CN113766761A - Acid-washing board grinding device for producing multilayer circuit board and implementation method thereof - Google Patents
Acid-washing board grinding device for producing multilayer circuit board and implementation method thereof Download PDFInfo
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- CN113766761A CN113766761A CN202110979957.5A CN202110979957A CN113766761A CN 113766761 A CN113766761 A CN 113766761A CN 202110979957 A CN202110979957 A CN 202110979957A CN 113766761 A CN113766761 A CN 113766761A
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- circuit board
- clamping
- pickling
- conveying
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- 238000000034 method Methods 0.000 title claims abstract description 20
- 238000005406 washing Methods 0.000 title description 6
- 230000007246 mechanism Effects 0.000 claims abstract description 81
- 230000005540 biological transmission Effects 0.000 claims abstract description 65
- 238000005554 pickling Methods 0.000 claims abstract description 48
- 238000004506 ultrasonic cleaning Methods 0.000 claims abstract description 29
- 239000002253 acid Substances 0.000 claims abstract description 16
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 8
- 238000004140 cleaning Methods 0.000 claims description 18
- 230000000694 effects Effects 0.000 claims description 11
- 238000005096 rolling process Methods 0.000 claims description 10
- 230000006835 compression Effects 0.000 claims description 9
- 238000007906 compression Methods 0.000 claims description 9
- 230000000149 penetrating effect Effects 0.000 claims description 3
- 230000009365 direct transmission Effects 0.000 claims description 2
- 238000004519 manufacturing process Methods 0.000 claims 1
- 239000012535 impurity Substances 0.000 abstract description 5
- 230000000712 assembly Effects 0.000 description 7
- 238000000429 assembly Methods 0.000 description 7
- 239000010410 layer Substances 0.000 description 5
- 230000009471 action Effects 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 238000006073 displacement reaction Methods 0.000 description 2
- 238000001914 filtration Methods 0.000 description 2
- 238000009825 accumulation Methods 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 210000001503 joint Anatomy 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/26—Cleaning or polishing of the conductive pattern
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
- B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
- B08B3/12—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration by sonic or ultrasonic vibrations
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B51/00—Arrangements for automatic control of a series of individual steps in grinding a workpiece
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
- B24B7/06—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor involving conveyor belts, a sequence of travelling work-tables or the like
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23G—CLEANING OR DE-GREASING OF METALLIC MATERIAL BY CHEMICAL METHODS OTHER THAN ELECTROLYSIS
- C23G3/00—Apparatus for cleaning or pickling metallic material
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Grinding Of Cylindrical And Plane Surfaces (AREA)
Abstract
The invention relates to the technical field of circuit boards, and discloses a pickling and grinding device for producing a multilayer circuit board, which comprises a pickling mechanism and a conveying mechanism arranged on one side of the pickling mechanism, wherein a plate grinding machine is arranged on one side of the conveying mechanism, a distinguishing component is arranged at one end of the plate grinding machine, a classifying mechanism is arranged on one side of the plate grinding machine, the pickling mechanism comprises a transmission chain belt arranged on the inner walls of the two sides of the pickling mechanism, an ultrasonic cleaning box arranged at the middle position of the pickling mechanism and a clamping component arranged on the side surface of the transmission chain belt, impurities in acid water can be filtered once after a certain group of circuit boards are cleaned in the continuous rotation of the transmission chain belt, meanwhile, an implementation method of the pickling and grinding device for producing the multilayer circuit board is disclosed, the clamping component moves along with the rotation of the transmission chain belt, the group of clamping component moves to the position right above the ultrasonic cleaning box, the vertical lifting column is driven to drive the clamping block to descend, and the circuit board is placed into the ultrasonic cleaning box to be cleaned.
Description
Technical Field
The invention relates to the technical field of circuit boards, in particular to a pickling and board grinding device for producing a multilayer circuit board and an implementation method thereof.
Background
Circuit boards are classified into three major categories, single-sided boards, double-sided boards, and multilayer circuit boards, in which the single-sided board is the first one, components are concentrated on one side, and wires are concentrated on the other side, on the most basic PCB. The double-sided board is an extension of a single-sided board, when single-layer wiring cannot meet the requirements of electronic products, the double-sided board is used, copper-clad wires are coated on both sides, and a circuit between two layers can be conducted through a via hole to form required network connection, and the multilayer board is a printed board which is formed by laminating more than three conductive pattern layers and insulating materials between the conductive pattern layers at intervals, and the conductive patterns between the conductive pattern layers are interconnected according to requirements.
