CN113793875A - Photovoltaic packaging plate, manufacturing method thereof and photovoltaic module - Google Patents

Photovoltaic packaging plate, manufacturing method thereof and photovoltaic module Download PDF

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Publication number
CN113793875A
CN113793875A CN202111070426.0A CN202111070426A CN113793875A CN 113793875 A CN113793875 A CN 113793875A CN 202111070426 A CN202111070426 A CN 202111070426A CN 113793875 A CN113793875 A CN 113793875A
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layer
photovoltaic
conductive layer
conductive
gas
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谭小春
朱疆
谢燕
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Longi Solar Technology Co Ltd
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Xian Longi Green Energy Architecture Technology Co Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02—Details
    • H01L31/0216—Coatings
    • H01L31/02161—Coatings for devices characterised by at least one potential jump barrier or surface barrier
    • H01L31/02167—Coatings for devices characterised by at least one potential jump barrier or surface barrier for solar cells
    • H01L31/02168—Coatings for devices characterised by at least one potential jump barrier or surface barrier for solar cells the coatings being antireflective or having enhancing optical properties for the solar cells
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02—Details
    • H01L31/0224—Electrodes
    • H01L31/022408—Electrodes for devices characterised by at least one potential jump barrier or surface barrier
    • H01L31/022425—Electrodes for devices characterised by at least one potential jump barrier or surface barrier for solar cells
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
    • H01L31/042—PV modules or arrays of single PV cells
    • H01L31/048—Encapsulation of modules
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy

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  • Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Electromagnetism (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Sustainable Energy (AREA)
  • Photovoltaic Devices (AREA)

Abstract

The invention provides a photovoltaic packaging plate, a manufacturing method thereof and a photovoltaic module, relates to the technical field of photovoltaics, and aims to solve the problems that the photovoltaic module generates a PID (proportion integration differentiation) phenomenon and the photovoltaic effect of a cell sheet layer is influenced. The photovoltaic packaging plate comprises an antireflection layer, a packaging plate body, a conducting layer and a conductive band, wherein the antireflection layer, the packaging plate body and the conducting layer are sequentially laminated together from top to bottom, and the conductive band is connected with the conducting layer and the antireflection layer. The invention also provides a manufacturing method of the photovoltaic packaging plate, which comprises the following steps: a package board body is provided, and the package board body is provided with a first face and a second face which are opposite. And forming a conductive layer on the first surface and forming an antireflection layer on the second surface. And a conductive strip is formed at the edge of the packaging plate body and along the direction extending from the first surface to the second surface. The invention also provides a photovoltaic module which comprises a cover plate, a first adhesive film layer, a battery sheet layer, a second adhesive film layer and a back plate which are sequentially stacked from top to bottom. The cover plate and/or the back plate are/is the photovoltaic packaging plate in the technical scheme.

Description

Photovoltaic packaging plate, manufacturing method thereof and photovoltaic module
Technical Field
The invention relates to the technical field of photovoltaics, in particular to a photovoltaic packaging plate, a manufacturing method of the photovoltaic packaging plate and a photovoltaic module.
Background
Photovoltaic modules typically include a laminate, a junction box, and a bezel. The laminate generally includes a cover plate, a first adhesive film layer, a battery sheet layer, a second adhesive film layer, and a back plate, which are stacked in sequence from top to bottom. The cover plate and the back plate are usually made of glass.
Under the environment of high temperature and high humidity, a large amount of water vapor can be adsorbed on the surface of the glass, and at the moment, the alkali precipitation phenomenon is easy to occur on the surface of the glass. On the basis of this, alkali metal ions (for example Na) which can lead to the formation of glass surfaces+) Under the action of the voltage, the glass moves to the cell sheet layer. The alkali metal ions are then concentrated at the anti-reflective layer of the cell sheet. At this time, PN junctions in the cell layers are damaged, so that a Potential Induced Degradation (PID) phenomenon occurs, and a photovoltaic effect of the cell layers is reduced, thereby affecting the performance of the photovoltaic module.
Disclosure of Invention
The invention aims to provide a photovoltaic packaging plate, a manufacturing method thereof and a photovoltaic module, which are used for avoiding the PID phenomenon of the photovoltaic module and improving the photovoltaic effect of a cell layer and the performance of the photovoltaic module.
In a first aspect, the present invention provides a photovoltaic encapsulant sheet. The photovoltaic packaging plate comprises an antireflection layer, a packaging plate body, a conducting layer and a conductive band, wherein the antireflection layer, the packaging plate body and the conducting layer are sequentially laminated together from top to bottom, and the conductive band is connected with the conducting layer and the antireflection layer. The conductive layer is a non-alkali metal ion conductive layer.
Compared with the prior art, when the photovoltaic packaging plate and the cell sheet layer are assembled together to form a photovoltaic module, voltage is applied to the photovoltaic module. Specifically, one end of the antireflection layer is connected with the positive electrode of the power supply, and the battery sheet layer is connected with the negative electrode of the power supply. Because the conducting layer and the antireflection layer are electrically connected through the conducting band, both the conducting layer and the antireflection layer are positively charged, and no potential difference exists between the conducting layer and the antireflection layer. Based on this, alkali metal ions (e.g., Na) in the package plate body over the conductive layer+) Do not migrate into the conductive layer. And because the cell sheet layer is connected with the negative electrode of the power supply, the cell sheet layer is charged with negative charges. Based on this, the aboveA potential difference exists between the cell sheet and the conductive layer. However, since the conductive layer does not contain alkali metal ions, and also no alkali metal ions migrate from the package board body into the conductive layer. Therefore, under the action of the potential difference, no alkali metal ions migrate to the cell sheet layer, and the PN junction in the cell sheet layer is not damaged. Therefore, the PID phenomenon of the photovoltaic module can be avoided, and the photovoltaic effect of the cell sheet layer and the performance of the photovoltaic module are improved.
In one implementation, the photovoltaic package board further includes an insulating adhesive layer, and the insulating adhesive layer and a surface of the conductive layer away from the package board body are laminated together.
