CN113759228A - Acceptance test system and method - Google Patents
Acceptance test system and method Download PDFInfo
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- CN113759228A CN113759228A CN202111062975.3A CN202111062975A CN113759228A CN 113759228 A CN113759228 A CN 113759228A CN 202111062975 A CN202111062975 A CN 202111062975A CN 113759228 A CN113759228 A CN 113759228A
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/26—Testing of individual semiconductor devices
- G01R31/2601—Apparatus or methods therefor
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
Abstract
The embodiment of the disclosure discloses an acceptance test system and method. The acceptance test system comprises: the bearing table is used for bearing an object to be tested; a test head for mounting a probe card having a probe; when detecting the electrical parameters of the object to be detected, the test head is positioned above the bearing table, and the probe on the probe card can be contacted with the object to be detected; the test unit is connected with the probe card and is used for detecting the electrical parameters of the object to be detected when the probe is contacted with the object to be detected; the control unit is respectively connected with the bearing table, the test head and the test unit and is used for sending an adjusting instruction to the bearing table or/and the test head when the electrical parameter does not meet the preset condition; the adjusting instruction comprises information for indicating the distance between the adjusting bearing platform and the testing head; and the control unit is also used for carrying out acceptance test on the object to be tested when the electrical parameters meet the preset conditions.
Description
Technical Field
The embodiment of the disclosure relates to the field of semiconductor device testing, in particular to an acceptance testing system and method.
Background
In order to ensure the quality of the finished wafers and the stability of the production line process, semiconductor manufacturers must perform a Wafer Acceptance Test (WAT) on the wafers, wherein the WAT Test detects the electrical characteristics of the wafers to be tested by inserting probes on the wafers to be tested. If the test result is qualified, the processing technology of the tested wafer is normal, and the quality of the wafer is qualified.
Before the wafer acceptance test is performed, the test needle pressure of the probe card needs to be set. The accuracy of the setting of the test probe pressure directly affects the quality of the contact between the probe in the probe card and the wafer to be tested, and further affects the accuracy of the acceptance test result of the wafer. The current method for setting the test needle pressure is to feed back and adjust the needle pressure by manually observing the size of the needle mark of the probe card on the wafer to complete the setting of the test needle pressure, however, the method has a large error. Therefore, how to set the test needle pressure more accurately becomes a technical problem to be solved urgently.
Disclosure of Invention
In view of this, the embodiments of the present disclosure provide an acceptance test system and method.
According to a first aspect of embodiments of the present disclosure, there is provided an acceptance test system, comprising:
the bearing table is used for bearing an object to be tested;
a test head for mounting a probe card having a probe; when detecting the electrical parameters of the object to be detected, the test head is positioned above the bearing table, and the probe on the probe card can be contacted with the object to be detected;
the test unit is connected with the probe card and is used for detecting the electrical parameters of the object to be detected when the probe is contacted with the object to be detected;
the control unit is respectively connected with the bearing table, the test head and the test unit and is used for sending an adjusting instruction to the bearing table or/and the test head when the electrical parameter does not meet a preset condition; wherein the adjustment instruction comprises information indicating to adjust the distance between the bearing table and the test head;
the control unit is further used for performing acceptance test on the object to be tested when the electrical parameters meet the preset conditions.
In some embodiments, the control unit is further configured to determine that the electrical parameter does not satisfy the preset condition when the electrical parameter of the object to be tested corresponding to the adjusted distance between the carrier and the test head is smaller than the electrical parameter of the object to be tested corresponding to the adjusted distance between the carrier and the test head.
In some embodiments, the control unit is further configured to determine that the electrical parameter satisfies the preset condition when the electrical parameter of the object to be tested corresponding to the adjusted distance between the carrier and the test head is equal to or greater than the electrical parameter of the object to be tested corresponding to the adjusted distance between the carrier and the test head.
In some embodiments, the control unit is further configured to determine a target test needle pressure according to a distance between the carrier and the test head after determining that the electrical parameter satisfies the preset condition; and the target test needle pressure is used as the initial test needle pressure when the next object to be tested is detected.
In some embodiments, the adjustment value for adjusting the distance between the carrier and the test head each time is a fixed value;
or the like, or, alternatively,
and adjusting the distance between the bearing platform and the test head for the next time, wherein the adjustment value is smaller than the adjustment value of the distance between the bearing platform and the test head for the last time.
In some embodiments, when the number of times of use of the probe card is less than a preset value, adjusting the adjustment value of the distance between the bearing table and the test head to be a fixed value each time;
and when the using times of the probe card is more than or equal to the preset value, adjusting the adjustment value of the distance between the bearing table and the test head next time, wherein the adjustment value of the distance between the bearing table and the test head last time is less than the adjustment value of the distance between the bearing table and the test head last time. In some embodiments, the carrier stage is movable towards or away from the test head, or/and the test head is movable towards or away from the test head.
According to a second aspect of the embodiments of the present disclosure, there is provided a acceptance test method for testing an object to be tested by using a probe card having probes, the method including:
detecting the electrical parameters of the object to be detected;
when the electrical parameter does not meet the preset condition, adjusting the distance between the bearing table and the test head;
and when the electrical parameter meets the preset condition, performing acceptance test on the object to be tested.
In some embodiments, the method further comprises:
after the distance between the bearing platform and the test head is adjusted, detecting the electrical parameters of the corresponding object to be tested;
and when the electrical parameter of the object to be tested corresponding to the adjusted distance between the bearing platform and the test head is smaller than the electrical parameter of the object to be tested corresponding to the adjusted distance between the bearing platform and the test head, determining that the electrical parameter does not meet the preset condition. In some embodiments, the method further comprises:
after the distance between the bearing platform and the test head is adjusted, detecting the electrical parameters of the corresponding object to be tested;
and when the electrical parameter of the object to be tested corresponding to the adjusted distance between the bearing platform and the test head is equal to or larger than the electrical parameter of the object to be tested corresponding to the adjusted distance between the bearing platform and the test head, determining that the electrical parameter meets the preset condition.
In some embodiments, the method further comprises: after determining that the electrical parameter satisfies the predetermined condition,
determining target test needle pressure according to the distance between the bearing table and the test head; and the target test needle pressure is used as the initial test needle pressure when the next object to be tested is detected.
