CN113707425A - Planar winding unit, manufacturing method thereof, planar winding and planar electronic device - Google Patents

Planar winding unit, manufacturing method thereof, planar winding and planar electronic device Download PDF

Info

Publication number
CN113707425A
CN113707425A CN202110758618.4A CN202110758618A CN113707425A CN 113707425 A CN113707425 A CN 113707425A CN 202110758618 A CN202110758618 A CN 202110758618A CN 113707425 A CN113707425 A CN 113707425A
Authority
CN
China
Prior art keywords
winding
planar
area
connection point
winding area
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
CN202110758618.4A
Other languages
Chinese (zh)
Inventor
娄建勇
张旭东
袁凯
姚炜
尹玮
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Wuxi Shenwanghe Electronic Technology Co ltd
Original Assignee
Wuxi Shenwanghe Electronic Technology Co ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Wuxi Shenwanghe Electronic Technology Co ltd filed Critical Wuxi Shenwanghe Electronic Technology Co ltd
Priority to CN202110758618.4A priority Critical patent/CN113707425A/en
Publication of CN113707425A publication Critical patent/CN113707425A/en
Withdrawn legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/28—Coils; Windings; Conductive connections
    • H01F27/2804—Printed windings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type 
    • H01F17/0006—Printed inductances
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/28—Coils; Windings; Conductive connections
    • H01F27/32—Insulating of coils, windings, or parts thereof
    • H01F27/323—Insulation between winding turns, between winding layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
    • H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
    • H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
    • H01F41/041—Printed circuit coils

Abstract

The invention discloses a planar winding unit and a manufacturing method thereof, a planar winding and a planar electronic device, wherein the planar winding unit comprises an insulating base material and a patterned conducting layer, the conducting layer is arranged on the surface of the insulating base material, and the conducting layer comprises a winding area and a first non-winding area which are not mutually conducted, wherein: the winding area forms a winding by the patterned conductive layer; the first non-winding area is located on the periphery of the winding area and insulated from the winding area, and the first non-winding area is grounded through a first grounding connection point to form a first shielding layer. The plane winding provided by the invention fully utilizes the non-winding area of the conducting layer to form the shielding layer by grounding, thereby shielding the winding, reducing the coupling capacitance and improving the working effect of the plane winding.