Under the condition of adopting above-mentioned technical scheme, in the in-service use in-process, above-mentioned insulating bonding layer is located the conducting layer and photovoltaic module's glue film layer, can be effectual with conducting layer and glue film layer bonding together. And because the antireflection layer, the packaging plate body and the conductive layer are stacked together, the insulating bonding layer can firmly arrange the layers on the adhesive film layer, and the safety and the stability of the assembled photovoltaic module can be further ensured.
In one implementation, the conductive layer is a tin conductive layer, an indium conductive layer, or a zinc conductive layer.
Under the condition of adopting the technical scheme, the conducting layer made of the material has conductivity, so that the phenomenon of PID (proportion integration differentiation) of the photovoltaic module can be avoided. Next, when the conductive layer is a tin-based conductive layer, ultraviolet rays having a wavelength of 300nm or less cannot penetrate the tin-based conductive layer. Therefore, the stannide conducting layer can block ultraviolet rays, prevent a glue film layer, a battery sheet layer and the like in the photovoltaic module from being damaged, and further improve the outdoor power generation performance, the weather resistance and the safety performance of the photovoltaic module.
In one implementation, where the conductive layer is a stannide conductive layer, the stannide conductive layer is a fluorine-doped tin oxide conductive layer. In the case where the conductive layer is an indium compound conductive layer, the indium compound conductive layer is a tin-doped indium oxide conductive layer. In the case where the conductive layer is a zincate conductive layer, the zincate conductive layer is an aluminum-doped zinc oxide conductive layer.
In one implementation, when the stannide conductive layer is a fluorine-doped tin oxide conductive layer, the fluorine-doped tin oxide conductive layer has a refractive index of 1.4 to 1.8. And/or the fluorine-doped tin oxide conducting layer has a thickness of 5nm to 20 nm. And/or the fluorine content in the fluorine-doped tin oxide conducting layer is 0-50%.
Under the condition of adopting above-mentioned technical scheme, can increase photovoltaic module's light transmissivity, improve solar cell's photoelectric conversion efficiency.
In one implementation, the conductive strips are arranged at the edges of the conductive layer and the antireflection layer.
Under the condition of adopting above-mentioned technical scheme, the position that is used for forming "conducting layer and antireflection layer" on the packaging board body can not be occupied or excessively occupied to the conducting band. At this time, a larger area of the conductive layer and the antireflection layer can be formed in the limited position of the surface of the package board body. On the one hand, on the basis of this, it is more advantageous to prevent alkali metal ions (for example, Na) in the package plate body when a voltage is applied to the photovoltaic module+) The conductive layer is migrated, so that the PN junction in the cell sheet layer is prevented from being damaged by alkali metal ions, the PID phenomenon of the photovoltaic module is avoided, and the photovoltaic effect of the cell sheet layer and the performance of the photovoltaic module are improved. On the other hand, when an antireflection layer with a larger area is formed, the light transmittance of the photovoltaic module is increased, and the photoelectric conversion efficiency of the solar cell is further improved.
In one implementation, the conductive strips and the conductive layer are made of the same or different materials.
Under the condition of adopting above-mentioned technical scheme, when the material of conductive band and conducting layer is the same, can reduce the preparation degree of difficulty of conductive band and conducting layer to ensure that conductive band can effectual electricity connection conducting layer and antireflection layer, and then ensure when exerting voltage to photovoltaic module, there is not the potential difference between conducting layer and the antireflection layer. Therefore, the PID phenomenon of the photovoltaic module can be avoided, and the photovoltaic effect of the cell sheet layer and the performance of the photovoltaic module are improved.
When the conductive band and the conductive layer are made of different materials, the selectivity of raw materials for manufacturing the conductive band and the conductive layer is increased, and the raw material cost of the conductive band and the conductive layer is reduced.
In one implementation, the conductive strip and the conductive layer are integrally formed on the package board body, in the case that the conductive strip and the conductive layer are made of the same material.
By adopting the technical scheme, the manufacturing efficiency of the conductive belt and the conductive layer can be improved, and meanwhile, the connection tightness and the connection fixity of the conductive belt and the conductive layer can be ensured, so that the electric connection safety of the conductive belt and the conductive layer in the actual use process is ensured.
In one implementation, the specific resistance value of the conductive strip is 5 × 10-4Ωcm～5×10-3Ωcm。
Under the condition of adopting above-mentioned technical scheme, when exerting voltage to photovoltaic module, can ensure that the conduction band has good electric conductivity, and then ensure not to have the potential difference between conducting layer and the antireflection layer, avoid photovoltaic module to produce PID phenomenon.
In one implementation, the antireflection layer is at least one layer. And/or the refractive index of the antireflection layer is 1.2-1.6. And/or the thickness of the antireflection layer is 80nm to 200 nm.
By adopting the technical scheme, the reflection of visible light can be reduced, the light transmittance of the photovoltaic module can be increased, and the photoelectric conversion efficiency of the solar cell can be improved.
In one implementation mode, the packaging plate body is made of ultra-white patterned glass, the ultra-white patterned glass is made of double-textured ultra-white patterned glass, and the roughness of the double-textured ultra-white patterned glass is 0.2-2 um.
Under the condition of adopting above-mentioned technical scheme, be favorable to making that antireflection layer and conducting layer and two matte ultrawhite knurling glass combine inseparabler, and then ensure the fastness and the security of photovoltaic encapsulation board and photovoltaic module.
In one implementation, the package board body is made of ultra-white float glass, and the non-tin surface of the ultra-white float glass is laminated with the antireflection layer.
In one implementation, the insulating adhesive layer is a silicide insulating adhesive layer.
Under the condition of adopting above-mentioned technical scheme, on the one hand, because insulating tie coat is connected with the conducting layer, be located between conducting layer and the battery lamella. When a voltage is applied to the photovoltaic module, there is no potential difference between the conductive layer and the anti-reflective layer. Thus, the alkali metal ion (e.g., Na) in the package board body+) Do not migrate into the conductive layer and thus into the insulating adhesive layer. And because the cell sheet layer is connected with the negative electrode of the power supply, the cell sheet layer is charged with negative charges. Based on this, a potential difference exists between the battery sheet layer and the insulating adhesive layer. However, since the insulating adhesive layer does not contain alkali metal ions, and no alkali metal ions migrate from the package board body into the insulating adhesive layer. Therefore, under the action of the potential difference, no alkali metal ions migrate to the cell sheet layer, and the PN junction in the cell sheet layer is not damaged. Based on this, can further avoid photovoltaic module to produce PID phenomenon, improve the photovoltaic effect of battery lamella and photovoltaic module's performance. On the other hand, the material cost of the insulating bonding layer can be saved by adopting the materials.
