CN113782525A - Small-size LED device with built-in control IC and preparation method thereof - Google Patents
Small-size LED device with built-in control IC and preparation method thereof Download PDFInfo
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
- H01L25/167—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits comprising optoelectronic devices, e.g. LED, photodiodes
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- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
- G09G3/00—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes
- G09G3/20—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters
- G09G3/22—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources
- G09G3/30—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels
- G09G3/32—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels semiconductive, e.g. using light-emitting diodes [LED]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B45/00—Circuit arrangements for operating light-emitting diodes [LED]
- H05B45/30—Driver circuits
- H05B45/345—Current stabilisation; Maintaining constant current
Abstract
The invention relates to a small-sized LED device with a built-in control IC, which comprises: the device comprises a carrier plate, a three-channel constant current drive IC and an RGB chip with a vertical structure; the three-channel constant-current drive IC is fixedly arranged in the middle functional area of the carrier plate; the RGB chip is arranged on the vertical upper layer of the three-channel constant-current drive IC; and bottom electrodes of the RGB chips are respectively and correspondingly connected with and conduct an R constant-current output port bonding pad, a G constant-current output port bonding pad and a B constant-current output port bonding pad on the three-channel constant-current drive IC. The small-size LED device with the built-in control IC not only can effectively reduce the size of a device, but also solves the problem that the light emitting of an RGB chip is influenced by an IC chip.
Description
Technical Field
The invention belongs to the technical field of LEDs, and particularly relates to a small-size LED device with a built-in control IC and a preparation method thereof.
Background
1. The LED product internally provided with the three-channel constant current driving IC is integrally packaged, and comprises LED products of PLCC type and CHIP type. The LED product with the built-in driving IC is characterized in that each lamp bead is provided with an independent IC, the gray scale of each color of the red, green and blue LEDs can be improved to more than 256 levels, single-point full-color control can be realized, and the colors are diversified; the product is in single-wire or double-wire communication, and the application line is simple in design; the product is applied to the fields of colorful lamps, scene lighting, pixel screens, transparent LED display screens, glass LED screens and the like.
As shown in fig. 1, the CHIP-type LED includes a PCB, a red, green, and blue LED CHIP, and a three-channel constant current driver IC, wherein the front surface of the PCB is a copper-clad functional area, the back surface of the PCB is a copper-clad lead area, and the copper layer is provided with a metal layer such as electroplated nickel, silver, and gold. The red, green and blue LED light-emitting chips and the three-channel constant-current driving IC are arranged on different functional areas of a single pixel of the PCB, and separation gaps are formed among the functional areas; the driving IC and the LED chip are fixed on the substrate functional area through an adhesive, and the driving IC, the LED chip and the functional area are connected through bonding wires.
For PLCC type LEDs, a driving IC and an LED chip are placed in a functional area inside an inwards concave reflecting cup, and the functional area is provided with a separation gap; the driving IC and the LED chip are fixed on the substrate functional area through an adhesive, and the driving IC, the LED chip and the functional area are connected through bonding wires.
At present, full-color LED packaging plane sizes of built-in ICs on the market mainly comprise 5.0 x 5.0mm, 3.5 x 3.5mm, 2.2 x 2.2mm and 1.5 x 1.5mm, and the LED lamp beads are applied to colorful, scene lighting and pixel screens with excellent effects, but are applied to transparent LED display screens and glass screens, particularly to transparent screens with small spacing, so that the plane size of a device is reduced, and the full-color LED packaging plane sizes have important significance for improving the transparency of the transparent LED display screens.
Reason analysis: the driving IC and the LED chip are placed in the same plane, so that the occupied area is large; the area of the three-channel constant-current driving IC is larger, especially the area occupied by the IC with more functions is larger, so that the size of a packaged device is difficult to reduce; therefore, in the application of the transparent LED display screen, the pixel density cannot be increased, or the transparency is reduced by increasing the pixel density.
2. The driver IC and the LED chip are placed in the same plane of the substrate, the size and the height of the driver IC chip are larger than those of the LED chip, and the light emitting of the LED is influenced by the side IC.
3. In high definition RGB display screen chip field, formal dress, flip-chip and vertical structure "tripodia are ding", wherein with formal dress and the flip-chip structure of ordinary sapphire substrate comparatively common, vertical structure usually refers to the film LED chip through substrate stripping, and the new base plate of bonding or can not bond the base plate after the substrate stripping makes vertical chip. The LEDs with built-in ICs on the market at present all adopt normally-installed blue-green LED chips which are placed on independent functional areas on the same plane with a driving IC, and 2 electrodes of the chips need to be connected through bonding wires.