In some embodiments, the adjusting the distance between the carrier and the test head when the electrical parameter does not satisfy the predetermined condition includes:
adjusting the distance between the bearing table and the test head by a fixed value every time;
or the like, or, alternatively,
and adjusting the distance between the bearing platform and the test head by an adjustment value smaller than the distance between the bearing platform and the test head adjusted last time. In some embodiments, the method further comprises:
when the using times of the probe card are smaller than a preset value, adjusting the distance between the bearing table and the test head by a fixed value each time;
and when the using times of the probe card is greater than or equal to the preset value, adjusting the distance between the bearing table and the test head by an adjustment value which is smaller than the adjustment value of the distance between the bearing table and the test head at the last time.
In some embodiments, the adjusting a distance between the carrier and the test head comprises:
moving the stage in a direction towards or away from the test head;
and/or the first and/or second light sources,
moving the test head in a direction towards or away from the carrier.
According to a third aspect of embodiments of the present disclosure, there is provided a test apparatus comprising:
a memory for storing executable instructions;
a processor, configured to execute the executable instructions stored in the memory, to implement the method described in any of the above embodiments.
According to a fourth aspect of the embodiments of the present disclosure, there is provided a computer-readable storage medium storing executable instructions for implementing the method described in any of the above embodiments when the executable instructions are executed by a processor.
In the embodiment of the disclosure, the test unit detects an electrical parameter of the object to be tested when the probe contacts the object to be tested, and when the electrical parameter does not meet a preset condition, the control unit may send an adjustment instruction to the carrying table or/and the test head to adjust a distance between the carrying table carrying the object to be tested and the test head mounting the probe card, so as to change a contact state of the probe and the object to be tested, and when the electrical parameter meets the preset condition, the object to be tested may be tested.
The acceptance test system in the embodiment of the disclosure can automatically complete the setting of the test acupressure without manual participation, reduces the acupressure setting deviation caused by subjectivity in the process of manually setting the test acupressure, and is favorable for improving the objectivity and the accuracy of the test acupressure setting.
In addition, through setting up the control unit in this disclosed embodiment, can rationally control the information of instructing the distance between adjustment plummer and the test head to make the surface contact of probe and determinand abundant. The problem that the surface contact area of the probe and the object to be detected is small to influence the transmission of an electric signal due to the fact that the probe penetrates into the surface of the object to be detected to be too shallow can be avoided, the problem that the service life of the probe card is shortened due to the fact that the probe penetrates into the surface of the object to be detected to be too deep can also be avoided, and even the problem that the probe penetrates into the unit to be detected to be too deep to damage the structure of the unit to be detected in the object to be detected can be solved.
Drawings
FIG. 1 is an illustration of an acceptance test system in accordance with an embodiment of the present disclosure;
fig. 2a to 2c are schematic diagrams illustrating an acceptance test state of an object to be tested according to an embodiment of the disclosure;
FIG. 3 is a schematic flow chart diagram illustrating a method of acceptance testing according to an embodiment of the present disclosure;
FIG. 4 is a flow chart illustrating a method for wafer acceptance testing in accordance with an embodiment of the present disclosure;
fig. 5 is a diagram illustrating wafer acceptance test data in accordance with an embodiment of the present disclosure.
Detailed Description
The technical solutions of the present disclosure will be further explained in detail with reference to the drawings and examples. While exemplary implementations of the present disclosure are shown in the drawings, it should be understood that the present disclosure may be embodied in various forms and should not be limited by the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the disclosure to those skilled in the art.
The present disclosure is more particularly described in the following paragraphs with reference to the accompanying drawings by way of example. Advantages and features of the present disclosure will become apparent from the following description and claims. It is to be noted that the drawings are in a very simplified form and are not to precise scale, which is merely for the purpose of facilitating and distinctly claiming the embodiments of the present disclosure.
It is to be understood that the meaning of "on … …," "over … …," and "over … …" of the present disclosure should be read in the broadest manner such that "on … …" not only means that it is "on" something without intervening features or layers therebetween (i.e., directly on something), but also includes the meaning of being "on" something with intervening features or layers therebetween.
In the embodiments of the present disclosure, the terms "first," "second," "third," and the like are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order.
In the disclosed embodiment, the term "a is in contact with B" includes the case where a is in direct contact with B, or A, B is in contact with B indirectly with another component interposed between the two.
It should be noted that although the present description is described in terms of embodiments, not every embodiment includes only a single technical solution, and such description of the embodiments is merely for clarity, and those skilled in the art should make the description as a whole, and the technical solutions in the embodiments may be appropriately combined to form other embodiments that can be understood by those skilled in the art. .
The features disclosed in the system or method embodiments provided by the present disclosure may be combined in any combination without conflict.
As the feature size of the chips is continuously reduced, the number of chips carried on a single wafer is increased. When a wafer acceptance test is performed, acceptance tests need to be performed on a plurality of chip pins on the wafer. In order to reduce the test cost and improve the test efficiency, in the related art, a probe card including a plurality of probes is used to simultaneously probe a plurality of chips on a wafer for testing.
Specifically, a plurality of probes of the probe card are respectively aligned to chips to be tested on the wafer, the current needle pressure is fed back by manually observing the size of a needle mark clamped on the wafer by the probes, the test needle pressure of the probe card is adjusted according to a feedback result until the probes of the probe card are contacted with the chips to be tested, the setting of the test needle pressure is completed, and the wafer acceptance test is started.
It should be noted that, when the probe card performs acceptance test on the wafer, the probe card performs pressure loading on the bonding pads or the bumps on the wafer, and pin marks are left on the bonding pads or the bumps, that is, the test pin pressure. The magnitude of the test probe pressure can be reflected by the depth of the probe penetrating into the wafer, and the deeper the probe penetrates into the wafer, the larger the test probe pressure. However, there is a certain subjective one-sidedness in adjusting the test probe pressure by manually observing the size of the probe mark on the wafer, so that the current test probe pressure may deviate from the target test probe pressure. It should be noted that when the testing acupressure is substantially equal to the target testing acupressure, it indicates that all probes on the probe card are in sufficient contact with the surface of the wafer to be tested, and here, the sufficient contact between the probes and the surface of the wafer to be tested indicates that the probes do not penetrate into the wafer to be tested too shallow, so as to avoid the influence on the transmission of the electrical signals due to the small contact area between the probes and the surface of the wafer to be tested, or the probes do not penetrate into the wafer to be tested too deep, so that the loss of the probes in the testing process is small or negligible.
For example, when the probe card has too small a testing needle pressure, i.e. the testing needle pressure is smaller than the target testing needle pressure, at least part of the probes of the probe card may not contact with part of the chips to be tested on the wafer sufficiently, which reduces the accuracy of the wafer acceptance test result. When the test needle pressure of the probe card is set to be too large, that is, the test needle pressure is greater than the target test needle pressure, part of the probes may be worn, and the service life of the probe card may be reduced.