In one implementation, the material of the silicide insulating adhesion layer is at least one of silicon oxide or silicon dioxide.
Under the condition of adopting above-mentioned technical scheme, on the one hand, can ensure that insulating tie coat and good bonding of rete are in the same place, and then ensure photovoltaic packaging board and rete fastening connection, ensure the security and the fixity of the photovoltaic module after the equipment. On the other hand, silicon monoxide or silicon dioxide has good light transmittance, and can improve the photoelectric conversion efficiency of the solar cell.
In one implementation, the insulating bonding layer and the antireflection layer are made of the same or different materials.
Under the condition of adopting above-mentioned technical scheme, when insulating tie coat and antireflection layer's material is the same, can further increase photovoltaic module's light transmissivity, improve solar cell's photoelectric conversion efficiency.
When the insulating bonding layer is different from the antireflection layer, the selectivity of raw materials for manufacturing the insulating bonding layer and the antireflection layer is increased, and the raw material cost of the insulating bonding layer and the raw material cost of the antireflection layer are reduced.
In one implementation, the thickness of the insulating adhesive layer is 10nm to 100 nm.
Under the condition of adopting above-mentioned technical scheme, on the one hand, can be effectual with conducting layer and glued membrane layer bonding together to ensure the security and the stability of the photovoltaic module after the equipment. On the other hand, the packaging plate can also play an insulating role, so that alkali metal ions in the packaging plate body are further prevented from migrating to the cell sheet layer, the phenomenon of PID (proportion integration differentiation) of the photovoltaic module is further avoided, and the photovoltaic effect of the cell sheet layer and the performance of the photovoltaic module are improved.
In one implementation, the light transmittance of the photovoltaic packaging plate is greater than 90% when the wavelength of visible light is 300 nm-1100 nm.
Under the condition of adopting the technical scheme, when the wavelength of visible light is 300 nm-1100 nm, the light transmittance of the photovoltaic packaging plate is good, the light absorption rate of the solar cell can be ensured, and the photoelectric conversion efficiency of the solar cell is further improved.
In one implementation mode, the thickness of the photovoltaic packaging board is 1.0-4.0 mm.
Under the condition of adopting above-mentioned technical scheme, on the one hand, can ensure that the thickness of each layer that forms the photovoltaic encapsulation board accords with actual need to ensure the stability of the function of each layer. On the other hand, the photovoltaic packaging plate can effectively protect the cell layer connected with the adhesive film layer, the cell layer is prevented from being damaged or polluted, and the stability of the working performance of the photovoltaic module is further ensured.
In one implementation mode, the photovoltaic packaging plate is formed by sintering.
By adopting the technical scheme, the adhesive force between the layers in the photovoltaic packaging plate can be improved, namely, the tightness and firmness of connection between the layers are improved, the safety of the photovoltaic packaging plate when the photovoltaic packaging plate is applied to a photovoltaic module is ensured, and the safety of the photovoltaic module is further ensured.
In a second aspect, the invention further provides a manufacturing method of the photovoltaic packaging plate. The manufacturing method of the photovoltaic packaging plate comprises the following steps:
a package board body is provided, and the package board body is provided with a first face and a second face which are opposite.
And forming a conductive layer on the first surface and forming an antireflection layer on the second surface.
And a conductive belt is formed at the edge of the packaging plate body and along the direction extending from the first surface to the second surface, and the conductive belt is connected with the conductive layer and the edge of the antireflection layer.
Compared with the prior art, the beneficial effects of the manufacturing method of the photovoltaic packaging plate provided by the invention are the same as those of the photovoltaic packaging plate in the technical scheme, and the details are not repeated here.
In one implementation, forming the conductive layer on the first side includes: and forming a conductive layer on the first surface by adopting a chemical vapor deposition method or a magnetron sputtering method.
By adopting the technical scheme, the density and the purity of the conducting layer formed on the first surface can be effectively controlled by adopting a chemical vapor deposition method, so that the stability of the working performance of the conducting layer is ensured.
When the magnetron sputtering method is adopted, on one hand, the magnetron sputtering method has simple equipment and is easy to control. On the other hand, the conducting layer formed by the magnetron sputtering method is large in area and strong in adhesive force, and the tightness and firmness of the combination of the conducting layer and the packaging plate body can be ensured, so that the stability and the safety of the photovoltaic packaging plate and the photovoltaic assembly are ensured.
In one implementation, forming an anti-reflective layer on the second side includes: and forming an antireflection layer on the second surface by adopting a mode of rolling and coating an antireflection layer material.
By adopting the technical scheme, the antireflection layer formed on the second surface of the packaging plate body has the advantages of good temperature resistance, strong environmental protection, durability, freshness and firmness by adopting a roll coating mode.
In one implementation, after the conductive tape is formed at the edge of the package board body and along the direction in which the first surface extends toward the second surface, and the conductive tape connects the conductive layer and the edge of the antireflection layer, the method for manufacturing a photovoltaic package board further includes: and sintering the packaging plate body, the conducting layer, the antireflection layer and the conducting belt together.
In one implementation, after the package board body, the conductive layer, the antireflection layer, and the conductive tape are sintered together, the method for manufacturing a photovoltaic package board further includes: an insulating adhesive layer is formed overlying the conductive layer.
In a third aspect, the invention also provides a photovoltaic module. The photovoltaic module comprises a cover plate, a first adhesive film layer, a battery sheet layer, a second adhesive film layer and a back plate which are sequentially stacked from top to bottom.
The cover plate is the photovoltaic packaging plate adopting the technical scheme. And/or the back plate is the photovoltaic packaging plate in the technical scheme.
Compared with the prior art, the beneficial effects of the photovoltaic module provided by the invention are the same as those of the photovoltaic packaging plate in the technical scheme, and the details are not repeated here.
