna.
In a first aspect, the present application provides an antenna molding method, which can mold an antenna onto a cover plate for a terminal device; specifically, the antenna forming method comprises the following steps:
providing a cover plate and a shading mask plate matched with the surface of the cover plate, wherein the shading mask plate is provided with a light transmission area matched with the shape of the antenna; here, the surface of the cover plate may be an outer surface of the cover plate or an inner surface of the cover plate.
Carrying out UV selective exposure treatment on the surface of the cover plate by matching with the shading mask plate so as to form an irradiation area and a non-irradiation area on the surface of the cover plate;
performing alkali liquor treatment on the surface of the cover plate;
inoculating a catalyst on the surface of the cover plate;
carrying out inhibition treatment on the catalyst adsorbed on the surface of the cover plate;
plating a conductive metal on the surface of the cover plate to form the antenna;
and forming a protective layer covering the antenna on the surface of the cover plate.
In the implementation of the method, the light-shielding mask plate enables UV exposure to only act on the surface of the cover plate corresponding to the light transmission area of the light-shielding mask plate, and a large number of hydroxyl groups or carboxyl groups can appear on the surface of the irradiation area of the cover plate irradiated by UV; in order to better adsorb the catalyst on the surface of the cover plate, hydroxyl groups or carboxyl groups on the surface of the cover plate are ionized through alkali liquor treatment; after the catalyst is adsorbed on the surface of the cover plate, conductive metal is plated on the cover plate; when the catalyst is inoculated, a small amount of catalyst is adsorbed on the non-irradiation area of the cover plate, but the metal conductive circuit of the antenna needs to be formed only on the irradiation area, in order to prevent the non-irradiation area from being plated with the conductive metal, the catalyst adsorbed on the surface of the cover plate is subjected to inhibition treatment, the activity of the small amount of catalyst adsorbed on the non-irradiation area can be inhibited, the large amount of catalyst in the irradiation area is not affected by inhibition (namely, the inhibition treatment does not seriously weaken the catalytic performance of the catalyst in the irradiation area), the catalyst existing in the irradiation area can form a catalyst layer, after the conductive metal is plated, the metal conductive circuit capable of realizing the antenna function can be formed on the catalyst layer, the pattern formed by the metal conductive circuit is equivalent to the antenna, and the protective layer can play a role in protecting the metal conductive circuit (namely, the antenna). It can be seen that the antenna (the pattern formed by the metal conductive circuit is equivalent to the antenna) can be directly arranged on the surface of the cover plate by the method, the medium passing through during antenna signal transmission is less, a good signal transceiving effect can be obtained, and the transmission requirement of 5G signal millimeter waves of the current terminal equipment can be met.
In the above method, weakly acidic hydroxyl groups or carboxyl groups are formed on the surface of the cover plate subjected to UV irradiation, and are not easily ionized to adsorb the catalyst, so in the alkali treatment, a potassium hydroxide (KOH) solution or a sodium hydroxide (NaOH) solution may be used, and the strong basicity of the KOH solution contributes to the ionization of the above hydroxyl groups and carboxyl groups; the protective layer can be one or a combination of a plurality of polyurethane, acrylic, epoxy and organic silicon resin, and the protective layer needs to cover the antenna, so that the antenna is not exposed.
In a possible implementation manner, before the UV selective exposure treatment is performed on the surface of the cover plate by matching with the light-shielding mask plate, the method further includes the following steps:
the organic polymer layer is formed on the surface of the cover plate, so that the adhesion force between the surface of the cover plate and the antenna can be improved; the material of the organic polymer layer is determined by the material of the cover plate, and specifically may be one or a combination of more of polyurethanes, acrylics, epoxies and silicones; the organic polymer layer herein is transparent and has a visible light transmittance of not less than 80%.
The cover plate is made of transparent materials in specific implementation, and can be made of plastics, optical flexible films or glass; in the case where the cover plate is made of glass, the step of forming the organic polymer layer is not omitted.
In a possible implementation manner, after the alkali treatment is performed on the surface of the cover plate and before the catalyst is inoculated on the surface of the cover plate, the method further comprises the following steps:
treating the surface of the cover plate by adopting a cationic polymer solution; the implementation of this step can enhance the adsorption effect of the catalyst.
In the method, the catalyst may be a palladium (Pd) catalyst, a tin (Sn) catalyst, a platinum (Pt) catalyst, or a mixture of these catalysts, such as a mixture of a palladium catalyst and a tin catalyst; the kind of the cationic polymer in the cationic polymer solution and the kind of the inhibitor used for the inhibition treatment of the catalyst need to correspond to the kind of the catalyst; in the case of palladium catalysts, the corresponding cationic polymers can be polyquaterniums or polyacrylamides, and the inhibitors can be thiourea-based compounds.
