CN113695600B - 3D prints intelligent bottom plate - Google Patents

3D prints intelligent bottom plate Download PDF

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Publication number
CN113695600B
CN113695600B CN202110917983.5A CN202110917983A CN113695600B CN 113695600 B CN113695600 B CN 113695600B CN 202110917983 A CN202110917983 A CN 202110917983A CN 113695600 B CN113695600 B CN 113695600B
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China
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bottom plate
end cover
piezoelectric
signal
intelligent
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CN113695600A (en
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李泞
高椿明
张萍
胡强
王亚非
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University of Electronic Science and Technology of China
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University of Electronic Science and Technology of China
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F12/00—Apparatus or devices specially adapted for additive manufacturing; Auxiliary means for additive manufacturing; Combinations of additive manufacturing apparatus or devices with other processing apparatus or devices
    • B22F12/30—Platforms or substrates
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F10/00—Additive manufacturing of workpieces or articles from metallic powder
    • B22F10/80—Data acquisition or data processing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B33—ADDITIVE MANUFACTURING TECHNOLOGY
    • B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
    • B33Y30/00—Apparatus for additive manufacturing; Details thereof or accessories therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B33—ADDITIVE MANUFACTURING TECHNOLOGY
    • B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
    • B33Y50/00—Data acquisition or data processing for additive manufacturing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P10/00—Technologies related to metal processing
    • Y02P10/25—Process efficiency

Abstract

The invention belongs to the technical field of 3D printing, and particularly relates to a 3D printing intelligent bottom plate. In the 3D printing process, the printing is started from the surface of the bottom plate, the workpiece and the bottom plate are integrated, the upper surface of the bottom plate gradually accumulates stress and generates micro deformation along with the printing, the micro deformation generates amplified deformation corresponding to the stress at the bottom of the seam under the action of the strain amplification seam, on one hand, the deformation can cause the piezoelectric sensor attached to the bottom of the piezoelectric sensor to generate transient electric signal output, on the other hand, the prestress state of the piezoelectric sensor is changed, so that the electromechanical conversion efficiency of the piezoelectric sensor is changed, the piezoelectric output generated by the same excitation sound source can show the change of the efficiency, and therefore, the distribution of the strain can be evaluated in real time in a piezoelectric sensor array mode.