Traditional circuit board need be through the step of pickling and mill board, and prior art adopts the technical means who carries out the limit transmission limit acid water washing with the circuit board, but when efficiency increases, the inside impurity of acid water is also at the rapid accumulation to reduce abluent quality, and prior art is after grinding the board with the circuit board warp mill board after will wasing, can not distinguish the circuit board and need one side to grind board or two-sided mill board, lead to needing the manual work to discern, increased staff's burden.
In order to solve the problems, the acid-washing plate-grinding device for producing the multilayer circuit board and the implementation method thereof are provided.
Disclosure of Invention
The invention aims to provide a pickling plate grinding device for producing a multilayer circuit board and an implementation method thereof.
In order to achieve the purpose, the invention provides the following technical scheme: a pickling plate grinding device for producing a multilayer circuit board comprises a pickling mechanism and a conveying mechanism arranged on one side of the pickling mechanism, wherein a plate grinding machine is arranged on one side of the conveying mechanism, a distinguishing component is arranged on the upper side of one end of the plate grinding machine, a classifying mechanism is arranged on one side of the plate grinding machine, the pickling mechanism comprises a transmission chain belt arranged on the inner walls of two sides of the pickling mechanism, an ultrasonic cleaning box arranged in the middle of the pickling mechanism and clamping components arranged on the side surfaces of the transmission chain belt, and the clamping components are provided with a plurality of groups;
the pickling mechanism also comprises a filter screen block arranged in the middle of the pickling mechanism, a first connecting column arranged on one side of the filter screen block and a first connecting block arranged at one end of the first connecting column, and the first connecting block is connected with the side surface of the transmission chain belt;
conveying mechanism is including setting up the conveyer belt in conveying mechanism inside to and the activity sets up the first regulation strip and the activity of conveying mechanism inner wall both sides sets up the second regulation strip in first regulation strip inside, and first regulation strip one end is provided with the second telescopic link, and the second telescopic link contacts with the conveying mechanism inner wall.
Further, the centre gripping subassembly is including setting up the second spliced pole in the drive chain area side to and set up at the grip block of second spliced pole one end and set up the inside centre gripping groove in the grip block, ultrasonic cleaning incasement portion sets up the acid water.
Further, the second spliced pole is including setting up the vertical lift post at the second spliced pole lower extreme to and set up the horizontal column of rotating in vertical lift post one end, and horizontal column of rotating one end is connected with the grip block side.
Further, the centre gripping groove is including setting up the promotion post at centre gripping inslot wall to and set up the through net and the activity that run through that set up at centre gripping inslot wall downside sets up the centre gripping strip in centre gripping inslot portion.
Further, the centre gripping groove still includes that the gomphosis sets up at the inside driven strip of centre gripping strip to and set up at the connecting spring of centre gripping strip one side and set up the first telescopic link in driven strip side, the inside first pulley that is provided with of driven strip.
Further, the filter screen block comprises a vibration block arranged at the upper end of the filter screen block, a compression spring arranged at the lower end of the filter screen block and a connecting plate arranged at the lower end of the compression spring, a second pulley is arranged at the lower end of the connecting plate, and a vibration motor is arranged inside the vibration block.
Furthermore, the second adjusting strip comprises an embedding groove arranged in the second adjusting strip and a spring guide post embedded in the embedding groove, and one end of the spring guide post is connected with the inner wall of the first adjusting strip.
Further, the classification mechanism is including setting up the activity transmission band in the inside one end of classification mechanism to and set up at the fixed guide of activity transmission band downside and set up the through transmission band in activity transmission band one side, classification mechanism still including setting up the transmission frame that turns back with one side at the activity transmission band.
Further, the transmission frame of turning back is including setting up the first subassembly of turning back in activity transmission band one side, and set up the second of turning back subassembly one side at first subassembly of turning back and set up the district of putting of turning back subassembly one side at the second, the first subassembly of turning back is including setting up the conveying roller bearing in activity transmission band one side, and set up the rolling roller frame of conveying roller bearing one side and set up the diversion roll roller in rolling roller frame one side, conveying roller bearing and diversion roll roller all set up the multiunit, and the transmission direction angle of conveying roller bearing and diversion roll roller is the right angle, the first subassembly of turning back and the second of turning back are the component that the looks isostructure was made.
