CN113755807B - Optical filter coating device and coating process - Google Patents
Optical filter coating device and coating process Download PDFInfo
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- CN113755807B CN113755807B CN202111067078.1A CN202111067078A CN113755807B CN 113755807 B CN113755807 B CN 113755807B CN 202111067078 A CN202111067078 A CN 202111067078A CN 113755807 B CN113755807 B CN 113755807B
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- 238000000576 coating method Methods 0.000 title claims abstract description 46
- 239000011248 coating agent Substances 0.000 title claims abstract description 37
- 230000003287 optical effect Effects 0.000 title claims abstract description 14
- 238000004544 sputter deposition Methods 0.000 claims abstract description 46
- 239000000758 substrate Substances 0.000 claims abstract description 40
- 230000007246 mechanism Effects 0.000 claims abstract description 14
- 239000007888 film coating Substances 0.000 claims abstract description 9
- 238000009501 film coating Methods 0.000 claims abstract description 9
- 238000012544 monitoring process Methods 0.000 claims abstract description 5
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 claims description 46
- 229910052786 argon Inorganic materials 0.000 claims description 24
- 239000007789 gas Substances 0.000 claims description 22
- 239000010410 layer Substances 0.000 claims description 19
- 239000002344 surface layer Substances 0.000 claims description 18
- 239000002245 particle Substances 0.000 claims description 15
- 239000013077 target material Substances 0.000 claims description 11
- 238000007599 discharging Methods 0.000 claims description 10
- 238000001755 magnetron sputter deposition Methods 0.000 claims description 9
- 239000000463 material Substances 0.000 claims description 9
- 238000001816 cooling Methods 0.000 claims description 7
- 238000000034 method Methods 0.000 claims description 7
- 230000008569 process Effects 0.000 claims description 7
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 6
- 238000004140 cleaning Methods 0.000 claims description 4
- 239000012535 impurity Substances 0.000 claims description 4
- 238000005498 polishing Methods 0.000 claims description 4
- 238000001035 drying Methods 0.000 claims description 3
- 239000005002 finish coating Substances 0.000 claims description 3
- 238000010438 heat treatment Methods 0.000 claims description 3
- 229910021645 metal ion Inorganic materials 0.000 claims description 3
- 229910052757 nitrogen Inorganic materials 0.000 claims description 3
- 239000012530 fluid Substances 0.000 claims description 2
- 238000004519 manufacturing process Methods 0.000 abstract description 4
- 230000002349 favourable effect Effects 0.000 abstract 1
- 238000007747 plating Methods 0.000 description 11
- 238000010586 diagram Methods 0.000 description 4
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 2
- -1 argon ions Chemical class 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 230000007935 neutral effect Effects 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 230000009471 action Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 230000005685 electric field effect Effects 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 238000007733 ion plating Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 238000001228 spectrum Methods 0.000 description 1
- 230000001502 supplementing effect Effects 0.000 description 1
- 238000004506 ultrasonic cleaning Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/35—Sputtering by application of a magnetic field, e.g. magnetron sputtering
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/02—Pretreatment of the material to be coated
- C23C14/021—Cleaning or etching treatments
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/02—Pretreatment of the material to be coated
- C23C14/028—Physical treatment to alter the texture of the substrate surface, e.g. grinding, polishing
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/50—Substrate holders
- C23C14/505—Substrate holders for rotation of the substrates
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physical Vapour Deposition (AREA)
Abstract
The invention relates to a light filter coating device and a coating process, wherein the device comprises a cavity, a sputtering generator and a carrier are arranged in the cavity, the sputtering generator comprises a discharge electrode and a positioning seat, a plurality of positioning channels are arranged in the positioning seat, targets are arranged in the positioning channels, the starting ends of the positioning channels are connected with the discharge electrode, the carrier comprises a working disc, a rotating mechanism and a support, a plurality of accommodating cavities are arranged on the upper end surface of the working disc, a substrate is arranged in each accommodating cavity, a drainage unit is arranged at the bottom of the working disc, the drainage unit mainly comprises a supporting piece and a drainage piece, and the drainage piece is used for electrifying to form an electric drainage area; the chamber is connected with a gas control unit which is used for exhausting the gas in the cavity chamber or circulating the plasma load gas and monitoring the pressure state in the chamber. The invention has reliable sputtering range, can improve the adhesion strength between films, has good compactness and uniformity of a film layer formed by the film coating, and is favorable for improving the production quality of the optical filter.