Description

Planar winding unit, manufacturing method thereof, planar winding and planar electronic device
Technical Field
The invention relates to the technical field of circuit chips, in particular to a planar winding unit, a manufacturing method of the planar winding unit, a planar winding and a planar electronic device.
Background
In the field of chip transformers, planar transformers are susceptible to large coupling capacitances between the primary and secondary sides due to the large surface area and small interplanar distances associated with planar structures, and capacitive coupling allows current to flow between the primary and secondary sides.
Meanwhile, because the transformer has a function of converting voltage, the current passing through the corresponding transformer coil is generally large, especially for a high-power transformer, in order to enable the copper foil to meet the current requirement, and simultaneously, in order to reduce the product volume as much as possible, thicker copper foil is generally used as much as possible, and in order to make up the offset left after the copper foil is patterned, epoxy glue materials with appropriate thickness are needed to be used, otherwise, the planar transformers with the multilayer structure are difficult to be tightly adhered together.
Disclosure of Invention
Aiming at the defects of the prior art, the invention aims to provide a planar winding unit, a manufacturing method thereof, a planar winding and a planar electronic device, wherein a blank area without a coil on the planar winding is grounded to form a shielding layer, so that the coupling capacitance between a primary side and a secondary side is reduced, and the problem that the total number of layers and the total thickness are increased by independently arranging the shielding layer is solved.
In a first aspect, the present invention provides a planar winding unit comprising an insulating substrate and a patterned conductive layer disposed on a surface of the insulating substrate, the conductive layer comprising a winding region and a first non-winding region, wherein:
a winding region forming a winding from the patterned conductive layer;
and the first non-winding area is positioned at the periphery of the winding area and is insulated from the winding area, and the first non-winding area is grounded through a first grounding connection point to form a first shielding layer.
The first ground connection point is located at an edge of the insulating substrate.
The conducting layer further comprises a second non-winding area, the second non-winding area is surrounded by the winding area and is insulated from the winding area, and the second non-winding area is grounded through a second grounding connection point to form a second shielding layer.
The second ground connection point is located on the edge of the insulating substrate near the core hole.
And through holes penetrating through the surfaces of the two sides of the insulating base material are arranged on the first grounding connection point and the second grounding connection point.
The conductive layer is configured to be disposed on one side surface or both side surfaces of the insulating substrate; when the conducting layers are arranged on the two side surfaces of the insulating base material, the positions of the first ground connection point and the second ground connection point on the two side surfaces are the same and are conducted through the through hole.
The conducting layer is made of copper foil or aluminum foil.
The winding area comprises a primary winding area and/or a secondary winding area, wherein the primary winding area is provided with a primary winding and a driving winding which are patterned, and the secondary winding area is provided with a secondary winding and an auxiliary winding which are patterned.
In a second aspect, the invention provides a planar winding, comprising the planar winding unit.
And an insulating layer is arranged between the planar winding units.
The insulating layer is configured as an insulating glue.
The insulating glue is made of epoxy glue.
In a third aspect, the present invention provides a planar electronic device comprising said planar winding.
The planar electronic device is an inductor, capacitor or other electronic device using windings.
In a fourth aspect, the present invention provides a method for manufacturing the planar winding unit, including:
providing an insulating substrate;
forming a patterned conductive layer on the surface of the insulating substrate;
the patterned conductive layer has a winding region and a non-winding region insulated from each other;
and forming the shielding layer on the non-winding area through grounding design or grounding treatment.
The method for forming the patterned conductive layer comprises etching and screen printing.
The implementation of the invention has the following beneficial effects:
according to the planar winding unit and the planar winding, the non-winding area of the conducting layer is fully utilized and grounded to form the shielding layer, so that the winding can be shielded, the coupling capacitance is reduced, the working effect of the planar winding is improved, the conducting layer is fully utilized, the conducting copper foil or aluminum foil in the non-winding area does not need to be processed, the section difference between the conducting layer and the insulating base material is filled, and the process links are reduced.
According to the inductor provided by the invention, the conducting layer of the non-winding area is reserved and is processed to form the shielding layer, and the shielding layer does not need to be arranged independently, so that the thickness of the inductor can be reduced, and the material consumption is saved; on the basis of filling the section difference between the conductive layer and the insulating base material, a thinner epoxy glue material can be used as an insulating layer to be connected between the two layers of planar windings, so that the overall thickness of the inductor is further reduced.
According to the transformer provided by the invention, the conducting layer of the non-winding area is reserved and is processed in parallel to form the shielding layer, so that the coupling capacitance between the primary side and the secondary side can be greatly reduced, and the working effect of the transformer is improved; the shielding layer does not need to be arranged independently, so that the thickness of the inductor can be reduced, and the consumable material is saved; on the basis of filling the section difference between the conducting layer and the insulating base material, a thinner epoxy glue material can be used as an insulating layer to be connected between the two layers of planar windings, so that the overall thickness of the transformer is further reduced.
The manufacturing method of the planar winding simplifies the processing technology of the planar winding, saves the material consumption, and can use thinner epoxy glue material as the insulating layer to be connected between the two layers of planar windings, thereby further reducing the overall thickness of the transformer.
Drawings
Fig. 1 is a schematic structural diagram of a planar winding provided by an embodiment of the present invention;
fig. 2 is another schematic structural diagram of a planar winding according to an embodiment of the present invention.
Reference numerals in the drawings:
1-an insulating substrate; 2-a conductive layer; 21-a winding area; 211-a primary winding area; 212-a secondary winding area; 22-a first non-winding region; 221-a first ground connection point; 23-a second non-winding region; 231-second ground connection point.
Detailed Description