Description

3D prints intelligent bottom plate
Technical Field
The invention belongs to the technical field of 3D printing, and particularly relates to a 3D printing intelligent bottom plate technology.
Background
In the metal 3D printing process, as the temperature of a processing area is even up to more than 2000 ℃, huge temperature difference and corresponding thermal stress accumulation exist in a workpiece, and when the stress accumulation reaches a certain degree, destructive stress release (comprising crystal lattice dislocation, delamination, fracture, surface tearing and the like) can be generated, so that the acoustic emission phenomenon is generated. In the process of stress development, corresponding strain always corresponds, so that the change condition of stress can be effectively inferred through monitoring the strain, and in an extreme condition (generating acoustic emission), the acoustic emission position can be effectively monitored through monitoring a sound field. Therefore, it is very useful to develop a metal 3D printing substrate capable of monitoring the stress strain.
The intelligent bottom plate utilizes piezoelectricity composite transducer technique, prints the bottom plate to metal 3D and has carried out intelligent upgrading, utilizes composite transducer structure, carries out the distributed monitoring to the stress and strain of bottom plate different positions to the realization is to the detection of the inside stress accumulation condition of product, and through acoustic emission monitoring and analysis, accomplishes the judgement of defect position.
In the related art, the mechanical performance characteristics and physical characteristics of the backplane are mainly concerned, and the backplane is not developed to have a detection function.
Disclosure of Invention
The invention aims to provide a vibration/sound sensing array combined with detection sensing capability aiming at the current situation that the current back plate is only used as a structural support and a material growth bottom plate, so that the pool photoacoustic signal detection and metal part defect acoustic emission detection in the metal 3D printing process are realized, and a technical basis is provided for the metal 3D printing photoacoustic and acoustic emission on-line monitoring.
The technical scheme adopted by the invention is as follows:
A3D printing intelligent bottom plate is characterized by comprising an intelligent bottom plate upper end cover 1, a strain amplification seam 2, a piezoelectric sensor 3, a signal transmission line 4, a piezoelectric signal processing circuit 6, a signal output terminal 7, an intelligent bottom plate lower end cover 8, an acoustic excitation source 9, a signal connecting line 10 and an excitation driving connecting line 11; the intelligent bottom plate upper end cover 1 is connected with the intelligent bottom plate lower end cover 8, and a closed insulating gap 5 is formed between the intelligent bottom plate upper end cover 1 and the intelligent bottom plate lower end cover 8; the strain amplification seams 2 are distributed on one surface, close to the lower end cover 8 of the intelligent bottom plate, of the upper end cover 1 of the intelligent bottom plate in a criss-cross mode, and the vertical height of the strain amplification seams 2 is smaller than that of the upper end cover 1 of the intelligent bottom plate; the piezoelectric sensor 3 is arranged at the intersection point of each row and each column of the strain amplification seams 2 to form a sensor array, the surface of the piezoelectric sensor 3, which is in contact with the upper end cover 1 of the intelligent bottom plate, is a signal ground, and the surface of the piezoelectric sensor 3, which is exposed in the insulation gap 5, is a signal output electrode; the piezoelectric signal processing circuit 6 is arranged on the surface of one side of the intelligent bottom plate lower end cover 8, which forms the insulation gap 5, the piezoelectric signal processing circuit 6 is connected with the piezoelectric sensor 3 through the signal transmission line 4, and the piezoelectric signal processing circuit 6 is used for receiving the signal output by the piezoelectric sensor 3 and transmitting the processed signal to the signal output terminal 7 through the signal connection line 10; the signal output terminal 7 is embedded in the surface of the lower end cover 8 of the intelligent bottom plate to realize the outward output of signals; at the interior bottom surface of intelligent bottom plate lower end cover 8, still be provided with acoustic excitation source 9, acoustic excitation source 9 is connected with piezoelectric signal processing circuit 6 through excitation drive connecting wire 11, acoustic excitation source 9 is the excitation acoustic signal emission source, realizes the transmission function of single-frequency audio frequency under piezoelectric signal processing circuit 6's drive.
The invention adopts a slotted structure to amplify the strain capacity; the relation between the piezoelectric performance of the piezoelectric material and the stress is utilized, and the high-sensitivity monitoring of the stress-strain state is realized by an active single-frequency sound excitation detection method; the sensor array realizes the spatial resolution of stress-strain distribution. The workpiece strain monitoring and acoustic emission defect positioning in the 3D printing process can be realized, and therefore an important feedback basis is provided for the optimization of process parameters of the 3D printing. In the 3D printing process, printing starts from the surface of the bottom plate, a workpiece and the bottom plate are integrated, the upper surface of the bottom plate gradually accumulates stress and generates micro deformation along with the printing, the micro deformation is generated at the bottom of the seam through the action of a strain amplification seam, the amplified deformation corresponding to the strain is generated at the bottom of the seam, on one hand, the deformation can lead the piezoelectric sensor attached to the bottom of the piezoelectric sensor to generate transient electric signal output, on the other hand, the prestress state of the piezoelectric sensor can be changed, the electromechanical conversion efficiency of the piezoelectric sensor is changed, therefore, the piezoelectric output generated by the same excitation sound source can show the change of the efficiency, and the strain distribution can be evaluated in real time in a piezoelectric sensor array mode.
The invention has the beneficial effects that:
