CN113809509B - Antenna forming method, cover plate assembly and terminal equipment - Google Patents
Antenna forming method, cover plate assembly and terminal equipment Download PDFInfo
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- CN113809509B CN113809509B CN202010529495.2A CN202010529495A CN113809509B CN 113809509 B CN113809509 B CN 113809509B CN 202010529495 A CN202010529495 A CN 202010529495A CN 113809509 B CN113809509 B CN 113809509B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/12—Supports; Mounting means
- H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
- H01Q1/2258—Supports; Mounting means by structural association with other equipment or articles used with computer equipment
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/02—Electroplating of selected surface areas
- C25D5/022—Electroplating of selected surface areas using masking means
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/12—Supports; Mounting means
- H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/12—Supports; Mounting means
- H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
- H01Q1/24—Supports; Mounting means by structural association with other equipment or articles with receiving set
- H01Q1/241—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM
- H01Q1/242—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM specially adapted for hand-held use
Abstract
An antenna forming method, a cover plate assembly and terminal equipment are provided, and the antenna forming method can form an antenna on a cover plate. The antenna forming method comprises the following steps: providing a cover plate and a shading mask matched with the surface of the cover plate, wherein the shading mask is provided with a light transmission area matched with the shape of an antenna; carrying out UV selective exposure treatment on the surface of the cover plate by matching with a shading mask plate so as to form an irradiation area and a non-irradiation area on the surface of the cover plate; alkali liquor treatment is carried out on the surface of the cover plate; inoculating a catalyst on the surface of the cover plate; performing inhibition treatment on the catalyst adsorbed on the surface of the cover plate; plating conductive metal on the surface of the cover plate to form an antenna; and forming a protective layer covering the antenna on the surface of the cover plate. The cover plate with the antenna formed by the antenna forming method is applied to the terminal equipment, so that good signal receiving and transmitting effects can be achieved.
Description
Technical Field
The application relates to the technical field of terminal equipment, in particular to an antenna forming method, a cover plate assembly and terminal equipment.
Background
Along with development of technology, mobile communication terminals are becoming more and more popular in daily life of people, and such mobile communication terminals include smart phones, smart watches, tablet computers, wearable smart devices, and the like. In order to improve portability and operability of mobile communication terminals, under the condition of not affecting visual appearance, the mobile communication terminals are developing toward functional diversity, light and thin and miniaturized body, and are also developing iteratively as antenna modules of signal receiving and transmitting ends of the mobile communication terminals. However, the trend of mobile communication terminals means that more and more components are provided, and the space inside the device is utilized as much as possible, that is, the space reserved for the design of the antenna module is smaller and smaller, which puts higher demands on the design of the antenna module.
For example, after the communication technology is upgraded from 4G to 5G millimeter wave technology, an 8×8MIMO (multiple-input and multiple-output) antenna design scheme is generally adopted, and the number of antennas is increased to 64. As shown in fig. 1a to 1c, several possible embodiments of the 5G antenna arrangement scheme in the mobile communication terminal are illustrated, where the antenna module 101 in fig. 1a is equivalent to being disposed outside the front cover 102 or the rear cover 103, the antenna module 101 in fig. 1b is equivalent to being disposed inside the front cover 102 or the rear cover 103, specifically between the front cover 102 and the OCA (optically clear adhesive, optical cement) 104 or the rear cover 103 and the OCA104, the antenna module 101 in fig. 1c is equivalent to being disposed on the touch sensor 105 (specifically between the OCA104 and the touch sensor 105), and of course, other structures in fig. 1a to 1c further include the display unit 106, the protective coating 107 for protecting the antenna module 101, and other common structures of the mobile communication terminal. As is known from the conventional knowledge, the energy loss exists when the signal transmitted and received by the antenna module 101 penetrates through the dielectric layer, so that the position of the antenna module 101 in the mobile communication terminal has a great influence on the signal transmitting and receiving efficiency; in connection with the implementation of the antenna module 101 in fig. 1a to 1c, the priority of the efficiency of the antenna module 101 for transmitting and receiving signals is: antenna module 101 in fig. 1a > antenna module 101 in fig. 1b > antenna module 101 in fig. 1c, it can be seen that relatively good transceiving efficiency can be achieved when antenna module 101 is disposed on front cover 102 or rear cover 103.