Drawings
The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description serve to explain the invention and not to limit the invention. In the drawings:
fig. 1 is a schematic view of a first structure of a photovoltaic packaging plate according to an embodiment of the present invention;
FIG. 2 is a schematic diagram of a second structure of a photovoltaic packaging board according to an embodiment of the present invention;
FIG. 3 is a schematic view of the charge distribution of the photovoltaic packaging plate and the cell sheet layer after being electrified according to the embodiment of the invention;
FIG. 4 is a schematic cross-sectional view of a package board body according to an embodiment of the invention;
FIG. 5 is a schematic cross-sectional view of the package board body and the conductive layer according to the embodiment of the present invention;
FIG. 6 is a schematic cross-sectional view of an encapsulation plate body, a conductive layer and an anti-reflection layer according to an embodiment of the invention;
FIG. 7 is a schematic cross-sectional structural view of a photovoltaic packaging plate according to an embodiment of the present invention;
fig. 8 is a schematic structural diagram of a photovoltaic module according to an embodiment of the present invention.
Reference numerals:
1-a photovoltaic packaging plate, wherein,
10-an antireflection layer, 11-a package plate body, 12-a conductive layer,
13-a conductive strip, 14-an insulating adhesive layer,
2-cover plate, 3-first adhesive film layer, 4-battery sheet layer,
5-a second adhesive film layer and 6-a back plate.
Detailed Description
In order to facilitate clear description of technical solutions of the embodiments of the present invention, in the embodiments of the present invention, terms such as "first" and "second" are used to distinguish the same items or similar items having substantially the same functions and actions. For example, the first threshold and the second threshold are only used for distinguishing different thresholds, and the sequence order of the thresholds is not limited. Those skilled in the art will appreciate that the terms "first," "second," etc. do not denote any order or quantity, nor do the terms "first," "second," etc. denote any order or importance.
It is to be understood that the terms "exemplary" or "such as" are used herein to mean serving as an example, instance, or illustration. Any embodiment or design described herein as "exemplary" or "e.g.," is not necessarily to be construed as preferred or advantageous over other embodiments or designs. Rather, use of the word "exemplary" or "such as" is intended to present concepts related in a concrete fashion.
In the present invention, "at least one" means one or more, "a plurality" means two or more. "and/or" describes the association relationship of the associated objects, meaning that there may be three relationships, e.g., a and/or B, which may mean: a exists alone, A and B exist simultaneously, and B exists alone, wherein A and B can be singular or plural. The character "/" generally indicates that the former and latter associated objects are in an "or" relationship. "at least one of the following" or similar expressions refer to any combination of these items, including any combination of the singular or plural items. For example, at least one (one) of a, b, or c, may represent: a, b, c, a and b combination, a and c combination, b and c combination, or a, b and c combination, wherein a, b and c can be single or multiple.
Solar energy is a renewable clean energy source which is not limited by regions, in recent years, with the development of photovoltaic technology, the photovoltaic power generation cost is rapidly reduced, the photovoltaic power generation technology is increasingly used in a large range, but with the popularization of photovoltaic power generation, the industry pays attention to the obvious attenuation of the power generation capacity due to the PID phenomenon after a plurality of photovoltaic modules are in service for a period of time, and some countries and regions have taken PID as one of the key requirements. Data from various photovoltaic module factories and research institutions indicate that PID is related to cell sheets, glass, glue films, system voltage, temperature and humidity, and is most relevant to photovoltaic glass in widespread use.
In the prior art, a photovoltaic module generally comprises a laminate, a junction box and a frame. The laminate generally includes a cover plate, a first adhesive film layer, a battery sheet layer, a second adhesive film layer, and a back plate, which are stacked in sequence from top to bottom. The cover plate and the back plate are usually made of glass.
Under the environment of high temperature and high humidity, a large amount of water vapor can be adsorbed on the surface of the glass, and at the moment, the alkali precipitation phenomenon is easy to occur on the surface of the glass. On the basis of this, alkali metal ions (for example Na) which can lead to the formation of glass surfaces+) Under the action of voltage, the glass moves to the battery sheet layer, and the moving speed of the glass is influenced by temperature, humidity, voltage and adhesive film. The alkali metal ions are then concentrated at the anti-reflective layer of the cell sheet. At the moment, PN junctions in the cell layers can be damaged, so that the PID phenomenon is generated, the photovoltaic effect of the cell layers is reduced, and the performance of the photovoltaic module is influenced.
At present, the PID problem is usually solved by increasing the volume resistivity of the adhesive film layer (the first adhesive film layer or the second adhesive film layer). However, the adhesive film layer may be aged and degraded during long-term service. Based on this, the volume resistivity of the glue film layer is still reduced, and the PID problem of the assembly is not fundamentally solved.
In order to solve the technical problem, in a first aspect, an embodiment of the present invention provides a photovoltaic package board. The photovoltaic packaging plate can be a cover plate in a photovoltaic module and can also be a back plate in the photovoltaic module. In the embodiments of the present invention, the glass cover plate is described as an example, and it should be understood that the following description is only for understanding and is not intended to be limiting.
Referring to fig. 1 and 2, the photovoltaic encapsulation plate 1 includes an antireflection layer 10, an encapsulation plate body 11, and a conductive layer 12, and a conductive tape 13 connecting the conductive layer 12 and the antireflection layer 10, which are sequentially laminated from top to bottom. The conductive layer 12 is a non-alkali metal ion conductive layer.
Referring to fig. 1 and 2, the specific positions, the number, and the like of the conductive strips 13 may be set according to actual conditions, and are not particularly limited as long as the conductive strips 13 can connect the conductive layer 12 and the anti-reflection layer 10.
