WO2017119030A1 - Ingot cutting method - Google Patents

Ingot cutting method Download PDF

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Publication number
WO2017119030A1
WO2017119030A1 PCT/JP2016/005113 JP2016005113W WO2017119030A1 WO 2017119030 A1 WO2017119030 A1 WO 2017119030A1 JP 2016005113 W JP2016005113 W JP 2016005113W WO 2017119030 A1 WO2017119030 A1 WO 2017119030A1
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Prior art keywords
wire
ingot
reel
tension
supply
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PCT/JP2016/005113
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French (fr)
Japanese (ja)
Inventor
健司 小林
幸司 北川
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信越半導体株式会社
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Publication of WO2017119030A1 publication Critical patent/WO2017119030A1/en

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B27/00—Other grinding machines or devices
    • B24B27/06—Grinders for cutting-off
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting

Definitions

  • the present invention relates to a method for cutting an ingot.
  • a wire saw is known as a means for cutting a wafer from a silicon ingot, a compound semiconductor ingot, or the like.
  • a wire array is formed by winding a large number of ingot cutting wires around a plurality of grooved rollers, and the wires are driven at high speed in the axial direction.
  • the ingot is cut and fed to the wire row while the slurry is appropriately supplied, so that the ingot is simultaneously cut at the position of each wire.
  • FIG. 3 shows an outline of an example of a general wire saw.
  • the wire saw 101 is mainly cut by a wire 102 for cutting the ingot W, a plurality of grooved rollers 103 around which the wire 102 is wound, a mechanism 104 for adjusting the tension of the wire 102, and the wire saw 102.
  • the wire 102 is fed out from one wire reel 107, passed through a tension applying mechanism 112 including a traverser 108, a pulley 109, and a tension adjusting mechanism 104, and then wound around the grooved roller 103 about 300 to 500 times. It is wound around a wire reel 107 ′ through a tension applying mechanism 112 ′ including one tension adjusting mechanism 104 ′, a pulley 109 ′, and a traverser 108 ′.
  • the grooved roller 103 is a roller in which polyurethane resin is press-fitted around a steel cylinder and grooves are cut on the surface thereof at a substantially constant pitch, and the wound wire 102 is driven by the grooved roller drive motor 110. It can be driven in a reciprocating direction at a predetermined cycle.
  • the wire reels 107 and 107 ′ are rotationally driven by the wire reel drive motors 111 and 111 ′, and are applied to the wire 102 by controlling the speeds of the grooved roller drive motor 110 and the wire reel drive motors 111 and 111 ′, respectively.
  • the tension can also be adjusted.
  • the tension adjusting mechanisms 104 and 104 ′ have a role of adjusting the tension applied to the wire 102 with higher accuracy as disclosed in, for example, Patent Document 2.
  • Patent Document 4 discloses a technique for reducing fluctuations in wire tension by further disposing a mechanism such as a buffer wire reel between a grooved roller and a wire reel. Yes.
  • a mechanism such as a buffer wire reel between a grooved roller and a wire reel.
  • the present invention has been made in view of the above-described problems, and an object thereof is to provide a method for cutting an ingot with a wire saw capable of suppressing the occurrence of wire breakage.
  • a wire array is formed by spirally winding a wire supplied from a supply wire reel and recovered on a recovery wire reel between a plurality of grooved rollers, The supply wire reel and the collection wire reel while the wire is reciprocated by repeating a predetermined length from the supply wire reel and winding the supply wire reel to a length less than the predetermined length.
  • the winding tension of the unwound wire wound around the supply wire reel is A
  • the supply wire reel is Ingot cutting characterized by controlling the value of A / B ⁇ 100 to be 60 or more when the wire winding tension when winding the wire is B, and cutting the ingot into a wafer shape
  • Such an ingot cutting method can suppress the occurrence of wire breakage during cutting without requiring a large-scale device.
  • the maximum traveling speed of the wire can be set to 900 m / min or more.
  • the method for cutting an ingot according to the present invention can reduce the occurrence rate of wire breakage even when the maximum traveling speed of the wire is 900 m / min or more. That is, according to the ingot cutting method of the present invention, even if the traveling speed of the wire is increased in order to improve the cutting efficiency, the wire is hardly broken.
  • the ingot cutting method of the present invention can suppress the occurrence of wire breakage during cutting without requiring a large-scale device.
  • the wire breakage is likely to occur as the traveling speed of the wire increases.
  • the wire breakage suppressing method in the prior art is likely to be a large-scale device, and the effect of suppressing the wire breakage has not been sufficiently obtained.
  • the winding tension of the unwinded wire wound around the supply wire reel is usually a low value (for example, 1/3 or less) with respect to the wire tension at the time of cutting.
  • the wire In the reciprocating movement of the wire, when the supply wire reel is on the winding side of the wire, the wire is usually wound with a cutting tension. Therefore, it has been found that a large tension fluctuation occurs at the moment when the unused wire is fed out when the supply wire reel is changed from the wire winding side to the feeding side. And it became clear that the tension adjusting mechanism 104 (see FIG. 3) could not control the fluctuation of the tension as the wire traveling speed increased, and the disconnection occurred. Based on such knowledge, the present inventors have completed the ingot cutting method of the present invention.