The current antenna forming process commonly used at present can be a photolithography process, the process flow of which is shown in fig. 2a to 2g, firstly, as shown in fig. 2a, a metal conductive film 202 is formed on a substrate 201, as shown in fig. 2b, a photoresist 203 is coated on the metal conductive film 202 and dried, then, as shown in fig. 2c, the structure is exposed in cooperation with a mask 204, as shown in fig. 2d, the structure is developed, as shown in fig. 2e, the photoresist 203 is removed as shown in fig. 2f, finally, as shown in fig. 2g, a protective coating 107 is coated, and finally, the obtained structure is pad printed on a transparent film (not shown here), so that a MIMO antenna can be formed on the touch panel. In another antenna forming process, namely, a nanoimprint technology, the process flow can be shown by referring to fig. 3a to 3f, firstly, as shown in fig. 3a, a UV curing coating 302 is coated on a resin film 301, as shown in fig. 3b to 3d, a microstructure is formed on the UV curing coating 302 by adopting a male die 303 with a nanometer convex structure corresponding to an antenna design, the microstructure is provided with a groove 304, then, as shown in fig. 3e, a conductive layer 305 is injected into the groove 304 of the microstructure, and finally, as shown in fig. 3f, a protective coating 107 is coated, so that an antenna module formed on the resin film 301 is obtained.
Therefore, the conventional antenna structure design cannot meet the design requirement of the development of the current mobile communication device on the antenna module.
Disclosure of Invention
The application provides an antenna forming method, a cover plate assembly and terminal equipment, wherein an antenna can be directly formed on a cover plate of the terminal equipment, and the efficiency requirement of the terminal equipment on receiving and transmitting signals of the antenna is met.
In a first aspect, the present application provides an antenna molding method that can mold an antenna onto a cover plate for a terminal device; specifically, the antenna molding method comprises the following steps:
providing a cover plate and a shading mask matched with the surface of the cover plate, wherein the shading mask is provided with a light transmission area matched with the shape of the antenna; here, the surface of the cover plate may be the outer surface of the cover plate or the inner surface of the cover plate.
Carrying out UV selective exposure treatment on the surface of the cover plate by matching with the shading mask plate so as to form an irradiation area and a non-irradiation area on the surface of the cover plate;
alkali liquor treatment is carried out on the surface of the cover plate;
inoculating a catalyst on the surface of the cover plate;
performing inhibition treatment on the catalyst adsorbed on the surface of the cover plate;
plating conductive metal on the surface of the cover plate to form the antenna;
and forming a protective layer covering the antenna on the surface of the cover plate.
In the implementation of the method, the light shielding mask plate enables UV exposure to only act on the surface of the cover plate corresponding to the light transmission area of the light shielding mask plate, and a large number of hydroxyl groups or carboxyl groups can appear on the surface of the irradiation area of the cover plate subjected to UV irradiation; in order to better adsorb the catalyst on the surface of the cover plate, ionizing hydroxyl groups or carboxyl groups on the surface of the cover plate through alkali liquor treatment; after the catalyst is adsorbed on the surface of the cover plate, the plating of conductive metal is facilitated; when the catalyst is inoculated, a small amount of catalyst is adsorbed in a non-irradiated area of the cover plate, but the metal conductive circuit of the antenna needs to be formed only in the irradiated area, in order to prevent the non-irradiated area from being plated with conductive metal, the catalyst adsorbed on the surface of the cover plate is subjected to inhibition treatment, so that the activity of the small amount of catalyst adsorbed in the non-irradiated area can be inhibited, a large amount of catalyst in the irradiated area is not substantially inhibited (namely, the inhibition treatment does not seriously impair the catalytic performance of the catalyst in the irradiated area), the catalyst existing in the irradiated area can form a catalyst layer, after the conductive metal is plated, the metal conductive circuit capable of realizing the antenna function can be formed on the catalyst layer, the pattern formed by the metal conductive circuit corresponds to the antenna, and the protective layer can play a role in protecting the metal conductive circuit (namely, the antenna). It can be seen that, by the method, the antenna (the pattern formed by the metal conductive circuit is equivalent to the antenna) can be directly arranged on the surface of the cover plate, the medium traversed by the antenna during signal transmission is less, good signal receiving and transmitting effects can be obtained, and the transmission requirement of the current terminal equipment 5G signal millimeter wave can be met.
