CN113710397A - Method for cutting workpiece and wire saw - Google Patents
Method for cutting workpiece and wire saw Download PDFInfo
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- CN113710397A CN113710397A CN202080030275.3A CN202080030275A CN113710397A CN 113710397 A CN113710397 A CN 113710397A CN 202080030275 A CN202080030275 A CN 202080030275A CN 113710397 A CN113710397 A CN 113710397A
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- fixed abrasive
- cutting
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- 238000005520 cutting process Methods 0.000 title claims abstract description 56
- 238000000034 method Methods 0.000 title claims abstract description 33
- 239000002826 coolant Substances 0.000 claims abstract description 42
- 239000006061 abrasive grain Substances 0.000 claims abstract description 20
- 238000004804 winding Methods 0.000 claims abstract description 10
- 239000002184 metal Substances 0.000 claims abstract description 7
- 230000007246 mechanism Effects 0.000 claims description 29
- 238000005304 joining Methods 0.000 claims description 6
- 238000002360 preparation method Methods 0.000 claims description 3
- 239000002002 slurry Substances 0.000 description 7
- 230000000052 comparative effect Effects 0.000 description 6
- 230000000694 effects Effects 0.000 description 6
- 235000012431 wafers Nutrition 0.000 description 3
- 229910000831 Steel Inorganic materials 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000011295 pitch Substances 0.000 description 2
- 239000010959 steel Substances 0.000 description 2
- 229920002803 thermoplastic polyurethane Polymers 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 239000000498 cooling water Substances 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 239000002440 industrial waste Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
Images
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23D—PLANING; SLOTTING; SHEARING; BROACHING; SAWING; FILING; SCRAPING; LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOT OTHERWISE PROVIDED FOR
- B23D61/00—Tools for sawing machines or sawing devices; Clamping devices for these tools
- B23D61/18—Sawing tools of special type, e.g. wire saw strands, saw blades or saw wire equipped with diamonds or other abrasive particles in selected individual positions
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B27/00—Other grinding machines or devices
- B24B27/06—Grinders for cutting-off
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
- B24B55/02—Equipment for cooling the grinding surfaces, e.g. devices for feeding coolant
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Grinding-Machine Dressing And Accessory Apparatuses (AREA)
- Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
Abstract
The present invention provides a method for cutting a workpiece by a wire saw, wherein a wire array is formed by winding a fixed abrasive wire around a plurality of grooved rollers, a workpiece is cut at a plurality of positions arranged in an axial direction simultaneously by feeding the workpiece into the wire array while supplying a coolant to the fixed abrasive wire and reciprocating the fixed abrasive wire in the axial direction, and the workpiece is held by a workpiece holding device, characterized in that, after the cutting of the workpiece is completed and when the workpiece is pulled out from the wire array, the flow rate of the coolant is set to 180L/min or more, and the moving speed of the fixed abrasive wire in the axial direction is set to 6m/min or more and 30m/min or less. Thus, a method for cutting a workpiece is provided, which can prevent the fixed abrasive grain metal wire from being stuck on the workpiece to generate saw marks or the fixed abrasive grain metal wire from being broken in the process of drawing the metal wire after cutting the workpiece.
Description
Technical Field
The present invention relates to a method for cutting a workpiece and a wire saw.
Background
Wire saws have been known as apparatuses for slicing wafers from silicon ingots, compound semiconductor ingots, and the like. In this wire saw, a plurality of cutting wires are wound around a plurality of rollers to form a wire array, the cutting wires are driven at high speed in the axial direction, and a workpiece is cut into the wire array and fed while appropriately supplying a slurry, whereby the workpiece is cut at each position of the wire array at the same time (see patent document 1).
Here, fig. 3 shows an outline of an example of a conventional general wire saw. As shown in fig. 3, the wire saw 101 is mainly composed of: a wire 102 (high-tension wire) for cutting the workpiece W ', grooved rollers 103, 103 ' around which the wire 102 is wound, a wire row 130 formed by winding the wire 102 around the plurality of grooved rollers 103, 103 ', tension adjusting mechanisms 104, 104 ' for adjusting the tension of the wire 102, a workpiece feeding mechanism 105 for feeding the cut workpiece W ' downward, and a slurry supply mechanism 106 for supplying slurry at the time of cutting.
The wire 102 is fed from one wire reel 107, wound around the grooved rollers 103 and 103 ' for about 300 to 500 cycles via a cross arm (トラバーサ), a pulley 109, and a tension adjusting mechanism 104, and then wound around the wire reel 107 ' via another tension adjusting mechanism 104 ', a pulley 109 ', and a cross arm 108 '.