The vertical chip emits light uniformly, more importantly, the electrodes of the vertical chip are distributed on the front surface and the bottom surface of the chip, and the size of the chip is small; the bottom electrode is bonded by silver adhesive, and the front surface of the bottom electrode is connected by a bonding wire and can be fixed with a bonding pad of a current output channel of the IC chip, so that the occupied area of the LED chip is reduced. .
The centralized acquisition equipment used in the market at present is directionally developed by respective enterprises, has single function, fixed configuration mode and difficult expansion, and the GPRS module needs external integration, so that the equipment is not universal enough, has poor configuration, expansion and maintenance capabilities, limited application range and the like, and is difficult to exchange with equipment of other manufacturers.
Disclosure of Invention
Technical problem to be solved
Aiming at the existing technical problems, the invention provides a small-size LED device with a built-in control IC and a preparation method thereof, which not only can effectively reduce the size of a device, but also solves the problem that an IC chip influences the light emission of an RGB chip.
(II) technical scheme
In order to achieve the purpose, the invention adopts the main technical scheme that:
a small-sized LED device with a built-in control IC, comprising: the device comprises a carrier plate, a three-channel constant current drive IC and an RGB chip with a vertical structure;
the three-channel constant-current drive IC is fixedly arranged in the middle functional area of the carrier plate;
the RGB chip is arranged on the vertical upper layer of the three-channel constant-current drive IC;
and bottom electrodes of the RGB chips are respectively and correspondingly connected with and conduct an R constant-current output port bonding pad, a G constant-current output port bonding pad and a B constant-current output port bonding pad on the three-channel constant-current drive IC.
Preferably, the three-channel constant current driving IC is further provided with a plurality of external bonding pads;
the functional area of the carrier plate is also provided with a plurality of driving bonding pads corresponding to the plurality of external bonding pads;
and the plurality of external connection bonding pads are connected with the plurality of driving bonding pads by bonding wires.
Preferably, a power supply end bonding pad is further arranged on the functional region of the carrier plate;
the power end bonding pad is connected with the power interface bonding pad on the front side of the RGB chip through a bonding wire.
Preferably, the bottom surface electrode of the RGB chip is fixedly connected and conducted with the R constant current output port pad, the G constant current output port pad, and the B constant current output port pad by means of silver paste.
Preferably, the R constant current output port pads, the G constant current output port pads and the B constant current output port pads on the three-channel constant current driving IC are arranged linearly or in a shape like a Chinese character pin.
Preferably, the RGB chip includes: r chip, G chip and B chip;
when the chips are linearly arranged, the R chip, the G chip and the B chip are linearly arranged;
when the chips are arranged in a shape like the Chinese character 'pin', the R chips, the G chips and the B chips are arranged in a shape like the Chinese character 'pin'.
Preferably, the size of the carrier plate is less than 1.5 x 1.5 mm;
the number of the bonding wires is not more than 9.
The technical scheme also provides a preparation method of the small-size LED device with the built-in control IC based on the scheme, which comprises the following steps:
s1, arranging and fixing a three-channel constant current driving IC on the carrier plate;
s2, respectively placing silver glue and/or tin paste for bonding and conducting on an R constant-current output port bonding pad, a G constant-current output port bonding pad and a B constant-current output port bonding pad on the three-channel constant-current drive IC;
s3, placing a R chip, a G chip and a B chip of a vertical structure on the silver adhesive of the R constant-current output port bonding pad, the G constant-current output port bonding pad and the B constant-current output port bonding pad respectively, fixing the RGB chips after the silver adhesive is hardened, and conducting bottom electrodes of the RGB chips of the vertical structure with the R constant-current output port bonding pad, the G constant-current output port bonding pad and the B constant-current output port bonding pad of the three-channel constant-current drive IC;
and S4, after the R chip, the G chip and the B chip are fixed, connecting a power interface bonding pad on the front surface of the RGB chip with a power end bonding pad on the substrate through a bonding wire, and simultaneously connecting a plurality of driving bonding pads on the IC chip with corresponding external bonding pads on the substrate respectively.
(III) advantageous effects
The invention has the beneficial effects that: the small-size LED device with the built-in control IC and the preparation method thereof provided by the invention have the following beneficial effects:
(1) the occupied area of the single-pixel-point substrate is reduced, and the size of a device can be effectively reduced; devices of 0.8 x 0.8mm size can be designed. For a transparent LED screen with the dot spacing of 5mm, 1.5 × 1.5mm devices are used, and the area ratio of the devices to the display screen is 9%; if a device with the size of 0.8 x 0.8mm is used, the area ratio of the device to the display screen is 2.56%, and under the condition of the same wiring width, the transparency of the transparent screen is improved by 6%.
(2) The use amount of the bonding wires is reduced, and the original 11 bonding wires are reduced to 9 bonding wires.