In the above method, the surface of the cover plate subjected to UV irradiation may form a weakly acidic hydroxyl group or carboxyl group, which is not easily ionized to adsorb the catalyst, so that in the alkali solution treatment, potassium hydroxide (KOH) solution or sodium hydroxide (NaOH) solution, the strong basicity of which facilitates ionization of the above hydroxyl group and carboxyl group, may be used; the protective layer can be one or more of polyurethane, acrylic, epoxy and organosilicon resin, and the protective layer needs to cover the antenna, so long as the antenna is not exposed.
In one possible implementation manner, before the UV selective exposure treatment is performed on the surface of the cover plate in cooperation with the light shielding mask, the method further comprises the following steps:
an organic polymer layer is formed on the surface of the cover plate, so that the adhesive force between the surface of the cover plate and the antenna can be improved; the material of the organic polymer layer is determined by the material of the cover plate, and can be one or a combination of more of polyurethane, acrylic, epoxy and silicone; the organic polymer layer is transparent, and the visible light transmittance is not less than 80%.
The cover plate is of a transparent material structure in specific implementation, and can be made of plastic, an optical flexible film or glass; if the cover plate is made of glass, the step of forming the organic polymer layer is not necessarily omitted.
In a possible implementation manner, after alkali liquor treatment is performed on the surface of the cover plate and before the surface of the cover plate is inoculated with the catalyst, the method further comprises the following steps:
treating the surface of the cover plate by adopting a cationic polymer solution; the implementation of this step can enhance the adsorption effect of the catalyst.
In the method, the catalyst can be palladium (Pd) catalyst, tin (Sn) catalyst, platinum (Pt) catalyst, or mixture of the above catalysts, such as mixture of palladium catalyst and tin catalyst; the type of the cationic polymer in the cationic polymer solution and the type of the inhibitor used in the inhibition treatment of the catalyst need to correspond to the type of the catalyst; taking palladium catalyst as an example, the corresponding cationic polymer may be a polyquaternary ammonium salt or a polyacrylamide, and the inhibitor may be a thiourea group compound.
In a second aspect, the present application also provides a cover assembly that may be applied to a terminal device such as a cell phone, tablet computer, or the like. The cover plate assembly comprises a cover plate and an antenna, wherein the antenna is formed on the surface of the cover plate through the antenna forming method provided by the technical scheme, and a catalyst layer is formed on the surface of the cover plate for being jointed with the antenna; the antenna in the cover plate assembly has less penetrating medium and less loss when receiving and transmitting signals, and can obtain good signal receiving and transmitting effects. In order to ensure transparency of the cover plate assembly such that visible light transmittance of the entire cover plate assembly is not less than 80%, a line width of a metal conductive line of the antenna may be defined to be not more than 10 μm and a height thereof is not more than 10 μm; the line width and the height may be preferably 0.1 to 5 μm in view of the visual recognition and conductivity of the metal conductive line. Meanwhile, in the area surrounded by the metal circuit at the outermost periphery of the metal conductive circuit of the antenna, the area ratio of the metal conductive circuit is between 5% and 20%.
In one possible implementation manner, in order to improve the adhesion between the surface of the cover plate and the antenna, an organic polymer layer may be formed on the surface of the cover plate facing the catalyst layer; the cover plate can be made of transparent plastic, optical flexible film or glass, and when the cover plate is made of glass, the organic polymer layer must be present. The cover plate is not limited in structure, and the surface of the cover plate can be a curved surface, a curved surface or a three-dimensional structure, so that the antenna is not affected, and the cover plate has wider applicability.
In a third aspect, the present application further provides a terminal device, where the terminal device may be a mobile phone, a tablet computer, a smart watch, etc.; the terminal equipment specifically comprises a terminal body, wherein a main board is arranged in the terminal body, and the cover plate assembly is arranged outside the terminal body to play a role in protecting the shell; the antenna is arranged on the surface of the cover plate in the cover plate assembly, and the antenna and the main board can be connected through a coupling connection or a feeder line, namely, the antenna can realize signal interaction between the main board and an external antenna device; because the antenna is arranged on the surface of the cover plate, whether the antenna is the inner surface or the outer surface of the cover plate, the space in the terminal equipment can be saved, the loss generated when the communication signal passes through the medium is small, and the antenna has good signal receiving and transmitting effect.