The grooved rollers 103 and 103' are rollers in which urethane resin is pressed around a steel cylinder and grooves are cut at substantially constant pitches on the surface thereof, and the wound wire 102 can be driven in one direction or in the reciprocating direction at predetermined intervals by the grooved roller drive motor 110.
The wire reels 107, 107 ' are rotationally driven by wire reel driving motors 111, 111 ', and the speeds of the grooved roller driving motor 110 and the wire reel driving motors 111, 111 ' are controlled, respectively, whereby the tension acting on the wire 102 can be adjusted.
As shown in fig. 4, the workpiece feeding mechanism 105 that feeds the workpiece W ' of fig. 3 downward includes a workpiece holding device 114 including a workpiece holding portion 112 and a workpiece plate 113, and the workpiece W ' is bonded to the workpiece plate 113 by a bonding member (beam) attached to the workpiece W '.
When cutting the workpiece W ', the workpiece W' is held by the workpiece feed mechanism 105, pressed relatively, and fed out to the wire array 130, and the wire array 130 is formed of a wire wound around the grooved rollers 103.
When such a wire saw 101 is used, the wire 102 is applied with an appropriate tension by the tension adjusting mechanisms 104 and 104 ', and the slurry is supplied from the slurry supply mechanism 106 while the wire 102 is moved in the reciprocating direction by the wire reel drive motors 111 and 111', and the workpiece W 'is cut and fed by the workpiece feed mechanism 105, thereby cutting the workpiece W'.
On the other hand, a method of cutting a workpiece by using a fixed abrasive wire in which diamond abrasive grains or the like are fixed to a wire surface instead of a slurry containing abrasive grains is known, and has been partially put into practical use in cutting a small-diameter ingot having a diameter of about 150mm or less.
In the cutting of the fixed abrasive wire, a general wire saw can be used as it is by installing the fixed abrasive wire instead of the wire saw shown in fig. 3 and changing the slurry to a coolant such as cooling water containing no abrasive.
Documents of the prior art
Patent document
Patent document 1: japanese laid-open patent publication No. 9-262826
Disclosure of Invention
Technical problem to be solved
Since the free abrasive is not used in cutting the fixed abrasive wire, there is an advantage that industrial waste is less in environmental aspects. In addition, the method has an advantage of high processing speed, and is more convenient than the processing using a wire saw of free abrasive grains. However, in the wire saw, as shown in fig. 3, since the workpiece W ' is pressed against one wire 102 wound around the grooved roller 103 and cut, the workpiece W ' is positioned below the wire 102 pressing the workpiece W ' when the cutting is completed. Therefore, in order to take out the workpiece W ', the wire 102 needs to be relatively pulled out downward through the gap of the cut workpiece W ' having a wafer shape by moving the workpiece W ' upward.
When the wire is pulled out, as shown in fig. 5 (a), in the case of a wire saw using free abrasive grains, since a gap (clearance) can be generated between the wire 102 and the workpiece W by the amount of the width of the free abrasive grains G, the wire 102 can be relatively easily taken out and withdrawn. However, as shown in fig. 5 (b), in the case of a wire saw using fixed abrasive grains, since no gap is generated between the fixed abrasive grain wire 402 and the workpiece W', it is difficult to pull out the fixed abrasive grain wire 402.
Therefore, if the fixed abrasive wire 402 is caught by the workpiece W' and floated, and the fixed abrasive wire 402 is pulled out in this state, the cut surface of the workpiece is damaged and so-called saw cuts are generated in the cut surface, and therefore the Warp deteriorates and deteriorates the quality. In the case where the floating of the fixed abrasive wire 402 is further increased, it may even cause wire breakage. When the wire is broken, the fixed abrasive wire needs to be rewound around the grooved roller, and an extra amount of the fixed abrasive wire needs to be added to the rewound portion, which results in a large loss.
The present invention has been made in view of the above problems, and an object of the present invention is to provide a workpiece cutting method and a wire saw that prevent a fixed abrasive wire from being caught on a workpiece and generating saw marks or breakage of the fixed abrasive wire in a process of pulling out the fixed abrasive wire after cutting the workpiece.
