CN113766757A - Full-automatic roll-to-roll flexible circuit board manufacturing mechanism and manufacturing method thereof - Google Patents
Full-automatic roll-to-roll flexible circuit board manufacturing mechanism and manufacturing method thereof Download PDFInfo
- Publication number
- CN113766757A CN113766757A CN202111053534.7A CN202111053534A CN113766757A CN 113766757 A CN113766757 A CN 113766757A CN 202111053534 A CN202111053534 A CN 202111053534A CN 113766757 A CN113766757 A CN 113766757A
- Authority
- CN
- China
- Prior art keywords
- circuit board
- flexible circuit
- etching liquid
- conveying
- spraying
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000007246 mechanism Effects 0.000 title claims abstract description 63
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 17
- 239000007788 liquid Substances 0.000 claims abstract description 104
- 238000005530 etching Methods 0.000 claims abstract description 102
- 238000005507 spraying Methods 0.000 claims abstract description 54
- 238000011049 filling Methods 0.000 claims abstract description 43
- 238000004140 cleaning Methods 0.000 claims abstract description 40
- 239000012783 reinforcing fiber Substances 0.000 claims abstract description 30
- 238000001035 drying Methods 0.000 claims abstract description 26
- 239000000835 fiber Substances 0.000 claims abstract description 15
- 239000007921 spray Substances 0.000 claims abstract description 13
- 238000002360 preparation method Methods 0.000 claims abstract description 12
- 238000005406 washing Methods 0.000 claims abstract description 10
- 238000007599 discharging Methods 0.000 claims abstract description 7
- 238000000034 method Methods 0.000 claims description 22
- 239000000243 solution Substances 0.000 claims description 15
- 239000011248 coating agent Substances 0.000 claims description 9
- 238000000576 coating method Methods 0.000 claims description 9
- 239000000463 material Substances 0.000 claims description 9
- 230000003075 superhydrophobic effect Effects 0.000 claims description 9
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 9
- 239000012670 alkaline solution Substances 0.000 claims description 6
- 238000011010 flushing procedure Methods 0.000 claims description 4
- 230000000873 masking effect Effects 0.000 claims description 4
- 238000006243 chemical reaction Methods 0.000 claims description 3
- 238000010981 drying operation Methods 0.000 claims description 3
- 229920002120 photoresistant polymer Polymers 0.000 claims description 3
- 238000001259 photo etching Methods 0.000 claims description 2
- 238000003756 stirring Methods 0.000 claims description 2
- 238000005516 engineering process Methods 0.000 abstract description 8
- 238000000059 patterning Methods 0.000 abstract description 5
- 238000001039 wet etching Methods 0.000 abstract description 5
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 8
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 6
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 4
- BDAGIHXWWSANSR-UHFFFAOYSA-N methanoic acid Natural products OC=O BDAGIHXWWSANSR-UHFFFAOYSA-N 0.000 description 4
- 229910017604 nitric acid Inorganic materials 0.000 description 4
- 239000000126 substance Substances 0.000 description 3
- 238000004448 titration Methods 0.000 description 3
- OSWFIVFLDKOXQC-UHFFFAOYSA-N 4-(3-methoxyphenyl)aniline Chemical compound COC1=CC=CC(C=2C=CC(N)=CC=2)=C1 OSWFIVFLDKOXQC-UHFFFAOYSA-N 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000001312 dry etching Methods 0.000 description 2
- 230000002349 favourable effect Effects 0.000 description 2
- 235000019253 formic acid Nutrition 0.000 description 2
- 238000011031 large-scale manufacturing process Methods 0.000 description 2
- 239000011259 mixed solution Substances 0.000 description 2
- 239000007800 oxidant agent Substances 0.000 description 2
- 230000001590 oxidative effect Effects 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000004734 Polyphenylene sulfide Substances 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 239000004760 aramid Substances 0.000 description 1
- 229920006231 aramid fiber Polymers 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- 238000000402 conductometric titration Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000002657 fibrous material Substances 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 229920000069 polyphenylene sulfide Polymers 0.000 description 1
- 238000003918 potentiometric titration Methods 0.000 description 1
- 238000002834 transmittance Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
- H05K3/068—Apparatus for etching printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/227—Drying of printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/26—Cleaning or polishing of the conductive pattern
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
- ing And Chemical Polishing (AREA)
Abstract