Drawings
Fig. 1a to 1c are diagrams illustrating an antenna configuration scheme of a conventional mobile communication terminal;
FIGS. 2a to 2g illustrate a conventional antenna molding method;
FIGS. 3a to 3f illustrate another conventional antenna molding method;
fig. 4a to fig. 4c are schematic structural diagrams of a cover assembly according to an embodiment of the present application;
FIG. 4d is a schematic structural view of a cover plate in the cover plate assembly according to the embodiment of the present application;
FIG. 4e is a schematic structural view of another cover plate in the cover plate assembly according to the embodiment of the present application;
FIGS. 4f and 4g are schematic structural views of another cover plate assembly according to embodiments of the present application;
FIG. 4h is a schematic structural view of a cover plate assembly according to an embodiment of the present disclosure;
FIGS. 4i and 4j are schematic structural views of one or more cover plate assemblies according to embodiments of the present application;
fig. 5 is a schematic flow chart of an antenna forming method according to an embodiment of the present application;
fig. 6a to 6i are schematic views illustrating structural changes of a cover assembly during a manufacturing process according to an embodiment of the present application;
fig. 7 is a schematic flow chart of another antenna forming method according to an embodiment of the present application;
fig. 8 is a schematic structural diagram of a cover plate assembly according to an embodiment of the present disclosure;
fig. 9 is a flow chart of another antenna forming method according to an embodiment of the present disclosure;
fig. 10 is a flow chart of another antenna forming method according to an embodiment of the present disclosure;
FIG. 11 is a schematic diagram of an antenna molding method implemented on a flexible optical film according to an embodiment of the present application;
fig. 12 is a schematic structural diagram of a terminal device according to an embodiment of the present application.
Reference numerals:
a 101-antenna module; 102-front cover; 103-a rear cover; 104-OCA; 105-a touch sensor; 106-a display unit; 107-protective coating; 201-a substrate; 202-a metal conductive film; 203-photoresist; 204-mask; 301-resin film; 302-UV chemical coating; 303-nanometer convex structure male mold; 304-grooves; 305-a conductive layer; 100-mobile phone; 11-a rear cover; 12-a main board; 10-a cover plate assembly; 1-a cover plate; 2-shading mask plate; a 3-catalyst layer; 4-antennas; 5-a protective layer; 6-organic polymer layer.
Detailed Description
First, the application scenario of the present application is introduced: with the development of communication technology, the available space inside the terminal device is smaller and smaller, and the antenna is formed on the cover plate, so that better signal receiving and transmitting efficiency can be obtained. However, the conventional antenna molding process cannot meet the requirement of arranging the antenna on the cover plate, and the formed antenna cannot meet the ideal signal receiving and transmitting effect.
Based on this, the embodiment of the present application provides an antenna molding method and a cover assembly 10, where the antenna molding method is used to form an antenna 4 on a surface of a cover 1, and finally, the cover 1 with the antenna 4 as shown in fig. 4a, 4b or 4c can be obtained, and the structure of the cover 1 in fig. 4a, 4b or 4c can be shown with reference to fig. 4d, where the cover 1 has two opposite surfaces, and the antenna 4 can be formed on an outer surface 1a (for example, as shown in fig. 4 a) of the cover 1, can be formed on an inner surface 1b (for example, as shown in fig. 4 b) of the cover 1, and can also form the antenna 4 on both surfaces (for example, as shown in fig. 4 c). Of course, as shown in fig. 4a, 4b or 4c, a catalyst layer 3 is further formed on the surface of the cover plate 1 for forming the antenna 4, the antenna 4 is formed on the catalyst layer 3, and a protective layer 5 for covering the antenna 4 is further formed on the surface of the antenna 4.
It will be appreciated that the surface of the cover plate 1 in fig. 4a, 4b or 4c is planar; if the cover 1 has a structure as shown in fig. 4e, the outer surface 1a and the inner surface 1b thereof are both arc surfaces, and the structure of the cover assembly 10 obtained by forming the antenna 4 on the cover 1 can be shown with reference to fig. 4f or fig. 4g (the structure of forming the antenna 4 on both surfaces of the cover 1 is not shown here); if the cover 1 has a three-dimensional structure as shown in fig. 4h, the outer surface 1a and the inner surface 1b thereof are both three-dimensional structures, and the structure of the cover assembly 10 obtained by forming the antenna 4 on the cover 1 can be described with reference to fig. 4i and 4j (the structure of forming the antenna 4 on both surfaces of the cover 1 is not shown). Therefore, the antenna forming method provided by the embodiment of the application does not limit the structure of the cover plate 1, and has strong adaptability. It will be appreciated that the structures shown in fig. 4a, 4b, 4c, 4f, 4g, 4i and 4j provide several implementations of the cover plate assembly 10 provided by the present embodiment; of course, in the above illustration, the antenna 4 is also formed with a protective layer 5 covering the antenna 4. It is understood that the structure of the catalyst layer 3 is omitted in fig. 4a, 4b, 4c, 4f, 4g, 4i and 4j for clarity of illustration.
