CN113770881B - Method for aligning grinding head and workpiece and grinding equipment - Google Patents

Method for aligning grinding head and workpiece and grinding equipment Download PDF

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Publication number
CN113770881B
CN113770881B CN202111127968.7A CN202111127968A CN113770881B CN 113770881 B CN113770881 B CN 113770881B CN 202111127968 A CN202111127968 A CN 202111127968A CN 113770881 B CN113770881 B CN 113770881B
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China
Prior art keywords
workpiece
grinding
grinding head
measuring sensor
thickness
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CN202111127968.7A
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CN113770881A (en
Inventor
李帅
姜栋
郑倩倩
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Sany Construction Robot Xian Research Institute Co Ltd
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Sany Construction Robot Xian Research Institute Co Ltd
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B27/00—Other grinding machines or devices
    • B24B27/02—Bench grinders
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/005—Feeding or manipulating devices specially adapted to grinding machines
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/007—Weight compensation; Temperature compensation; Vibration damping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/04—Headstocks; Working-spindles; Features relating thereto
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/06—Work supports, e.g. adjustable steadies
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/006—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation taking regard of the speed
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/16—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation taking regard of the load

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)

Abstract

The invention relates to the technical field of part processing, in particular to a method for zero alignment of a grinding head and a workpiece. The method for aligning the grinding head with the workpiece comprises the following steps: moving the workpiece to a first preset position (S1, 0); acquiring a workpiece thickness value D; determining a lowering rate of the grinding head based on the thickness value D of the workpiece such that the grinding head is lowered to the grinding start position (S1 + S2, D) while the workpiece is moved to the second preset position (S1 + S2, 0). According to the zero alignment method of the grinding head and the workpiece, provided by the invention, the descending rate of the grinding head is determined based on the thickness value D of the workpiece, so that the grinding head descends to the grinding initial position (S1 + S2, D) while the workpiece moves to the second preset position (S1 + S2, 0), and the grinding head can be flush with the surface of the workpiece when the workpiece is transported to a grinding area, so that the rough zero alignment is just completed, the zero alignment time is saved, the zero alignment efficiency is improved, and the production rhythm is not influenced.

Description

Method for aligning grinding head and workpiece and grinding equipment
Technical Field
The invention relates to the technical field of part processing, in particular to a method for aligning a grinding head and a workpiece.
Background
In industrial production, in order to improve the performance of part products, workpieces need to be polished, wherein zero alignment is an important step in polishing, namely the relative position of a grinding head and the workpieces when polishing is started is searched for zero alignment, and zero alignment is inaccurate, so that the polishing is too heavy or too light, and the polishing quality is directly determined. However, in the actual process, zero alignment operation is influenced by two factors of workpiece thickness and abrasive loss, and aiming at the problem that the thickness difference of the workpiece is large and the equipment cannot be adjusted in a self-adaptive thickness mode, the thickness is usually calibrated manually in the traditional technology, then the relative position of a grinding belt and the workpiece is adjusted, and the zero point position of sanding is judged manually, so that the efficiency is low, the human factors are large, and the precision and the consistency cannot be guaranteed; the grinding head is gradually worn, the relative position of the grinding head and the workpiece is continuously influenced, zero deviation is gradually increased, and grinding quality glides. In order to solve the problems, in the prior art, a work piece is sent to the position below a sanding contact roller, a work conveying table is lifted, when the surface of the work piece is in contact with an abrasive belt and drives the sanding contact roller to rotate, a signal of the rotation of the sanding contact roller is output to a controller, the controller instructs the work conveying table to stop lifting, and at the moment, the zero alignment action of the work piece and the abrasive belt is completed. However, the whole zero-aligning process of the method is carried out in the sanding area, and the time is long; and the contact roller is driven by friction to judge zero alignment, the standard is solidified, the polishing force and the polishing effect cannot be adjusted, and different polishing requirements cannot be met.
Disclosure of Invention
Therefore, the technical problem to be solved by the invention is to overcome the defects that zero alignment consumes a long time and cannot meet different polishing precision requirements in the prior art, so that a method for aligning the grinding head and the workpiece, which can improve the efficiency and meet different polishing precision requirements, is provided.
