CN204795853U - LTCC -LTCF compound circuit base plate structure - Google Patents
LTCC -LTCF compound circuit base plate structure Download PDFInfo
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- CN204795853U CN204795853U CN201520268349.3U CN201520268349U CN204795853U CN 204795853 U CN204795853 U CN 204795853U CN 201520268349 U CN201520268349 U CN 201520268349U CN 204795853 U CN204795853 U CN 204795853U
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Abstract
The utility model relates to an integrated circuit field, it discloses a LTCC -LTCF compound circuit base plate structure, by forming in LTCC ceramic chip layer and LTCF ceramic chip layer, LTCC ceramic chip and LTCF ceramic chip are basic stromatolite unit, and arrange with the stromatolite mode on LTCC ceramic chip layer and LTCF ceramic chip layer. The beneficial effects of the utility model are that: both can realize the design of conventional LTCC integrated circuit, utilize the magnetic characteristic of LTCF material simultaneously, at magnetism components and parts such as the integrated inductance in LTCF layer, transformers to remedy the shortcoming of magnetism components and parts such as being difficult to integrated big inductance, transformer in the conventional LTCC integrated technology, realize that magnetism is integrated with the integration of non magnetic components and parts and circuit. This compound circuit base plate structure is favorable to the further integrated miniaturized of circuit module, has very strong practical value.
Description
Technical field
The utility model relates to integrated circuit fields, particularly relates to a kind of LTCC-LTCF compound circuit board structure.
Background technology
As a kind of integrated circuit technique, LTCC technology is quite ripe, and the miniaturization for circuit module serves positive effect.LTCF technology develops from LTCC technology, and it adopts Ferrite Material, utilizes ferritic magnetic characteristic, can realize the Integrated design of the components and parts such as inductance, transformer.LTCC technology and LTCF technology have self advantage, their defect is also apparent simultaneously, conventional LTCC technology is due to material behavior, be difficult to the components and parts such as integrated large inductance, transformer, adopting the form such as Surface Mount to install discrete inductance, transformer no doubt can realizing circuit function, but cannot reach the object of integration of compact; Equally, LTCF technology, due to material behavior, is realizing that the Integrated design such as electric capacity and various microwave circuit structures also exists very large difficulty.
Summary of the invention
In order to solve the problems of the prior art, the utility model provides a kind of LTCC-LTCF compound circuit board structure, cannot reach in order to solve single LTCC in prior art the problem that integration of compact and single LTCF exist very large difficulty on microwave circuit Integrated design.
The technical scheme that the utility model solution prior art problem adopts is: a kind of LTCC-LTCF compound circuit of Design and manufacture board structure, be made up of LTCC ceramics layer and LTCF ceramics layer, described LTCC ceramics and LTCF ceramics are basic hierarchical element, and LTCC ceramics layer and LTCF ceramics layer are with any tier-like manner.
As further improvement of the utility model: described LTCC ceramics layer comprises continuously or/and discrete LTCC ceramics layer.
As further improvement of the utility model: described LTCF ceramics layer comprises continuously or/and discrete LTCF ceramics layer.
As further improvement of the utility model: the material of described LTCC ceramics layer only refers to the low-temperature co-burning ceramic material of narrow sense, i.e. the LTCC material of non-ferrite.
As further improvement of the utility model: the magnetic element that is combined as of described LTCF ceramics layer or continuous print LTCF ceramics layer arranges layer, the metallic vias interconnection of the conductor fig that LTCF ceramics layer prints and interlayer forms magnetic elements.
As further improvement of the utility model: described magnetic element is arranged between layer and LTCC ceramics layer, form middle shield by printing large area conductor on certain layer of ceramics.
The beneficial effects of the utility model are: this compound circuit board structure combines the advantage of LTCC and LTCF bi-material, both conventional LTCC integrated circuit (IC) design can have been realized, utilize the magnetic characteristic of LTCF material simultaneously, at magnetic elements such as LTCF layer integrated inductor, transformers, thus make up the shortcoming being difficult to the magnetic elements such as integrated large inductance, transformer in conventional LTCC integrated technology, realize the integrated of magnetic and non magnetic components and parts and circuit.This compound circuit board structure is conducive to the further integration of compact of circuit module, has very strong practical value.