Description
Technical Field
The invention relates to the technical field of optical filter coating production, in particular to an optical filter coating device and a coating process.
Background
For the film plating process of the optical filter, phase evaporation deposition film plating, magnetron sputtering film plating and ion plating are generally adopted, wherein the magnetron sputtering film plating process is widely adopted due to high film plating efficiency and high film plating particle adhesion strength. Magnetron sputtering belongs to the category of glow discharge, and film plating is carried out by utilizing a cathode sputtering principle, wherein film particles are derived from the cathode sputtering effect of argon ions on a cathode target material in glow discharge. The argon ions sputter target atoms off and deposit the target atoms on the surface of the element to form a required film layer.
In the prior art, the coating equipment is easy to have local brightness gradient layering in the coating stage, the coating is uneven, the adhesion strength and compactness of the coating are poor, the sputtering range is not good, as a continuous coating device disclosed in patent application No. CN201610061031.7, the working glow region is connected with the sputtering region of the cathode target, but the interval between the discharge glow region and the target is close, which is unfavorable for forming a reliable sputtering region, the coating is uneven, the compactness and consistency are poor, as a vacuum magnetron sputtering coating device for preparing a graded neutral density filter disclosed in patent application No. CN201810094965.X, which comprises: the vacuum cavity, the circular baffle mechanism, the rotary cathode mechanism and the driving device are driven by the driving motor to rotate through the dynamic seal rotating shaft, so that the cathode seat and the circular baffle mechanism are driven to rotate 360 degrees in the vacuum cavity, the large-size circular gradient neutral density filter is prepared, the balance stability is good, but the coating film adhesion strength is low, the coating film is easy to fall off, and the compactness of a finished product film layer is poor.
Disclosure of Invention
In order to solve the problems in the prior art, the invention provides a light filter film plating device and a film plating process, which have reliable sputtering range, can improve the adhesion strength between films, have good compactness and uniformity of film layers formed by film plating, and are beneficial to improving the production quality of light filters.
The invention provides the following technical scheme:
in one aspect, the invention provides a light filter film plating device, which comprises a cavity, wherein a sputtering generator and a carrier arranged right below the sputtering generator are arranged in the cavity, the sputtering generator is arranged at the inner top wall of the cavity, the sputtering generator comprises a discharge electrode and a positioning seat, a plurality of positioning channels are arranged in the positioning seat, a target material is arranged in each positioning channel, the starting end of each positioning channel is connected with the discharge electrode, the carrier comprises a working disc, a rotating mechanism for driving the working disc to rotate and a support, the upper end surface of the working disc is provided with a plurality of accommodating cavities, a substrate is arranged in each accommodating cavity, a second connecting part is arranged in each accommodating cavity, the second connecting part is connected with the substrate in a clamping manner, and a first electromagnetic shielding layer is arranged at the wall surface of the cavity;
the bottom of the working disc is provided with a drainage unit, the drainage unit mainly comprises a support piece and a drainage piece, the support piece is arranged between the support and the working disc, the drainage piece is used for electrifying to form an electric drainage area, and the projection area of the electric drainage area on the height is larger than the cross-sectional area of the accommodating cavity along the horizontal plane;
the chamber is connected with a gas control unit, and the gas control unit is used for evacuating the gas in the chamber or circulating plasma load gas and monitoring the pressure state in the chamber.
Preferably, a first connecting part is arranged in the positioning channel, the first connecting part is connected with the target in a clamping way, a positioning baffle is arranged at the tail end of the positioning channel, and a positioning opening is arranged on the positioning baffle.
Preferably, the gas control unit comprises a first air cavity, a second air cavity, a third air cavity and a pressure sensor, wherein the first air cavity, the second air cavity, the third air cavity and the pressure sensor are respectively and fluidly connected with the cavity, the first air cavity is used for evacuating the cavity through a guide pump or recovering the cavity to be in a normal pressure state, the second air cavity is hermetically connected with the cavity through an input air pipe, an input metering pump is arranged on the input air pipe, the third air cavity is hermetically connected with the cavity through an output air pipe, and an output metering pump is arranged on the output air pipe.
Preferably, the drainage piece is in a honeycomb shape or a multi-circle annular shape and is uniformly distributed on the upper end face of the support piece, and the top end of the drainage piece is positive in a power-on state.