In view of this, the embodiments of the present disclosure provide an acceptance test system and method.
FIG. 1 is an illustration of an acceptance test system in accordance with an embodiment of the disclosure. Referring to FIG. 1, an acceptance test system 100 includes:
a bearing table 20 for bearing the object 10;
a test head 40 for mounting a probe card 30 having probes 31; when detecting the electrical parameters of the object 10 to be tested, the test head 40 is located above the carrying table 20, and the probes 31 on the probe card 30 can contact with the object 10 to be tested;
a test unit 50 connected to the probe card 30 for detecting an electrical parameter of the object 10 when the probe 31 contacts the object 10;
the control unit 60 is respectively connected with the bearing table 20, the test head 40 and the test unit 50, and is used for sending an adjusting instruction to the bearing table 20 or/and the test head 40 when the electrical parameter does not meet the preset condition; wherein the adjustment instruction comprises information indicating to adjust the distance between the carrier 20 and the test head 40;
the control unit 60 is further configured to perform an acceptance test on the object 10 to be tested when the electrical parameter satisfies a preset condition.
The analyte 10 includes: a wafer to be tested, a semiconductor device chip or other product requiring acceptance testing. The wafer to be tested may include a wafer carrying a gate stack structure or a wafer carrying phase change memory cells. The semiconductor device chip may include a memory chip or a power amplification device chip, etc. It should be noted that the wafer to be tested may be a complete wafer or a part of a wafer after dicing.
It should be emphasized that the object under test is not included in the test system, and the object under test (shown by dotted lines) in fig. 1 is only illustrated to facilitate understanding of the position relationship between the object under test and the stage and the probe card when performing the acceptance test.
In some embodiments, the carrier stage 20 may further include: and a chuck (not shown) disposed on the surface of the stage 20 for fixing the object 10.
It should be emphasized that the object 10 is only shown schematically in fig. 1, and the stage 20 can carry a plurality of objects, and the stage can include a plurality of chucks, each for fixing one object.
The test head 40 may fixedly mount the probe card 30 and may detachably mount the probe card 30. In the disclosed embodiment, the test head 40 detachably mounts the probe card 30. It will be appreciated that probe card 30 can be mounted on test head 40 during acceptance testing and probe card 30 can be removed from test head 40 at the end of acceptance testing.
The probe card 30 includes a plurality of probes 31, and may be of any shape, such as square, circular, etc. The number of probes that can be loaded on the probe card may vary from 1 to 1000. The probes in the probe card are used to make contact with the wafer so that the test unit transmits electrical signals (voltage or current) to the unit under test on the object under test.
The constituent materials of the probe 31 include: tungsten (W), beryllium copper (BeCu) alloys or palladium (Pd) alloys.
The test unit 50 is connected to the probe card 30, and the test unit 50 can apply a test input signal to the object to be tested 10 and receive a measurement output signal when the probes 31 are in contact with the object to be tested 20.
The electrical parameters may include: resistance value, voltage value, or current value. For example, the test unit may apply an input voltage to the test object and receive an output current of the test object. The test unit can also apply input current to the object to be tested and receive output voltage of the object to be tested. The test unit can also determine the resistance according to the ratio of the input voltage to the output current or the ratio of the output voltage to the input current.
The electrical parameter not meeting the preset condition may indicate that the probe of the probe card and the unit to be tested of the object to be tested are in an initial contact state or an intermediate contact state, and the current testing needle pressure is less than the target testing needle pressure. It should be emphasized that when the current testing needle pressure is smaller than the target testing needle pressure, the electrical parameters will change continuously along with the change of the current testing needle pressure, that is, the values of at least two adjacent electrical parameters detected do not reach a stable state. Taking the electrical parameter as an example of resistance, when the current testing needle pressure is smaller than the target testing needle pressure, the detected resistance decreases with the increase of the testing needle pressure. Specifically, as the test probe pressure increases, the contact area between the probe and the object to be tested increases, and the contact resistance between the probe and the object to be tested decreases, at this time, it may be determined that the electrical parameter does not satisfy the preset condition.
The electrical parameter satisfying the predetermined condition indicates that the probe of the probe card is in a complete contact state with the unit to be tested of the object to be tested, and the current testing probe pressure is substantially equal to the target testing probe pressure. Here, the current test needle pressure being substantially equal to the target test needle pressure includes: the current test needle pressure is completely equal to the target test needle pressure, or the difference range of the current test needle pressure and the target test needle pressure is smaller than the preset value (for example, within an allowable error range). It is emphasized that when the current test pin pressure is substantially equal to the target test pin pressure, the electrical parameter (e.g., resistance) no longer changes as the test pin pressure increases. Namely, the values of at least two adjacent detected electrical parameters basically reach a stable state.
In general, there may be a certain difference in distance between tips of a plurality of probes in a probe card and a stage. Also, as the number of probe uses increases or probe wear due to other reasons, the difference between the distances between the tips of the plurality of probes in the probe card and the stage may be further increased. Therefore, the contact between the probe in the probe card and the object to be tested can include at least three contact states: an initial contact state, an intermediate contact state, and a full contact state. The three contact states will be described with reference to fig. 2a to 2c by taking a probe card including 4 probes as an example.
Referring to fig. 2a, the probe card 30 includes: probe 311, probe 312, probe 313, and probe 314. The object 10 includes a unit under test 11, a unit under test 12, a unit under test 13, and a unit under test 14. Each probe in the probe card corresponds to one unit to be tested in the object to be tested.
The initial contact state indicates a state in which a tip of at least one probe in the probe card starts to contact a cell to be tested in the object to be tested. For example, the initial contact state is considered when the number of probes on the probe card contacting the unit to be tested in the object to be tested does not reach 5% of the total number of probes on the probe card. Referring to fig. 2a, taking the probe 311 in the probe card as an example, the tip of the probe 311 starts to contact the unit under test 11, and the tip of the probe 311 is located on the AA 'horizontal line, where the plane of the AA' horizontal line is coincident with the plane of the upper surface 10a of the object under test 10.
The intermediate contact state indicates a state in which the tip of at least one probe in the probe card has not yet contacted the unit under test in the object under test. For example, the middle contact state is considered when the number of probes on the probe card contacting the unit to be tested in the object to be tested has reached 5% of the total number of probes on the probe card and has not reached 95% of the total number of probes on the probe card. Referring to FIG. 2b, the tips of the probes 312 and 313 do not reach the plane of the horizontal AA', i.e., the tips of the probes 312 and 313 do not contact the upper surface 10a of the object 10. At this time, the tip of the probe 314 comes into contact with the unit under test 14, the tip of the probe 314 is on the AA 'horizontal line, and the tip of the probe 311 is on the BB' horizontal line, where the plane of the BB 'horizontal line does not coincide with the plane of the AA' horizontal line (i.e., the upper surface 10a of the object 10). It will be appreciated that the intermediate contact state may comprise a plurality of intermediate contact sub-states.