In a second aspect, the present application also provides a cover assembly, which can be applied to a terminal device such as a mobile phone or a tablet computer. The cover plate assembly comprises a cover plate and an antenna, wherein the antenna is formed on the surface of the cover plate by the antenna forming method provided by the technical scheme, and a catalyst layer is formed on the surface of the cover plate, which is used for being connected with the antenna; the antenna in the cover plate assembly has less medium passing through and less loss during signal receiving and transmitting, and can obtain good signal receiving and transmitting effects. In order to ensure the transparency of the cover plate assembly such that the visible light transmittance of the entire cover plate assembly is not less than 80%, the line width of the metal conductive line of the antenna may be defined to be not more than 10 μm, and the height thereof is not more than 10 μm; the line width and height may preferably be 0.1 to 5 μm in consideration of the visual identifiability and conductivity of the metal conductive line. Meanwhile, in the area surrounded by the metal circuit at the outermost periphery of the metal conductive circuit of the antenna, the area percentage of the metal conductive circuit is between 5% and 20%.
In one possible implementation manner, in order to improve the adhesion between the surface of the cover plate and the antenna, an organic polymer layer may be formed on the surface of the cover plate facing the catalyst layer; the cover plate may be a transparent plastic, an optically flexible film or glass, and when the cover plate is glass, the organic polymer layer must be present. The structure of the cover plate is not limited, the surface of the cover plate can be a curved surface, a curved surface or a three-dimensional structure, the formation of the antenna is not influenced, and the cover plate has wide applicability.
In a third aspect, the present application further provides a terminal device, where the terminal device may be a mobile phone, a tablet computer, a smart watch, or the like; the terminal device specifically comprises a terminal body, a main board is arranged in the terminal body, and the cover plate assembly is arranged outside the terminal body to play a role in protecting the shell; the surface of the cover plate in the cover plate component is provided with an antenna, and the antenna and the main board can be connected through coupling or feeder lines, namely, the antenna can realize signal interaction between the main board and an external antenna device; because the antenna is arranged on the surface of the cover plate, no matter the inner surface or the outer surface of the cover plate, the space in the terminal equipment can be saved, the loss generated when the communication signal passes through the medium is small, and the antenna has a good signal receiving and transmitting effect.
Drawings
Fig. 1a to 1c are schematic views illustrating an antenna arrangement scheme of a conventional mobile communication terminal;
fig. 2a to 2g illustrate a conventional antenna forming method;
fig. 3a to 3f illustrate another conventional antenna forming method;
fig. 4a to 4c are schematic structural diagrams of a cover plate assembly according to an embodiment of the present disclosure;
FIG. 4d is a schematic structural diagram of a cover plate of the cover plate assembly according to an embodiment of the present disclosure;
FIG. 4e is a schematic structural diagram of another cover plate in the cover plate assembly according to the embodiment of the present disclosure;
FIGS. 4f and 4g are schematic structural views of another cover plate assembly provided in the embodiments of the present application;
FIG. 4h is a schematic structural diagram of another cover plate in the cover plate assembly according to an embodiment of the present disclosure;
FIGS. 4i and 4j are schematic structural diagrams of another cover plate assembly according to an embodiment of the present disclosure;
fig. 5 is a schematic flowchart of an antenna forming method according to an embodiment of the present application;
fig. 6a to 6i are schematic views illustrating structural changes of a cover plate assembly in a manufacturing process according to an embodiment of the present disclosure;
fig. 7 is a schematic flowchart of another antenna forming method according to an embodiment of the present application;
FIG. 8 is a schematic structural diagram of a cover plate assembly according to an embodiment of the present disclosure;
fig. 9 is a schematic flowchart of another antenna forming method according to an embodiment of the present application;
fig. 10 is a schematic flowchart of another antenna forming method according to an embodiment of the present application;
fig. 11 is a schematic diagram illustrating an antenna forming method implemented on a flexible optical film according to an embodiment of the present disclosure;
fig. 12 is a schematic structural diagram of a terminal device according to an embodiment of the present application.
Reference numerals:
101-an antenna module; 102-a front cover; 103-rear cover; 104-OCA; 105-a touch sensor; 106-a display unit; 107-protective coating; 201-a substrate; 202-a metal conductive film; 203-photoresist; 204-mask plate; 301-a resin film; 302-UV coating; 303-a nano convex structure male die; 304-a groove; 305-a conductive layer; 100-mobile phone; 11-rear cover; 12-a main board; 10-a cover plate assembly; 1-cover plate; 2-shading mask plate; 3-a catalyst layer; 4-an antenna; 5-a protective layer; 6-organic polymer layer.
Detailed Description
First, an application scenario of the present application is introduced: with the development of communication technology, the available space inside the terminal equipment is smaller and smaller, and better signal transceiving efficiency can be obtained by forming the antenna on the cover plate. However, the conventional antenna forming process cannot meet the requirement for arranging the antenna on the cover plate, and the formed antenna cannot meet the ideal signal transceiving effect.
Based on this, the present invention provides an antenna forming method and a cover assembly 10, the antenna forming method is used to form an antenna 4 on a surface of a cover 1, and finally obtain the cover 1 with the antenna 4 as shown in fig. 4a, 4b or 4c, the structure of the cover 1 in fig. 4a, 4b or 4c can be as shown in fig. 4d, the cover 1 has two opposite surfaces, the antenna 4 can be formed on an outer surface 1a (for example, shown in fig. 4 a) of the cover 1, can be formed on an inner surface 1b (for example, shown in fig. 4 b) of the cover 1, and can also be formed with the antenna 4 on both surfaces (for example, shown in fig. 4 c). As shown in fig. 4a, 4b, or 4c, a catalyst layer 3 is further formed on the surface of the cover plate 1 on which the antenna 4 is formed, the antenna 4 is formed on the catalyst layer 3, and a protective layer 5 covering the antenna 4 is further formed on the surface of the antenna 4.