Referring to fig. 1 to 3, when the photovoltaic packaging plate 1 and the cell sheet layer 4 are assembled together to form a photovoltaic module, a voltage is applied to the photovoltaic module. Specifically, one end of the antireflection layer 10 is connected with the positive electrode of the power supply, and the battery sheet layer 4 is connected with the negative electrode of the power supply. Since the conductive layer 12 and the antireflection layer 10 are electrically connected by the conductive tape 13, both the conductive layer 12 and the antireflection layer 10 are positively charged at this time, and there is no potential difference between the conductive layer 12 and the antireflection layer 10. Based on this, the alkali metal ions (e.g., Na) in the package board body 11 above the conductive layer 12+) Do not migrate into the conductive layer 12. And because the cell sheet 4 is connected with the negative electrode of the power supply, the cell sheet 4 is charged with negative charges. On this basis, a potential difference exists between the above-described cell sheet 4 and the conductive layer 12. However, since the conductive layer 12 does not contain alkali metal ions therein, and also, no alkali metal ions migrate from the package board body 11 into the conductive layer 12. Therefore, under the action of the above potential difference, no alkali metal ions migrate toward the cell sheet 4, and the PN junction in the cell sheet 4 is not broken. Based on the structure, the PID phenomenon of the photovoltaic module can be avoided, and the light of the cell sheet layer 4 is improvedThe photovoltaic effect and the performance of the photovoltaic module.
As a possible implementation, referring to fig. 1 and 2, the photovoltaic packaging board 1 may further include an insulating adhesive layer 14, and the insulating adhesive layer 14 is laminated with a surface of the conductive layer 12 facing away from the packaging board body 11. Specifically, in the actual use process, the insulating adhesive layer 14 is located between the conductive layer 12 and the first adhesive film layer of the photovoltaic module, so that the conductive layer 12 and the first adhesive film layer can be effectively adhered together. Since the antireflection layer 10, the package board body 11 and the conductive layer 12 are stacked together, the insulating adhesive layer 14 can firmly set the layers on the first adhesive film layer, so as to ensure the safety and stability of the assembled photovoltaic module.
It should be understood that the insulating adhesive layer may be disposed on the first adhesive film layer of the photovoltaic module instead of being disposed on the photovoltaic package board and laminated with the conductive layer. Then, in the actual use process, the conducting layer and the insulating bonding layer in the photovoltaic packaging plate are laminated together. At this moment, the insulating bonding layer still can be firmly connected the photovoltaic packaging board with first glued membrane layer together to ensure the security and the stability of the photovoltaic module after the equipment.
In an embodiment of the present invention, the first adhesive film layer or the second adhesive film layer may be one of ethylene-vinyl acetate copolymer (EVA), Polyolefin elastomer (POE), Polyvinyl Butyral (PVB), and ionomer. The first adhesive film layer or the second adhesive film layer may be the same material or may not be the same material.
In an alternative, referring to fig. 1-3, the insulating adhesive layer 14 may be a silicide insulating adhesive layer. Specifically, on the one hand, the insulating adhesive layer 14 is connected to the conductive layer 12 and is located between the conductive layer 12 and the cell sheet layer 4. When a voltage is applied to the photovoltaic module, there is no potential difference between the conductive layer 12 and the anti-reflective layer 10. Therefore, the alkali metal ion (e.g., Na) in the package board body 11+) Will not be in the conductive layer 12And thus does not migrate into the insulating adhesive layer 14. And because the cell sheet 4 is connected with the negative electrode of the power supply, the cell sheet 4 is charged with negative charges. Based on this, a potential difference exists between the above-described cell sheet layer 4 and the insulating adhesive layer 14. However, since the insulating adhesive layer 14 does not contain alkali metal ions, and there is no migration of alkali metal ions from the package board body 11 into the insulating adhesive layer 14. Therefore, under the action of the above potential difference, no alkali metal ions migrate toward the cell sheet 4, and the PN junction in the cell sheet 4 is not broken. Therefore, the photovoltaic module can be further prevented from generating a PID phenomenon, and the photovoltaic effect of the cell sheet layer 4 and the performance of the photovoltaic module are improved. On the other hand, the material cost of the insulating bonding layer can be saved by adopting the materials.
For example, the material of the silicide insulating adhesion layer may be at least one of silicon oxide or silicon dioxide. At the moment, on one hand, the insulating bonding layer and the first adhesive film layer can be well bonded together, so that the photovoltaic packaging plate and the first adhesive film layer are tightly connected, and the safety and the fixity of the assembled photovoltaic module are ensured. On the other hand, silicon monoxide or silicon dioxide has good light transmittance, and can improve the photoelectric conversion efficiency of the solar cell.
In an alternative, referring to fig. 1 and 2, the insulating adhesive layer 14 may be made of the same material as or different from that of the antireflection layer 10. When the insulating bonding layer 14 and the antireflection layer 10 are made of the same material, the light transmittance of the photovoltaic module can be further increased, and the photoelectric conversion efficiency of the solar cell can be improved. When the insulating bonding layer 14 and the antireflection layer 10 are made of different materials, the selectivity of raw materials for manufacturing the insulating bonding layer 14 and the antireflection layer 10 is increased, and the raw material cost of the insulating bonding layer 14 and the antireflection layer 10 is reduced. Illustratively, the material of the anti-reflective layer 10 may be SiN, ZnS, SiO2Or SiC, etc. In this case, the insulating adhesive layer 14 may be SiN, ZnS, SiO2Or SiC, etc.
In an alternative, the insulating adhesive layer has a thickness of 10nm to 100 nm. At this moment, on the one hand, can be effectual with the conducting layer together with first glued membrane layer bonding to ensure the security and the stability of photovoltaic module after the equipment. On the other hand, the packaging plate can also play an insulating role, so that alkali metal ions in the packaging plate body are further prevented from migrating to the cell sheet layer, the phenomenon of PID (proportion integration differentiation) of the photovoltaic module is further avoided, and the photovoltaic effect of the cell sheet layer and the performance of the photovoltaic module are improved. Illustratively, the thickness of the insulating adhesive layer may be 10nm, 20nm, 50nm, or 100 nm.
As a possible implementation, the conductive layer is a tin conductive layer, an indium conductive layer, or a zinc conductive layer. Specifically, the conductive layer made of the material has conductivity, so that the photovoltaic module can be prevented from generating a PID (proportion integration differentiation) phenomenon. Next, when the conductive layer is a tin-based conductive layer, ultraviolet rays having a wavelength of 300nm or less cannot penetrate the tin-based conductive layer. Therefore, the stannide conducting layer can block ultraviolet rays, the first adhesive film layer, the cell sheet layer and the like in the photovoltaic module are prevented from being damaged, and the outdoor power generation performance, the weather resistance and the safety performance of the photovoltaic module are improved.