  • the wire saw 1 mainly includes a wire 2 for cutting the ingot W, a plurality of grooved rollers 3 in which the wire 2 is spirally wound, and a wire wound around the grooved roller 3. 2, a tension applying mechanism 12, 12 ′ for applying tension to the wire 2, a feed mechanism 5 for sending the ingot W to be cut downward, a slurry supply mechanism 6 for supplying slurry at the time of cutting, and the like.
  • the wire 2 is supplied from the supply wire reel 7, passed through the tension applying mechanism 12 including the traverser 8, the pulley 9, and the tension adjusting mechanism 4, and then wound around the grooved roller 3 about 300 to 500 times, and then the other
  • the tension adjusting mechanism 4 ', the pulley 9', and the traverser 8 'including the traverser 8' are collected on the collecting wire reel 7 '.
  • the grooved roller 3 is a roller in which polyurethane resin is press-fitted around a steel cylinder and grooves are cut on the surface thereof at a substantially constant pitch.
  • the wound wire 2 is moved by the grooved roller drive motor 10. It can be driven in a reciprocating direction at a predetermined cycle.
  • the supply wire reel 7 and the recovery wire reel 7 ′ are rotationally driven by wire reel drive motors 11 and 11 ′, and control the speeds of the grooved roller drive motor 10 and the wire reel drive motors 11 and 11 ′, respectively.
  • the tension applied to the wire 2 can also be adjusted.
  • the wire 2 supplied from the supply wire reel 7 and recovered on the recovery wire reel 7 ′ is spirally wound between the plurality of grooved rollers 3 to form a wire row 13.
  • the wire 2 is reciprocated by repeatedly feeding the wire 2 from the supply wire reel 7 to a predetermined length and winding the supply wire reel 7 to a length less than the predetermined length.
  • tension is applied to the wire 2 by the tension applying mechanisms 12 and 12 ′ disposed on the supply wire reel 7 side and the recovery wire reel 7 ′ side, respectively.
  • the ingot W is cut into a wafer shape by reciprocating the wire 2 and pressing the ingot W against the wire row 13 while applying tension to the wire 2.
  • the ingot W can be cut while supplying the slurry from the slurry supply mechanism 6.
  • A is the winding tension of the unwound wire wound around the supply wire reel 7
  • B is the wire winding tension when the supply wire reel 7 winds the wire.
  • the upper limit value of A / B ⁇ 100 is preferably 90.
  • the maximum traveling speed of the wire 2 can be set to 900 m / min or more.
  • the cutting efficiency of the ingot can be improved.
  • a higher traveling speed is preferable from the viewpoint of cutting efficiency, but as an upper limit of the maximum traveling speed, for example, 1500 m / min is sufficient for cutting using slurry (free abrasive grains).
  • Example 2 Using a wire saw 1 as shown in FIG. 1, a silicon ingot having a diameter of 300 mm was cut by the ingot cutting method of the present invention. That is, in the cutting of the silicon ingot, the winding tension A of the unwinded wire wound around the supply wire reel and the wire winding tension B when the supply wire reel winds the wire are A / B ⁇ 100 ⁇ 60. It was carried out to satisfy.
  • the silicon ingot was cut a plurality of times while changing the cutting conditions within the range of Table 1 below with the value of A or the maximum traveling speed of the wire.
  • the wire winding tension B when the supply wire reel winds the wire was fixed at 23 (N).
  • the wire tension in the grooved roller 3 in FIG. 1 when the ingot was cut was the same value as B.
  • Table 1 shows a summary of the cutting conditions in the examples.
  • the silicon ingot was cut in the same manner as in the example except that the value of A was changed so that A / B ⁇ 100 ⁇ 60.
  • the silicon ingot was cut a plurality of times, and each time, the value of A or the maximum traveling speed of the wire was changed within the range shown in Table 2 below.
  • Table 2 summarizes the cutting conditions in the comparative example.
  • Table 3 and FIG. 2 show the results of summarizing the occurrence rate (disconnection rate) of the wire breakage for each of the values of A / B ⁇ 100 and the maximum traveling speed of the wire in cutting the ingots of the above examples and comparative examples. .
  • the disconnection rate is suppressed to 0% or extremely low regardless of the wire traveling speed. It was confirmed that In particular, when the maximum traveling speed of the wire is as high as 900 m / min or more, in the comparative example, the higher the maximum traveling speed of the wire, the higher the probability of disconnection. However, in the example of the present invention, it was confirmed that the wire breakage hardly occurred even at such a high speed, and the breakage rate was suppressed to be considerably lower than that of the comparative example. Thus, it was confirmed that the present invention is particularly effective when the maximum traveling speed of the wire is high.
  • the present invention is not limited to the above embodiment.