The present application will be described in further detail with reference to the accompanying drawings, and in the description of the following embodiments, the cover plate 1 shown in fig. 4b will be taken as an example. In addition, the antenna molding method provided in the embodiment of the present application corresponds to the structure of the cover assembly 10, and therefore, for clarity and brevity of the scheme, the structure of the cover assembly 10 will be described corresponding to the embodiment of the antenna molding method.
Referring to fig. 4a, which is a schematic diagram illustrating a flow of the antenna forming method shown in fig. 5 and a schematic diagram illustrating a structural variation of the cover assembly 10 corresponding to the method shown in fig. 6a to 6e, the embodiment of the present application first provides an antenna forming method. The antenna forming method comprises the following steps:
s1: providing a cover plate 1 and a shading mask plate 2 matched with the surface of the cover plate 1, wherein the shading mask plate 2 is provided with a light transmission area A matched with the shape of an antenna; referring to fig. 6b, an exemplary structure of a light-shielding mask 2 is shown, wherein the shape of the light-transmitting area a is matched with the shape of the finally formed antenna 4, and the cover plate 1 is made of transparent material, which may be plastic, optical flexible film or glass. It should be noted that, in the following embodiments, the structure of the light-shielding mask 2 illustrated in fig. 6b will be described as an example.
S2: carrying out UV selective exposure treatment on the surface of the cover plate 1 by matching with the shading mask plate 2; as shown in fig. 6c, the light-shielding mask 2 is placed on the surface of the cover plate 1 so that the light-shielding mask 2 can be corresponding to and contacted with the cover plate 1, a DUV type ultraviolet lamp with high radiation efficiency is adopted to irradiate from the side, away from the cover plate 1, of the light-shielding mask 2, the light transmission area a on the light-shielding mask 2 can allow irradiation light to pass through and irradiate the surface of the cover plate 1, and the solid part of the light-shielding mask 2 can block the irradiation light from passing through, so that an irradiation area B1 (part inside a dotted line frame) and a non-irradiation area B2 shown in fig. 6d are finally formed on the surface of the cover plate 1; in fig. 6d, the shape of the irradiation area B1 matches the shape of the light transmitting area a on the shadow mask 2. The DUV type ultraviolet lamp can emit light with the wavelength of about 230-320nm, and particularly, hg (mercury) -Xe (xenon) ultrahigh pressure ultraviolet lamp can be selected.
In this step, the surface of the cover plate 1 subjected to UV irradiation treatment (i.e., the irradiation region B1 shown in fig. 6 d) changes the chemical structure of the surface of the cover plate 1, so that a large number of weakly acidic hydroxyl groups or carboxyl groups are present on the surface of the irradiation region B1, and such a surface of the cover plate 1 is advantageous for the subsequent step implementation.
S2: alkali liquor treatment is carried out on the surface of the cover plate 1; the alkali liquor treatment refers to the treatment of the surface of the cover plate 1 by adopting an alkaline solution, so that the alkaline solution promotes the ionization of hydroxyl groups and carboxyl groups on the surface of the cover plate 1; in particular to this step, OH can be used - The surface of the cover plate 1 is treated with a sodium hydroxide solution having a concentration of 1.0 to 2.0mol/L, the strong basicity of which facilitates ionization of the above-mentioned hydroxyl groups and carboxyl groupsThe method comprises the steps of carrying out a first treatment on the surface of the The sodium hydroxide solution here may be replaced by potassium hydroxide solution, and OH - The concentration of (2) may be further defined as 1.2 to 1.5mol/L.
S3: inoculating a catalyst C on the surface of the cover plate 1; the seeding catalyst C herein refers to the attachment of catalyst C, which facilitates the plating of the late metal, to the surface of the cover plate 1; specifically to this step, as shown in fig. 6e, the cover plate 1 is immersed in an aqueous solution of the catalyst C, so that the catalyst C is adsorbed to the surface of the cover plate 1 to obtain a structure as shown in fig. 6 f. In fig. 6f, the irradiation area B1 of the surface of the cover plate 1 has a large number of hydroxyl groups or carboxyl groups, so that the irradiation area B1 adsorbs a large number of catalysts C, and the surface of the catalysts C adsorbed to the irradiation area B1 is advantageous for the formation of the subsequent antennas 4. It should be noted that a small amount of the catalyst C is adsorbed in the non-irradiated area B2, and of course, the catalyst C adsorbed in the non-irradiated area B2 is not advantageous for the precise formation of the antenna 4 in the irradiated area B1.