In order to make the aforementioned objects, features and advantages of the present invention comprehensible, embodiments accompanied with figures are described in detail below. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein.
It will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "left," "right," and the like as used herein are for illustrative purposes only.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.
Example one
As shown in fig. 1-2, this embodiment provides two examples, and any one of the examples can be used to implement the technical solution of the present invention. Specifically, the present embodiment provides a planar winding unit, including an insulating substrate 1 and a conductive layer 2, the conductive layer 2 is disposed on a surface of the insulating substrate 1, the conductive layer 2 includes a winding region 21 and a first non-winding region 22 that are not conductive to each other, the winding region 21 has a patterned winding, the first non-winding region 22 is located on a periphery of the winding region 21 and is insulated from the winding region 21, and the first non-winding region 22 is grounded through a first ground connection point 221 to form a first shielding layer. The grounding of the first grounding connection point 221 refers to that the first grounding connection point 221 is subjected to grounding design or grounding processing, so that when the planar winding unit is placed in a working environment, the first grounding connection point 221 can be connected and conducted with a corresponding grounding line, a corresponding grounding pin, and a corresponding grounding end to realize grounding.
In general, when the planar winding unit is used for a transformer, as shown in fig. 1 to 2, the winding region 21 is divided into a primary winding region 211 and a secondary winding region 212, the primary winding region 211 and the secondary winding region 212 are provided in isolation from each other, the primary winding region 211 is patterned to form a primary coil, the secondary winding region 212 is patterned to form a secondary coil, and core holes for passing magnetic cores are provided in both winding regions, respectively, the primary coil is arranged around the core hole of the primary winding region 211, and the secondary coil is arranged around the core hole of the secondary winding region 212.
In the implementation process, the winding region 21 may not be divided into a primary winding region and a secondary winding region, and both may be used as the primary winding region or both may be used as the secondary winding region; when an E-core is used, there is usually only one core hole for the core to pass through, and the winding area can be used as the primary winding area or the secondary winding area.
When planar winding elements are used in an inductor, the primary and secondary winding regions will no longer be distinguished, but only one winding region will usually be provided.
After patterning the winding areas, the upper conductive layer of the insulating substrate 1 may be used as the first non-winding area 22 at other positions, but most commonly, the conductive layer arranged around the two winding areas and continuously extending to the edge of the insulating substrate 1 is used as the first non-winding area 22, correspondingly, the first ground connection point 221 is located at the edge of the insulating substrate, and the ground connection point is arranged at the edge of the insulating substrate 1, so that the first non-winding area 22 is grounded to form an isolation layer.
Generally, the conductive layer 2 further includes a second non-winding region 23, the second non-winding region 23 is surrounded by the winding region 21 and insulated from the winding region 21, and the second non-winding region 23 is grounded through a second ground connection point 231 to form a second shielding layer. The second non-winding area is set based on the design scheme of winding, if no winding is designed near the magnetic core hole to form blank area in the winding design process, the conducting layer of the area is grounded, and the shielding layer can also be formed. Typically, the second ground connection point 231 is located on the insulating substrate 1 near the edge of the core hole to achieve an optimized layout design. The second ground connection point 231 may be connected through a via hole, and then connected to an external ground through a lead wire in a layer in which a blank region exists.
Vias penetrating through both side surfaces of the insulating base material 1 are provided in the first ground connection point 221 and the second ground connection point 231. The arrangement of the via holes can lead the multilayer planar windings to be grounded together only through the connection via holes when the multilayer planar windings are connected in a laminated manner.
The conductive layer 2 is configured to be disposed on one side surface or both side surfaces of the insulating base material 1; when the conductive layers 2 are disposed on both side surfaces of the insulating base material 1, the first ground connection point 221 and the second ground connection point 231 on both side surfaces are at the same position and are electrically connected through a via hole.
The conductive layer 2 is made of copper foil or aluminum foil, and the copper foil is generally the most preferable material for the conductive layer because of good conductivity and flexibility, but the aluminum foil can also meet the use requirement, and other metal foil layers can be used as alternative.
The plane winding unit provided by the invention fully utilizes the non-winding area of the conducting layer to form the shielding layer by grounding, thereby shielding the winding, reducing the coupling capacitance and improving the working effect of the plane winding.
Example two
The embodiment provides a planar winding, which includes the planar winding unit, the planar winding may be a layer or a multilayer structure, when a multilayer structure is adopted, any one or more layers of the planar winding unit may be the planar winding unit, and the specific structure of the planar winding is designed differently according to different products of application. Generally, for inductor products, only one winding area needs to be designed; for transformer products, as shown in fig. 1-2, it is necessary to design the corresponding primary winding region 211 and secondary winding region 212 according to the primary winding and secondary winding, respectively.
The planar winding is configured into a multilayer structure, the multilayer structure is connected in a laminating mode, corresponding winding areas are connected in series, and at least one layer is the planar winding unit.
The layers of the planar winding are connected through an insulating layer, and the insulating layer plays roles of connection and insulation at the same time.
The insulating layer is configured to be insulating glue, and the insulating glue preferably adopts epoxy glue material, can satisfy the connection and the insulating requirement of insulating layer.
When the planar winding is provided with more than two layers of the planar winding units, the first grounding connection points and the second grounding connection points of the planar winding units are respectively connected in a penetrating mode through the through holes.
The plane winding provided by the invention fully utilizes the non-winding area of the conducting layer to form the shielding layer by grounding, thereby shielding the winding, reducing the coupling capacitance and improving the working effect of the plane winding.
EXAMPLE III