The full contact state indicates a state in which each probe in the probe card is in contact with a corresponding unit under test in the object under test, respectively. For example, when the number of probes on the probe card contacting the unit to be tested in the object to be tested reaches 95% of the total number of probes on the probe card, the probe card is considered to be in a complete contact state. Referring to fig. 2c, the probes 311, 312, 313, 314 are in one-to-one contact with the unit under test 11, the unit under test 12, the unit under test 13, and the unit under test 14. The tip of the probe 311 is on the CC' horizontal line. Here, the plane of the CC ' horizontal line does not coincide with the plane of the BB ' horizontal line, the plane of the AA ' horizontal line.
It will be appreciated that a probe is considered to be in contact with a cell to be tested when its tip is in the plane of the horizontal AA'. Since the tip of the probe is generally tapered, in order to ensure that the probe is in full contact with the unit to be tested, the tip of the probe should be properly inserted into the surface of the unit to be tested to a certain depth, so as to reduce the interface resistance between the probe and the unit to be tested.
In the related art, whether the contact state of the probe card and the object to be tested reaches the complete contact state is judged by observing the size of the pin mark on the object to be tested by a tester. And when the full contact state is not reached, the tester continuously increases the test needle pressure.
However, by manually observing the needle marks and setting the test needle pressure, on one hand, a certain error may exist when the probe card and the test system are manually judged to be in a complete contact state, so that a deviation exists between the test needle pressure set by the probe card and the test system and the target test needle pressure, the fluctuation range of the test result is large, and the accuracy of the test result is reduced.
On the other hand, for the same probe card, the too small pressure of the probe card testing needles may cause insufficient contact between at least part of the probes of the probe card and the corresponding chips to be tested on the wafer, and reduce the accuracy of the wafer acceptance test result. The over-pressure of the probe card testing needle can reduce the service life of the probe card, and even damage the structure of the unit to be tested in the object to be tested because the probe penetrates into the unit to be tested too deeply.
In the embodiment of the disclosure, the test unit detects an electrical parameter of the object to be tested when the probe contacts the object to be tested, and when the electrical parameter does not meet a preset condition, the control unit may send an adjustment instruction to the carrying table or/and the test head to adjust a distance between the carrying table carrying the object to be tested and the test head mounting the probe card, so as to change a contact state of the probe and the object to be tested, and when the electrical parameter meets the preset condition, the object to be tested may be tested. The acceptance test system in the embodiment of the disclosure can automatically complete the setting of the test acupressure without manual participation, reduces the acupressure setting deviation caused by subjectivity in the process of manually setting the test acupressure, and is favorable for improving the objectivity and the accuracy of the test acupressure setting.
In addition, through setting up the control unit in this disclosed embodiment, can rationally control the information of instructing the distance between adjustment plummer and the test head to make the surface contact of probe and determinand abundant. The problem that the surface contact area of the probe and the object to be detected is small to influence the transmission of an electric signal due to the fact that the probe penetrates into the surface of the object to be detected to be too shallow can be avoided, the problem that the service life of the probe card is shortened due to the fact that the probe penetrates into the surface of the object to be detected to be too deep can also be avoided, and even the problem that the probe penetrates into the unit to be detected to be too deep to damage the structure of the unit to be detected in the object to be detected can be solved.
In some embodiments, the control unit is further configured to determine that the electrical parameter does not satisfy the predetermined condition when the electrical parameter of the object to be tested corresponding to the adjusted distance between the carrier and the test head is smaller than the electrical parameter of the object to be tested corresponding to the adjusted distance between the carrier and the test head.
Exemplarily, when the value of the position parameter of the carrier 20 is the nth position value and the value of the position parameter of the test head 40 is the mth position value, the test unit detects the lth electrical parameter of the object to be tested, and obtains the lth parameter value. When the value of the position parameter of the carrier 20 is the (N +1) th position value and the value of the position parameter of the test head 40 is the M-th position value, the test unit detects the (L +1) th electrical parameter of the object to be tested, and obtains the (L +1) th parameter value. And when the (L +1) th parameter value is smaller than the L-th parameter value, determining that the probe of the probe card and the unit to be tested of the object to be tested are not in a complete contact state, namely the electrical parameter is not over the preset condition, and continuously increasing the test needle pressure. Here, N, M and L are both natural numbers, and the same shall not be repeated hereinafter.
Exemplarily, when the value of the position parameter of the carrier 20 is the nth position value and the value of the position parameter of the test head 40 is the mth position value, the test unit detects the lth electrical parameter of the object to be tested, and obtains the lth parameter value. When the value of the position parameter of the carrier 20 is the nth position value and the value of the position parameter of the test head 40 is the (M +1) th position value, the test unit detects the (L +1) th electrical parameter of the object to be tested, and obtains the (L +1) th parameter value. And when the (L +1) th parameter value is smaller than the L-th parameter value, determining that the probe of the probe card and the unit to be tested of the object to be tested are not in a complete contact state, namely the electrical parameter is not over the preset condition, and continuously increasing the test needle pressure.
Exemplarily, when the value of the position parameter of the carrier 20 is the nth position value and the value of the position parameter of the test head 40 is the mth position value, the test unit detects the lth electrical parameter of the object to be tested, and obtains the lth parameter value. When the value of the position parameter of the bearing table 20 is the (N +1) th position value and the value of the position parameter of the test head 40 is the (M +1) th position value, the test unit detects the (L +1) th electrical parameter of the object to be tested, and obtains the (L +1) th parameter value. And when the (L +1) th parameter value is smaller than the L-th parameter value, determining that the probe of the probe card and the unit to be tested of the object to be tested are not in a complete contact state, namely the electrical parameter is not over the preset condition, and continuously increasing the test needle pressure.
It is emphasized that in the above three examples, when the position parameters of the carrier 20 have different values, the carrier 20 is at different heights (for example, the (N +1) th position value is higher than the nth position value, and the (N +1) th position value is relatively close to the test head 40, i.e. the carrier 20 moves towards the test head 40). When the values of the position parameters of the test head 40 are different, the test head 40 is at different heights (for example, the (M +1) th position value is lower than the M-th position value, the (M +1) th position value is relatively close to the carrier 20, that is, the test head 40 moves toward the carrier 20), that is, the object to be tested is at different heights, the object to be tested and the probe are in different contact states, and different electrical parameters can be generated according to the different contact states of the object to be tested and the probe.