The invention discloses a full-automatic roll-to-roll flexible circuit board preparation mechanism which comprises a conveying mechanism, an etching mechanism and a cleaning and drying mechanism, wherein the conveying mechanism comprises a discharging roller, a conveying roller, a guide roller and a receiving roller; each etching mechanism comprises a plurality of spraying nozzles and a spraying containing cavity, an etching liquid filling device is adhered to the inside of the spraying containing cavity, the etching liquid filling device is of a cylindrical bottomless structure, and is constructed by a plurality of reinforcing fibers and connected with each reinforcing fiber through supporting fibers; the supporting fiber extends to the center of the etching liquid filling device for a certain length and forms a certain included angle; the etching liquid in the etching liquid filling device is sprayed to the upper panel of the flexible circuit board through the spraying nozzle; each cleaning and drying mechanism comprises a cleaning container, a washing device and a drying device. The equipment combines a roll-to-roll conveying mode and a wet etching technology to spray etching liquid on the upper panel of the flexible circuit board, so that the purpose of forming patterning is achieved, and the production efficiency is improved.
Description
Technical Field
The invention relates to the technical field of circuit board processing or photoelectronic technology, in particular to a full-automatic roll-to-roll flexible circuit board preparation mechanism and a preparation method thereof.
Background
The roll-to-roll etching technology is used for removing unnecessary copper layers of the flexible circuit board to form a circuit, and comprises the processes of etching, washing, drying and the like, or is matched with a developing and stripping process, or is matched with a stripping and tin stripping process, and is conveyed in a roll-to-roll mode. The product processed by roll-to-roll processing has good chemical stability, high conductivity, high light transmittance and easy patterning, and is widely applied to various aspects such as solar cells, flexible display technology, energy-saving building windows, aerospace fields and the like.
At present, the etching of the flexible circuit board in the market mainly adopts dry etching, but the dry etching equipment is expensive, the process is complex, the cost is higher, the etching speed is low, and the requirement of mass production cannot be met. In addition, the existing wet etching also has the problems of uneven etching of the circuit board and the like caused by insufficient spraying precision of the etching liquid.
Therefore, the invention combines the roll-to-roll etching technology to provide a method for wet etching and patterning the upper panel of the circuit board, which has simple process, good performance and low cost and is suitable for mass production.
Disclosure of Invention
The invention overcomes the defects of the prior art, provides a full-automatic roll-to-roll flexible circuit board preparation mechanism and a preparation method thereof, and aims to solve the problems of high cost of mass production and insufficient etching precision of a panel on a patterned circuit board.
In order to achieve the purpose, the invention adopts the technical scheme that: a full-automatic roll-to-roll flexible circuit board preparation mechanism comprises a conveying mechanism, a plurality of etching mechanisms and a plurality of cleaning and drying mechanisms, and is characterized in that,
the conveying mechanism comprises a discharging roller for mounting the lower panel of the flexible circuit board, a plurality of conveying rollers arranged according to a material conveying route, a plurality of guide rollers for mounting the upper panel of the flexible circuit board and a material collecting roller for collecting the flexible circuit board; the etching mechanisms are respectively arranged right above the conveying roller I and the conveying roller II, and the cleaning and drying mechanisms are respectively arranged right below the guide roller I and the guide roller II;
each etching mechanism comprises a plurality of spraying nozzles and a spraying cavity, an etching liquid filling device is adhered to the inside of the spraying cavity, the etching liquid filling device is of a cylindrical bottomless structure, and the etching liquid filling device is constructed by a plurality of reinforcing fibers and is connected with each reinforcing fiber through a supporting fiber; the supporting fibers extend to the center of the etching liquid filling device for a certain length and form a certain included angle; etching liquid in the etching liquid filling device is sprayed to the upper panel of the flexible circuit board through the spraying nozzle;
each cleaning and drying mechanism comprises a cleaning container, a washing device and a drying device.
