CN113747684A - Technology for manufacturing fully-suspended finger FPC - Google Patents
Technology for manufacturing fully-suspended finger FPC Download PDFInfo
- Publication number
- CN113747684A CN113747684A CN202110868927.7A CN202110868927A CN113747684A CN 113747684 A CN113747684 A CN 113747684A CN 202110868927 A CN202110868927 A CN 202110868927A CN 113747684 A CN113747684 A CN 113747684A
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- Prior art keywords
- finger
- manufacturing
- fpc
- hollow
- insulating layer
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 54
- 238000003466 welding Methods 0.000 claims abstract description 23
- 239000000758 substrate Substances 0.000 claims abstract description 12
- 238000005520 cutting process Methods 0.000 claims abstract description 10
- 238000000034 method Methods 0.000 claims description 18
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 9
- 239000011889 copper foil Substances 0.000 claims description 9
- 239000000463 material Substances 0.000 claims description 6
- 238000003825 pressing Methods 0.000 claims description 4
- 239000002131 composite material Substances 0.000 claims description 3
- 238000012545 processing Methods 0.000 claims description 3
- 239000002994 raw material Substances 0.000 claims description 3
- 239000010410 layer Substances 0.000 description 35
- 239000010408 film Substances 0.000 description 11
- 238000013461 design Methods 0.000 description 5
- 239000013039 cover film Substances 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000000725 suspension Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/403—Edge contacts; Windows or holes in the substrate having plural connections on the walls thereof
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Structure Of Printed Boards (AREA)
Abstract
The invention discloses a technology for manufacturing a full-suspended finger FPC (flexible printed circuit), and aims to provide a technology for manufacturing a full-suspended finger FPC, which can solve the problems of deformation, breakage and the like of a window lead finger. The invention comprises the following steps: a. manufacturing a hollowed-out plate without substrate support on the back surface of a welding finger, wherein an extension part is arranged at the tail end of the welding finger, the welding finger is completely suspended at the hollowed-out part of the hollowed-out plate, the extension part is supported by an insulating layer, and the insulating layer is connected with the hollowed-out plate; b. cutting the insulating layer from the stencil while cutting the extension of the bonding finger from the bonding finger tip. The invention is applied to the technical field of FPC manufacturing technology.
Description
Technical Field
The invention relates to a FPC (flexible printed circuit) manufacturing technology, in particular to a full-suspension finger FPC manufacturing technology.
Background
In order to ensure the welding reliability and the production process requirement of the FPC, the back surface of a welding finger is sometimes required to be not supported by a PI base material and only needs to be a layer of copper foil. Such FPCs are known as window, stencil or flying lead plates.
Due to the assembly space or design requirements, some hollowed-out boards require that the other end of a window finger cannot be supported by an insulating layer, and only copper foils serving as leads are available, so that the hollow-out boards are called full-suspended fingers. If the hollow-out board with the full-suspended fingers is directly manufactured, the lead fingers can be seriously deformed or even broken in the manufacturing process because the other end of the hollow-out board is not supported by an insulating layer, so that the production cannot be carried out. For example, chinese patent publication No. CN102361535B discloses a method for manufacturing a flexible circuit board with a hanging insertion finger, which mainly includes selecting a pure copper foil with a corresponding thickness and etching twice, and in order to prevent the lead finger from being seriously deformed or broken, the fully hanging lead finger can only be widened and thickened, so that the higher requirements of customers on the product cannot be met.
Disclosure of Invention
The invention aims to overcome the defects of the prior art and provides a technology for manufacturing a full-suspended finger FPC (flexible printed circuit) capable of solving the problems of deformation, breakage and the like of a window lead finger.
The technical scheme adopted by the invention is as follows: the manufacturing technology of the fully-suspended finger FPC comprises the following steps:
a. manufacturing a hollowed-out plate without substrate support on the back surface of a welding finger, wherein an extension part is arranged at the tail end of the welding finger, the welding finger is completely suspended at the hollowed-out part of the hollowed-out plate, the extension part is supported by an insulating layer, and the insulating layer is connected with the hollowed-out plate;
b. cutting the insulating layer from the stencil while cutting the extension of the bonding finger from the bonding finger tip.
Preferably, the manufacturing method of the hollow-out plate adopts the following method: the window is processed on the covering film, then the copper foil is pressed, after the copper foil is used for manufacturing a circuit, the covering film with the window opened on the other surface is pressed, and then the subsequent process is completed to manufacture the hollow-out board with the support.
Preferably, the manufacturing method of the hollow-out plate adopts the following method: the single-sided board without the hollow window is manufactured by the glue-free single-sided board, the covering film is pressed, the copper-clad board substrate in the window area is dissolved by adopting modes such as chemistry and the like, and then the subsequent process is completed to manufacture the hollow board with the support.
Preferably, the manufacturing method of the hollow-out plate adopts the following method: and manufacturing a single panel without a hollow window by adopting the adhesive-free single panel, pressing a covering film, processing the copper-clad plate substrate by adopting laser, and finishing the subsequent processes to manufacture the hollow plate with the support.