  • the above-described embodiment is an exemplification, and the present invention has any configuration that has substantially the same configuration as the technical idea described in the claims of the present invention and that exhibits the same effects. Are included in the technical scope.

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)

Abstract

The present invention is an ingot cutting method wherein wire rows are formed by spirally wrapping a wire between a plurality of grooved rollers, and, while the wire is moved back and forth by repeating the unreeling of a predetermined length of the wire from a supply wire reel and the winding of a length less than the predetermined length of the wire onto the supply wire reel, tension is applied to the wire by tension applying mechanisms disposed on the supply wire reel and a recovery wire reel, and the ingot is pressed against the wire rows and thus cut into wafers. In this ingot cutting method, the ingot is cut into wafers by performing control such that the value calculated from A/B × 100 becomes 60 or more, where A represents the winding tension of the wire that is wound on the supply wire reel and is not unreeled, and B represents the winding tension when winding the wire on the supply wire reel. Thus, the provided ingot cutting method using a wire saw is capable of suppressing a break in the wire.

Description

インゴットの切断方法Ingot cutting method
　本発明は、インゴットの切断方法に関する。 The present invention relates to a method for cutting an ingot.
　従来、シリコンインゴットや化合物半導体インゴットなどからウェーハを切り出す手段として、ワイヤソーが知られている。特許文献１に開示されているように、ワイヤソーでは、複数の溝付きローラの周囲にインゴットの切断用のワイヤが多数巻き掛けられることによりワイヤ列が形成されており、ワイヤが軸方向に高速駆動され、かつ、スラリが適宜供給されながら、ワイヤ列に対してインゴットが切り込み送りされることにより、インゴットが各ワイヤの位置で同時に切断されるようにしたものである。 Conventionally, a wire saw is known as a means for cutting a wafer from a silicon ingot, a compound semiconductor ingot, or the like. As disclosed in Patent Document 1, in a wire saw, a wire array is formed by winding a large number of ingot cutting wires around a plurality of grooved rollers, and the wires are driven at high speed in the axial direction. In addition, the ingot is cut and fed to the wire row while the slurry is appropriately supplied, so that the ingot is simultaneously cut at the position of each wire.
　ここで、図３に、一般的なワイヤソーの一例の概略を示す。図３に示すように、このワイヤソー１０１は、主に、インゴットＷを切断するためのワイヤ１０２、ワイヤ１０２を巻掛けた複数の溝付きローラ１０３、ワイヤ１０２の張力を調整する機構１０４、切断されるインゴットＷを下方へ送り出す機構１０５、切断時にスラリを供給する機構１０６で構成されている。 Here, FIG. 3 shows an outline of an example of a general wire saw. As shown in FIG. 3, the wire saw 101 is mainly cut by a wire 102 for cutting the ingot W, a plurality of grooved rollers 103 around which the wire 102 is wound, a mechanism 104 for adjusting the tension of the wire 102, and the wire saw 102. A mechanism 105 for feeding the ingot W downward, and a mechanism 106 for supplying slurry at the time of cutting.
　ワイヤ１０２は、一方のワイヤリール１０７から繰り出され、トラバーサ１０８、プーリー１０９、及び張力調整機構１０４を含む張力付与機構１１２を経て、溝付きローラ１０３に３００～５００回程度巻掛けられた後、もう一方の張力調整機構１０４’、プーリー１０９’、トラバーサ１０８’を含む張力付与機構１１２’を経てワイヤリール１０７’に巻き取られている。 The wire 102 is fed out from one wire reel 107, passed through a tension applying mechanism 112 including a traverser 108, a pulley 109, and a tension adjusting mechanism 104, and then wound around the grooved roller 103 about 300 to 500 times. It is wound around a wire reel 107 ′ through a tension applying mechanism 112 ′ including one tension adjusting mechanism 104 ′, a pulley 109 ′, and a traverser 108 ′.
　また、溝付きローラ１０３は鉄鋼製円筒の周囲にポリウレタン樹脂を圧入し、その表面に略一定のピッチで溝を切ったローラであり、巻掛けられたワイヤ１０２が溝付きローラ駆動モーター１１０によって、予め定められた周期で往復方向に駆動できるようになっている。 Further, the grooved roller 103 is a roller in which polyurethane resin is press-fitted around a steel cylinder and grooves are cut on the surface thereof at a substantially constant pitch, and the wound wire 102 is driven by the grooved roller drive motor 110. It can be driven in a reciprocating direction at a predetermined cycle.
　また、ワイヤリール１０７、１０７’はワイヤリール駆動モーター１１１、１１１’によって回転駆動され、溝付きローラ駆動モーター１１０とワイヤリール駆動モーター１１１，１１１’の速度をそれぞれ制御することにより、ワイヤ１０２にかかる張力を調整することもできる。 Further, the wire reels 107 and 107 ′ are rotationally driven by the wire reel drive motors 111 and 111 ′, and are applied to the wire 102 by controlling the speeds of the grooved roller drive motor 110 and the wire reel drive motors 111 and 111 ′, respectively. The tension can also be adjusted.