The invention provides another scheme: the implementation method of the acid-washing plate grinding device for producing the multilayer circuit board comprises the following steps:
s1: embedding the circuit board into the two groups of clamping blocks, moving the clamping assemblies along with the rotation displacement of the transmission chain belt, moving the group of clamping assemblies to be right above the ultrasonic cleaning box, driving the vertical lifting columns to drive the clamping blocks to descend, and placing the circuit board into the ultrasonic cleaning box for cleaning;
s2: after cleaning, the vertical lifting column contracts to drive the clamping block to ascend, the transmission chain belt continuously rotates and displaces, the pushing column pushes the cleaned circuit board to fall onto the side face of the conveying belt, transmission is continued, the first adjusting strip and the second adjusting strip are driven to move to the middle position of the conveying belt, and the position of the circuit board is adjusted;
s3: the circuit board is continuously transmitted into the board grinding machine, clamped and ground, identified and distinguished through the distinguishing component, and finally transmitted into the classifying mechanism;
s4: the circuit board of the light board is transmitted to the upper side face of the turn-back transmission frame through the movable transmission belt, and finally placed in the placement area, so that the circuit board provided with the convex electronic elements is transmitted to the upper side face of the transmission belt after the circuit board on the other side is ground, and all implementation steps are completed.
Compared with the prior art, the invention has the following beneficial effects:
1. the invention provides a pickling and grinding device for producing a multilayer circuit board and an implementation method thereof, wherein the circuit board is embedded into two groups of clamping blocks, the clamping strips are contacted with the outer side of the circuit board, at the moment, a connecting spring is compressed, the clamping components move along with the rotation of a transmission chain belt, when the group of clamping components move right above an ultrasonic cleaning box, a vertical lifting column is driven to drive the clamping blocks to descend, the circuit board is placed into the ultrasonic cleaning box to be cleaned, after the cleaning is finished, the vertical lifting column contracts to drive the clamping blocks to ascend, the transmission chain belt continues to rotate and move, in the process, two groups of transverse rotating columns rotate to drive the circuit board to rotate to spin-dry the liquid stuck on the circuit board, when the circuit board is conveyed to the position right above the conveying belt, a first telescopic rod is driven to extend out to enable a first pulley to be contacted with the outer side, under the pushing of a pushing column, the circuit board after the washing falls into the side on the conveyer belt, has realized incessant limit transportation and has washd the work.
2. The invention provides a pickling and grinding plate device for producing a multilayer circuit board and an implementation method thereof, wherein a filter screen block is arranged on one side of a transmission chain belt and is connected with one side of the transmission chain belt through a first connecting column and a first connecting block, the filter screen block is also driven to displace during the rotation of the transmission chain belt, when the filter screen block is positioned right above an ultrasonic cleaning box, the first connecting column and a second connecting column are members with the same structure, the filter screen block can be lowered into the ultrasonic cleaning box by utilizing the first connecting column, the filter screen block moves in the ultrasonic cleaning box to carry out filtering work along with the rotation of the transmission chain belt, when the filter screen block moves from one end to the other end in the ultrasonic cleaning box, one end of the first connecting column rotates to drive the filter screen block to rotate, so that the filter screen block is changed from a vertical state to a transverse state, the second pulley can contact with ultrasonic cleaning incasement wall, compression spring is compressed this moment, compression spring's setting can avoid the rigid collision of filter screen piece and ultrasonic cleaning incasement wall, in the filter screen piece is rotatory, utilize first column connection to drive the filter screen piece and rise, make it break away from with the ultrasonic cleaning case, the sour water to ultrasonic cleaning incasement portion has promptly filtered, and impurity stops in filter screen piece side, utilize last first column connection to change the filter screen piece into opposite side transverse state up by the transverse state that one side faces upward, the inside vibrating motor of vibrations piece can play a role, vibrations break away from the inside impurity of filter screen piece, in the continuous rotation of transmission chain belt, after the circuit board of certain group is cleaned, can carry out once to the filtration of the inside impurity of sour water, abluent efficiency has been increased.