Preferably, the support member is provided with a second electromagnetic shielding layer.
Preferably, the coating device further comprises a cooling unit, the cooling unit comprises heat exchangers, and the heat exchangers are symmetrically arranged on the inner side wall surface of the chamber.
Preferably, the rotating mechanism comprises a rotating rod and a connecting piece, the connecting piece is fixedly connected with the working disc, the rotating rod penetrates through the supporting piece and is rotationally connected with the supporting piece, and a spacing space is arranged between the working disc and the supporting piece.
In another aspect, the present invention provides a process for coating a color filter, including:
polishing the surface layer to be coated of the substrate, cleaning to remove bad impurities of the surface layer to be coated of the substrate, heating and drying the substrate through nitrogen heat flow, correspondingly arranging a plurality of substrates which are dried in a plurality of accommodating cavities of a working disc, exposing the surface layer to be coated of the substrate, arranging a target material containing uniformly distributed coating materials in a positioning channel, aligning a positioning opening of a positioning baffle plate, and arranging the substrate and the target material oppositely;
opening a first valve, discharging the argon in the chamber into vacuum by matching a flow guide pump with a first air chamber, closing the first valve, opening a second valve, guiding the argon in the second air chamber into the chamber by matching an input air pipe with an input metering pump, opening a third valve, discharging the argon in the chamber into a third air chamber by matching an output air pipe with an output metering pump, and enabling the input quantity of the argon flowing in the chamber to be consistent with the output quantity;
starting a sputtering generator, ionizing plasma load gas through a discharge electrode to generate metal ions to impact a target material to generate magnetron sputtering, sputtering a coating material to a surface layer to be coated, electrifying a drainage piece at the bottom of a working disk to form an electric drainage area so as to directionally drain sputtered particles to a substrate on the upper end surface of the working disk, and simultaneously driving the working disk to rotate by a rotating mechanism to perform coating, and discharging heat accumulated in the coating process through a heat exchanger to finish coating;
then, closing the second valve, discharging argon in the cavity to a third air cavity by matching the output air pipe with an output metering pump, evacuating the cavity, closing the third valve, opening the first valve, and recovering the cavity to a normal pressure state by matching the diversion pump with the first air cavity;
and taking out the substrate with the film coating completed, and detecting the film layer.
Preferably, the drainage piece is in a honeycomb shape or a multi-circle annular shape and is uniformly distributed at the bottom of the working disc, and the top end of the drainage piece is positive in an electrified state.
Preferably, during magnetron sputtering, the flow rate of argon in the chamber is 15-38sccm, and the pressure of the argon is 0.4-0.6Pa.
The beneficial effects of the invention are as follows:
(1): the vacuum degree in the cavity is controlled by the gas control unit, the input and output quantity of argon are controlled, sputtered particles are directionally output by utilizing the positioning channels, the positioning baffle plate forms a shielding area, the directional opening forms a sputtering area, the distributed positioning channels can form a reliable sputtering range, the electric conduction area is formed at the bottom of the working disc by the conduction unit, the sputtered particles are directionally conducted to the substrate, meanwhile, the working disc is rotated to conduct film coating, the uniformity of film layers can be effectively promoted, the adhesion strength between films is improved, the film layers formed by the film coating are good in compactness and good in uniformity;
(2): the polishing and cleaning steps of the surface layer to be coated of the substrate can effectively remove bad impurities of the surface layer to be coated, reduce local brightness gradient layering formed on the surface of the coated film, and improve the yield of the optical filter production.
Drawings
The accompanying drawings are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification, illustrate the invention and together with the embodiments of the invention, serve to explain the invention.
FIG. 1 is a schematic diagram of one embodiment of the present invention;
FIG. 2 is a schematic diagram of a second embodiment of the present invention;
FIG. 3 is a schematic view showing the bottom view of the sputtering generator according to the present invention;
FIG. 4 is a schematic view of one embodiment of a drainage unit of the present invention;
FIG. 5 is a schematic diagram of a drainage unit according to a second embodiment of the present invention;
fig. 6 is a schematic diagram of the working principle of the embodiment of the present invention.