　なお、張力調整機構１０４、１０４’は、例えば、特許文献２に開示されているように、ワイヤ１０２にかかる張力を更に精度よく調整する役割を有する。 The tension adjusting mechanisms 104 and 104 ′ have a role of adjusting the tension applied to the wire 102 with higher accuracy as disclosed in, for example, Patent Document 2.
　このようなワイヤソー１０１を用い、ワイヤ１０２にワイヤ張力付与機構１０４を用いて適当な張力をかけて、駆動用モーター１１０により、ワイヤ１０２を往復方向に走行させながらインゴットをスライスする。 Using such a wire saw 101, an appropriate tension is applied to the wire 102 using the wire tension applying mechanism 104, and the drive motor 110 slices the ingot while the wire 102 travels in the reciprocating direction.
　また、特許文献３に開示されているように、上述のようなワイヤソー１０１を用いる場合、駆動用モーター１１０によって動作するワイヤ１０２の走行速度を増加させると、切断能力が向上する。即ち、効率よくインゴットの切断を行うことができるため、ウェーハの生産性を向上することができる。 Also, as disclosed in Patent Document 3, when the wire saw 101 as described above is used, the cutting ability is improved by increasing the traveling speed of the wire 102 operated by the driving motor 110. That is, since the ingot can be efficiently cut, the productivity of the wafer can be improved.
特開平９－２６２８２６号公報Japanese Patent Laid-Open No. 9-262826 特開平９－９４７５５号公報Japanese Patent Laid-Open No. 9-94755 特開２０００－１１７７２６号公報JP 2000-117726 A 特開２０１３－２７９５８号公報JP 2013-27958 A
　しかし、ワイヤの走行速度を増加させると、溝付きローラ１０３、ワイヤリール１０７などを高速回転させる必要が有り、ワイヤの張力変動が大きくなる。そのため、ワイヤの断線が発生しやすくなる。 However, when the traveling speed of the wire is increased, it is necessary to rotate the grooved roller 103, the wire reel 107 and the like at high speed, and the tension fluctuation of the wire becomes large. Therefore, the wire breakage is likely to occur.
　ワイヤの断線が発生すると、インゴットから切り出されたウェーハの表面に段差が生じたり、ウェーハの表面のナノトポグラフィーが悪化したりして、製品が不良となるという問題がある。よって、ワイヤの断線の発生率を低減することが重要な課題である。 When the wire breakage occurs, there is a problem that a step is generated on the surface of the wafer cut out from the ingot, or the nanotopography on the surface of the wafer is deteriorated, resulting in a defective product. Therefore, it is an important issue to reduce the occurrence rate of wire breakage.
　これに対して、例えば、特許文献４には、溝付きローラとワイヤリールとの間に、更に、バッファワイヤリール等の機構を配設して、ワイヤの張力変動を低減する技術が開示されている。しかしながら、この方法では、装置が大掛かりとなり、また、断線の抑制効果が十分に得られなかった。 On the other hand, for example, Patent Document 4 discloses a technique for reducing fluctuations in wire tension by further disposing a mechanism such as a buffer wire reel between a grooved roller and a wire reel. Yes. However, with this method, the apparatus becomes large and the effect of suppressing disconnection cannot be obtained sufficiently.
　本発明は前述のような問題に鑑みてなされたもので、ワイヤの断線の発生を抑制することが可能なワイヤソーによるインゴットの切断方法を提供することを目的とする。 The present invention has been made in view of the above-described problems, and an object thereof is to provide a method for cutting an ingot with a wire saw capable of suppressing the occurrence of wire breakage.
　上記目的を達成するために、本発明は、供給ワイヤリールから供給され、回収ワイヤリールに回収されるワイヤを、複数の溝付きローラ間に螺旋状に巻回してワイヤ列を形成し、前記ワイヤを前記供給ワイヤリールから所定の長さ繰り出し、前記供給ワイヤリールに前記所定の長さよりも少ない長さ巻き取ることを繰り返して、前記ワイヤを往復走行させながら、前記供給ワイヤリール側と、前記回収ワイヤリール側とにそれぞれ配置された張力付与機構により前記ワイヤに張力を付与しつつ、インゴットを前記ワイヤ列に押し当てることによって、前記インゴットをウェーハ状に切断するインゴットの切断方法であって、前記供給ワイヤリールに巻き付けられた、繰り出されていないワイヤの巻き張力をＡとし、前記供給ワイヤリールが前記ワイヤを巻き取る時のワイヤ巻取り張力をＢとした時に、Ａ／Ｂ×１００の値が６０以上となるよう制御して、前記インゴットをウェーハ状に切断することを特徴とするインゴットの切断方法を提供する。 To achieve the above object, according to the present invention, a wire array is formed by spirally winding a wire supplied from a supply wire reel and recovered on a recovery wire reel between a plurality of grooved rollers, The supply wire reel and the collection wire reel while the wire is reciprocated by repeating a predetermined length from the supply wire reel and winding the supply wire reel to a length less than the predetermined length. An ingot cutting method for cutting the ingot into a wafer by pressing an ingot against the wire row while applying tension to the wire by a tension applying mechanism arranged on each of the wire reels, The winding tension of the unwound wire wound around the supply wire reel is A, and the supply wire reel is Ingot cutting characterized by controlling the value of A / B × 100 to be 60 or more when the wire winding tension when winding the wire is B, and cutting the ingot into a wafer shape Provide a method.