Furthermore, the insulating layer is two layers of insulating layers positioned on the upper surface and the lower surface of the extension part.
Preferably, both insulating layers are cover films
Preferably, one of the two insulating layers is a covering film, and the other insulating layer is a base material layer of a copper-clad plate raw material.
Preferably, the two insulating layers are composite layers of the base material layer and the cover film respectively.
The invention has the beneficial effects that: because the invention adopts the design of extending the full-suspended finger, the invention comprises the following steps: a. manufacturing a hollowed-out plate without substrate support on the back surface of a welding finger, wherein an extension part is arranged at the tail end of the welding finger, the welding finger is completely suspended at the hollowed-out part of the hollowed-out plate, the extension part is supported by an insulating layer, and the insulating layer is connected with the hollowed-out plate; b. and cutting off the insulating layer from the hollowed-out plate, and simultaneously cutting off the extension part of the welding finger from the tail end of the welding finger to obtain the full-suspended finger FPC, thereby well solving the problems of deformation, breakage and the like of the window lead finger.
Drawings
FIG. 1 is a fully-suspended hand section indicating intent;
FIG. 2 is a first schematic plan view of a fully suspended finger FPC;
FIG. 3 is a second schematic plan view of the fully suspended finger FPC;
FIG. 4 is a schematic cross-sectional view of a modified design of a pierced FPC;
fig. 5 is a schematic plan view of a modified design of the pierced FPC.
Detailed Description
As shown in fig. 1, 2, and 3, this is the original fully-suspended finger stencil requirement. The figure shows that the finger is in a cantilever shape in the fully suspended area, and the other end of the lead finger is not supported by the insulating layer.
As shown in fig. 4 and fig. 3, in this embodiment, the technology for manufacturing the fully suspended finger FPC includes the following steps:
a. manufacturing a hollowed-out plate without substrate support on the back surface of a welding finger, wherein an extension part 2 is arranged at the tail end of the welding finger 1, the welding finger 1 is completely suspended at the hollowed-out part of the hollowed-out plate, the extension part 2 is supported by an insulating layer 3, and the insulating layer 3 is connected with the hollowed-out plate; the insulating layers are two layers of insulating layers positioned on the upper surface and the lower surface of the extension part, and the upper layer and the lower layer of insulating layers are possibly both covering films; or one layer can be a covering film, and the other layer is a base material layer of the copper-clad plate raw material; a composite layer of the substrate layer and the cover film is also possible.
b. And cutting off the insulating layer 3 from the hollowed-out board, and simultaneously cutting off the extension part 2 of the welding finger 1 from the tail end of the welding finger 1, so as to obtain the fully suspended finger FPC shown in the figures 1, 2 and 3. Wherein, fig. 2 and fig. 3 are to determine whether the insulating layer needs to be reserved on the side edge of the fully suspended finger according to the requirements of the drawings.
The manufacturing of the hollow-out board can adopt a method I according to the technical difficulty of products and the technical capability of each company, the window is processed by adopting a covering film, then copper foil is pressed on, the covering film with the window opened on the other surface is pressed on after the circuit is manufactured, and then the subsequent process is completed to manufacture the supported hollow-out board; manufacturing a single panel without a hollow window by adopting the adhesive-free single panel, pressing a cover film, dissolving the copper-clad plate substrate in the window area by adopting a chemical mode and the like, and finishing the subsequent processes to manufacture the hollow plate with the support; and thirdly, manufacturing a single panel without a hollow window by adopting the adhesive-free single panel, pressing the covering film, processing the copper-clad plate substrate by adopting laser, and then finishing the subsequent processes to manufacture the hollow plate with the support.
The fully suspended finger is vulnerable and easily deformed. Therefore, after the design extension part is cut off and the full-suspended finger is exposed, the carrying, the packaging and the like need to be properly processed so as to avoid accidentally damaging the full-suspended finger.
In the same way, referring to the technical route provided above, besides the manufacture of the single-sided full-suspended finger FPC, the method can also be used for manufacturing the double-sided full-suspended finger FPC and the multilayer full-suspended finger FPC. The common characteristic is that the completely suspended finger areas are all single-layer copper foils.
In conclusion, the technology provides a production technology of the FPC with the completely suspended fingers, and the problem that the lead fingers of the FPC are damaged in the production process can be effectively solved, so that the product can be produced smoothly.
While the embodiments of the present invention have been described in terms of practical embodiments, they are not to be construed as limiting the meaning of the present invention, and modifications of the embodiments and combinations with other embodiments will be apparent to those skilled in the art in light of the present description.
Claims (8)
1. A technology for manufacturing a fully suspended finger FPC is characterized in that: the manufacturing technology of the fully-suspended finger FPC comprises the following steps:
a. manufacturing a hollowed-out plate without substrate support on the back of a welding finger, wherein an extending part (2) is arranged at the tail end of the welding finger (1), the welding finger (1) is completely suspended at the hollowed-out part of the hollowed-out plate, the extending part (2) is supported by an insulating layer (3), and the insulating layer (3) is connected with the hollowed-out plate;
b. cutting the insulating layer (3) from the stencil, and simultaneously cutting the extension (2) of the welding finger (1) from the end of the welding finger (1).