It will be appreciated that the surface of the cover plate 1 in fig. 4a, 4b or 4c is planar; if the cover 1 has a structure as shown in fig. 4e, and the outer surface 1a and the inner surface 1b are both curved surfaces, the structure of the cover assembly 10 obtained by forming the antenna 4 on the cover 1 can be shown in fig. 4f or fig. 4g (the structure in which the antenna 4 is formed on both surfaces of the cover 1 is not shown here); if the cover 1 has a three-dimensional structure as shown in fig. 4h, and both the outer surface 1a and the inner surface 1b are three-dimensional structures, the structure of the cover assembly 10 obtained by forming the antenna 4 on the cover 1 can be as shown in fig. 4i and 4j (the structure in which the antenna 4 is formed on both surfaces of the cover 1 is not shown here either). Therefore, the antenna forming method provided by the embodiment of the application does not limit the structure of the cover plate 1, and has strong adaptability. It will be appreciated that the structures shown in fig. 4a, 4b, 4c, 4f, 4g, 4i and 4j, i.e. the cover plate assembly 10 provided in this embodiment, are several embodiments; in the above illustration, the protective layer 5 is formed on the surface of the antenna 4 to cover the antenna 4. It is understood that the structure of the catalyst layer 3 is omitted in fig. 4a, 4b, 4c, 4f, 4g, 4i, and 4j for clarity of illustration.
The present application will be described in further detail with reference to the accompanying drawings, and in the following description of embodiments, the cover plate 1 shown in fig. 4b will be taken as an example. In addition, the antenna forming method provided in the embodiment of the present application corresponds to the structure of the cover assembly 10, and therefore, for the sake of clarity and brevity of the solution, the structure of the cover assembly 10 will be described in correspondence with the embodiment of the antenna forming method.
Referring to fig. 5, a flow diagram of an antenna forming method and structural changes of the cover plate assembly 10 corresponding to the method shown in fig. 6a to 6e are shown. The antenna forming method comprises the following steps:
s1: providing a cover plate 1 and a shading mask plate 2 matched with the surface of the cover plate 1, wherein the shading mask plate 2 is provided with a light transmission area A matched with the shape of an antenna; referring to fig. 6b, an exemplary structure of a light-shielding mask 2 is shown, in which the shape of the light-transmitting region a matches the shape of the antenna 4 to be formed, and the cover plate 1 is made of a transparent material, such as plastic, an optically flexible film, or glass. It should be noted that the following embodiments will exemplarily describe the structure of the shadow mask 2 illustrated in fig. 6 b.
S2: matching with the shading mask 2 to carry out UV selective exposure treatment on the surface of the cover plate 1; as shown in fig. 6c, the light-shielding mask 2 is placed on the surface of the cover plate 1 so that the light-shielding mask 2 can correspond to and contact with the cover plate 1, a DUV-type ultraviolet lamp with high radiation efficiency is used for irradiating from the side of the light-shielding mask 2 away from the cover plate 1, the light-transmitting region a on the light-shielding mask 2 can allow the irradiation light to pass through and irradiate the surface of the cover plate 1, while the solid part of the light-shielding mask 2 can block the irradiation light from passing through, and finally, the surface of the cover plate 1 forms an irradiation region B1 (inner part of the dotted line frame) and a non-irradiation region B2 as shown in fig. 6 d; in fig. 6d, the shape of the irradiation region B1 matches the shape of the light transmission region a on the mask 2. The DUV-type ultraviolet lamp can emit light with the wavelength of about 230-320nm, and particularly can be an Hg (mercury) -Xe (xenon) ultrahigh-pressure ultraviolet lamp.
In this step, the surface of the cover plate 1 (i.e. the irradiation region B1 shown in fig. 6 d) treated by UV irradiation changes the surface chemical structure of the cover plate 1, so that a large number of weakly acidic hydroxyl groups or carboxyl groups appear on the surface of the irradiation region B1, and such a surface of the cover plate 1 is beneficial for the subsequent steps.
S2: performing alkali liquor treatment on the surface of the cover plate 1; base hereinThe liquid treatment refers to treating the surface of the cover plate 1 by using an alkaline solution, so that the alkaline solution promotes the ionization of hydroxyl groups and carboxyl groups on the surface of the cover plate 1; specifically to this step, OH may be used-The surface of the cover plate 1 is treated by a sodium hydroxide solution with the concentration of 1.0-2.0 mol/L, and the strong basicity of the sodium hydroxide solution is helpful for ionizing the hydroxyl groups and the carboxyl groups; here, the sodium hydroxide solution may be replaced by potassium hydroxide solution, and OH-The concentration of (B) may be further defined as 1.2 to 1.5 mol/L.