　このようなインゴットの切断方法であれば、大掛かりな装置も必要なしに、切断中におけるワイヤの断線の発生を抑制することが可能である。 Such an ingot cutting method can suppress the occurrence of wire breakage during cutting without requiring a large-scale device.
　このとき、前記ワイヤの最大走行速度を９００ｍ／ｍｉｎ以上とすることができる。 At this time, the maximum traveling speed of the wire can be set to 900 m / min or more.
　本発明のインゴットの切断方法であれば、ワイヤの最大走行速度を９００ｍ／ｍｉｎ以上とした場合であっても、ワイヤの断線の発生率を小さく抑制することができる。すなわち、本発明のインゴットの切断方法であれば、切断能率を向上させるためにワイヤの走行速度を大きくしたとしても、ワイヤの断線が発生し難い。 The method for cutting an ingot according to the present invention can reduce the occurrence rate of wire breakage even when the maximum traveling speed of the wire is 900 m / min or more. That is, according to the ingot cutting method of the present invention, even if the traveling speed of the wire is increased in order to improve the cutting efficiency, the wire is hardly broken.
　本発明のインゴットの切断方法であれば、大掛かりな装置も必要なしに、切断中におけるワイヤの断線の発生を抑制することが可能である。 The ingot cutting method of the present invention can suppress the occurrence of wire breakage during cutting without requiring a large-scale device.
本発明のインゴットの切断方法に用いることができるワイヤソーの一例を示す概略図である。It is the schematic which shows an example of the wire saw which can be used for the cutting method of the ingot of this invention. 実施例、比較例におけるワイヤの断線の発生率をまとめたグラフである。It is the graph which put together the incidence rate of the break of the wire in an Example and a comparative example. 一般的なワイヤソーの一例を示す概略図である。It is the schematic which shows an example of a common wire saw.
　以下、本発明について実施の形態を説明するが、本発明はこれに限定されるものではない。 Hereinafter, embodiments of the present invention will be described, but the present invention is not limited thereto.
　上記のように、従来の方法では、ワイヤの走行速度の高速化に伴い、ワイヤの断線が発生し易くなってきていた。また、従来技術におけるワイヤの断線の抑制方法は、装置が大掛かりになり易いうえに、断線の抑制効果が十分に得られなかった。 As described above, in the conventional method, the wire breakage is likely to occur as the traveling speed of the wire increases. Moreover, the wire breakage suppressing method in the prior art is likely to be a large-scale device, and the effect of suppressing the wire breakage has not been sufficiently obtained.
　そこで、本発明者らはこのような問題を解決すべく、ワイヤ断線が発生する原因について調査を行った。その結果、特に、供給ワイヤリールから未使用ワイヤ（供給ワイヤリールに巻き付けられた、繰り出されていないワイヤ）が繰り出されるタイミングで大きな張力変動があり、この張力変動が、ワイヤの断線を招いていることが分かった。 Therefore, the present inventors have investigated the cause of wire breakage in order to solve such problems. As a result, in particular, there is a large tension fluctuation at the timing when an unused wire (a wire that has been wound around the supply wire reel and is not fed) is fed from the supply wire reel, and this tension fluctuation causes a break in the wire. I understood that.
　供給ワイヤリールに巻き付けられた、繰り出されていないワイヤの巻き張力は、通常、切断時のワイヤの張力に対して低い値（例えば１／３以下）となっている。ワイヤの往復走行において、供給ワイヤリールがワイヤの巻取り側になった場合に、通常は、切断張力でワイヤが巻き取られることになる。そのため、供給ワイヤリールがワイヤの巻取側から繰り出し側になった場合の未使用ワイヤが繰り出される瞬間には、大きな張力変動が生じることが判明した。そして、ワイヤ走行速度の増加に伴い、張力調整機構１０４（図３参照）がこの張力変動を制御できなくなり、断線が発生してしまうことが判明した。このような知見に基づき、本発明者等は本発明のインゴットの切断方法を完成させた。 The winding tension of the unwinded wire wound around the supply wire reel is usually a low value (for example, 1/3 or less) with respect to the wire tension at the time of cutting. In the reciprocating movement of the wire, when the supply wire reel is on the winding side of the wire, the wire is usually wound with a cutting tension. Therefore, it has been found that a large tension fluctuation occurs at the moment when the unused wire is fed out when the supply wire reel is changed from the wire winding side to the feeding side. And it became clear that the tension adjusting mechanism 104 (see FIG. 3) could not control the fluctuation of the tension as the wire traveling speed increased, and the disconnection occurred. Based on such knowledge, the present inventors have completed the ingot cutting method of the present invention.