Accompanying drawing explanation
Fig. 1 is schematic diagram in an embodiment of the utility model LTCC-LTCF compound circuit board structure.
Fig. 2 is schematic diagram in the another embodiment of the utility model LTCC-LTCF compound circuit board structure.
Fig. 3 is schematic diagram in another embodiment of the utility model LTCC-LTCF compound circuit board structure.
Embodiment
Below in conjunction with accompanying drawing, the utility model is described in further detail.
A kind of LTCC-LTCF compound circuit board structure, be made up of LTCC ceramics layer and LTCF ceramics layer, described LTCC ceramics and LTCF ceramics are basic hierarchical element, and LTCC ceramics layer and LTCF ceramics layer are with any tier-like manner.
Described LTCC ceramics layer comprises continuously or/and discrete LTCC ceramics layer.
Described LTCF ceramics layer comprises continuously or/and discrete LTCF ceramics layer.
The material of described LTCC ceramics layer only refers to the low-temperature co-burning ceramic material of narrow sense, i.e. the LTCC material of non-ferrite.
The magnetic element that is combined as of described LTCF ceramics layer or continuous print LTCF ceramics layer arranges layer, and the metallic vias interconnection of the conductor fig that LTCF ceramics layer prints and interlayer forms magnetic elements.
Described magnetic element is arranged between layer and LTCC ceramics layer, forms middle shield by printing large area conductor on certain layer of ceramics.
When LTCC ceramics and (or) the LTCF ceramics number of plies are greater than 1 layer, any possible laminated layer sequence can be adopted to combine.
LTCC and LTCF ceramic substrate is adopted in compound circuit board structure, not only need the electromagnetic performance requirement meeting circuit design, also need to meet the parameter such as sintering shrinkage, thermal coefficient of expansion mutually to mate, circuit substrate finished product after sintering, without various defects such as layering, warpage, crackles, realizes by methods such as selecting suitable green material, take prepared by special process; Concrete model specification for LTCC, LTCF material used is not clearly defined, but should be explained as follows: the LTCC material that the utility model relates to only refers to the low-temperature co-burning ceramic material of narrow sense, i.e. non-ferrite material.
In one embodiment, specifically certain circuit substrate selects concrete LTCC and LTCF material according to the circuit function that will realize and performance; The LTCC layer concrete structure stacked with LTCF is also relevant with physical circuit, determines when side circuit designs; Concrete technology method (or technological parameter) is also closely related with the material of actual selection; In above three kinds of modes, concrete " LTCC-LTCF compound circuit board structure " can have the diversified form of expression because the material of actual selection is different or lamination order is different, corresponding concrete technology also difference to some extent.
In one embodiment, the specific design step of this LTCC/LTCF compound circuit board structure is as follows:
A. select according to the circuit function that will realize and electrical performance indexes, manufacturing process etc. LTCC and the LTCF material meeting design, technological requirement;
B. according to LTCF material electromagnetic parameter, design of Simulation is carried out to wanting the integrated magnetic elements such as inductance, transformer; According to LTCC material electromagnetic parameter, to wanting integrated electric capacity, RF components and parts carry out design of Simulation.
C. according to the simulation result of circuit overall allocation plan and step b, select the rational substrate number of plies (the LTCC number of plies, the LTCF number of plies) and overall dimension, and determine the lamination order of LTCC, LTCF ceramics.
D. each components and parts figure that step b emulation obtains is imported circuit design software (as AltiumDesigner, AutoCAD, Durst etc.), each LTCC, LTCF layer carries out layout to components and parts, and add SMT component pads, be designed for cavity, bonding welding pad that bare chip is installed, and the wire of circuit interconnection, via hole, screen, shield opening, louvre etc., completing circuit is integrated, placement-and-routing's design.
E. again by simulation software, complex optimum is carried out to circuit layout wiring, determines final circuit layout.
Embodiment 1: Fig. 1 is " 3C+3F+2C " composite laminate circuit board structure.Wherein sequence number be 7 ~ 13 conductor and LTCF layer constitute " magnetic elements layout layer ", the Integration Design (as magnetic core, the conductor fig that LTCF layer prints forms inductance or transformer coil to LTCF layer) of the magnetic elements such as inductance, transformer is carried out in this region; Sequence number be 5 and 15 two-layer conductor formed respectively " middle shield ", to isolate magnetic elements and other circuit; All the other LTCC layers and conductor layer are used for Integration Design electric capacity, RF components and parts and other circuit-line; Each layer circuitous pattern is connected by metallic vias.