The present embodiment also provides an inductor, which uses the planar winding provided in the above embodiments, and the planar winding may be a multilayer structure including at least one layer of planar winding units or a single layer of planar winding units.
When the planar winding is configured as a multilayer structure, the multiple layers are connected in a laminated manner, and the winding regions are connected in series, so that an inductance coil of the inductor is formed.
Furthermore, the adjacent two layers of planar winding units are connected through an insulating layer.
The insulating layer is configured as an insulating glue; the insulating glue is made of epoxy glue. The epoxy glue material is connected between the two layers of planar windings as an insulating layer, so that the overall thickness of the inductor is further reduced.
The positions of the first grounding connection point and the second grounding connection point of the multilayer planar winding are vertically corresponding, the first grounding connection point and the second grounding connection point of the multilayer planar winding are respectively connected through the through holes in a penetrating mode, and then the first grounding connection point and the second grounding connection point are grounded. The method can be generally realized by arranging one grounding pin, and the grounding pin can adopt a pin type structure or an angle structure.
According to the inductor provided by the invention, the conducting layer of the non-winding area is reserved and is processed to form the shielding layer, and the shielding layer does not need to be arranged independently, so that the thickness of the inductor can be reduced, and the material consumption is saved; on the basis of filling the section difference between the conductive layer and the insulating base material, a thinner epoxy glue material can be used as an insulating layer to be connected between the two layers of planar windings, so that the overall thickness of the inductor is further reduced.
Example four
The present embodiment also provides a transformer, which uses the planar winding provided in the above embodiments, and the planar winding may be a multilayer structure including at least one layer of planar winding units or a single layer of planar winding units.
When the planar winding units are configured into a multilayer structure, the multilayer planar windings are connected in a laminated manner, and the winding areas are connected in series, so that windings of the inductor are formed.
Furthermore, the adjacent two layers of planar winding units are connected through an insulating layer.
The insulating layer is configured as an insulating glue; the insulating glue is made of epoxy glue. The epoxy glue material is connected between the two layers of planar windings as an insulating layer, so that the overall thickness of the transformer is further reduced.
The positions of the first grounding connection point and the second grounding connection point of the multilayer planar winding are vertically corresponding, the first grounding connection point and the second grounding connection point of the multilayer planar winding are respectively connected through the through holes in a penetrating mode, and then the first grounding connection point and the second grounding connection point are grounded. The method can be generally realized by arranging one grounding pin, and the grounding pin can adopt a pin type structure or an angle structure.
According to the transformer provided by the invention, the conducting layer of the non-winding area is reserved and is processed in parallel to form the shielding layer, so that the coupling capacitance between the primary side and the secondary side can be greatly reduced, and the working effect of the transformer is improved; the shielding layer does not need to be arranged independently, so that the thickness of the inductor can be reduced, and the consumable material is saved; on the basis of filling the section difference between the conducting layer and the insulating base material, a thinner epoxy glue material can be used as an insulating layer to be connected between the two layers of planar windings, so that the overall thickness of the transformer is further reduced.
EXAMPLE five
The embodiment of the invention also provides a manufacturing method of the planar winding, which comprises the following steps:
providing an insulating substrate, wherein the insulating substrate is generally in a sheet structure and processed into a square shape;
forming a conductive layer on the surface of the insulating base material;
etching the conducting layer according to the designed winding pattern to form a winding area and a non-winding area which are insulated from each other; removing the conducting layer on the discontinuous non-winding area with small area;
grounding the non-winding area through a grounding connection point to form a shielding layer; selecting positions of the grounding connection points close to four edges of the insulating base material, and avoiding positions of winding pins of the inductor and the transformer; when the non-winding area is surrounded by the winding area, the ground connection point is selected to be close to the magnetic core hole, and a via hole design is usually needed to facilitate conduction when the multilayer connection is carried out.
When the planar winding needs to be manufactured into an inductor or a transformer, a via hole needs to be processed on the grounding connection point, the multilayer planar winding is connected and conducted through the via hole on the grounding connection point with the same corresponding position, and then grounding treatment is carried out.
The manufacturing method of the planar winding simplifies the processing technology of the planar winding, saves the material consumption, and can use thinner epoxy glue material as the insulating layer to be connected between the two layers of planar windings, thereby further reducing the overall thickness of the transformer.
EXAMPLE six
The invention provides a manufacturing method of the planar winding unit, which comprises the following steps:
providing an insulating substrate, wherein the insulating substrate is generally in a sheet structure and processed into a square shape;
according to the designed winding pattern, forming a winding area and a non-winding area which are mutually insulated by silk-screen printing on the surface of an insulating base material;
grounding the non-winding area through a grounding connection point to form a shielding layer; selecting positions of the grounding connection points close to four edges of the insulating base material, and avoiding positions of winding pins of the inductor and the transformer; when the non-winding area is surrounded by the winding area, the ground connection point is selected to be close to the magnetic core hole, and a via hole design is usually needed to facilitate conduction when the multilayer connection is carried out.
When the planar winding needs to be manufactured into an inductor or a transformer, a via hole needs to be processed on the grounding connection point, the multilayer planar winding is connected and conducted through the via hole on the grounding connection point with the same corresponding position, and then grounding treatment is carried out.
The manufacturing method of the planar winding simplifies the processing technology of the planar winding, saves the material consumption, and can use thinner epoxy glue material as the insulating layer to be connected between the two layers of planar windings, thereby further reducing the overall thickness of the transformer.
The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.
The above-mentioned embodiments only express several embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.