The marks in the figure: 1-a chamber; 11-a first valve; 12-a second valve; 13-a third valve; 14-a first electromagnetic shielding layer; a 2-sputter generator; 21-a discharge electrode; 22-positioning seats; 221-positioning channel; 222-a first connection; 223-positioning a baffle; 3-carrier; 31-a working disc; 311-accommodating cavities; 312-a second connection; 32-a rotation mechanism; 321-rotating the rod; 322-connectors; 33-support; 4-a cooling unit; 41-a heat exchanger; 5-a gas control unit; 51-a first air cavity; 52-a second air cavity; 53-a third air cavity; 54-pressure sensor; 55-a diversion pump; 56-an input air tube; 57-input metering pump; 58-output air pipe; 59-output metering pump; 6-drainage unit; 61-a support; 62-drainage piece; 63-a second electromagnetic shielding layer; 7-target material; 8-substrate.
Detailed Description
Embodiments of the present invention will be described in detail below with reference to the accompanying drawings.
Example 1:
referring to fig. 1-6, the present embodiment provides a film coating device for an optical filter, which includes a chamber 1, a sputtering generator 2 and a carrier 3 disposed under the sputtering generator 2 are installed in the chamber 1, the sputtering generator 2 is disposed at an inner top wall of the chamber 1, the sputtering generator 2 includes a discharge electrode 21 and a positioning seat 22, a plurality of positioning channels 221 are disposed in the positioning seat 22, the positioning channels 221 are preferably disposed in a ring shape, a target 7 is disposed in each positioning channel 221, the target 7 contains uniformly distributed film coating materials, the film coating materials are selected according to a film layer characteristic required by the optical filter, a start end of each positioning channel 221 is connected with the discharge electrode 21, the discharge electrode 21 is disposed in each positioning channel 221, a plurality of discharge electrodes 21 are disposed, a first connecting portion 222 is disposed in the positioning channel 221, the first connecting portion 222 is engaged with and connected with the target 7 to position the target 7, a positioning baffle 223 is disposed at an end of the positioning channel 221, and a positioning opening is disposed on the positioning baffle; the carrier 3 comprises a working disc 31, a rotating mechanism 32 for driving the working disc 31 to rotate and a support 33, wherein a plurality of accommodating cavities 311 are arranged on the upper end surface of the working disc 31, the accommodating cavities 311 are preferably distributed in a ring shape, a substrate 8 is arranged in each accommodating cavity 311, the accommodating cavities 311 limit and bear the substrate 8 and enable the substrate 8 to expose a surface layer to be coated, wherein a positioning seat 22 and the working disc 31 are arranged in a cylindrical shape or a disc shape, the center line of the positioning seat 22 is aligned and overlapped with the center line of the working disc 31, the targets 7 can be obliquely arranged and can reach a certain incidence angle at the output position of a positioning channel 221, and the oblique arrangement of the targets 7 can form a semi-surrounding state of the substrate 8 to be coated in space so as to fully sputter; the accommodating cavity 311 is internally provided with a second connecting part 312, the second connecting part 312 is clamped and connected with the substrate 8 to position the substrate 8, the wall surface of the cavity 1 is provided with a first electromagnetic shielding layer 14, and the first electromagnetic shielding layer 14;
the chamber 1 is connected with a gas control unit 5, the gas control unit 5 is used for evacuating gas in the chamber 1 or circulating plasma load gas and monitoring the pressure state in the chamber 1, specifically, the gas control unit 5 comprises a first air cavity 51, a second air cavity 52, a third air cavity 53 and a pressure sensor 54 which are respectively connected with the chamber 1 in a fluid way, the first air cavity 51 is used for transferring or supplementing air in the chamber 1, the first air cavity 51 is used for evacuating the chamber 1 through a diversion pump 55 or restoring the chamber 1 to be in a normal pressure state, the second air cavity 52 is a gas source cavity of plasma load gas, when the device works, the cathode of the discharge electrode 21 is utilized for carrying out glow discharge in a plasma load environment through radio frequency, the target 7 is bombarded, sputtering occurs, sputtering particles are generated by coating materials, the plasma load is preferably argon with low cost and good sputtering performance, the second air cavity 52 is connected with the chamber 1 in a sealing way through an input air pipe 56, the third air cavity 53 is used for exhausting the plasma load in the chamber 1, the chamber 1 is connected in a sealing way through an output air pipe 58, and the output air pipe 58 is provided with an output 59.