In a preferred embodiment of the invention, the conveying mechanism processes the upper panel of the flexible circuit board at a feeding speed of 0.5-50 m/min.
In a preferred embodiment of the invention, each spraying nozzle sprays the etching liquid at an interval of 1-2 min.
In a preferred embodiment of the present invention, the flexible circuit board is subjected to a photolithography process according to a photoresist pattern, and a patterned masking layer having a certain thickness and uniformity is formed on the surface of the flexible circuit board.
In a preferred embodiment of the invention, at least the surface of the extension part is coated with a super-hydrophilic medium layer.
In a preferred embodiment of the invention, each etching liquid filling device is provided with the reinforcing fibers with different hydrophilicity and hydrophobicity from the top layer downwards by taking three reinforcing fibers as a coating period, and the coating period comprises two super-hydrophobic medium layers and one super-hydrophilic medium layer coated.
In a preferred embodiment of the present invention, the cleaning container is provided with at least a certain concentration of alkaline solution, and the flushing device sprays water to flush the upper panel of the flexible printed circuit board, and the water flows into the cleaning container.
In a preferred embodiment of the present invention, the drying device uses compressed air to dry the flexible printed circuit board, and the temperature of the compressed air is between 40 ℃ and 120 ℃.
The invention also provides a preparation method of the full-automatic roll-to-roll flexible circuit board preparation mechanism, which is characterized by comprising the following steps of:
s1, conveying the lower panel of the flexible circuit board to a conveying roller I under the action of a discharging roller, spraying etching liquid on a spraying nozzle right above the conveying roller I, converting the spraying nozzle after spraying for a period of time, and not spraying the etching liquid above the conveying roller I in the conversion process;
s2, conveying the flexible circuit board into a cleaning container through a guide roller I, dissolving surface oxides through KOH solution, washing with water through a washing device, and drying the flexible circuit board by using compressed air;
s3, conveying the flexible circuit board to a conveying roller II, repeating the steps of spraying the etching liquid and cleaning and drying in S1 and S2, after the etching liquid is sprayed by a spraying nozzle above the conveying roller II for a period of time, converting the spraying nozzle, and spraying the upper panel of the flexible circuit board, which is not sprayed with the etching liquid, of the conveying roller I by the spraying nozzle at intervals;
and S4, conveying the flexible circuit board into a cleaning container through a guide roller II, repeating the cleaning and drying operation in the S2, and receiving the flexible circuit board through a receiving roller.
In a preferred embodiment of the present invention, in S2, the KOH solution needs to be continuously added to the alkaline solution in the cleaning container during the processing process to ensure that the concentration of the KOH solution is kept constant, and the bottom of the cleaning container needs to be continuously stirred in a direction along the feeding direction of the flexible printed circuit board.
In a preferred embodiment of the present invention, at least a hydrofluoric acid solution, a nitric acid solution or a mixed solution of hydrofluoric acid and nitric acid is added dropwise into the etching solution filling apparatus.
In a preferred embodiment of the invention, because the surface of the reinforcing fiber of the top layer is coated with the super-hydrophobic medium layer, the liquid drop can form repulsion with the surface of the reinforcing fiber, so that the contact surface of the liquid and the reinforcing fiber is always lower than the middle liquid level, and a raised liquid level with high middle part and low periphery is formed.
In a preferred embodiment of the invention, the etching liquid filling device filled with liquid and the surface of the liquid are ensured to be flat by accurately adjusting the included angle between each extending part and the top layer of the etching liquid filling device.