(3) The light-emitting effect of the device is optimized, the RGB devices are located on the same plane, the light-emitting light shape is not affected by the IC chip, the light is emitted uniformly, and the display effect of the transparent LED display screen is improved.
Drawings
Fig. 1 is a schematic structural diagram of an LED product with a built-in three-channel constant current driving IC in the background art of a small-sized LED device with a built-in control IC and a manufacturing method thereof according to the present invention;
fig. 2 is a schematic structural diagram of a small-sized LED device with a built-in control IC and the device in step S1 in the manufacturing method thereof according to the present invention;
fig. 3 is a schematic structural diagram of a small-sized LED device with a built-in control IC and the device in step S2 in the manufacturing method thereof according to the present invention;
fig. 4 is a schematic structural diagram of a small-sized LED device with a built-in control IC and the device in step S3 in the manufacturing method thereof according to the present invention;
fig. 5 is a schematic structural diagram of a small-sized LED device with a built-in control IC and the device in step S4 in the manufacturing method thereof according to the present invention;
fig. 6 is a schematic structural diagram of a small-sized LED device with a built-in control IC and a device for optimizing a pad position of a three-channel constant current driving IC in a manufacturing method of the small-sized LED device.
Detailed Description
For the purpose of better explaining the present invention and to facilitate understanding, the present invention will be described in detail by way of specific embodiments with reference to the accompanying drawings.
As shown in fig. 5 and shown: the embodiment discloses a small-size LED device with a built-in control IC, which comprises: the device comprises a carrier plate, a three-channel constant current drive IC and an RGB chip with a vertical structure; the three-channel constant-current drive IC is fixedly arranged in the middle functional area of the carrier plate; the RGB chip is arranged on the vertical upper layer of the three-channel constant-current drive IC; and bottom electrodes of the RGB chips are respectively and correspondingly connected with and conduct an R constant-current output port bonding pad, a G constant-current output port bonding pad and a B constant-current output port bonding pad on the three-channel constant-current drive IC.
The three-channel constant current driving IC is also provided with a plurality of external bonding pads; the functional area of the carrier plate is also provided with a plurality of driving bonding pads corresponding to the plurality of external bonding pads; and the plurality of external connection bonding pads are connected with the plurality of driving bonding pads by bonding wires.
In this embodiment, a power supply terminal pad is further disposed on the functional region of the carrier board; the power end bonding pad is connected with the power interface bonding pad on the front side of the RGB chip through a bonding wire.
In this embodiment, the bottom electrodes of the RGB chip are fixedly connected and connected to the R constant current output port pad, the G constant current output port pad, and the B constant current output port pad by means of silver paste.
In this embodiment, the R constant current output port pads, the G constant current output port pads, and the B constant current output port pads on the three-channel constant current driving IC are arranged linearly or in a shape like a Chinese character 'pin'.
In this embodiment, the RGB chip includes: r chip, G chip and B chip.
As shown in fig. 5: when the chips are arranged linearly, the R chip, the G chip and the B chip are arranged linearly.
As shown in fig. 6: when the chips are arranged in a shape like the Chinese character 'pin', the R chips, the G chips and the B chips are arranged in a shape like the Chinese character 'pin'.
It should be noted that: the R constant current output port bonding pads, the G constant current output port bonding pads and the B constant current output port bonding pads are arranged in a linear mode or a 'pin' mode.
The dimensions of the carrier plate described in this embodiment are less than 1.5 x 1.5mm, with a preferred dimension of 0.8 x 0.8 mm; the number of the bonding wires is not more than 9, and the number of the bonding wires is 9.
The embodiment also provides a preparation method of the small-size LED device with the built-in control IC based on the scheme, which comprises the following steps:
as shown in fig. 2: s1, arranging and fixing a three-channel constant current driving IC on the carrier plate;
as shown in fig. 3: s2, respectively placing silver glue and/or tin paste for bonding and conducting on an R constant-current output port bonding pad, a G constant-current output port bonding pad and a B constant-current output port bonding pad on the three-channel constant-current drive IC;
as shown in fig. 4: s3, placing a R chip, a G chip and a B chip of a vertical structure on the silver adhesive of the R constant-current output port bonding pad, the G constant-current output port bonding pad and the B constant-current output port bonding pad respectively, fixing the RGB chips after the silver adhesive is hardened, and conducting bottom electrodes of the RGB chips of the vertical structure with the R constant-current output port bonding pad, the G constant-current output port bonding pad and the B constant-current output port bonding pad of the three-channel constant-current drive IC;
as shown in fig. 5: and S4, after the R chip, the G chip and the B chip are fixed, connecting a power interface bonding pad on the front surface of the RGB chip with a power end bonding pad on the substrate through a bonding wire, and simultaneously connecting a plurality of driving bonding pads on the IC chip with corresponding external bonding pads on the substrate respectively.