The invention aims to solve another technical problem of overcoming the defects that the zero alignment time of the polishing equipment in the prior art is long and the polishing equipment cannot meet different polishing precision requirements, thereby providing the polishing equipment capable of realizing efficient and accurate zero alignment.
In order to solve the technical problem, the invention provides a method for aligning a grinding head and a workpiece, which comprises the following steps:
moving the workpiece to a first preset position (S1, 0);
acquiring a workpiece thickness value D;
determining a lowering rate of the grinding head based on the workpiece thickness value D such that the grinding head is lowered to a grinding start position (S1 + S2, D) while the workpiece is moved to a second preset position (S1 + S2, 0).
Optionally, a travel switch is arranged at the first preset position (S1, 0), and the workpiece thickness value D is obtained by a thickness measuring sensor located at the coordinates (0, h);
moving the work piece to first preset position (S1, 0), obtaining work piece thickness value D, including:
driving the workpiece to move along a preset direction;
and when the workpiece touches the travel switch, starting the thickness measuring sensor to acquire the workpiece thickness value D of the workpiece.
Optionally, before the obtaining the workpiece thickness value D, the method further includes:
judging whether the radiation range of the thickness measuring sensor is on the upper surface of the workpiece or not;
when (H-d) 1 )tan(α/2)<S1 is, and (H-d) 1 )tan(α/2)<L-S1, determining that the radiation range of the thickness measuring sensor is all on the upper surface of the workpiece;
wherein H is the height of the thickness measuring sensor from a reference plane (X, 0), d 1 The minimum value of the thickness value of the workpiece is obtained, alpha is the full emission angle of the thickness measuring sensor, S1 is the horizontal distance between the thickness measuring sensor and the travel switch, and L is the minimum length of the workpiece.
Optionally, the determining a lowering rate of the grinding head based on the workpiece thickness value D so that the grinding head is lowered to the grinding start position (S1 + S2, D) while the workpiece is moved to the second preset position (S1 + S2, 0), includes:
determining the rate of decline as: v. of 1 ＝(h-d 2 )/(s/v 2 )，
Wherein h is the height difference between the grinding head and a reference surface (X, 0), and d 2 Is the maximum value of the thickness value of the workpiece, s is the horizontal distance between the travel switch and the grinding head, v 2 Is the speed of travel of the workpiece.
Optionally, after the grinding head descends to the grinding start position (S1 + S2, D), the method further includes:
continuously downwards regulating the grinding head until the positive pressure of the grinding head and the workpiece reaches a preset threshold value;
and starting the grinding head to operate.
The invention provides a grinding apparatus comprising:
a method for carrying out the alignment of a grinding head with a workpiece as described above, the grinding apparatus comprising: an epitaxial transport table, the epitaxial transport table comprising: a conveying unit adapted to support and convey a workpiece; and the thickness measuring sensor is arranged right above the conveying unit and is suitable for measuring the thickness value D of the workpiece.
Optionally, the epitaxial conveying table further includes: and the travel switch is arranged in front of the thickness measuring sensor along the workpiece conveying direction and is suitable for controlling the starting of the thickness measuring sensor.
Optionally, the grinding device further comprises: the grinding assembly is suitable for grinding the workpiece and is provided with a grinding head;
and the lifting assembly is suitable for controlling the lifting of the grinding assembly.
Optionally, the lifting assembly comprises: a force sensor coupled to the grinding assembly and adapted to monitor a positive pressure between the grinding assembly and the workpiece;
a floating joint adapted to connect the abrading assembly and adapted to provide cushioning when the abrading assembly contacts the workpiece.
Optionally, the grinding apparatus further comprises: and the polishing platform is arranged right below the polishing assembly, is connected with the conveying unit and is suitable for supporting the workpiece.
The technical scheme of the invention has the following advantages:
1. according to the method for zero alignment of the grinding head and the workpiece, provided by the invention, the descending speed of the grinding head is determined based on the workpiece thickness value D, so that the grinding head descends to the grinding initial position (S1 + S2, D) while the workpiece moves to the second preset position (S1 + S2, 0), and when the workpiece is transported to the grinding area, the grinding head can be flush with the surface of the workpiece, the rough zero alignment is just completed, the zero alignment time is saved, the zero alignment efficiency is improved, and the production rhythm is not influenced.