The invention solves the defects in the background technology, and has the following beneficial effects:
(1) the invention provides a full-automatic roll-to-roll flexible circuit board preparation mechanism, which combines a roll-to-roll conveying mode and a wet etching technology to spray etching liquid on an upper panel of a flexible circuit board, so as to achieve the aim of forming patterning, improve the production efficiency and reduce the production cost.
(2) The etching nozzles of the invention spray the etching liquid at intervals, and the etching nozzles can be switched to fill the etching liquid, so that the processing assembly line can work all the time, and an automatic control system ensures stable process circulation and is suitable for large-scale production.
(3) According to the invention, the surface of the reinforcing fiber at the top layer is coated with the super-hydrophobic medium layer, so that repulsion can be formed between liquid drops and the surface of the reinforcing fiber, the contact surface of liquid and the reinforcing fiber is lower than the middle liquid level, a raised liquid level with a high middle part and a low periphery is formed, and the liquid filled etching liquid filling device and the surface of the liquid are ensured to be flat by accurately adjusting the included angle between each extending part and the top layer of the etching liquid filling device.
(4) According to the invention, three reinforcing fibers with different hydrophilicity and hydrophobicity are arranged in each etching liquid filling device from the top layer to the bottom layer by taking the three reinforcing fibers as a coating period, the coating period comprises two super-hydrophobic medium layers and one reinforcing fiber coated with the super-hydrophilic medium layer, the repulsion of the surfaces of the reinforcing fibers to the liquid level is improved by the aid of the structure of two sides and one side, a raised structure is formed more easily, the structure is favorable for building a more three-dimensional liquid structure, and the actual amount of the added etching liquid is closer to the pre-measured amount.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below, it is obvious that the drawings in the following description are only some embodiments described in the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts;
FIG. 1 is a schematic diagram of a preferred embodiment of the present invention;
FIG. 2 is a perspective view of an etching mechanism according to a preferred embodiment of the present invention;
FIG. 3 is a perspective view showing the structure of an etching liquid filling apparatus according to a preferred embodiment of the present invention;
in the figure: 1. a full-automatic roll-to-roll flexible circuit board preparation mechanism; 2. a discharge roller; 3. a conveying roller I; 4. a guide roller I; 5. a conveying roller II; 6. a guide roller II;
7. a flexible circuit board; 8. an etching mechanism; 81. a spray nozzle; 82. spraying a cavity; 83. an etching liquid filling device; 831. a reinforcing fiber; 832. a support fiber; 9. cleaning and drying the mechanism; 10. a material receiving roller.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention, but the present invention may be practiced in other ways than those specifically described herein, and therefore the scope of the present invention is not limited by the specific embodiments disclosed below.
In the description of the present application, it is to be understood that the terms "center," "longitudinal," "lateral," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like are used in the orientation or positional relationship indicated in the drawings for convenience in describing the present application and for simplicity in description, and are not intended to indicate or imply that the referenced devices or elements must have a particular orientation, be constructed in a particular orientation, and be operated in a particular manner, and are not to be considered limiting of the scope of the present application. Furthermore, the terms "first," "second," and the like are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first," "second," etc. may explicitly or implicitly include one or more of that feature.
In the description of the present application, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art through specific situations.
Fig. 1 is a schematic diagram of a full-automatic roll-to-roll flexible circuit board manufacturing mechanism 1. The equipment combines a roll-to-roll conveying mode and a wet etching technology to spray etching liquid on the upper panel of the flexible circuit board 7, so that the purpose of forming patterning is achieved, the production efficiency is improved, and the production cost is reduced. The processing equipment of the flexible circuit board 7 comprises a conveying mechanism, a plurality of etching mechanisms 8 and a plurality of cleaning and drying mechanisms 9. The flexible circuit board 7 is subjected to a photoetching process according to the photoresist pattern, and a patterned masking layer with a certain thickness and uniformity is prepared on the surface of the flexible circuit board 7. And spraying etching liquid only at the position not covered by the masking layer to obtain the correspondingly patterned flexible circuit board 7.