3. The invention provides a pickling and grinding device for producing a multilayer circuit board and an implementation method thereof, when the cleaned circuit board falls on the side surface of a conveying belt, a second telescopic rod is driven to enable a first adjusting strip to move to the middle position of the conveying belt, namely, two groups of first adjusting strips move to the middle position of the conveying belt at the moment, a circuit board is pushed to adjust the position of the circuit board to be in the middle position of the conveying belt, the distance between the two groups of conveying belts is equal to the maximum width of the conveyed circuit board in the extending state of the second telescopic rod, the distance between the two groups of second adjusting strips is equal to the minimum width of the circuit board in the extending state of the second telescopic rod and the natural state of a spring guide post spring, the positions of the circuit boards with different widths can be adjusted, the conveying path of the circuit board is correct, then the circuit board is conveyed into a grinding mechanism to carry out grinding function, and after the circuit board is ground, a component can identify whether the circuit board needs single-sided grinding or double-sided grinding, a single-sided grinding plate with one side provided with a convex electric element, a double-sided grinding plate without the convex electric element, when the plate needs to be ground on one side, the plate is directly conveyed to the upper side surface of the direct conveying belt through the movable conveying belt for collection, when discerning when the needs two-sided mill board, the side on the movable transmission band can be transported to the circuit board, the movable transmission band removes through the cooperation with fixed guide, the butt joint of subassembly one side is returned with first returning to this moment movable transmission band, the circuit board conveys through the delivery roller bearing, it is transmitted to be examined subsequently by the roll roller frame, because of the circuit board height less of accessible roll roller frame roller interval department, the roll roller frame can be examined whether it is the circuit board of protruding form electrical component, carry out the transport that turns to by the diversion roll roller again, return the transportation that the subassembly turned to once more through the second at last and place the circuit board inside putting the district, wait for the staff to take and carry out the mill board work of another side.
Drawings
FIG. 1 is a schematic view of the overall structure of the present invention;
FIG. 2 is a schematic structural diagram of a pickling mechanism according to the present invention;
FIG. 3 is a schematic view of a clamping assembly according to the present invention;
FIG. 4 is a schematic plan view of the clamping block of the present invention;
FIG. 5 is an enlarged view of the structure at A in FIG. 2 according to the present invention;
FIG. 6 is a schematic view of the conveying mechanism of the present invention;
FIG. 7 is a schematic view of the second adjusting bar and the second telescopic rod of the present invention;
fig. 8 is a schematic structural diagram of the sorting mechanism of the present invention.
In the figure: 1. a pickling mechanism; 11. a drive chain belt; 12. an ultrasonic cleaning tank; 13. a clamping assembly; 131. a second connecting column; 1311. a vertical lifting column; 1312. a transverse rotation column; 132. a clamping block; 133. a clamping groove; 1331. pushing the column; 1332. penetrating the net; 1333. a clamping bar; 1334. a driven bar; 1335. a connecting spring; 1336. a first telescopic rod; 1337. a first pulley; 14. a filter screen block; 141. a vibration block; 142. a compression spring; 143. a connecting plate; 144. a second pulley; 15. a first connecting column; 16. a first connection block; 2. a conveying mechanism; 21. a conveyor belt; 22. a first adjustment bar; 23. a second adjustment bar; 231. a spring guide post; 232. a fitting groove; 24. a second telescopic rod; 3. grinding the plate machine; 4. a sorting mechanism; 41. a movable conveyor belt; 42. fixing the guide rail; 43. directly reaching a transmission belt; 44. a foldback transmission frame; 441. a first foldback component; 4411. a conveying roller; 4412. a roll stand; 4413. a turning rolling roller; 442. a second return assembly; 443. a placement area; 5. the components are distinguished.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1, a plate pickling and grinding device for producing a multilayer circuit board includes a pickling mechanism 1 and a conveying mechanism 2 disposed on one side of the pickling mechanism 1, a plate grinding machine 3 is disposed on one side of the conveying mechanism 2, a distinguishing component 5 is disposed on an upper side of one end of the plate grinding machine 3, and a sorting mechanism 4 is disposed on one side of the plate grinding machine 3.