2. According to the method for zero alignment of the grinding head and the workpiece, provided by the invention, the thickness measuring sensor is started to obtain the workpiece thickness value D of the workpiece when the workpiece touches the travel switch, so that the thickness measuring sensor is started again when the workpiece moves to the preset position (S1, 0), the radiation range is prevented from being out of the workpiece due to the fact that the thickness measuring sensor is started in advance, and the value out of the workpiece thickness value is prevented from being obtained, so that the reliability and the stability of the measuring result are ensured.
3. According to the method for zero alignment of the grinding head and the workpiece, after the grinding head descends to the grinding initial position (S1 + S2, D), the grinding head is continuously adjusted downwards until the positive pressure of the grinding head and the workpiece reaches a preset threshold value, so that whether zero alignment is completed or not is judged by utilizing the positive pressure feedback of the grinding head and the workpiece, and when the force reaches the set threshold value, precise zero alignment is completed, so that the grinding force is directly ensured, the grinding effect is ensured, and the loss of the grinding head can be automatically compensated.
4. According to the polishing equipment provided by the invention, the conveying unit is arranged to support and convey the workpiece, the thickness measuring sensor and the travel switch are arranged, the travel switch is used for controlling the starting of the thickness measuring sensor, so that the thickness of the workpiece is automatically detected, and the travel switch is arranged in front of the thickness measuring sensor along the conveying direction of the workpiece, so that when the travel switch is touched and started, the workpiece is positioned in the radiation range of the thickness measuring sensor, and the thickness measuring accuracy is ensured.
5. According to the polishing equipment provided by the invention, the lifting assembly is connected with the polishing assembly through the force sensor, so that the positive pressure between the polishing assembly and the workpiece is collected, the polishing assembly is controlled to be started or stopped according to the fact that the positive pressure reaches a preset threshold value, the accurate zero alignment is realized, meanwhile, the floating joint is arranged, the buffer is provided when the polishing assembly contacts the workpiece, and the polishing assembly is prevented from being directly touched to cause impact damage to the polishing assembly.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and other drawings can be obtained by those skilled in the art without creative efforts.
Fig. 1 is a schematic structural view of the sanding apparatus of the present invention.
Description of reference numerals:
1. an epitaxial transport table; 11. a thickness measuring sensor; 12. a travel switch; 13. a caster wheel; 14. a ground brake; 15. a delivery stent; 16. a conveying unit;
2. a lifting assembly; 21. a lifting motor; 22. a lifter; 23. a force sensor; 24. a floating joint;
3. polishing the assembly; 31. polishing the motor; 32. a belt; 33. grinding heads; 34. a bearing; 35. a guide shaft;
4. a support; 5. and (7) polishing the platform.
Detailed Description
The technical solutions of the present invention will be described clearly and completely with reference to the accompanying drawings, and it should be understood that the described embodiments are some, but not all embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplicity of description, but do not indicate or imply that the device or element referred to must have a particular orientation, be constructed in a particular orientation, and be operated, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.
In addition, the technical features involved in the different embodiments of the present invention described below may be combined with each other as long as they do not conflict with each other.
The method for aligning the grinding head and the workpiece provided by the embodiment comprises the following steps:
moving the workpiece to a first preset position (S1, 0);
acquiring a workpiece thickness value D;
determining a lowering rate of the grinding head based on the workpiece thickness value D such that the grinding head is lowered to the grinding start position (S1 + S2, D) while the workpiece is moved to a second preset position (S1 + S2, 0).
The workpiece is a product component which needs to be polished, and is horizontally placed on polishing equipment and is transferred and moved in a certain direction in a horizontal plane; constructing a rectangular coordinate system by taking a horizontal plane for placing the workpiece as a reference plane, wherein the origin of the rectangular coordinate system is a projection point of the thickness measuring sensor on the reference plane, the X-axis direction is the advancing direction of the workpiece, and the Y-axis direction is the vertical direction perpendicular to the horizontal plane; the thickness measuring sensor is used for acquiring the thickness value of the workpiece.