　まず、本発明のインゴットの切断方法で使用することができる、ワイヤソーの一例について説明する。 First, an example of a wire saw that can be used in the ingot cutting method of the present invention will be described.
　図１に示すように、ワイヤソー１は、主に、インゴットＷを切断するためのワイヤ２、ワイヤ２を螺旋状に巻回した複数の溝付きローラ３、溝付きローラ３に巻回されたワイヤ２から成るワイヤ列１３、ワイヤ２に張力付与する張力付与機構１２、１２’、切断するインゴットＷを下方へ送り出す送り機構５、切断時にスラリを供給するスラリ供給機構６などで構成されている。 As shown in FIG. 1, the wire saw 1 mainly includes a wire 2 for cutting the ingot W, a plurality of grooved rollers 3 in which the wire 2 is spirally wound, and a wire wound around the grooved roller 3. 2, a tension applying mechanism 12, 12 ′ for applying tension to the wire 2, a feed mechanism 5 for sending the ingot W to be cut downward, a slurry supply mechanism 6 for supplying slurry at the time of cutting, and the like.
　ワイヤ２は、供給ワイヤリール７から供給され、トラバーサ８、プーリー９、及び張力調整機構４を含む張力付与機構１２を経て、溝付きローラ３に３００～５００回程度巻掛けられた後、もう一方の張力調整機構４’、プーリー９’、トラバーサ８’を含む張力付与機構１２’を経て回収ワイヤリール７’に回収される。 The wire 2 is supplied from the supply wire reel 7, passed through the tension applying mechanism 12 including the traverser 8, the pulley 9, and the tension adjusting mechanism 4, and then wound around the grooved roller 3 about 300 to 500 times, and then the other The tension adjusting mechanism 4 ', the pulley 9', and the traverser 8 'including the traverser 8' are collected on the collecting wire reel 7 '.
　また、溝付きローラ３は鉄鋼製円筒の周囲にポリウレタン樹脂を圧入し、その表面に略一定のピッチで溝を切ったローラであり、巻掛けられたワイヤ２が溝付きローラ駆動モーター１０によって、予め定められた周期で往復方向に駆動できるようになっている。 The grooved roller 3 is a roller in which polyurethane resin is press-fitted around a steel cylinder and grooves are cut on the surface thereof at a substantially constant pitch. The wound wire 2 is moved by the grooved roller drive motor 10. It can be driven in a reciprocating direction at a predetermined cycle.
　また、供給ワイヤリール７と回収ワイヤリール７’は、ワイヤリール駆動モーター１１、１１’によって回転駆動され、溝付きローラ駆動モーター１０とワイヤリール駆動モーター１１、１１’の速度をそれぞれ制御することにより、ワイヤ２にかかる張力を調整することもできる。 Further, the supply wire reel 7 and the recovery wire reel 7 ′ are rotationally driven by wire reel drive motors 11 and 11 ′, and control the speeds of the grooved roller drive motor 10 and the wire reel drive motors 11 and 11 ′, respectively. The tension applied to the wire 2 can also be adjusted.
　次に、このワイヤソー１を用いた場合の本発明のインゴットの切断方法について説明する。 Next, the method for cutting an ingot according to the present invention when this wire saw 1 is used will be described.
　まず、供給ワイヤリール７から供給され、回収ワイヤリール７’に回収されるワイヤ２を、複数の溝付きローラ３間に螺旋状に巻回してワイヤ列１３を形成する。そして、ワイヤ２を供給ワイヤリール７から所定の長さ繰り出し、供給ワイヤリール７に所定の長さよりも少ない長さ巻き取ることを繰り返して、ワイヤ２を往復走行させる。このとき、供給ワイヤリール７側と、回収ワイヤリール７’側とにそれぞれ配置された張力付与機構１２、１２’によりワイヤ２に張力を付与する。そして、ワイヤ２を往復走行させ、かつ、ワイヤ２に張力を付与しながら、インゴットＷをワイヤ列１３に押し当てることによって、インゴットＷをウェーハ状に切断する。このとき、スラリ供給機構６からスラリを供給しながらインゴットＷを切断することができる。 First, the wire 2 supplied from the supply wire reel 7 and recovered on the recovery wire reel 7 ′ is spirally wound between the plurality of grooved rollers 3 to form a wire row 13. Then, the wire 2 is reciprocated by repeatedly feeding the wire 2 from the supply wire reel 7 to a predetermined length and winding the supply wire reel 7 to a length less than the predetermined length. At this time, tension is applied to the wire 2 by the tension applying mechanisms 12 and 12 ′ disposed on the supply wire reel 7 side and the recovery wire reel 7 ′ side, respectively. Then, the ingot W is cut into a wafer shape by reciprocating the wire 2 and pressing the ingot W against the wire row 13 while applying tension to the wire 2. At this time, the ingot W can be cut while supplying the slurry from the slurry supply mechanism 6.