(II) technical scheme
In order to achieve the above object, the present invention provides a method of cutting a workpiece by a wire saw, the method comprising winding a fixed abrasive wire having abrasive grains fixed to a surface thereof around a plurality of grooved rollers to form a wire array, feeding a workpiece into the wire array while supplying a coolant to the fixed abrasive wire and reciprocating the fixed abrasive wire in an axial direction, and simultaneously cutting the workpiece at a plurality of positions in the axial direction, wherein the workpiece is held by a workpiece holding device via a joint member attached to the workpiece,
after the cutting of the workpiece is completed and when the workpiece is pulled out from the wire row, the flow rate of the coolant is set to 180L/min or more, and the moving speed of the fixed abrasive metal in the axial direction is set to 6m/min to 30 m/min.
The workpiece cutting method according to the present invention can improve the lubricity between the workpiece and the fixed abrasive wire, and prevent the fixed abrasive wire from being stuck when the workpiece is pulled out. Therefore, if the method for cutting a workpiece according to the present invention is used, it is possible to prevent the fixed abrasive wire from being caught by the workpiece and generating saw marks, and to prevent the fixed abrasive wire from being broken.
In this case, the flow rate of the coolant is preferably set to 250L/min or less.
By suppressing the supply of the coolant in this way, the above-described effects can be obtained, and the amount of the coolant used can also be suppressed.
In order to achieve the above object, the present invention provides a wire saw including:
a metal wire array formed by winding a fixed abrasive wire having abrasive grains fixed to a surface thereof around a plurality of grooved rollers;
a coolant supply mechanism that supplies coolant to the fixed abrasive wire; and
a workpiece feed mechanism that, while holding the workpiece by a workpiece holding device via a joining member attached to the workpiece, plunges and feeds the workpiece into the wire array,
the wire saw cuts the workpiece at a plurality of positions arranged in the axial direction simultaneously by performing plunge feed of the workpiece into the wire row using the workpiece feed mechanism while reciprocating the fixed-abrasive wire in the axial direction,
it is characterized in that the preparation method is characterized in that,
after the cutting of the workpiece is completed and when the workpiece is pulled out from the wire row, the flow rate of the coolant is set to 180L/min or more, and the moving speed of the fixed abrasive wire in the axial direction is set to 6m/min to 30 m/min.
The wire saw according to the present invention can improve the lubricity between the workpiece and the fixed abrasive wire, and prevent the fixed abrasive wire from being stuck when the workpiece is pulled out. Therefore, in the wire saw of the present invention, it is possible to prevent the fixed abrasive wire from being caught by the workpiece and generating a saw cut, and to prevent the fixed abrasive wire from being broken.
The flow rate of the coolant is preferably 250L/min or less.
By suppressing the supply of the coolant in this way, the above-described effects can be obtained, and the amount of the coolant used can also be suppressed.
(III) advantageous effects
As described above, according to the method for cutting a workpiece and the wire saw of the present invention, when the fixed abrasive wire is pulled out after the workpiece is cut, it is possible to prevent a saw mark caused by the fixed abrasive wire being caught on the workpiece or a wire breakage of the fixed abrasive wire. As a result, the workpiece can be cut in sequence by one wire saw without rewinding the fixed abrasive wire by contacting the workpiece or adding the fixed abrasive wire in the rewound portion.
Drawings
Fig. 1 is a schematic view showing an example of a wire saw that can be used for the method for cutting a workpiece according to the present invention.
Fig. 2 (a) is a diagram showing a positional relationship between the workpiece and the fixed abrasive wire at the end of cutting of the workpiece; fig. 2 (b) is a view showing a state of the workpiece and the fixed abrasive wire when seizure of the wire occurs; fig. 2 (c) is a diagram showing a positional relationship between the workpiece and the fixed abrasive wire at the end of the drawing of the workpiece.
Fig. 3 is a schematic view showing an example of a general wire saw.
Fig. 4 is a schematic view showing an example of a workpiece holding device of a general wire saw.
Fig. 5 (a) is an explanatory view showing the removal of the wire in the case of a wire saw using free abrasive grains (free abrasive grain method); fig. 5 (b) is an explanatory view showing the removal of the wire in the case of a wire saw using a fixed abrasive wire (fixed abrasive method).
Detailed Description
The present invention will be described below with reference to embodiments, but the present invention is not limited to these embodiments.
As described above, when a workpiece is cut using a fixed abrasive wire, there is a problem that the fixed abrasive wire is caught on the workpiece and saw marks are generated on a cut surface or the fixed abrasive wire is broken when the cut workpiece is pulled out from the wire row.