2. The fully suspended finger FPC manufacturing technology of claim 1, wherein: the manufacturing method of the hollow-out plate adopts the following method: the window is processed on the covering film, then the copper foil is pressed, after the copper foil is used for manufacturing a circuit, the covering film with the window opened on the other surface is pressed, and then the subsequent process is completed to manufacture the hollow-out board with the support.
3. The fully suspended finger FPC manufacturing technology of claim 1, wherein: the manufacturing method of the hollow-out plate adopts the following method: the single-sided board without the hollow window is manufactured by the glue-free single-sided board, the covering film is pressed, the copper-clad board substrate in the window area is dissolved by adopting modes such as chemistry and the like, and then the subsequent process is completed to manufacture the hollow board with the support.
4. The fully suspended finger FPC manufacturing technology of claim 1, wherein: the manufacturing method of the hollow-out plate adopts the following method: and manufacturing a single panel without a hollow window by adopting the adhesive-free single panel, pressing a covering film, processing the copper-clad plate substrate by adopting laser, and finishing the subsequent processes to manufacture the hollow plate with the support.
5. The fully suspended finger FPC manufacturing technology of claim 1, wherein: the insulating layer (3) is a two-layer insulating layer located on the upper surface and the lower surface of the extension part (2).
6. The fully suspended finger FPC manufacturing technology of claim 5, wherein: the two insulating layers are both cover films.
7. The fully suspended finger FPC manufacturing technology of claim 5, wherein: one of the two insulating layers is a covering film, and the other insulating layer is a base material layer of a copper-clad plate raw material.
8. The fully suspended finger FPC manufacturing technology of claim 5, wherein: the two insulating layers are respectively a composite layer of a base material layer and a covering film.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110868927.7A CN113747684A (en) | 2021-07-30 | 2021-07-30 | Technology for manufacturing fully-suspended finger FPC |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110868927.7A CN113747684A (en) | 2021-07-30 | 2021-07-30 | Technology for manufacturing fully-suspended finger FPC |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN113747684A true CN113747684A (en) | 2021-12-03 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110868927.7A Pending CN113747684A (en) | 2021-07-30 | 2021-07-30 | Technology for manufacturing fully-suspended finger FPC |
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| Country | Link |
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| CN (1) | CN113747684A (en) |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07254770A (en) * | 1994-03-16 | 1995-10-03 | Sumitomo Electric Ind Ltd | Manufacturing method of flexible printed wiring board |
| CN201039586Y (en) * | 2006-12-02 | 2008-03-19 | 比亚迪股份有限公司 | A flexible line board for preventing gold fingers from breaking |
| CN101426342A (en) * | 2007-10-31 | 2009-05-06 | 富葵精密组件(深圳)有限公司 | Manufacturing method of hollowed-out flexible circuit board |
| CN107809846A (en) * | 2017-10-20 | 2018-03-16 | 珠海元盛电子科技股份有限公司 | A kind of method for making FPC hollowed-out boards that opened a window using laser |
| CN108024453A (en) * | 2016-10-31 | 2018-05-11 | 宏启胜精密电子(秦皇岛)有限公司 | Hollowed-out PCB and preparation method thereof |
| CN110012605A (en) * | 2019-04-23 | 2019-07-12 | 珠海元盛电子科技股份有限公司 | A kind of thickness copper hollow out window FPC production method |
-
2021
- 2021-07-30 CN CN202110868927.7A patent/CN113747684A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07254770A (en) * | 1994-03-16 | 1995-10-03 | Sumitomo Electric Ind Ltd | Manufacturing method of flexible printed wiring board |
| CN201039586Y (en) * | 2006-12-02 | 2008-03-19 | 比亚迪股份有限公司 | A flexible line board for preventing gold fingers from breaking |
| CN101426342A (en) * | 2007-10-31 | 2009-05-06 | 富葵精密组件(深圳)有限公司 | Manufacturing method of hollowed-out flexible circuit board |
| CN108024453A (en) * | 2016-10-31 | 2018-05-11 | 宏启胜精密电子(秦皇岛)有限公司 | Hollowed-out PCB and preparation method thereof |
| CN107809846A (en) * | 2017-10-20 | 2018-03-16 | 珠海元盛电子科技股份有限公司 | A kind of method for making FPC hollowed-out boards that opened a window using laser |
| CN110012605A (en) * | 2019-04-23 | 2019-07-12 | 珠海元盛电子科技股份有限公司 | A kind of thickness copper hollow out window FPC production method |
Non-Patent Citations (1)
| Title |
|---|
| 何为 等: "挠性PI基材上镂空板用开窗工艺研究", 电子科技大学学报 * |
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| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20211203 |
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| RJ01 | Rejection of invention patent application after publication |