For example, referring to fig. 2a to 2c, the description will be given by taking the contact resistance as an electrical parameter, where the contact resistance is R when the object to be tested and the probe are in the initial contact state (refer to fig. 2a)10When the object to be measured and the probe are in an intermediate contact state (see FIG. 2b), the contact resistance is R20When the object to be measured and the probe are in a complete contact state (see FIG. 2c), the contact resistance is R30And satisfies the relationship: r10＞R20＞R30And the testing needle pressure is continuously increased, and the contact resistance is not changed any more.
In the actual test procedure, the intermediate contact state may also include a plurality of intermediate contact sub-states from which different contact resistances, e.g., R, may be detected11、R12……R19、R20……R28、R29And satisfy the relationship：R10＞R11＞R12＞…R19＞R20＞…＞R28＞R29＞R30。
In the embodiment of the disclosure, by comparing the values of the electrical parameter of the object to be tested at different position values, when the object to be tested and the probe are not in a complete contact state, it can be determined that the electrical parameter does not satisfy the preset condition, so that the control unit can send an adjustment instruction to the bearing table or/and the test head in time to continue adjusting the test probe pressure.
In some embodiments, referring to FIG. 1, acceptance test system 100 further comprises:
a first acquiring assembly 70 connected with the bearing platform 20 and the testing unit 50 and used for acquiring a position parameter indicating the bearing platform 20;
a first acquisition assembly 80 is coupled to test head 40 and test unit 50 for acquiring positional parameters indicative of test head 40.
The first acquisition assembly 70 and the second acquisition assembly 80 include: a displacement sensor or a position sensor. The first acquisition component 70 and the second acquisition component 80 may be the same or different, and the disclosure is not limited thereto.
In some embodiments, the control unit is further configured to determine that the electrical parameter satisfies the predetermined condition when the electrical parameter of the object to be tested corresponding to the adjusted distance between the carrier and the test head is equal to or greater than the electrical parameter of the object to be tested corresponding to the adjusted distance between the carrier and the test head.
For example, when the position parameter of the carrier 20 is the nth position value and the position parameter of the test head 40 is the mth position value, the contact resistance between the object to be tested and the probe is RLWhen the position parameter of the carrier 20 is the (N +1) th position value and the position parameter of the test head 40 is the M-th position value, the contact resistance between the object to be tested and the probe is RL+1And satisfies the relationship: rL+1≥RLAnd determining the state that the object to be detected and the probe are completely contacted.
Illustratively, the value of the position parameter of the carrier 20 is the Nth position value, and the value of the position parameter of the test head 40 is takenWhen the value is the Mth position value, the contact resistance between the object to be measured and the probe is RLWhen the position parameter of the carrier 20 is the nth position value and the position parameter of the test head 40 is the (M +1) th position value, the contact resistance between the object to be tested and the probe is RL+1And satisfies the relationship: rL+1≥RLAnd determining the state that the object to be detected and the probe are completely contacted.
For example, when the position parameter of the carrier 20 is the nth position value and the position parameter of the test head 40 is the mth position value, the contact resistance between the object to be tested and the probe is RLWhen the position parameter of the carrier 20 is the (N +1) th position value and the position parameter of the test head 40 is the (M +1) th position value, the contact resistance between the object to be tested and the probe is RL+1And satisfies the relationship: rL+1≥RLAnd determining the state that the object to be detected and the probe are completely contacted.
It is emphasized that during the actual test, R appears for the first timeL+1Is equal to RLIn the meantime, it is not immediately determined that the object to be measured and the probe are in a complete contact state, and several times of verification are required, and when the contact resistance is not changed any more, it is determined that the object to be measured and the probe are in a complete contact state. During the verification process, R may appearL+2Is equal to RL+1，RL+3Greater than RL+2In the case of (A), RL+3Is generally small and negligible.
In the embodiment of the disclosure, by comparing the electrical parameter values of the object to be tested at different position values, when the object to be tested and the probe reach a complete contact state, it can be determined that the electrical parameter satisfies the preset condition, so as to perform acceptance test on the object to be tested.
In some embodiments, the control unit is further configured to determine a target test needle pressure according to a distance between the carrier and the test head after determining that the electrical parameter satisfies a preset condition; wherein, the target test probe pressure is used as the initial test probe pressure when detecting the next object to be tested.
For example, when the position parameter of the carrier 20 is the (N +1) th position value and the position parameter of the test head 40 is the mth position value, the object to be tested and the probe are in a complete contact state, a target test acupressure may be determined according to a distance between the (N +1) th position value of the carrier 20 and the mth position value of the test head 40, and the target test acupressure may be used as an initial test acupressure of a next object to be tested. For example, when the acceptance test of the next object to be tested is performed, the value of the initial position parameter of the stage 20 is set to the (N +1) th position value, and the value of the initial position parameter of the test head 40 is set to the mth position value.
For example, when the position parameter of the carrier 20 is the nth position value and the position parameter of the test head 40 is the (M +1) th position value, the object to be tested and the probe are in a complete contact state, a target test acupressure may be determined according to a distance between the nth position value of the carrier 20 and the (M +1) th position value of the test head 40, and the target test acupressure may be used as an initial test acupressure of a next object to be tested. For example, when the acceptance test of the next object to be tested is performed, the value of the initial position parameter of the stage 20 is set to the nth position value, and the value of the initial position parameter of the test head 40 is set to the (M +1) th position value.
For example, when the position parameter of the carrier 20 is the (N +1) th position value and the position parameter of the test head 40 is the (M +1) th position value, the object to be tested and the probe are in a complete contact state, a target test acupressure may be determined according to a distance between the (N +1) th position value of the carrier 20 and the (M +1) th position value of the test head 40, and the target test acupressure may be used as an initial test acupressure of a next object to be tested. For example, when the acceptance test of the next object to be tested is performed, the value of the initial position parameter of the stage 20 is set to the (N +1) th position value, and the value of the initial position parameter of the test head 40 is set to the (M +1) th position value.
In the embodiment of the disclosure, after the electrical parameter meets the preset condition, the target testing needle pressure of the current object to be tested can be determined, and the target testing needle pressure of the current object to be tested is used as the initial testing needle pressure of the next object to be tested, so that the setting process of the testing needle pressure of the next object to be tested can be simplified, the setting time of the testing needle pressure of the next object to be tested is saved, and the acceptance testing efficiency of the next object to be tested is improved.