S3: inoculating a catalyst C on the surface of the cover plate 1; the seeding of the catalyst C here means that the catalyst C that facilitates the plating on the late metal is attached to the surface of the cover plate 1; specifically to this step, as shown in fig. 6e, the cover plate 1 is immersed in the aqueous solution of the catalyst C, so that the catalyst C is adsorbed to the surface of the cover plate 1 to obtain the structure shown in fig. 6 f. In fig. 6f, the irradiation region B1 on the surface of the cover plate 1 has a large number of hydroxyl groups or carboxyl groups, so that a large number of catalysts C are adsorbed on the irradiation region B1, and the surface of the catalyst C adsorbed on the irradiation region B1 is favorable for the formation of the subsequent antenna 4. It should be noted that a small amount of the catalyst C is adsorbed in the non-irradiation region B2, and of course, the catalyst C adsorbed in the non-irradiation region B2 is not favorable for the precise formation of the antenna 4 in the irradiation region B1.
The catalyst C can be a palladium catalyst, and specifically can be a palladium (II) complex, such as a palladium-arginine complex; the catalyst C can also be selected from tin catalyst, platinum catalyst and the like, and can also be selected from a mixture of the catalysts, such as a mixture of palladium catalyst and tin catalyst, which can be reasonably selected according to specific process flow and product requirements.
S4: the catalyst C adsorbed on the surface of the cover plate 1 is subjected to inhibition treatment; the inhibition treatment herein means that the activity of the catalyst C is inhibited by an inhibitor, and of course, the type of the inhibitor needs to be matched with that of the catalyst C; this step is performed because, when the antenna 4 is formed, the antenna 4 is formed only in the irradiated region B1, and since the non-irradiated region B2 after the alkali treatment may also form a small amount of hydroxyl groups or carboxyl groups on the surface, i.e., the non-irradiated region B2 may also adsorb a small amount of catalyst C (refer to fig. 6f), it is obvious that the catalyst C existing in the non-irradiated region B2 is advantageous for the metal plating, which is certainly not advantageous for the structure formation of the antenna 4. Therefore, in order to prevent the non-irradiation region B2 on the surface of the cover plate 1 from being plated, the catalyst 3 on the surface of the cover plate 1 is subjected to a suppression treatment by using a suppressor, and the amount of the catalyst C adsorbed in the irradiation region B1 is large, so that the catalyst C has a certain activity even after the suppression treatment, and the metal plating is not affected; on the other hand, the catalyst C adsorbed in the non-irradiated region B2 was very small, and the activity of the catalyst C was substantially suppressed by the inhibitor treatment, and finally, a structure in which the catalyst C was present only in the irradiated region B1 as shown in fig. 6g was obtained, in which the catalyst C formed the catalyst layer 3 on the surface of the cover plate 1. Of course, the kind of inhibitor here needs to match the kind of catalyst C described above, and the inhibitor may be a compound having a thiourea group, taking the example that the catalyst C is a palladium (II) complex.
S5: as shown in fig. 6h, a conductive metal with a thickness in the range of 0.1-10 um is plated on the surface of the cover plate 1, and due to the existence of the catalyst 3, the conductive metal is formed on the part of the cover plate 1 having the catalyst 3, so that the conductive metal has a regular shape to form the antenna 4; in this step, the conductive metal may be any one of copper, silver, aluminum, tin or an alloy thereof, and these metals have good conductivity. Taking metal copper as an example, the step may be specifically to directly perform electroless copper plating on the surface of the cover plate 1 to form a metal conducting wire circuit capable of realizing the antenna function, the pattern formed by the metal conducting wire circuit forms the antenna 4, and in order to improve the conductivity, the electroless copper plating may be performed after certain electroless copper plating is performed.
It should be noted that, for the antenna 4 formed on the cover plate 1, in order to ensure the transparency of the whole cover plate assembly 10 (i.e. the visible light transmittance of the cover plate assembly 10 is not less than 80%), the line width of the metal conductive circuit of the antenna 4 may be defined to be not more than 10 μm. The line width and height may preferably be 0.1 to 5 μm in consideration of the visual identifiability and conductivity of the metal conductive line. Meanwhile, in the region surrounded by the metal line at the outermost periphery of the metal conductive line of the antenna 4, the area percentage of the metal conductive line is between 5% and 20%.
S6: forming a protective layer 5 covering the antenna 4 on the surface of the cover plate 1 to obtain the structure shown in fig. 6 i; in this step, a protective coating may be coated on the side of the cover plate 1 where the antenna 4 is disposed and cured to form a protective layer 5, where the protective coating may be one or a combination of more of polyurethanes, acrylics, epoxies, and silicone resins, and the antenna 4 needs to be covered when coating, subject to the fact that the antenna 4 is not exposed; the curing method may be thermal curing or UV curing, but a combination of the two methods may also be used.