The catalyst C can be palladium catalyst, and can be palladium (II) complex, such as palladium-arginine complex; the catalyst C can also be selected from tin catalysts, platinum catalysts and the like, and can also be selected from a mixture of the catalysts, such as a mixture of a palladium catalyst and a tin catalyst, and the catalysts can be reasonably selected according to specific technological processes and product requirements.
S4: performing inhibition treatment on the catalyst C adsorbed on the surface of the cover plate 1; the inhibition treatment herein means that the activity of the catalyst C is inhibited by an inhibitor, and of course, the type of the inhibitor needs to be matched with the type of the catalyst C; the reason for this step is that, when forming the antenna 4, the antenna 4 is formed only in the irradiated area B1, and since the non-irradiated area B2 after alkali treatment may also form a small amount of hydroxyl groups or carboxyl groups on the surface, i.e., the non-irradiated area B2 may also adsorb a small amount of catalyst C (refer to fig. 6 f), obviously, the catalyst C present in the non-irradiated area B2 is advantageous for metal plating, which is of course disadvantageous for structural formation of the antenna 4. Therefore, in order to prevent the non-irradiated area B2 of the surface of the cover plate 1 from being plated, the catalyst 3 on the surface of the cover plate 1 is inhibited by the inhibitor, the amount of the catalyst C adsorbed on the irradiated area B1 is large, and even if the catalyst C is treated by the inhibitor, the catalyst C has a certain activity and does not affect the implementation of metal plating; the catalyst C adsorbed on the non-irradiated region B2 is very small, and the activity of the catalyst C is substantially suppressed after the inhibitor treatment, and finally, a structure in which the catalyst C exists only in the irradiated region B1 as shown in fig. 6g can be obtained, and at this time, the catalyst C forms the catalyst layer 3 on the surface of the cover plate 1. Of course, the type of the inhibitor is required to match the type of the catalyst C, and the catalyst C is exemplified by palladium (II) complex, and the inhibitor may be a compound having thiourea group.
S5: as shown in fig. 6h, a conductive metal having a thickness in the range of 0.1 to 10um is plated on the surface of the cover plate 1, and due to the presence of the catalyst 3, the conductive metal is formed at a portion of the cover plate 1 having the catalyst 3, so that the conductive metal has a regular shape to form the antenna 4; in this step, the conductive metal may be any one of copper, silver, aluminum, tin or an alloy thereof, and these metals have good conductivity. Taking metal copper as an example, the step may be to directly plate electroless copper on the surface of the cover plate 1 to form a metal wire circuit capable of realizing the antenna function, the pattern formed by the metal wire circuit forms the antenna 4, and in order to improve the conductivity, the electroless copper may be plated after the electroless copper is plated.
It should be noted that, for the antenna 4 formed on the cover plate 1, in order to ensure transparency of the entire cover plate assembly 10 (i.e., the visible light transmittance of the cover plate assembly 10 is not less than 80%), the line width of the metal conductive line of the antenna 4 may be defined to be not more than 10 μm. The line width and the height may be preferably 0.1 to 5 μm in view of the visual recognition and conductivity of the metal conductive line. Meanwhile, in the area surrounded by the metal circuit at the outermost periphery of the metal conductive circuit of the antenna 4, the area of the metal conductive circuit accounts for 5% -20%.
S6: forming a protective layer 5 covering the antenna 4 on the surface of the cover plate 1 to obtain a structure as shown in fig. 6 i; in this step, a protective coating may be applied to the side of the cover plate 1 where the antenna 4 is disposed and cured to form the protective layer 5, where the protective coating may be one or more of polyurethane, acrylic, epoxy, and silicone resins, and when the antenna 4 is coated, it is required to cover the antenna 4, so long as the antenna 4 is not exposed; the curing mode can be thermal curing or UV curing, and a combination of the two modes can be adopted.