The bottom of the working disc 31 is provided with a drainage unit 6, the drainage unit 6 mainly comprises a support piece 61 and a drainage piece 62, the support piece 61 is arranged between the support 33 and the working disc 31, the drainage piece 62 is used for electrifying to form an electric drainage area, the projection area of the electric drainage area on the height is larger than the cross-section area of the containing cavity 311 along the horizontal plane, so that sputtered particles fully cover a surface layer to be coated which can be exposed by the containing cavity 311, the support piece 61 is provided with a second electromagnetic shielding layer 63, wherein the drainage piece 62 is uniformly distributed on the upper end face of the support piece 61 in a honeycomb shape or a multi-circle annular shape, the drainage piece 62 can be uniformly distributed vertically and extends to the position right below the containing cavity 311, in an electrified state, the top end of the drainage piece 62 is positive in order to change the movement direction of electrons in sputtering, a potential difference can be formed on the path of the sputtering direction in order to generate an electric field in the direction from the target 7 to the substrate 8, the movement track is cycloid and the spiral line is coupled in the sputtering direction in order to increase the movement track of electrons in the sputtering direction by utilizing the electric field effect electrons, so as to restrict the movement track of the spiral line of electrons in the sputtering direction to move to the containing cavity 311, the uniformity of the sputtered particles can be promoted, so as to improve the film adhesion capability between films.
Wherein, the coating device still includes cooling unit 4, and cooling unit 4 includes heat exchanger 41, and heat exchanger 41 symmetry sets up at the inside wall face of cavity 1 to reduce the bad temperature rise in the cavity 1.
Example 2:
on the basis of the above embodiment, the rotating mechanism 32 includes a rotating rod 321 and a connecting piece 322, the connecting piece 322 is fixedly connected with the working disk 31, the rotating rod 321 penetrates through the supporting piece 61 and rotates to connect the supporting piece 61, the rotating rod 321 is matched with the connecting piece 322 to drive the working disk 31 to rotate, sputtering particles in the coating stage are promoted to be uniformly distributed on the substrate 8 at the upper end of the working disk 31, a spacing space is arranged between the working disk 31 and the supporting piece 61, and an action space of the drainage piece 62 is formed.
The invention provides a light filter coating process, which comprises the following steps:
s110: polishing the surface layer to be coated of the substrate 8, cleaning to remove undesirable impurities on the surface layer coated of the substrate 8, and heating and drying the substrate 8 through nitrogen heat flow;
the ultrasonic cleaning process can be carried out in any environment of pure water, isopropanol, ethanol and acetone, wherein the environment comprises a steam environment and/or a dipping environment, so that the roughness of a coating surface layer is effectively improved, the surface layer structure is thinned, and the local brightness gradient layering formed on the coating surface after coating is reduced, so that the yield is improved;
s120: correspondingly arranging a plurality of substrates 8 which are dried in a plurality of accommodating cavities 311 of a working disc 31, enabling the substrates 8 to expose a surface layer to be coated, arranging target materials 7 containing uniformly distributed coating materials in a positioning channel 221, aligning positioning openings of a positioning baffle 223, and enabling the substrates 8 and the target materials 7 to be arranged oppositely;
s130: opening a first valve 11, discharging vacuum in the chamber 1 through a diversion pump 55 in cooperation with a first air cavity 51, closing the first valve 11, opening a second valve 12, guiding argon in a second air cavity 52 into the chamber 1 through the cooperation of an input air pipe 56 and an input metering pump 57, opening a third valve 13, discharging the argon in the chamber 1 to a third air cavity 53 through the cooperation of an output air pipe 58 and an output metering pump 59, enabling the input quantity and output quantity of the argon flowing in the chamber 1 to be consistent, controlling the flow quantity of the argon in the chamber 1 to be 15-38sccm, and controlling the pressure of the argon to be 0.4-0.6Pa;
s140: starting a sputtering generator 2, ionizing plasma load gas through a discharge electrode 21 to generate metal ions to collide with a target 7 to generate magnetron sputtering, using a positioning channel 221 to output sputtering particles in a directional manner, using a positioning baffle 223 to form a shielding area for the sputtering particles, using a directional opening to form a sputtering area for the sputtering particles, applying sputtering particles formed by a coating material to a surface layer to be coated, using a drainage piece 62 to form an electric drainage area when being electrified so as to directionally drain the sputtering particles onto a substrate 8 on the upper end surface of a working disc 31, and simultaneously, using a rotating mechanism 32 to drive the working disc 31 to rotate to perform coating, wherein the rotating speed is 0.05rad/s, thereby effectively promoting the uniformity of the thickness of the film surface and improving the adhesion capability between films;
the heat accumulated in the coating process is discharged through the heat exchanger 41 to finish coating, and the sputtering generator 2 and the chamber 1 are respectively provided with a temperature sensor, so that the monitoring feedback is carried out on the sputtering generator 2 and the chamber 1 to improve the safety of the operation of the device.