To this end, the antenna 4 is formed on the cover plate 1 by using the antenna forming method provided by this embodiment, in a specific application, the cover plate 1 is generally directly applied to a housing portion of a terminal device, and the medium through which the antenna 4 formed on the cover plate 1 passes during signal transmission is few, so that a good signal transceiving effect can be obtained, and the millimeter wave transmission requirement of the current 5G signal can be met; moreover, the antenna 4 is directly formed on the cover plate 1, so that the space in the terminal equipment is not occupied, and the development trend of miniaturization of the terminal equipment is met; of course, the method is simple in process, strong in feasibility and beneficial to popularization and implementation.
On the basis of the antenna forming method shown in fig. 5, an embodiment of the present invention further provides an antenna forming method, please refer to the flowchart of the method shown in fig. 7, which is different from the method flowchart shown in fig. 5 in that before the UV selective exposure treatment is performed on the surface of the cover plate 1 by matching with the light-shielding mask 2, the method may further include the following steps:
s13': forming an organic polymer layer 6 on the surface of the cap plate 1; in this step, an organic polymer coating may be applied on the surface of the cover plate 1 to form an organic polymer layer 6, and the material of the organic polymer layer 6 is determined by the material of the cover plate 1, and may be one or a combination of more of polyurethanes, acrylics, epoxies, and silicones; the organic polymer layer 6 here is transparent and has a visible light transmittance of not less than 80%.
The structure of the cover plate 1 having the antenna 4 obtained by the antenna forming method shown in fig. 7 can be as shown in fig. 8 (the catalyst layer 3 is omitted here), and the organic polymer layer 6 here can enhance the adhesion between the cover plate 1 and the antenna 4. Of course, the structure shown in fig. 8 here corresponds to the structure of the cover plate assembly 10 corresponding to the method shown in fig. 7.
When the cover plate 1 is made of glass, the step S13' is not omitted here.
Referring to fig. 9, a schematic flow chart of the method is different from the method flow chart shown in fig. 5 in that after the surface of the cover plate 1 is treated with alkali solution and before the surface of the cover plate 1 is inoculated with the catalyst C, the method may further include the following steps:
s14': the surface of the cover plate 1 is treated by adopting a cationic polymer solution, and the embodiment of the step can enhance the adsorption effect of the subsequent catalyst C; of course, the kind of the cationic polymer solution is also matched with the kind of the catalyst C, and in the case of the palladium catalyst C, the corresponding cationic polymer can be a polyquaternium or a polyacrylamide.
It is understood that the structure of the cover plate 1 with the antenna 4 obtained by the antenna forming method (corresponding to the structure of the cover plate assembly 10 corresponding to the method shown in fig. 9) is similar to the structure shown in fig. 4a, and therefore is not shown in the figure here.
In conjunction with the flows of the two antenna forming methods shown in fig. 7 and 9, an antenna forming method as shown in fig. 10 can be obtained, which is equivalent to adding the step of forming the organic polymer layer 6 and the step of treating the surface of the cover plate 1 with the cationic polymer solution to the structure of the antenna forming method shown in fig. 5, and the structure of the cover plate 1 with the antenna 4 (which is equivalent to the structure of the cover plate assembly 10 corresponding to the method shown in fig. 10) obtained by the method is similar to the structure shown in fig. 8 and is not shown in the figure again; in addition, since the steps shown in fig. 10 have already been described in detail above, they are not described again here.
On the basis of the antenna forming method shown in fig. 5, the present embodiment also provides another antenna forming method, which is applied to form an antenna 4 on a flexible optical film (corresponding to a cover plate 1); the difference from the method flow shown in fig. 5 is that, since the cover plate 1 is a flexible optical film, as shown in fig. 11, the cover plate 1 can be arranged on a roll-to-roll processing device, in the process of moving any part of the cover plate 1 from the M position to the N position shown in fig. 11, the antenna 4 is formed on the cover plate 1 by the method shown in fig. 5, and finally, the cover plate 1 with the antenna 4 is cut according to different product specification requirements, and finally, the cover plate assembly 10 with the target size is obtained.
Based on the structure of any cover assembly 10 provided in the above embodiments, the present embodiment also provides a terminal device, which can be exemplified by a mobile phone 100 shown in fig. 12, wherein the rear cover 11 of the mobile phone 100 is equivalent to the cover 1 of the cover assembly 10, the antenna 4 is disposed on the inner surface of the rear cover 11, the main board 12 is disposed in the mobile phone 100, and the antenna 4 and the main board 12 are both disposed in the mobile phone 100, and are shown by dotted lines in fig. 12.
Referring to fig. 12, the main board 12 and the antenna 4 may be connected by a coupling or a feeder line, and the antenna 4 is equivalent to a signal transceiver of the main board 12, so as to realize signal interaction between the main board 12 and an external antenna device. Because the antenna 4 is disposed on the inner surface of the rear cover 11 (or on the outer surface of the rear cover 11, of course), the space in the mobile phone 100 can be saved, and the loss generated when the communication signal passes through the medium is small, thereby having a good signal transceiving effect.
It will be apparent to those skilled in the art that various changes and modifications may be made in the embodiments of the present application without departing from the scope of the embodiments of the present application. Thus, if such modifications and variations of the embodiments of the present application fall within the scope of the claims of the present application and their equivalents, the present application is also intended to encompass such modifications and variations.