In practical applications, the size of the carrier or the reflective cup and the size of the functional area pad can be reduced for a device with a PLCC structure type according to the method in the embodiment.
The LED device prepared by the method in the embodiment also has the following advantages:
(1) the occupied area of the single-pixel-point substrate is reduced, and the size of a device can be effectively reduced; devices of 0.8 x 0.8mm size can be designed. For a transparent LED screen with the dot spacing of 5mm, 1.5 × 1.5mm devices are used, and the area ratio of the devices to the display screen is 9%; if a device with the size of 0.8 x 0.8mm is used, the area ratio of the device to the display screen is 2.56%, and under the condition of the same wiring width, the transparency of the transparent screen is improved by 6%.
(2) The use amount of the bonding wires is reduced, and the original 11 bonding wires are reduced to 9 bonding wires.
(3) The light-emitting effect of the device is optimized, the RGB devices are located on the same plane, the light-emitting light shape is not affected by the IC chip, the light is emitted uniformly, and the display effect of the transparent LED display screen is improved.
The technical principles of the present invention have been described above in connection with specific embodiments, which are intended to explain the principles of the present invention and should not be construed as limiting the scope of the present invention in any way. Based on the explanations herein, those skilled in the art will be able to conceive of other embodiments of the present invention without inventive efforts, which shall fall within the scope of the present invention.
Claims (8)
1. A small-sized LED device with a built-in control IC, comprising: the device comprises a carrier plate, a three-channel constant current drive IC and an RGB chip with a vertical structure;
the three-channel constant-current drive IC is fixedly arranged in the middle functional area of the carrier plate;
the RGB chip is arranged on the vertical upper layer of the three-channel constant-current drive IC;
and bottom electrodes of the RGB chips are respectively and correspondingly connected with and conduct an R constant-current output port bonding pad, a G constant-current output port bonding pad and a B constant-current output port bonding pad on the three-channel constant-current drive IC.
2. The LED apparatus of claim 1,
the three-channel constant current driving IC is also provided with a plurality of external bonding pads;
the functional area of the carrier plate is also provided with a plurality of driving bonding pads corresponding to the plurality of external bonding pads;
and the plurality of external connection bonding pads are connected with the plurality of driving bonding pads by bonding wires.
3. The LED apparatus of claim 2,
a power supply end bonding pad is also arranged on the functional area of the carrier plate;
the power end bonding pad is connected with the power interface bonding pad on the front side of the RGB chip through a bonding wire.
4. The LED apparatus of claim 3,
and the bottom surface electrode of the RGB chip is fixedly connected and conducted with the R constant current output port bonding pad, the G constant current output port bonding pad and the B constant current output port bonding pad by means of silver paste.
5. The LED apparatus of claim 4,
and the R constant current output port bonding pads, the G constant current output port bonding pads and the B constant current output port bonding pads on the three-channel constant current driving IC are arranged in a linear or 'product' shape.
6. The LED apparatus of claim 5,
the RGB chip includes: r chip, G chip and B chip;
when the chips are linearly arranged, the R chip, the G chip and the B chip are linearly arranged;
when the chips are arranged in a shape like the Chinese character 'pin', the R chips, the G chips and the B chips are arranged in a shape like the Chinese character 'pin'.
7. The LED apparatus of claim 5,
the size of the carrying plate is less than 1.5 x 1.5 mm;
the number of the bonding wires is not more than 9.
8. A method for manufacturing a small-sized LED device based on the built-in control IC of any one of claims 1 to 7, comprising the steps of:
s1, arranging and fixing a three-channel constant current driving IC on the carrier plate;
s2, respectively placing silver glue and/or tin paste for bonding and conducting on an R constant-current output port bonding pad, a G constant-current output port bonding pad and a B constant-current output port bonding pad on the three-channel constant-current drive IC;
s3, placing a R chip, a G chip and a B chip of a vertical structure on the silver adhesive of the R constant-current output port bonding pad, the G constant-current output port bonding pad and the B constant-current output port bonding pad respectively, fixing the RGB chips after the silver adhesive is hardened, and conducting bottom electrodes of the RGB chips of the vertical structure with the R constant-current output port bonding pad, the G constant-current output port bonding pad and the B constant-current output port bonding pad of the three-channel constant-current drive IC;
and S4, after the R chip, the G chip and the B chip are fixed, connecting a power interface bonding pad on the front surface of the RGB chip with a power end bonding pad on the substrate through a bonding wire, and simultaneously connecting a plurality of driving bonding pads on the IC chip with corresponding external bonding pads on the substrate respectively.
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Application publication date: 20211210 |