S150: then, the second valve 12 is closed, the argon in the chamber 1 is discharged to the third air cavity 53 by the output air pipe 58 in cooperation with the output metering pump 59, the chamber 1 is emptied, the third valve 13 is closed, the first valve 11 is opened, and the chamber 1 is restored to the normal pressure state by the diversion pump 55 in cooperation with the first air cavity 51;
s160: and taking out the substrate 8 with the film coating completed, and detecting a film layer, wherein the film thickness detection of the film layer can be carried out by adopting a spectrum ellipsometer.
While the preferred embodiments of the present patent have been described in detail, the present patent is not limited to the above embodiments, and various changes and modifications may be made without departing from the spirit of the present patent within the knowledge of those skilled in the art.
Claims (8)
1. The utility model provides a light filter coating device, includes the cavity, its characterized in that, install sputtering generator and the carrier of setting under the sputtering generator in the cavity, the sputtering generator sets up in cavity roof department, the sputtering generator includes discharge electrode and positioning seat, be equipped with a plurality of location passageway in the positioning seat, be provided with the target in each location passageway, the positioning passageway top is connected discharge electrode, the carrier includes the working dish, drive the rotary mechanism and the support of working dish pivoted, the working dish up end is equipped with a plurality of acceping the chamber, each acceping the intracavity and being provided with the substrate, acceping the intracavity and being equipped with second connecting portion, second connecting portion block connection the substrate, cavity wall department is equipped with first electromagnetic shield layer;
the bottom of the working disc is provided with a drainage unit, the drainage unit mainly comprises a support piece and a drainage piece, the support piece is arranged between the support and the working disc, the drainage piece is used for electrifying to form an electric drainage area, and the projection area of the electric drainage area on the height is larger than the cross-sectional area of the accommodating cavity along the horizontal plane; the drainage pieces are uniformly distributed on the upper end face of the support piece in a honeycomb shape or a multi-circle annular shape, and the top ends of the drainage pieces are positive in polarity in an electrified state;
the chamber is connected with a gas control unit, and the gas control unit is used for evacuating the gas in the chamber or circulating plasma load gas and monitoring the pressure state in the chamber; the gas control unit comprises a first air cavity, a second air cavity, a third air cavity and a pressure sensor, wherein the first air cavity, the second air cavity, the third air cavity and the pressure sensor are respectively in fluid connection with the cavity, the first air cavity is used for evacuating the cavity through a flow guide pump or recovering the cavity to be in a normal pressure state, the second air cavity is in sealed connection with the cavity through an input air pipe, an input metering pump is arranged on the input air pipe, the third air cavity is in sealed connection with the cavity through an output air pipe, and an output metering pump is arranged on the output air pipe.
2. The optical filter coating device according to claim 1, wherein: the positioning device comprises a positioning channel, wherein a first connecting part is arranged in the positioning channel, the first connecting part is connected with the target in a clamping mode, a positioning baffle is arranged at the tail end of the positioning channel, and a positioning opening is formed in the positioning baffle.
3. The optical filter coating device according to claim 1, wherein: and a second electromagnetic shielding layer is arranged on the supporting piece.
4. The optical filter coating device according to claim 1, wherein: still include the cooling unit, the cooling unit includes the heat exchanger, the heat exchanger symmetry sets up the inside wall face of cavity.
5. The optical filter coating device according to claim 1, wherein: the rotating mechanism comprises a rotating rod and a connecting piece, the connecting piece is fixedly connected with the working disc, the rotating rod penetrates through the supporting piece and is rotationally connected with the supporting piece, and an interval space is formed between the working disc and the supporting piece.