Embodiment 2: Fig. 2 is " 3C+3F+2C " composite laminate circuit board structure revised on Fig. 1 basis.Be with the difference of embodiment 1, in fig. 2, sequence number be 8 ~ 10 LTCF layer between without conductor layer, 3 layers of LTCF directly laminate into the thicker ferrite layer of thickness, meet design requirement.
Embodiment 3: Fig. 3 is " 2C+1F+2C+1F+2C " composite laminate circuit board structure.Wherein sequence number be 5 ~ 7 conductor and LTCF layer constitute " magnetic elements arrange layer 1 ", and sequence number be 11 ~ 13 conductor and LTCF layer constitute " magnetic elements arranges layer 2 ".Magnetic elements is arranged that layer 1 and magnetic elements are arranged in layer 2 and is designed different magnetic elements figures respectively, and " middle shield " that be 9 by sequence number between them isolates; All the other LTCC layers and conductor layer are used for Integration Design electric capacity, RF components and parts and other circuit-line; Each layer circuitous pattern is connected by metallic vias.
" 3C " in more than illustrating refers to 3 layers of continuous print LTCC ceramics, and " 3F " refers to 3 layers of continuous print LTCF ceramics, by that analogy.Whether " continuously " refers to here does not have the another kind of ceramic substrate in interval, and have circuitous pattern (conductor layer) to have nothing to do.Fig. 1 ~ 3 are schematic diagram, in order to laminated construction relation to be described, do not represent physical circuit.
This compound circuit basic structure adopts m layer LTCC and n layer LTCF to form (m >=1 and n >=1), no matter this m layer LTCC and n layer LTCF can be stacked according to random order, m layer LTCC comprises continuous print LTCC layer or/and discrete LTCC layer, n layer LTCF comprises continuous print LTCF layer or/and discrete LTCF layer, adopt the electromagnetic property of two kinds of different materials, thus realize the integrated of magnetic and non magnetic components and parts and circuit.
Above content is in conjunction with concrete preferred implementation further detailed description of the utility model, can not assert that concrete enforcement of the present utility model is confined to these explanations.For the utility model person of an ordinary skill in the technical field, without departing from the concept of the premise utility, some simple deduction or replace can also be made, all should be considered as belonging to protection range of the present utility model.
Claims (6)
1. a LTCC-LTCF compound circuit board structure, is characterized in that: be made up of LTCC ceramics layer and LTCF ceramics layer, described LTCC ceramics and LTCF ceramics are basic hierarchical element, and LTCC ceramics layer and LTCF ceramics layer are with tier-like manner.
2. LTCC-LTCF compound circuit board structure according to claim 1, is characterized in that: described LTCC ceramics layer comprises continuously or/and discrete LTCC ceramics layer.
3. LTCC-LTCF compound circuit board structure according to claim 1, is characterized in that: described LTCF ceramics layer comprises continuously or/and discrete LTCF ceramics layer.
4. LTCC-LTCF compound circuit board structure according to claim 1, is characterized in that: the material of described LTCC ceramics layer is the LTCC material of non-ferrite.
5. LTCC-LTCF compound circuit board structure according to claim 1, it is characterized in that: the magnetic element that is combined as of described LTCF ceramics layer or continuous print LTCF ceramics layer arranges layer, the metallic vias interconnection of the conductor fig that LTCF ceramics layer prints and interlayer forms magnetic elements.
6. LTCC-LTCF compound circuit board structure according to claim 5, is characterized in that: described magnetic element is arranged between layer and LTCC ceramics layer, forms middle shield by printing large area conductor on certain layer of ceramics.
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| CN201520268349.3U CN204795853U (en) | 2015-04-29 | 2015-04-29 | LTCC -LTCF compound circuit base plate structure |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN104780704A (en) * | 2015-04-29 | 2015-07-15 | 西南应用磁学研究所 | LTCC-LTCF composite circuit substrate structure |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104780704A (en) * | 2015-04-29 | 2015-07-15 | 西南应用磁学研究所 | LTCC-LTCF composite circuit substrate structure |
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