According to the method for zero alignment of the grinding head and the workpiece, the lowering rate of the grinding head is determined based on the workpiece thickness value D, so that the workpiece is moved to the second preset position (S1 + S2, 0) and the grinding head is lowered to the grinding starting position (S1 + S2, D), when the workpiece is transported to the grinding area, the grinding head can be flush with the surface of the workpiece, the rough zero alignment is just completed, the zero alignment time is saved, the zero alignment efficiency is improved, and the production rhythm is not influenced.
Specifically, a travel switch 12 is arranged at the first preset position (S1, 0), and the workpiece thickness value D is obtained by a thickness measuring sensor 11 located at coordinates (0, h);
the moving of the workpiece to a first preset position (S1, 0) obtains a workpiece thickness value D, including:
driving the workpiece to move along a preset direction;
when the workpiece touches the travel switch 12, the thickness measuring sensor 11 is started to acquire the workpiece thickness value D of the workpiece.
It should be noted that the preset direction refers to an advancing direction of the workpiece.
According to the zero alignment method of the grinding head and the workpiece, provided by the invention, the thickness measuring sensor 11 is started to obtain the workpiece thickness value D of the workpiece when the workpiece touches the travel switch 12, so that the thickness measuring sensor 11 is started again when the workpiece moves to the preset position (S1, 0), the radiation range is prevented from being beyond the workpiece due to the fact that the thickness measuring sensor 11 is started in advance, and the value beyond the workpiece thickness value is prevented from being obtained, so that the reliability and the stability of the measuring result are ensured.
Specifically, the obtaining the workpiece thickness value D further comprises:
judging whether the radiation range of the thickness measuring sensor 11 is on the upper surface of the workpiece;
when (H-d) 1 )tan(α/2)<S1 is, and (H-d) 1 )tan(α/2)<L-S1, determining that the radiation range of the thickness measuring sensor 11 is all on the upper surface of the workpiece;
wherein H is the height of the thickness measuring sensor 11 from a reference plane (X, 0), d 1 The minimum value of the thickness value of the workpiece is defined, alpha is the total emission angle of the thickness measuring sensor 11, S1 is the horizontal distance between the thickness measuring sensor 11 and the travel switch 12, and L is the minimum length of the workpiece.
Preferably, the upper surface of the workpiece is uneven, so that the workpiece thickness values D of the workpiece at different positions are not completely consistent, and the minimum value of the workpiece thickness values D is D 1 The maximum value of the workpiece thickness value D is D 2 。
Preferably, the radiation range of the thickness measuring sensor 11 is a conical radiation range with the thickness measuring sensor as an emission point, and the formula (H-d) 1 )tan(α/2)<S1 for ensuringThe radiation range on the right side of the thickness measuring sensor 11 is all on the upper surface of the workpiece; the formula (H-d) 1 )tan(α/2)<L-S1 is used to ensure that the radiation range of the left side of the thickness measuring sensor 11 is all on the upper surface of the workpiece, thereby ensuring that the radiation range of the thickness measuring sensor 11 is all on the upper surface of the workpiece.
Wherein, referring to fig. 1, the right side refers to the right side of the thickness sensor 11 indicated by an arrow in fig. 1, and the left side refers to the left side of the thickness sensor 11 indicated by an arrow in fig. 1.
Specifically, the determining a lowering rate of the grinding head based on the workpiece thickness value D so that the grinding head is lowered to a grinding start position (S1 + S2, D) while the workpiece is moved to a second preset position (S1 + S2, 0) includes:
determining the rate of decline as: v. of 1 ＝(h-d 2 )/(s/v 2 )，
Wherein h is the height difference between the grinding head and a reference surface (X, 0), and d 2 Is the maximum value of the thickness value of the workpiece, and S is the horizontal distance between the travel switch 12 and the grinding head, i.e. S = S2, v 2 Is the speed of travel of the workpiece.
It should be noted that when the workpiece is moved to the second preset position (S1 + S2, 0), the rightmost side of the grinding head is located at the starting position of the ground region of the workpiece.