Referring to fig. 2-5, a pickling and grinding device for producing a multilayer circuit board, wherein a pickling mechanism 1 comprises a transmission chain belt 11 arranged on the inner walls of two sides of the pickling mechanism 1, an ultrasonic cleaning box 12 arranged in the middle of the pickling mechanism 1 and clamping assemblies 13 arranged on the sides of the transmission chain belt 11, the clamping assemblies 13 are provided with a plurality of groups, the pickling mechanism 1 further comprises a filter screen block 14 arranged in the middle of the pickling mechanism 1, a first connecting column 15 arranged on one side of the filter screen block 14 and a first connecting block 16 arranged on one end of the first connecting column 15, the first connecting block 16 is connected with the sides of the transmission chain belt 11, the clamping assemblies 13 comprise a second connecting column 131 arranged on the sides of the transmission chain belt 11, a clamping block 132 arranged on one end of the second connecting column 131 and a clamping groove 133 arranged inside the clamping block 132, acid water is arranged inside the ultrasonic cleaning box 12, the second connection column 131 comprises a vertical lifting column 1311 arranged at the lower end of the second connection column 131, a horizontal rotation column 1312 arranged at one end of the vertical lifting column 1311, one end of the horizontal rotation column 1312 is connected with the side surface of the clamping block 132, the clamping groove 133 comprises a pushing column 1331 arranged on the inner wall of the clamping groove 133, a penetrating net 1332 arranged at the lower side surface of the inner wall of the clamping groove 133 and a clamping strip 1333 movably arranged inside the clamping groove 133, the clamping groove 133 further comprises a driven strip 1334 embedded inside the clamping strip 1333, a connecting spring 1335 arranged at one side of the clamping strip 1333 and a first telescopic rod 1336 arranged at the side surface of the driven strip 1334, a first pulley 1337 is arranged inside the driven strip 1334, the filter screen block 14 comprises a vibrating block 141 arranged at the upper end of the filter screen block 14, a compression spring 142 arranged at the lower end of the filter screen block 14 and a connecting plate 143 arranged at the lower end of the compression spring 142, and a second pulley 144 is provided at the lower end of the connection plate 143, and a vibration motor is provided inside the vibration block 141.
Referring to fig. 6-7, a plate pickling and grinding device for producing a multilayer circuit board, a conveying mechanism 2 includes a conveying belt 21 disposed inside the conveying mechanism 2, a first adjusting bar 22 movably disposed on two sides of an inner wall of the conveying mechanism 2, and a second adjusting bar 23 movably disposed inside the first adjusting bar 22, one end of the first adjusting bar 22 is provided with a second telescopic rod 24, the second telescopic rod 24 contacts with the inner wall of the conveying mechanism 2, the second adjusting bar 23 includes an engaging groove 232 disposed inside the second adjusting bar 23, and a spring guide post 231 engaged with the engaging groove 232, and one end of the spring guide post 231 is connected with the inner wall of the first adjusting bar 22.
Referring to fig. 8, a pickling and grinding apparatus for producing a multi-layer circuit board, the sorting mechanism 4 includes a movable conveyor 41 disposed at one end of the sorting mechanism 4, a fixed guide 42 disposed at the lower side of the movable conveyor 41, a direct conveyor 43 disposed at one side of the movable conveyor 41, the sorting mechanism 4 further includes a return conveyor 44 disposed at the same side of the movable conveyor 41, the return conveyor 44 includes a first return component 441 disposed at one side of the movable conveyor 41, a second return component 442 disposed at one side of the first return component 441 and a placement area 443 disposed at one side of the second return component 442, the first return component 441 includes a conveying roller 4411 disposed at one side of the movable conveyor 41, a rolling roller frame 4412 disposed at one side of the conveying roller 4411 and a turning roller 4413 disposed at one side of the rolling roller frame 4412, the conveying roller 4411 and the turning roller 4413 are all disposed in multiple sets, and the transmission direction angles of the conveying roller 4411 and the direction-changing roller 4413 are right angles, the first returning component 441 and the second returning component 442 are members made of the same construction.