The antenna 4 is formed on the cover plate 1 by adopting the antenna forming method provided by the embodiment, and in a specific application, the cover plate 1 is generally and directly applied to a shell part of a terminal device, and the antenna 4 formed on the cover plate 1 has less penetrating media during signal transmission, can obtain good signal receiving and transmitting effects, and can meet the millimeter wave transmission requirement of the current 5G signal; moreover, the antenna 4 is directly formed on the cover plate 1, so that the space inside the terminal equipment is not occupied, and the current development trend of miniaturization of the terminal equipment is met; of course, the method is simple in process, high in feasibility and beneficial to popularization and implementation.
On the basis of the antenna forming method shown in fig. 5, the embodiment of the present application further provides an antenna forming method, referring to a flow chart of the method shown in fig. 7, which is different from the flow chart of the method shown in fig. 5 in that, before UV selective exposure treatment is performed on the surface of the cover plate 1 by matching with the light-shielding mask 2, the method further includes the following steps:
s13': forming an organic polymer layer 6 on the surface of the cover plate 1; in the step, an organic polymer coating can be coated on the surface of the cover plate 1 to form an organic polymer layer 6, and the material of the organic polymer layer 6 is determined by the material of the cover plate 1, and specifically, the organic polymer coating can be one or a combination of more of polyurethane, acrylic, epoxy and silicone; the organic polymer layer 6 here has a transparent property, and the visible light transmittance thereof is not less than 80%.
The structure of the cover plate 1 having the antenna 4 obtained by the antenna molding method shown in fig. 7 can be shown with reference to fig. 8 (the catalyst layer 3 is omitted here), and the organic polymer layer 6 can enhance the adhesion between the cover plate 1 and the antenna 4. Of course, the structure shown in fig. 8 herein corresponds to the structure of the cover plate assembly 10 corresponding to the method shown in fig. 7.
When the cover plate 1 is made of glass, the step S13' may not be omitted.
On the basis of the antenna forming method shown in fig. 5, the embodiment of the present application further provides another antenna forming method, referring to a schematic flow chart of the method shown in fig. 9, which is different from the flow chart of the method shown in fig. 5 in that after alkali solution treatment is performed on the surface of the cover plate 1 and before the surface of the cover plate 1 is inoculated with the catalyst C, the method further includes the following steps:
s14': the cationic polymer solution is adopted to treat the surface of the cover plate 1, and the adsorption effect of the subsequent catalyst C can be enhanced in the embodiment of the step; of course, the type of cationic polymer solution is also matched with the type of catalyst C, and the corresponding cationic polymer may be a polyquaternary ammonium salt or a polyacrylamide, for example, palladium catalyst C.
It will be appreciated that the construction of the cover plate 1 with the antenna 4 (corresponding to the construction of the cover plate assembly 10 corresponding to the method shown in fig. 9) obtained by this antenna molding method is similar to that shown in fig. 4a and is therefore not shown here by way of illustration.
By combining the flows of the two antenna forming methods shown in fig. 7 and 9, an antenna forming method as shown in fig. 10 can also be obtained, which corresponds to the step of forming the organic polymer layer 6 and the step of treating the surface of the cover plate 1 with the cationic polymer solution added to the structure of the antenna forming method shown in fig. 5, and the structure of the cover plate 1 with the antenna 4 (corresponding to the structure of the cover plate assembly 10 corresponding to the method shown in fig. 10) obtained finally is similar to the structure shown in fig. 8, and is not shown in the drawings; in addition, since the respective steps shown in fig. 10 have been described in detail above, a detailed description thereof is omitted herein.
On the basis of the antenna molding method shown in fig. 5, the embodiment of the present application also provides another antenna molding method applied to forming the antenna 4 on the flexible optical film (equivalent to the cover plate 1); the difference between the process flow of the method shown in fig. 5 and the process flow of the method shown in fig. 5 is that, since the cover plate 1 is a flexible optical film, the cover plate 1 can be arranged on a roll-to-roll process device as shown in fig. 11, and during the process that any part of the cover plate 1 moves from the M position to the N position shown in fig. 11, the antenna 4 is formed on the cover plate 1 by adopting the method shown in fig. 5, and finally, the cover plate 1 with the antenna 4 is cut according to different product specification requirements, so as to obtain the cover plate assembly 10 with the target size.
Based on the structure of any one of the cover plate assemblies 10 provided in the foregoing embodiments, the present embodiment further provides a terminal device, which may be illustrated as a mobile phone 100 shown in fig. 12, where the rear cover 11 of the mobile phone 100 corresponds to the cover plate 1 of the foregoing cover plate assembly 10, the antenna 4 is disposed on the inner surface of the rear cover 11, and the motherboard 12 is disposed in the mobile phone 100, and since the antenna 4 and the motherboard 12 are both disposed in the mobile phone 100, they are illustrated in dashed lines in fig. 12.