The conveying mechanism comprises a discharging roller 2 for mounting a lower panel of the flexible circuit board 7, a plurality of conveying rollers arranged according to a material conveying route, a plurality of guide rollers for mounting an upper panel of the flexible circuit board 7 and a material collecting roller 10 for collecting the flexible circuit board 7. The conveying mechanism processes the upper panel of the flexible circuit board 7 at a feeding speed of 0.5-50 m/min.
As shown in fig. 2 and 3, each etching mechanism 8 includes a plurality of spray nozzles 81 and a spray chamber 82, and an etching liquid filling device 83 is adhered to the interior of the spray chamber 82. The etching liquid filling device 83 is of a cylindrical bottomless structure, and the etching liquid filling device 83 is constructed by a plurality of reinforcing fibers 831 and is connected with each reinforcing fiber 831 through a supporting fiber 832; the support fibers 832 extend a certain length toward the center of the etching liquid filling device 83 and form an included angle. The surface of the reinforcing fiber 831 of the top layer is coated with a super-hydrophobic medium layer, and at least the surface of the extended part is coated with a super-hydrophilic medium layer.
In the etching liquid filling device 83 of the present invention, hydrofluoric acid, nitric acid or a mixed solution of hydrofluoric acid and nitric acid is at least dropped. Because the surfaces of the reinforcing fibers 831 on the top layer are coated with the super-hydrophobic medium layers, the liquid drops of the etching liquid can form repulsion with the surfaces of the reinforcing fibers 831, so that the contact surface of the liquid and the reinforcing fibers 831 is lower than the middle liquid level, and a raised liquid level with a high middle part and a low periphery is formed. By accurately adjusting the included angle between each extending part and the top layer of the etching liquid filling device 83, the liquid filling etching liquid filling device 83 and the liquid surface are ensured to be flat.
The etching liquid in the etching liquid filling device 83 of the invention is sprayed to the upper panel of the flexible circuit board 7 through the spraying nozzle 81. And spraying the etching liquid by each spraying nozzle 81 at intervals of 1-2 min. The etching nozzles of the invention spray the etching liquid at intervals, and the etching nozzles can be switched to fill the etching liquid, so that the processing assembly line can work all the time, and an automatic control system ensures stable process circulation and is suitable for large-scale production.
Each etching liquid filling device 83 is provided with reinforcing fibers 831 different in hydrophilicity and hydrophobicity with three reinforcing fibers 831 as a coating period from the top layer downwards, and the coating period comprises two super-hydrophobic medium layers and one super-hydrophilic medium layer. The two-hydrophobic-one-hydrophilic structure improves the repulsion of the surface of the reinforcing fiber 831 to the liquid level, a raised structure is easier to form, the structure is favorable for constructing a more three-dimensional liquid structure, and the actual amount of the added etching liquid is closer to the pre-measurement amount.
The supporting fiber 832 is made of high-strength fiber materials, preferably aramid fibers 1414, the fiber is high in strength and stable in chemical performance, and is suitable for being used as a support of the etching liquid filling device 83, and when liquid is dripped into the surrounding space of the etching liquid filling device 83, the etching liquid filling device 83 is guaranteed not to deform.
The etching liquid filling device 83 in the spraying cavity 82 of the present invention can be used for dropping corrosive liquid, such as formic acid, acetic acid, etc. The laminated fiber of the etching liquid filling device 83 adopts polyphenylene sulfide fiber, so that the etching liquid filling device 83 is ensured to have good chemical resistance stability and excellent thermal stability. Even if the strength of the fiber is not changed after one week at the boiling point, formic acid and acetic acid at the temperature of 93 ℃ have no influence, and the fiber can be strongly degraded only under the condition of a strong oxidant, namely the etching liquid filling device 83 can detect the liquid thickness of any solution except the strong oxidant at a certain temperature and a certain concentration.