The present inventors have made extensive studies to solve the above problems. As a result, it was found that: in a workpiece cutting method using a wire saw using a fixed abrasive wire, when the workpiece is pulled out from a wire row after cutting of the workpiece is completed, if the coolant flow rate and the moving speed of the fixed abrasive wire in the axial direction are set to predetermined values, the workpiece can be pulled out without the fixed abrasive wire being caught on the workpiece, and the present invention has been completed.
That is, the present invention relates to a method of cutting a workpiece by a wire saw, in which a wire array is formed by winding a fixed abrasive wire having abrasive grains fixed to a surface thereof around a plurality of grooved rollers, and the workpiece is simultaneously cut at a plurality of positions arranged in an axial direction by feeding the workpiece into the wire array while supplying a coolant to the fixed abrasive wire and reciprocating the fixed abrasive wire in the axial direction, wherein the workpiece is held by a workpiece holding device via a joining member attached to the workpiece,
after the cutting of the workpiece is completed and when the workpiece is pulled out from the wire row, the flow rate of the coolant is set to 180L/min or more, and the moving speed of the fixed abrasive wire in the axial direction is set to 6m/min to 30 m/min.
Further, the present invention relates to a wire saw including:
a metal wire array formed by winding a fixed abrasive wire having abrasive grains fixed to a surface thereof around a plurality of grooved rollers;
a coolant supply mechanism that supplies coolant to the fixed abrasive wire; and
a workpiece feed mechanism that, while holding the workpiece by a workpiece holding device via a joining member attached to the workpiece, plunges and feeds the workpiece into the wire array,
the wire saw cuts the workpiece at a plurality of positions arranged in the axial direction simultaneously by performing plunge feed of the workpiece into the wire row using the workpiece feed mechanism while reciprocating the fixed-abrasive wire in the axial direction,
it is characterized in that the preparation method is characterized in that,
after the cutting of the workpiece is completed and when the workpiece is pulled out from the wire row, the flow rate of the coolant is set to 180L/min or more, and the moving speed of the fixed abrasive wire in the axial direction is set to 6m/min to 30 m/min.
Hereinafter, the present invention will be described in detail with reference to the accompanying drawings, but the present invention is not limited thereto.
[ fretsaw ]
First, a wire saw that can be used for the method for cutting a workpiece according to the present invention will be described with reference to fig. 1. As shown in fig. 1, a wire saw 1 of the present invention is mainly composed of: a fixed abrasive wire 2 for cutting the workpiece W with abrasive grains fixed to the surface thereof, grooved rollers 3 and 3 'around which the fixed abrasive wire 2 is wound, a wire array 30 formed by winding the fixed abrasive wire 2 around the plurality of grooved rollers 3 and 3', a workpiece feeding mechanism 5 for feeding the cut workpiece W downward to the wire array 30, and a coolant supply mechanism 6 for supplying a coolant to the fixed abrasive wire 2.
The workpiece feeding mechanism 5 includes a workpiece holding device shown in fig. 4, which holds the workpiece W via a joining member (beam) 20 (fig. 1) attached to the workpiece W, like a conventional workpiece feeding mechanism 105.
The wire saw 1 may further include tension adjusting mechanisms 4 and 4' for adjusting the tension of the fixed abrasive wire 2.
In fig. 1, the fixed abrasive wire 2 is fed out from one wire reel 7, wound around the grooved rollers 3 and 3 ' for about 300 to 500 cycles via the cross arm 8, the pulley 9, and the tension adjusting mechanism 4, and then wound around the wire reel 7 ' via the other tension adjusting mechanism 4 ', the pulley 9 ', the cross arm 8 '.
The grooved rollers 3 and 3' are rollers in which urethane resin is pressed into the periphery of a steel cylinder, for example, and grooves are cut at substantially constant pitches on the surface thereof. The wound fixed abrasive wire 2 can be driven in one direction or in a reciprocating direction at a predetermined cycle by the grooved roller drive motor 10.
The wire reels 7, 7 ' are rotationally driven by wire reel driving motors 11, 11 ', and the speeds of the grooved roller driving motor 10 and the wire reel driving motors 11, 11 ' are controlled to adjust the tension acting on the fixed abrasive wire 2.
The wire saw 1 cuts the workpiece W at a plurality of positions arranged in the axial direction at the same time by cutting and feeding the workpiece W into the wire array 30 by the workpiece feed mechanism 5 while reciprocating the fixed abrasive wire 2 in the axial direction.