Preferably, the workpiece thickness value D of the grinding start position (S1 + S2, D) is a maximum value D of the workpiece thickness values 2 Namely, when the grinding head descends to the grinding initial position (S1 + S2, D), the grinding head descends to be flush with the highest point of the upper surface of the workpiece, and coarse zero alignment is completed.
Preferably, the time taken for the workpiece to move from the position of the travel switch 12 to the grinding start position is t 1 ＝s/v 2 The distance of the grinding head descending is h-d in the same time 2 Then the rate of descent of the grinding head is v 1 ＝(h-d 2 )/t 1 ＝(h-d 2 )/(s/v 2 )。
Specifically, the method further comprises the following steps after the grinding head descends to the grinding starting position (S1 + S2, D):
continuously downwards regulating the grinding head until the positive pressure of the grinding head and the workpiece reaches a preset threshold value;
and starting the grinding head to operate.
According to the method for zero alignment of the grinding head and the workpiece, after the grinding head descends to the grinding initial position (S1 + S2, D), the grinding head is continuously adjusted downwards until the positive pressure of the grinding head and the workpiece reaches a preset threshold value, so that whether zero alignment is completed or not is judged by utilizing the positive pressure feedback of the grinding head and the workpiece, and when the force reaches the set threshold value, precise zero alignment is completed, so that the grinding force is directly ensured, the grinding effect is ensured, and the loss of the grinding head can be automatically compensated.
Example two
As shown in fig. 1, the present embodiment provides a polishing apparatus, including:
a method for carrying out the alignment of a grinding head with a workpiece as described above, the grinding apparatus comprising: an epitaxial transport table 1, the epitaxial transport table 1 comprising: a conveying unit 16 adapted to support and convey the workpiece; and the thickness measuring sensor 11 is arranged right above the conveying unit 16 and is suitable for measuring the thickness value D of the workpiece.
Preferably, the conveyor unit 16 comprises a roller or a belt.
Preferably, the conveying unit 16 drives the workpiece to move on the epitaxial conveying table 1, and when the workpiece touches the travel switch 12, the thickness measuring sensor 11 is started.
Specifically, the epitaxial transport table 1 further includes: and the travel switch 12 is arranged in front of the thickness measuring sensor 11 along the workpiece conveying direction and is suitable for controlling the starting of the thickness measuring sensor 11.
The front direction refers to the direction "front" indicated by an arrow in fig. 1, and is the same direction as the right side.
Preferably, the epitaxial transport table 1 further includes: the caster 13 and the ground brake 14 are arranged at the lower end of the extension conveying table 1 and are in contact with the ground, the extension conveying table is an independent device, the caster 13 is suitable for freely moving the extension conveying table 1, and the ground brake 14 is suitable for stably placing the extension conveying table 1;
a transport support 15 adapted to support said transport unit 16.
The equipment of polishing that this embodiment provided, through setting up conveying unit 16, it is right to realize the support and the conveying of work piece to through setting up thickness measurement sensor 11 and travel switch 12, through travel switch 12 control thickness measurement sensor 11's start-up, it is right to realize work piece thickness automated inspection, and through setting up travel switch is located thickness measurement sensor 11's edge the place ahead of work piece direction of transfer is guaranteed when travel switch 12 is touched the start-up, the work piece is located thickness measurement sensor 11's radiation range to guarantee the accuracy of thickness measurement.
Specifically, the grinding apparatus further comprises: a grinding assembly 3, adapted to grind said workpiece, on which a grinding head 33 is arranged;
and the lifting assembly 2 is suitable for controlling the lifting of the grinding assembly 3.
Specifically, the lifting assembly 2 comprises: a force sensor 23 connected to the grinding assembly 3 and adapted to monitor a positive pressure between the grinding assembly 3 and the workpiece;
a floating joint 24 adapted to connect the grinding assembly 3 and to provide a cushion when the grinding assembly 3 contacts the workpiece.
Preferably, the lifting assembly 2 further comprises: the lifter 22 is connected with the grinding assembly 3 sequentially through the force sensor 23 and the floating joint 24 and is suitable for driving the grinding assembly 3 to lift;
and the lifting motor 21 is connected with the lifter 22 and is suitable for driving the lifter 22 to move.