The flatness of the bottom surface of the spraying containing cavity 82 is 0 mm-0.12 mu m, so that the flatness of the bottom surface of the spraying containing cavity 82 is ensured, and the liquid thickness in each containing cavity is ensured to be consistent.
The invention adds liquid drops into the enclosed space of the etching liquid filling device 83, is not limited to the use of devices such as a burette, a quantitative liquid adding device, a digital automatic burette and the like which are manually titrated, and aims to accurately control the quantity and the volume of the liquid drops added into the etching liquid filling device 83 in a certain way. The drops can be accurately, automatically and reliably dripped by utilizing potentiometric titration, photometric titration, polarographic titration, conductometric titration, temperature titration and the like.
The invention also provides a preparation method of the roll-to-roll flexible circuit board 7 processing equipment 1, which is characterized by comprising the following steps:
s1, conveying the lower panel of the flexible circuit board 7 to a conveying roller I3 under the action of a discharging roller 2, spraying etching liquid on a spraying nozzle 81 right above the conveying roller I3, converting the spraying nozzle 81 after spraying for a period of time, and not spraying the etching liquid above the conveying roller I3 in the conversion process;
s2, conveying the flexible circuit board 7 into a cleaning container through a guide roller I4, dissolving surface oxides through KOH solution, washing with water through a washing device, and drying the flexible circuit board 7 through compressed air;
s3, conveying the flexible circuit board 7 to a conveying roller II 5, repeating the steps of spraying the etching liquid and cleaning and drying in S1 and S2, after the etching liquid is sprayed for a period of time by a spraying nozzle 81 above the conveying roller II 5, converting the spraying nozzle 81, and spraying the upper panel of the flexible circuit board 7, which is not sprayed with the etching liquid, on the conveying roller I3 by the spraying nozzle 81 at intervals;
s4, the flexible circuit board 7 is sent to a cleaning container by the guide roller II 6, the cleaning and drying operation in the S2 is repeated, and the flexible circuit board is received by the receiving roller 10.
It should be noted that in S2, the KOH solution needs to be continuously added to the alkaline solution in the cleaning container during the processing process to ensure that the concentration of the KOH solution remains unchanged, the bottom of the cleaning container needs to be continuously stirred, and the stirring direction is along the feeding direction of the flexible printed circuit board 7.
The flexible circuit board 7 upper panel after receiving the material can be subjected to quality inspection, the flexible circuit board 7 upper panel after receiving the material uses the light source to penetrate directly, and whether the flexible circuit board 7 upper panel is etched uniformly, whether the depth accords with the premeasurement, whether the phenomenon of etching dislocation, etching omission exists or not is detected according to the light received by the light sensor.
In light of the foregoing description of the preferred embodiment of the present invention, it is to be understood that various changes and modifications may be made by one skilled in the art without departing from the spirit and scope of the invention. The technical scope of the present invention is not limited to the content of the specification, and must be determined according to the scope of the claims.
Claims (10)
1. A full-automatic roll-to-roll flexible circuit board preparation mechanism comprises a conveying mechanism, a plurality of etching mechanisms and a plurality of cleaning and drying mechanisms, and is characterized in that,
the conveying mechanism comprises a discharging roller for mounting the lower panel of the flexible circuit board, a plurality of conveying rollers arranged according to a material conveying route, a plurality of guide rollers for mounting the upper panel of the flexible circuit board and a material collecting roller for collecting the flexible circuit board; the etching mechanisms are respectively arranged right above the conveying roller I and the conveying roller II, and the cleaning and drying mechanisms are respectively arranged right below the guide roller I and the guide roller II;
each etching mechanism comprises a plurality of spraying nozzles and a spraying cavity, an etching liquid filling device is adhered to the inside of the spraying cavity, the etching liquid filling device is of a cylindrical bottomless structure, and the etching liquid filling device is constructed by a plurality of reinforcing fibers and is connected with each reinforcing fiber through a supporting fiber; the supporting fibers extend to the center of the etching liquid filling device for a certain length and form a certain included angle; etching liquid in the etching liquid filling device is sprayed to the upper panel of the flexible circuit board through the spraying nozzle;
each cleaning and drying mechanism comprises a cleaning container, a washing device and a drying device.