the metal 3D printing ultrasonic detection acoustic emission detector can be used as a defect acoustic emission detector in a metal 3D printing process, and can also be used as a back photoacoustic detection channel for processing photoacoustic signals in the metal 3D printing process, so that indirect representation is provided for the state of a metal 3D printing molten pool.
Drawings
Fig. 1 is a block diagram of a 3D printing intelligent backplane of the present invention.
Fig. 2 is a sectional top view of the intelligent backplane upper end cap.
Detailed Description
The technical scheme of the invention is described in detail in the following with reference to the accompanying drawings.
As shown in fig. 1, the intelligent backplane of the present invention mainly comprises: intelligence bottom plate upper end cover 1, meet an emergency and enlarge seam 2, piezoelectric sensor 3, signal transmission line 4, piezoelectric signal processing circuit 6, signal output terminal 7, intelligence bottom plate lower end cover 8, acoustic excitation source 9, signal connection line 10, excitation drive connecting wire 11, intelligence bottom plate upper end cover 1 and intelligent bottom plate lower end cover 8 are connected, form confined insulating space 5 between intelligence bottom plate upper end cover 1 and intelligent bottom plate lower end cover 8. In the 3D printing process, printing starts from the surface of the bottom plate, a workpiece and the bottom plate are integrated, the upper surface of the bottom plate gradually accumulates stress and generates micro deformation along with the printing, the micro deformation is generated at the bottom of the seam through the action of a strain amplification seam, the amplified deformation corresponding to the strain is generated at the bottom of the seam, on one hand, the deformation can lead the piezoelectric sensor attached to the bottom of the piezoelectric sensor to generate transient electric signal output, on the other hand, the prestress state of the piezoelectric sensor can be changed, the electromechanical conversion efficiency of the piezoelectric sensor is changed, therefore, the piezoelectric output generated by the same excitation sound source can show the change of the efficiency, and the strain distribution can be evaluated in real time in a piezoelectric sensor array mode.
Intelligence bottom plate upper end cover includes: the intelligent bottom plate upper end cover bottom surface, the enlarged seam of meeting an emergency, piezoelectric sensor.
The upper end cover of the intelligent bottom plate is a flat surface, and is provided with strain amplification seams which are alternated transversely and longitudinally, and an array consisting of piezoelectric sensors is also adhered at the intersection of the seams.
The strain amplification seam is a small seam with an opening from the bottom surface of the upper end cover of the intelligent bottom plate, the depth of the strain amplification seam is smaller than the thickness of the upper end cover of the intelligent bottom plate, the strain amplification seam comprises a seam in two horizontal and vertical directions to form a seam array, and the piezoelectric sensor is pasted at the intersection of the horizontal and vertical seams.
The piezoelectric sensor is adhered to the bottom surface of the upper end cover of the intelligent bottom plate, is positioned at the intersection of the strain amplification seams, is in good electric contact with the bottom surface of the upper end cover of the intelligent bottom plate, is a signal ground of the piezoelectric sensor, is exposed in the insulation gap, is a signal output electrode, and transmits a piezoelectric signal to the piezoelectric signal processing circuit for processing through a signal transmission line.
The piezoelectric sensor is adhered to the bottom surface of the upper end cover of the intelligent bottom plate, is positioned at the intersection of the strain amplification seams, is in good electric contact with the bottom surface of the upper end cover of the intelligent bottom plate, is a signal ground of the piezoelectric sensor, is exposed in the insulation gap, is a signal output electrode, and transmits a piezoelectric signal to the piezoelectric signal processing circuit for processing through a signal transmission line.
The signal transmission line is a flexible lead, one end of the signal transmission line is connected with a signal output electrode of the piezoelectric sensor, the other end of the signal transmission line is connected with the piezoelectric signal processing circuit, and the signal transmission line is used as a signal output connecting line of the piezoelectric sensor.
The insulating air gap is a gap layer between the upper end cover of the intelligent bottom plate and the lower end cover of the intelligent bottom plate, is filled with air or other insulating substances, and plays a role in electrical insulation so as to ensure that two poles of the piezoelectric sensor are not short-circuited.
The piezoelectric signal processing circuit is a multi-channel signal acquisition and preprocessing circuit, the input end of the piezoelectric signal processing circuit is a piezoelectric output signal of a sensor array consisting of a plurality of piezoelectric sensors, the piezoelectric signal processing circuit acquires the sensor array signal in real time, completes the primary processing of a time domain and a frequency domain, and finally outputs the processed array signal to a signal output terminal according to industrial communication specifications (RS232, 485 and the like); on the other hand, it provides a drive signal for the excitation source.
And the signal output terminal is used as an output interface of the piezoelectric signal processing circuit to finish external signal output.
It is the mounting base of piezoelectric signal processing circuit, signal output terminal, excitation sound source for intelligence bottom plate lower end cover to the whole support that provides the intelligence bottom plate.
The excitation sound source is an excitation sound signal emission source, realizes the emission function of single-frequency audio, and the driving signal of the excitation sound source is provided by the piezoelectric signal processing circuit.
The signal connection line is a multi-strand shield line and is a signal connection line between the piezoelectric signal processing circuit and the signal output terminal.
The excitation driving connecting line is a double-strand shielding line, so that the connection between the piezoelectric signal processing circuit and the excitation sound source is realized, and the output connection of the excitation sound source driven by the excitation sound signal generated by the piezoelectric signal processing circuit is completed.