In an alternative, where the conductive layer is a stannide conductive layer, the stannide conductive layer is a fluorine doped tin oxide conductive layer. In the case where the conductive layer is an indium compound conductive layer, the indium compound conductive layer is a tin-doped indium oxide conductive layer. In the case where the conductive layer is a zincate conductive layer, the zincate conductive layer is an aluminum-doped zinc oxide conductive layer.
For example, in the case that the stannide conductive layer is a fluorine-doped tin oxide conductive layer, the fluorine-doped tin oxide conductive layer has a refractive index of 1.4 to 1.8. And/or the fluorine-doped tin oxide conducting layer has a thickness of 5nm to 20 nm. And/or the fluorine content in the fluorine-doped tin oxide conducting layer is 0-50%. At this time, the light transmittance of the photovoltaic module can be increased, and the photoelectric conversion efficiency of the solar cell can be improved. For example, the fluorine-doped tin oxide conductive layer may have a refractive index of 1.4, 1.5, 1.6, 1.75, or 1.8. The fluorine-doped tin oxide conductive layer has a thickness of 5nm, 12nm, 18nm, or 20 nm. The fluorine content in the fluorine-doped tin oxide conductive layer is 0%, 12%, 30%, 45%, or 50%.
As a possible implementation, see FIG. 1 and the figure2, the conductive band 13 is arranged at the edge of the conductive layer 12 and the antireflection layer 10. Specifically, the conductive tape 13 does not occupy or excessively occupies the position on the package board body 11 for forming the "conductive layer 12 and the antireflection layer 10". At this time, a larger area of the conductive layer 12 and the antireflection layer 10 can be formed in a limited position of the surface of the package board body 11. On the one hand, this is advantageous for preventing alkali metal ions (for example, Na) from being present in the package plate body 11 when a voltage is applied to the photovoltaic module+) And the ions migrate into the conductive layer 12, so that the PN junction in the cell sheet layer is prevented from being damaged by alkali metal ions, the PID phenomenon of the photovoltaic module is avoided, and the photovoltaic effect of the cell sheet layer and the performance of the photovoltaic module are improved. On the other hand, when the antireflection layer 10 with a larger area is formed, the light transmittance of the photovoltaic module is increased, and the photoelectric conversion efficiency of the solar cell is further improved.
For example, referring to fig. 1 and 2, the conductive strip 13 may be disposed at a corner, a long side, a short side, or any other position of the edge. In the embodiment of the invention, four conductive strips 13 are arranged on the photovoltaic packaging board 1. At this time, the connectivity between the conductive layer 12 and the antireflection layer 10 can be enhanced, and it is ensured that there is no potential difference between the conductive layer 12 and the antireflection layer 10 when the photovoltaic module is powered on.
As a possible implementation manner, the conductive tape and the conductive layer are made of the same or different materials. Specifically, when the conductive band is the same as the material of conducting layer, can reduce the preparation degree of difficulty of conductive band and conducting layer to ensure that conductive band can effectual electricity connection conducting layer and antireflection layer, and then ensure when exerting voltage to photovoltaic module, there is not the potential difference between conducting layer and the antireflection layer. Therefore, the PID phenomenon of the photovoltaic module can be avoided, and the photovoltaic effect of the cell sheet layer and the performance of the photovoltaic module are improved. When the conductive band and the conductive layer are made of different materials, the selectivity of raw materials for manufacturing the conductive band and the conductive layer is increased, and the raw material cost of the conductive band and the conductive layer is reduced. In the embodiment of the invention, the conductive tape and the conductive layer are made of the same material and are fluorine-doped tin oxide.
Under the condition that the conductive belt and the conductive layer are made of the same material, the conductive belt and the conductive layer are integrally formed on the packaging plate body. At the moment, the manufacturing efficiency of the conductive belt and the conductive layer can be improved, meanwhile, the connection tightness and the connection fixity of the conductive belt and the conductive layer can be ensured, and further, the electric connection safety of the conductive belt and the conductive layer in the actual use process is ensured.
As a possible realization, the specific resistance value of the above conductive strip is 5 × 10-4Ωcm～5×10-3Omega cm. Specifically, when voltage is applied to the photovoltaic assembly, the conductive strips can be ensured to have good conductivity, so that no potential difference exists between the conductive layers and the antireflection layer, and the photovoltaic assembly is prevented from generating a PID (proportion integration differentiation) phenomenon. The specific resistance value of the conductive tape may be 5 × 10-4Ωcm、1.5×10-3Ωcm、2.3×10-3Ωcm、3.6×10-3Omega cm or 5X 10-3Ωcm。
As a possible implementation manner, the antireflection layer is at least one layer. And/or the refractive index of the antireflection layer is 1.2-1.6. And/or the thickness of the antireflection layer is 80nm to 200 nm. At the moment, the reflection of visible light can be reduced, the light transmittance of the photovoltaic module is increased, and the photoelectric conversion efficiency of the solar cell is improved. For example, the antireflection layer may be one layer, two layers or more. The refractive index of the antireflection layer may be 1.2, 1.3, 1.45, or 1.6. The thickness of the antireflection layer may be 80nm, 90nm, 180nm, or 200 nm. It should be understood that the refractive index of the antireflection layer and the thickness of the antireflection layer described above both refer to the refractive index of the entire antireflection layer and the thickness of the entire antireflection layer, and are not single layers.
As a possible implementation manner, the package board body may be ultra-white glass.
Example one: the packaging plate body is made of ultra-white patterned glass, the ultra-white patterned glass is made of double-suede ultra-white patterned glass, and the roughness of the double-suede ultra-white patterned glass is 0.2-2 um. At the moment, the antireflection layer, the conducting layer and the double-suede super-white patterned glass are combined more tightly, and firmness and safety of the photovoltaic packaging plate and the photovoltaic module are further ensured. The roughness of the double-textured super-white embossed glass can be 0.2um, 0.56um, 1.5um or 2 um.
Example two: the packaging plate body is made of ultra-white float glass, and a non-tin surface of the ultra-white float glass is laminated with the antireflection layer.