　ここで、本発明のインゴットの切断方法では、供給ワイヤリール７に巻き付けられた、繰り出されていないワイヤの巻き張力をＡとし、供給ワイヤリール７がワイヤを巻き取る時のワイヤ巻取り張力をＢとした時に、Ａ／Ｂ×１００の値が６０以上となるよう制御して、インゴットＷをウェーハ状に切断する。 Here, in the ingot cutting method of the present invention, A is the winding tension of the unwound wire wound around the supply wire reel 7, and B is the wire winding tension when the supply wire reel 7 winds the wire. Then, the ingot W is cut into a wafer shape by controlling so that the value of A / B × 100 is 60 or more.
　このようにすれば、ワイヤ２の往復走行において、供給ワイヤリール７がワイヤ２の繰り出し側になった場合のワイヤ２が繰り出される瞬間における張力変動を小さくすることが可能である。よって、本発明のインゴットの切断方法であれば、この張力変動を小さく抑えることができるため、ワイヤの断線の発生を抑制することができる。しかも装置を大がかりなものとする必要もない。また、Ａ／Ｂ×１００の上限値は、９０とすることが好ましい。 In this way, in the reciprocating travel of the wire 2, it is possible to reduce the tension fluctuation at the moment when the wire 2 is fed when the supply wire reel 7 is on the feeding side of the wire 2. Therefore, if it is the ingot cutting method of this invention, since this tension fluctuation | variation can be restrained small, generation | occurrence | production of the disconnection of a wire can be suppressed. Moreover, it is not necessary to make the device large. The upper limit value of A / B × 100 is preferably 90.
　またこのとき、本発明のインゴットの切断方法では、ワイヤ２の最大走行速度を９００ｍ／ｍｉｎ以上とすることができる。ワイヤの最大走行速度を、このように大きく設定することで、インゴットの切断効率を向上させることができる。また、本発明のインゴットの切断方法であれば、このようにワイヤを高速走行させる場合であっても、ワイヤの断線が起き難い。なお、走行速度が速いほど切断効率の面から好ましいが、最大走行速度の上限として、例えば、スラリー（遊離砥粒）を用いた切断であれば１５００ｍ／ｍｉｎで十分である。 At this time, in the ingot cutting method of the present invention, the maximum traveling speed of the wire 2 can be set to 900 m / min or more. By setting the maximum traveling speed of the wire in this way, the cutting efficiency of the ingot can be improved. Further, with the ingot cutting method of the present invention, even when the wire is run at a high speed as described above, the wire is hardly broken. A higher traveling speed is preferable from the viewpoint of cutting efficiency, but as an upper limit of the maximum traveling speed, for example, 1500 m / min is sufficient for cutting using slurry (free abrasive grains).
　以下、本発明の実施例及び比較例を示して本発明をより具体的に説明するが、本発明はこれら実施例に限定されるものではない。 Hereinafter, the present invention will be described more specifically with reference to examples and comparative examples of the present invention, but the present invention is not limited to these examples.
（実施例）
　図１に示すような、ワイヤソー１を用いて、本発明のインゴットの切断方法により、直径３００ｍｍのシリコンインゴットの切断を行った。すなわち、シリコンインゴットの切断は、供給ワイヤリールに巻き付けられた、繰り出されていないワイヤの巻き張力Ａと供給ワイヤリールがワイヤを巻き取る時のワイヤ巻取り張力Ｂが、Ａ／Ｂ×１００≧６０を満たすように実施した。 (Example)
Using a wire saw 1 as shown in FIG. 1, a silicon ingot having a diameter of 300 mm was cut by the ingot cutting method of the present invention. That is, in the cutting of the silicon ingot, the winding tension A of the unwinded wire wound around the supply wire reel and the wire winding tension B when the supply wire reel winds the wire are A / B × 100 ≧ 60. It was carried out to satisfy.
　また、シリコンインゴットの切断は、Ａの値又はワイヤの最大走行速度を下記の表１の範囲で、切断条件を変化させて複数回実施した。また、供給ワイヤリールがワイヤを巻き取る時のワイヤ巻取り張力Ｂは２３（Ｎ）に固定した。なお、インゴットの切断時の、図１の溝付きローラ３でのワイヤ張力は、Ｂと同じ値であった。 In addition, the silicon ingot was cut a plurality of times while changing the cutting conditions within the range of Table 1 below with the value of A or the maximum traveling speed of the wire. Further, the wire winding tension B when the supply wire reel winds the wire was fixed at 23 (N). The wire tension in the grooved roller 3 in FIG. 1 when the ingot was cut was the same value as B.
　表１に、実施例における切断条件をまとめたものを示す。 Table 1 shows a summary of the cutting conditions in the examples.
Figure JPOXMLDOC01-appb-T000001
Figure JPOXMLDOC01-appb-T000001
（比較例）
　Ａ／Ｂ×１００＜６０となるように、Ａの値を変更したこと以外、実施例と同様にシリコンインゴットの切断を行った。シリコンインゴットの切断は複数回行い、各回でＡの値又はワイヤの最大走行速度を下記の表２の範囲で変化させて切断を実施した。 (Comparative example)
The silicon ingot was cut in the same manner as in the example except that the value of A was changed so that A / B × 100 <60. The silicon ingot was cut a plurality of times, and each time, the value of A or the maximum traveling speed of the wire was changed within the range shown in Table 2 below.