6. A light filter coating process is characterized in that: an optical filter coating apparatus according to any one of claims 1 to 5, comprising:
polishing the surface layer to be coated of the substrate, cleaning to remove bad impurities of the surface layer to be coated of the substrate, heating and drying the substrate through nitrogen heat flow, correspondingly arranging a plurality of substrates which are dried in a plurality of accommodating cavities of a working disc, exposing the surface layer to be coated of the substrate, arranging a target material containing uniformly distributed coating materials in a positioning channel, aligning a positioning opening of a positioning baffle plate, and arranging the substrate and the target material oppositely;
opening a first valve, discharging the argon in the chamber into vacuum by matching a flow guide pump with a first air chamber, closing the first valve, opening a second valve, guiding the argon in the second air chamber into the chamber by matching an input air pipe with an input metering pump, opening a third valve, discharging the argon in the chamber into a third air chamber by matching an output air pipe with an output metering pump, and enabling the input quantity of the argon flowing in the chamber to be consistent with the output quantity;
starting a sputtering generator, ionizing plasma load gas through a discharge electrode to generate metal ions to impact a target material to generate magnetron sputtering, sputtering a coating material to a surface layer to be coated, electrifying a drainage piece at the bottom of a working disk to form an electric drainage area so as to directionally drain sputtered particles to a substrate on the upper end surface of the working disk, and simultaneously driving the working disk to rotate by a rotating mechanism to perform coating, and discharging heat accumulated in the coating process through a heat exchanger to finish coating;
then, closing the second valve, discharging argon in the cavity to a third air cavity by matching the output air pipe with an output metering pump, evacuating the cavity, closing the third valve, opening the first valve, and recovering the cavity to a normal pressure state by matching the diversion pump with the first air cavity;
and taking out the substrate with the film coating completed, and detecting the film layer.
7. The process of claim 6, wherein: the drainage piece is in a honeycomb shape or a multi-ring annular shape and is uniformly distributed at the bottom of the working disc, and the top end of the drainage piece is positive in an electrified state.
8. The process of claim 6, wherein: during magnetron sputtering, the flow rate of argon in the chamber is 15-38sccm, and the pressure of the argon is 0.4-0.6Pa.
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| CN202111067078.1A CN113755807B (en) | 2021-09-13 | 2021-09-13 | Optical filter coating device and coating process |
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| GB2039962A (en) * | 1978-12-29 | 1980-08-20 | Boc Ltd | Sputtering system |
| CA2103770A1 (en) * | 1992-08-14 | 1994-02-15 | Simon K. Nieh | Plasma-Enhanced Magnetron-Sputtered Deposition of Materials |
| JPH08134641A (en) * | 1994-11-09 | 1996-05-28 | Shibaura Eng Works Co Ltd | Sputtering device |
| JP2020172685A (en) * | 2019-04-10 | 2020-10-22 | 株式会社トヨタプロダクションエンジニアリング | Operation simulation device and operation simulation method for magnetron sputtering device |
| CN112647050A (en) * | 2020-09-24 | 2021-04-13 | 深圳市宝元金实业有限公司 | PVD (physical vapor deposition) nano magnetron sputtering silver plating metallization process of ceramic dielectric filter |
| CN213327812U (en) * | 2020-09-29 | 2021-06-01 | 亚芯半导体材料(江苏)有限公司 | Precise vacuum coating system |
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2021
- 2021-09-13 CN CN202111067078.1A patent/CN113755807B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2039962A (en) * | 1978-12-29 | 1980-08-20 | Boc Ltd | Sputtering system |
| CA2103770A1 (en) * | 1992-08-14 | 1994-02-15 | Simon K. Nieh | Plasma-Enhanced Magnetron-Sputtered Deposition of Materials |
| JPH08134641A (en) * | 1994-11-09 | 1996-05-28 | Shibaura Eng Works Co Ltd | Sputtering device |
| JP2020172685A (en) * | 2019-04-10 | 2020-10-22 | 株式会社トヨタプロダクションエンジニアリング | Operation simulation device and operation simulation method for magnetron sputtering device |
| CN112647050A (en) * | 2020-09-24 | 2021-04-13 | 深圳市宝元金实业有限公司 | PVD (physical vapor deposition) nano magnetron sputtering silver plating metallization process of ceramic dielectric filter |
| CN213327812U (en) * | 2020-09-29 | 2021-06-01 | 亚芯半导体材料(江苏)有限公司 | Precise vacuum coating system |
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| CN113755807A (en) | 2021-12-07 |
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