CN113751089A - 一种集成有加热模块的数字微流控芯片 - Google Patents

一种集成有加热模块的数字微流控芯片 Download PDF

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CN113751089A
CN113751089A CN202111024813.0A CN202111024813A CN113751089A CN 113751089 A CN113751089 A CN 113751089A CN 202111024813 A CN202111024813 A CN 202111024813A CN 113751089 A CN113751089 A CN 113751089A
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陈宏�
程浩
姚薇
沈杰男
朱永生
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Jiujiang Research Institute Of Xiamen University
Xiamen University
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Abstract

一种集成有加热模块的数字微流控芯片,涉及微流控芯片领域。将温控模块集成在数字微流控芯片的基板上,但与驱动电极阵列(或接地电极)不在基板的同一侧,从而实现温控模块在数字微流控芯片上高效集成。温控模块可由加热丝组成,或由加热丝和测温丝组成。所述温控模块在数字微流控芯片上可集成至少一个。通过在芯片表面集成分别用于加热和测温的电阻丝回路,在实现对微流控芯片的集成式、反馈式的温度控制。得益于反馈控温机制,可用于在数字微流控芯片上进行聚合酶链式反应等需要高精度控温的反应中;由于加热模块集成在芯片表面,还特别适合数字微流控芯片的便携式应用中。

Description

一种集成有加热模块的数字微流控芯片
技术领域
本发明涉及微流控芯片领域,尤其是涉及一种集成有加热模块的数字微流控芯片。
背景技术
微流控芯片是在硅、玻璃以及高聚物等基底材料上制作微米尺寸的微通道和微结构,利用这些微通道和微结构,对溶液实现反应、分离和检测等各种功能。由于微通道和微结构的特征尺寸在微米级别,具有快速传质和传热的能力,所以具有比较优异的性能,目前已被广泛地运用到化学分析、生化检测、免疫检测以及细胞(组织)培养等各领域。
数字微流控芯片属于微流控芯片,但与常规微流控芯片不同的是,它是利用介质上电润湿的现象实现对液滴的操控。在基底材料上制作驱动电极阵列,在驱动电极阵列上再制作一层介质层和一层疏水层。驱动电极是否通电能够改变驱动电极上方的介质层(疏水层)的润湿性。数字微流控芯片通过程序性地改变驱动电极阵列的状态,顺序地改变介质层不同区域的润湿性,从而控制液滴的自由运动。数字微流控芯片主要有两种不同的结构:平行极板形式和单极板形式。在平行极板形式中,液滴被夹在两个平行的基板之间,其中一个基板上制作有驱动电极阵列,另一个基板上制作接地电极(以与驱动电极形成电回路)。在单极板形式中,液滴位于承载驱动电极和接地电极的单个基板的顶部。
在很多应用中,例如免疫反应中的抗原和抗体的特异性结合以及聚合酶链式反应等,都需要在数字微流控芯片上提供高于室温的温度并保持稳定,已有部分报道进行这方面的努力。有报道通过外置的加热模块(Sista R,Hua Z,Thwar P,et al.Development ofa digital microfluidic platform for point of care testing[J].Lab on a Chip,2008,8(12):2091-2104.)和加热薄膜形式(Norian H,Field R M,Kymissis I,et al.Anintegrated CMOS quantitative-polymerase-chain-reaction lab-on-chip for point-of-care diagnostics[J].Lab on a Chip,2014,14(20):4076-4084.)来提供所需的温度,还有报道使用互补金属氧化物半导体(CMOS)集成电路技术制作出完全集成的温控模块(Norian H,Field R M,Kymissis I,et al.An integrated CMOS quantitative-polymerase-chain-reaction lab-on-chip for point-of-care diagnostics[J].Lab ona Chip,2014,14(20):4076-4084.)。使用外置加热模块和加热薄膜的方式,比较容易实现,但是集成度不高并且性能较差。使用CMOS集成电路工艺集成的温控模块集成度高且性能好,但加工工艺复杂,成本高。并且驱动电极阵列和温控模块制作在基板的同一侧,之间使用绝缘层或介质层进行隔离,但驱动电极阵列和温控模块之间非常容易相互影响并产生干扰。
发明内容
本发明的目的在于为克服现有技术存在的上述不足,提供将温控模块集成在数字微流控芯片的基板上,但与驱动电极阵列(或接地电极)不在基板的同一侧,从而实现温控模块在数字微流控芯片上高效集成的一种集成有加热模块的数字微流控芯片。
所述集成有加热模块的数字微流控芯片,温控模块集成在数字微流控芯片的基板上,且温控模块与驱动电极阵列/接地电极位于基板的不同侧。
所述数字微流控芯片包括平行极板形式和单极板形式;
当采用平行极板形式的数字微流控芯片时,一片基板上制作有驱动电极阵列,另一片基板上制作接地电极;温控模块集成在制作有驱动电极阵列的基板的另一侧,或在制作接地电极的基板的另一侧,或同时集成在分别制作有驱动电极阵列和接地电极的两片基板的另一侧。
当采用单极板形式的数字微流控芯片时,驱动电极阵列和接地电极加工在单片基板的同侧,温控模块集成在驱动电极和接地电极的基板的另一侧。
所述温控模块可由加热丝组成,或由加热丝和测温丝组成,所述加热丝用于实现升温,测温丝用于对温控区域进行测温。
所述温控模块在数字微流控芯片上可集成至少一个。
与现有技术相比,本发明具有以下突出的优点:
传统的芯片加热多用外置加热模块,其优点在于成本低且产品成熟,但外置模块体积过大,需要额外的校正装置,丧失微流控芯片原本的体积小、便携性好的优势。而本发明所提出的集成有加热模块的数字微流控芯片,通过在芯片表面集成分别用于加热和测温的电阻丝回路,在实现对微流控芯片的集成式、反馈式的温度控制。得益于反馈控温机制,可用于在数字微流控芯片上进行聚合酶链式反应等需要高精度控温的反应中;由于加热模块集成在芯片表面,还特别适合数字微流控芯片的便携式应用中。
附图说明
图1为本发明实施例1的结构示意图。
图2为本发明实施例2的结构示意图。
图3为本发明实施例3的结构示意图。
图4为本发明实施例4的结构示意图。
图5为仅有加热丝的温控模块结构示意图。
图6为包含有加热丝和测温丝的温控模块结构示意图。
图中各标记为:1是基板;2是驱动电极阵列;3是接地电极;4是疏水层;5是介质层;6是温控模块;7是加热丝;8是加热丝接口;9是测温丝;10是测温丝接口。
具体实施方式
以下实施例将结合附图对本发明作进一步的说明。本实施例在以本发明技术方案为前提下进行实施,给出详细的实施方式和过程,但本发明的保护范围不限于下述的实施例。
实施例1
图1给出平行极板形式的数字微流控芯片,在加工有驱动电极阵列的基板的背面制作集成的温控模块示意图。集成有三个温控模块的平行极板形式的数字微流控芯片,所述数字微流控芯片由上下两片基板(1)组成,在上基板的下表面依次设置接地电极(3)和疏水层(4),在下基板的上表面依次设置驱动电极阵列(2)、介质层(5)和疏水层(4);三个温控模块(6)集成在下基板的下表面,下表面剩余区域设置介质层(5)进行保护。
实施例2
图2给出平行极板形式的数字微流控芯片,在加工有接地电极的基板的背面制作集成的温控模块示意图;集成有三个温控模块的平行极板形式的数字微流控芯片,所述数字微流控芯片由上下两片基板(1)组成,在上基板的下表面依次设置接地电极(3)和疏水层(4),在下基板上表面依次设置驱动电极阵列(2)、介质层(5)和疏水层(4);三个温控模块(6)集成在上基板的上表面,剩余区域设置介质层(5)进行保护。
实施例3
图3给出平行极板形式的数字微流控芯片,在加工有驱动电极点阵和接地电极的基板的背面均制作集成的温控模块示意图。集成有六个温控模块的平行极板形式的数字微流控芯片,所述数字微流控芯片由两片基板(1)组成,在上基板的下表面依次设置接地电极(3)和疏水层(4),在下基板的上表面依次设置驱动电极阵列(2)、介质层(5)和疏水层(4);三个温控模块(6)集成在上基板的上表面,剩余区域设置介质层(5)进行保护;另外三个温控模块(6)集成在下基板的下表面,剩余区域设置介质层(5)进行保护。
实施例4
图4给出单极板形式的数字微流控芯片,在加工有驱动电极阵列及接电电极的基板的背面制作集成的温控模块示意图。集成有两个温控模块的单极板形式的数字微流控芯片,所述数字微流控芯片由一片基板(1)组成,在基板的上表面制作驱动电极阵列(2)、接地电极(3),介质层,在介质层上设置疏水层(4);两个温控模块(6)集成在基板的下表面,剩余区域制作介质层(5)进行保护。
图5给出仅有加热丝的温控模块的结构示意图。温控模块只由加热丝(7)组成,呈蜿蜒状,两端通过加热丝接口(8)与外电路连接。
图6给出同时包含有加热丝和测温丝的温控模块的结构示意图。温控模块由加热丝(7)和测温丝(9)共同组成,呈蜿蜒状。加热丝两端通过加热丝接口(8)与外电路连接,测温丝两端通过测温丝接口(10)与外部测温电路连接。
本发明通过在芯片表面集成分别用于加热和测温的电阻丝回路,在实现对微流控芯片的集成式、反馈式的温度控制。得益于反馈控温机制,可用于在数字微流控芯片上进行聚合酶链式反应等需要高精度控温的反应中;由于加热模块集成在芯片表面,体积小,便于携带。

