CN107246909A - graphene acoustic sensor array - Google Patents
graphene acoustic sensor array Download PDFInfo
- Publication number
- CN107246909A CN107246909A CN201710364339.3A CN201710364339A CN107246909A CN 107246909 A CN107246909 A CN 107246909A CN 201710364339 A CN201710364339 A CN 201710364339A CN 107246909 A CN107246909 A CN 107246909A
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- CN
- China
- Prior art keywords
- supporting plate
- array
- graphene
- crown
- acoustic sensor
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01H—MEASUREMENT OF MECHANICAL VIBRATIONS OR ULTRASONIC, SONIC OR INFRASONIC WAVES
- G01H11/00—Measuring mechanical vibrations or ultrasonic, sonic or infrasonic waves by detecting changes in electric or magnetic properties
- G01H11/06—Measuring mechanical vibrations or ultrasonic, sonic or infrasonic waves by detecting changes in electric or magnetic properties by electric means
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R19/00—Electrostatic transducers
- H04R19/04—Microphones
Abstract
The invention discloses a kind of graphene acoustic sensor array, including top crown, bottom crown and insulating barrier, top crown includes uniform laying via-hole array in the graphene film layer deposited in supporting plate and supporting plate, supporting plate；Bottom crown is consistent with top crown size, bottom crown includes upper backup pad, wiring plate and lower supporting plate, lay hard contact array corresponding with via-hole array in upper backup pad upper surface, lower supporting plate lower surface lays set wiring on amplifier circuit unit array corresponding with hard contact array, wiring plate and is used for connecting one to one hard contact and amplifier circuit unit；Insulating barrier is located between top crown and bottom crown, and is contacted with top crown and bottom crown.Multiple graphene sonic transducers are integrated into acoustic sensor array by the present invention, and collaborative work is easier to catch pure voice signal, and acoustic sensor array can carry out auditory localization, and the addition of graphene can catch the ultrasonic wave for surmounting the human ear hearing upper limit.
Description
Technical field
The present invention relates to a kind of graphene acoustic sensor array, industrial nondestructive testing can be applied to.
Background technology
Microphone is a kind of transducer that voice signal is converted to electric signal.The sound in nature can be gathered by it
Message number is simultaneously translated into data signal, in order to which follow-up filtering, amplification etc. are handled.It is widely used in consumer electronics at present
In product scope for capacitor-type electret microphone, it is based on capacitance principle, and the change of upper bottom crown spacing is converted into electricity
The change of pressure value.The vibration of sound wave can cause top crown（Vibrating membrane）Vibration, so as to cause vibrating membrane to deviate former equilbrium position.
Because bottom crown is fixed, so the vibration of sound wave can cause the distance between bottom crown to change, capacitance is caused to change
Become.Electret microphone, which is employed, can keep the electret film of permanent charge as top crown, therefore need not be to capacitor
Power supply.But it is due to the presence of amplifying circuit, electret microphone stills need low pressure and is powered.
Electret microphone is widely used because of its cheap price, but itself performance existing defects.In complicated sound
Learn under environment, noise is always from from all directions, and noise signal and voice signal are often mutually to overlap on frequency spectrum,
Along with echo and the influence of reverberation, it is extremely difficult to catch relatively pure voice signal using single electret microphone
's.Single microphone can only take the mode of Multiple-Scan for the information of Overall Acquisition sound source, but be constrained to microphone number
Amount, this process generally requires long time.Further, since the limitation of electret film, the frequency of electret microphone is rung
It is also limited to answer bandwidth, it is impossible to which the ultrasonic signal for surmounting the human ear hearing limit is handled.
The content of the invention
It is an object of the invention to provide a kind of graphene acoustic sensor array.
To reach above-mentioned purpose, the present invention is adopted the following technical scheme that：
Graphene acoustic sensor array, including top crown, bottom crown and insulating barrier, wherein：
Top crown includes uniform laying via-hole array in the graphene film layer deposited in supporting plate and supporting plate, supporting plate；
Bottom crown is consistent with top crown size, and bottom crown includes upper backup pad, wiring plate and lower supporting plate, upper backup pad upper surface
Hard contact array corresponding with via-hole array is laid, lower supporting plate lower surface lays amplification electricity corresponding with hard contact array
Set wiring is used for connecting one to one hard contact and amplifier circuit unit on road cell array, wiring plate；
Also via-hole array is laid with insulating barrier, the via-hole array is corresponding with via-hole array in supporting plate；Insulating barrier is located at upper
Between pole plate and bottom crown, and contacted with top crown and bottom crown.
Further, supporting plate is pcb board.
Further, one jiao of top crown supporting plate is provided with the mu balanced circuit being connected with graphene film layer.
Further, supporting plate, wiring plate and lower supporting plate are pcb board.