The fixed abrasive wire 2 wound between the grooved rollers 3 and 3' is advanced in one direction by a predetermined length, then retreated in the other direction by a length shorter than the aforementioned advance amount, and this is used as one feed cycle, and the fixed abrasive wire 2 is reciprocated by a method of repeating this cycle and feeding the wire in one direction. The grooved roller 3' can drive the wound fixed abrasive wire 2 in the reciprocating direction at a predetermined cycle by the grooved roller drive motor 10.
In the wire saw 1 of the present invention, the flow rate of the coolant is controlled to 180L/min or more and the moving speed of the fixed abrasive wire 2 in the axial direction is controlled to 6m/min to 30m/min after the cutting of the workpiece W is completed and when the workpiece W is pulled out from the wire array 30.
Here, fig. 2 (a) and (c) are views showing the positional relationship between the workpiece W and the fixed abrasive wire 202 wound around the grooved rollers 203 and 203' at the time of completion of cutting the workpiece and at the time of completion of pulling out the workpiece, respectively. As shown in fig. 2 (a), at the end of cutting, the workpiece W is located below the wire array. Therefore, in order to take out the workpiece W, the fixed abrasive wire 202 must be pulled out downward relatively through the gap between the wafers of the sliced and wafer-shaped workpiece W by moving the workpiece W upward.
However, in the case of the conventional wire saw using such a fixed abrasive wire, since no clearance is generated between the fixed abrasive wire 202 and the workpiece W (see fig. 5 b), the fixed abrasive wire 202 is caught on the workpiece W, and floats up as shown in fig. 2 b to generate a saw cut in a cut surface of the workpiece W or a wire breakage occurs.
In contrast, in the wire saw 1 of the present invention, the controller 31 controls the coolant flow rate and the moving speed of the fixed abrasive wire 2 in the axial direction in the above-described manner, so that the lubricity between the workpiece W and the fixed abrasive wire 2 can be improved, and the fixed abrasive wire 2 can be prevented from being stuck when the workpiece W is pulled out. Therefore, in the wire saw 1 of the present invention, the fixed abrasive wire 2 can be prevented from being caught by the workpiece W to generate a saw cut, and the wire breakage of the fixed abrasive wire can be prevented.
The flow rate of the coolant is preferably 250L/min or less.
By suppressing the supply of the coolant in this way, the above-described effects can be obtained, and the amount of the coolant used can also be suppressed.
[ method of cutting workpiece ]
Next, a method for cutting a workpiece according to the present invention will be described by taking a case where the wire saw according to the present invention is used as an example. First, as shown in fig. 1, a wire row 30 is formed by winding a fixed abrasive wire 2 having abrasive grains fixed to the surface thereof around a plurality of grooved rollers 3 and 3'. Subsequently, the fixed abrasive wire 2 is reciprocated in the axial direction of the fixed abrasive wire 2 by the grooved roller drive motor 10. At this time, the tension applied to the fixed abrasive wire 2 can be adjusted while applying an appropriate tension to the fixed abrasive wire 2 by using the tension adjusting mechanisms 4 and 4 'and moving the fixed abrasive wire 2 in the reciprocating direction by the wire reel driving motors 11 and 11'. Then, while supplying the coolant from the coolant supply mechanism 6 to the fixed abrasive wire 2 and moving the fixed abrasive wire 2 in the reciprocating direction, the cylindrical workpiece W is cut into the wire row 30 and fed, and the workpiece W held by the workpiece holding device via the joining member 20 bonded to the workpiece W is cut at a plurality of positions arranged in the axial direction at the same time.
The above description is the same as the workpiece cutting method described above, but the workpiece cutting method of the present invention is different from a normal workpiece cutting method in that: after the cutting of the workpiece W is completed and the workpiece W is pulled out from the wire array 30, the flow rate of the coolant is set to 180L/min or more, and the moving speed of the fixed abrasive wire 2 in the axial direction is set to 6m/min to 30 m/min.
In the workpiece cutting method of the present invention, the lubricity between the workpiece W and the fixed abrasive wire 2 can be improved, and the fixed abrasive wire 2 can be prevented from being stuck when the workpiece W is pulled out. Therefore, if the method for cutting a workpiece according to the present invention is used, it is possible to prevent the fixed abrasive wire 2 from being caught by the workpiece W and generating saw marks, and to prevent the fixed abrasive wire from being broken.
In this case, the flow rate of the coolant is preferably set to 250L/min or less.
By suppressing the supply of the coolant in this way, the above-described effects can be obtained, and the amount of the coolant used can also be suppressed.
Examples
The present invention will be described in detail below with reference to examples and comparative examples of the present invention, but the present invention is not limited thereto.