Preferably, the rotating speed of the lifting motor 21 is n, and the descending speed of the grinding head is v when the stroke of the lifter 22 per revolution is p 1 = np, i.e. v 1 ＝np＝(h-d 2 )/(s/v 2 )。
Preferably, the grinding apparatus further comprises: and the central control system is suitable for commanding the lifting motor 21 to start after receiving the workpiece thickness value signal of the thickness measuring sensor 11, so that the lifting motor 21 drives the lifter 22 to move downwards to drive the grinding assembly 3 to move downwards.
Preferably, when the grinding head 33 of the grinding assembly 3 is lowered to be level with the highest point of the upper surface of the workpiece, the rough zero alignment is completed; after rough zero alignment is completed, the grinding head 33 is continuously adjusted downwards, the grinding head 33 is abutted against the workpiece, positive pressure of the grinding head 33 and the workpiece is fed back to the force sensor 23, when the positive pressure reaches a set threshold value, accurate zero alignment is completed, the lifting motor 21 stops, the grinding component 3 stops descending, the grinding motor 31 is started, the grinding head 33 is driven to rotate, and the workpiece is ground.
Preferably, the threshold value of the force sensor 23 can be adjusted according to the actual sanding effect, and the empirical value is input into the system, so that the sanding effect has higher flexibility.
Preferably, the grinding assembly 3 further comprises: a belt 32, wherein the grinding head 33 is arranged on the belt 32;
a grinding motor 31, which is suitable for driving the belt 32 to rotate, thereby driving the grinding head 33 to rotate and grinding the workpiece;
a guide shaft 35 adapted to guide the elevation of the sanding assembly 3;
the bearing 34 is fixedly connected with the supporting structure of the polishing assembly 3, sleeved on the guide shaft 35 and suitable for driving the supporting structure of the polishing assembly 3 to slide up and down along the guide shaft 35;
the grinding device provided by the embodiment is connected with the grinding component 3 through the force sensor 23 by arranging the lifting component 2, so that the grinding component 3 and the positive pressure between the workpieces are collected, the grinding component 3 is controlled to start and stop according to the positive pressure, the accurate zero alignment is realized, meanwhile, the grinding component 3 is in contact with the workpieces through the floating joint 24, the grinding component 3 is buffered, and the grinding component 3 is prevented from being directly touched by the workpieces and causing impact damage to the grinding component 3.
Specifically, the grinding apparatus further comprises: and the polishing platform 5 is arranged right below the polishing assembly 3, and the polishing platform 5 is connected with the conveying unit 16 and is suitable for supporting the workpiece.
Preferably, the grinding apparatus further comprises: a support 4 adapted to support the grinding apparatus.
It should be understood that the above examples are only for clarity of illustration and are not intended to limit the embodiments. Other variations and modifications will be apparent to persons skilled in the art in light of the above description. And are neither required nor exhaustive of all embodiments. And obvious variations or modifications therefrom are within the scope of the invention.

Claims (10)

1. A method for aligning a grinding head with a workpiece is characterized by comprising the following steps:
moving the workpiece to a first preset position (S1, 0);
acquiring a workpiece thickness value D;
determining a lowering rate of a grinding head based on the workpiece thickness value D so that the grinding head is lowered to a grinding start position (S1 + S2, D) while the workpiece is moved to a second preset position (S1 + S2, 0);
the origin of the rectangular coordinate system is a projection point of the thickness measuring sensor (11) on a reference surface, the X-axis direction is the advancing direction of the workpiece, and the Y-axis direction is the vertical upward direction perpendicular to the horizontal plane.
2. The grinding head and workpiece zero-alignment method according to claim 1, characterized in that a travel switch (12) is provided at the first preset position (S1, 0), and the workpiece thickness value D is obtained by a thickness measuring sensor (11) located at coordinates (0, h);
moving the work piece to first preset position (S1, 0), obtaining work piece thickness value D, including:
driving the workpiece to move along a preset direction;
and when the workpiece touches the travel switch (12), starting the thickness measuring sensor (11) to acquire the workpiece thickness value D of the workpiece.