Referring to fig. 12, the main board 12 and the antenna 4 may be connected by a coupling or feeder line, and the antenna 4 corresponds to a signal receiving and transmitting end of the main board 12, so as to implement signal interaction between the main board 12 and an external antenna device. Because the antenna 4 is disposed on the inner surface of the rear cover 11 (or on the outer surface of the rear cover 11), the space in the mobile phone 100 can be saved, and the loss generated when the communication signal passes through the medium is small, so that the antenna has a good signal receiving and transmitting effect.
It will be apparent to those skilled in the art that various modifications and variations can be made to the embodiments of the present application without departing from the scope of the embodiments of the present application. Thus, if such modifications and variations of the embodiments of the present application fall within the scope of the claims and the equivalents thereof, the present application is intended to encompass such modifications and variations.
Claims (15)
1. An antenna molding method for forming an antenna on a surface of a cover plate, comprising the steps of:
providing a cover plate and a shading mask matched with the surface of the cover plate, wherein the shading mask is provided with a light transmission area matched with the shape of the antenna;
carrying out UV selective exposure treatment on the surface of the cover plate by matching with the shading mask plate so as to form an irradiation area and a non-irradiation area on the surface of the cover plate;
alkali liquor treatment is carried out on the surface of the cover plate;
inoculating a catalyst on the surface of the cover plate; the irradiation area of the surface of the cover plate is adsorbed with a large amount of the catalyst, and the non-irradiation area of the surface of the cover plate is adsorbed with a small amount of the catalyst;
performing inhibition treatment on the catalyst adsorbed on the surface of the cover plate;
plating conductive metal on the surface of the cover plate to form the antenna;
forming a protective layer covering the antenna on the surface of the cover plate;
and when the cover plate is glass, an organic polymer layer is formed on the surface of the cover plate before the Ultraviolet (UV) selective exposure treatment is carried out on the surface of the cover plate by matching with the shading mask plate.
2. The method of claim 1, wherein the material of the organic polymer layer is determined by the material of the cover plate and the visible light transmittance of the organic polymer layer is not less than 80%.
3. The method of claim 2, wherein the organic polymeric layer is a combination of one or more of polyurethanes, acrylics, epoxies, silicones.
4. The method of claim 1, further comprising the step of, after lye treatment of the cover surface, before seeding the cover surface with a catalyst:
and treating the surface of the cover plate by adopting a cationic polymer solution.
5. The method of claim 4, wherein the catalyst is a palladium catalyst, the cationic polymer in the cationic polymer solution is a polyquaternary ammonium salt or a polyacrylamide, and the inhibitor in inhibiting the non-irradiated area of the cover plate surface is a thiourea inhibitor.
6. The method of any one of claims 1-5, wherein the protective layer is a combination of one or more of polyurethanes, acrylics, epoxies, silicones.
7. A cover plate assembly applied to a terminal device, comprising: a cover plate and an antenna formed on a surface of the cover plate by the antenna molding method according to any one of claims 1 to 6, the surface of the cover plate for bonding the antenna being formed with a catalyst layer.
8. The cover assembly of claim 7, wherein the surface of the cover facing the catalyst layer is further formed with an organic polymer layer.
9. The cover sheet assembly of claim 8 wherein the organic polymer layer has a visible light transmittance of not less than 80%.
10. The cover assembly of claim 7, wherein the cover is a plastic, optically flexible film or glass of transparent material.
11. The cover assembly of claim 7, wherein the surface of the cover is planar, curved, or three-dimensional.
12. The cover assembly of claim 7, wherein the width of the metallic conductive trace of the antenna is no greater than 10 μm.
13. The cover assembly of claim 7, wherein the antenna has a metal conductive trace height of no more than 10 μm.
14. The cover assembly of any one of claims 7-13, wherein the antenna has a metal conductive trace area of 5% -20% in the area surrounded by the outermost metal conductive trace of the antenna.
15. A terminal device, characterized by a device body, in which a main board is provided, and in which the cover assembly according to any one of claims 7 to 14 is provided outside;
and an antenna in the cover plate assembly is connected with the main board in a coupling way or a feeder line way.
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| CN202010529495.2A CN113809509B (en) | 2020-06-11 | 2020-06-11 | Antenna forming method, cover plate assembly and terminal equipment |
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