Claims (15)
1. An antenna forming method for forming an antenna on a surface of a cover plate, comprising the steps of:
providing a cover plate and a shading mask plate matched with the surface of the cover plate, wherein the shading mask plate is provided with a light transmission area matched with the shape of the antenna;
carrying out UV selective exposure treatment on the surface of the cover plate by matching with the shading mask plate so as to form an irradiation area and a non-irradiation area on the surface of the cover plate;
performing alkali liquor treatment on the surface of the cover plate;
inoculating a catalyst on the surface of the cover plate;
carrying out inhibition treatment on the catalyst adsorbed on the surface of the cover plate;
plating a conductive metal on the surface of the cover plate to form the antenna;
and forming a protective layer covering the antenna on the surface of the cover plate.
2. The method of claim 1, wherein prior to said UV selective exposure treatment of said cover plate surface in conjunction with said shadow mask, said method further comprises the steps of:
forming an organic polymer layer on the surface of the cover plate;
the material of the organic polymer layer is determined by the material of the cover plate, and the visible light transmittance of the organic polymer layer is not lower than 80%.
3. The method of claim 2, wherein the organic polymer layer is one or a combination of polyurethanes, acrylics, epoxies, and silicones.
4. The method of any one of claims 1-3, further comprising, after the subjecting the mat surface to the lye treatment and before the mat surface is seeded with the catalyst, the steps of:
and treating the surface of the cover plate by using a cationic polymer solution.
5. The method of claim 4, wherein the catalyst is a palladium catalyst, the cationic polymer in the cationic polymer solution is a polyquaternium or a polyacrylamide, and the inhibitor in the inhibition treatment of the non-irradiated area of the cover plate surface is a thiourea inhibitor.
6. The method of any one of claims 1-5, wherein the protective layer is one or a combination of polyurethanes, acrylics, epoxies, and silicones.
7. A cover plate assembly applied to a terminal device, comprising: a cover plate and an antenna, the antenna being formed on a surface of the cover plate by the antenna molding method according to any one of claims 1 to 6, the cover plate being formed with a catalyst layer on a surface for bonding the antenna.
8. The cap assembly of claim 7, wherein a surface of the cap plate facing the catalyst layer is further formed with an organic polymer layer.
9. The cap plate assembly of claim 8, wherein the organic polymer layer has a visible light transmittance of not less than 80%.
10. The cover assembly of any one of claims 7-9, wherein the cover is a plastic, optically flexible film, or glass of transparent material.
11. The cover assembly of any one of claims 7-10, wherein the surface of the cover is planar, curved, or textured.
12. The cover assembly of any one of claims 7-11, wherein the width of the metallic conductive trace of the antenna is no greater than 10 μ ι η.
13. The cover assembly of any one of claims 7-12, wherein the antenna has a metallic conductive trace height of no greater than 10 μ ι η.
14. The cover assembly of any one of claims 7-13, wherein the metallic conductive trace of the antenna has an area percentage of 5% to 20% in an area surrounded by the metallic conductive trace of the outermost periphery of the antenna.
15. A terminal device, characterized in that a main board is arranged in the device body, and the cover plate assembly as claimed in any one of claims 7 to 14 is arranged outside the device body;
and the antenna in the cover plate assembly is connected with the mainboard in a coupling mode or a feeder line mode.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010529495.2A CN113809509B (en) | 2020-06-11 | 2020-06-11 | Antenna forming method, cover plate assembly and terminal equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010529495.2A CN113809509B (en) | 2020-06-11 | 2020-06-11 | Antenna forming method, cover plate assembly and terminal equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN113809509A true CN113809509A (en) | 2021-12-17 |
| CN113809509B CN113809509B (en) | 2023-07-18 |
Family
ID=78943953
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010529495.2A Active CN113809509B (en) | 2020-06-11 | 2020-06-11 | Antenna forming method, cover plate assembly and terminal equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN113809509B (en) |
Citations (24)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4668532A (en) * | 1984-09-04 | 1987-05-26 | Kollmorgen Technologies Corporation | System for selective metallization of electronic interconnection boards |
| CN1263896A (en) * | 1999-02-19 | 2000-08-23 | 东进化成工业株式会社 | Resin for chemical reinforced slushing compound |