3. The method of aligning a grinding head with a workpiece according to claim 2, wherein said obtaining a workpiece thickness value D further comprises:
judging whether the radiation range of the thickness measuring sensor (11) is on the upper surface of the workpiece;
when (H-d) 1 )tan(α/2)<S1 is, and (H-d) 1 )tan(α/2)<L-S1, determining that the radiation range of the thickness measuring sensor (11) is on the upper surface of the workpiece completely;
wherein H is the height of the thickness measuring sensor (11) from a reference plane (X, 0), d 1 The minimum value of the thickness value of the workpiece is defined, alpha is the full emission angle of the thickness measuring sensor (11), S1 is the horizontal distance between the thickness measuring sensor (11) and the travel switch (12), and L is the minimum length of the workpiece.
4. The method for zeroing a grinding head with a workpiece according to claim 2, wherein said determining a lowering rate of the grinding head based on the workpiece thickness value D so that the grinding head is lowered to a grinding start position (S1 + S2, D) while the workpiece is moved to a second preset position (S1 + S2, 0) comprises:
determining the rate of decline as: v. of 1 ＝(h-d 2 )/(s/v 2 )，
Wherein h is the height difference between the grinding head and a reference plane (X, 0), and d 2 Is the maximum value of the thickness value of the workpiece, s is the horizontal distance between the travel switch (12) and the grinding head, v 2 Is the speed of travel of the workpiece.
5. The method of aligning a grinding head with a workpiece as set forth in any one of claims 1 to 4, further comprising, after the lowering of the grinding head to the grinding start position (S1 + S2, D):
continuously downwards regulating the grinding head until the positive pressure of the grinding head and the workpiece reaches a preset threshold value;
and starting the grinding head to operate.
6. An abrading device for carrying out the method of aligning a grinding head of any one of claims 1 to 5 with a workpiece, the abrading device comprising: an epitaxial transport table (1), the epitaxial transport table (1) comprising: a transport unit (16) adapted to support and transport the workpiece; and the thickness measuring sensor (11) is arranged right above the conveying unit (16) and is suitable for measuring the thickness value D of the workpiece.
7. The grinding apparatus according to claim 6, characterized in that the epitaxial transport table (1) further comprises: and the travel switch (12) is arranged in front of the thickness measuring sensor (11) along the workpiece conveying direction and is suitable for controlling the starting of the thickness measuring sensor (11).
8. The sharpening apparatus of claim 7, further comprising: the grinding component (3) is suitable for grinding the workpiece, and a grinding head (33) is arranged on the grinding component (3);
the lifting assembly (2) is suitable for controlling the lifting of the grinding assembly (3).
9. The sharpening apparatus according to claim 8, characterized in that the lifting assembly (2) comprises: a force sensor (23) connected to the grinding assembly (3) and adapted to monitor a positive pressure between the grinding assembly (3) and the workpiece;
a floating joint (24) adapted to connect the grinding assembly (3) and to provide a cushion when the grinding assembly (2) contacts the workpiece.
10. The sharpening apparatus of claim 8, further comprising: the polishing platform (5) is arranged under the polishing assembly (3), and the polishing platform (5) is connected with the conveying unit (16) and is suitable for supporting the workpiece.
CN202111127968.7A 2021-09-26 2021-09-26 Method for aligning grinding head and workpiece and grinding equipment Active CN113770881B (en)

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DE3535909A1 (en) * 1985-10-08 1987-04-09 Mengele & Soehne Masch Karl CHOPPER OR THE LIKE CRUSHING MACHINE
AU2002340068A1 (en) * 2001-09-28 2003-04-07 Republic Welding Company Rotor and counter knife for a rotary grinder
CN100337789C (en) * 2004-09-24 2007-09-19 杭州祥生砂光机制造有限公司 Zero setting device and zero setting method for sander dynamic workpiece and sand belt
CN2724921Y (en) * 2004-09-24 2005-09-14 陈勇奇 Dynamic work piece and abrasive band zero setting device for electric abrasive polishing machine
CN207358867U (en) * 2017-10-27 2018-05-15 麦特达因（苏州）汽车部件有限公司 A kind of online laser thickness measuring apparatus
CN209849954U (en) * 2019-05-16 2019-12-27 东莞市顺盟数控机械有限公司 Automatic tool setting automatic processing plane finish milling machine tool

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