　表２に、比較例における切断条件をまとめたものを示す。 Table 2 summarizes the cutting conditions in the comparative example.
Figure JPOXMLDOC01-appb-T000002
Figure JPOXMLDOC01-appb-T000002
　上記の実施例及び比較例のインゴットの切断におけるワイヤの断線の発生率（断線率）を、Ａ／Ｂ×１００の値及びワイヤの最大走行速度ごとにまとめた結果を表３及び図２に示す。 Table 3 and FIG. 2 show the results of summarizing the occurrence rate (disconnection rate) of the wire breakage for each of the values of A / B × 100 and the maximum traveling speed of the wire in cutting the ingots of the above examples and comparative examples. .
Figure JPOXMLDOC01-appb-T000003
Figure JPOXMLDOC01-appb-T000003
　表３及び図２から分かるように、実施例のようにＡ／Ｂ×１００の値を６０以上に制御すれば、ワイヤの走行速度がどのような速度でも、断線率を０％又は極めて低く抑えられることが確認できた。特に、ワイヤの最大走行速度が９００ｍ／ｍｉｎ以上と、高速になった場合、比較例では、ワイヤの最大走行速度が高速になるほど高い確率で断線が生じていた。しかし、本発明の実施例では、そのように高速になった場合でも、ワイヤの断線がほとんど起きず、比較例に比べて断線率をかなり低く抑えられることが確認できた。このように、ワイヤの最大走行速度が高速の場合、本発明は特に有効であることが確認できた。 As can be seen from Table 3 and FIG. 2, if the value of A / B × 100 is controlled to 60 or more as in the embodiment, the disconnection rate is suppressed to 0% or extremely low regardless of the wire traveling speed. It was confirmed that In particular, when the maximum traveling speed of the wire is as high as 900 m / min or more, in the comparative example, the higher the maximum traveling speed of the wire, the higher the probability of disconnection. However, in the example of the present invention, it was confirmed that the wire breakage hardly occurred even at such a high speed, and the breakage rate was suppressed to be considerably lower than that of the comparative example. Thus, it was confirmed that the present invention is particularly effective when the maximum traveling speed of the wire is high.
　なお、本発明は、上記実施形態に限定されるものではない。上記実施形態は例示であり、本発明の特許請求の範囲に記載された技術的思想と実質的に同一な構成を有し、同様な作用効果を奏するものは、いかなるものであっても本発明の技術的範囲に包含される。 Note that the present invention is not limited to the above embodiment. The above-described embodiment is an exemplification, and the present invention has any configuration that has substantially the same configuration as the technical idea described in the claims of the present invention and that exhibits the same effects. Are included in the technical scope.

Claims (2)

  1. 　供給ワイヤリールから供給され、回収ワイヤリールに回収されるワイヤを、複数の溝付きローラ間に螺旋状に巻回してワイヤ列を形成し、前記ワイヤを前記供給ワイヤリールから所定の長さ繰り出し、前記供給ワイヤリールに前記所定の長さよりも少ない長さ巻き取ることを繰り返して、前記ワイヤを往復走行させながら、前記供給ワイヤリール側と、前記回収ワイヤリール側とにそれぞれ配置された張力付与機構により前記ワイヤに張力を付与しつつ、インゴットを前記ワイヤ列に押し当てることによって、前記インゴットをウェーハ状に切断するインゴットの切断方法であって、
    　前記供給ワイヤリールに巻き付けられた、繰り出されていないワイヤの巻き張力をＡとし、前記供給ワイヤリールが前記ワイヤを巻き取る時のワイヤ巻取り張力をＢとした時に、Ａ／Ｂ×１００の値が６０以上となるよう制御して、前記インゴットをウェーハ状に切断することを特徴とするインゴットの切断方法。     The wire supplied from the supply wire reel and collected on the collection wire reel is spirally wound between a plurality of grooved rollers to form a wire row, and the wire is fed out from the supply wire reel by a predetermined length, Tension applying mechanisms respectively arranged on the supply wire reel side and the recovery wire reel side while reciprocating the wire by repeatedly winding the supply wire reel less than the predetermined length. The ingot cutting method of cutting the ingot into a wafer by pressing the ingot against the wire row while applying tension to the wire by:
    The value of A / B × 100, where A is the winding tension of the unwinded wire wound around the supply wire reel, and B is the wire winding tension when the supply wire reel winds the wire. Is controlled to be 60 or more, and the ingot is cut into a wafer shape.
  2. 　前記ワイヤの最大走行速度を９００ｍ／ｍｉｎ以上とすることを特徴とする請求項１に記載のインゴットの切断方法。 The method for cutting an ingot according to claim 1, wherein the maximum traveling speed of the wire is set to 900 m / min or more.
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