| JP2005062499A (en) * | 2003-08-13 | 2005-03-10 | Fuji Xerox Co Ltd | Method for forming electrodeposition film and electrodeposition film forming apparatus |
| WO2006068175A1 (en) * | 2004-12-24 | 2006-06-29 | Hitachi Chemical Co., Ltd. | Method for manufacturing base material provided with conductor layer pattern, base material provided with conductor layer pattern and electromagnetic wave blocking member using such base material |
| CN101120621A (en) * | 2005-02-08 | 2008-02-06 | 富士胶片株式会社 | Method of forming metallic pattern, metallic pattern and printed wiring board using it and tft wiring circuit |
| CN101304076A (en) * | 2008-06-23 | 2008-11-12 | 中国科学院长春应用化学研究所 | Method for processing cathode insulated column of organic luminous display device |
| US20090022885A1 (en) * | 2005-02-08 | 2009-01-22 | Fujifilm Corporation | Metallic pattern forming method, metallic pattern obtained thereby, printed wiring board using the same, and tft wiring board using the same |
| JP2009161857A (en) * | 2007-12-14 | 2009-07-23 | Fujifilm Corp | Photosensitive resin composition for plating and method for producing substrate with metal layer using the same |
| TW201205953A (en) * | 2010-07-27 | 2012-02-01 | Wistron Neweb Corp | Method for forming antenna structure |
| CN102369481A (en) * | 2009-04-14 | 2012-03-07 | 住友电木株式会社 | Photosensitive resin composition, adhesive film, and light receiving device |
| CN103866300A (en) * | 2014-03-06 | 2014-06-18 | 东莞劲胜精密组件股份有限公司 | Nonmetal substrate metallization method |
| CN103998650A (en) * | 2012-02-06 | 2014-08-20 | 富士胶片株式会社 | Laminate, method for producing same and base layer forming composition |
| CN104637877A (en) * | 2013-11-13 | 2015-05-20 | 株式会社东芝 | Method of manufacturing semiconductor chip, semiconductor chip, and semiconductor device |
| JP2016180868A (en) * | 2015-03-24 | 2016-10-13 | 富士フイルム株式会社 | Exposure fixture and exposure method |
| TW201639175A (en) * | 2015-01-26 | 2016-11-01 | 半導體能源研究所股份有限公司 | Semiconductor device and manufacturing method thereof |
| CN106785389A (en) * | 2016-12-09 | 2017-05-31 | 蓝思科技（长沙）有限公司 | The method and the glass back cover with antenna of antenna are made in glass back cover |
| CN107429400A (en) * | 2015-03-31 | 2017-12-01 | 富士胶片株式会社 | Plated coating formation is plated the film of coating precursor layer with composition, band, the film, conductive film, contact panel of coating is plated with pattern-like |
| CN207380418U (en) * | 2017-09-13 | 2018-05-18 | 合肥鑫晟光电科技有限公司 | A kind of mask plate |
| CN108303860A (en) * | 2018-03-26 | 2018-07-20 | 西安电子科技大学 | A kind of distributed exposure method for maskless lithography scanning |
| CN108605413A (en) * | 2016-01-20 | 2018-09-28 | 利玛塔有限公司 | For directly the direct exposure device of paint only to be welded in exposure in two-dimensional, short annealing environment |
| CN108778710A (en) * | 2016-03-11 | 2018-11-09 | 富士胶片株式会社 | Band by the film of coating precursor layer, with pattern-like by the film, conductive membrane and touch panel of coating |
| CN108884568A (en) * | 2016-03-31 | 2018-11-23 | 富士胶片株式会社 | Manufacturing method, laminated body and the conductive laminate of conductive laminate |
| CN109603860A (en) * | 2019-01-02 | 2019-04-12 | 吉林师范大学 | A kind of preparation method of the ZnO/ZnS/ZnSe composite Nano with photocatalyst film |
| CN109755179A (en) * | 2017-11-03 | 2019-05-14 | 台湾积体电路制造股份有限公司 | The forming method of semiconductor structure |
-
2020
- 2020-06-11 CN CN202010529495.2A patent/CN113809509B/en active Active
Patent Citations (24)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4668532A (en) * | 1984-09-04 | 1987-05-26 | Kollmorgen Technologies Corporation | System for selective metallization of electronic interconnection boards |
| CN1263896A (en) * | 1999-02-19 | 2000-08-23 | 东进化成工业株式会社 | Resin for chemical reinforced slushing compound |
| JP2005062499A (en) * | 2003-08-13 | 2005-03-10 | Fuji Xerox Co Ltd | Method for forming electrodeposition film and electrodeposition film forming apparatus |
| WO2006068175A1 (en) * | 2004-12-24 | 2006-06-29 | Hitachi Chemical Co., Ltd. | Method for manufacturing base material provided with conductor layer pattern, base material provided with conductor layer pattern and electromagnetic wave blocking member using such base material |
| CN101120621A (en) * | 2005-02-08 | 2008-02-06 | 富士胶片株式会社 | Method of forming metallic pattern, metallic pattern and printed wiring board using it and tft wiring circuit |
| US20090022885A1 (en) * | 2005-02-08 | 2009-01-22 | Fujifilm Corporation | Metallic pattern forming method, metallic pattern obtained thereby, printed wiring board using the same, and tft wiring board using the same |
| JP2009161857A (en) * | 2007-12-14 | 2009-07-23 | Fujifilm Corp | Photosensitive resin composition for plating and method for producing substrate with metal layer using the same |
| CN101304076A (en) * | 2008-06-23 | 2008-11-12 | 中国科学院长春应用化学研究所 | Method for processing cathode insulated column of organic luminous display device |