Claims (6)

1.一种集成有加热模块的数字微流控芯片,包括数字微流控芯片、驱动电极阵列和接地电极,其特征在于在数字微流控芯片的基板上集成温控模块,且温控模块与驱动电极阵列和接地电极位于基板的不同侧。
2.如权利要求1所述一种集成有加热模块的数字微流控芯片,其特征在于所述数字微流控芯片包括平行极板形式和单极板形式。
3.如权利要求2所述一种集成有加热模块的数字微流控芯片,其特征在于当所述数字微流控芯片采用平行极板形式时,一片基板上设驱动电极阵列,另一片基板上设接地电极,温控模块集成设置在有驱动电极阵列的基板的另一侧或在设置在接地电极的基板的另一侧;或两片基板的一侧分别设有驱动电极阵列和接地电极,多个温控模块同时集成设置在两片基板的另一侧。
4.如权利要求2所述一种集成有加热模块的数字微流控芯片,其特征在于当所述数字微流控芯片采用单极板形式时,驱动电极阵列和接地电极设在单片基板的同侧,温控模块集成在驱动电极和接地电极的基板的另一侧。
5.如权利要求1~4中任一所述一种集成有加热模块的数字微流控芯片,其特征在于所述温控模块由加热丝组成,或由加热丝和测温丝组成,所述加热丝用于实现升温,测温丝用于对温控区域进行测温。
6.如权利要求1~4中任一所述一种集成有加热模块的数字微流控芯片,其特征在于所述温控模块设有至少一个。
CN202111024813.0A 2021-09-02 2021-09-02 一种集成有加热模块的数字微流控芯片 Pending CN113751089A (zh)

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