In some embodiments, the adjustment value for adjusting the distance between the carrier and the test head is a fixed value each time;
or the like, or, alternatively,
the adjustment value of the distance between the bearing platform and the test head is adjusted next time and is smaller than the adjustment value of the distance between the bearing platform and the test head which is adjusted last time.
For example, after determining that the electrical parameter does not satisfy the preset condition, the control unit sends an adjustment instruction to the carrier to drive the carrier to move in a direction approaching the test head, where a variation of a current distance of the carrier may be equal to or smaller than a variation of a previous distance, or/and after determining that the electrical parameter does not satisfy the preset condition, the control unit sends an adjustment instruction to the test head to drive the test head to move in a direction approaching the carrier, and a variation of a current distance of the test head may be equal to or smaller than a variation of a previous distance. The amount of change in distance here represents the absolute value of the difference between the position after the stage/test head has moved and the position before the movement.
It is understood that, during the process of moving the carrier to the direction close to the test head or/and moving the test head to the direction close to the carrier, the distance between the carrier and the test head becomes smaller and smaller, and the adjustment value at each time may be a fixed value, or the adjustment value at the next time is smaller than the adjustment value at the previous time, which is not limited herein. Preferably, the next adjustment value is smaller than the previous adjustment value, and the probe is prevented from being damaged and failing in the acceptance test due to the fact that the probe suddenly penetrates too deep into the object to be tested in a mode of setting the adjustment value of each time to be smaller and smaller.
In some embodiments, when the number of times of using the probe card is less than a preset value, the adjustment value for adjusting the distance between the bearing table and the test head is a fixed value each time;
when the using times of the probe card is more than or equal to the preset value, the adjusting value of the distance between the bearing table and the test head is adjusted next time and is smaller than the adjusting value of the distance between the bearing table and the test head is adjusted last time.
For example, the adjustment command sent by the control unit to the carrier stage or/and the test head can be adjusted according to the number of uses of the probe card. Specifically, when the number of times of use of the probe card is less than the preset value, it can be considered that the probe of the probe card is not worn or the degree of wear is negligible, and the adjustment value for adjusting the distance between the carrier table and the test head next time can be equal to the adjustment value for adjusting the distance between the carrier table and the test head last time, that is, the adjustment value for adjusting the distance between the carrier table and the test head each time is a fixed value. When the number of times of use of the probe card is greater than or equal to the preset value, the degree of wear of the probe card can be considered to be large, and the adjustment value for adjusting the distance between the bearing table and the test head next time can be smaller than the adjustment value for adjusting the distance between the bearing table and the test head last time.
In practical applications, the acceptance test system needs to perform acceptance tests on multiple batches of objects to be tested. For example, when the test probe pressure of the X-th lot of the objects to be tested is set, if the number of times of using the probe card is less than the preset value, the adjustment value of the distance between the carrier and the test head may be a fixed value d1. When setting the test probe pressure of the (X +1) th batch of the objects to be tested, if the using times of the probe card is more than or equal to the preset value, the adjusting values of the distance between the bearing platform and the test head sequentially comprise d1、d2、d3、……dnAnd satisfy the relationship d1＞d2＞d3＞……＞dnAnd n is a natural number.
It will be appreciated that, for example, during actual wafer acceptance, testing of multiple batches of wafers may be required. After the wafer testing of the same batch is completed, the needle point of the probe in the probe card may be worn, and the service life parameters of the using times of the probe are reduced.
In some embodiments, the carrier stage can be moved toward or away from the test head, or/and the test head can be moved toward or away from the test head.
For example, when the setting of the test needle pressure is performed, the carrier stage may move towards the test head, or/and the test head may move towards the carrier stage, so as to reduce the distance between the carrier stage and the test head and increase the needle pressure applied by the probe on the surface of the object to be tested, so as to complete the setting of the test needle pressure.
For example, at the end of the acceptance test of the current lot of the objects to be tested, the carrier stage may be moved away from the test head, or/and the test head may be moved away from the carrier stage to increase the distance between the carrier stage and the test head and remove the probe pressure applied to the surface of the current lot of the objects to be tested to perform the acceptance test of the next lot of the objects to be tested.
In some embodiments, acceptance test system 100 further comprises:
a first drive assembly connected to the stage 20 and the control unit 50 for driving the stage towards or away from the test head;
and a second driving assembly connected to the test head 40 and the control unit 50 for driving the test head toward or away from the carrier stage. The first and second drive assemblies include: automatic lifting devices, pneumatic lifting devices, hydraulic lifting devices or mechanical lifting devices. The first driving assembly and the second driving assembly may be the same or different, and the disclosure is not limited thereto.
Fig. 3 is a schematic flow chart illustrating a method for acceptance testing according to an embodiment of the present disclosure, the method using a probe card with probes to test an object to be tested, and referring to fig. 3, the method includes the following steps:
s110: detecting the electrical parameters of the object to be detected; when the electrical parameter does not meet the preset condition, adjusting the distance between the bearing table and the test head; and when the electrical parameters meet the preset conditions, performing acceptance test on the object to be tested.
For example, in step S110, the electrical parameter of the object to be tested may be detected by the wafer acceptance tester; when the electrical parameter does not meet the preset condition, adjusting the distance between the bearing table and the test head; and when the electrical parameters meet the preset conditions, performing acceptance test on the object to be tested.
In the embodiment of the disclosure, by detecting the electrical parameter of the object to be tested, when the electrical parameter does not satisfy the preset condition, the distance between the bearing table and the test head is adjusted, so that the contact state between the probe and the object to be tested can be changed, and when the electrical parameter satisfies the preset condition, the object to be tested can be tested. The acceptance test method in the embodiment of the disclosure can automatically complete the setting of the test acupressure without manual participation, reduces the acupressure setting deviation caused by subjectivity in the process of manually setting the test acupressure, and is beneficial to improving the objectivity and the accuracy of the test acupressure setting.
In some embodiments, the above method further comprises:
after the distance between the bearing platform and the test head is adjusted, detecting the electrical parameters of the corresponding object to be tested;
and when the electrical parameter of the corresponding object to be tested after the distance between the bearing platform and the test head is adjusted is smaller than the electrical parameter of the corresponding object to be tested before the distance between the bearing platform and the test head is adjusted, determining that the electrical parameter does not meet the preset condition.
In the embodiment of the disclosure, by detecting the electrical parameters of the object to be tested at different positions and comparing the electrical parameter values of the object to be tested at different positions, when the object to be tested and the probe are not in a complete contact state, it can be determined that the electrical parameters do not meet the preset condition, so that the distance between the bearing table and the test head can be timely adjusted to continuously increase the test probe pressure.