2. The mechanism of claim 1, wherein the mechanism comprises: the conveying mechanism processes the upper panel of the flexible circuit board at a feeding speed of 0.5-50 m/min.
3. The mechanism of claim 1, wherein the mechanism comprises: and spraying etching liquid at intervals of 1-2 min by each spraying nozzle.
4. The mechanism of claim 1, wherein the mechanism comprises: the flexible circuit board is subjected to a photoetching process according to the photoresist pattern, and a patterned masking layer with a certain thickness and uniformity is prepared on the surface of the flexible circuit board.
5. The mechanism of claim 1, wherein the mechanism comprises: and a super-hydrophilic medium layer is coated on at least the surface of the extension part.
6. The mechanism of claim 1, wherein the mechanism comprises: and the three reinforcing fibers are arranged in each etching liquid filling device from the top layer downwards as a coating period, the reinforcing fibers with different hydrophilicity and hydrophobicity are arranged in the coating period, and the coating period comprises two super-hydrophobic medium layers and one super-hydrophilic medium layer coated on the two super-hydrophobic medium layers.
7. The mechanism of claim 1, wherein the mechanism comprises: the cleaning container is internally at least provided with alkaline solution with certain concentration, the flushing device sprays water to flush the upper panel of the flexible circuit board, and the water flows into the cleaning container.
8. The mechanism of claim 1, wherein the mechanism comprises: the drying device uses compressed air to dry the flexible circuit board, and the temperature of the compressed air is between 40 and 120 ℃.
9. The method for manufacturing the mechanism for manufacturing the flexible circuit board based on any one of claims 1 to 8, wherein the method comprises the following steps:
s1, conveying the lower panel of the flexible circuit board to a conveying roller I under the action of a discharging roller, spraying etching liquid on a spraying nozzle right above the conveying roller I, converting the spraying nozzle after spraying for a period of time, and not spraying the etching liquid above the conveying roller I in the conversion process;
s2, conveying the flexible circuit board into a cleaning container through a guide roller I, dissolving surface oxides through KOH solution, washing with water through a washing device, and drying the flexible circuit board by using compressed air;
s3, conveying the flexible circuit board to a conveying roller II, repeating the steps of spraying the etching liquid and cleaning and drying in S1 and S2, after the etching liquid is sprayed by a spraying nozzle above the conveying roller II for a period of time, converting the spraying nozzle, and spraying the upper panel of the flexible circuit board, which is not sprayed with the etching liquid, of the conveying roller I by the spraying nozzle at intervals;
and S4, conveying the flexible circuit board into a cleaning container through a guide roller II, repeating the cleaning and drying operation in the S2, and receiving the flexible circuit board through a receiving roller.