Claims (13)

1. A planar winding unit comprising an insulating substrate and a patterned conductive layer, wherein the conductive layer is disposed on a surface of the insulating substrate, the conductive layer comprising a winding region and a first non-winding region that are non-conductive with respect to each other, wherein:
a winding region forming a winding from the patterned conductive layer;
and the first non-winding area is positioned at the periphery of the winding area and is insulated from the winding area, and the first non-winding area is grounded through a first grounding connection point to form a first shielding layer.
2. Planar winding unit according to claim 1,
the first ground connection point is located at an edge of the insulating substrate.
3. Planar winding unit according to claim 1 or 2,
the conducting layer further comprises a second non-winding area, the second non-winding area is surrounded by the winding area and is insulated from the winding area, and the second non-winding area is grounded through a second grounding connection point to form a second shielding layer.
4. Planar winding unit according to claim 3,
the second ground connection point is located on the edge of the insulating substrate near the core hole.
5. Planar winding unit according to claim 3,
and through holes penetrating through the surfaces of the two sides of the insulating base material are respectively arranged on the first grounding connection point and the second grounding connection point.
6. Planar winding unit according to claim 3,
the conductive layer is configured to be disposed on one side surface or both side surfaces of the insulating substrate; when the conducting layers are arranged on the two side surfaces of the insulating base material, the positions of the first ground connection point and the second ground connection point on the two side surfaces are the same and are conducted through the through hole.
7. Planar winding unit according to claim 1,
the winding area comprises a primary winding area and/or a secondary winding area, wherein the primary winding area is provided with a primary winding and a driving winding which are patterned, and the secondary winding area is provided with a secondary winding and an auxiliary winding which are patterned.
8. A planar winding comprising a planar winding unit as claimed in any one of claims 1 to 7.
9. Planar winding according to claim 8,
and an insulating layer is arranged between the plane winding units.
10. A planar electronic device, characterized in that it comprises a planar winding according to one of claims 8 to 9.
11. Planar electronic device according to claim 10,
the planar electronic device is an inductor or a capacitor.
12. A method of making a planar winding unit according to any of claims 1 to 7, comprising:
providing an insulating substrate;
forming a patterned conductive layer on the surface of the insulating substrate;
the patterned conductive layer has a winding region and a non-winding region insulated from each other;
and forming the shielding layer on the non-winding area through grounding design or grounding treatment.
13. The method of manufacturing according to claim 12,
the method for forming the patterned conductive layer comprises etching and screen printing.
CN202110758618.4A 2021-07-05 2021-07-05 Planar winding unit, manufacturing method thereof, planar winding and planar electronic device Withdrawn CN113707425A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202110758618.4A CN113707425A (en) 2021-07-05 2021-07-05 Planar winding unit, manufacturing method thereof, planar winding and planar electronic device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202110758618.4A CN113707425A (en) 2021-07-05 2021-07-05 Planar winding unit, manufacturing method thereof, planar winding and planar electronic device