In some embodiments, the above method further comprises:
after the distance between the bearing platform and the test head is adjusted, detecting the electrical parameters of the corresponding object to be tested;
and when the electrical parameter of the corresponding object to be tested after the distance between the bearing table and the test head is adjusted is equal to or larger than the electrical parameter of the corresponding object to be tested before the distance between the bearing table and the test head is adjusted, determining that the electrical parameter meets a preset condition.
In the embodiment of the disclosure, by detecting the electrical parameters of the object to be tested at different positions and comparing the electrical parameter values of the object to be tested at different positions, when the object to be tested and the probe are in a complete contact state, it can be determined that the electrical parameters satisfy the preset conditions, so as to perform acceptance test on the object to be tested.
In some embodiments, the above method further comprises: after determining that the electrical parameter satisfies the predetermined condition,
determining target test needle pressure according to the distance between the bearing table and the test head; wherein, the target test probe pressure is used as the initial test probe pressure when detecting the next object to be tested.
In the embodiment of the disclosure, after the electrical parameter meets the preset condition, the target testing needle pressure of the current object to be tested can be determined, and the target testing needle pressure of the current object to be tested is used as the initial testing needle pressure of the next object to be tested, so that the setting process of the testing needle pressure of the next object to be tested can be simplified, the setting time of the testing needle pressure of the next object to be tested is saved, and the acceptance testing efficiency of the next object to be tested is improved.
In some embodiments, the adjusting the distance between the carrier and the test head when the electrical parameter does not satisfy the predetermined condition includes:
adjusting the distance between the bearing table and the test head by a fixed value each time;
or the like, or, alternatively,
and adjusting the distance between the bearing table and the test head by an adjustment value smaller than the distance between the bearing table and the test head adjusted last time.
It should be emphasized that, in the embodiment of the present disclosure, each adjustment value may be a fixed value, or the next adjustment value is smaller than the previous adjustment value, and the present disclosure is not limited herein. Preferably, the next adjustment value is smaller than the previous adjustment value, and the probe is prevented from being damaged and failing in the acceptance test due to the fact that the probe suddenly penetrates too deep into the object to be tested in a mode of setting the adjustment value of each time to be smaller and smaller.
In some embodiments, the above method further comprises: when the using times of the probe card is less than a preset value, adjusting the distance between the bearing table and the test head by a fixed value each time;
when the using times of the probe card is larger than or equal to the preset value, the distance between the bearing table and the test head is adjusted by an adjusting value which is smaller than the distance between the bearing table and the test head which is adjusted last time.
It should be noted that in the actual wafer acceptance process, a plurality of lots of wafers need to be tested. After the wafer testing of the same batch is completed, the needle point of the probe in the probe card may be worn, and the service life parameters of the using times of the probe are reduced.
In some embodiments, the adjusting the distance between the carrier and the test head includes:
moving the stage in a direction towards or away from the test head;
and/or the first and/or second light sources,
the test head is moved in a direction towards or away from the carrier table.
For example, the stage may be moved in a direction toward the test head or/and the test head may be moved in a direction toward the stage while the test stitch is being set. At the end of the acceptance test, the carrier may be moved in a direction away from the test head, or/and the test head may be moved in a direction away from the carrier.
The embodiment of the present disclosure further provides a testing apparatus, including:
a memory for storing executable instructions;
a processor, configured to execute the executable instructions stored in the memory, to implement the method of any of the above embodiments.
The embodiment of the present disclosure further provides a computer-readable storage medium, which stores executable instructions for implementing the method in any of the above embodiments when the processor executes the executable instructions.
Examples of readable storage media include floppy disks, hard disks, magneto-optical disks, optical disks (e.g., CD-ROMs, CD-R, CD-RWs, DVD-ROMs, DVD-RAMs, DVD-RWs), magnetic tapes, non-volatile Memory cards, Read Only Memories (ROMs), and the like.
Specific examples are provided below in connection with any of the embodiments described above.
Example 1:
fig. 4 is a flow chart illustrating a wafer acceptance test method according to an embodiment of the disclosure. Referring to fig. 4, the method includes the steps of:
the method comprises the following steps: adjusting an object to be tested on the bearing table to be in contact with at least one probe of the probe card, wherein the value of the position parameter of the bearing table is the nth position value, and the test needle pressure of the probe card is set to be Xn。
For example, referring to fig. 2a and 4, the probe 311 of the probe card contacts the upper surface 10a of the object 10, where n is 1, the position parameter of the stage takes the value of the 1 st position value, and the test needle pressure of the probe card is set to the initial needle pressure X1(X1＝0)。
Step two: when the value of the position parameter of the bearing table is the nth position value, detecting the electrical parameter of the object to be detected to obtain the nth parameter value; wherein n is a natural number. For example, a tester applies an input voltage V and tests an output current InAccording to the input voltage signal and the output current signal, the contact resistance R of the object to be detected and the probe can be generatedn。
For example, referring to fig. 4, when the position parameter of the carrier is the 1 st position value (that is, n is 1), the electrical parameter of the object to be measured is detected, and the 1 st parameter value R is obtained1。
Step three: adjusting the value of the position parameter of the bearing table from the nth position value to the (n +1) th position value to ensure that the bearing table moves towards the direction close to the probe, and setting the test needle pressure of the probe card to be Xn+1，Xn+1＝Xn+D。
Illustratively, will carryThe value of the position parameter of the platform is adjusted from the 1 st position value to the 2 nd position value, and the test needle pressure of the probe card is set to be X2(X2＝X1+D)。
Step four: and when the value of the position parameter of the bearing table is the (n +1) th position value, detecting the electrical parameter of the object to be detected to obtain the (n +1) th parameter value. For example, a tester applies an input voltage V and tests an output current In+1According to the input voltage signal and the output current signal, the contact resistance R of the object to be detected and the probe can be generatedn+1。
Exemplarily, when the value of the position parameter is the 2 nd position value, the electrical parameter of the object to be measured is detected to obtain the 2 nd parameter value R2。
Step five: and (5) comparing the (n +1) th parameter value with the nth parameter value, determining that the electrical parameter does not meet the preset condition when the (n +1) th parameter value is smaller than the nth parameter value, repeatedly executing the third step and the fourth step, and continuously increasing the test needle pressure.
And when the (n +1) th parameter value is equal to or larger than the nth parameter value, determining that the electrical parameter meets the preset condition, and determining the target test needle pressure according to the difference value between the nth position value and the 1 st position value.