Claims (1)

1. A3D printing intelligent bottom plate is characterized by comprising an intelligent bottom plate upper end cover (1), a strain amplification seam (2), a piezoelectric sensor (3), a signal transmission line (4), a piezoelectric signal processing circuit (6), a signal output terminal (7), an intelligent bottom plate lower end cover (8), an acoustic excitation source (9), a signal connecting line (10) and an excitation driving connecting line (11); the intelligent bottom plate upper end cover (1) is connected with the intelligent bottom plate lower end cover (8), and a closed insulating gap (5) is formed between the intelligent bottom plate upper end cover (1) and the intelligent bottom plate lower end cover (8); the strain amplification seams (2) are distributed on one surface, close to the intelligent bottom plate lower end cover (8), of the intelligent bottom plate upper end cover (1) in a criss-cross mode, and the vertical height of the strain amplification seams (2) is smaller than that of the intelligent bottom plate upper end cover (1); the piezoelectric sensors (3) are arranged at the intersection points of each row and each column of the strain amplification seams (2) to form a sensor array, one surface of each piezoelectric sensor (3) in contact with the upper end cover (1) of the intelligent bottom plate is a signal ground, and the surface of each piezoelectric sensor (3) exposed in the insulation gap (5) is a signal output electrode; the piezoelectric signal processing circuit (6) is arranged on the surface of one side of the intelligent bottom plate lower end cover (8) forming the insulation gap (5), the piezoelectric signal processing circuit (6) is connected with the piezoelectric sensor (3) through a signal transmission line (4), and the piezoelectric signal processing circuit (6) is used for receiving signals output by the piezoelectric sensor (3) and transmitting the processed signals to a signal output terminal (7) through a signal connecting line (10); the signal output terminal (7) is embedded in the surface of the lower end cover (8) of the intelligent bottom plate to realize the outward output of signals; the interior bottom surface of intelligence bottom plate bottom end cover (8), still be provided with acoustic excitation source (9), acoustic excitation source (9) are connected with piezoelectric signal processing circuit (6) through excitation drive connecting wire (11), acoustic excitation source (9) are for encouraging the acoustic signal emission source, realize the emission function of single-frequency audio frequency under piezoelectric signal processing circuit's (6) drive.
CN202110917983.5A 2021-08-11 2021-08-11 3D prints intelligent bottom plate Active CN113695600B (en)

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Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103018329A (en) * 2012-12-21 2013-04-03 重庆交通大学 Structural damage monitoring system and method based on piezoelectric ultrasonic-smart grids
CN107775953A (en) * 2017-12-07 2018-03-09 徐素香 A kind of automatic method interrupted 3D printer and continue feed
CN109307707A (en) * 2017-11-16 2019-02-05 中国石油化工股份有限公司 The passive sound fusion detection method of storage tank bottom plate distributed wireless master
CN111780658A (en) * 2020-06-19 2020-10-16 北京科技大学 Real-time measuring device and method for part deformation in high-energy beam powder bed printing additive manufacturing
CN112285202A (en) * 2020-10-20 2021-01-29 天津大学 Variable-curvature PBX surface crack oriented nondestructive testing method and sensor
CN112313023A (en) * 2018-07-02 2021-02-02 瑞尼斯豪公司 Acoustic emission sensing in powder bed additive manufacturing

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103018329A (en) * 2012-12-21 2013-04-03 重庆交通大学 Structural damage monitoring system and method based on piezoelectric ultrasonic-smart grids
CN109307707A (en) * 2017-11-16 2019-02-05 中国石油化工股份有限公司 The passive sound fusion detection method of storage tank bottom plate distributed wireless master
CN107775953A (en) * 2017-12-07 2018-03-09 徐素香 A kind of automatic method interrupted 3D printer and continue feed
CN112313023A (en) * 2018-07-02 2021-02-02 瑞尼斯豪公司 Acoustic emission sensing in powder bed additive manufacturing
CN111780658A (en) * 2020-06-19 2020-10-16 北京科技大学 Real-time measuring device and method for part deformation in high-energy beam powder bed printing additive manufacturing
CN112285202A (en) * 2020-10-20 2021-01-29 天津大学 Variable-curvature PBX surface crack oriented nondestructive testing method and sensor

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
A.J. Dunbar等.Development of experimental method for in situ distortion and temperature measurements during the laser powder bed fusion additive manufacturing process.《Additvie Manufacturing》.2016,第12卷第25-30页. *

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