Multiple graphene sonic transducers are integrated into acoustic sensor array by the present invention, and collaborative work can be easier to catch pure
Voice signal, the anthropoid binaural effect of class.Acoustic sensor array can carry out auditory localization, and the addition of graphene can improve sound biography
The bandwidth of sensor array frequency response, catches it and surmounts the human ear hearing upper limit（20K Hz）Ultrasonic wave.
Compared to the prior art, the present invention has the following technical effect that：
（1）In the audio frequency range that human ear can be heard, the effect for following the trail of sound is better than conventional capacitive formula electret microphone.
（2）Outside the audio frequency range that human ear can be heard, have benefited from the excellent areal mass density of graphene film and power
Performance is learned, this acoustic sensor array can follow the trail of ultrasonic wave.
（3）By related algorithm, carry out auditory localization, sound imaging and industrial non-destructive using acoustic sensor array and examine
Survey.
Brief description of the drawings
Fig. 1 is overall structure of the present invention and application schematic diagram；
Fig. 2 is the specific hierarchical diagram of the present invention；
Fig. 3 is the floor map of top crown；
Fig. 4 is the schematic perspective view of top crown；
Fig. 5 is the floor map of bottom crown upper surface；
Fig. 6 is the floor map of lower step lower surface；
Fig. 7 is the circuit theory diagrams of amplifier circuit unit.
In figure, 1- top crowns, the gold-plated supporting plates of 101-, 1011- substrates, 1012- Gold plated Layers, 102- through holes, 103- graphite
Alkene film layer, 2- bottom crowns, 201- hard contacts, 202- amplifier circuit units, 3- insulating barriers.
Embodiment
The invention will be further described below in conjunction with the accompanying drawings.
See Fig. 1 ~ 2, graphene acoustic sensor array of the present invention includes top crown 1, bottom crown 2 and insulating barrier 3, insulating barrier 3
Contacted between top crown 1 and bottom crown 2, and with top crown 1 and bottom crown 2.See Fig. 3 ~ 4, top crown 1 includes gold-plated branch
The graphene film layer 103 of deposition growing is shifted on fagging 101 and the gilding of gold-plated supporting plate 101.It is gold-plated in this specific implementation
Supporting plate 101 is thickness 2mm, length of side 120mm gold-plated pcb board, and 16 × 16 via-hole array, each through hole are uniformly laid with thereon
102 apertures are 5mm, and the holes of adjacent through-holes 102 is in the heart away from for 7mm.Ni-based graphene " growth " is set to exist using the method for " transfer "
On pcb board gilding, graphene film layer 103 is grown to serve as.1 one jiaos of top crown is provided with what is be connected with graphene film layer 103
Power supply circuit, power supply circuit connection external power source, can make voltage constant on graphene film layer 103.
Bottom crown 2 is consistent with the size of top crown 1, and bottom crown 2 includes upper backup pad, wiring plate and lower supporting plate, and this is specific
In implementation, upper backup pad, wiring plate and lower supporting plate are pcb board, wherein, wiring plate is using two layers of pcb board.On upper backup pad
16 × 16 hard contact array is laid on surface, sees Fig. 5, hard contact array is matched with via-hole array, i.e. hard contact array
The size of middle hard contact 201 and position are matched with through hole in via-hole array 102.When top crown 1 and bottom crown it is 2-in-1 and when, on
Graphene film layer 103 constitutes 16 × 16 capacitor array with hard contact array on bottom crown 2 on pole plate 1.Under lower supporting plate
Amplifier circuit unit array corresponding with hard contact array is laid on surface, Fig. 6 is seen, by being connected up hard contact on wiring plate
201 are connected with amplifier circuit unit 202 and connect one to one.
Insulating barrier 3 is located between top crown 1 and bottom crown 2, and is contacted with top crown 1 and bottom crown 2, is opened on insulating barrier 3
Provided with via-hole array, via-hole array is adapted with via-hole array on top crown 1 on insulating barrier 3, i.e., on insulating barrier 3 and top crown 1
The positions and dimensions of via-hole array are adapted.
During Fig. 7 is the circuit theory diagrams of amplifier circuit unit, figure, C1 represents an electric capacity in capacitor array, direct current
Source BT1 represents the external power supply put on graphene film layer 103.When electric capacity C1 changes, due to voltage constant, electric capacity C1
Upper electric charge redistribution, and then produce electric current.Resistance R1 converts electrical current into voltage, and by metal-oxide-semiconductor Q1 by voltage amplification simultaneously
Output.