In order to better explain the above examples, the present invention also provides an embodiment of a method for implementing the acid cleaning and grinding device for producing the multilayer circuit board, comprising the following steps:
the method comprises the following steps: embedding the circuit board into the two groups of clamping blocks 132, enabling the clamping assemblies 13 to move along with the rotation of the transmission chain belt 11, enabling the group of clamping assemblies 13 to move right above the ultrasonic cleaning box 12, driving the vertical lifting columns 1311 to drive the clamping blocks 132 to descend, and placing the circuit board into the ultrasonic cleaning box 12 for cleaning;
step two: after cleaning, the vertical lifting column 1311 is retracted to drive the clamping block 132 to lift, the transmission chain belt 11 continues to rotate and displace, the pushing column 1331 pushes the cleaned circuit board to fall onto the upper side surface of the conveying belt 21, and the circuit board continues to be transmitted to drive the first adjusting strip 22 and the second adjusting strip 23 to move towards the middle position of the conveying belt 21, so as to adjust the position of the circuit board;
step three: the circuit board is continuously transmitted into the board grinding machine 3, clamped and ground, identified and distinguished through the distinguishing component 5, and finally transmitted into the classifying mechanism 4;
step four: the circuit board of the light panel is transported to the upper side of the return transport frame 44 through the movable transport belt 41, and finally placed at the position of the placement area 443, so that the circuit board provided with the electronic components is transported to the upper side of the transport belt 43 until the circuit board is ground on the other side, and all the implementation steps are completed.
In summary, the following steps: the invention relates to a pickling and grinding device for producing a multilayer circuit board and an implementation method thereof, wherein a pickling mechanism 1 comprises a transmission chain belt 11 arranged on the inner walls of two sides of the pickling mechanism 1, an ultrasonic cleaning box 12 arranged at the middle position of the pickling mechanism 1 and clamping components 13 arranged on the side surfaces of the transmission chain belt 11, the clamping components 13 are provided with a plurality of groups, the pickling mechanism 1 further comprises a filter screen block 14 arranged at the middle position of the pickling mechanism 1, a first connecting column 15 arranged on one side of the filter screen block 14 and a first connecting block 16 arranged at one end of the first connecting column 15, the first connecting block 16 is connected with the side surfaces of the transmission chain belt 11, the circuit board is embedded into two groups of clamping blocks 132, the clamping components 13 move along with the rotation displacement of the transmission chain belt 11, the group of clamping components 13 moves to the position right above the ultrasonic cleaning box 12, and drives a vertical lifting column 1311 to drive the clamping blocks 132 to descend, the circuit board is put into an ultrasonic cleaning box 12 for cleaning, the conveying mechanism 2 comprises a conveying belt 21 arranged inside the conveying mechanism 2, a first adjusting strip 22 movably arranged on two sides of the inner wall of the conveying mechanism 2 and a second adjusting strip 23 movably arranged inside the first adjusting strip 22, one end of the first adjusting strip 22 is provided with a second telescopic rod 24, the second telescopic rod 24 is contacted with the inner wall of the conveying mechanism 2, a pushing column 1331 pushes the cleaned circuit board to fall onto the upper side surface of the conveying belt 21 for continuous transmission, the first adjusting strip 22 and the second adjusting strip 23 are driven to move towards the middle position of the conveying belt 21, the position of the circuit board is adjusted, the circuit board is continuously transmitted into a board grinding machine 3 and is clamped for grinding the board, the classification mechanism 4 comprises a movable conveying belt 41 arranged at one end inside the classification mechanism 4, a fixed guide rail 42 arranged on the lower side surface of the movable conveying belt 41 and a direct conveying belt 43 arranged on one side of the movable conveying belt 41, the sorting mechanism 4 further includes a folding-back transmission frame 44 disposed on the same side of the movable transmission belt 41, the circuit board of the light panel is transmitted to the upper side of the folding-back transmission frame 44 through the movable transmission belt 41, and finally placed in the placement area 443, so that the circuit board provided with the convex electronic components is transmitted to the upper side of the direct transmission belt 43 when the circuit board on the other side is ground.