10. The manufacturing method of the full-automatic roll-to-roll flexible circuit board manufacturing mechanism according to claim 9, characterized in that: in the step S2, KOH solution needs to be continuously added to the alkaline solution in the cleaning container during the processing process to ensure that the concentration of the KOH solution remains unchanged, the bottom of the cleaning container needs to be continuously stirred, and the stirring direction is along the feeding direction of the flexible printed circuit board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111053534.7A CN113766757A (en) | 2021-09-09 | 2021-09-09 | Full-automatic roll-to-roll flexible circuit board manufacturing mechanism and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111053534.7A CN113766757A (en) | 2021-09-09 | 2021-09-09 | Full-automatic roll-to-roll flexible circuit board manufacturing mechanism and manufacturing method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN113766757A true CN113766757A (en) | 2021-12-07 |
Family
ID=78794098
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202111053534.7A Pending CN113766757A (en) | 2021-09-09 | 2021-09-09 | Full-automatic roll-to-roll flexible circuit board manufacturing mechanism and manufacturing method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN113766757A (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0575219A (en) * | 1991-07-25 | 1993-03-26 | Sharp Corp | Flexible circuit board and manufacture of flexible circuit board |
| CN101308953A (en) * | 2008-07-04 | 2008-11-19 | 汤献维 | Special membrane and method for manufacturing radio-frequency label antenna |
| CN112399723A (en) * | 2020-10-23 | 2021-02-23 | 武汉大学 | High-precision etching production system and method for flexible PCB |
| CN113251934A (en) * | 2021-05-12 | 2021-08-13 | 苏州爱宝德生物科技有限公司 | Liquid precise control device based on microscopic technology and preparation method thereof |
| CN217135791U (en) * | 2021-12-31 | 2022-08-05 | 四川深北电路科技有限公司 | Etching device for etching high-frequency printed circuit board |
-
2021
- 2021-09-09 CN CN202111053534.7A patent/CN113766757A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0575219A (en) * | 1991-07-25 | 1993-03-26 | Sharp Corp | Flexible circuit board and manufacture of flexible circuit board |
| CN101308953A (en) * | 2008-07-04 | 2008-11-19 | 汤献维 | Special membrane and method for manufacturing radio-frequency label antenna |
| CN112399723A (en) * | 2020-10-23 | 2021-02-23 | 武汉大学 | High-precision etching production system and method for flexible PCB |
| CN113251934A (en) * | 2021-05-12 | 2021-08-13 | 苏州爱宝德生物科技有限公司 | Liquid precise control device based on microscopic technology and preparation method thereof |
| CN217135791U (en) * | 2021-12-31 | 2022-08-05 | 四川深北电路科技有限公司 | Etching device for etching high-frequency printed circuit board |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN101027431B (en) | Plating method and plating apparatus | |
| US20120103521A1 (en) | Etching apparatus with suction mechanism | |
| CN111676493B (en) | Multifunctional device for stripping electrolytic copper foil and surface treatment | |
| CN207340309U (en) | A kind of copper-clad plate Etaching device | |
| CN107493659A (en) | A kind of FPC fine-lines preparation method | |
| CN103409752A (en) | Wet etching apparatus and wet etching method | |
| CN113766757A (en) | Full-automatic roll-to-roll flexible circuit board manufacturing mechanism and manufacturing method thereof | |
| CN111712059B (en) | Circuit PCB washes board device | |
| CN205183008U (en) | A nanometer solution automatic spraying device for SMT laser template | |
| CN102658257B (en) | One-step double surface coating device for coiled based materials | |
| CN113493923A (en) | Horizontal single-side/double-side simultaneous electroplating equipment for increasing plated area of solar cell | |
| TWI461130B (en) | Method of thin printed circuit board wet process consistency on the same carrier | |
| CN202725427U (en) | Double-face one-shot coating device for coiling base materials | |
| WO2013187036A1 (en) | Chemical processing apparatus | |
| CN218041948U (en) | Printed circuit board etching device | |
| CN202570538U (en) | Double-surface one-step coating device for coiled base materials | |
| CN111518538A (en) | Preparation method of light-emitting film, light-emitting film and display device | |
| CN217606795U (en) | Silicon wafer removes PSG equipment transport mechanism | |
| CN101942661A (en) | System and method for performing single-side continuous chemical wet treatment by using mist chemical agent | |
| CN216192849U (en) | Liquid adsorption device and solar cell electroplating device | |
| CN107249257A (en) | The IC support plate preparation methods of novel environment friendly | |
| CN114703538A (en) | Copper removing device for conductive belt | |
| CN215529449U (en) | PCB hinders and welds development unclean detection device | |
| CN209766120U (en) | Printed electronic manufacturing equipment and assembly line thereof | |
| CN102117701B (en) | Dye-sensitization solar battery electrode manufacturing equipment and solar battery manufacturing method |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20211207 |