See Fig. 1, during using the present invention, controller of the output connection based on STM32 of amplifier circuit unit works as outside sound source
Cause the displacement of each point on the vibration of graphene film layer 103, graphene film layer 103 different, cause each electric capacity of capacitor array
The change of value is different.Capacitance variation situation at difference is sent to the controller based on STM32, controller is used for stone
The electric signal of black alkene acoustic sensor array output is handled, including selection signal, filter background noise, amplified signal etc., from
And restore sound source；Signal is gathered through signal gathering unit again, and collection signal is shown in display unit.
Claims (4)
1. graphene acoustic sensor array, it is characterized in that：
Including top crown, bottom crown and insulating barrier, wherein：
Top crown includes uniform laying via-hole array in the graphene film layer deposited in supporting plate and supporting plate, supporting plate；
Bottom crown is consistent with top crown size, and bottom crown includes upper backup pad, wiring plate and lower supporting plate, upper backup pad upper surface
Hard contact array corresponding with via-hole array is laid, lower supporting plate lower surface lays amplification electricity corresponding with hard contact array
Set wiring is used for connecting one to one hard contact and amplifier circuit unit on road cell array, wiring plate；
Also via-hole array is laid with insulating barrier, the via-hole array is corresponding with via-hole array in supporting plate；Insulating barrier is located at upper
Between pole plate and bottom crown, and contacted with top crown and bottom crown.
2. graphene acoustic sensor array as claimed in claim 1, it is characterized in that：
Described supporting plate is pcb board.
3. graphene acoustic sensor array as claimed in claim 1, it is characterized in that：
One jiao described of supporting plate is provided with the mu balanced circuit being connected with graphene film layer.
4. graphene acoustic sensor array as claimed in claim 1, it is characterized in that：
Described upper backup pad, wiring plate and lower supporting plate is pcb board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710364339.3A CN107246909A (en) | 2017-05-22 | 2017-05-22 | graphene acoustic sensor array |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710364339.3A CN107246909A (en) | 2017-05-22 | 2017-05-22 | graphene acoustic sensor array |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107246909A true CN107246909A (en) | 2017-10-13 |
Family
ID=60017395
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710364339.3A Pending CN107246909A (en) | 2017-05-22 | 2017-05-22 | graphene acoustic sensor array |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107246909A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110460941A (en) * | 2019-07-23 | 2019-11-15 | 武汉理工大学 | Transmitting-receiving integrated graphene sonic transducer |
| CN110715722A (en) * | 2019-10-23 | 2020-01-21 | 云南师范大学 | Acoustic detector and system based on boron-doped quantum dot photoelectric characteristics |
| EP3834433A4 (en) * | 2018-08-08 | 2022-03-30 | Graphaudio Inc. | High volume manufacturing of micro electrostatic transducers |
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| KR100758515B1 (en) * | 2006-02-21 | 2007-09-13 | 주식회사 비에스이 | Electret Condenser Microphone And Assembling Method Thereof |
| CN201657310U (en) * | 2010-03-08 | 2010-11-24 | 瑞声微电子科技(常州)有限公司 | Mems microphone |
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| WO2016148860A1 (en) * | 2015-03-16 | 2016-09-22 | The Regents Of The University Of California | Ultrasonic microphone and ultrasonic acoustic radio |
| US20160345083A1 (en) * | 2015-05-20 | 2016-11-24 | Clean Energy Labs, Llc | Compact electroacoustic transducer and loudspeaker system and method of use thereof |
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2017
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| CN201657310U (en) * | 2010-03-08 | 2010-11-24 | 瑞声微电子科技(常州)有限公司 | Mems microphone |
| CN102448002A (en) * | 2010-09-30 | 2012-05-09 | 雅马哈株式会社 | Condenser microphone array chip |
| WO2016148860A1 (en) * | 2015-03-16 | 2016-09-22 | The Regents Of The University Of California | Ultrasonic microphone and ultrasonic acoustic radio |
| US20160345083A1 (en) * | 2015-05-20 | 2016-11-24 | Clean Energy Labs, Llc | Compact electroacoustic transducer and loudspeaker system and method of use thereof |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP3834433A4 (en) * | 2018-08-08 | 2022-03-30 | Graphaudio Inc. | High volume manufacturing of micro electrostatic transducers |
| US11425507B2 (en) | 2018-08-08 | 2022-08-23 | Graphaudio Inc. | High volume manufacturing of micro electrostatic transducers |
| CN110460941A (en) * | 2019-07-23 | 2019-11-15 | 武汉理工大学 | Transmitting-receiving integrated graphene sonic transducer |
| CN110715722A (en) * | 2019-10-23 | 2020-01-21 | 云南师范大学 | Acoustic detector and system based on boron-doped quantum dot photoelectric characteristics |
| CN110715722B (en) * | 2019-10-23 | 2022-01-04 | 云南师范大学 | Acoustic detector and system based on boron-doped quantum dot photoelectric characteristics |
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| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20171013 |
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| RJ01 | Rejection of invention patent application after publication |