Publications (1)

Publication Number Publication Date
CN113707425A true CN113707425A (en) 2021-11-26

Family

ID=78648284

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202110758618.4A Withdrawn CN113707425A (en) 2021-07-05 2021-07-05 Planar winding unit, manufacturing method thereof, planar winding and planar electronic device

Country Status (1)

Country Link
CN (1) CN113707425A (en)

Similar Documents

Publication Publication Date Title
CN106328339B (en) Coil component
JP7155499B2 (en) LAMINATED ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREOF
US7375608B2 (en) Solid electrolytic capacitor and manufacturing method thereof
US6903938B2 (en) Printed circuit board
US7843303B2 (en) Multilayer inductor
US20110291785A1 (en) Power inductor structure
EP2345047A2 (en) Inductive and capacitive components integration structure
JP2002270428A (en) Laminated chip inductor
CN103298274B (en) A kind of bury hold printed circuit board manufacture method and bury appearance printed circuit board
CN104221103B (en) Cascade type element and its manufacture method
US9204545B2 (en) Multilayer substrate
CN104637650A (en) Multi-layer type inductor
CN109243780A (en) A kind of printed circuit thin film inductor element and preparation method thereof
CN106376173B (en) Multilayer lead structure of printed circuit board, magnetic element and manufacturing method thereof
CN113707425A (en) Planar winding unit, manufacturing method thereof, planar winding and planar electronic device
WO2018030128A1 (en) Multilayer circuit board, multilayer electronic component and module
CN109803494A (en) Circuit board and its manufacturing method
JP2013115053A (en) Mounting structure of noise countermeasure electronic component on circuit board
JPH11186040A (en) Laminated noise filter
CN106341945A (en) Flexible circuit board and manufacturing method thereof
CN104780719A (en) Method for embedding inductors in printed-circuit board and printed-circuit board adopted by method
CN110463358B (en) Wiring board and electronic module
CN204795853U (en) LTCC -LTCF compound circuit base plate structure
KR20140084970A (en) multilayer chip inductor
CN210328109U (en) Novel PCB (printed circuit board)

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
WW01 Invention patent application withdrawn after publication
WW01 Invention patent application withdrawn after publication

Application publication date: 20211126