It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (10)
1. The utility model provides a multilayer circuit board production is with pickling grinding plate device, includes pickling mechanism (1) and sets up conveying mechanism (2) in pickling mechanism (1) one side, and conveying mechanism (2) one side is provided with plate grinder (3), its characterized in that: a distinguishing component (5) is arranged on the upper side of one end of the plate grinding machine (3), a classifying mechanism (4) is arranged on one side of the plate grinding machine (3), the pickling mechanism (1) comprises a transmission chain belt (11) arranged on the inner walls of the two sides of the pickling mechanism (1), an ultrasonic cleaning box (12) arranged in the middle of the pickling mechanism (1) and clamping components (13) arranged on the side surfaces of the transmission chain belt (11), and a plurality of groups of the clamping components (13) are arranged;
the pickling mechanism (1) further comprises a filter screen block (14) arranged in the middle of the pickling mechanism (1), a first connecting column (15) arranged on one side of the filter screen block (14) and a first connecting block (16) arranged at one end of the first connecting column (15), and the first connecting block (16) is connected with the side face of the transmission chain belt (11);
conveying mechanism (2) are including setting up conveyer belt (21) in conveying mechanism (2) inside to and the activity sets up first regulation strip (22) and the activity of conveying mechanism (2) inner wall both sides and sets up second regulation strip (23) in first regulation strip (22) inside, and first regulation strip (22) one end is provided with second telescopic link (24), and second telescopic link (24) contact with conveying mechanism (2) inner wall.
2. The acid cleaning and grinding device for producing the multilayer circuit board according to claim 1, characterized in that: the clamping assembly (13) comprises a second connecting column (131) arranged on the side face of the transmission chain belt (11), a clamping block (132) arranged at one end of the second connecting column (131) and a clamping groove (133) formed in the clamping block (132), and acid water is arranged in the ultrasonic cleaning box (12).
3. The acid cleaning and grinding device for producing the multilayer circuit board according to claim 2, characterized in that: the second connecting column (131) comprises a vertical lifting column (1311) arranged at the lower end of the second connecting column (131) and a transverse rotating column (1312) arranged at one end of the vertical lifting column (1311), and one end of the transverse rotating column (1312) is connected with the side face of the clamping block (132).
4. The acid cleaning and grinding device for producing the multilayer circuit board according to claim 2, characterized in that: the clamping groove (133) comprises a pushing column (1331) arranged on the inner wall of the clamping groove (133), a penetrating net (1332) arranged on the lower side surface of the inner wall of the clamping groove (133) and a clamping strip (1333) movably arranged in the clamping groove (133).
5. The acid cleaning and grinding device for producing the multilayer circuit board according to claim 4, characterized in that: the clamping groove (133) further comprises a driven strip (1334) which is embedded in the clamping strip (1333), a connecting spring (1335) which is arranged on one side of the clamping strip (1333) and a first telescopic rod (1336) which is arranged on the side surface of the driven strip (1334), and a first pulley (1337) is arranged in the driven strip (1334).
6. The acid cleaning and grinding device for producing the multilayer circuit board according to claim 1, characterized in that: the filter screen block (14) comprises a vibration block (141) arranged at the upper end of the filter screen block (14), a compression spring (142) arranged at the lower end of the filter screen block (14) and a connecting plate (143) arranged at the lower end of the compression spring (142), a second pulley (144) is arranged at the lower end of the connecting plate (143), and a vibration motor is arranged inside the vibration block (141).
7. The acid cleaning and grinding device for producing the multilayer circuit board according to claim 1, characterized in that: the second adjusting strip (23) comprises an embedding groove (232) arranged inside the second adjusting strip (23) and a spring guide post (231) embedded inside the embedding groove (232), and one end of the spring guide post (231) is connected with the inner wall of the first adjusting strip (22).
8. The acid cleaning and grinding device for producing the multilayer circuit board according to claim 1, characterized in that: the sorting mechanism (4) comprises a movable conveying belt (41) arranged at one end inside the sorting mechanism (4), a fixed guide rail (42) arranged on the lower side surface of the movable conveying belt (41) and a direct conveying belt (43) arranged on one side of the movable conveying belt (41), and the sorting mechanism (4) further comprises a turning-back conveying frame (44) arranged on the same side of the movable conveying belt (41).
9. The acid cleaning and grinding device for producing the multilayer circuit board according to claim 8, characterized in that: the turn-back transmission frame (44) comprises a first turn-back component (441) arranged on one side of the movable transmission belt (41), a second turn-back component (442) arranged on one side of the first turn-back component (441) and a placing area (443) arranged on one side of the second turn-back component (442), the first turn-back component (441) comprises a conveying roller (4411) arranged on one side of the movable transmission belt (41), a rolling roller frame (4412) arranged on one side of the conveying roller (4411) and a turning rolling roller (4413) arranged on one side of the rolling roller frame (4412), the conveying roller (4411) and the turning rolling roller (4413) are both provided with multiple groups, the transmission direction angles of the conveying roller (4411) and the turning rolling roller (4413) are right angles, and the first turn-back component (441) and the second turn-back component (442) are members made of the same structure.