Illustratively, compare R2And R1At a size of R2Less than R1When the electrical parameter does not meet the preset condition, the value of the position parameter of the bearing table is adjusted from the 2 nd position value to the 3 rd position value, and when the value of the position parameter is the 3 rd position value, the electrical parameter of the object to be detected is detected to obtain a 3 rd parameter value R3Judgment of R3Whether a preset condition is satisfied. At R2Is equal to or greater than R1Then, the needle pressure X when the electrical parameter meets the preset condition and the 1 st position value is determined1Namely the target test needle pressure.
Fig. 5 is a diagram illustrating wafer acceptance test data in accordance with an embodiment of the present disclosure. Referring to fig. 5, the abscissa represents the test probe pressure of the probe card, and the ordinate represents the contact resistance between the object to be tested and the probe. When the position parameter is set to be the 6 th position value, the test needle pressure of the probe card is set to be X6Detecting the object to be detected andcontact resistance R of probe6. When the position parameter is set to be the 7 th position value, the test needle pressure of the probe card is set to be X7Detecting the contact resistance R of the object to be detected and the probe7。R7Is substantially equal to R6Determining the target test needle pressure as X6。
The above description is only for the specific embodiments of the present disclosure, but the scope of the present disclosure is not limited thereto, and any person skilled in the art can easily conceive of the changes or substitutions within the technical scope of the present disclosure, and all the changes or substitutions should be covered within the scope of the present disclosure. Therefore, the protection scope of the present disclosure shall be subject to the protection scope of the claims.
Claims (16)
1. An acceptance test system, comprising:
the bearing table is used for bearing an object to be tested;
a test head for mounting a probe card having a probe; when detecting the electrical parameters of the object to be detected, the test head is positioned above the bearing table, and the probe on the probe card can be contacted with the object to be detected;
the test unit is connected with the probe card and is used for detecting the electrical parameters of the object to be detected when the probe is contacted with the object to be detected;
the control unit is respectively connected with the bearing table, the test head and the test unit and is used for sending an adjusting instruction to the bearing table or/and the test head when the electrical parameter does not meet a preset condition; wherein the adjustment instruction comprises information indicating to adjust the distance between the bearing table and the test head;
the control unit is further used for performing acceptance test on the object to be tested when the electrical parameters meet the preset conditions.
2. The system of claim 1, wherein the control unit is further configured to determine that the electrical parameter does not satisfy the predetermined condition when the electrical parameter of the object to be tested corresponding to the adjusted distance between the carrier and the test head is smaller than the electrical parameter of the object to be tested corresponding to the adjusted distance between the carrier and the test head.
3. The system of claim 1, wherein the control unit is further configured to determine that the electrical parameter satisfies the predetermined condition when the electrical parameter of the object to be tested corresponding to the adjusted distance between the carrier and the test head is equal to or greater than the electrical parameter of the object to be tested corresponding to the adjusted distance between the carrier and the test head.
4. The system of claim 1, wherein the control unit is further configured to determine a target test needle pressure according to a distance between the carrier and the test head after determining that the electrical parameter satisfies the preset condition; and the target test needle pressure is used as the initial test needle pressure when the next object to be tested is detected.
5. The system of claim 1,
adjusting the adjustment value of the distance between the bearing table and the test head to be a fixed value every time;
or the like, or, alternatively,
and adjusting the distance between the bearing platform and the test head for the next time, wherein the adjustment value is smaller than the adjustment value of the distance between the bearing platform and the test head for the last time.
6. The system of claim 1,
when the using times of the probe card is less than a preset value, adjusting the adjustment value of the distance between the bearing table and the test head to be a fixed value each time;
and when the using times of the probe card is more than or equal to the preset value, adjusting the adjustment value of the distance between the bearing table and the test head next time, wherein the adjustment value of the distance between the bearing table and the test head last time is less than the adjustment value of the distance between the bearing table and the test head last time.
7. The system of claim 1,
the carrier may be movable towards or away from the test head, or/and the test head may be movable towards or away from the carrier.
8. An acceptance test method for testing an object to be tested by using a probe card having a probe, the method comprising:
detecting the electrical parameters of the object to be detected;
when the electrical parameter does not meet the preset condition, adjusting the distance between the bearing table and the test head;
and when the electrical parameter meets the preset condition, performing acceptance test on the object to be tested.
9. The method of claim 8, further comprising:
after the distance between the bearing platform and the test head is adjusted, detecting the electrical parameters of the corresponding object to be tested;
and when the electrical parameter of the object to be tested corresponding to the adjusted distance between the bearing platform and the test head is smaller than the electrical parameter of the object to be tested corresponding to the adjusted distance between the bearing platform and the test head, determining that the electrical parameter does not meet the preset condition.
10. The method of claim 8, further comprising:
after the distance between the bearing platform and the test head is adjusted, detecting the electrical parameters of the corresponding object to be tested;
and when the electrical parameter of the object to be tested corresponding to the adjusted distance between the bearing platform and the test head is equal to or larger than the electrical parameter of the object to be tested corresponding to the adjusted distance between the bearing platform and the test head, determining that the electrical parameter meets the preset condition.
11. The method of claim 8, further comprising: after determining that the electrical parameter satisfies the predetermined condition,
determining target test needle pressure according to the distance between the bearing table and the test head; and the target test needle pressure is used as the initial test needle pressure when the next object to be tested is detected.
12. The method of claim 8, wherein adjusting the distance between the carrier and the test head when the electrical parameter does not satisfy a predetermined condition comprises:
adjusting the distance between the bearing table and the test head by a fixed value every time;
or the like, or, alternatively,
and adjusting the distance between the bearing platform and the test head by an adjustment value smaller than the distance between the bearing platform and the test head adjusted last time.
13. The method of claim 8, further comprising:
when the using times of the probe card are smaller than a preset value, adjusting the distance between the bearing table and the test head by a fixed value each time;
and when the using times of the probe card is greater than or equal to the preset value, adjusting the distance between the bearing table and the test head by an adjustment value which is smaller than the adjustment value of the distance between the bearing table and the test head at the last time.
14. The method of claim 8, wherein adjusting the distance between the carrier stage and the test head comprises:
moving the stage in a direction towards or away from the test head;
and/or the first and/or second light sources,
moving the test head in a direction towards or away from the carrier.
15. A test apparatus, comprising:
a memory for storing executable instructions;
a processor for implementing the method of any one of claims 8 to 14 when executing executable instructions stored in the memory.
16. A computer readable storage medium storing executable instructions for implementing the method of any one of claims 8 to 14 when executed by a processor.
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| CN116864408A (en) * | 2022-07-29 | 2023-10-10 | 广州嘀嘀康科技有限公司 | Probe alignment method and probe alignment device based on wafer test |
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