As a possible implementation manner, after the photovoltaic packaging board is manufactured, when the wavelength of visible light is 300nm to 1100nm, the light transmittance of the photovoltaic packaging board is greater than 90%. Based on this, above-mentioned photovoltaic packaging board can have good light transmission to improve solar cell's light absorption rate, and then improve solar cell's photoelectric conversion efficiency.
As a possible realization mode, the thickness of the manufactured photovoltaic packaging plate is 1.0-4.0 mm. At this time, on the one hand, the thickness of each layer forming the photovoltaic encapsulation sheet can be ensured to meet the actual need to ensure the stability of the function of each layer. On the other hand, the photovoltaic packaging plate can effectively protect the cell layer connected with the first adhesive film layer, the cell layer is prevented from being damaged or polluted, and the stability of the working performance of the photovoltaic module is further ensured. For example, the thickness of the photovoltaic encapsulation plate can be 1.0mm, 1.5mm, 2.0mm, 3.4mm or 4.0 mm.
As a possible implementation manner, the photovoltaic packaging plate is formed by sintering. At the moment, the adhesive force between the layers in the photovoltaic packaging plate can be improved, namely, the tightness and firmness of connection between the layers are improved, the safety of the photovoltaic packaging plate when the photovoltaic packaging plate is applied to a photovoltaic assembly is ensured, and the safety of the photovoltaic assembly is further ensured.
In a second aspect, the embodiment of the invention further provides a manufacturing method of the photovoltaic packaging plate. The manufacturing method of the photovoltaic packaging plate comprises the following steps:
referring to fig. 4, a package board body 11 is provided, the package board body 11 having a first face and a second face opposite to each other.
Specifically, the packaging plate body can be double-suede ultra-white patterned glass or ultra-white float glass, and the tin surface of the double-suede ultra-white patterned glass or the ultra-white float glass is subjected to pre-cleaning and drying treatment.
Referring to fig. 5, a conductive layer 12 is formed on the first side.
Specifically, the conductive layer may be formed on the first surface by a chemical vapor deposition method or a magnetron sputtering method. In an embodiment of the invention, the conductive layer is a fluorine-doped tin oxide conductive layer, and specific parameters thereof are not described in detail herein with reference to the foregoing description.
When the chemical vapor deposition method is adopted, the density and purity of the conductive layer formed on the first surface can be effectively controlled to ensure the stability of the working performance of the conductive layer. When the magnetron sputtering method is adopted, on one hand, the equipment of the magnetron sputtering method is simple and is easy to control. On the other hand, the conducting layer formed by the magnetron sputtering method is large in area and strong in adhesive force, and the tightness and firmness of the combination of the conducting layer and the packaging plate body can be ensured, so that the stability and the safety of the photovoltaic packaging plate and the photovoltaic assembly are ensured.
Referring to fig. 6, an antireflection layer 10 is formed on the second surface.
Specifically, referring to fig. 6, the second surface of the double-textured ultra-white embossed glass or the ultra-white float glass is pre-cleaned and dried. Then, an antireflection layer 10 is formed on the second surface by roll coating an antireflection layer material. When the roll coating method is adopted, the antireflection layer 10 formed on the second surface of the package board body 11 has the advantages of good temperature resistance, strong environmental protection, durability, freshness and firmness.
And a conductive belt is formed at the edge of the packaging plate body and along the direction extending from the first surface to the second surface, and the conductive belt is connected with the conductive layer and the edge of the antireflection layer.
Specifically, the conductive strips may be disposed at corners, long sides, short sides, or any other positions of the edges.
And then, sintering the packaging plate body, the conducting layer, the antireflection layer and the conducting belt together.
Referring to fig. 7, after the above-described package board body, conductive layer, antireflection layer and conductive tape are sintered together, an insulating adhesive layer 14 covering the conductive layer 12 is formed.
The beneficial effects of the method for manufacturing the photovoltaic packaging plate provided by the embodiment of the invention are the same as those of the photovoltaic packaging plate in the technical scheme, and are not repeated here.
In a third aspect, the embodiment of the invention further provides a photovoltaic module. Referring to fig. 8, the photovoltaic module includes a cover plate 2, a first adhesive film layer 3, a cell sheet layer 4, a second adhesive film layer 5 and a back plate 6, which are sequentially stacked from top to bottom.
The cover plate is the photovoltaic packaging plate adopting the technical scheme. And/or the back plate is the photovoltaic packaging plate in the technical scheme. Three possible implementations are described below as examples, it being understood that the following description is for understanding only and is not intended to be limiting.
Example one: when the cover plate is the photovoltaic packaging plate in the technical scheme, the back plate can be a polymer back plate made of KPE, KPF, TPF and the like, or a back plate made of metal back base materials such as aluminum zinc, aluminum magnesium manganese, zinc aluminum magnesium and magnesium, or a glass back plate. K may be Kynar membrane from arkema, but may also be referred to as polyvinylidene fluoride (abbreviated PVDF). The above P may be Polyethylene terephthalate (abbreviated as PET). The F may be a fluorine-containing coating. The E may be a polyolefin layer, and may be, for example, an ethylene-vinyl acetate copolymer (abbreviated as EVA), or a blend of EVA and polypropylene. The T may be a dupont Tedlar film. Illustratively, the KPE described above is a polymer backsheet formed from K, P, E three materials.
Example two: when the cover plate is a glass cover plate, the back plate is the photovoltaic packaging plate in the technical scheme.
Example three: when the cover plate is the photovoltaic packaging plate in the technical scheme, the back plate is also the photovoltaic packaging plate in the technical scheme.
In addition, the battery in the battery sheet layer can be a P-type battery or an N-type battery.
Further, the photovoltaic module can be packaged by a laminating machine, and can also be packaged by an autoclave.
The beneficial effects of the photovoltaic module provided by the embodiment of the invention are the same as those of the photovoltaic packaging plate in the technical scheme, and are not repeated herein.
While the invention has been described in connection with various embodiments, other variations to the disclosed embodiments can be understood and effected by those skilled in the art in practicing the claimed invention, from a review of the drawings, the disclosure, and the appended claims. In the claims, the word "comprising" does not exclude other elements or steps, and the word "a" or "an" does not exclude a plurality. A single processor or other unit may fulfill the functions of several items recited in the claims. The mere fact that certain measures are recited in mutually different dependent claims does not indicate that a combination of these measures cannot be used to advantage.