(examples and comparative examples)
The inventors cut a cylindrical workpiece W by using the wire saw 1 of the present invention shown in fig. 1 according to the method of cutting a workpiece of the present invention, and pull out the workpiece W from the wire array 30. The workpiece was cut and the workpiece was pulled out by using the workpiece cutting method of the comparative example. Table 1 shows the common conditions of the examples and comparative examples.
[ Table 1]
Next, the conditions of the examples and comparative examples when the workpiece was pulled out from the wire row after the end of cutting the workpiece are shown in table 2. The results are shown in Table 3.
[ Table 2]
[ Table 3]
As a result, as shown in table 3, when the workpiece was pulled out from the wire row after the end of cutting the workpiece, in examples 1 to 6 in which the flow rate of the coolant was set to 180L/min or more and the moving speed of the fixed abrasive wire in the axial direction was set to 6m/min to 30m/min, no breakage or saw marks occurred during pulling out. On the other hand, in comparative examples 1 to 8 in which at least one of the coolant flow rate and the moving speed of the fixed abrasive wire in the axial direction was out of the range of the present invention, it was confirmed that wire breakage and saw marks occurred during the drawing.
The present invention is not limited to the above embodiments. The above embodiments are merely illustrative, and any configuration having substantially the same configuration as the technical idea described in the claims of the present invention and producing the same operation and effect is included in the technical scope of the present invention.
Claims (4)
1. A method of cutting a workpiece by a wire saw, wherein a wire row is formed by winding a fixed abrasive wire having abrasive grains fixed to a surface thereof around a plurality of grooved rollers, and the workpiece is cut at a plurality of positions arranged in an axial direction simultaneously by feeding the workpiece into the wire row while supplying a coolant to the fixed abrasive wire and reciprocating the fixed abrasive wire in the axial direction, wherein the workpiece is held by a workpiece holding device via a joint member attached to the workpiece,
after the cutting of the workpiece is completed and when the workpiece is pulled out from the wire row, the flow rate of the coolant is set to 180L/min or more, and the moving speed of the fixed abrasive wire in the axial direction is set to 6m/min to 30 m/min.
2. The method of cutting off a workpiece according to claim 1,
the flow rate of the coolant is set to 250L/min or less.
3. A wire saw is provided with:
a metal wire array formed by winding a fixed abrasive wire having abrasive grains fixed to a surface thereof around a plurality of grooved rollers;
a coolant supply mechanism that supplies coolant to the fixed abrasive wire; and
a workpiece feed mechanism that, while holding the workpiece by a workpiece holding device via a joining member attached to the workpiece, plunges and feeds the workpiece into the wire array,
the wire saw cuts the workpiece at a plurality of positions arranged in the axial direction simultaneously by performing plunge feed of the workpiece into the wire row using the workpiece feed mechanism while reciprocating the fixed-abrasive wire in the axial direction,
it is characterized in that the preparation method is characterized in that,
after the cutting of the workpiece is completed and when the workpiece is pulled out from the wire row, the flow rate of the coolant is set to 180L/min or more, and the moving speed of the fixed abrasive wire in the axial direction is set to 6m/min to 30 m/min.
4. The jigsaw of claim 3,
the flow rate of the coolant is 250L/min or less.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2019-092793 | 2019-05-16 | ||
| JP2019092793A JP7020454B2 (en) | 2019-05-16 | 2019-05-16 | Work cutting method and wire saw |
| PCT/JP2020/010008 WO2020230423A1 (en) | 2019-05-16 | 2020-03-09 | Workpiece cutting method and wire saw |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN113710397A true CN113710397A (en) | 2021-11-26 |
| CN113710397B CN113710397B (en) | 2024-07-02 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202080030275.3A Active CN113710397B (en) | 2019-05-16 | 2020-03-09 | Workpiece cutting method and wire saw |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JP7020454B2 (en) |
| KR (1) | KR20220008262A (en) |
| CN (1) | CN113710397B (en) |
| TW (1) | TWI838515B (en) |
| WO (1) | WO2020230423A1 (en) |
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| Publication number | Publication date |
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| KR20220008262A (en) | 2022-01-20 |
| JP7020454B2 (en) | 2022-02-16 |
| CN113710397B (en) | 2024-07-02 |
| WO2020230423A1 (en) | 2020-11-19 |
| JP2020185649A (en) | 2020-11-19 |
| TW202042998A (en) | 2020-12-01 |
| TWI838515B (en) | 2024-04-11 |
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