10. A method for carrying out an acid cleaning and plate grinding apparatus for producing a multilayer wiring board according to any one of claims 1 to 9, characterized in that: the method comprises the following steps:
s1: embedding the circuit board into the two groups of clamping blocks (132), enabling the clamping components (13) to move along with the rotation of the transmission chain belt (11), enabling the group of clamping components (13) to move right above the ultrasonic cleaning box (12), driving the vertical lifting columns (1311) to drive the clamping blocks (132) to descend, and placing the circuit board into the ultrasonic cleaning box (12) for cleaning;
s2: after cleaning, the vertical lifting column (1311) is contracted to drive the clamping block (132) to ascend, the transmission chain belt (11) continues to rotate and displace, the pushing column (1331) pushes the cleaned circuit board to fall onto the upper side surface of the conveying belt (21), transmission is continued, the first adjusting strip (22) and the second adjusting strip (23) are driven to move towards the middle position of the conveying belt (21), and the position of the circuit board is adjusted;
s3: the circuit board is continuously transmitted into the board grinding machine (3), clamped and ground, identified and distinguished through the distinguishing component (5), and finally transmitted into the classifying mechanism (4);
s4: the circuit board of the light panel is transmitted to the upper side surface of a return transmission frame (44) through a movable transmission belt (41), and finally placed at the position of a placement area (443), so that the circuit board provided with electronic components is transmitted to the upper side surface of a direct transmission belt (43) when the other surface of the circuit board is ground, and all implementation steps are completed.
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| CN202110979957.5A CN113766761B (en) | 2021-08-25 | 2021-08-25 | Acid-washing board grinding device for producing multilayer circuit board and implementation method thereof |
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| CN202110979957.5A CN113766761B (en) | 2021-08-25 | 2021-08-25 | Acid-washing board grinding device for producing multilayer circuit board and implementation method thereof |
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| CN113766761A true CN113766761A (en) | 2021-12-07 |
| CN113766761B CN113766761B (en) | 2023-02-17 |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN115365223A (en) * | 2022-07-20 | 2022-11-22 | 北京中科飞鸿科技股份有限公司 | Long-wave infrared chip photoresist removing and cleaning system |
| CN115633454A (en) * | 2022-11-14 | 2023-01-20 | 浙江柳市线路板有限公司 | Circuit board pickling grinds board equipment |
| CN117564835A (en) * | 2024-01-15 | 2024-02-20 | 领跃电子科技（珠海）有限公司 | Board polishing device for processing multilayer printed circuit board |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN115365223A (en) * | 2022-07-20 | 2022-11-22 | 北京中科飞鸿科技股份有限公司 | Long-wave infrared chip photoresist removing and cleaning system |
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| CN117564835B (en) * | 2024-01-15 | 2024-04-05 | 领跃电子科技（珠海）有限公司 | Board polishing device for processing multilayer printed circuit board |
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| CN113766761B (en) | 2023-02-17 |
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Application publication date: 20211207 Assignee: XINFENG ZHENGTIANWEI ELECTRONIC TECHNOLOGIES Co.,Ltd. Assignor: XINFENG FUCHANGFA ELECTRONIC Co.,Ltd. Contract record no.: X2023980049034 Denomination of invention: A pickling and grinding device for multi-layer circuit board production and its implementation method Granted publication date: 20230217 License type: Common License Record date: 20231130 |
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Application publication date: 20211207 Assignee: SHENZHEN ZHENGTIANWEI TECHNOLOGIES CO.,LTD. Assignor: XINFENG FUCHANGFA ELECTRONIC Co.,Ltd. Contract record no.: X2023980050304 Denomination of invention: A pickling and grinding device for multi-layer circuit board production and its implementation method Granted publication date: 20230217 License type: Common License Record date: 20231205 |
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Denomination of invention: A pickling and grinding device for multi-layer circuit board production and its implementation method Granted publication date: 20230217 Pledgee: Agricultural Bank of China Limited Xinfeng County Branch Pledgor: XINFENG FUCHANGFA ELECTRONIC Co.,Ltd. Registration number: Y2024980013496 |