While the invention has been described in conjunction with specific features and embodiments thereof, it will be evident that various modifications and combinations can be made thereto without departing from the spirit and scope of the invention. Accordingly, the specification and figures are merely exemplary of the invention as defined in the appended claims and are intended to cover any and all modifications, variations, combinations, or equivalents within the scope of the invention. It will be apparent to those skilled in the art that various changes and modifications may be made in the present invention without departing from the spirit and scope of the invention. Thus, if such modifications and variations of the present invention fall within the scope of the claims of the present invention and their equivalents, the present invention is also intended to include such modifications and variations.

Claims (17)

1. A photovoltaic packaging plate is characterized by comprising an antireflection layer, a packaging plate body, a conducting layer and a conductive band, wherein the antireflection layer, the packaging plate body and the conducting layer are sequentially laminated from top to bottom;
the conducting layer is a non-alkali metal ion conducting layer.
2. The photovoltaic packaging board of claim 1, further comprising an insulating adhesive layer laminated with a face of the conductive layer facing away from the packaging board body.
3. The photovoltaic encapsulant plate of claim 1, wherein the conductive layer is a tin conductive layer, an indium conductive layer, or a zinc conductive layer.
4. The photovoltaic encapsulant plate of claim 3 wherein where the conductive layer is a stannide conductive layer, the stannide conductive layer is a fluorine doped tin oxide conductive layer;
in the case that the conductive layer is an indium compound conductive layer, the indium compound conductive layer is a tin-doped indium oxide conductive layer;
in the case where the conductive layer is a zincate conductive layer, the zincate conductive layer is an aluminum-doped zinc oxide conductive layer.
5. The photovoltaic encapsulant plate of claim 4, wherein, in the case that the stannide conductive layer is a fluorine-doped tin oxide conductive layer, the fluorine-doped tin oxide conductive layer has a refractive index of 1.4-1.8; and/or the presence of a gas in the gas,
the thickness of the fluorine-doped tin oxide conducting layer is 5 nm-20 nm; and/or the presence of a gas in the gas,
the fluorine content in the fluorine-doped tin oxide conducting layer is 0-50%.
6. The photovoltaic encapsulant sheet in accordance with claim 1, wherein the conductive tape is disposed at the edges of the conductive layer and anti-reflective layer; and/or the presence of a gas in the gas,
the conductive band and the conductive layer are made of the same or different materials; and/or the presence of a gas in the gas,
under the condition that the conductive belt and the conductive layer are made of the same material, the conductive belt and the conductive layer are integrally formed on the packaging plate body; and/or the presence of a gas in the gas,
the specific resistance value of the conductive belt is 5 multiplied by 10-4Ωcm～5×10-3Ωcm。
7. The photovoltaic encapsulant plate of claim 1 wherein the antireflective layer is at least one layer; and/or the presence of a gas in the gas,
the refractive index of the antireflection layer is 1.2-1.6; and/or the presence of a gas in the gas,
the thickness of the antireflection layer is 80 nm-200 nm.
8. The photovoltaic packaging plate of claim 1, wherein the packaging plate body is made of ultra-white patterned glass, the ultra-white patterned glass is made of double-textured ultra-white patterned glass, and the roughness of the double-textured ultra-white patterned glass is 0.2um to 2 um; or the like, or, alternatively,
the packaging plate body is made of ultra-white float glass, and a non-tin surface of the ultra-white float glass is laminated with the antireflection layer.
9. The photovoltaic encapsulant of claim 2, wherein the insulating tie layer is a silicide insulating tie layer.
10. The photovoltaic packaging plate of claim 9, wherein the silicide insulating bonding layer is made of at least one of silicon monoxide or silicon dioxide; and/or the presence of a gas in the gas,
the insulating bonding layer and the antireflection layer are made of the same or different materials; and/or the presence of a gas in the gas,
the thickness of the insulating bonding layer is 10 nm-100 nm.
11. The photovoltaic encapsulant of claim 1, wherein the photovoltaic encapsulant has a transmittance of greater than 90% at visible wavelengths of 300nm to 1100 nm; and/or the presence of a gas in the gas,
the thickness of the photovoltaic packaging plate is 1.0-4.0 mm; and/or the presence of a gas in the gas,
the photovoltaic packaging plate is formed by sintering.
12. A manufacturing method of a photovoltaic packaging plate is characterized by comprising the following steps:
providing a packaging plate body, wherein the packaging plate body is provided with a first face and a second face which are opposite;
forming a conductive layer on the first surface;
forming an antireflection layer on the second surface;
and forming a conductive belt at the edge of the packaging plate body along the direction extending from the first surface to the second surface, wherein the conductive belt is connected with the conductive layer and the edge of the antireflection layer.
13. The method of claim 12, wherein forming a conductive layer on the first side comprises:
and forming the conductive layer on the first surface by adopting a chemical vapor deposition method or a magnetron sputtering method.
14. The method of claim 12, wherein forming an anti-reflective layer on the second side comprises:
and forming an antireflection layer on the second surface in a mode of rolling and coating an antireflection layer material.
15. The method of claim 12, wherein after forming a conductive tape at the edge of the encapsulant body and along the direction extending from the first surface to the second surface, the conductive tape connecting the conductive layer and the edge of the anti-reflective layer, the method further comprises:
and sintering the packaging plate body, the conducting layer, the antireflection layer and the conductive belt together.
16. The method of claim 15, wherein after sintering the encapsulant body, the conductive layer, the anti-reflective layer, and the conductive tape together, the method further comprises:
and forming an insulating bonding layer covering the conductive layer.
17. A photovoltaic module is characterized by comprising a cover plate, a first adhesive film layer, a battery sheet layer, a second adhesive film layer and a back plate which are sequentially stacked from top to bottom;
the cover plate is the photovoltaic packaging plate as claimed in any one of claims 1 to 11; and/or the presence of a gas in the gas,
the back sheet is the photovoltaic packaging sheet of any one of claims 1 to 11.
CN202111070426.0A 2021-09-13 2021-09-13 Photovoltaic packaging plate, manufacturing method thereof and photovoltaic module Pending CN113793875A (en)

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