| CN102369481A (en) * | 2009-04-14 | 2012-03-07 | 住友电木株式会社 | Photosensitive resin composition, adhesive film, and light receiving device |
| TW201205953A (en) * | 2010-07-27 | 2012-02-01 | Wistron Neweb Corp | Method for forming antenna structure |
| CN103998650A (en) * | 2012-02-06 | 2014-08-20 | 富士胶片株式会社 | Laminate, method for producing same and base layer forming composition |
| CN104637877A (en) * | 2013-11-13 | 2015-05-20 | 株式会社东芝 | Method of manufacturing semiconductor chip, semiconductor chip, and semiconductor device |
| CN103866300A (en) * | 2014-03-06 | 2014-06-18 | 东莞劲胜精密组件股份有限公司 | Nonmetal substrate metallization method |
| TW201639175A (en) * | 2015-01-26 | 2016-11-01 | 半導體能源研究所股份有限公司 | Semiconductor device and manufacturing method thereof |
| JP2016180868A (en) * | 2015-03-24 | 2016-10-13 | 富士フイルム株式会社 | Exposure fixture and exposure method |
| CN107429400A (en) * | 2015-03-31 | 2017-12-01 | 富士胶片株式会社 | Plated coating formation is plated the film of coating precursor layer with composition, band, the film, conductive film, contact panel of coating is plated with pattern-like |
| CN108605413A (en) * | 2016-01-20 | 2018-09-28 | 利玛塔有限公司 | For directly the direct exposure device of paint only to be welded in exposure in two-dimensional, short annealing environment |
| CN108778710A (en) * | 2016-03-11 | 2018-11-09 | 富士胶片株式会社 | Band by the film of coating precursor layer, with pattern-like by the film, conductive membrane and touch panel of coating |
| CN108884568A (en) * | 2016-03-31 | 2018-11-23 | 富士胶片株式会社 | Manufacturing method, laminated body and the conductive laminate of conductive laminate |
| CN106785389A (en) * | 2016-12-09 | 2017-05-31 | 蓝思科技（长沙）有限公司 | The method and the glass back cover with antenna of antenna are made in glass back cover |
| CN207380418U (en) * | 2017-09-13 | 2018-05-18 | 合肥鑫晟光电科技有限公司 | A kind of mask plate |
| CN109755179A (en) * | 2017-11-03 | 2019-05-14 | 台湾积体电路制造股份有限公司 | The forming method of semiconductor structure |
| CN108303860A (en) * | 2018-03-26 | 2018-07-20 | 西安电子科技大学 | A kind of distributed exposure method for maskless lithography scanning |
| CN109603860A (en) * | 2019-01-02 | 2019-04-12 | 吉林师范大学 | A kind of preparation method of the ZnO/ZnS/ZnSe composite Nano with photocatalyst film |
Non-Patent Citations (4)
| Title |
|---|
| "薄膜光学 薄膜光学理论与膜系设计", 中国光学与应用光学文摘 * |
| CHENG-LIANG HSU: "Field Emission of ZnO Nanowires in Low Vacuum Following Various Enhancements Made by Exposure to UV", 《 IEEE TRANSACTIONS ON NANOTECHNOLOGY》 * |
| 王长涛等: "表面等离子体超衍射光学光刻", 《科学通报》 * |
| 黄京希;: "塑料的紫外线固化涂装", 科技创新导报 * |
Also Published As
| Publication number | Publication date |
|---|---|
| CN113809509B (en) | 2023-07-18 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP6490192B2 (en) | Touch sensor and touch panel | |
| US10514793B2 (en) | Touch sensor panel | |
| JP6421077B2 (en) | Antenna manufacturing method and touch sensor | |
| US20180059846A1 (en) | Touch sensor panel and substrate | |
| CN111508340A (en) | Display module, preparation method and display device | |
| CN102356181B (en) | Method for providing a conductive material structure on a carrier | |
| CN104540359A (en) | Shell of electronic device like mobile phone and manufacturing method thereof | |
| US20080069957A1 (en) | Method of manufacturing metal film pattern forming body | |
| CN104427738A (en) | Printed circuit board and manufacturing method thereof | |
| JPWO2003045125A1 (en) | Electromagnetic shielding light transmissive window material and method for manufacturing the same | |
| CN113809509B (en) | Antenna forming method, cover plate assembly and terminal equipment | |
| KR20130014784A (en) | Case-printed antenna for mobile communication terminal and mobile communication terminal equipped with the same | |
| WO2003045127A1 (en) | Electromagnetic wave shielded light-transmissive material and manufacturing method thereof | |
| CN104466368A (en) | Manufacturing method of antenna and electronic device | |
| KR20170101647A (en) | Shield device of electromagnetic interference and method of fabricating the same | |
| US12009587B2 (en) | Antenna module | |
| TWI548315B (en) | Circuit substrate, method for making the same, and circuit board and electronic device using the same. | |
| WO2014142475A1 (en) | Built-in antenna production method | |
| CN117728169A (en) | Preparation method of radome metal circuit layer and radome | |
| KR101457259B1 (en) | Method of manufacturing plastic metallized three-dimensional circuit | |
| CN211957890U (en) | Electronic device | |
| KR102288649B1 (en) | Manufacturing method of an antenna integral case by forming | |
| JP2023158561A (en) | Wiring board, laminate for image display unit and image display unit | |
| JP2023158579A (en) | Wiring board, laminate for image display unit and image display unit | |
| JP2023181012A (en) | Image display device laminate and image display device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |